Pic 16c5xx

M EPROM/ROM-Based 8-Bit CMOS Microcontroller Series
PIC16C5X
Devices Included in this Data Sheet: • 12-bit wide instructions
• PIC16C52 • 8-bit wide data path
• PIC16C54s • Seven or eight special function hardware registers
• PIC16CR54s • Two-level deep hardware stack
• PIC16C55s • Direct, indirect and relative addressing modes for
• PIC16C56s data and instructions
• PIC16CR56s Peripheral Features:
• PIC16C57s • 8-bit real time clock/counter (TMR0) with 8-bit
• PIC16CR57s programmable prescaler
• PIC16C58s • Power-On Reset (POR)
• PIC16CR58s • Device Reset Timer (DRT)
• Watchdog Timer (WDT) with its own on-chip
Note: The letter "s" used following the part
RC oscillator for reliable operation
numbers throughout this document
indicate plural, meaning there is more • Programmable code-protection
than one part variety for the indicated • Power saving SLEEP mode
device. • Selectable oscillator options:
High-Performance RISC CPU: - RC: Low-cost RC oscillator
• Only 33 single word instructions to learn - XT: Standard crystal/resonator
• All instructions are single cycle (200 ns) except for - HS: High-speed crystal/resonator
program branches which are two-cycle - LP: Power saving, low-frequency crystal
• Operating speed: DC - 20 MHz clock input CMOS Technology:
DC - 200 ns instruction cycle • Low-power, high-speed CMOS EPROM/ROM
EPROM/ technology
Device Pins I/O RAM
ROM • Fully static design
PIC16C52 18 12 384 25 • Wide-operating voltage and temperature range:
PIC16C54 18 12 512 25 - EPROM Commercial/Industrial 2.0V to 6.25V
PIC16C54A 18 12 512 25 - ROM Commercial/Industrial 2.0V to 6.25V
PIC16C54B 18 12 512 25 - EPROM Extended 2.5V to 6.0V
PIC16CR54A 18 12 512 25 - ROM Extended 2.5V to 6.0V
PIC16CR54B 18 12 512 25 • Low-power consumption
PIC16C55 28 20 512 24 - < 2 mA typical @ 5V, 4 MHz
PIC16C55A 28 20 512 24 - 15 µA typical @ 3V, 32 kHz
PIC16C56 18 12 1K 25 - < 0.6 µA typical standby current
PIC16C56A 18 12 1K 25 (with WDT disabled) @ 3V, 0°C to 70°C
PIC16CR56A 18 12 1K 25
PIC16C57 28 20 2K 72 Note: In this document, figure and table titles
refer to all varieties of the part number
PIC16C57C 28 20 2K 72
indicated, (i.e., The title "Figure 14-1:
PIC16CR57B 28 20 2K 72 Load Conditions - PIC16C54A", also
PIC16CR57C 28 20 2K 72 refers to PIC16LC54A and PIC16LV54A
PIC16C58A 18 12 2K 73 parts).
PIC16C58B 18 12 2K 73
PIC16CR58A 18 12 2K 73
PIC16CR58B 18 12 2K 73
 1997 Microchip Technology Inc. Preliminary DS30453A-page 1

PIC16C5X
Pin Diagrams
PDIP, SOIC, Windowed CERDIP PDIP, SOIC, Windowed CERDIP
RA2 •1 18 RA1 T0CKI •1 28 MCLR/VPP

RA3 2 17 RA0 VDD 2 27 OSC1/CLKIN
PIC16CR58s
PIC16C58s
PIC16CR56s
PIC16C56s
PIC16CR54s
PIC16C54s
PIC16C52s
T0CKI 3 16 OSC1/CLKIN
N/C 3 26
MCLR/VPP 4 15 OSC2/CLKOUT OSC2/CLKOUT
VDD VSS 4 25
VSS 5 14
N/C 5 24 RC7
6 RB7
PIC16CR57s
PIC16C57s
PIC16C55s
RB0 13
RB1 7 12 RB6 RA0 6 23 RC6
RB2 8 11 RB5 RA1 7 22
RC5
RB3 9 10 RB4 RA2 8 21
RA3 9 20 RC4
RB0 10 19 RC3
RB1 11 18
RC2
RB2 12 17
RC1
RB3 13 16
RB4 14 15 RC0
SSOP SSOP
RA2 •1 20 RA1 VSS •1 28 MCLR/VPP

RA3 2 19 RA0 T0CKI 2 27 OSC1/CLKIN
VDD 3 26 OSC2/CLKOUT
T0CKI 3 18 OSC1/CLKIN VDD 4 25 RC7
PIC16CR58s
PIC16C58s
PIC16CR56s
PIC16C56s
PIC16CR54s
PIC16C54s
PIC16CR57s
PIC16C57s
PIC16C55s
MCLR/VPP 4 17 OSC2/CLKOUT RA0 5 24 RC6
VSS 5 16 VDD RA1 6 23 RC5
VSS 6 15 VDD RA2 7 22 RC4
RB0 7 14 RB7 RA3 8 21 RC3
RB0 9 20 RC2
RB1 8 13 RB6 RB1 10 19 RC1
RB2 9 12 RB5 RB2 11 18 RC0
RB3 10 11 RB4 RB3 12 17 RB7
RB4 13 16 RB6
VSS 14 15 RB5
DS30453A-page 2 Preliminary  1997 Microchip Technology Inc.

PIC16C5X
Device Differences
Oscillator Process
Voltage ROM MCLR
Device Selection Oscillator Technology
Range Equivalent Filter
(Program) (Microns)
PIC16C52 3.0-6.25 User See Note 1 0.9 — No
PIC16C54 2.5-6.25 Factory See Note 1 1.2 PIC16CR54A No
PIC16C54A 2.0-6.25 User See Note 1 0.9 — No
PIC16C54B 3.0-5.5 User See Note 1 0.7 PIC16CR54B Yes
PIC16C55 2.5-6.25 Factory See Note 1 1.7 — No
PIC16C55A 3.0-5.5 User See Note 1 0.7 — Yes
PIC16C56A 3.0-5.5 User See Note 1 0.7 PIC16CR56A Yes
PIC16C57C 3.0-5.5 User See Note 1 0.7 PIC16CR57C Yes
PIC16CR57C 2.5-5.5 Factory See Note 1 0.7 NA Yes
PIC16C58A 2.0-6.25 User See Note 1 0.9 PIC16CR58A No(2)
PIC16C58B 3.0-5.5 User See Note 1 0.7 PIC16CR58B Yes
PIC16CR54A 2.5-6.25 Factory See Note 1 1.2 NA Yes
PIC16CR54B 2.5-5.5 Factory See Note 1 0.7 NA Yes
Note 1: If you change from this device to another device, please verify oscillator characteristics in your application.
Note 2: In PIC16LV58A, MCLR Filter = Yes

PIC16C5X
Table of Contents
1.0 General Description .............................................................................................................................................5
2.0 PIC16C5X Device Varieties.................................................................................................................................7
3.0 Architectural Overview.........................................................................................................................................9
4.0 Memory Organization ........................................................................................................................................15
5.0 I/O Ports.............................................................................................................................................................25
6.0 Timer0 Module and TMR0 Register...................................................................................................................27
7.0 Special Features of the CPU .............................................................................................................................31
8.0 Instruction Set Summary ...................................................................................................................................43
9.0 Development Support ........................................................................................................................................55
10.0 Electrical Characteristics - PIC16C52................................................................................................................59
11.0 Electrical Characteristics - PIC16C54/55/56/57.................................................................................................67
12.0 DC and AC Characteristics - PIC16C54/55/56/57 .............................................................................................81
13.0 Electrical Characteristics - PIC16CR54A...........................................................................................................89
14.0 Electrical Characteristics - PIC16C54A ...........................................................................................................103
15.0 Electrical Characteristics - PIC16CR57B.........................................................................................................117
16.0 Electrical Characteristics - PIC16C58A ...........................................................................................................131
17.0 Electrical Characteristics - PIC16CR58A.........................................................................................................145
18.0 DC and AC Characteristics - PIC16C54A/CR57B/C58A/CR58A ....................................................................159
19.0 Electrical Characteristics - PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B .................................................171
20.0 DC and AC Characteristics - PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B..............................................183
21.0 Packaging Information .....................................................................................................................................193
Appendix A: Compatibility ...........................................................................................................................................205
Index............................................................................................................................................................................207
PIC16C5X Product Identification System....................................................................................................................215
PIC16C54/55/56/57 Product Identification System .....................................................................................................216

PIC16C5X
1.0 GENERAL DESCRIPTION 1.1 Applications
The PIC16C5X from Microchip Technology is a family The PIC16C5X series fits perfectly in applications rang-
of low-cost, high performance, 8-bit, fully static, ing from high-speed automotive and appliance motor
EPROM/ ROM-based CMOS microcontrollers. It control to low-power remote transmitters/receivers,
employs a RISC architecture with only 33 single pointing devices and telecom processors. The EPROM
word/single cycle instructions. All instructions are sin- technology makes customizing application programs
gle cycle (200 ns) except for program branches which (transmitter codes, motor speeds, receiver frequen-
take two cycles. The PIC16C5X delivers performance cies, etc.) extremely fast and convenient. The small
an order of magnitude higher than its competitors in the footprint packages, for through hole or surface mount-
same price category. The 12-bit wide instructions are ing, make this microcontroller series perfect for applica-
highly symmetrical resulting in 2:1 code compression tions with space limitations. Low-cost, low-power, high
over other 8-bit microcontrollers in its class. The easy performance, ease of use and I/O flexibility make the
to use and easy to remember instruction set reduces PIC16C5X series very versatile even in areas where no
development time significantly. microcontroller use has been considered before (e.g.,
The PIC16C5X products are equipped with special fea- timer functions, replacement of “glue” logic in larger
tures that reduce system cost and power requirements. systems, coprocessor applications).
The Power-On Reset (POR) and Device Reset Timer
(DRT) eliminate the need for external reset circuitry.
There are four oscillator configurations to choose from,
including the power-saving LP (Low Power) oscillator
and cost saving RC oscillator. Power saving SLEEP
mode, Watchdog Timer and code protection features
improve system cost, power and reliability.
The UV erasable CERDIP packaged versions are ideal
for code development, while the cost-effective One
Time Programmable (OTP) versions are suitable for
production in any volume. The customer can take full
advantage of Microchip’s price leadership in OTP
microcontrollers while benefiting from the OTP’s
flexibility.
The PIC16C5X products are supported by a
full-featured macro assembler, a software simulator, an
in-circuit emulator, a ‘C’ compiler, fuzzy logic support
tools, a low-cost development programmer, and a full
featured programmer. All the tools are supported on
IBM PC and compatible machines.

PIC16C5X
TABLE 1-1: PIC16C5X FAMILY OF DEVICES
PIC16C52 PIC16C54s PIC16CR54s PIC16C55s PIC16C56s
Maximum Frequency 4 20 20 20 20
Clock
of Operation (MHz)
EPROM Program Memory 384 512 — 512 1K
(x12 words)
Memory ROM Program Memory — — 512 — —
(x12 words)
RAM Data Memory (bytes) 25 25 25 24 25
Peripherals Timer Module(s) TMR0 TMR0 TMR0 TMR0 TMR0
I/O Pins 12 12 12 20 12
Number of Instructions 33 33 33 33 33
Features Packages 18-pin DIP, 18-pin DIP, 18-pin DIP, 28-pin DIP, 18-pin DIP,
SOIC SOIC; SOIC; SOIC; SOIC;
20-pin SSOP 20-pin SSOP 28-pin SSOP 20-pin SSOP
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer (except PIC16C52), selectable code
protect and high I/O current capability.
PIC16CR56s PIC16C57s PIC16CR57s PIC16C58s PIC16CR58s

Maximum Frequency 20 20 20 20 20
Clock
of Operation (MHz)
EPROM Program Memory — 2K — 2K —
(x12 words)
Memory ROM Program Memory 1K — 2K — 2K
(x12 words)
RAM Data Memory (bytes) 25 72 72 73 73
Peripherals Timer Module(s) TMR0 TMR0 TMR0 TMR0 TMR0
I/O Pins 12 20 20 12 12
Number of Instructions 33 33 33 33 33
Features Packages 18-pin DIP, 28-pin DIP, 28-pin DIP, 18-pin DIP, 18-pin DIP,
SOIC; SOIC; SOIC; SOIC; SOIC;
20-pin SSOP 28-pin SSOP 28-pin SSOP 20-pin SSOP 20-pin SSOP
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer (except PIC16C52), selectable code
protect and high I/O current capability.

PIC16C5X
2.0 PIC16C5X DEVICE VARIETIES 2.3 Quick-Turnaround-Production (QTP)
Devices
A variety of frequency ranges and packaging options
are available. Depending on application and Microchip offers a QTP Programming Service for
production requirements, the proper device option can factory production orders. This service is made
be selected using the information in this section. When available for users who choose not to program a
placing orders, please use the PIC16C5X Product medium to high quantity of units and whose code
Identification System at the back of this data sheet to patterns have stabilized. The devices are identical to
specify the correct part number. the OTP devices but with all EPROM locations and
For the PIC16C5X family of devices, there are four configuration bit options already programmed by the
device types, as indicated in the device number: factory. Certain code and prototype verification
procedures apply before production shipments are
1. C, as in PIC16C54. These devices have
available. Please contact your Microchip Technology
EPROM program memory and operate over the
sales office for more details.
standard voltage range.
2. LC, as in PIC16LC54A. These devices have 2.4 Serialized
EPROM program memory and operate over an Quick-Turnaround-Production
extended voltage range. (SQTP SM) Devices
3. LV, as in PIC16LV54A. These devices have
EPROM program memory and operate over a Microchip offers the unique programming service
2.0V to 3.8V range. where a few user-defined locations in each device are
4. CR, as in PIC16CR54A. These devices have programmed with different serial numbers. The serial
ROM program memory and operate over the numbers may be random, pseudo-random or
standard voltage range. sequential. The devices are identical to the OTP
devices but with all EPROM locations and
5. LCR, as in PIC16LCR54B. These devices have
configuration bit options already programmed by the
ROM program memory and operate over an
factory.
extended voltage range.
Serial programming allows each device to have a
2.1 UV Erasable Devices (EPROM) unique number which can serve as an entry code,
password or ID number.
The UV erasable versions, offered in CERDIP
packages, are optimal for prototype development and 2.5 Read Only Memory (ROM) Devices
pilot programs
Microchip offers masked ROM versions of several of
UV erasable devices can be programmed for any of
the highest volume parts, giving the customer a low
the four oscillator configurations. Microchip's
cost option for high volume, mature products.
PICSTART and PRO MATE programmers both
support programming of the PIC16C5X. Third party
programmers also are available; refer to the Third
Party Guide for a list of sources.
2.2 One-Time-Programmable (OTP)

Devices
The availability of OTP devices is especially useful for
customers expecting frequent code changes and
updates.
The OTP devices, packaged in plastic packages,
permit the user to program them once. In addition to
the program memory, the configuration bits must be
programmed.

PIC16C5X
NOTES:

PIC16C5X
3.0 ARCHITECTURAL OVERVIEW The PIC16C5X device contains an 8-bit ALU and
working register. The ALU is a general purpose
The high performance of the PIC16C5X family can be arithmetic unit. It performs arithmetic and Boolean
attributed to a number of architectural features functions between data in the working register and any
commonly found in RISC microprocessors. To begin register file.
with, the PIC16C5X uses a Harvard architecture in
which program and data are accessed on separate The ALU is 8-bits wide and capable of addition,
buses. This improves bandwidth over traditional von subtraction, shift and logical operations. Unless
Neumann architecture where program and data are otherwise mentioned, arithmetic operations are two's
fetched on the same bus. Separating program and complement in nature. In two-operand instructions,
data memory further allows instructions to be sized typically one operand is the W (working) register. The
differently than the 8-bit wide data word. Instruction other operand is either a file register or an immediate
opcodes are 12-bits wide making it possible to have all constant. In single operand instructions, the operand
single word instructions. A 12-bit wide program is either the W register or a file register.
memory access bus fetches a 12-bit instruction in a The W register is an 8-bit working register used for
single cycle. A two-stage pipeline overlaps fetch and ALU operations. It is not an addressable register.
execution of instructions. Consequently, all instructions
Depending on the instruction executed, the ALU may
(33) execute in a single cycle (200ns @ 20MHz)
affect the values of the Carry (C), Digit Carry (DC),
except for program branches.
and Zero (Z) bits in the STATUS register. The C and
The PIC16C52 addresses 384 x 12 of program DC bits operate as a borrow and digit borrow out bit,
memory, the PIC16C54s/CR54s and PIC16C55s respectively, in subtraction. See the SUBWF and ADDWF
address 512 x 12 of program memory, the instructions for examples.
PIC16C56s/CR56s address 1K X 12 of program
A simplified block diagram is shown in Figure 3-1, with
memory, and the PIC16C57s/CR57s and
the corresponding device pins described in Table 3-1.
PIC16C58s/CR58s address 2K x 12 of program
memory. All program memory is internal.
The PIC16C5X can directly or indirectly address its
register files and data memory. All special function
registers including the program counter are mapped in
the data memory. The PIC16C5X has a highly
orthogonal (symmetrical) instruction set that makes it
possible to carry out any operation on any register
using any addressing mode. This symmetrical nature
and lack of ‘special optimal situations’ make
programming with the PIC16C5X simple yet efficient.
In addition, the learning curve is reduced significantly.

PIC16C5X
FIGURE 3-1: PIC16C5X SERIES BLOCK DIAGRAM
9-11 T0CKI OSC1 OSC2 MCLR

EPROM/ROM 9-11 STACK 1 CONFIGURATION WORD
PIN
384 X 12 TO STACK 2 “DISABLE” “OSC
2048 X 12 PC SELECT”
12 WATCHDOG 2
TIMER “CODE
PROTECT” OSCILLATOR/
INSTRUCTION TIMING &
REGISTER CONTROL
9 WDT TIME WDT/TMR0 CLKOUT
12 OUT PRESCALER
8 “SLEEP”
INSTRUCTION
6
DECODER
OPTION REG. “OPTION”
DIRECT ADDRESS DIRECT RAM
FROM W GENERAL
ADDRESS
PURPOSE
5 REGISTER
FILE
8 5-7
(SRAM)
24, 25, 72 or
LITERALS
STATUS 73 Bytes
TMR0 FSR
8
DATA BUS
W ALU
8
FROM W FROM W FROM W
4 8 8
4 8 8
“TRIS 5” “TRIS 6” “TRIS 7”
TRISA PORTA TRISB PORTB TRISC PORTC
4 8 8
RA3:RA0 RB7:RB0 RC7:RC0

(28-Pin
Devices Only)

PIC16C5X
TABLE 3-1: PINOUT DESCRIPTION - PIC16C52, PIC16C54s, PIC16CR54s, PIC16C56s,
PIC16CR56s, PIC16C58s, PIC16CR58s
DIP, SOIC SSOP I/O/P Input

Name Description
No. No. Type Levels
RA0 17 19 I/O TTL Bi-directional I/O port
RA1 18 20 I/O TTL
RA2 1 1 I/O TTL
RA3 2 2 I/O TTL
RB0 6 7 I/O TTL Bi-directional I/O port
RB1 7 8 I/O TTL
RB2 8 9 I/O TTL
RB3 9 10 I/O TTL
RB4 10 11 I/O TTL
RB5 11 12 I/O TTL
RB6 12 13 I/O TTL
RB7 13 14 I/O TTL
T0CKI 3 3 I ST Clock input to Timer0. Must be tied to VSS or VDD, if not in
use, to reduce current consumption.
MCLR/VPP 4 4 I ST Master clear (reset) input/programming voltage input. This
pin is an active low reset to the device. Voltage on the
MCLR/VPP pin must not exceed VDD to avoid unintended
entering of programming mode.
OSC1/CLKIN 16 18 I ST Oscillator crystal input/external clock source input.
OSC2/CLKOUT 15 17 O — Oscillator crystal output. Connects to crystal or resonator in
crystal oscillator mode. In RC mode, OSC2 pin outputs
CLKOUT which has 1/4 the frequency of OSC1, and denotes
the instruction cycle rate.
VDD 14 15,16 P — Positive supply for logic and I/O pins.
VSS 5 5,6 P — Ground reference for logic and I/O pins.
Legend: I = input, O = output, I/O = input/output,
P = power, — = Not Used, TTL = TTL input,
ST = Schmitt Trigger input

PIC16C5X
TABLE 3-2: PINOUT DESCRIPTION - PIC16C55s, PIC16C57s, PIC16CR57s
DIP, SOIC SSOP I/O/P Input

Name Description
No. No. Type Levels
RA0 6 5 I/O TTL Bi-directional I/O port
RA1 7 6 I/O TTL
RA2 8 7 I/O TTL
RA3 9 8 I/O TTL
RB0 10 9 I/O TTL Bi-directional I/O port
RB1 11 10 I/O TTL
RB2 12 11 I/O TTL
RB3 13 12 I/O TTL
RB4 14 13 I/O TTL
RB5 15 15 I/O TTL
RB6 16 16 I/O TTL
RB7 17 17 I/O TTL
RC0 18 18 I/O TTL Bi-directional I/O port
RC1 19 19 I/O TTL
RC2 20 20 I/O TTL
RC3 21 21 I/O TTL
RC4 22 22 I/O TTL
RC5 23 23 I/O TTL
RC6 24 24 I/O TTL
RC7 25 25 I/O TTL
T0CKI 1 2 I ST Clock input to Timer0. Must be tied to VSS or VDD if not in use
to reduce current consumption.
MCLR 28 28 I ST Master clear (reset) input. This pin is an active low reset to the
device.
OSC1/CLKIN 27 27 I ST Oscillator crystal input/external clock source input.
OSC2/CLKOUT 26 26 O — Oscillator crystal output. Connects to crystal or resonator in
crystal oscillator mode. In RC mode, OSC2 pin outputs
CLKOUT which has 1/4 the frequency of OSC1, and denotes
the instruction cycle rate.
VDD 2 3,4 P — Positive supply for logic and I/O pins.
VSS 4 1,14 P — Ground reference for logic and I/O pins.
N/C 3,5 — — — Unused, do not connect
Legend: I = input, O = output, I/O = input/output,
P = power, — = Not Used,
TTL = TTL input, ST = Schmitt Trigger input

PIC16C5X
3.1 Clocking Scheme/Instruction Cycle 3.2 Instruction Flow/Pipelining
The clock input (OSC1/CLKIN pin) is internally divided An Instruction Cycle consists of four Q cycles (Q1, Q2,
by four to generate four non-overlapping quadrature Q3 and Q4). The instruction fetch and execute are
clocks namely Q1, Q2, Q3 and Q4. Internally, the pipelined such that fetch takes one instruction cycle
program counter is incremented every Q1, and the while decode and execute takes another instruction
instruction is fetched from program memory and cycle. However, due to the pipelining, each instruction
latched into instruction register in Q4. It is decoded effectively executes in one cycle. If an instruction
and executed during the following Q1 through Q4. The causes the program counter to change (e.g., GOTO)
clocks and instruction execution flow is shown in then two cycles are required to complete the
Figure 3-2 and Example 3-1. instruction (Example 3-1).
A fetch cycle begins with the program counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is
latched into the Instruction Register (IR) in cycle Q1.
This instruction is then decoded and executed during
the Q2, Q3, and Q4 cycles. Data memory is read
during Q2 (operand read) and written during Q4
(destination write).
FIGURE 3-2: CLOCK/INSTRUCTION CYCLE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Q1
Q2 Internal
phase
Q3 clock
Q4
PC PC PC+1 PC+2
OSC2/CLKOUT
(RC mode)
Fetch INST (PC)
Execute INST (PC-1) Fetch INST (PC+1)
Execute INST (PC) Fetch INST (PC+2)
Execute INST (PC+1)
EXAMPLE 3-1: INSTRUCTION PIPELINE FLOW
1. MOVLW 55H Fetch 1 Execute 1

2. MOVWF PORTB Fetch 2 Execute 2
3. CALL SUB_1 Fetch 3 Execute 3
4. BSF PORTA, BIT3 Fetch 4 Flush
Fetch SUB_1 Execute SUB_1
All instructions are single cycle, except for any program branches. These take two cycles since the fetch
instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed.

