Tacflux For Board Assembly Rework 97776 r8 Tim
Tacflux For Board Assembly Rework 97776 r8 Tim
Tacflux For Board Assembly Rework 97776 r8 Tim
Application Method
TACFlux ® 012
TACFlux® can be dispensed in dots or lines onto the desired
Formulated for alloys containing indium, this flux is substrate, preform, or BGA sphere. It can also be easily
compatible with our NC-SMQ80 solder paste. screen printed or stenciled on a desired component footprint.
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Products
Typical Typical Max Reflow Reliability
TACFlux® Tackiness Viscosity Temp Residue J-STD Halide
(grams) (kcps) (°C) (%) 004 Containing Cleaning Method
No-Clean Rosin
007 190 570 310 47 Pass Y No-Clean/Semi-aqueous Solution
010 232 67 450 4 Pass N No-Clean/Semi-aqueous Solution
012 140 220 250 45 Pass N No-Clean/Semi-aqueous Solution
014 141 351 250 45 Pass N No-Clean/Semi-aqueous Solution
018 160 255 250 36 Pass N No-Clean/Semi-aqueous Solution
020 175 470 250 45 Pass N No-Clean/Semi-aqueous Solution
021 225 365 230 56 Pass N No-Clean/Semi-aqueous Solution
023 225 410 300 42 Pass Y No-Clean/Semi-aqueous Solution
Water Wash
019 175 500 325 45 Pass N Water
025 550 850 370 47 Pass N Water
All information is for reference only. Not to be used as incoming product specifications.
This product data sheet is provided for general information only. It is not intended, described which are sold subject exclusively to written warranties and limitations
and shall not be construed, to warrant or guarantee the performance of the products thereon included in product packaging and invoices.
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