Dual-Row QFN Package

Assembly and PCB Layout

Guidelines
SiliconBlue
August 9, 2010 (1.0) Application Note AN016

Introduction
Leadless Quad Flat Pack (QFN) packages are plastic-encapsulated with a copper lead frame substrate, providing a
robust, low-cost solution for small form factor applications such as mobile handsets and other battery operated
consumer products. Dual-row QFN packages have interstitial, staggered contacts. The inner row is offset 0.5 mm,
resulting in a compact design that does not exceed the surface mount technology (SMT) capability of a typical
0.5 mm pitch surface-mount process.
Because SiliconBlue iCE65 mobileFPGA devices have the ultra-low power consumption, connecting the center
thermal pad is not required. Therefore, when designing a PCB for an iCE65 mobileFPGA in the QN84 package, the
following primary factors can affect the successful package mounting on the board:
 Perimeter Land Pad and Trace Design
 Stencil design
 Type of vias
 Board thickness
 Lead finish on the package
 Surface finish on the board
 Type of solder pasted
 Reflow profile

These are general guidelines and other factors may affect the successful and reliable mounting of a QN84 package.
Additionally, particular applications may require specific analysis and/or considerations that are not covered here.
All spacing calculations assume a standard four-layer board using one-half ounce of copper.

Perimeter Land Pad and Trace Design

In several published QFN tests, trace cracking was observed during board-level drop and bend tests. The reported
trace cracking usually occurred at the edge of the solder mask opening around the metal pad. To avoid this failure
mode, widen the trace under the solder mask edge so that it is wider than the remainder of the trace as shown in
Figure 1. Depending on the reliability requirements, the wider part of the trace might need to be as wide as 50 to
75% of the metal pad width.
Figure 1: Wider Trace under Solder Mask Edge to Avoid Trace Cracking

Avoid if possible

A B Preferred, where
B > 50% • A

Non-solder mask defined (NSMD) pads are recommended for dual-row QFN packages, because the copper etching
process has tighter control than the solder masking process and improves the reliability of the solder joints.

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AN016: Dual-Row QFN Package Assembly/PCB Layout Guidelines
Stencil Design for Perimeter Land Pads
For reliable solder joints on dual-row QFN packages, pay extra attention because of the small land surface area and
the sole reliance on printed solder paste on the PCB surface. Special considerations are needed in stencil design and
paste printing for both perimeter lands. Because the surface mount process varies from company to company,
careful process development is recommended. The following section provides some guidelines for stencil design
based on industry experience.
The optimum and reliable solder joints on the perimeter pads have about 50 to 70 µm (2 to 3 mils) standoff height.
Tightly control the stencil aperture tolerance because these tolerances can effectively reduce the aperture size. Area
ratios of 0.66 and aspect ratios of 1.5 were never exceeded. The land pattern on the PCB should be 1:1 to the land
pads on QFN package.
Stencil thickness of 0.125 mm is recommended for 0.5 mm dual-row QFN packages. A laser-cut stainless steel
stencil with electro-polished trapezoidal walls is recommended to improve the paste release. SiliconBlue
recommends that no-clean, Type 3 or Type 4 paste be used for mounting QFN packages. Nitrogen purge is also
recommended during reflow.

Reflow Profile
Reflow profile and peak temperature have a strong influence on void formation. SiliconBlue strongly recommends
that users follow the profile recommendation of the paste suppliers, since this is specific to the requirements of the
flux formation. However, the following profile, Figure 2 serves as a general reference for SiliconBlue mobileFPGA
devices.
Figure 2: Typical Pb-Free Solder Flow Profile
Wetting Time
10–20 seconds
260
255

217

187
Temperature (°C)

120 seconds Max.

3°C Max.
Preheat

Ramp

Flux Activation/
Dryout

93
Cooling
6°C/second Max.

0
0 20 40 60 80 100 120 140 160 180 200 220 240 260
Time (seconds)

Assembly Process Flow

QFN packages use the same process flow used for typical surface mount packages, without modification. Include
post-print and post-reflow inspections, especially during initial process refinement. The paste volume should be
approximately 80%–90% of stencil aperture volume to indicate sufficient paste release and should be measured
either by 2D or 3D techniques. After reflow, inspect the mounted packages for the presence of voids, solder balling,
or other defects. Cross-section analysis may be required to determine the fillet shape and size and joint standoff
height.