PIC16C5X
NOTES:

PIC16C5X
4.0 MEMORY ORGANIZATION FIGURE 4-2: PIC16C54s/CR54s/C55s
PROGRAM MEMORY MAP
PIC16C5X memory is organized into program memory
and data memory. For devices with more than 512 AND STACK
bytes of program memory, a paging scheme is used. PC<8:0>
Program memory pages are accessed using one or 9
two STATUS register bits. For devices with a data CALL, RETLW
memory register file of more than 32 registers, a Stack Level 1
banking scheme is used. Data memory banks are Stack Level 2
accessed using the File Selection Register (FSR).
000h
4.1 Program Memory Organization
User Memory
On-chip
Space
The PIC16C52 has a 9-bit Program Counter (PC) Program 0FFh
100h
capable of addressing a 384 x 12 program memory Memory
space (Figure 4-1). The PIC16C54s, PIC16CR54s and
PIC16C55s have a 9-bit Program Counter (PC)
capable of addressing a 512 x 12 program memory Reset Vector 1FFh
space (Figure 4-2). The PIC16C56s and PIC16CR56s
have a 10-bit Program Counter (PC) capable of
addressing a 1K x 12 program memory space FIGURE 4-3: PIC16C56s/CR56s
(Figure 4-3). The PIC16CR57s, PIC16C58s and PROGRAM MEMORY MAP
PIC16CR58s have an 11-bit Program Counter capable AND STACK
of addressing a 2K x 12 program memory space
(Figure 4-4). Accessing a location above the physically PC<9:0>
10
implemented address will cause a wraparound. CALL, RETLW
The reset vector for the PIC16C52 is at 17Fh. A NOP Stack Level 1
at the reset vector location will cause a restart at Stack Level 2
location 000h. The reset vector for the PIC16C54s,
PIC16CR54s and PIC16C55s is at 1FFh. The reset 000h
vector for the PIC16C56s and PIC16CR56s is at On-chip Program 0FFh

User Memory
3FFh. The reset vector for the PIC16C57s, Memory (Page 0) 100h
Space
PIC16CR57s, PIC16C58s, and PIC16CR58s is at 1FFh

7FFh. 200h
FIGURE 4-1: PIC16C52 PROGRAM On-chip Program 2FFh

Memory (Page 1) 300h
MEMORY MAP AND STACK
PC<8:0> Reset Vector 3FFh

9
CALL, RETLW
Stack Level 1
Stack Level 2
000h
User Memory
Space
On-chip Program
Memory
Reset Vector 17Fh

PIC16C5X
FIGURE 4-4: PIC16C57s/CR57s/C58s/
CR58s PROGRAM MEMORY
MAP AND STACK
PC<10:0>
11
CALL, RETLW
Stack Level 1
Stack Level 2
000h
On-chip Program 0FFh
1FFh
200h
On-chip Program
User Memory
2FFh
Space
3FFh
400h
On-chip Program
4FFh
5FFh
600h
On-chip Program
6FFh
Reset Vector 7FFh

PIC16C5X
4.2 Data Memory Organization FIGURE 4-5: PIC16C52, PIC16C54s,
PIC16CR54s, PIC16C55s,
Data memory is composed of registers, or bytes of
PIC16C56s, PIC16CR56s
RAM. Therefore, data memory for a device is specified
REGISTER FILE MAP
by its register file. The register file is divided into two
functional groups: special function registers and File Address
general purpose registers.
00h INDF(1)
The special function registers include the TMR0
register, the Program Counter (PC), the Status 01h TMR0
Register, the I/O registers (ports), and the File Select 02h PCL
Register (FSR). In addition, special purpose registers
03h STATUS
are used to control the I/O port configuration and
prescaler options. 04h FSR
The general purpose registers are used for data and 05h PORTA
control information under command of the instructions. 06h PORTB
For the PIC16C52, PIC16C54s, PIC16CR54s, 07h PORTC(2)
PIC16C56s and PIC16CR56s, the register file is
composed of 7 special function registers and 25
general purpose registers (Figure 4-5).
0Fh General
For the PIC16C55s, the register file is composed of 8 Purpose
10h Registers
special function registers and 24 general purpose
registers.
For the PIC16C57s and PIC16CR57s, the register file
is composed of 8 special function registers, 24 general 1Fh
purpose registers and up to 48 additional general
purpose registers that may be addressed using a Note 1: Not a physical register. See Section 4.7
banking scheme (Figure 4-6). 2: PIC16C55s only, others are a general
purpose register.
For the PIC16C58s and PIC16CR58s, the register file
is composed of 7 special function registers, 25 general
purpose registers and up to 48 additional general
purpose registers that may be addressed using a
banking scheme (Figure 4-7).
4.2.1 GENERAL PURPOSE REGISTER FILE
The register file is accessed either directly or indirectly

through the file select register FSR (Section 4.7).

PIC16C5X
FIGURE 4-6: PIC16C57s/CR57s REGISTER FILE MAP
FSR<6:5> 00 01 10 11
File Address
00h INDF(1) 20h 40h 60h
01h TMR0
02h PCL
03h STATUS
04h FSR
Addresses map back to
05h PORTA addresses in Bank 0.
06h PORTB
07h PORTC
08h General
Purpose
0Fh Registers 2Fh 4Fh 6Fh
10h 30h 50h 70h
General General General General
Purpose Purpose Purpose Purpose
Registers Registers Registers Registers
1Fh 3Fh 5Fh 7Fh

Bank 0 Bank 1 Bank 2 Bank 3
Note 1: Not a physical register. See Section 4.7
FIGURE 4-7: PIC16C58s/CR58s REGISTER FILE MAP

FSR<6:5> 00 01 10 11
File Address
00h INDF(1) 20h 40h 60h
01h TMR0
02h PCL
03h STATUS
04h FSR
Addresses map back to
05h PORTA addresses in Bank 0.
06h PORTB
07h
General
Purpose
Registers
0Fh 2Fh 4Fh 6Fh
10h 30h 50h 70h
General General General General
Purpose Purpose Purpose Purpose
Registers Registers Registers Registers
1Fh 3Fh 5Fh 7Fh

Note 1: Not a physical register. See Section 4.7

PIC16C5X
4.2.2 SPECIAL FUNCTION REGISTERS The special registers can be classified into two sets.
The special function registers associated with the
The Special Function Registers are registers used by “core” functions are described in this section. Those
the CPU and peripheral functions to control the related to the operation of the peripheral features are
operation of the device (Table 4-1). described in the section for each peripheral feature.
TABLE 4-1: SPECIAL FUNCTION REGISTER SUMMARY
Value on Value on
Power-On MCLR and
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset WDT Reset
N/A TRIS I/O control registers (TRISA, TRISB, TRISC) 1111 1111 1111 1111
N/A OPTION Contains control bits to configure Timer0 and Timer0/WDT prescaler --11 1111 --11 1111
00h INDF Uses contents of FSR to address data memory (not a physical register) xxxx xxxx uuuu uuuu
01h TMR0 8-bit real-time clock/counter xxxx xxxx uuuu uuuu
(1)
02h PCL Low order 8 bits of PC 1111 1111 1111 1111
03h STATUS PA2 PA1 PA0 TO PD Z DC C 0001 1xxx 000q quuu
04h FSR Indirect data memory address pointer 1xxx xxxx 1uuu uuuu
05h PORTA — — — — RA3 RA2 RA1 RA0 ---- xxxx ---- uuuu
06h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu
(2)
07h PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx uuuu uuuu
Legend: Shaded boxes = unimplemented or unused, – = unimplemented, read as '0' (if applicable)
x = unknown, u = unchanged, q = see the tables in Section 7.7 for possible values.
Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.5
for an explanation of how to access these bits.
2: File address 07h is a general purpose register on the PIC16C52, PIC16C54s, PIC16CR54s, PIC16C56s, PIC16CR56s,
PIC16C58s and PIC16CR58s.

PIC16C5X
4.3 STATUS Register not writable. Therefore, the result of an instruction with
the STATUS register as destination may be different
This register contains the arithmetic status of the ALU, than intended.
the RESET status, and the page preselect bits for
For example, CLRF STATUS will clear the upper three
program memories larger than 512 words.
bits and set the Z bit. This leaves the STATUS register
The STATUS register can be the destination for any as 000u u1uu (where u = unchanged).
instruction, as with any other register. If the STATUS
It is recommended, therefore, that only BCF, BSF and
register is the destination for an instruction that affects
MOVWF instructions be used to alter the STATUS
the Z, DC or C bits, then the write to these three bits is
register because these instructions do not affect the Z,
disabled. These bits are set or cleared according to
DC or C bits from the STATUS register. For other
the device logic. Furthermore, the TO and PD bits are
instructions, which do affect STATUS bits, see
Section 8.0, Instruction Set Summary.
FIGURE 4-8: STATUS REGISTER (ADDRESS:03h)
R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x

PA2 PA1 PA0 TO PD Z DC C R = Readable bit
bit7 6 5 4 3 2 1 bit0 W = Writable bit
- n = Value at POR reset
bit 7: PA2: This bit unused at this time.
Use of the PA2 bit as a general purpose read/write bit is not recommended, since this may affect upward
compatibility with future products.
bit 6-5: PA1:PA0: Program page preselect bits (PIC16C56s/CR56s)(PIC16C57s/CR57s)(PIC16C58s/CR58s)
00 = Page 0 (000h - 1FFh) - PIC16C56s/CR56s, PIC16C57s/CR57s, PIC16C58s/CR58s
01 = Page 1 (200h - 3FFh) - PIC16C56s/CR56s, PIC16C57s/CR57s, PIC16C58s/CR58s
10 = Page 2 (400h - 5FFh) - PIC16C57s/CR57s, PIC16C58s/CR58s
11 = Page 3 (600h - 7FFh) - PIC16C57s/CR57s, PIC16C58s/CR58s
Each page is 512 words.
Using the PA1:PA0 bits as general purpose read/write bits in devices which do not use them for program
page preselect is not recommended since this may affect upward compatibility with future products.
bit 4: TO: Time-out bit
1 = After power-up, CLRWDT instruction, or SLEEP instruction
0 = A WDT time-out occurred
bit 3: PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2: Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1: DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions)
ADDWF
1 = A carry from the 4th low order bit of the result occurred
0 = A carry from the 4th low order bit of the result did not occur
SUBWF
1 = A borrow from the 4th low order bit of the result did not occur
0 = A borrow from the 4th low order bit of the result occurred
bit 0: C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions)
ADDWF SUBWF RRF or RLF
1 = A carry occurred 1 = A borrow did not occur Load bit with LSb or MSb, respectively
0 = A carry did not occur 0 = A borrow occurred

PIC16C5X
4.4 OPTION Register By executing the OPTION instruction, the contents of
the W register will be transferred to the OPTION
The OPTION register is a 6-bit wide, write-only register. A RESET sets the OPTION<5:0> bits.
register which contains various control bits to
configure the Timer0/WDT prescaler and Timer0.
FIGURE 4-9: OPTION REGISTER
U-0 U-0 W-1 W-1 W-1 W-1 W-1 W-1

— — T0CS T0SE PSA PS2 PS1 PS0 W = Writable bit
bit7 6 5 4 3 2 1 bit0 U = Unimplemented bit
- n = Value at POR reset
bit 7-6: Unimplemented.
bit 5: T0CS: Timer0 clock source select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (CLKOUT)
bit 4: T0SE: Timer0 source edge select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3: PSA: Prescaler assignment bit
1 = Prescaler assigned to the WDT (not implemented on PIC16C52)
0 = Prescaler assigned to Timer0
bit 2-0: PS2:PS0: Prescaler rate select bits
Bit Value Timer0 Rate WDT Rate (not implemented on PIC16C52)
000 1:2 1:1

001 1:4 1:2
010 1:8 1:4
011 1 : 16 1:8
100 1 : 32 1 : 16
101 1 : 64 1 : 32
110 1 : 128 1 : 64
111 1 : 256 1 : 128

PIC16C5X
4.5 Program Counter FIGURE 4-10: LOADING OF PC
BRANCH INSTRUCTIONS -
As a program instruction is executed, the Program
PIC16C52, PIC16C54s,
Counter (PC) will contain the address of the next
PIC16CR54s, PIC16C55s
program instruction to be executed. The PC value is
increased by one every instruction cycle, unless an GOTO Instruction
instruction changes the PC.
8 7 0
For a GOTO instruction, bits 8:0 of the PC are provided PC PCL
by the GOTO instruction word. The PC Latch (PCL) is
mapped to PC<7:0> (Figure 4-10 and Figure 4-11).
Instruction Word
For the PIC16C56s, PIC16CR56s, PIC16C57s,
PIC16CR57s, PIC16C58s and PIC16CR58s, a page
number must be supplied as well. Bit5 and bit6 of the CALL or Modify PCL Instruction
STATUS register provide page information to bit9 and 8 7 0
bit10 of the PC (Figure 4-11 and Figure 4-12). PC PCL
For a CALL instruction, or any instruction where the
PCL is the destination, bits 7:0 of the PC again are
Reset to '0' Instruction Word
provided by the instruction word. However, PC<8>
does not come from the instruction word, but is always
cleared (Figure 4-10 and Figure 4-11). FIGURE 4-11: LOADING OF PC
Instructions where the PCL is the destination, or BRANCH INSTRUCTIONS -
Modify PCL instructions, include MOVWF PC, ADDWF PIC16C56s/PIC16CR56s
PC, and BSF PC,5.
GOTO Instruction
For the PIC16C56s, PIC16CR56s, PIC16C57s,
10 9 8 7 0
PIC16CR57s, PIC16C58s and PIC16CR58s, a page
PC PCL
number again must be supplied. Bit5 and bit6 of the
STATUS register provide page information to bit9 and
bit10 of the PC (Figure 4-11 and Figure 4-12). Instruction Word
Note: Because PC<8> is cleared in the CALL 2 PA1:PA0
instruction, or any Modify PCL instruction, 7 0
all subroutine calls or computed jumps are
limited to the first 256 locations of any pro- STATUS
gram memory page (512 words long).
CALL or Modify PCL Instruction
10 9 8 7 0
PC PCL
Instruction Word
Reset to ‘0’
2 PA1:PA0
7 0
STATUS

PIC16C5X
FIGURE 4-12: LOADING OF PC 4.5.1 PAGING CONSIDERATIONS –
BRANCH INSTRUCTIONS - PIC16C56s/CR56s, PIC16C57s/CR57s AND
PIC16C57s/PIC16CR57s, AND PIC16C58s/CR58s
PIC16C58s/PIC16CR58s If the Program Counter is pointing to the last address
GOTO Instruction of a selected memory page, when it increments it will
10 9 8 7 0 cause the program to continue in the next higher page.
PC PCL However, the page preselect bits in the STATUS
register will not be updated. Therefore, the next GOTO,
CALL, or Modify PCL instruction will send the program
Instruction Word to the page specified by the page preselect bits (PA0
2 PA1:PA0 or PA1:PA0).
7 0
For example, a NOP at location 1FFh (page 0)
increments the PC to 200h (page 1). A GOTO xxx at
STATUS 200h will return the program to address xxxh on page
0 (assuming that PA1:PA0 are clear).
CALL or Modify PCL Instruction To prevent this, the page preselect bits must be
updated under program control.
10 9 8 7 0
PC PCL 4.5.2 EFFECTS OF RESET
The Program Counter is set upon a RESET, which

Instruction Word means that the PC addresses the last location in the
last page i.e., the reset vector.
Reset to ‘0’
2 PA1:PA0 The STATUS register page preselect bits are cleared
7 0 upon a RESET, which means that page 0 is
pre-selected.
STATUS Therefore, upon a RESET, a GOTO instruction at the
reset vector location will automatically cause the
For the RETLW instruction, the PC is loaded with the program to jump to page 0.
Top Of Stack (TOS) contents. All of the devices
covered in this data sheet have a two-level stack. The 4.6 Stack
stack has the same bit width as the device PC.
PIC16C5X devices have a 9-bit, 10-bit or 11-bit wide,
two-level hardware push/pop stack (Figure 4-2,
Figure 4-1, and Figure 4-3 respectively).
A CALL instruction will push the current value of stack 1
into stack 2 and then push the current program counter
value, incremented by one, into stack level 1. If more
than two sequential CALL’s are executed, only the most
recent two return addresses are stored.
A RETLW instruction will pop the contents of stack level
1 into the program counter and then copy stack level 2
contents into level 1. If more than two sequential
RETLW’s are executed, the stack will be filled with the
address previously stored in level 2. Note that the
W register will be loaded with the literal value specified
in the instruction. This is particularly useful for the
implementation of data look-up tables within the
program memory.

PIC16C5X
4.7 Indirect Data Addressing; INDF and EXAMPLE 4-2: HOW TO CLEAR RAM
FSR Registers USING INDIRECT
ADDRESSING
The INDF register is not a physical register. movlw 0x10 ;initialize pointer
Addressing INDF actually addresses the register movwf FSR ; to RAM
whose address is contained in the FSR register (FSR NEXT clrf INDF ;clear INDF register
is a pointer). This is indirect addressing. incf FSR,F ;inc pointer
btfsc FSR,4 ;all done?
EXAMPLE 4-1: INDIRECT ADDRESSING goto NEXT ;NO, clear next
CONTINUE
• Register file 05 contains the value 10h
: ;YES, continue
• Register file 06 contains the value 0Ah
• Load the value 05 into the FSR register The FSR is either a 5-bit (PIC16C52, PIC16C54s,
• A read of the INDF register will return the value PIC16CR54s, PIC16C55s), 6-bit (PIC16C56s,
of 10h PIC16CR56s), or 7-bit (PIC16C57s, PIC16CR57s,
• Increment the value of the FSR register by one PIC16C58s, PIC16CR58s) wide register. It is used in
(FSR = 06) conjunction with the INDF register to indirectly address
• A read of the INDR register now will return the the data memory area.
value of 0Ah. The FSR<4:0> bits are used to select data memory
Reading INDF itself indirectly (FSR = 0) will produce addresses 00h to 1Fh.
00h. Writing to the INDF register indirectly results in a PIC16C52, PIC16C54s, PIC16CR54s, PIC16C55s:
no-operation (although STATUS bits may be affected). Do not use banking. FSR<6:5> are unimplemented
A simple program to clear RAM locations 10h-1Fh and read as '1's.
using indirect addressing is shown in Example 4-2. PIC16C56s, PIC16CR56s: FSR<6:5> are the bank
select bits and are used to select the bank to be
addressed (00 = bank 0, 01 = bank 1, 10 = invalid, 11
= invalid).
PIC16C57s, PIC16CR57s, PIC16C58s,
PIC16CR58s: FSR<6:5> are the bank select bits and
are used to select the bank to be addressed (00 =
bank 0, 01 = bank 1, 10 = bank 2, 11 = bank 3).
FIGURE 4-13: DIRECT/INDIRECT ADDRESSING

Direct Addressing Indirect Addressing
(FSR)
6 5 4 (opcode) 0 6 5 4 (FSR) 0
bank select location select bank location select

00 01 10 11
00h
Addresses map back

to addresses in Bank 0.
Data 0Fh
Memory(1) 10h
1Fh 3Fh 5Fh 7Fh

Note 1: For register map detail see Section 4.2.

PIC16C5X
5.0 I/O PORTS 5.5 I/O Interfacing
As with any other register, the I/O registers can be The equivalent circuit for an I/O port pin is shown in
written and read under program control. However, read Figure 5-1. All ports may be used for both input and
instructions (e.g., MOVF PORTB,W) always read the I/O output operation. For input operations these ports are
pins independent of the pin’s input/output modes. On non-latching. Any input must be present until read by
RESET, all I/O ports are defined as input (inputs are at an input instruction (e.g., MOVF PORTB, W). The
hi-impedance) since the I/O control registers (TRISA, outputs are latched and remain unchanged until the
TRISB, TRISC) are all set. output latch is rewritten. To use a port pin as output,
the corresponding direction control bit (in TRISA,
5.1 PORTA TRISB) must be cleared (= 0). For use as an input, the
PORTA is a 4-bit I/O register. Only the low order 4 bits corresponding TRIS bit must be set. Any I/O pin can
are used (RA3:RA0). Bits 7-4 are unimplemented and be programmed individually as input or output.
read as '0's. FIGURE 5-1: EQUIVALENT CIRCUIT
FOR A SINGLE I/O PIN
5.2 PORTB
Data
PORTB is an 8-bit I/O register (PORTB<7:0>). Bus
D Q
5.3 PORTC Data
VDD
WR Latch
Port
PORTC is an 8-bit I/O register for PIC16C55s, CK Q
P
PIC16C57s and PIC16CR57s.
PORTC is a general purpose register for PIC16C52,
PIC16C54s, PIC16CR54s, PIC16C56s, PIC16C58s W N I/O
and PIC16CR58s. Reg pin(1)
D Q
TRIS
5.4 TRIS Registers Latch
VSS
TRIS ‘f’
The output driver control registers are loaded with the CK Q
contents of the W register by executing the TRIS f
instruction. A '1' from a TRIS register bit puts the
corresponding output driver in a hi-impedance mode. Reset
A '0' puts the contents of the output data latch on the
selected pins, enabling the output buffer.
Note: A read of the ports reads the pins, not the

output data latches. That is, if an output RD Port
driver on a pin is enabled and driven high,
but the external system is holding it low, a Note 1: I/O pins have protection diodes to VDD and VSS.
read of the port will indicate that the pin is
low.
The TRIS registers are “write-only” and are set (output

drivers disabled) upon RESET.
TABLE 5-1: SUMMARY OF PORT REGISTERS
Value on Value on
Power-On MCLR and
N/A TRIS I/O control registers (TRISA, TRISB) 1111 1111 1111 1111
05h PORTA — — — — RA3 RA2 RA1 RA0 ---- xxxx ---- uuuu
06h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu
07h PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx uuuu uuuu
Legend: Shaded boxes = unimplemented, read as ‘0’,
– = unimplemented, read as '0', x = unknown, u = unchanged

PIC16C5X
5.6 I/O Programming Considerations EXAMPLE 5-1: READ-MODIFY-WRITE
INSTRUCTIONS ON AN
5.6.1 BI-DIRECTIONAL I/O PORTS
I/O PORT
Some instructions operate internally as read followed ;Initial PORT Settings
; PORTB<7:4> Inputs
by write operations. The BCF and BSF instructions, for
; PORTB<3:0> Outputs
example, read the entire port into the CPU, execute ;PORTB<7:6> have external pull-ups and are
the bit operation and re-write the result. Caution must ;not connected to other circuitry
be used when these instructions are applied to a port ;
where one or more pins are used as input/outputs. For ; PORT latch PORT pins
example, a BSF operation on bit5 of PORTB will cause ; ---------- ----------
all eight bits of PORTB to be read into the CPU, bit5 to BCF PORTB, 7 ;01pp pppp 11pp pppp
be set and the PORTB value to be written to the output BCF PORTB, 6 ;10pp pppp 11pp pppp
latches. If another bit of PORTB is used as a MOVLW 03Fh ;
bi-directional I/O pin (say bit0) and it is defined as an TRIS PORTB ;10pp pppp 10pp pppp
;
input at this time, the input signal present on the pin
;Note that the user may have expected the pin
itself would be read into the CPU and rewritten to the ;values to be 00pp pppp. The 2nd BCF caused
data latch of this particular pin, overwriting the ;RB7 to be latched as the pin value (High).
previous content. As long as the pin stays in the input
mode, no problem occurs. However, if bit0 is switched 5.6.2 SUCCESSIVE OPERATIONS ON I/O
into output mode later on, the content of the data latch PORTS
may now be unknown.
The actual write to an I/O port happens at the end of
Example 5-1 shows the effect of two sequential an instruction cycle, whereas for reading, the data
read-modify-write instructions (e.g., BCF, BSF, etc.) on must be valid at the beginning of the instruction cycle
an I/O port. (Figure 5-2). Therefore, care must be exercised if a
A pin actively outputting a high or a low should not be write followed by a read operation is carried out on the
driven from external devices at the same time in order same I/O port. The sequence of instructions should
to change the level on this pin (“wired-or”, “wired-and”). allow the pin voltage to stabilize (load dependent)
The resulting high output currents may damage the before the next instruction, which causes that file to be
chip. read into the CPU, is executed. Otherwise, the
previous state of that pin may be read into the CPU
rather than the new state. When in doubt, it is better to
separate these instructions with a NOP or another
instruction not accessing this I/O port.
FIGURE 5-2: SUCCESSIVE I/O OPERATION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC PC + 1 PC + 2 PC + 3
Instruction
fetched MOVWF PORTB MOVF PORTB,W NOP NOP
This example shows a write
to PORTB followed by a read
RB7:RB0
from PORTB.
Port pin Port pin
written here sampled here
Instruction
executed MOVWF PORTB MOVF PORTB,W NOP
(Write to (Read
PORTB) PORTB)

PIC16C5X
6.0 TIMER0 MODULE AND Counter mode is selected by setting the T0CS bit
(OPTION<5>). In this mode, Timer0 will increment
TMR0 REGISTER either on every rising or falling edge of pin T0CKI. The
The Timer0 module has the following features: incrementing edge is determined by the source edge
• 8-bit timer/counter register, TMR0 select bit T0SE (OPTION<4>). Clearing the T0SE bit
selects the rising edge. Restrictions on the external
- Readable and writable
clock input are discussed in detail in Section 6.1.
• 8-bit software programmable prescaler
The prescaler may be used by either the Timer0
• Internal or external clock select
module or the Watchdog Timer, but not both. The
- Edge select for external clock prescaler assignment is controlled in software by the
Figure 6-1 is a simplified block diagram of the Timer0 control bit PSA (OPTION<3>). Clearing the PSA bit
module, while Figure 6-2 shows the electrical structure will assign the prescaler to Timer0. The prescaler is
of the Timer0 input. not readable or writable. When the prescaler is
Timer mode is selected by clearing the T0CS bit assigned to the Timer0 module, prescale values of 1:2,
(OPTION<5>). In timer mode, the Timer0 module will 1:4,..., 1:256 are selectable. Section 6.2 details the
increment every instruction cycle (without prescaler). If operation of the prescaler.
TMR0 register is written, the increment is inhibited for A summary of registers associated with the Timer0
the following two cycles (Figure 6-3 and Figure 6-4). module is found in Table 6-1.
The user can work around this by writing an adjusted
value to the TMR0 register.
FIGURE 6-1: TIMER0 BLOCK DIAGRAM
Data bus
FOSC/4 0
PSout 8
1
Sync with
1 Internal TMR0 reg
T0CKI Programmable Clocks
0 PSout
pin Prescaler(2)
T0SE(1) (2 cycle delay) Sync
3
PS2, PS1, PS0(1) PSA(1)
T0CS(1)
Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register.
2: The prescaler is shared with the Watchdog Timer (Figure 6-6).
FIGURE 6-2: ELECTRICAL STRUCTURE OF T0CKI PIN
RIN
T0CKI (1) Schmitt Trigger

pin (1) N Input Buffer
VSS VSS
Note 1: ESD protection circuits

PIC16C5X
FIGURE 6-3: TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE
PC Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
(Program
Counter) PC-1 PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6
Instruction MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Fetch
Timer0 T0 T0+1 T0+2 NT0 NT0 NT0 NT0+1 NT0+2
Instruction
Executed
Write TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0
executed reads NT0 reads NT0 reads NT0 reads NT0 + 1 reads NT0 + 2
FIGURE 6-4: TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2
PC Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
(Program
Counter) PC-1 PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6
Instruction MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Fetch
Timer0 T0 T0+1 NT0 NT0+1 T0
Instruction
Execute Write TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0 Read TMR0
executed reads NT0 reads NT0 reads NT0 reads NT0 reads NT0 + 1
TABLE 6-1: REGISTERS ASSOCIATED WITH TIMER0
Value on Value on
Power-On MCLR and
01h TMR0 Timer0 - 8-bit real-time clock/counter xxxx xxxx uuuu uuuu
N/A OPTION — — T0CS T0SE PSA PS2 PS1 PS0 --11 1111 --11 1111
Legend: Shaded cells: Unimplemented bits,
- = unimplemented, x = unknown, u = unchanged,

PIC16C5X
6.1 Using Timer0 with an External Clock When a prescaler is used, the external clock input is
divided by the asynchronous ripple counter-type
When an external clock input is used for Timer0, it prescaler so that the prescaler output is symmetrical.
must meet certain requirements. The external clock For the external clock to meet the sampling
requirement is due to internal phase clock (TOSC) requirement, the ripple counter must be taken into
synchronization. Also, there is a delay in the actual account. Therefore, it is necessary for T0CKI to have a
incrementing of Timer0 after synchronization. period of at least 4TOSC (and a small RC delay of
40 ns) divided by the prescaler value. The only
6.1.1 EXTERNAL CLOCK SYNCHRONIZATION
requirement on T0CKI high and low time is that they
When no prescaler is used, the external clock input is do not violate the minimum pulse width requirement of
the same as the prescaler output. The synchronization 10 ns. Refer to parameters 40, 41 and 42 in the
of T0CKI with the internal phase clocks is electrical specification of the desired device.
accomplished by sampling the prescaler output on the
6.1.2 TIMER0 INCREMENT DELAY
Q2 and Q4 cycles of the internal phase clocks
(Figure 6-5). Therefore, it is necessary for T0CKI to be Since the prescaler output is synchronized with the
high for at least 2TOSC (and a small RC delay of 20 ns) internal clocks, there is a small delay from the time the
and low for at least 2TOSC (and a small RC delay of external clock edge occurs to the time the Timer0
20 ns). Refer to the electrical specification of the module is actually incremented. Figure 6-5 shows the
desired device. delay from the external clock edge to the timer
incrementing.
FIGURE 6-5: TIMER0 TIMING WITH EXTERNAL CLOCK
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
External Clock Input or Small pulse
Prescaler Output (2) misses sampling
(1)
External Clock/Prescaler (3)
Output After Sampling
Increment Timer0 (Q4)
Timer0 T0 T0 + 1 T0 + 2
Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc).
Therefore, the error in measuring the interval between two edges on Timer0 input = ± 4Tosc max.
2: External clock if no prescaler selected, Prescaler output otherwise.
3: The arrows indicate the points in time where sampling occurs.

