Slus 177 B
Slus 177 B
Slus 177 B
DESCRIPTION
The UC1707 family of power drivers is made with a high-speed Schottky process to interface between low-level
control functions and high-power switching devices–particularly power MOSFETs. These devices contain two
independent channels, each of which can be activated by either a high or low input logic level signal. Each output
can source or sink up to 1.5 A as long as power dissipation limits are not exceeded.
Although each output can be activated independently with its own inputs, it can be forced low in common through
the action either of a digital high signal at the Shutdown terminal or a differential low-level analog signal. The
Shutdown command from either source can either be latching or not, depending on the status of the Latch
Disable pin.
Supply voltage for both VIN and VC can independently range from 5 V to 40 V.
These devices are available in two-watt plastic "bat-wing" DIP for operation over a 0°C to 70°C temperature
range and, with reduced power, in a hermetically sealed cerdip for –55°C to +125°C operation. Also available in
surface mount DW, Q, L packages.
TRUTH TABLE
(Each Channel) (1)
INV. N.I. OUT
H H L
L H H
H L L
L L L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
UC1707, UC2707, UC3707
SLUS177B – MARCH 1999 – REVISED SEPTEMBER 2008 ............................................................................................................................................. www.ti.com
BLOCK DIAGRAM
CONNECTION DIAGRAMS
(1) All voltages are with respect to the four ground pins which must be connected together. All currents are positive into, negative out of the
specified terminal. Digital drive can exceed 5.5 V if input current is limited to 10 mA. Consult packaging section of databook for thermal
limitations and considerations of package.
ELECTRICAL CHARACTERISTICS
Unless otherwise stated, these specifications apply for TA = –55°C to +125°C for the UC1707, –25°C to +85°C for the
UC2707, and 0°C to +70°C for the UC3707; VIN = VC = 20 V. TA = TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Supply current VIN = 40 V 12 15 mA
VC Supply current VC = 40 V, outputs low 5.2 7.5 mA
VC Leakage current VIN = 0, VC - 30 V, no load 0.05 0.1 mA
Digital input low level 0.8 V
Digital input high level 2.2 V
Input current VI = 0 –0.06 –1.0 mA
Input leakage VI = 5 V 0.05 0.1 mA
IO = –50 mA 2.0
VC – VO Output high sat. V
IO = –500 mA 2.5
IO = –50 mA 0.4
VO Output low sat. V
IO = –500 mA 2.5
Analog threshold VCM = 0 to 15 V 100 130 160 mV
Input bias current VCM = 0 –10 –20 µA
Thermal shutdown 155 °C
Shutdown threshold Pin 7 input 0.4 1.0 2.2 V
Latch disable threshold Pin 3 input 0.8 1.2 2.2 V
(1) If the output was previously in Shutdown and Latch Disable was low and stays low, then even if the Analog Stop Logic is changed or the
Shutdown pin is open, the outputs will remain in Shutdown.
Figure 12. Power MOSFET Drive Circuit Using Negative Bias Voltage
and Level Shifting to Ground Reference PWM
www.ti.com 6-Jun-2024
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
5962-87619012A ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962- Samples
& Green 87619012A
UC1707L/
81032
5962-8761901EA ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962-8761901EA Samples
& Green UC1707J/80900
5962-8761901V2A ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962- Samples
& Green 8761901V2A
UC1707L
QMLV
5962-8761901VEA ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962-8761901VE Samples
& Green A
UC1707JQMLV
5962-8761903V2A ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962- Samples
& Green 8761903V2A
UC1707L-SP
5962-8761903VEA ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962-8761903VE Samples
& Green A
UC1707J-SP
5962-8761903VFA ACTIVE CFP W 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 5962-8761903VF Samples
& Green A
UC1707W-SP
UC1707J ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 UC1707J Samples
& Green
UC1707J883B ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 UC1707J/883B Samples
& Green
UC1707L ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 UC1707L Samples
& Green
UC1707L883B ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 UC1707L/ Samples
& Green 883B
UC2707DW ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2707DW Samples
UC2707DWTR ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2707DW Samples
UC2707N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 UC2707N Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 6-Jun-2024
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
UC2707NG4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 UC2707N Samples
UC3707DW ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3707DW Samples
UC3707DWTR ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3707DW Samples
UC3707J ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type 0 to 70 UC3707J Samples
& Green
UC3707N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 UC3707N Samples
UC3707NG4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 UC3707N Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 6-Jun-2024
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Dec-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Dec-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Dec-2023
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
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