Rework Guidelines
Since solder joints are not fully exposed, retouch work for QFN packages is limited. For defects underneath the
package, the entire device must be removed. In addition, rework of QFN packages after removal can be a challenge
due to their small size. Also, since QFN devices are typically mounted on smaller, thinner, and denser PCBs,
handling and heating can be problematic. Because of these complexities, the following guidelines provide a starting
point for the development of a successful rework process for these packages.

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The rework process involves the following steps:

1. Component removal
2. Site redress
3. Solder paste application
4. Component placement and attachment
The first step to remove the component is the reflow of solder joints attaching the component to the PCB board.
Ideally the reflow profile for removing the component should be the same as the one used for part attachment.
However, the time above liquid can be reduced as long as the reflow is completed. In the removal process, the board
should be heated from the bottom side using a convective heater, and hot gas or air should be used on the top side of
the component. A special nozzle should be used to direct the heating in the component area. The heating of adjacent
components should be minimized. Air velocity of 15 to 20 liters per minute is a good starting point, and excessive
airflow should be avoided. Once the joints have reflowed, the vacuum lift-off should be automatically engaged
during the transition from reflow to cool down. Because of their small size, the vacuum pressure should be kept
below 15 inches of mercury (Hg). This will ensure the component is not lifted if all joints have not been reflowed,
thus avoiding pad liftoff.
After the components have been removed, the site must be cleaned properly. Use a combination of a blade-style
conductive tool and de-soldering braid. Match the width of the blade to the maximum width of the footprint and set
the baked temperature low enough so as not to cause any damage to the circuit board. Once the residual solder is
removed, clean the landing pads with solvent. The solvent is usually specific to the type of paste used in the original
assembly and follow the paste manufacturer’s recommendations.
Because of their small size and finer pitches, solder paste deposition for QFN packages require extra care. Use a
miniature stencil specific for the component to achieve a uniform and precise deposition. Align the stencil aperture
with the pads under 50X–100X magnification. Then, lower the stencil onto the PCB and deposit the paste with a
small metal squeegee blade. Alternatively, use miniature stencil to print paste on the package site. Use a stencil
with a thickness of 125 µm with an aperture size and shape the same as the package land. Use no-clean flux because
the small standoff of QFN packages does not leave much room for cleaning.
QFN packages have superior self-centering ability due to their small mass. Placing QFN packages is similar to BGA
package placement. Because the land pads are on the underside of the package, use a split-beam optical system to
align the component onto the motherboard. This optical system forms an image of land overlaid on the mating
footprint and aid proper alignment. Again, perform the alignment at 50X–100X magnification. The placement
machine should be capable of allowing fine adjustments in X, Y, and rotational axes. Use the reflow profile
developed during the original component attachment or removal process to attach the new component. Since all
reflow profile parameters have already been optimized, using the same profile eliminates the need for thermocouple
feedback and reduces operator dependencies.

Other Documentation
See also the single-layer layout example for the QN84 package in the following application note.
 AN010: iCE65 Printed Circuit Board (PCB) Layout Guidelines
www.siliconbluetech.com/media/downloads/SiliconBlue_AN010.pdf

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AN016: Dual-Row QFN Package Assembly/PCB Layout Guidelines

Appendix I: Recommended PCB Layout Details

Figure 3 shows the suggested board layout for the QN84 package on a top layer of a printed circuit board, assuming
NSMD solder mask rules. The labeled dimensions are listed in Table 1.
Figure 3: Top-layer Layout
LW1 LL

BL
SO
SL
SO SO SO
SL
SM
OTH
SM

Figure 4 shows the suggested layout if pads are connected on inner layers.
Figure 4: Inner-layer Layout
LW1

LV

LV
BL
LW2

OVL

OTH

Table 1: Recommended dimensions for QN84 package

Dimension Symbol QN84 Units
Component Land Pad Diameter SMD 0.300
Solder Land Diameter SL 0.300
Solder Mask Opening Diameter SM 0.425
Solder Land to Solder Land LL 0.075
Solder Mask Overlap SO 0.0625
Package Pin Pitch 0.500
mm
Solder Land Pitch BL 0.650
Line Width between Via Outside and Via Land LW1 0.127
Line Width between Via and Via Land LW2 0.100
Line to Via Land LV 0.050 – 0.100
Via Land Diameter OVL 0.250 – 0.400
Via Opening Diameter OTH 0.100 – 0.250

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Revision History
Version Date Description
1.0 9-AUG-2010 Initial release.

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