PIC16C5X
6.2 Prescaler following instruction sequence (Example 6-1) must be
executed when changing the prescaler assignment from
An 8-bit counter is available as a prescaler for the Timer0 to the WDT.
Timer0 module, or as a postscaler for the Watchdog
Timer (WDT) (WDT postscaler not implemented on EXAMPLE 6-1: CHANGING PRESCALER
PIC16C52), respectively (Section 6.1.2). For simplicity,
(TIMER0→WDT)
this counter is being referred to as “prescaler” 1.CLRWDT ;Clear WDT
throughout this data sheet. Note that the prescaler 2.CLRF TMR0 ;Clear TMR0 & Prescaler
may be used by either the Timer0 module or the WDT, 3.MOVLW '00xx1111’b ;These 3 lines (5, 6, 7)
but not both. Thus, a prescaler assignment for the 4.OPTION ; are required only if
Timer0 module means that there is no prescaler for ; desired
the WDT, and vice-versa. 5.CLRWDT ;PS<2:0> are 000 or 001
6.MOVLW '00xx1xxx’b ;Set Postscaler to
The PSA and PS2:PS0 bits (OPTION<3:0>) determine 7.OPTION ; desired WDT rate
prescaler assignment and prescale ratio.
To change prescaler from the WDT to the Timer0
When assigned to the Timer0 module, all instructions module, use the sequence shown in Example 6-2. This
writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, sequence must be used even if the WDT is disabled. A
BSF 1,x, etc.) will clear the prescaler. When assigned CLRWDT instruction should be executed before switching
to WDT, a CLRWDT instruction will clear the prescaler the prescaler.
along with the WDT. The prescaler is neither readable
nor writable. On a RESET, the prescaler contains all
EXAMPLE 6-2: CHANGING PRESCALER
'0's.
(WDT→TIMER0)
6.2.1 SWITCHING PRESCALER ASSIGNMENT CLRWDT ;Clear WDT and
;prescaler
The prescaler assignment is fully under software control MOVLW 'xxxx0xxx' ;Select TMR0, new
(i.e., it can be changed “on the fly” during program ;prescale value and
execution). To avoid an unintended device RESET, the ;clock source
OPTION
FIGURE 6-6: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
TCY ( = Fosc/4)
Data Bus
0 8
M 1
T0CKI U M
1 X Sync
pin U 2 TMR0 reg
0 X Cycles
T0SE
T0CS
PSA
0
8-bit Prescaler
M
U
1 X
Watchdog 8
Timer
8 - to - 1MUX PS2:PS0
PSA
0 1
WDT Enable bit
MUX PSA
WDT
Time-Out
Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register.
WDT not implemented on PIC16C52.

PIC16C5X
7.0 SPECIAL FEATURES OF THE The SLEEP mode is designed to offer a very low
current power-down mode. The user can wake up from
CPU SLEEP through external reset or through a Watchdog
What sets a microcontroller apart from other Timer time-out. Several oscillator options are also
processors are special circuits that deal with the made available to allow the part to fit the application.
needs of real-time applications. The PIC16C5X family The RC oscillator option saves system cost while the
of microcontrollers has a host of such features LP crystal option saves power. A set of configuration
intended to maximize system reliability, minimize cost bits are used to select various options.
through elimination of external components, provide
power saving operating modes and offer code 7.1 Configuration Bits
protection. These features are:
Configuration bits can be programmed to select
• Oscillator selection various device configurations. Two bits are for the
• Reset selection of the oscillator type and one bit is the
• Power-On Reset (POR) Watchdog Timer enable bit. Nine bits are code
• Device Reset Timer (DRT) protection bits (Figure 7-1 and Figure 7-2) for the
PIC16C54, PIC16CR54, PIC16C56, PIC16CR56,
• Watchdog Timer (WDT)
PIC16C58, and PIC16CR58 devices.
(not implemented on PIC16C52)
• SLEEP QTP or ROM devices have the oscillator configuration
programmed at the factory and these parts are tested
• Code protection
accordingly (see "Product Identification System"
• ID locations (not implemented on PIC16C52) diagrams in the back of this data sheet).
The PIC16C5X Family has a Watchdog Timer which
can be shut off only through configuration bit WDTE. It
runs off of its own RC oscillator for added reliability.
There is an 18 ms delay provided by the Device Reset
Timer (DRT), intended to keep the chip in reset until
the crystal oscillator is stable. With this timer on-chip,
most applications need no external reset circuitry.
FIGURE 7-1: CONFIGURATION WORD FOR

PIC16CR54A/C54B/CR54B/C56A/CR56A/CR57B/C58B/CR58A/CR58B
CP CP CP CP CP CP CP CP CP WDTE FOSC1 FOSC0 Register: CONFIG

bit11 10 9 8 7 6 5 4 3 2 1 bit0 Address(1): FFFh
bit 11-3: CP: Code protection bits
1 = Code protection off
0 = Code protection on
bit 2: WDTE: Watchdog timer enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator selection bits
11 = RC oscillator
10 = HS oscillator
01 = XT oscillator
00 = LP oscillator
Note 1: Refer to the PIC16C5X Programming Specification (Literature Number DS30190) to deter-
mine how to access the configuration word.

PIC16C5X
FIGURE 7-2: CONFIGURATION WORD FOR PIC16C52/C54/C54A/C55/C56/C57/C58A
— — — — — — — — CP WDTE FOSC1 FOSC0 Register: CONFIG

bit11 10 9 8 7 6 5 4 3 2 1 bit0 Address(1): FFFh
bit 11-4: Unimplemented: Read as ’0’
bit 3: CP: Code protection bit.
1 = Code protection off
0 = Code protection on
bit 2: WDTE: Watchdog timer enable bit (not implemented on PIC16C52)
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator selection bits(2)
11 = RC oscillator
10 = HS oscillator
01 = XT oscillator
00 = LP oscillator
Note 1: Refer to the PIC16C5X Programming Specifications (Literature Number DS30190) to

determine how to access the configuration word.
2: PIC16C52 supports XT and RC oscillator only.
PIC16LV54A supports XT, RC and LP oscillator only.
PIC16LV58A supports XT, RC and LP oscillator only.

PIC16C5X
7.2 Oscillator Configurations FIGURE 7-4: EXTERNAL CLOCK INPUT
OPERATION (HS, XT OR LP
7.2.1 OSCILLATOR TYPES
OSC CONFIGURATION)
PIC16C5Xs can be operated in four different oscillator
modes. The user can program two configuration bits
Clock from OSC1
(FOSC1:FOSC0) to select one of these four modes: ext. system PIC16C5X
• LP: Low Power Crystal
Open OSC2
• XT: Crystal/Resonator
• HS: High Speed Crystal/Resonator
• RC: Resistor/Capacitor TABLE 7-1: CAPACITOR SELECTION
Note: Not all oscillator selections available for all FOR CERAMIC RESONATORS
parts. See Section 7.1. - PIC16C5X, PIC16CR5X
Osc Resonator Cap. Range Cap. Range
7.2.2 CRYSTAL OSCILLATOR / CERAMIC Type Freq C1 C2
RESONATORS
XT 455 kHz 22-100 pF 22-100 pF
In XT, LP or HS modes, a crystal or ceramic resonator 2.0 MHz 15-68 pF 15-68 pF
is connected to the OSC1/CLKIN and OSC2/CLKOUT 4.0 MHz 15-68 pF 15-68 pF
pins to establish oscillation (Figure 7-3). The HS 4.0 MHz 15-68 pF 15-68 pF
PIC16C5X oscillator design requires the use of a 8.0 MHz 10-68 pF 10-68 pF
parallel cut crystal. Use of a series cut crystal may give 16.0 MHz 10-22 pF 10-22 pF
a frequency out of the crystal manufacturers These values are for design guidance only. Since
specifications. When in XT, LP or HS modes, the each resonator has its own characteristics, the user
device can have an external clock source drive the should consult the resonator manufacturer for
OSC1/CLKIN pin (Figure 7-4). appropriate values of external components.
FIGURE 7-3: CRYSTAL OPERATION TABLE 7-2: CAPACITOR SELECTION
(OR CERAMIC RESONATOR) FOR CRYSTAL OSCILLATOR
(HS, XT OR LP OSC - PIC16C5X, PIC16CR5X
CONFIGURATION) Osc Resonator Cap.Range Cap. Range
C1(1) Type Freq C1 C2
OSC1 PIC16C5X
LP 32 kHz(1) 15 pF 15 pF
SLEEP 100 kHz 15-30 pF 30-47 pF
XTAL RF(3)
200 kHz 15-30 pF 15-82 pF
To internal XT 100 kHz 15-30 pF 200-300 pF
logic
OSC2 200 kHz 15-30 pF 100-200 pF
RS(2)
455 kHz 15-30 pF 15-100 pF
C2(1)
1 MHz 15-30 pF 15-30 pF
Note 1: See Capacitor Selection tables for 2 MHz 15-30 pF 15-30 pF
recommended values of C1 and C2. 4 MHz 15-47 pF 15-47 pF
2: A series resistor (RS) may be required for HS 4 MHz 15-30 pF 15-30 pF
AT strip cut crystals. 8 MHz 15-30 pF 15-30 pF
3: RF varies with the crystal chosen (approx. 20 MHz 15-30 pF 15-30 pF
value = 10 MΩ). Note 1: For VDD > 4.5V, C1 = C2 ≈ 30 pF is
recommended.
These values are for design guidance only. Rs may
be required in HS mode as well as XT mode to avoid
overdriving crystals with low drive level specification.
Since each crystal has its own characteristics, the
user should consult the crystal manufacturer for
appropriate values of external components.
Note: If you change from this device to

another device, please verify oscillator
characteristics in your application.

PIC16C5X
7.2.3 EXTERNAL CRYSTAL OSCILLATOR FIGURE 7-6: EXTERNAL SERIES
CIRCUIT RESONANT CRYSTAL
Either a prepackaged oscillator or a simple oscillator OSCILLATOR CIRCUIT
circuit with TTL gates can be used as an external (USING XT, HS OR LP
crystal oscillator circuit. Prepackaged oscillators OSCILLATOR MODE)
provide a wide operating range and better stability. A To Other
well-designed crystal oscillator will provide good 330 330 Devices
performance with TTL gates. Two types of crystal 74AS04 74AS04 74AS04 PIC16C5X
oscillator circuits can be used: one with parallel
CLKIN
resonance, or one with series resonance.
0.1 µF
Figure 7-5 shows implementation of a parallel OSC2
XTAL
resonant oscillator circuit. The circuit is designed to
100k
use the fundamental frequency of the crystal. The
74AS04 inverter performs the 180-degree phase shift
that a parallel oscillator requires. The 4.7 kΩ resistor
provides the negative feedback for stability. The 10 kΩ Note: If you change from this device to
potentiometers bias the 74AS04 in the linear region. another device, please verify oscillator
This circuit could be used for external oscillator characteristics in your application.
designs.
7.2.4 RC OSCILLATOR
FIGURE 7-5: EXTERNAL PARALLEL
For timing insensitive applications, the RC device
RESONANT CRYSTAL
option offers additional cost savings. The RC oscillator
OSCILLATOR CIRCUIT
frequency is a function of the supply voltage, the
(USING XT, HS OR LP resistor (Rext) and capacitor (Cext) values, and the
OSCILLATOR MODE) operating temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal
+5V
To Other process parameter variation. Furthermore, the
Devices difference in lead frame capacitance between package
10k
4.7k 74AS04 PIC16C5X types will also affect the oscillation frequency,
especially for low Cext values. The user also needs to
74AS04 CLKIN
take into account variation due to tolerance of external
R and C components used.
OSC2
10k Figure 7-7 shows how the R/C combination is
100k connected to the PIC16C5X. For Rext values below
XTAL
2.2 kΩ, the oscillator operation may become unstable,
10k or stop completely. For very high Rext values
(e.g., 1 MΩ) the oscillator becomes sensitive to noise,
20 pF 20 pF humidity and leakage. Thus, we recommend keeping
Rext between 3 kΩ and 100 kΩ.
Although the oscillator will operate with no external
Note: If you change from this device to capacitor (Cext = 0 pF), we recommend using values
another device, please verify oscillator above 20 pF for noise and stability reasons. With no or
characteristics in your application. small external capacitance, the oscillation frequency
This circuit is also designed to use the fundamental can vary dramatically due to changes in external
frequency of the crystal. The inverter performs a capacitances, such as PCB trace capacitance or
180-degree phase shift in a series resonant oscillator package lead frame capacitance.
circuit. The 330 Ω resistors provide the negative
feedback to bias the inverters in their linear region.

PIC16C5X
The Electrical Specifications sections show RC 7.3 Reset
frequency variation from part to part due to normal
process variation. PIC16C5X devices may be reset in one of the
following ways:
Also, see the Electrical Specifications sections for
variation of oscillator frequency due to VDD for given • Power-On Reset (POR)
Rext/Cext values as well as frequency variation due to • MCLR reset (normal operation)
operating temperature for given R, C, and VDD values. • MCLR wake-up reset (from SLEEP)
The oscillator frequency, divided by 4, is available on • WDT reset (normal operation)
the OSC2/CLKOUT pin, and can be used for test • WDT wake-up reset (from SLEEP)
purposes or to synchronize other logic.
Table 7-3 shows these reset conditions for the PCL
FIGURE 7-7: RC OSCILLATOR MODE and STATUS registers.
VDD Some registers are not affected in any reset condition.
Their status is unknown on POR and unchanged in
Rext any other reset. Most other registers are reset to a
Internal
OSC1 clock “reset state” on Power-On Reset (POR), MCLR or
WDT reset. A MCLR or WDT wake-up from SLEEP
also results in a device reset, and not a continuation of
N operation before SLEEP.
Cext PIC16C5X
VSS The TO and PD bits (STATUS <4:3>) are set or

Fosc/4 cleared depending on the different reset conditions
OSC2/CLKOUT (Section 7.7). These bits may be used to determine
the nature of the reset.
Table 7-4 lists a full description of reset states of all
Note: If you change from this device to
registers. Figure 7-8 shows a simplified block diagram
another device, please verify oscillator
of the on-chip reset circuit.
characteristics in your application.

PIC16C5X
TABLE 7-3: RESET CONDITIONS FOR SPECIAL REGISTERS
PCL STATUS
Condition
Addr: 02h Addr: 03h
Power-On Reset 1111 1111 0001 1xxx
MCLR reset (normal operation) 1111 1111 000u uuuu(1)
MCLR wake-up (from SLEEP) 1111 1111 0001 0uuu
WDT reset (normal operation) 1111 1111 0000 1uuu(2)
WDT wake-up (from SLEEP) 1111 1111 0000 0uuu
Legend: u = unchanged, x = unknown, - = unimplemented read as '0'.
Note 1: TO and PD bits retain their last value until one of the other reset conditions occur.
2: The CLRWDT instruction will set the TO and PD bits.
TABLE 7-4: RESET CONDITIONS FOR ALL REGISTERS
Register Address Power-On Reset MCLR or WDT Reset

W N/A xxxx xxxx uuuu uuuu
TRIS N/A 1111 1111 1111 1111
OPTION N/A --11 1111 --11 1111
INDF 00h xxxx xxxx uuuu uuuu
TMR0 01h xxxx xxxx uuuu uuuu
PCL(1) 02h 1111 1111 1111 1111
STATUS(1) 03h 0001 1xxx 000q quuu
FSR 04h 1xxx xxxx 1uuu uuuu
PORTA 05h ---- xxxx ---- uuuu
PORTB 06h xxxx xxxx uuuu uuuu
PORTC(2) 07h xxxx xxxx uuuu uuuu
General Purpose Register Files 07-7Fh xxxx xxxx uuuu uuuu
Legend: u = unchanged, x = unknown, - = unimplemented, read as '0',
q = see tables in Section 7.7 for possible values.
Note 1: See Table 7-3 for reset value for specific conditions.
2: General purpose register file on PIC16C52/C54s/CR54s/C56s/CR56s/C58s/CR58s
FIGURE 7-8: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Power-Up
Detect
VDD POR (Power-On Reset)
MCLR/VPP pin WDT Time-out
RESET S Q
WDT
On-Chip 8-bit Asynch
RC OSC Ripple Counter
(Start-Up Timer) R Q
CHIP RESET

PIC16C5X
7.4 Power-On Reset (POR) FIGURE 7-9: EXTERNAL POWER-ON
RESET CIRCUIT (FOR SLOW
The PIC16C5X family incorporates on-chip Power-On
VDD POWER-UP)
Reset (POR) circuitry which provides an internal chip
VDD VDD
reset for most power-up situations. To use this feature,
the user merely ties the MCLR/VPP pin to VDD. A
simplified block diagram of the on-chip Power-On D R
Reset circuit is shown in Figure 7-8. R1
The Power-On Reset circuit and the Device Reset MCLR
Timer (Section 7.5) circuit are closely related. On PIC16C5X
C
power-up, the reset latch is set and the DRT is reset.
The DRT timer begins counting once it detects MCLR
to be high. After the time-out period, which is typically • External Power-On Reset circuit is required
18 ms, it will reset the reset latch and thus end the only if VDD power-up is too slow. The diode D
on-chip reset signal. helps discharge the capacitor quickly when
A power-up example where MCLR is not tied to VDD is VDD powers down.
shown in Figure 7-10. VDD is allowed to rise and • R < 40 kΩ is recommended to make sure that
stabilize before bringing MCLR high. The chip will voltage drop across R does not violate the
actually come out of reset TDRT msec after MCLR device electrical specification.
goes high. • R1 = 100Ω to 1 kΩ will limit any current
In Figure 7-11, the on-chip Power-On Reset feature is flowing into MCLR from external capacitor C
being used (MCLR and VDD are tied together). The in the event of MCLR pin breakdown due to
VDD is stable before the start-up timer times out and Electrostatic Discharge (ESD) or Electrical
there is no problem in getting a proper reset. However, Overstress (EOS).
Figure 7-12 depicts a problem situation where VDD
rises too slowly. The time between when the DRT
senses a high on the MCLR/VPP pin, and when the
MCLR/VPP pin (and VDD) actually reach their full value,
is too long. In this situation, when the start-up timer
times out, VDD has not reached the VDD (min) value
and the chip is, therefore, not guaranteed to function
correctly. For such situations, we recommend that
external RC circuits be used to achieve longer POR
delay times (Figure 7-9).
Note: When the device starts normal operation

(exits the reset condition), device operat-
ing parameters (voltage, frequency, tem-
perature, etc.) must be meet to ensure
operation. If these conditions are not met,
the device must be held in reset until the
operating conditions are met.
For more information on PIC16C5X POR, see
Power-Up Considerations - AN522 in the Embedded
Control Handbook.
The POR circuit does not produce an internal reset
when VDD declines.

PIC16C5X
FIGURE 7-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD)
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
FIGURE 7-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
FIGURE 7-12: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME
V1
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In
this example, the chip will reset properly if, and only if, V1 ≥ VDD min

PIC16C5X
7.5 Device Reset Timer (DRT) 7.6 Watchdog Timer (WDT) (not
implemented on PIC16C52)
The Device Reset Timer (DRT) provides a fixed 18 ms
nominal time-out on reset. The DRT operates on an The Watchdog Timer (WDT) is a free running on-chip
internal RC oscillator. The processor is kept in RESET RC oscillator which does not require any external
as long as the DRT is active. The DRT delay allows components. This RC oscillator is separate from the
VDD to rise above VDD min., and for the oscillator to RC oscillator of the OSC1/CLKIN pin. That means that
stabilize. the WDT will run even if the clock on the OSC1/CLKIN
Oscillator circuits based on crystals or ceramic and OSC2/CLKOUT pins have been stopped, for
resonators require a certain time after power-up to example, by execution of a SLEEP instruction. During
establish a stable oscillation. The on-chip DRT keeps normal operation or SLEEP, a WDT reset or wake-up
the device in a RESET condition for approximately 18 reset generates a device RESET.
ms after the voltage on the MCLR/VPP pin has The TO bit (STATUS<4>) will be cleared upon a
reached a logic high (VIH) level. Thus, external RC Watchdog Timer reset.
networks connected to the MCLR input are not
The WDT can be permanently disabled by
required in most cases, allowing for savings in
programming the configuration bit WDTE as a '0'
cost-sensitive and/or space restricted applications.
(Section 7.1). Refer to the PIC16C5X Programming
The Device Reset time delay will vary from chip to chip Specifications (Literature Number DS30190) to
due to VDD, temperature, and process variation. See determine how to access the configuration word.
AC parameters for details.
7.6.1 WDT PERIOD
The DRT will also be triggered upon a Watchdog Timer
time-out. This is particularly important for applications The WDT has a nominal time-out period of 18 ms,
using the WDT to wake the PIC16C5X from SLEEP (with no prescaler). If a longer time-out period is
mode automatically. desired, a prescaler with a division ratio of up to 1:128
can be assigned to the WDT (under software control)
by writing to the OPTION register. Thus, time-out a
period of a nominal 2.3 seconds can be realized.
These periods vary with temperature, VDD and
part-to-part process variations (see DC specs).
Under worst case conditions (VDD = Min., Temperature
= Max., max. WDT prescaler), it may take several
seconds before a WDT time-out occurs.
7.6.2 WDT PROGRAMMING CONSIDERATIONS
The CLRWDT instruction clears the WDT and the

postscaler, if assigned to the WDT, and prevents it
from timing out and generating a device RESET.
The SLEEP instruction resets the WDT and the
postscaler, if assigned to the WDT. This gives the
maximum SLEEP time before a WDT wake-up reset.

PIC16C5X
FIGURE 7-13: WATCHDOG TIMER BLOCK DIAGRAM
From TMR0 Clock Source
0
M Postscaler
Watchdog 1 Postscaler
U
Timer
X
8 - to - 1 MUX PS2:PS0
WDT Enable PSA

EPROM Bit
To TMR0
0 1
MUX PSA
Note: T0CS, T0SE, PSA, PS2:PS0
are bits in the OPTION register.
WDT
Time-out
TABLE 7-5: SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER
Value on Value on
Power-On MCLR and
N/A OPTION — — T0CS T0SE PSA PS2 PS1 PS0 --11 1111 --11 1111
Legend: Shaded boxes = Not used by Watchdog Timer,
– = unimplemented, read as '0', u = unchanged

PIC16C5X
7.7 Time-Out Sequence and Power Down 7.8 Reset on Brown-Out
Status Bits (TO/PD)
A brown-out is a condition where device power (VDD)
The TO and PD bits in the STATUS register can be dips below its minimum value, but not to zero, and then
tested to determine if a RESET condition has been recovers. The device should be reset in the event of a
caused by a power-up condition, a MCLR or Watchdog brown-out.
Timer (WDT) reset, or a MCLR or WDT wake-up reset. To reset PIC16C5X devices when a brown-out occurs,
external brown-out protection circuits may be built, as
TABLE 7-6: TO/PD STATUS AFTER shown in Figure 7-14 and Figure 7-15.
RESET
FIGURE 7-14: BROWN-OUT PROTECTION
TO PD RESET was caused by CIRCUIT 1
1 1 Power-up (POR)
u u MCLR reset (normal operation)(1) VDD
1 0 MCLR wake-up reset (from SLEEP)
VDD
0 1 WDT reset (normal operation)
33k
0 0 WDT wake-up reset (from SLEEP)
Legend: u = unchanged Q1
10k MCLR
Note 1: The TO and PD bits maintain their status (u) until
a reset occurs. A low-pulse on the MCLR input 40k
does not change the TO and PD status bits. PIC16C5X
These STATUS bits are only affected by events listed

in Table 7-7.
This circuit will activate reset when VDD goes below Vz +
TABLE 7-7: EVENTS AFFECTING TO/PD 0.7V (where Vz = Zener voltage).
STATUS BITS
Event TO PD Remarks
Power-up 1 1
FIGURE 7-15: BROWN-OUT PROTECTION
WDT Time-out 0 u No effect on PD CIRCUIT 2
SLEEP instruction 1 0
VDD
CLRWDT instruction 1 1
Legend: u = unchanged
VDD
A WDT time-out will occur regardless of the status of the TO
R1
bit. A SLEEP instruction will be executed, regardless of the
status of the PD bit. Table 7-6 reflects the status of TO and Q1
PD after the corresponding event. MCLR
Table 7-3 lists the reset conditions for the special R2 40k
PIC16C5X
function registers, while Table 7-4 lists the reset
conditions for all the registers.
This brown-out circuit is less expensive, although

less accurate. Transistor Q1 turns off when VDD
is below a certain level such that:
R1
VDD • = 0.7V
R1 + R2

PIC16C5X
7.9 Power-Down Mode (SLEEP) 7.10 Program Verification/Code Protection
A device may be powered down (SLEEP) and later If the code protection bit(s) have not been
powered up (Wake-up from SLEEP). programmed, the on-chip program memory can be
read out for verification purposes.
7.9.1 SLEEP
Note: Microchip does not recommend code pro-
The Power-Down mode is entered by executing a tecting windowed devices.
SLEEP instruction.
7.11 ID Locations (not implemented on
If enabled, the Watchdog Timer will be cleared but
keeps running, the TO bit (STATUS<4>) is set, the PD PIC16C52)
bit (STATUS<3>) is cleared and the oscillator driver is Four memory locations are designated as ID locations
turned off. The I/O ports maintain the status they had where the user can store checksum or other
before the SLEEP instruction was executed (driving code-identification numbers. These locations are not
high, driving low, or hi-impedance). accessible during normal execution but are readable
It should be noted that a RESET generated by a WDT and writable during program/verify.
time-out does not drive the MCLR/VPP pin low. Use only the lower 4 bits of the ID locations and
For lowest current consumption while powered down, always program the upper 8 bits as '1's.
the T0CKI input should be at VDD or VSS and the
Note: Microchip will assign a unique pattern
MCLR/VPP pin must be at a logic high level
number for QTP and SQTP requests and
(VIH MCLR).
for ROM devices. This pattern number will
7.9.2 WAKE-UP FROM SLEEP be unique and traceable to the submitted
code.
The device can wake up from SLEEP through one of
the following events:
1. An external reset input on MCLR/VPP pin.
2. A Watchdog Timer time-out reset (if WDT was
enabled).
Both of these events cause a device reset. The TO and
PD bits can be used to determine the cause of device
reset. The TO bit is cleared if a WDT time-out
occurred (and caused wake-up). The PD bit, which is
set on power-up, is cleared when SLEEP is invoked.
The WDT is cleared when the device wakes from
sleep, regardless of the wake-up source.

PIC16C5X
8.0 INSTRUCTION SET SUMMARY All instructions are executed within one single
instruction cycle, unless a conditional test is true or the
Each PIC16C5X instruction is a 12-bit word divided into an program counter is changed as a result of an
OPCODE, which specifies the instruction type, and one or instruction. In this case, the execution takes two
more operands which further specify the operation of the instruction cycles. One instruction cycle consists of
instruction. The PIC16C5X instruction set summary in four oscillator periods. Thus, for an oscillator frequency
Table 8-2 groups the instructions into byte-oriented, of 4 MHz, the normal instruction execution time is 1 µs.
bit-oriented, and literal and control operations. Table 8-1 If a conditional test is true or the program counter is
shows the opcode field descriptions. changed as a result of an instruction, the instruction
For byte-oriented instructions, 'f' represents a file register execution time is 2 µs.
designator and 'd' represents a destination designator. The Figure 8-1 shows the three general formats that the
file register designator is used to specify which one of the instructions can have. All examples in the figure use the
32 file registers is to be used by the instruction. following format to represent a hexadecimal number:
The destination designator specifies where the result 0xhhh
of the operation is to be placed. If 'd' is '0', the result is
placed in the W register. If 'd' is '1', the result is placed where 'h' signifies a hexadecimal digit.
in the file register specified in the instruction. FIGURE 8-1: GENERAL FORMAT FOR
For bit-oriented instructions, 'b' represents a bit field INSTRUCTIONS
designator which selects the number of the bit affected Byte-oriented file register operations
by the operation, while 'f' represents the number of the
file in which the bit is located. 11 6 5 4 0
OPCODE d f (FILE #)
For literal and control operations, 'k' represents an
8 or 9-bit constant or literal value. d = 0 for destination W
d = 1 for destination f
TABLE 8-1: OPCODE FIELD f = 5-bit file register address
DESCRIPTIONS Bit-oriented file register operations
11 8 7 5 4 0
Field Description
OPCODE b (BIT #) f (FILE #)
f Register file address (0x00 to 0x7F)
W Working register (accumulator) b = 3-bit bit address
f = 5-bit file register address
b Bit address within an 8-bit file register
k Literal field, constant data or label Literal and control operations (except GOTO)
Don't care location (= 0 or 1) 11 8 7 0
The assembler will generate code with x = 0. It is
x OPCODE k (literal)
the recommended form of use for compatibility
with all Microchip software tools.
k = 8-bit immediate value
Destination select;
d = 0 (store result in W) Literal and control operations - GOTO instruction
d
d = 1 (store result in file register 'f')
Default is d = 1 11 9 8 0
label Label name OPCODE k (literal)
TOS Top of Stack k = 9-bit immediate value
PC Program Counter
WDT Watchdog Timer Counter
TO Time-Out bit
PD Power-Down bit
Destination, either the W register or the specified
dest register file location
[ ] Options
( ) Contents
→ Assigned to
<> Register bit field
∈ In the set of
italics User defined term (font is courier)

PIC16C5X
TABLE 8-2: INSTRUCTION SET SUMMARY
12-Bit Opcode
Mnemonic, Status
Operands Description Cycles MSb LSb Affected Notes
ADDWF f,d Add W and f 1 0001 11df ffff C,DC,Z 1,2,4
ANDWF f,d AND W with f 1 0001 01df ffff Z 2,4
CLRF f Clear f 1 0000 011f ffff Z 4
CLRW – Clear W 1 0000 0100 0000 Z
COMF f, d Complement f 1 0010 01df ffff Z
DECF f, d Decrement f 1 0000 11df ffff Z 2,4
DECFSZ f, d Decrement f, Skip if 0 1(2) 0010 11df ffff None 2,4
INCF f, d Increment f 1 0010 10df ffff Z 2,4
INCFSZ f, d Increment f, Skip if 0 1(2) 0011 11df ffff None 2,4
IORWF f, d Inclusive OR W with f 1 0001 00df ffff Z 2,4
MOVF f, d Move f 1 0010 00df ffff Z 2,4
MOVWF f Move W to f 1 0000 001f ffff None 1,4
NOP – No Operation 1 0000 0000 0000 None
RLF f, d Rotate left f through Carry 1 0011 01df ffff C 2,4
RRF f, d Rotate right f through Carry 1 0011 00df ffff C 2,4
SUBWF f, d Subtract W from f 1 0000 10df ffff C,DC,Z 1,2,4
SWAPF f, d Swap f 1 0011 10df ffff None 2,4
XORWF f, d Exclusive OR W with f 1 0001 10df ffff Z 2,4
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF f, b Bit Clear f 1 0100 bbbf ffff None 2,4
BSF f, b Bit Set f 1 0101 bbbf ffff None 2,4
BTFSC f, b Bit Test f, Skip if Clear 1 (2) 0110 bbbf ffff None
BTFSS f, b Bit Test f, Skip if Set 1 (2) 0111 bbbf ffff None
LITERAL AND CONTROL OPERATIONS
ANDLW k AND literal with W 1 1110 kkkk kkkk Z
CALL k Call subroutine 2 1001 kkkk kkkk None 1
CLRWDT k Clear Watchdog Timer 1 0000 0000 0100 TO, PD
GOTO k Unconditional branch 2 101k kkkk kkkk None
IORLW k Inclusive OR Literal with W 1 1101 kkkk kkkk Z
MOVLW k Move Literal to W 1 1100 kkkk kkkk None
OPTION k Load OPTION register 1 0000 0000 0010 None
RETLW k Return, place Literal in W 2 1000 kkkk kkkk None
SLEEP – Go into standby mode 1 0000 0000 0011 TO, PD
TRIS f Load TRIS register 1 0000 0000 0fff None 3
XORLW k Exclusive OR Literal to W 1 1111 kkkk kkkk Z
Note 1: The 9th bit of the program counter will be forced to a '0' by any instruction that writes to the PC except for GOTO.
(See individual device data sheets, Memory Section/Indirect Data Addressing, INDF and FSR Registers)
2: When an I/O register is modified as a function of itself (e.g. MOVF PORTB, 1), the value used will be that value
present on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven
low by an external device, the data will be written back with a '0'.
3: The instruction TRIS f, where f = 5 or 6 causes the contents of the W register to be written to the tristate
latches of PORTA or B respectively. A '1' forces the pin to a hi-impedance state and disables the output buff-
ers.
4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared
(if assigned to TMR0).

PIC16C5X
ADDWF Add W and f ANDWF AND W with f

Syntax: [ label ] ADDWF f,d Syntax: [ label ] ANDWF f,d
Operands: 0 ≤ f ≤ 31 Operands: 0 ≤ f ≤ 31
d ∈ [0,1] d ∈ [0,1]
Operation: (W) + (f) → (dest) Operation: (W) .AND. (f) → (dest)
Status Affected: C, DC, Z Status Affected: Z
Encoding: 0001 11df ffff Encoding: 0001 01df ffff
Description: Add the contents of the W register and Description: The contents of the W register are
register 'f'. If 'd' is 0 the result is stored AND’ed with register 'f'. If 'd' is 0 the
in the W register. If 'd' is '1' the result is result is stored in the W register. If 'd' is
stored back in register 'f'. '1' the result is stored back in register 'f'.
Words: 1 Words: 1
Cycles: 1 Cycles: 1
Example: ADDWF FSR, 0 Example: ANDWF FSR, 1
Before Instruction Before Instruction
W = 0x17 W = 0x17
FSR = 0xC2 FSR = 0xC2
After Instruction After Instruction
W = 0xD9 W = 0x17
FSR = 0xC2 FSR = 0x02
ANDLW And literal with W BCF Bit Clear f

Syntax: [ label ] ANDLW k Syntax: [ label ] BCF f,b
Operands: 0 ≤ k ≤ 255 Operands: 0 ≤ f ≤ 31
Operation: (W).AND. (k) → (W) 0≤b≤7
Status Affected: Z Operation: 0 → (f<b>)
Encoding: 1110 kkkk kkkk Status Affected: None
Description: The contents of the W register are Encoding: 0100 bbbf ffff
AND’ed with the eight-bit literal 'k'. The Description: Bit 'b' in register 'f' is cleared.
result is placed in the W register.
Words: 1
Words: 1
Cycles: 1
Cycles: 1
Example: BCF FLAG_REG, 7
Example: ANDLW 0x5F
Before Instruction
Before Instruction FLAG_REG = 0xC7
W = 0xA3
After Instruction
After Instruction FLAG_REG = 0x47
W = 0x03

PIC16C5X
BSF Bit Set f BTFSS Bit Test f, Skip if Set

Syntax: [ label ] BSF f,b Syntax: [ label ] BTFSS f,b
0≤b≤7 0≤b<7
Operation: 1 → (f<b>) Operation: skip if (f<b>) = 1
Status Affected: None Status Affected: None
Encoding: 0101 bbbf ffff Encoding: 0111 bbbf ffff
Description: Bit 'b' in register 'f' is set. Description: If bit 'b' in register 'f' is '1' then the next
instruction is skipped.
Words: 1
If bit 'b' is '1', then the next instruction
Cycles: 1 fetched during the current instruction
Example: BSF FLAG_REG, 7 execution, is discarded and an NOP is
executed instead, making this a 2 cycle
Before Instruction instruction.
FLAG_REG = 0x0A
Words: 1
After Instruction
FLAG_REG = 0x8A
Cycles: 1(2)
Example: HERE BTFSS FLAG,1
FALSE GOTO PROCESS_CODE
TRUE •
BTFSC Bit Test f, Skip if Clear
•
Syntax: [ label ] BTFSC f,b •
Operands: 0 ≤ f ≤ 31 Before Instruction
0≤b≤7 PC = address (HERE)
Operation: skip if (f<b>) = 0 After Instruction
If FLAG<1> = 0,
Status Affected: None PC = address (FALSE);
Encoding: 0110 bbbf ffff if FLAG<1> = 1,
PC = address (TRUE)
Description: If bit 'b' in register 'f' is 0 then the next
instruction is skipped.
If bit 'b' is 0 then the next instruction
fetched during the current instruction
execution is discarded, and an NOP is
executed instead, making this a 2 cycle
instruction.
Words: 1
Cycles: 1(2)
Example: HERE BTFSC FLAG,1
FALSE GOTO PROCESS_CODE
TRUE •
•
•
Before Instruction
PC = address (HERE)
After Instruction
if FLAG<1> = 0,
PC = address (TRUE);
if FLAG<1> = 1,
PC = address(FALSE)

PIC16C5X
CALL Subroutine Call CLRW Clear W

Syntax: [ label ] CALL k Syntax: [ label ] CLRW
Operands: 0 ≤ k ≤ 255 Operands: None
Operation: (PC) + 1→ Top of Stack; Operation: 00h → (W);
k → PC<7:0>; 1→Z
(STATUS<6:5>) → PC<10:9>; Status Affected: Z
0 → PC<8>
Encoding: 0000 0100 0000
Status Affected: None
Description: The W register is cleared. Zero bit (Z)
Encoding: 1001 kkkk kkkk is set.
Description: Subroutine call. First, return address Words: 1
(PC+1) is pushed onto the stack. The
eight bit immediate address is loaded Cycles: 1
into PC bits <7:0>. The upper bits Example: CLRW
PC<10:9> are loaded from STA-
TUS<6:5>, PC<8> is cleared. CALL is Before Instruction
a two cycle instruction. W = 0x5A
Words: 1 After Instruction

W = 0x00
Cycles: 2 Z = 1
Example: HERE CALL THERE
Before Instruction
PC = address (HERE) CLRWDT Clear Watchdog Timer
After Instruction Syntax: [ label ] CLRWDT
PC = address (THERE) Operands: None
TOS = address (HERE + 1)
Operation: 00h → WDT;
0 → WDT prescaler (if assigned);
1 → TO;
CLRF Clear f
1 → PD
Syntax: [ label ] CLRF f
Status Affected: TO, PD
Operands: 0 ≤ f ≤ 31
Encoding: 0000 0000 0100
Operation: 00h → (f);
Description: The CLRWDT instruction resets the
1→Z WDT. It also resets the prescaler, if the
Status Affected: Z prescaler is assigned to the WDT and
not Timer0. Status bits TO and PD are
Encoding: 0000 011f ffff
set.
Description: The contents of register 'f' are cleared
Words: 1
and the Z bit is set.
Cycles: 1
Words: 1
Example: CLRWDT
Cycles: 1
Before Instruction
Example: CLRF FLAG_REG
WDT counter = ?
Before Instruction
After Instruction
FLAG_REG = 0x5A
WDT counter = 0x00
After Instruction WDT prescale = 0
FLAG_REG = 0x00 TO = 1
Z = 1 PD = 1

PIC16C5X
COMF Complement f DECFSZ Decrement f, Skip if 0

Syntax: [ label ] COMF f,d Syntax: [ label ] DECFSZ f,d
d ∈ [0,1] d ∈ [0,1]
Operation: (f) → (dest) Operation: (f) – 1 → d; skip if result = 0
Status Affected: Z Status Affected: None
Encoding: 0010 01df ffff Encoding: 0010 11df ffff
Description: The contents of register 'f' are comple- Description: The contents of register 'f' are decre-
mented. If 'd' is 0 the result is stored in mented. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is the W register. If 'd' is 1 the result is
stored back in register 'f'. placed back in register 'f'.
Words: 1 If the result is 0, the next instruction,
which is already fetched, is discarded
Cycles: 1 and an NOP is executed instead mak-
Example: COMF REG1,0 ing it a two cycle instruction.
Before Instruction Words: 1

REG1 = 0x13 Cycles: 1(2)
After Instruction Example: HERE DECFSZ CNT, 1
REG1 = 0x13 GOTO LOOP
W = 0xEC CONTINUE •
•
•
DECF Decrement f Before Instruction
Syntax: [ label ] DECF f,d PC = address (HERE)
Operands: 0 ≤ f ≤ 31 After Instruction

CNT = CNT - 1;
d ∈ [0,1]
if CNT = 0,
Operation: (f) – 1 → (dest) PC = address (CONTINUE);
if CNT ≠ 0,
Status Affected: Z
PC = address (HERE+1)
Encoding: 0000 11df ffff
Description: Decrement register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is GOTO Unconditional Branch
1 the result is stored back in register 'f'.
Syntax: [ label ] GOTO k
Words: 1
Operands: 0 ≤ k ≤ 511
Cycles: 1
Operation: k → PC<8:0>;
Example: DECF CNT, 1 STATUS<6:5> → PC<10:9>
Before Instruction Status Affected: None
CNT = 0x01
Z = 0 Encoding: 101k kkkk kkkk
After Instruction Description: GOTO is an unconditional branch. The

9-bit immediate value is loaded into PC
CNT = 0x00
bits <8:0>. The upper bits of PC are
Z = 1
loaded from STATUS<6:5>. GOTO is a
two cycle instruction.
Words: 1
Cycles: 2
Example: GOTO THERE
After Instruction
PC = address (THERE)

PIC16C5X
INCF Increment f IORLW Inclusive OR literal with W

Syntax: [ label ] INCF f,d Syntax: [ label ] IORLW k
Operands: 0 ≤ f ≤ 31 Operands: 0 ≤ k ≤ 255
d ∈ [0,1] Operation: (W) .OR. (k) → (W)
Operation: (f) + 1 → (dest) Status Affected: Z
Status Affected: Z Encoding: 1101 kkkk kkkk
Description: The contents of the W register are
Description: The contents of register 'f' are incre- OR’ed with the eight bit literal 'k'. The
mented. If 'd' is 0 the result is placed in result is placed in the W register.
the W register. If 'd' is 1 the result is Words: 1
placed back in register 'f'.
Cycles: 1
Words: 1
Example: IORLW 0x35
Cycles: 1
Before Instruction
Example: INCF CNT, 1 W = 0x9A
Before Instruction After Instruction
CNT = 0xFF W = 0xBF
Z = 0 Z = 0
After Instruction
CNT = 0x00
Z = 1 IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
INCFSZ Increment f, Skip if 0 Operands: 0 ≤ f ≤ 31
d ∈ [0,1]
Syntax: [ label ] INCFSZ f,d
Operation: (W).OR. (f) → (dest)
d ∈ [0,1] Status Affected: Z
Operation: (f) + 1 → (dest), skip if result = 0 Encoding: 0001 00df ffff
Status Affected: None Description: Inclusive OR the W register with regis-

ter 'f'. If 'd' is 0 the result is placed in
Encoding: 0011 11df ffff the W register. If 'd' is 1 the result is
Description: The contents of register 'f' are incre- placed back in register 'f'.
mented. If 'd' is 0 the result is placed in Words: 1
the W register. If 'd' is 1 the result is
placed back in register 'f'. Cycles: 1
If the result is 0, then the next instruc- Example: IORWF RESULT, 0
tion, which is already fetched, is dis-
carded and an NOP is executed Before Instruction
instead making it a two cycle instruc- RESULT = 0x13
tion. W = 0x91
Words: 1 After Instruction

RESULT = 0x13
Cycles: 1(2) W = 0x93
Example: HERE INCFSZ CNT, 1 Z = 0
GOTO LOOP
CONTINUE •
•
•
Before Instruction
PC = address (HERE)
After Instruction
CNT = CNT + 1;
if CNT = 0,
PC = address (CONTINUE);
if CNT ≠ 0,
PC = address (HERE +1)

PIC16C5X
MOVF Move f MOVWF Move W to f

Syntax: [ label ] MOVF f,d Syntax: [ label ] MOVWF f
d ∈ [0,1] Operation: (W) → (f)
Operation: (f) → (dest) Status Affected: None
Status Affected: Z Encoding: 0000 001f ffff
Description: Move data from the W register to regis-
Description: The contents of register 'f' is moved to ter 'f'.
destination 'd'. If 'd' is 0, destination is
Words: 1
the W register. If 'd' is 1, the destination
is file register 'f'. 'd' is 1 is useful to test Cycles: 1
a file register since status flag Z is
Example: MOVWF TEMP_REG
affected.
Before Instruction
Words: 1
TEMP_REG = 0xFF
Cycles: 1 W = 0x4F
Example: MOVF FSR, 0 After Instruction
TEMP_REG = 0x4F
After Instruction
W = 0x4F
W = value in FSR register
NOP No Operation
MOVLW Move Literal to W Syntax: [ label ] NOP
Syntax: [ label ] MOVLW k Operands: None
Operands: 0 ≤ k ≤ 255 Operation: No operation
Operation: k → (W) Status Affected: None
Status Affected: None Encoding: 0000 0000 0000
Encoding: 1100 kkkk kkkk Description: No operation.
Description: The eight bit literal 'k' is loaded into the Words: 1
W register. The don’t cares will assem-
ble as 0s.
Cycles: 1
Words: 1 Example: NOP
Cycles: 1
Example: MOVLW 0x5A
After Instruction
W = 0x5A

PIC16C5X
OPTION Load OPTION Register RLF Rotate Left f through Carry

Syntax: [ label ] OPTION Syntax: [ label ] RLF f,d
Operands: None Operands: 0 ≤ f ≤ 31
Operation: (W) → OPTION d ∈ [0,1]
Status Affected: None Operation: See description below
Encoding: 0000 0000 0010 Status Affected: C
Description: The content of the W register is loaded Encoding: 0011 01df ffff
into the OPTION register.
Description: The contents of register 'f' are rotated
Words: 1 one bit to the left through the Carry
Cycles: 1 Flag. If 'd' is 0 the result is placed in the
W register. If 'd' is 1 the result is stored
Example OPTION
back in register 'f'.
Before Instruction
W = 0x07 C register 'f'
After Instruction Words: 1

OPTION = 0x07
Cycles: 1
Example: RLF REG1,0
RETLW Return with Literal in W
Before Instruction
Syntax: [ label ] RETLW k REG1 = 1110 0110
C = 0
Operands: 0 ≤ k ≤ 255
After Instruction
Operation: k → (W);
REG1 = 1110 0110
TOS → PC W = 1100 1100
Status Affected: None C = 1
Encoding: 1000 kkkk kkkk
Description: The W register is loaded with the eight
RRF Rotate Right f through Carry
bit literal 'k'. The program counter is
loaded from the top of the stack (the Syntax: [ label ] RRF f,d
return address). This is a two cycle
instruction.
d ∈ [0,1]
Words: 1
Operation: See description below
Cycles: 2
Status Affected: C
Example: CALL TABLE ;W contains
;table offset Encoding: 0011 00df ffff
;value. Description: The contents of register 'f' are rotated
• ;W now has table one bit to the right through the Carry
• ;value. Flag. If 'd' is 0 the result is placed in the
• W register. If 'd' is 1 the result is placed
TABLE ADDWF PC ;W = offset back in register 'f'.
RETLW k1 ;Begin table
RETLW k2 ; C register 'f'
•
• Words: 1
•
Cycles: 1
RETLW kn ; End of table
Before Instruction Example: RRF REG1,0
W = 0x07 Before Instruction
REG1 = 1110 0110
After Instruction
C = 0
W = value of k8
After Instruction
REG1 = 1110 0110
W = 0111 0011
C = 0

PIC16C5X
SLEEP Enter SLEEP Mode SUBWF Subtract W from f

Syntax: [label] SLEEP Syntax: [label] SUBWF f,d
Operands: None Operands: 0 ≤ f ≤ 31
d ∈ [0,1]
Operation: 00h → WDT;
0 → WDT prescaler; Operation: (f) – (W) → (dest)
1 → TO; Status Affected: C, DC, Z
0 → PD
Status Affected: TO, PD
Description: Subtract (2’s complement method) the
Encoding: 0000 0000 0011 W register from register 'f'. If 'd' is 0 the
Description: Time-out status bit (TO) is set. The result is stored in the W register. If 'd' is
power down status bit (PD) is cleared. 1 the result is stored back in register 'f'.
The WDT and its prescaler are Words: 1
cleared.
Cycles: 1
The processor is put into SLEEP mode
with the oscillator stopped. See sec- Example 1: SUBWF REG1, 1
tion on SLEEP for more details.
Before Instruction
Words: 1 REG1 = 3
W = 2
Cycles: 1
C = ?
Example: SLEEP
After Instruction
REG1 = 1
W = 2
C = 1 ; result is positive
Example 2:
Before Instruction
REG1 = 2
W = 2
C = ?
After Instruction
REG1 = 0
W = 2
C = 1 ; result is zero
Example 3:
Before Instruction
REG1 = 1
W = 2
C = ?
After Instruction
REG1 = FF
W = 2
C = 0 ; result is negative

PIC16C5X
SWAPF Swap Nibbles in f XORLW Exclusive OR literal with W

Syntax: [ label ] SWAPF f,d Syntax: [label] XORLW k
Operands: 0 ≤ f ≤ 31 Operands: 0 ≤ k ≤ 255
d ∈ [0,1]
Operation: (W) .XOR. k → (W)
Operation: (f<3:0>) → (dest<7:4>);
Status Affected: Z
(f<7:4>) → (dest<3:0>)
Encoding: 1111 kkkk kkkk
Description: The contents of the W register are
XOR’ed with the eight bit literal 'k'. The
Description: The upper and lower nibbles of register result is placed in the W register.
'f' are exchanged. If 'd' is 0 the result is
Words: 1
placed in W register. If 'd' is 1 the result
is placed in register 'f'. Cycles: 1
Words: 1 Example: XORLW 0xAF
Cycles: 1 Before Instruction
W = 0xB5
Example SWAPF REG1, 0
After Instruction
Before Instruction
W = 0x1A
REG1 = 0xA5
After Instruction
REG1 = 0xA5
XORWF Exclusive OR W with f
W = 0X5A
Syntax: [ label ] XORWF f,d
TRIS Load TRIS Register d ∈ [0,1]
Syntax: [ label ] TRIS f Operation: (W) .XOR. (f) → (dest)
Operands: f = 5, 6 or 7 Status Affected: Z
Operation: (W) → TRIS register f Encoding: 0001 10df ffff
Description: Exclusive OR the contents of the W
Encoding: 0000 0000 0fff register with register 'f'. If 'd' is 0 the
Description: TRIS register 'f' (f = 5, 6, or 7) is loaded result is stored in the W register. If 'd' is
with the contents of the W register 1 the result is stored back in register 'f'.
Words: 1 Words: 1
Cycles: 1 Cycles: 1
Example TRIS PORTA Example XORWF REG,1
Before Instruction Before Instruction
W = 0XA5 REG = 0xAF
After Instruction W = 0xB5
TRISA = 0XA5 After Instruction
REG = 0x1A
W = 0xB5

PIC16C5X
NOTES:

PIC16C5X
9.0 DEVELOPMENT SUPPORT 9.3 ICEPIC: Low-Cost PIC16CXXX
In-Circuit Emulator
9.1 Development Tools
ICEPIC is a low-cost in-circuit emulator solution for the
The PIC16/17 microcontrollers are supported with a full Microchip PIC16C5X and PIC16CXXX families of 8-bit
range of hardware and software development tools: OTP microcontrollers.
• PICMASTER/PICMASTER CE Real-Time ICEPIC is designed to operate on PC-compatible
In-Circuit Emulator machines ranging from 286-AT through Pentium
• ICEPIC Low-Cost PIC16C5X and PIC16CXXX based machines under Windows 3.x environment.
In-Circuit Emulator ICEPIC features real time, non-intrusive emulation.
• PRO MATE II Universal Programmer
9.4 PRO MATE II: Universal Programmer
• PICSTART Plus Entry-Level Prototype
Programmer The PRO MATE II Universal Programmer is a full-fea-
• PICDEM-1 Low-Cost Demonstration Board tured programmer capable of operating in stand-alone
• PICDEM-2 Low-Cost Demonstration Board mode as well as PC-hosted mode.
• PICDEM-3 Low-Cost Demonstration Board The PRO MATE II has programmable VDD and VPP
• MPASM Assembler supplies which allows it to verify programmed memory
at VDD min and VDD max for maximum reliability. It has
• MPLAB SIM Software Simulator
an LCD display for displaying error messages, keys to
• MPLAB-C (C Compiler) enter commands and a modular detachable socket
• Fuzzy Logic Development System assembly to support various package types. In stand-
(fuzzyTECH−MP) alone mode the PRO MATE II can read, verify or pro-
gram PIC16C5X, PIC16CXXX, PIC17CXX and
9.2 PICMASTER: High Performance PIC14000 devices. It can also set configuration and
Universal In-Circuit Emulator with code-protect bits in this mode.
MPLAB IDE
9.5 PICSTART Plus Entry Level
The PICMASTER Universal In-Circuit Emulator is Development System
intended to provide the product development engineer
with a complete microcontroller design tool set for all The PICSTART programmer is an easy-to-use, low-
microcontrollers in the PIC12C5XX, PIC14C000, cost prototype programmer. It connects to the PC via
PIC16C5X, PIC16CXXX and PIC17CXX families. one of the COM (RS-232) ports. MPLAB Integrated
PICMASTER is supplied with the MPLAB Integrated Development Environment software makes using the
Development Environment (IDE), which allows editing, programmer simple and efficient. PICSTART Plus is
“make” and download, and source debugging from a not recommended for production programming.
single environment.
PICSTART Plus supports all PIC12C5XX, PIC14000,
Interchangeable target probes allow the system to be PIC16C5X, PIC16CXXX and PIC17CXX devices with
easily reconfigured for emulation of different proces- up to 40 pins. Larger pin count devices such as the
sors. The universal architecture of the PICMASTER PIC16C923 and PIC16C924 may be supported with an
allows expansion to support all new Microchip micro- adapter socket.
controllers.
The PICMASTER Emulator System has been
designed as a real-time emulation system with
advanced features that are generally found on more
expensive development tools. The PC compatible 386
(and higher) machine platform and Microsoft Windows
3.x environment were chosen to best make these fea-
tures available to you, the end user.
A CE compliant version of PICMASTER is available for
European Union (EU) countries.

PIC16C5X
9.6 PICDEM-1 Low-Cost PIC16/17 an RS-232 interface, push-button switches, a potenti-
Demonstration Board ometer for simulated analog input, a thermistor and
separate headers for connection to an external LCD
The PICDEM-1 is a simple board which demonstrates module and a keypad. Also provided on the PICDEM-3
the capabilities of several of Microchip’s microcontrol- board is an LCD panel, with 4 commons and 12 seg-
lers. The microcontrollers supported are: PIC16C5X ments, that is capable of displaying time, temperature
(PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, and day of the week. The PICDEM-3 provides an addi-
PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and tional RS-232 interface and Windows 3.1 software for
PIC17C44. All necessary hardware and software is showing the demultiplexed LCD signals on a PC. A sim-
included to run basic demo programs. The users can ple serial interface allows the user to construct a hard-
program the sample microcontrollers provided with ware demultiplexer for the LCD signals.
the PICDEM-1 board, on a PRO MATE II or
PICSTART-Plus programmer, and easily test firm- 9.9 MPLAB Integrated Development
ware. The user can also connect the PICDEM-1 Environment Software
board to the PICMASTER emulator and download
the firmware to the emulator for testing. Additional pro- The MPLAB IDE Software brings an ease of software
totype area is available for the user to build some addi- development previously unseen in the 8-bit microcon-
tional hardware and connect it to the microcontroller troller market. MPLAB is a windows based application
socket(s). Some of the features include an RS-232 which contains:
interface, a potentiometer for simulated analog input, • A full featured editor
push-button switches and eight LEDs connected to • Three operating modes
PORTB. - editor
- emulator
9.7 PICDEM-2 Low-Cost PIC16CXX - simulator
Demonstration Board • A project manager
• Customizable tool bar and key mapping
The PICDEM-2 is a simple demonstration board that
• A status bar with project information
supports the PIC16C62, PIC16C64, PIC16C65,
• Extensive on-line help
PIC16C73 and PIC16C74 microcontrollers. All the
necessary hardware and software is included to MPLAB allows you to:
run the basic demonstration programs. The user • Edit your source files (either assembly or ‘C’)
can program the sample microcontrollers provided • One touch assemble (or compile) and download
with the PICDEM-2 board, on a PRO MATE II pro- to PIC16/17 tools (automatically updates all
grammer or PICSTART-Plus, and easily test firmware. project information)
The PICMASTER emulator may also be used with the • Debug using:
PICDEM-2 board to test firmware. Additional prototype - source files
area has been provided to the user for adding addi- - absolute listing file
tional hardware and connecting it to the microcontroller • Transfer data dynamically via DDE (soon to be
socket(s). Some of the features include a RS-232 inter- replaced by OLE)
face, push-button switches, a potentiometer for simu- • Run up to four emulators on the same PC
lated analog input, a Serial EEPROM to demonstrate
The ability to use MPLAB with Microchip’s simulator
usage of the I2C bus and separate headers for connec-
allows a consistent platform and the ability to easily
tion to an LCD module and a keypad.
switch from the low cost simulator to the full featured
9.8 PICDEM-3 Low-Cost PIC16CXXX emulator with minimal retraining due to development
Demonstration Board tools.
The PICDEM-3 is a simple demonstration board that 9.10 Assembler (MPASM)

supports the PIC16C923 and PIC16C924 in the PLCC
The MPASM Universal Macro Assembler is a PC-
package. It will also support future 44-pin PLCC
hosted symbolic assembler. It supports all microcon-
microcontrollers with a LCD Module. All the neces-
troller series including the PIC12C5XX, PIC14000,
sary hardware and software is included to run the
PIC16C5X, PIC16CXXX, and PIC17CXX families.
basic demonstration programs. The user can pro-
gram the sample microcontrollers provided with MPASM offers full featured Macro capabilities, condi-
the PICDEM-3 board, on a PRO MATE II program- tional assembly, and several source and listing formats.
mer or PICSTART Plus with an adapter socket, and It generates various object code formats to support
easily test firmware. The PICMASTER emulator may Microchip's development tools as well as third party
also be used with the PICDEM-3 board to test firm- programmers.
ware. Additional prototype area has been provided to MPASM allows full symbolic debugging from
the user for adding hardware and connecting it to the PICMASTER, Microchip’s Universal Emulator
microcontroller socket(s). Some of the features include System.

PIC16C5X
MPASM has the following features to assist in develop- 9.14 MP-DriveWay – Application Code
ing software for specific use applications. Generator
• Provides translation of Assembler source code to
MP-DriveWay is an easy-to-use Windows-based Appli-
object code for all Microchip microcontrollers.
cation Code Generator. With MP-DriveWay you can
• Macro assembly capability. visually configure all the peripherals in a PIC16/17
• Produces all the files (Object, Listing, Symbol, device and, with a click of the mouse, generate all the
and special) required for symbolic debug with initialization and many functional code modules in C
Microchip’s emulator systems. language. The output is fully compatible with Micro-
• Supports Hex (default), Decimal and Octal source chip’s MPLAB-C C compiler. The code produced is
and listing formats. highly modular and allows easy integration of your own
MPASM provides a rich directive language to support code. MP-DriveWay is intelligent enough to maintain
programming of the PIC16/17. Directives are helpful in your code through subsequent code generation.
making the development of your assemble source code
9.15 SEEVAL Evaluation and
shorter and more maintainable.
Programming System
9.11 Software Simulator (MPLAB-SIM)
The SEEVAL SEEPROM Designer’s Kit supports all
The MPLAB-SIM Software Simulator allows code Microchip 2-wire and 3-wire Serial EEPROMs. The kit
development in a PC host environment. It allows the includes everything necessary to read, write, erase or
user to simulate the PIC16/17 series microcontrollers program special features of any Microchip SEEPROM
on an instruction level. On any given instruction, the product including Smart Serials and secure serials.
user may examine or modify any of the data areas or The Total Endurance Disk is included to aid in trade-
provide external stimulus to any of the pins. The input/ off analysis and reliability calculations. The total kit can
output radix can be set by the user and the execution significantly reduce time-to-market and result in an
can be performed in; single step, execute until break, or optimized system.
in a trace mode.
9.16 KEELOQ Evaluation and
MPLAB-SIM fully supports symbolic debugging using Programming Tools
MPLAB-C and MPASM. The Software Simulator offers
the low cost flexibility to develop and debug code out- KEELOQ evaluation and programming tools support
side of the laboratory environment making it an excel- Microchips HCS Secure Data Products. The HCS eval-
lent multi-project software development tool. uation kit includes an LCD display to show changing
codes, a decoder to decode transmissions, and a pro-
9.12 C Compiler (MPLAB-C) gramming interface to program test transmitters.
The MPLAB-C Code Development System is a
complete ‘C’ compiler and integrated development
environment for Microchip’s PIC16/17 family of micro-
controllers. The compiler provides powerful integration
capabilities and ease of use not found with other
compilers.
For easier source level debugging, the compiler pro-
vides symbol information that is compatible with the
MPLAB IDE memory display.
9.13 Fuzzy Logic Development System

(fuzzyTECH-MP)
fuzzyTECH-MP fuzzy logic development tool is avail-
able in two versions - a low cost introductory version,
MP Explorer, for designers to gain a comprehensive
working knowledge of fuzzy logic system design; and a
full-featured version, fuzzyTECH-MP, edition for imple-
menting more complex systems.
Both versions include Microchip’s fuzzyLAB demon-
stration board for hands-on experience with fuzzy logic
systems implementation.

24CXX HCS200
PIC12C5XX PIC14000 PIC16C5X PIC16CXXX PIC16C6X PIC16C7XX PIC16C8X PIC16C9XX PIC17C4X PIC17C75X 25CXX HCS300
93CXX HCS301
PICMASTER/
TABLE 9-1:
PICMASTER-CE Available
In-Circuit Emulator ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ 3Q97
DS30453A-page 58
ICEPIC Low-Cost
In-Circuit Emulator
✔ ✔ ✔ ✔ ✔ ✔
PIC16C5X
Emulator Products
MPLAB
Integrated
Development
Environment ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
MPLAB C
Compiler ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
fuzzyTECH-MP
Explorer/Edition
Fuzzy Logic
Dev. Tool ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
Software Tools
MP-DriveWay
Applications
Code Generator ✔ ✔ ✔ ✔ ✔ ✔
Total Endurance
Software Model ✔
Preliminary
PICSTART
DEVELOPMENT TOOLS FROM MICROCHIP
Lite Ultra Low-Cost

Dev. Kit ✔ ✔ ✔ ✔

PICSTART
Plus Low-Cost
Universal Dev. Kit ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔

PRO MATE II
Universal
Programmers
Programmer ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔
KEELOQ
Programmer ✔

SEEVAL
Designers Kit ✔
PICDEM-1 ✔ ✔ ✔ ✔
PICDEM-2 ✔ ✔
PICDEM-3 ✔
Demo Boards

KEELOQ
✔
 1997 Microchip Technology Inc.

Evaluation Kit
PIC16C52 PIC16C5X
10.0 ELECTRICAL CHARACTERISTICS - PIC16C52
Absolute Maximum Ratings†
Ambient Temperature under bias ........................................................................................................... –55°C to +125°C
Storage Temperature.............................................................................................................................. –65°C to +150°C
Voltage on VDD with respect to VSS ..............................................................................................................0 V to +7.5 V
Voltage on MCLR with respect to VSS............................................................................................................0 V to +14 V
Voltage on all other pins with respect to VSS ................................................................................–0.6 V to (VDD + 0.6 V)
Total Power Dissipation(1).....................................................................................................................................800 mW
Max. Current out of VSS pin...................................................................................................................................150 mA
Max. Current into VDD pin........................................................................................................................................50 mA
Max. Current into an input pin (T0CKI only).....................................................................................................................±500 µA
Input Clamp Current, IIK (VI < 0 or VI > VDD) ....................................................................................................................±20 mA
Output Clamp Current, IOK (VO < 0 or VO > VDD) ............................................................................................................±20 mA
Max. Output Current sunk by any I/O pin ................................................................................................................10 mA
Max. Output Current sourced by any I/O pin...........................................................................................................10 mA
Max. Output Current sourced by a single I/O port (PORTA or B)............................................................................10 mA
Max. Output Current sunk by a single I/O port (PORTA or B) .................................................................................10 mA
Note 1: Power Dissipation is calculated as follows: Pdis = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} + ∑(VOL x IOL)
†NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.

PIC16C5X PIC16C52
10.1 DC Characteristics: PIC16C52-04 (Commercial)

PIC16C52-04I (Industrial)
Standard Operating Conditions (unless otherwise specified)

DC Characteristics
Operating Temperature 0°C ≤ TA ≤ +70°C (commercial)
Power Supply Pins
–40°C ≤ TA ≤ +85°C (industrial)
Characteristic Sym Min Typ(1) Max Units Conditions
Supply Voltage VDD 3.0 6.25 V FOSC = DC to 4 MHz
RAM Data Retention Voltage(2) VDR 1.5* V Device in SLEEP Mode
Supply Current(3,4) IDD 1.8 3.3 mA FOSC = 4 MHz, VDD = 5.5 V
Power Down Current(5) IPD

Commercial 0.6 9 µA VDD = 3.0 V
Industrial 0.6 12 µA VDD = 3.0 V
* These parameters are characterized but not tested.

Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance
only and is not tested.
2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to
Vss, T0CKI = VDD, MCLR = VDD.
b) For standby current measurements, the conditions are the same, except that
the device is in SLEEP mode.
4: For RC option, does not include current through Rext. The current through the resistor can be estimated by
the formula: IR = VDD/2Rext (mA) with Rext in kΩ.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

PIC16C52 PIC16C5X
10.2 DC Characteristics: PIC16C52-04 (Commercial)
PIC16C52-04I (Industrial)

DC Characteristics
All Pins Except
Power Supply Pins
Operating Voltage VDD range is described in Section 10.1.
Input Low Voltage VIL

I/O ports VSS 0.2 VDD V Pin at hi-impedance
MCLR (Schmitt Trigger) VSS 0.15 VDD V
T0CKI (Schmitt Trigger) VSS 0.15 VDD V
OSC1 (Schmitt Trigger) VSS 0.15 VDD V RC(4) option only
VSS 0.3 VDD V XT option
Input High Voltage VIH

I/O ports 0.45 VDD VDD V For all VDD(5)
2.0 VDD V 4.0 V < VDD ≤ 5.5 V(5)
0.36 VDD VDD V VDD > 5.5 V
MCLR (Schmitt Trigger) 0.85 VDD VDD V
T0CKI (Schmitt Trigger) 0.85 VDD VDD V
OSC1 (Schmitt Trigger) 0.85 VDD VDD V RC(4) option only
0.7 VDD VDD V XT option
Hysteresis of Schmitt VHYS 0.15VDD* V

Trigger inputs
Input Leakage Current(2,3) IIL For VDD ≤ 5.5 V

I/O ports –1 0.5 +1 µA VSS ≤ VPIN ≤ VDD,
Pin at hi-impedance
MCLR –5 µA VPIN = VSS + 0.25 V
0.5 +5 µA VPIN = VDD
T0CKI –3 0.5 +3 µA VSS ≤ VPIN ≤ VDD
OSC1 –3 0.5 +3 µA VSS ≤ VPIN ≤ VDD,
XT option
Output Low Voltage VOL

I/O ports 0.6 V IOL = 2.0 mA, VDD = 4.5 V
OSC2/CLKOUT 0.6 V IOL = 1.6 mA, VDD = 4.5 V,
RC option
Output High Voltage VOH

I/O ports(3) VDD – 0.7 V IOH = –2.0 mA, VDD = 4.5 V
OSC2/CLKOUT VDD – 0.7 V IOH = –1.0 mA, VDD = 4.5 V,
RC option
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltage.
3: Negative current is defined as coming out of the pin.
4: For RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C52 be
driven with external clock in RC mode.
5: The user may use the better of the two specifications.

PIC16C5X PIC16C52
10.3 Timing Parameter Symbology and Load Conditions

The timing parameter symbols have been created following one of the following formats:
1. TppS2ppS
2. TppS
T
F Frequency T Time
Lowercase subscripts (pp) and their meanings:
pp
2 to mc MCLR
ck CLKOUT osc oscillator
cy cycle time os OSC1
drt device reset timer t0 T0CKI
io I/O port
Uppercase letters and their meanings:
S
F Fall P Period
H High R Rise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
FIGURE 10-1: LOAD CONDITIONS - PIC16C52
Pin CL = 50 pF for all pins except OSC2

CL 15 pF for OSC2 in XT mode when
external clock is used to
drive OSC1
VSS

PIC16C52 PIC16C5X
10.4 Timing Diagrams and Specifications
FIGURE 10-2: EXTERNAL CLOCK TIMING - PIC16C52
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
1 3 3
4 4
2
CLKOUT
TABLE 10-1: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C52
AC Characteristics Standard Operating Conditions (unless otherwise specified)

Parameter
No. Sym Characteristic Min Typ(1) Max Units Conditions
FOSC External CLKIN Frequency(2) DC — 4 MHz XT osc mode

Oscillator Frequency(2) DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
1 TOSC External CLKIN Period(2) 250 — — ns RC osc mode
250 — — ns XT osc mode
Oscillator Period(2) 250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
2 TCY Instruction Cycle Time(3) — 4/FOSC — —
3 TosL, TosH Clock in (OSC1) Low or High Time 85* — — ns XT oscillator

4 TosR, TosF Clock in (OSC1) Rise or Fall Time — — 25* ns XT oscillator
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
2: All specified values are based on characterization data for that particular oscillator type under standard operating condi-
tions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption.
When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
3: Instruction cycle period (TCY) equals four times the input oscillator time base period.

PIC16C5X PIC16C52
FIGURE 10-3: CLKOUT AND I/O TIMING - PIC16C52
Q4 Q1 Q2 Q3
OSC1
10 11
CLKOUT
13 18 12
14 19 16
I/O Pin
(input)
17 15
I/O Pin Old Value New Value

(output)
20, 21
Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
TABLE 10-2: CLKOUT AND I/O TIMING REQUIREMENTS - PIC16C52

Parameter
No. Sym Characteristic Min Typ(1) Max Units
10 TosH2ckL OSC1↑ to CLKOUT↓(2) — 15 30** ns

11 TosH2ckH OSC1↑ to CLKOUT↑(2) — 15 30** ns
12 TckR CLKOUT rise time(2) — 5 15** ns
13 TckF CLKOUT fall time(2) — 5 15** ns
14 TckL2ioV CLKOUT↓ to Port out valid(2) — — 40** ns
15 TioV2ckH Port in valid before CLKOUT↑(2) 0.25 TCY+30* — — ns
16 TckH2ioI Port in hold after CLKOUT↑(2) 0* — — ns
17 TosH2ioV OSC1↑ (Q1 cycle) to Port out valid(3) — — 100* ns
18 TosH2ioI OSC1↑ (Q2 cycle) to Port input invalid TBD — — ns
(I/O in hold time)
19 TioV2osH Port input valid to OSC1↑ TBD — — ns
(I/O in setup time)
20 TioR Port output rise time(3) — 10 25** ns
21 TioF Port output fall time(3) — 10 25** ns
** These parameters are design targets and are not tested. No characterization data available at this time.
and are not tested.
2: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
3: See Figure 10-1 for loading conditions.

PIC16C52 PIC16C5X
FIGURE 10-4: RESET AND DEVICE RESET TIMER TIMING - PIC16C52
VDD
MCLR
30
Internal
POR
32 32
32
DRT
Time-out
Internal
RESET
34 34
I/O pin
(Note 1)
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software.
TABLE 10-3: RESET AND DEVICE RESET TIMER - PIC16C52

Parameter
30 TmcL MCLR Pulse Width (low) 100* — — ns VDD = 5 V

32 TDRT Device Reset Timer Period 9* 18* 30* ms VDD = 5 V (Commercial)
34 TioZ I/O Hi-impedance from MCLR Low — — 100* ns
Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.

PIC16C5X PIC16C52
FIGURE 10-5: TIMER0 CLOCK TIMINGS - PIC16C52
T0CKI
40 41
42
TABLE 10-4: TIMER0 CLOCK REQUIREMENTS - PIC16C52

Parameter
Sym Characteristic Min Typ(1) Max Units Conditions
No.
40 Tt0H T0CKI High Pulse Width - No Prescaler 0.5 TCY + 20* — — ns
- With Prescaler 10* — — ns
41 Tt0L T0CKI Low Pulse Width - No Prescaler 0.5 TCY + 20* — — ns
42 Tt0P T0CKI Period 20 or TCY + 40* — — ns Whichever is greater.
N N = Prescale Value
(1, 2, 4,..., 256)
and are not tested.

PIC16C54/55/56/57 PIC16C5X
11.0 ELECTRICAL CHARACTERISTICS - PIC16C54/55/56/57
Voltage on VDD with respect to VSS ............................................................................................................... 0V to +7.5V
Voltage on MCLR with respect to VSS(2) ......................................................................................................... 0V to +14V
Voltage on all other pins with respect to VSS ................................................................................. –0.6V to (VDD + 0.6V)
Max. Current into VDD pin......................................................................................................................................100 mA
Max. Output Current sourced by a single I/O port (PORTA, B or C) .......................................................................40 mA
Max. Output Current sunk by a single I/O port (PORTA, B or C) ............................................................................50 mA
Note 1: Power Dissipation is calculated as follows: Pdis = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} + ∑(VOL x IOL)
Note 2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus,
a series resistor of 50 to 100 Ω should be used when applying a “low” level to the MCLR pin rather than pull-
ing this pin directly to VSS
†NOTICE: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.

PIC16C5X PIC16C54/55/56/57
TABLE 11-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS

(RC, XT & 10) AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
OSC PIC16C5X-RC PIC16C5X-XT PIC16C5X-10

VDD: 3.0 V to 6.25 V
IDD: 3.3 mA max. at 5. V
RC N/A N/A
IPD: 9 µA max. at 3.0 V, WDT dis
Freq: 4 MHz max.
VDD: 3.0V to 6.25V VDD: 3.0V to 6.25V

IDD: 1.8 mA typ. at 5.5V IDD: 3.3 mA max. at 5.5V
XT N/A
IPD: 0.6 µA typ. at 3.0V WDT dis IPD: 9 µA max. at 3.0V, WDT dis
Freq: 4 MHz max. Freq: 4 MHz max.
VDD: 4.5V to 5.5V

IDD: 10 mA max. at 5.5V
HS N/A N/A
IPD: 9 µA max. at 3.0V, WDT dis
Freq: 10 MHz max.
VDD: 2.5V to 6.25V VDD: 2.5V to 6.25V VDD: 2.5V to 6.25V

IDD: 15 µA typ. at 3.0V IDD: 15 µA typ. at 3.0V IDD: 15 µA typ. at 3.0V
LP
IPD: 0.6 µA typ. at 3.0V, WDT dis IPD: 0.6 µA typ. at 3.0V, WDT dis IPD: 0.6 µA typ. at 3.0V, WDT dis
Freq: 40 kHz max. Freq: 40 kHz max. Freq: 40 kHz max.
The shaded sections indicate oscillator selections which should work by design, but are not tested. It is recommended
that the user select the device type from information in unshaded sections.
(HS, LP & JW) AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
OSC PIC16C5X-HS PIC16C5X-LP PIC16C5X/JW

VDD: 3.0V to 6.25V
IDD: 3.3 mA max. at 5.5V
RC N/A N/A
Freq: 4 MHz max.
VDD: 3.0V to 6.25V

IDD: 3.3 mA max. at 5.5V
XT N/A N/A
Freq: 4 MHz max.
VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V

IDD: 20 mA max. at 5.5V IDD: 20 mA max. at 5.5V
HS N/A
IPD: 9 µA max. at 3.0V, WDT dis IPD: 9 µA max. at 3.0V, WDT dis

IDD: 15 µA typ. at 3.0V IDD: 32 µA max. at 32 kHz, 3.0V IDD: 32 µA max. at 32 kHz, 3.0V
LP
IPD: 0.6 µA typ. at 3.0V, WDT dis IPD: 9 µA max. at 3.0V, WDT dis IPD: 9 µA max. at 3.0V, WDT dis
Freq: 40 kHz max. Freq: 40 kHz max. Freq: 40 kHz max.

PIC16C54/55/56/57 PIC16C5X
11.1 DC Characteristics: PIC16C5X-RC, XT, 10, HS, LP (Commercial)
DC Characteristics Standard Operating Conditions (unless otherwise specified)

Power Supply Pins Operating Temperature 0°C ≤ TA ≤ +70°C
Supply Voltage VDD

PIC16C5X-RC 3.0 6.25 V FOSC = DC to 4 MHz
PIC16C5X-XT 3.0 6.25 V FOSC = DC to 4 MHz
PIC16C5X-10 4.5 5.5 V FOSC = DC to 10 MHz
PIC16C5X-HS 4.5 5.5 V FOSC = DC to 20 MHz
PIC16C5X-LP 2.5 6.25 V FOSC = DC to 40 kHz
RAM Data Retention Voltage(2) VDR 1.5* V Device in SLEEP Mode
VDD Start Voltage to ensure VPOR VSS V See Section 7.4 for details on
Power-On Reset Power-On Reset
VDD Rise Rate to ensure SVDD 0.05* V/ms See Section 7.4 for details on
Supply Current(3) IDD

PIC16C5X-RC(4) 1.8 3.3 mA FOSC = 4 MHz, VDD = 5.5V
PIC16C5X-XT 1.8 3.3 mA FOSC = 4 MHz, VDD = 5.5V
PIC16C5X-10 4.8 10 mA FOSC = 10 MHz, VDD = 5.5V
PIC16C5X-HS 4.8 10 mA FOSC = 10 MHz, VDD = 5.5V
9.0 20 mA FOSC = 20 MHz, VDD = 5.5V
PIC16C5X-LP 15 32 µA FOSC = 32 kHz, VDD = 3.0V,
WDT disabled

4.0 12 µA VDD = 3.0V, WDT enabled
0.6 9 µA VDD = 3.0V, WDT disabled
Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified.
4: Does not include current through Rext. The current through the resistor can be estimated by the
formula: IR = VDD/2Rext (mA) with Rext in kΩ.

PIC16C5X PIC16C54/55/56/57
11.2 DC Characteristics: PIC16C5X-RCI, XTI, 10I, HSI, LPI (Industrial)

Power Supply Pins Operating Temperature –40°C ≤ TA ≤ +85°C
Supply Voltage VDD

PIC16C5X-RCI 3.0 6.25 V FOSC = DC to 4 MHz
PIC16C5X-XTI 3.0 6.25 V FOSC = DC to 4 MHz
PIC16C5X-10I 4.5 5.5 V FOSC = DC to 10 MHz
PIC16C5X-HSI 4.5 5.5 V FOSC = DC to 20 MHz
PIC16C5X-LPI 2.5 6.25 V FOSC = DC to 40 kHz
RAM Data Retention Voltage(2) VDR 1.5* V Device in SLEEP mode

PIC16C5X-RCI(4) 1.8 3.3 mA FOSC = 4 MHz, VDD = 5.5V
PIC16C5X-XTI 1.8 3.3 mA FOSC = 4 MHz, VDD = 5.5V
PIC16C5X-10I 4.8 10 mA FOSC = 10 MHz, VDD = 5.5V
PIC16C5X-HSI 4.8 10 mA FOSC = 10 MHz, VDD = 5.5V
9.0 20 mA FOSC = 20 MHz, VDD = 5.5V
PIC16C5X-LPI 15 40 µA FOSC = 32 kHz, VDD = 3.0V,
WDT disabled


PIC16C54/55/56/57 PIC16C5X
11.3 DC Characteristics: PIC16C5X-RCE, XTE, 10E, HSE, LPE (Extended)

Power Supply Pins Operating Temperature –40°C ≤ TA ≤ +125°C
Characteristic Sym Min Typ (1) Max Units Conditions
Supply Voltage VDD

PIC16C5X-RCE 3.25 6.0 V FOSC = DC to 4 MHz
PIC16C5X-XTE 3.25 6.0 V FOSC = DC to 4 MHz
PIC16C5X-10E 4.5 5.5 V FOSC = DC to 10 MHz
PIC16C5X-HSE 4.5 5.5 V FOSC = DC to 16 MHz
PIC16C5X-LPE 2.5 6.0 V FOSC = DC to 40 kHz
VDD rise rate to ensure SVDD 0.05* V/ms See Section 7.4 for details on

PIC16C5X-RCE(4) 1.8 3.3 mA FOSC = 4 MHz, VDD = 5.5V
PIC16C5X-XTE 1.8 3.3 mA FOSC = 4 MHz, VDD = 5.5V
PIC16C5X-10E 4.8 10 mA FOSC = 10 MHz, VDD = 5.5V
PIC16C5X-HSE 4.8 10 mA FOSC = 10 MHz, VDD = 5.5V
9.0 20 mA FOSC = 16 MHz, VDD = 5.5V
PIC16C5X-LPE 19 55 µA FOSC = 32 kHz, VDD = 3.25V,
WDT disabled


PIC16C5X PIC16C54/55/56/57
11.4 DC Characteristics: PIC16C5X-RC, XT, 10, HS, LP (Commercial)

PIC16C5X-RCI, XTI, 10I, HSI, LPI (Industrial)

DC Characteristics Operating Temperature 0°C ≤ TA ≤ +70°C (commercial)
All Pins Except –40°C ≤ TA ≤ +85°C (industrial)
Power Supply Pins Operating Voltage VDD range is described in Section 11.1, Section 11.2 and
Section 11.3.

OSC1 (Schmitt Trigger) VSS 0.15 VDD V PIC16C5X-RC only(4)
VSS 0.3 VDD V PIC16C5X-XT, 10, HS, LP

2.0 VDD V 4.0V < VDD ≤ 5.5V(5)
0.36 VDD VDD V VDD > 5.5V
OSC1 (Schmitt Trigger) 0.85 VDD VDD V PIC16C5X-RC only(4)
0.7 VDD VDD V PIC16C5X-XT, 10, HS, LP

Trigger inputs
Input Leakage Current(2,3) IIL For VDD ≤ 5.5V

Pin at hi-impedance
MCLR –5 µA VPIN = VSS + 0.25V
PIC16C5X-XT, 10, HS, LP

I/O ports 0.6 V IOL = 8.7 mA, VDD = 4.5V
OSC2/CLKOUT 0.6 V IOL = 1.6 mA, VDD = 4.5V,
PIC16C5X-RC

I/O ports(3) VDD – 0.7 V IOH = –5.4 mA, VDD = 4.5V
OSC2/CLKOUT VDD – 0.7 V IOH = –1.0 mA, VDD = 4.5V,
PIC16C5X-RC
voltage.
4: For PIC16C5X-RC devices, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C5X be driven with external clock in RC mode.

PIC16C54/55/56/57 PIC16C5X
11.5 DC Characteristics: PIC16C5X-RC, XT, 10, HS, LP (Extended)

DC Characteristics
Operating Temperature –40°C ≤ TA ≤ +125°C
All Pins Except
Operating Voltage VDD range is described in Section 11.1, Section 11.2 and
Power Supply Pins
Section 11.3.

I/O ports Vss 0.15 VDD V Pin at hi-impedance
MCLR (Schmitt Trigger) Vss 0.15 VDD V
T0CKI (Schmitt Trigger) Vss 0.15 VDD V
OSC1 (Schmitt Trigger) Vss 0.15 VDD V PIC16C5X-RC only(4)
Vss 0.3 VDD V PIC16C5X-XT, 10, HS, LP

2.0 VDD V 4.0V < VDD ≤ 5.5V(5)
0.36 VDD VDD V VDD > 5.5 V
OSC1 (Schmitt Trigger) 0.85 VDD VDD V PIC16C5X-RC only(4)
0.7 VDD VDD V PIC16C5X-XT, 10, HS, LP

Trigger inputs
Input Leakage Current (2,3) IIL For VDD ≤ 5.5 V

Pin at hi-impedance
MCLR –5 µA VPIN = VSS + 0.25V
PIC16C5X-XT, 10, HS, LP

PIC16C5X-RC

I/O ports(3) VDD – 0.7 V IOH = –5.4 mA, VDD = 4.5V
OSC2/CLKOUT VDD – 0.7 V IOH = –1.0 mA, VDD = 4.5V,
PIC16C5X-RC
voltage.
4: For PIC16C5X-RC devices, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C5X be driven with external clock in RC mode.

PIC16C5X PIC16C54/55/56/57

1. TppS2ppS
2. TppS
T
F Frequency T Time
pp
2 to mc MCLR
io I/O port wdt watchdog timer
S
F Fall P Period
H High R Rise
FIGURE 11-1: LOAD CONDITIONS - PIC16C54/55/56/57

CL 15 pF for OSC2 in XT, HS or LP
modes when external clock
is used to drive OSC1
VSS

PIC16C54/55/56/57 PIC16C5X
FIGURE 11-2: EXTERNAL CLOCK TIMING - PIC16C54/55/56/57
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
1 3 3
4 4
2
CLKOUT
TABLE 11-3: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C54/55/56/57

–40°C ≤ TA ≤ +125°C (extended)
Operating Voltage VDD range is described in Section 11.1, Section 11.2 and Section 11.3
Parameter
FOSC External CLKIN Frequency(2) DC — 4 MHz XT osc mode

DC — 10 MHz 10 MHz mode
DC — 20 MHz HS osc mode (Com/Indust)
DC — 16 MHz HS osc mode (Extended)
DC — 40 kHz LP osc mode
Oscillator Frequency(2) DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
4 — 10 MHz 10 MHz mode
4 — 20 MHz HS osc mode (Com/Indust)
4 — 16 MHz HS osc mode (Extended)
Note 1: Data in the Typical (“Typ”) column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
2: All specified values are based on characterization data for that particular oscillator type under standard operating
conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation
and/or higher than expected current consumption.

PIC16C5X PIC16C54/55/56/57
TABLE 11-3: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C54/55/56/57 (CON’T)

Parameter
1 TOSC External CLKIN Period(2) 250 — — ns XT osc mode

100 — — ns 10 MHz mode
50 — — ns HS osc mode (Com/Indust)
62.5 — — ns HS osc mode (Extended)
25 — — µs LP osc mode
100 — 250 ns 10 MHz mode
50 — 250 ns HS osc mode (Com/Indust)
62.5 — 250 ns HS osc mode (Extended)
25 — — µs LP osc mode
20* — — ns HS oscillator
2* — — µs LP oscillator
— — 25* ns HS oscillator
— — 50* ns LP oscillator
and are not tested.

PIC16C54/55/56/57 PIC16C5X
FIGURE 11-3: CLKOUT AND I/O TIMING - PIC16C54/55/56/57
Q4 Q1 Q2 Q3
OSC1
10 11
CLKOUT
13 18 12
14 19 16
I/O Pin
(input)
17 15

(output)
20, 21
TABLE 11-4: CLKOUT AND I/O TIMING REQUIREMENTS - PIC16C54/55/56/57

Section 11.3
Parameter

(I/O in hold time)
(I/O in setup time)
Note 1: Data in the Typical (“Typ”) column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.

PIC16C5X PIC16C54/55/56/57
FIGURE 11-4: RESET, WATCHDOG TIMER, AND

DEVICE RESET TIMER TIMING - PIC16C54/55/56/57
VDD
MCLR
30
Internal
POR
32 32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34 34
I/O pin
(Note 1)
TABLE 11-5: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16C54/55/56/57

Parameter
30 TmcL MCLR Pulse Width (low) 100* — — ns VDD = 5.0V

31 Twdt Watchdog Timer Time-out Period 9* 18* 30* ms VDD = 5.0V (Commercial)
(No Prescaler)
32 TDRT Device Reset Timer Period 9* 18* 30* ms VDD = 5.0V (Commercial)
34 TioZ I/O Hi-impedance from MCLR Low — — 100* ns
Note 1: Data in the Typical (“Typ”) column is at 5.0V, 25°C unless otherwise stated. These parameters are for design

PIC16C54/55/56/57 PIC16C5X
FIGURE 11-5: TIMER0 CLOCK TIMINGS - PIC16C54/55/56/57
T0CKI
40 41
42
TABLE 11-6: TIMER0 CLOCK REQUIREMENTS - PIC16C54/55/56/57

Section 11.3
Parameter
No.
(1, 2, 4,..., 256)
and are not tested.

PIC16C5X PIC16C54/55/56/57
NOTES:

PIC16C54/55/56/57 PIC16C5X
12.0 DC AND AC CHARACTERISTICS - PIC16C54/55/56/57
The graphs and tables provided in this section are for design guidance and are not tested or guaranteed. In some
graphs or tables the data presented are outside specified operating range (e.g., outside specified VDD range). This is
for information only and devices will operate properly only within the specified range.
The data presented in this section is a statistical summary of data collected on units from different lots over a period of
time. “Typical” represents the mean of the distribution while “max” or “min” represents (mean + 3σ) and (mean – 3σ)
respectively, where σ is standard deviation.
FIGURE 12-1: TYPICAL RC OSCILLATOR FREQUENCY vs. TEMPERATURE
FOSC Frequency normalized to +25°C
FOSC (25°C)
1.10
Rext ≥ 10 kΩ
1.08
Cext = 100 pF
1.06
1.04
1.02
1.00
0.98
VDD = 5.5 V
0.96
0.94
VDD = 3.5 V
0.92
0.90
0.88
0 10 20 25 30 40 50 60 70
T(°C)
TABLE 12-1: RC OSCILLATOR FREQUENCIES
Average
Cext Rext
Fosc @ 5 V, 25°C
20 pF 3.3 k 4.973 MHz ± 27%
5k 3.82 MHz ± 21%
10 k 2.22 MHz ± 21%
100 k 262.15 kHz ± 31%
100 pF 3.3 k 1.63 MHz ± 13%
5k 1.19 MHz ± 13%
10 k 684.64 kHz ± 18%
100 k 71.56 kHz ± 25%
300 pF 3.3 k 660 kHz ± 10%
5.0 k 484.1 kHz ± 14%
10 k 267.63 kHz ± 15%
160 k 29.44 kHz ± 19%
The frequencies are measured on DIP packages.
The percentage variation indicated here is part-to-part variation due to normal process distribution. The variation
indicated is ±3 standard deviation from average value for VDD = 5 V.

PIC16C5X PIC16C54/55/56/57
FIGURE 12-2: TYPICAL RC OSCILLATOR FIGURE 12-3: TYPICAL RC OSCILLATOR

FREQUENCY vs. VDD, FREQUENCY vs. VDD,
CEXT = 20 PF CEXT = 100 PF
5.5 1.8
R = 3.3k R = 3.3k
5.0 1.6
4.5 1.4
4.0 R = 5k 1.2 R = 5k
FOSC (MHz)
3.5 1.0
FOSC (MHz)
3.0 0.8
R = 10k R = 10k
2.5 0.6
Measured on DIP Packages, T = 25°C
2.0 0.4
1.5 0.2
R = 100k
1.0 0.0
3.0 3.5 4.0 4.5 5.0 5.5 6.0
R = 100k VDD (Volts)
0.5
FIGURE 12-4: TYPICAL RC OSCILLATOR
FREQUENCY vs. VDD,
0.0
3.0 3.5 4.0 4.5 5.0 5.5 6.0 CEXT = 300 PF
VDD (Volts) 800
700 R = 3.3k
600
500 R = 5k
FOSC (kHz)
400
300 R = 10k
200
100
R = 100k
0
3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)

PIC16C54/55/56/57 PIC16C5X
FIGURE 12-5: TYPICAL IPD vs. VDD, FIGURE 12-7: TYPICAL IPD vs. VDD,
WATCHDOG DISABLED WATCHDOG ENABLED
2.5 20
18
2.0 16
14
T = 25°C T = 25°C
1.5 12
10
IPD (µA)
IPD (µA)
1.0 8
0.5 4
0.0 0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts) VDD (Volts)
FIGURE 12-6: MAXIMUM IPD vs. VDD, FIGURE 12-8: MAXIMUM IPD vs. VDD,
WATCHDOG DISABLED WATCHDOG ENABLED
100 60
50
+125˚C
+85˚C
10 40
+70˚C –55°C
0˚C
+85°C
IPD (mA)
30
–40˚C
+125°C
IPD (µA)
–40°C
–55˚C +70°C
1 20
0°C
10
0
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
IPD, with WDT enabled, has two components:
The leakage current which increases with higher temperature
and the operating current of the WDT logic which increases
with lower temperature. At –40°C, the latter dominates
explaining the apparently anomalous behavior.

PIC16C5X PIC16C54/55/56/57
FIGURE 12-9: VTH (INPUT THRESHOLD VOLTAGE) OF I/O PINS vs. VDD
2.00
1.80 °C)
to +85
–40°C
1.60 Max (
VTH (Volts)
1.40 2 5°C)
Typ (+
1.20
°C)
1.00 to +85
40°C
Min (–
0.80
0.60
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
FIGURE 12-10: VIH, VIL OF MCLR, T0CKI AND OSC1 (IN RC MODE) vs. VDD
4.5
4.0
+8 5°C)
°C to
3.5 (–40
max
VIH °C
+25
typ C)
+85°
3.0
VIH
VIH, VIL (Volts)
t o
40° C
2.5 m in (–
VIH
2.0
1.5 °C to +85°C)
VIL max (–40
1.0 VIH typ +25°C
0.5 5°C)
VIL min (–40°C to +8
0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Note: These input pins have Schmitt Trigger input buffers.
VDD (Volts)
FIGURE 12-11: VTH (INPUT THRESHOLD VOLTAGE) OF OSC1 INPUT

(IN XT, HS, AND LP MODES) vs. VDD
3.4
3.2
3.0
2.8 C)
o+ 85°
2.6 °C t
(–40
2.4 Max °C )
( +25
VTH (Volts)
2.2 Typ
C)
2.0 o+ 85°
°C t
(–40
1.8 Min
1.6
1.4
1.2
1.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)

PIC16C54/55/56/57 PIC16C5X
FIGURE 12-12: TYPICAL IDD vs. FREQUENCY (EXTERNAL CLOCK, 25°C)
10
1.0
IDD (mA)
0.1 7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
0.01
10k 100k 1M 10M 100M
External Clock Frequency (Hz)
FIGURE 12-13: MAXIMUM IDD vs. FREQUENCY (EXTERNAL CLOCK, –40°C TO +85°C)
10
1.0
IDD (mA)
7.0
6.5
0.1 6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
0.01
10k 100k 1M 10M 100M

PIC16C5X PIC16C54/55/56/57
FIGURE 12-14: MAXIMUM IDD vs. FREQUENCY (EXTERNAL CLOCK –55°C TO +125°C)
10
1.0
IDD (mA)
7.0
6.5
6.0
5.5
5.0
0.1 4.5
4.0
3.5
3.0
2.5
0.01
10k 100k 1M 10M 100M
FIGURE 12-15: WDT TIMER TIME-OUT FIGURE 12-16: TRANSCONDUCTANCE (gm)

PERIOD vs. VDD OF HS OSCILLATOR vs. VDD
50 9000
45 8000
Max –40°C
40 7000
35 6000
WDT period (ms)
30 5000
gm (µA/V)
Max +85°C Typ +25°C
25 4000
Max +70°C
20 3000
Typ +25°C
Min +85°C
15 2000
MIn 0°C
10 100
MIn –40°C
5 0
2 3 4 5 6 7 2 3 4 5 6 7

PIC16C54/55/56/57 PIC16C5X
FIGURE 12-17: TRANSCONDUCTANCE (gm) FIGURE 12-19: TRANSCONDUCTANCE (gm)
OF LP OSCILLATOR vs. VDD OF XT OSCILLATOR vs. VDD
45
2500
40
Max –40°C
Max –40°C
35 2000
30
1500
25
gm (µA/V)
gm (µA/V)
Typ +25°C
Typ +25°C
20
1000
15
Min +85°C
10 500
Min +85°C
5
0
2 3 4 5 6 7
0
2 3 4 5 6 7 VDD (Volts)
VDD (Volts)
FIGURE 12-18: IOH vs. VOH, VDD = 3 V FIGURE 12-20: IOH vs. VOH, VDD = 5 V
0 0
Min +85°C
–5
Min +85°C –10
–10
IOH (mA)
IOH (mA)
–20
Typ +25°C
Typ +25°C
–15
Max –40°C
–30
Max –40°C
–20
–40
–25 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0 0.5 1.0 1.5 2.0 2.5 3.0
VOH (Volts)
VOH (Volts)

PIC16C5X PIC16C54/55/56/57
FIGURE 12-21: IOL vs. VOL, VDD = 3 V FIGURE 12-22: IOL vs. VOL, VDD = 5 V
45 90
40 Max –40°C 80 Max –40°C
35 70
30 60
Typ +25°C
25 50
IOL (mA)
IOL (mA)
Typ +25°C
20 40
Min +85°C
15 30
Min +85°C
10 20
5 10
0 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0
VOL (Volts) VOL (Volts)
TABLE 12-2: INPUT CAPACITANCE FOR TABLE 12-3: INPUT CAPACITANCE FOR
PIC16C54/56 PIC16C55/57
Typical Capacitance (pF) Typical Capacitance (pF)

Pin
18L PDIP 18L SOIC Pin 28L PDIP 28L SOIC
(600 mil)
RA port 5.0 4.3
RA port 5.2 4.8
RB port 5.0 4.3
RB port 5.6 4.7
MCLR 17.0 17.0
RC port 5.0 4.1
OSC1 4.0 3.5
MCLR 17.0 17.0
OSC2/CLKOUT 4.3 3.5
OSC1 6.6 3.5
T0CKI 3.2 2.8
OSC2/CLKOUT 4.6 3.5
All capacitance values are typical at 25°C. A part-to-part
variation of ±25% (three standard deviations) should be T0CKI 4.5 3.5
taken into account.
variation of ±25% (three standard deviations) should be
taken into account.

PIC16CR54A PIC16C5X
13.0 ELECTRICAL CHARACTERISTICS - PIC16CR54A
Voltage on VDD with respect to VSS ..................................................................................................................0 to +7.5V
Voltage on MCLR with respect to VSS(2) ............................................................................................................0 to +14V
Max. Current into VDD pin........................................................................................................................................50 mA
Output Clamp Current, IOK (V0 < 0 or V0 > VDD) .............................................................................................................±20 mA
Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
Note 2: Voltage spikes below Vss at the MCLR pin, inducing currents greater than 80 mA may cause latch-up. Thus,
a series resistor of 50 to 100Ω should be used when applying a low level to the MCLR pin rather than pulling
this pin directly to Vss.
†NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

PIC16C5X PIC16CR54A

AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
OSC PIC16CR54A-04 PIC16CR54A-10 PIC16CR54A-20 PIC16LCR54A-04

RC VDD: 2.5 V to 6.25 V
IDD: 3.6 mA max at 6.0 V
IPD: 6.0 µA max at 2.5 V, N/A N/A N/A
WDT dis
Freq: 4 MHz max
XT VDD: 2.5 V to 6.25 V
IDD: 3.6 mA max at 6.0 V
IPD: 6.0 µA max at 2.5 V, N/A N/A N/A
WDT dis
Freq: 4.0 MHz max
HS VDD: 4.5 V to 5.5 V VDD: 4.5 V to 5.5 V
IDD: 10 mA max at 5.5 V IDD: 10 mA max at 5.5 V
N/A IPD: 6.0 µA max at 2.5 V, IPD: 6.0 µA max at 2.5 V, N/A
WDT dis WDT dis
Freq: 10 MHz max Freq: 20 MHz max
LP VDD: 2.0 V to 6.25 V
IDD: 20 µA max at 32 kHz,
2.0 V
N/A N/A N/A
IPD: 6.0 µA max at 2.5 V,
WDT dis
Freq: 200 kHz max

PIC16CR54A PIC16C5X
13.1 DC Characteristics: PIC16CR54A-04, 10, 20 (Commercial)
PIC16CR54A-04I, 10I, 20I (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD
RC and XT options 2.5 6.25 V
HS option 4.5 5.5 V
Power-on Reset Power-on Reset
RC(4) and XT options 2.0 3.6 mA FOSC = 4.0 MHz, VDD = 6.0V
0.8 1.8 mA FOSC = 4.0 MHz, VDD = 3.0V
90 350 µA FOSC = 200 kHz, VDD = 2.5V
HS option 4.8 10 mA FOSC = 10 MHz, VDD = 5.5V
9.0 20 mA FOSC = 20 MHz, VDD = 5.5V
Power-Down Current(5) IPD
Commercial
1.0 6.0 µA VDD = 2.5V, WDT disabled
2.0 8.0* µA VDD = 4.0V, WDT disabled
Industrial
2.0 10* µA VDD = 4.0V, WDT disabled
3.0 20* µA VDD = 4.0V, WDT enabled

PIC16C5X PIC16CR54A
13.2 DC Characteristics: PIC16CR54A-04E, 10E, 20E (Extended)

Power Supply Pins Operating Temperature –40°C ≤ TA ≤ +125°C (extended)

Supply Voltage VDD
HS options 4.5 5.5 V
9.0 20 mA FOSC = 16 MHz, VDD = 5.5V

PIC16CR54A PIC16C5X
13.3 DC Characteristics: PIC16LCR54A-04 (Commercial)
PIC16LCR54A-04I (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD 2.0 6.25 V
10 20 µA FOSC = 32 kHz, VDD = 2.0V
70 µA FOSC = 32 kHz, VDD = 6.0V
Commercial
2.0 8.0* µA VDD = 4.0V, WDT disabled
Industrial
2.0 10* µA VDD = 4.0V, WDT disabled
3.0 20* µA VDD = 4.0V, WDT enabled

PIC16C5X PIC16CR54A
13.4 DC Characteristics: PIC16CR54A-04, 10, 20, PIC16LCR54A-04 (Commercial)

PIC16CR54A-04I, 10I, 20I, PIC16LCR54A-04I (Industrial)

DC Characteristics
All Pins Except
Power Supply Pins
Operating Voltage VDD range is described in Section 13.1 and Section 13.3.

OSC1 (Schmitt Trigger) VSS 0.15 VDD V RC option only(4)
OSC1 VSS 0.15 VDD V XT, HS and LP options
I/O ports 2.0 VDD V VDD = 3.0V to 5.5V(5)
0.6 VDD VDD V Full VDD range(5)
OSC1 (Schmitt Trigger) 0.85 VDD VDD V RC option only(4)
OSC1 0.85 VDD VDD V XT, HS and LP options
Trigger inputs
Input Leakage Current(3) IIL For VDD ≤ 5.5V
I/O ports –1.0 +1.0 µA VSS ≤ VPIN ≤ VDD,
Pin at hi-impedance
MCLR –5.0 µA VPIN = VSS + 0.25V(2)
0.5 +5.0 µA VPIN = VDD(2)
T0CKI –3.0 0.5 +3.0 µA VSS ≤ VPIN ≤ VDD
OSC1 –3.0 0.5 +3.0 µA VSS ≤ VPIN ≤ VDD,
XT, HS and LP options
I/O ports 0.5 V IOL = 10 mA, VDD = 6.0V
RC option only
Output High Voltage(3) VOH
I/O ports VDD –0.5 V IOH = –4.0 mA, VDD = 6.0V
OSC2/CLKOUT VDD –0.5 V IOH = –0.8 mA, VDD = 6.0V,
RC option only
voltage.
4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X
be driven with external clock in RC mode.

PIC16CR54A PIC16C5X

All Pins Except Operating Temperature –40°C ≤ TA ≤ +125°C
Power Supply Pins Operating Voltage VDD range is described in Section 13.2.

I/O ports Vss 0.15 VDD V Pin at hi-impedance
MCLR (Schmitt Trigger) Vss 0.15 VDD V
T0CKI (Schmitt Trigger) Vss 0.15 VDD V
OSC1 (Schmitt Trigger) Vss 0.15 VDD V RC option only(4)
OSC1 Vss 0.3 VDD V XT, HS and LP options
2.0 VDD V 4.0V < VDD ≤ 5.5V(5)
Trigger inputs
I/O ports –1.0 0.5 +1.0 µA VSS ≤ VPIN ≤ VDD,
Pin at hi-impedance
0.5 +5.0 µA VPIN = VDD(2)
RC option only
Output High Voltage (3) VOH
RC option only
voltage.

PIC16C5X PIC16CR54A

1. TppS2ppS
2. TppS
T
F Frequency T Time
pp
2 to mc MCLR
S
F Fall P Period
H High R Rise
FIGURE 13-1: LOAD CONDITIONS

options when external clock
VSS

PIC16CR54A PIC16C5X
FIGURE 13-2: EXTERNAL CLOCK TIMING - PIC16CR54A
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
1 3 3
4 4
2
CLKOUT
TABLE 13-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR54A

Operating Voltage VDD range is described in Section 13.1, Section 13.2 and Section 13.3.
Parameter
FOSC External CLKIN Frequency(2) DC — 4.0 MHz XT osc mode

DC — 4.0 MHz HS osc mode (04)
DC — 10 MHz HS osc mode (10)
Oscillator Frequency(2) DC — 4.0 MHz RC osc mode
0.1 — 4.0 MHz XT osc mode
4.0 — 4.0 MHz HS osc mode (04)
4.0 — 10 MHz HS osc mode (10)
5.0 — 200 kHz LP osc mode
and are not tested.

PIC16C5X PIC16CR54A
TABLE 13-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR54A (CON’T)

Parameter

250 — — ns HS osc mode (04)
5.0 — — µs LP osc mode
250 — 250 ns HS osc mode (04)
100 — 250 ns HS osc mode (10)
50 — 250 ns HS osc mode (20)
5.0 — 200 µs LP osc mode
2.0* — — µs LP oscillator
and are not tested.

PIC16CR54A PIC16C5X
FIGURE 13-3: CLKOUT AND I/O TIMING - PIC16CR54A
Q4 Q1 Q2 Q3
OSC1
10 11
CLKOUT
13 12
19 18
14 16
I/O Pin
(input)
17 15

(output)
20, 21
TABLE 13-3: CLKOUT AND I/O TIMING REQUIREMENTS - PIC16CR54A

Section 13.3.
Parameter

12 TckR CLKOUT rise time(2) — 5.0 15** ns
13 TckF CLKOUT fall time(2) — 5.0 15** ns
(I/O in hold time)
(I/O in setup time)

PIC16C5X PIC16CR54A
FIGURE 13-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC16CR54A
VDD
MCLR
30
Internal
POR
32 32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34 34
I/O pin
(Note 1)
TABLE 13-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16CR54A

Parameter
30 TmcL MCLR Pulse Width (low) 1.0* — — µs VDD = 5.0V

31 Twdt Watchdog Timer Time-out Period 7.0* 18* 40* ms VDD = 5.0V (Commercial)
(No Prescaler)
32 TDRT Device Reset Timer Period 7.0* 18* 30* ms VDD = 5.0V (Commercial)
34 TioZ I/O Hi-impedance from MCLR Low — — 1.0* µs

PIC16CR54A PIC16C5X
FIGURE 13-5: TIMER0 CLOCK TIMINGS - PIC16CR54A
T0CKI
40 41
42
TABLE 13-5: TIMER0 CLOCK REQUIREMENTS - PIC16CR54A

Section 13.3.
Parameter
No.
(1, 2, 4,..., 256)
and are not tested.

PIC16C5X PIC16CR54A
NOTES:

PIC16C54A PIC16C5X
14.0 ELECTRICAL CHARACTERISTICS - PIC16C54A
Ambient temperature under bias............................................................................................................ –55°C to +125°C
Storage temperature ............................................................................................................................. –65°C to +150°C
Voltage on MCLR with respect to VSS................................................................................................................0 to +14V
Total power dissipation(1) .....................................................................................................................................800 mW
Max. current out of VSS pin....................................................................................................................................150 mA
Max. current into VDD pin ......................................................................................................................................100 mA
Max. current into an input pin (T0CKI only)......................................................................................................................±500 µA
Input clamp current, IIK (VI < 0 or VI > VDD) ....................................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ..............................................................................................................±20 mA
Max. output current sunk by any I/O pin..................................................................................................................25 mA
Max. output current sourced by any I/O pin ............................................................................................................20 mA
Max. output current sourced by a single I/O port (PORTA or B) .............................................................................50 mA
Max. output current sunk by a single I/O port (PORTA or B)...................................................................................50 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
† NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.

PIC16C5X PIC16C54A

OSC PIC16C54A-04 PIC16C54A-10 PIC16C54A-20 PIC16LC54A-04

VDD: 3.0V to 6.25V VDD: 3.0V to 6.25V VDD: 3.0V to 6.25V VDD: 3.0V to 6.25V
IDD: 2.4 mA max. at IDD: 1.7 mA typ. at IDD: 1.7 mA typ. at IDD: 0.5 mA typ. at
5.5V 5.5V 5.5V 5.5V
RC
IPD: 4.0 µA max. at IPD: 0.25 µA typ. at IPD: 0.25 µA typ. at IPD: 0.25 µA typ. at
3.0V WDT dis 3.0V WDT dis 3.0V WDT dis 3.0V WDT dis
Freq: 4 MHz max. Freq: 4.0 MHz max. Freq: 4.0 MHz max. Freq: 4.0 MHz max.
IDD 2.4 mA max. at IDD: 1.7 mA typ. at IDD: 1.7 mA typ. at IDD: 0.5 mA typ. at
5.5V 5.5V 5.5V 5.5V
XT
Freq: 4 MHz max. Freq: 4.0 MHz max. Freq: 4.0 MHz max. Freq: 4.0 MHz max.
IDD: 8.0 mA max. at IDD: 16 mA max. at
5.5V 5.5V Do not use in
HS N/A
IPD: 4.0 µA max. at IPD: 4.0 µA max. at HS mode
3.0V WDT dis 3.0V WDT dis
VDD: 3.0V to 6.25V VDD: 2.5V to 6.25V
IDD: 14 µA typ. at IDD: 27 µA max. at
32kHz, 3.0V 32kHz, 2.5V
Do not use in Do not use in
LP IPD: 0.25 µA typ. at WDT dis
LP mode LP mode
3.0V WDT dis IPD: 4.0 µA max. at
Freq: 200 kHz max. 2.5V WDT dis
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which should work by design, but are not
tested. It is recommended that the user select the device type from information in unshaded
sections.
OSC PIC16C54A/JW PIC16LV54A-02

VDD: 3.0V to 6.25V VDD: 2.0V to 3.8V
IDD: 2.4 mA max. at IDD: 0.5 mA typ. at
5.5V 3.0V
RC
IPD: 4.0 µA max. at IPD: 0.25 µA typ. at
Freq: 4.0 MHz max. Freq: 2.0 MHz max.
VDD: 3.0V to 6.25V VDD: 2.0V to 3.8V
IDD 2.4 mA max. at IDD: 0.5 mA typ. at
5.5V 3.0V
XT
VDD: 4.5V to 5.5V
IDD: 8 mA max. at
5.5V Do not use in
HS
IPD: 4.0 µA max. at HS mode
3.0V WDT dis
Freq: 10 MHz max.
VDD: 2.5V to 6.25V VDD: 2.0V to 3.8V
IDD: 27 µA max. at IDD: 27 µA max. at
32kHz, 2.5V 32kHz, 2.5V
LP WDT dis WDT dis
IPD: 4.0 µA max. at IPD: 4.0 µA max. at
Freq: 200 kHz max. Freq: 200 kHz max.
The shaded sections indicate oscillator selections
which should work by design, but are not tested. It
is recommended that the user select the device
type from information in unshaded sections.

PIC16C54A PIC16C5X
14.1 DC Characteristics: PIC16C54A-04, 10, 20 (Commercial)
PIC16C54A-04I, 10I, 20I (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD
XT, RC and LP options 3.0 6.25 V
HS option 4.5 5.5 V
VDD start voltage to ensure VPOR VSS V See Section 7.4 for details on
Power-On Reset Power-on Reset
XT and RC(4) options 1.8 2.4 mA FOSC = 4.0 MHz, VDD = 5.5V
HS option 2.4 8.0 mA FOSC = 10 MHz, VDD = 5.5V
4.5 16 mA FOSC = 20 MHz, VDD = 5.5V
LP option, Commercial 14 29 µA FOSC = 32 kHz, VDD = 3.0V, WDT disabled
LP option, Industrial 17 37 µA FOSC = 32 kHz, VDD = 3.0V, WDT disabled
Commercial 4.0 12 µA VDD = 3.0V, WDT enabled
Industrial 5.0 14 µA VDD = 3.0V, WDT enabled

PIC16C5X PIC16C54A
14.2 DC Characteristics: PIC16C54A-04E, 10E, 20E (Extended)


Supply Voltage VDD
XT and RC options 3.5 5.5 V
HS option 4.5 5.5 V
9.0 20 mA FOSC = 20 MHz, VDD = 5.5V
XT and RC options 5.0 22 µA VDD = 3.5V, WDT enabled
HS option 4.0 22 µA VDD = 3.5V, WDT enabled

PIC16C54A PIC16C5X
14.3 DC Characteristics: PIC16LC54A-04 (Commercial)
PIC16LC54A-04I (Industrial)
PIC16LC54A-04E (Extended)

Power Supply Pins –40°C ≤ TA ≤ +85°C (industrial)

Supply Voltage VDD
LP options 2.5 6.25 V
XT and RC(4) options 0.5 25 mA FOSC = 4.0 MHz, VDD = 5.5V
LP option, Commercial 11 27 µA FOSC = 32 kHz, VDD = 2.5V WDT disabled
LP option, Industrial 11 35 µA FOSC = 32 kHz, VDD = 2.5V WDT disabled
LP option, Extended 11 37 µA FOSC = 32 kHz, VDD = 2.5V WDT disabled
Extended 2.5 15 µA VDD = 2.5V, WDT enabled
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guid-
ance only and is not tested.

PIC16C5X PIC16C54A
14.4 DC Characteristics: PIC16LV54A-02 (Commercial)

PIC16LV54A-02 (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD
(2)
RAM Data Retention Voltage VDR 1.5* V Device in SLEEP mode
XT and RC(4) options 0.5 mA FOSC = 2.0 MHz, VDD = 3.0V
Power Down Current(5)(6) IPD
6: The oscillator start-up time can be as much as 8 seconds for XT and LP oscillator selection, if the SLEEP
mode is entered or during initial power-up.

PIC16C54A PIC16C5X
14.5 DC Characteristics: PIC16C54A-04, 10, 20, PIC16LC54A-04, PIC16LV54A-02 (Commercial)
PIC16C54A-04I, 10I, 20I, PIC16LC54A-04I, PIC16LV54A-02I (Industrial)
PIC16C54A-04E, 10E, 20E (Extended)

DC Characteristics –40°C ≤ TA ≤ +85°C (industrial)
All Pins Except –20°C ≤ TA ≤ +85°C (industrial - PIC16LV54A-02I)
Power Supply Pins –40°C ≤ TA ≤ +125°C (extended)
Section 14.3.
I/O ports 0.2 VDD+1V VDD V For all VDD(5)
2.0 VDD V 4.0V < VDD ≤ 5.5V(5)
Trigger inputs
I/O ports -1.0 0.5 +1.0 µA VSS ≤ VPIN ≤ VDD,
Pin at hi-impedance
MCLR -5.0 +5.0 µA VPIN = VSS +0.25V(2)
0.5 +3.0 µA VPIN = VDD(2)
T0CKI -3.0 0.5 +3.0 µA VSS ≤ VPIN ≤ VDD
OSC1 -3.0 0.5 µA VSS ≤ VPIN ≤ VDD,
RC option only
I/O ports(3) VDD-0.7 V IOH = -5.4 mA, VDD = 4.5V
OSC2/CLKOUT VDD-0.7 V IOH = -1.0 mA, VDD = 4.5V,
RC option only
voltage.

PIC16C5X PIC16C54A

1. TppS2ppS
2. TppS
T
F Frequency T Time
pp
2 to mc MCLR
S
F Fall P Period
H High R Rise
FIGURE 14-1: LOAD CONDITIONS - PIC16C54A

VSS

PIC16C54A PIC16C5X
FIGURE 14-2: EXTERNAL CLOCK TIMING - PIC16C54A
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
1 3 3
4 4
2
CLKOUT
TABLE 14-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C54A

–20°C ≤ TA ≤ +85°C (industrial - PIC16LV54A-02I)
Parameter

DC — 2.0 MHz XT osc mode (PIC16LV54A)
DC — 2.0 MHz RC osc mode (PIC16LV54A)
0.1 — 2.0 MHz XT osc mode (PIC16LV54A)
4 — 4.0 MHz HS osc mode (04)
4 — 10 MHz HS osc mode (10)
5 — 200 kHz LP osc mode
and are not tested.

PIC16C5X PIC16C54A
TABLE 14-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C54A (CON’T)

Parameter

500 — — ns XT osc mode (PIC16LV54A)
500 — — ns RC osc mode (PIC16LV54A)
250 — 250 ns HS osc mode (04)
100 — 250 ns HS osc mode (10)
50 — 250 ns HS osc mode (20)
and are not tested.

PIC16C54A PIC16C5X
FIGURE 14-3: CLKOUT AND I/O TIMING - PIC16C54A
Q4 Q1 Q2 Q3
OSC1
10 11
CLKOUT
13 18 12
14 19 16
I/O Pin
(input)
17 15

(output)
20, 21
TABLE 14-3: CLKOUT AND I/O TIMING REQUIREMENTS - PIC16C54A

Section 14.3.
Parameter

(I/O in hold time)
(I/O in setup time)
and are not tested.

PIC16C5X PIC16C54A

DEVICE RESET TIMER TIMING - PIC16C54A
VDD
MCLR
30
Internal
POR
32 32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34 34
I/O pin
(Note 1)
TABLE 14-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16C54A

Parameter

1µs — — VDD = 5.0V (PIC16LV54A only)
31 Twdt Watchdog Timer Time-out 9.0* 18* 30* ms VDD = 5.0V (Commercial)
Period (No Prescaler)
34 TioZ I/O Hi-impedance from MCLR — — 100* ns
Low — — 1µs (PIC16LV54A only)

PIC16C54A PIC16C5X
FIGURE 14-5: TIMER0 CLOCK TIMINGS - PIC16C54A
T0CKI
40 41
42
TABLE 14-5: TIMER0 CLOCK REQUIREMENTS - PIC16C54A

Section 14.3.
Parameter
No.
(1, 2, 4,..., 256)
and are not tested.

PIC16C5X PIC16C54A
NOTES:

PIC16CR57B PIC16C5X
15.0 ELECTRICAL CHARACTERISTICS - PIC16CR57B
Input Clamp Current, IIK (VI < 0 or VI > VDD) ...................................................................................................................±20 mA
Max. Output Current sourced by a single I/O port (PORTA, B or C) .......................................................................50 mA
Max. Output Current sunk by a single I/O port (PORTA, B or C) ............................................................................50 mA
†NOTICE: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device.

PIC16C5X PIC16CR57B

OSC PIC16CR57B-04 PIC16CR57B-10 PIC16CR57B-20 PIC16LCR57B-04

RC VDD: 3.0V to 6.25V
IDD: 2.5 mA max at 5.5V
IPD: 4.0 µA max at 3.0V, N/A N/A N/A
WDT dis
Freq: 4.0 MHz max
XT VDD: 3.0V to 6.25V
WDT dis
Freq: 4.0 MHz max
HS VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
IDD: 10 mA max at 5.5V IDD: 20 mA max at 5.5V
N/A IPD: 4.0 µA max at 3.0V, IPD: 4.0 µA max at 3.0V, N/A
WDT dis WDT dis
LP VDD: 2.5V to 6.25V
2.5V
N/A N/A N/A
IPD: 4.0 µA max at 2.5V,
WDT dis
Freq: 200 kHz max

PIC16CR57B PIC16C5X
15.1 DC Characteristics: PIC16CR57B-04, 10, 20 (Commercial)
PIC16CR57B-04I, 10I, 20I (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD
HS option 4.5 5.5 V
RC(4) and XT options 1.9 2.5 mA FOSC = 4 MHz, VDD = 5.5V
4.7 17 mA FOSC = 20 MHz, VDD = 5.5V

PIC16C5X PIC16CR57B
15.2 DC Characteristics: PIC16CR57B-04E, 10E, 20E (Extended)


Supply Voltage VDD
RC(4) and XT options 1.9 3.3 mA FOSC = 4 MHz, VDD = 5.5V
9.0 20 mA FOSC = 20 MHz, VDD = 5.5V
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.

PIC16CR57B PIC16C5X
15.3 DC Characteristics: PIC16LCR57B-04 (Commercial)
PIC16LCR57B-04I (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD 2.5 6.25 V LP option
Commercial 12 28 µA FOSC = 32 kHz, VDD = 2.5V,
WDT disabled
Industrial 15 37 µA FOSC = 32 kHz, VDD = 2.5V,
WDT disabled

PIC16C5X PIC16CR57B
15.4 DC Characteristics: PIC16CR57B-04, 10, 20, PIC16LCR57B-04 (Commercial)

PIC16CR57B-04I, 10I, 20I, PIC16LCR57B-04I (Industrial)

DC Characteristics
All Pins Except
Power Supply Pins

2.0 VDD V 4.0V < VDD ≤ 5.5V(5)
Trigger inputs
Pin at hi-impedance
0.5 +5.0 µA VPIN = VDD(2)
RC option only
RC option only
voltage.

PIC16CR57B PIC16C5X
15.5 DC Characteristics: PIC16CR57B-04E, 10E, 20E (Extended)

All Pins Except Operating Temperature –40°C ≤ TA ≤ +125°C

2.0 VDD V 4.0V < VDD ≤ 5.5V(5)
Trigger inputs
Pin at hi-impedance
MCLR –5.0 µA VPIN = VSS + 0.25 V(2)
0.5 +5.0 µA VPIN = VDD(2)
RC option only
RC option only
voltage.

PIC16C5X PIC16CR57B

1. TppS2ppS
2. TppS
T
F Frequency T Time
pp
2 to mc MCLR
S
F Fall P Period
H High R Rise
FIGURE 15-1: LOAD CONDITIONS

VSS

PIC16CR57B PIC16C5X
FIGURE 15-2: EXTERNAL CLOCK TIMING - PIC16CR57B
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
1 3 3
4 4
2
CLKOUT
TABLE 15-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR57B

Parameter

and are not tested.

PIC16C5X PIC16CR57B
TABLE 15-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR57B (CON’T)

Parameter

250 — 250 ns HS osc mode (04)
100 — 250 ns HS osc mode (10)
50 — 250 ns HS osc mode (20)
and are not tested.

PIC16CR57B PIC16C5X
FIGURE 15-3: CLKOUT AND I/O TIMING - PIC16CR57B
Q4 Q1 Q2 Q3
OSC1
10 11
CLKOUT
13 12
19 18
14 16
I/O Pin
(input)
17 15

(output)
20, 21
TABLE 15-3: CLKOUT AND I/O TIMING REQUIREMENTS - PIC16CR57B

Section 15.3.
Parameter

(I/O in hold time)
(I/O in setup time)
and are not tested.

PIC16C5X PIC16CR57B
FIGURE 15-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC16CR57B
VDD
MCLR
30
Internal
POR
32 32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34 34
I/O pin
(Note 1)
TABLE 15-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16CR57B

Parameter

(No Prescaler)

PIC16CR57B PIC16C5X
FIGURE 15-5: TIMER0 CLOCK TIMINGS - PIC16CR57B
T0CKI
40 41
42
TABLE 15-5: TIMER0 CLOCK REQUIREMENTS - PIC16CR57B

Section 15.3.
Parameter
No.
(1, 2, 4,..., 256)
and are not tested.

PIC16C5X PIC16CR57B
NOTES:

PIC16C58A PIC16C5X
16.0 ELECTRICAL CHARACTERISTICS - PIC16C58A
Storage Temperature............................................................................................................................. –65°C to +150°C
Note 1: Power Dissipation is calculated as follows: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)

PIC16C5X PIC16C58A

OSC PIC16C58A-04 PIC16C58A-10 PIC16C58A-20 PIC16LC58A-04

IDD: 2.5 mA max. at IDD: 1.8 mA typ. at IDD: 1.8 mA typ. at IDD: 0.5 mA typ. at
5.5V 5.5V 5.5V 5.5V
RC
Freq: 4.0 MHz max. Freq: 4.0 MHz max. Freq: 4.0 MHz max. Freq: 4.0 MHz max.
IDD 2.5 mA max. at IDD: 1.8 mA typ. at IDD: 1.8 mA typ. at IDD: 0.5 mA typ. at
5.5V 5.5V 5.5V 5.5V
XT
Freq: 4.0 MHz max. Freq: 4.0 MHz max. Freq: 4.0 MHz max. Freq: 4.0 MHz max.
IDD: 8.0 mA max. at IDD: 17 mA max. at
5.5V 5.5V Do not use in
HS N/A
IPD: 4.0 µA max. at IPD: 4.0 µA max. at HS mode
VDD: 3.0V to 6.25V VDD: 2.5V to 6.25V
32kHz, 3.0V 32kHz, 2.5V
Do not use in Do not use in
LP mode LP mode
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which should work by design, but are not
tested. It is recommended that the user select the device type from information in unshaded
sections.
OSC PIC16C58A/JW PIC16LV58A-02

VDD: 3.0V to 6.25V VDD: 2.0V to 3.8V
IDD: 2.5 mA max. at IDD: 0.5 mA typ. at
5.5V 3.0V
RC
VDD: 3.0V to 6.25V VDD: 2.0V to 3.8V
IDD 2.5 mA max. at IDD: 0.5 mA typ. at
5.5V 3.0V
XT
VDD: 4.5V to 5.5V
IDD: 17 mA max. at
5.5V Do not use in
HS
IPD: 4.0 µA max. at HS mode
3.0V WDT dis
Freq: 20 MHz max.
VDD: 2.5V to 6.25V VDD: 2.0V to 3.8V
IDD: 28 µA max. at IDD: 27 µA max. at
32kHz, 2.5V 32kHz, 2.5V
LP WDT dis WDT dis
Freq: 200 kHz max. Freq: 200 kHz max.
The shaded sections indicate oscillator selections
which should work by design, but are not tested. It
is recommended that the user select the device
type from information in unshaded sections.

PIC16C58A PIC16C5X
16.1 DC Characteristics: PIC16C58A-04, 10, 20 (Commercial)
PIC16C58A-04I, 10I, 20I (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD
HS option 4.5 5.5 V
4.7 17 mA FOSC = 20 MHz, VDD = 5.5V

PIC16C5X PIC16C58A
16.2 DC Characteristics: PIC16C58A-04E, 10E, 20E (Extended)


Supply Voltage VDD
HS option 4.5 5.5 V
9.0 20 mA FOSC = 20 MHz, VDD = 5.5V
XT and RC options 5.0 22 µA VDD = 3.5V, WDT enabled
HS option 4.0 22 µA VDD = 3.5V, WDT enabled
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.

PIC16C58A PIC16C5X
16.3 DC Characteristics: PIC16LC58A-04 (Commercial)
PIC16LC58A-04I (Industrial)
PIC16LC58A-04 (Extended)

Power Supply Pins –40°C ≤ TA ≤ +85°C (industrial)

Supply Voltage VDD
LP option, Extended 12 37 µA FOSC = 32 kHz, VDD = 2.5V WDT disabled
Extended 2.5 15 µA VDD = 2.5V, WDT enabled

PIC16C5X PIC16C58A
16.4 DC Characteristics: PIC16LV58A-02 (Commercial)

PIC16LV58A-02 (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD
(2)
RAM Data Retention Voltage VDR 1.5* V Device in SLEEP mode
VDD start voltage to ensure VPOR VSS V See section on Power-On Reset for details
Power-On Reset
VDD rise rate to ensure SVDD 0.05* V/ms See section on Power-On Reset for details
Power-On Reset
Power Down Current(5)(6) IPD
6: The oscillator start-up time can be as much as 8 seconds for XT and LP oscillator selection, if the SLEEP
mode is entered or during initial power-up.

PIC16C58A PIC16C5X
16.5 DC Characteristics: PIC16C58A-04, 10, 20, PIC16LC58A-04, PIC16LV58A-02 (Commercial)
PIC16C58A-04I, 10I, 20I, PIC16LC58A-04I, PIC16LV58A-02I (Industrial)
PIC16C58A-04E, 10E, 20E (Extended)

DC Characteristics –40°C ≤ TA ≤ +85°C (industrial)
All Pins Except –20°C ≤ TA ≤ +85°C (industrial - PIC16LV58A)
Power Supply Pins –40°C ≤ TA ≤ +125°C (extended)
Section 16.3.
I/O ports 0.2 VDD+1V VDD V For all VDD(5)
2.0 VDD V 4.0V < VDD ≤ 5.5V(5)
Trigger inputs
Pin at hi-impedance
MCLR -5.0 µA VPIN = VSS +0.25V(2)
0.5 +5.0 µA VPIN = VDD(2)
OSC1 -3.0 0.5 +3.0 µA VSS ≤ VPIN ≤ VDD,
RC option only
RC option only
voltage.

PIC16C5X PIC16C58A

1. TppS2ppS
2. TppS
T
F Frequency T Time
pp
2 to mc MCLR
S
F Fall P Period
H High R Rise
FIGURE 16-1: LOAD CONDITIONS - PIC16C58A

VSS

PIC16C58A PIC16C5X
FIGURE 16-2: EXTERNAL CLOCK TIMING - PIC16C58A
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
1 3 3
4 4
2
CLKOUT
TABLE 16-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C58A

–20°C ≤ TA ≤ +85°C (industrial - PIC16LV58A)
Parameter

DC — 2.0 MHz XT osc mode (PIC16LV58A)
DC — 2.0 MHz RC osc mode (PIC16LV58A)
0.1 — 2.0 MHz XT osc mode (PIC16LV58A)
and are not tested.

PIC16C5X PIC16C58A
TABLE 16-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C58A (CON’T)

Parameter

500 — — ns RC osc mode (PIC16LV58A)
250 — 250 ns HS osc mode (04)
100 — 250 ns HS osc mode (10)
50 — 250 ns HS osc mode (20)
and are not tested.

PIC16C58A PIC16C5X
FIGURE 16-3: CLKOUT AND I/O TIMING - PIC16C58A
Q4 Q1 Q2 Q3
OSC1
10 11
CLKOUT
13 18 12
14 19 16
I/O Pin
(input)
17 15

(output)
20, 21
TABLE 16-3: CLKOUT AND I/O TIMING REQUIREMENTS - PIC16C58A

Section 16.3.
Parameter

(I/O in hold time)
(I/O in setup time)
Note 1: Data in the Typical (“Typ”) column is at 5.0V, 25˚C unless otherwise stated. These parameters are for design guidance

PIC16C5X PIC16C58A

DEVICE RESET TIMER TIMING - PIC16C58A
VDD
MCLR
30
Internal
POR
32 32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34 34
I/O pin
(Note 1)
TABLE 16-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16C58A

Parameter

1µs — — VDD = 5.0V (PIC16LV58A only)
31 Twdt Watchdog Timer Time-out 9.0* 18* 30* ms VDD = 5.0V (Commercial)
Period (No Prescaler)
34 TioZ I/O Hi-impedance from MCLR — — 100* ns
Low — — 1µs (PIC16LV58A only)

PIC16C58A PIC16C5X
FIGURE 16-5: TIMER0 CLOCK TIMINGS - PIC16C58A
T0CKI
40 41
42
TABLE 16-5: TIMER0 CLOCK REQUIREMENTS - PIC16C58A

Section 16.3.
Parameter
No.
(1, 2, 4,..., 256)
and are not tested.

PIC16C5X PIC16C58A
NOTES:

PIC16CR58A PIC16C5X
17.0 ELECTRICAL CHARACTERISTICS - PIC16CR58A
Output Clamp Current, IOK (VO < 0 or VO> VDD)..............................................................................................................±20 mA
†NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.

PIC16C5X PIC16CR58A

OSC PIC16CR58A-04 PIC16CR58A-10 PIC16CR58A-20 PIC16LCR58A-04

RC VDD: 3.0V to 6.25V
WDT dis
Freq: 4.0 MHz max
XT VDD: 3.0V to 6.25V
WDT dis
Freq: 4.0 MHz max
HS VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
IDD: 8.0 mA max at 5.5V IDD: 17 mA max at 5.5V
N/A IPD: 4.0 µA max at 3.0V, IPD: 4.0 µA max at 3.0V, N/A
WDT dis WDT dis
LP VDD: 2.5V to 6.25V
2.5V
N/A N/A N/A
IPD: 4.0 µA max at 2.5V,
WDT dis
Freq: 200 kHz max

PIC16CR58A PIC16C5X
17.1 DC Characteristics: PIC16CR58A-04, 10, 20 (Commercial)
PIC16CR58A-04I, 10I, 20I (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD
HS option 4.5 5.5 V
4.7 17 mA FOSC = 20 MHz, VDD = 5.5V

PIC16C5X PIC16CR58A


Supply Voltage VDD
9.0 20 mA FOSC = 20 MHz, VDD = 5.5V

PIC16CR58A PIC16C5X
17.3 DC Characteristics: PIC16LCR58A-04 (Commercial)
PIC16LCR58A-04I (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD 2.5 6.25 V LP option
Commercial 12 28 µA FOSC = 32 kHz, VDD = 2.5V,
WDT disabled
Industrial 15 37 µA FOSC = 32 kHz, VDD = 2.5V,
WDT disabled

PIC16C5X PIC16CR58A
17.4 DC Characteristics: PIC16CR58A-04, 10, 20, PIC16LCR58A-04 (Commercial)

PIC16CR58A-04I, 10I, 20I, PIC16LCR58A-04I (Industrial)

DC Characteristics
All Pins Except
Power Supply Pins

2.0 VDD V 4.0V < VDD ≤ 5.5V(5)
Trigger inputs
Pin at hi-impedance
0.5 +5.0 µA VPIN = VDD(2)
RC option only
RC option only
voltage.

PIC16CR58A PIC16C5X

All Pins Except Operating Temperature –40°C ≤ TA ≤ +125°C (extended)

2.0 VDD V 4.0V < VDD ≤ 5.5V(5)
Trigger inputs
Pin at hi-impedance
0.5 +5.0 µA VPIN = VDD(2)
RC option only
RC option only
voltage.

PIC16C5X PIC16CR58A

1. TppS2ppS
2. TppS
T
F Frequency T Time
pp
2 to mc MCLR
S
F Fall P Period
H High R Rise
FIGURE 17-1: LOAD CONDITIONS - PIC16CR58A

VSS

PIC16CR58A PIC16C5X
FIGURE 17-2: EXTERNAL CLOCK TIMING - PIC16CR58A
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
1 3 3
4 4
2
CLKOUT
TABLE 17-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR58A

Parameter

and are not tested.

PIC16C5X PIC16CR58A
TABLE 17-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16CR58A (CON’T)

Parameter

250 — 250 ns HS osc mode (04)
100 — 250 ns HS osc mode (10)
50 — 250 ns HS osc mode (20)
and are not tested.

PIC16CR58A PIC16C5X
FIGURE 17-3: CLKOUT AND I/O TIMING - PIC16CR58A
Q4 Q1 Q2 Q3
OSC1
10 11
CLKOUT
13 12
19 18
14 16
I/O Pin
(input)
17 15

(output)
20, 21
TABLE 17-3: CLKOUT AND I/O TIMING REQUIREMENTS - PIC16CR58A

Section 17.3.
Parameter

(I/O in hold time)
(I/O in setup time)

PIC16C5X PIC16CR58A
FIGURE 17-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC16CR58A
VDD
MCLR
30
Internal
POR
32 32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34 34
I/O pin
(Note 1)
TABLE 17-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16CR58A

Parameter

(No Prescaler)

PIC16CR58A PIC16C5X
FIGURE 17-5: TIMER0 CLOCK TIMINGS - PIC16CR58A
T0CKI
40 41
42
TABLE 17-5: TIMER0 CLOCK REQUIREMENTS - PIC16CR58A

Section 17.3.
Parameter
No.
(1, 2, 4,..., 256)
and are not tested.

PIC16C5X PIC16CR58A
NOTES:

PIC16C54A/CR57B/C58A/CR58A PIC16C5X
18.0 DC AND AC CHARACTERISTICS - PIC16C54A/CR57B/C58A/CR58A
FOSC (25°C)
1.10
Rext ≥ 10 kΩ
1.08
Cext = 100 pF
1.06
1.04
1.02
1.00
0.98
VDD = 5.5 V
0.96
0.94
VDD = 3.5 V
0.92
0.90
0.88
0 10 20 25 30 40 50 60 70
T(°C)

Average
Cext Rext
Fosc @ 5 V, 25°C
20 pF 3.3 k 4.973 MHz ± 27%
5k 3.82 MHz ± 21%
10 k 2.22 MHz ± 21%
100 k 262.15 kHz ± 31%
100 pF 3.3 k 1.63 MHz ± 13%
5k 1.19 MHz ± 13%
10 k 684.64 kHz ± 18%
100 k 71.56 kHz ± 25%
300 pF 3.3 k 660 kHz ± 10%
5.0 k 484.1 kHz ± 14%
10 k 267.63 kHz ± 15%
160 k 29.44 kHz ± 19%

PIC16C5X PIC16C54A/CR57B/C58A/CR58A
FIGURE 18-2: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD, CEXT = 20 PF

6.00
R=3.3K
5.00
R=5.0K
4.00
Fosc(MHz)
3.00
R=10K
2.00
Cext=20pF, T=25C
1.00
R=100K
0.00
2.5 3 3.5 4 4.5 5 5.5 6
VDD(Volts)

1.80
R=3.3K
1.60
1.40
R=5.0K
1.20
Fosc(MHz)
1.00
0.80
R=10K
0.60
Cext=100pF, T=25C
0.40
0.20
R=100K
0.00
2.5 3 3.5 4 4.5 5 5.5 6
VDD(Volts)

700.00
R=3.3K
600.00
500.00
R=5.0K
400.00
Fosc(KHz)
300.00
R=10K
200.00
Cext=300pF, T=25C
100.00
R=100K
0.00
2.5 3 3.5 4 4.5 5 5.5 6
VDD(Volts)
FIGURE 18-5: TYPICAL IPD vs. VDD, WATCHDOG DISABLED (25°C)

2.5
1.5
Ipd(nA)
Ipd(µA)
0.5
0
2.5 3 3.5 4 4.5 5 5.5 6
VDD(Volts)

FIGURE 18-6: TYPICAL IPD vs. VDD, WATCHDOG ENABLED (25°C)

25.00
20.00
15.00
Ipd(uA)
10.00
5.00
0.00
2.5 3 3.5 4 4.5 5 5.5 6
VDD(Volts)
FIGURE 18-7: VTH (INPUT THRESHOLD VOLTAGE) OF I/O PINS vs. VDD
2.00
1.80 °C)
to +85
–40°C
1.60 Max (
VTH (Volts)
1.40 2 5°C)
Typ (+
1.20
+85°C
)
1.00 to
40°C
Min (–
0.80
0.60
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)

4.5
C)
+85°
4.0
to
3.5 (– 40°C
max
VIH °C
+25
3.0 typ 5°C)
VIH to +8
VIH, VIL (Volts)
40 ° C
2.5 m in (–
VIH
2.0
1.5 °C to +85°C)
VIL max (–40
1.0 VIH typ +25°C
0.5 5°C)
0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
FIGURE 18-9: VTH (INPUT THRESHOLD VOLTAGE) OF OSC1 INPUT

3.4
3.2
3.0
2.8 C)
o+ 85°
2.6 °C t
(–40
2.4 Max °C )
( +25
VTH (Volts)
2.2 Typ
C)
2.0 o+ 85°
°C t
(–40
1.8 Min
1.6
1.4
1.2
1.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)

FIGURE 18-10: TYPICAL IDD vs. FREQUENCY (WDT( DIS, RC@MODE

p @
) 20 PF, 25°C)
10000
1000
Idd(uA)
6.0V
5.5V
5.0V
100 4.5V
4.0V
3.5V
3.0V
2.5V
10
100000 1000000 10000000
Freq(Hz)
FIGURE 18-11: MAXIMUM IDD vs. FREQUENCY (WDT( DIS, RC@ MODE
p ) @ 20 PF, –40°C TO +85°C)
10000
1000
Idd(uA)
6.0V
5.5V
5.0V
4.5V
100 4.0V
`3.5V
3.0V
2.5V
10
100000 1000000 10000000
Freq(Hz)

FIGURE 18-12: TYPICAL IDD vs. FREQUENCY (WDT( DIS, RC
@ MODE
p )@ 100 PF, 25°C)
10000
1000
Idd(uA)
6.0V
100 5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
10
10000 100000 1000000 10000000
Freq(Hz)
FIGURE 18-13: MAXIMUM IDD vs. FREQUENCY (WDT DIS, RC MODE @ 100 PF, –40°C TO +85°C)
10000
1000
Idd(uA)
6.0V
5.5V
5.0V
100 4.5V
4.0V
3.5V
3.0V
2.5V
10
10000 100000 1000000 10000000
Freq(Hz)

FIGURE 18-14: TYPICAL IDD vs. FREQUENCY (WDT( DIS, RC

@ MODE
p )@ 300 PF, 25°C)
10000
1000
Idd(uA)
6.0V
100 5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
10
10000 100000 1000000
Freq(Hz)
FIGURE 18-15: MAXIMUM IDD vs. FREQUENCY (WDT DIS, RC MODE @ 300 PF, –40°C TO +85°C)
10000
1000
Idd(uA)
6.0V
5.5V
5.0V
100 4.5V
4.0V
3.5V
3.0V
2.5V
10
10000 100000 1000000
Freq(Hz)

FIGURE 18-16: WDT TIMER TIME-OUT TABLE 18-2: INPUT CAPACITANCE FOR
PERIOD vs. VDD PIC16C54A/C58A
50 Typical Capacitance (pF)
Pin
18L PDIP 18L SOIC
45
RA port 5.0 4.3
RB port 5.0 4.3
40
MCLR 17.0 17.0
35 OSC1 4.0 3.5

WDT period (ms)
OSC2/CLKOUT 4.3 3.5

30 T0CKI 3.2 2.8
Max +85°C
variation of ±25% (three standard deviations) should be
25
taken into account.
Max +70°C
20
Typ +25°C
15
MIn 0°C
10
MIn –40°C
5
2 3 4 5 6 7
VDD (Volts)

FIGURE 18-17: TRANSCONDUCTANCE (gm) FIGURE 18-18: TRANSCONDUCTANCE (gm)

OF HS OSCILLATOR vs. VDD OF LP OSCILLATOR vs. VDD
9000 45
8000 40
Max –40°C Max –40°C
7000 35
6000 30
5000 25
gm (µA/V)
gm (µA/V)
Typ +25°C
Typ +25°C
4000 20
3000 15
Min +85°C
2000 10
Min +85°C
100 5
0 0
2 3 4 5 6 7 2 3 4 5 6 7
FIGURE 18-19: TRANSCONDUCTANCE (gm)

OF XT OSCILLATOR vs. VDD
2500
Max –40°C
2000
1500
gm (µA/V)
Typ +25°C
1000
Min +85°C
500
0
2 3 4 5 6 7
VDD (Volts)

FIGURE 18-20: IOH vs. VOH, VDD = 3 V FIGURE 18-22: IOL vs. VOL, VDD = 3 V
0 45
40 Max –40°C
–5
Min +85°C
35
30
–10
IOH (mA)
25
IOL (mA)
Typ +25°C
Typ +25°C
–15 20
Max –40°C
15
–20 Min +85°C

10
5
–25
0 0.5 1.0 1.5 2.0 2.5 3.0
VOH (Volts) 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VOL (Volts)
0 90
80 Max –40°C
Min +85°C
–10 70
60
Typ +25°C
IOH (mA)
–20 50
IOL (mA)
Typ +25°C
40
Min +85°C
–30 30
Max –40°C
20
–40 10
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VOH (Volts) 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VOL (Volts)

NOTES:

PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B PIC16C5X
19.0 ELECTRICAL CHARACTERISTICS -
PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B
Ambient temperature under bias............................................................................................................ –55°C to +125°C
Storage temperature ............................................................................................................................. –65°C to +150°C
Total power dissipation(1) .....................................................................................................................................800 mW
Max. current out of VSS pin....................................................................................................................................150 mA
Max. current into VDD pin ......................................................................................................................................100 mA
Max. current into an input pin (T0CKI only)......................................................................................................................±500 µA
Input clamp current, IIK (VI < 0 or VI > VDD) ....................................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ..............................................................................................................±20 mA
Max. output current sunk by any I/O pin..................................................................................................................25 mA
Max. output current sourced by any I/O pin ............................................................................................................20 mA
Max. output current sourced by a single I/O port A ................................................................................................50 mA
Max. output current sourced by a single I/O port B ................................................................................................50 mA
Max. output current sunk by a single I/O port A ......................................................................................................50 mA
Max. output current sunk by a single I/O port B .....................................................................................................50 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)

PIC16C5X PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B

OSC PIC16C5X-04 PIC16C5X-20 PIC16C5X/JW

IDD: 2.4 mA max. at IDD: 1.7 mA typ. at IDD: 2.4 mA max. at
5.5V 5.5V 5.5V
RC
IPD: 4.0 µA max. at IPD: 0.25 µA typ. at IPD: 4.0 µA max. at
3.0V WDT dis 3.0V WDT dis 3.0V WDT dis
Freq: 4 MHz max. Freq: 4.0 MHz max. Freq: 4.0 MHz max.
IDD 2.4 mA max. at IDD: 1.7 mA typ. at IDD 2.4 mA max. at
5.5V 5.5V 5.5V
XT
IPD: 4.0 µA max. at IPD: 0.25 µA typ. at IPD: 4.0 µA max. at
3.0V WDT dis 3.0V WDT dis 3.0V WDT dis
Freq: 4 MHz max. Freq: 4.0 MHz max. Freq: 4.0 MHz max.
IDD: 16 mA max. at IDD: 16 mA max. at
5.5V 5.5V
HS N/A
32kHz, 3.0V 32kHz, 3.0V
Do not use in
LP mode
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which should work by
design, but are not tested. It is recommended that the user select the
device type from information in unshaded sections.

19.1 DC Characteristics: PIC16C5X-04, 20 (Commercial)
PIC16CR5X-04, 20 (Commercial)
PIC16C5X-04I, 20I (Industrial)
PIC16CR5X-04I, 20I (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD
HS option 4.5 5.5 V

19.2 DC Characteristics: PIC16C5X-04E, 20E (Extended)

PIC16CR5X-04E, 20E (Extended)


Supply Voltage VDD
HS option 4.5 5.5 V
Power Down Current(5) IPD 0.3 18 µA VDD = 3.5V, WDT disabled


19.3 DC Characteristics: PIC16LCR5X-04 (Commercial)
PIC16LCR5X-04I (Industrial)

DC Characteristics
Power Supply Pins

Supply Voltage VDD

19.4 DC Characteristics: PIC16C5X-04, 20, PIC16LCR5X-04 (Commercial)

PIC16CR5X-04, 20, PIC16CR5X-04I, 20I (Commercial)
PIC16C5X-04I, 20I, PIC16LC5X-04I (Industrial)
PIC16C5X-04E, 20E (Extended)

DC Characteristics
All Pins Except
Power Supply Pins
Section 19.3.
I/O Ports VSS 0.8 VDD V Pin at hi-impedance 4.5V , VDD ≤ 5.5V
I/O Ports VSS 0.15 VDD V Pin at hi-impedance 2.5V , VDD ≤ 4.5V
OSC1 0.3 VDD XT, HS and LP options
I/O ports 0.25 VDD+0.8V VDD V For all VDD(5)
2.0 VDD V 4.5V < VDD ≤ 5.5V(5)
Trigger inputs
Pin at hi-impedance
MCLR -5.0 +5.0 µA VPIN = VSS +0.25V(2)
0.5 +3.0 µA VPIN = VDD(2)
OSC1 -3.0 0.5 µA VSS ≤ VPIN ≤ VDD,
RC option only
RC option only
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified lev-
els represent normal operating conditions. Higher leakage current may be measured at different input voltage.
4: For the RC option, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be
driven with external clock in RC mode.

1. TppS2ppS
2. TppS
T
F Frequency T Time
pp
2 to mc MCLR
S
F Fall P Period
H High R Rise
FIGURE 19-1: LOAD CONDITIONS - PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B, PIC16CR5X

VSS

FIGURE 19-2: EXTERNAL CLOCK TIMING - PIC16C5X, PIC16CR5X
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
1 3 3
4 4
2
CLKOUT
TABLE 19-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C5X, PIC16CR5X

Parameter

4 — 4.0 MHz HS osc mode (04)
5 — 200 kHz LP osc mode
250 — 250 ns HS osc mode (04)
50 — 250 ns HS osc mode (20)
and are not tested.

TABLE 19-2: EXTERNAL CLOCK TIMING REQUIREMENTS - PIC16C5X, PIC16CR5X (CON’T)

Parameter
and are not tested.

FIGURE 19-3: CLKOUT AND I/O TIMING - PIC16C5X, PIC16CR5X
Q4 Q1 Q2 Q3
OSC1
10 11
CLKOUT
13 18 12
14 19 16
I/O Pin
(input)
17 15

(output)
20, 21
TABLE 19-3: CLKOUT AND I/O TIMING REQUIREMENTS - PIC16C5X, PIC16CR5X

Section 19.3.
Parameter

(I/O in hold time)
(I/O in setup time)
and are not tested.

DEVICE RESET TIMER TIMING - PIC16C5X, PIC16CR5X
VDD
MCLR
30
Internal
POR
32 32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34 34
I/O pin
(Note 1)
TABLE 19-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC16C5X, PIC16CR5X

Parameter

(No Prescaler)
34 TioZ I/O Hi-impedance from MCLR Low 100* 300* 1000* ns

FIGURE 19-5: TIMER0 CLOCK TIMINGS - PIC16C5X, PIC16CR5X
T0CKI
40 41
42
TABLE 19-5: TIMER0 CLOCK REQUIREMENTS - PIC16C5X, PIC16CR5X

Section 19.3.
Parameter
No.
(1, 2, 4,..., 256)
and are not tested.

20.0 DC AND AC CHARACTERISTICS -
PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B
FOSC (25°C)
1.10
Rext ≥ 10 kΩ
1.08
Cext = 100 pF
1.06
1.04
1.02
1.00
0.98
VDD = 5.5 V
0.96
0.94
VDD = 3.5 V
0.92
0.90
0.88
0 10 20 25 30 40 50 60 70
T(°C)

Average
Cext Rext
Fosc @ 5 V, 25°C
20 pF 3.3 k 4.973 MHz ± 27%
5k 3.82 MHz ± 21%
10 k 2.22 MHz ± 21%
100 k 262.15 kHz ± 31%
100 pF 3.3 k 1.63 MHz ± 13%
5k 1.19 MHz ± 13%
10 k 684.64 kHz ± 18%
100 k 71.56 kHz ± 25%
300 pF 3.3 k 660 kHz ± 10%
5.0 k 484.1 kHz ± 14%
10 k 267.63 kHz ± 15%
160 k 29.44 kHz ± 19%


6.00
R=3.3K
5.00
R=5.0K
4.00
Fosc(MHz)
3.00
R=10K
2.00
Cext=20pF, T=25C
1.00
R=100K
0.00
2.5 3 3.5 4 4.5 5 5.5 6
VDD(Volts)

1.80
R=3.3K
1.60
1.40
R=5.0K
1.20
Fosc(MHz)
1.00
0.80
R=10K
0.60
Cext=100pF, T=25C
0.40
0.20
R=100K
0.00
2.5 3 3.5 4 4.5 5 5.5 6
VDD(Volts)

700.00
R=3.3K
600.00
500.00
R=5.0K
400.00
Fosc(KHz)
300.00
R=10K
200.00
Cext=300pF, T=25C
100.00
R=100K
0.00
2.5 3 3.5 4 4.5 5 5.5 6
VDD(Volts)
FIGURE 20-5: TYPICAL IPD vs. VDD, WATCHDOG DISABLED (25°C)

2.5
1.5
Ipd(µA)
Ipd(nA)
0.5
0
2.5 3 3.5 4 4.5 5 5.5 6
VDD(Volts)

FIGURE 20-6: TYPICAL IPD vs. VDD, WATCHDOG ENABLED (25°C)

25
20
15
IPD (uA)
10
0
2.5 3 3.5 4 4.5 5 5.5 6
VDD (Volts)
FIGURE 20-7: TYPICAL IPD vs. VDD, WATCHDOG ENABLED (–40°C, 85°C)
35
30
25
20
IPD (uA)
15
10
5 (-40°C)
0
(+85°C)
2.5 3 3.5 4 4.5 5 5.5 6
VDD (Volts)

FIGURE 20-8: VTH (INPUT THRESHOLD TRIP POINT VOLTAGE) OF I/O PINS vs. VDD
2.00
1.80
1.60
VTH (Volts)
1.40 2 5°C)
Typ (+
1.20
1.00
0.80
0.60
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
4.5
C)
+85°
4.0
C to
3.5 (–40°
max
VIH °C
+25
typ C)
+85°
3.0
VIH
VIH, VIL (Volts)
t o
40°C
2.5 m in (–
VIH
2.0
1.5 °C to +85°C)
VIL max (–40
1.0 VIL typ +25°C
0.5 5°C)
0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)

FIGURE 20-10: VTH (INPUT THRESHOLD TRIP POINT VOLTAGE) OF OSC1 INPUT
3.4
3.2
3.0
2.8
2.6
2.4 °C)
(+25
VTH (Volts)
2.2 Typ
2.0
1.8
1.6
1.4
1.2
1.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
FIGURE 20-11: TYPICAL IDD vs. FREQUENCY (WDT DIS, RC MODE @ 20 PF, 25°C)
10000
1000
Idd(uA)
5.5V
100 4.5V
3.5V
2.5V
10
100000 1000000 10000000
Freq(Hz)

10000
1000
Idd(uA)
100 5.5V
4.5V
3.5V
2.5V
10
10000 100000 1000000 10000000
Freq(Hz)
10000
1000
Idd(uA)
100 5.5V
4.5V
3.5V
2.5V
10
10000 100000 1000000
Freq(Hz)

FIGURE 20-14: WDT TIMER TIME-OUT TABLE 20-2: INPUT CAPACITANCE FOR
PERIOD vs. VDD PIC16C54s/C58s
50 Typical Capacitance (pF)
Pin
18L PDIP 18L SOIC
45
RA port 5.0 4.3
RB port 5.0 4.3
40
MCLR 17.0 17.0
35 OSC1 4.0 3.5

WDT period (ms)
OSC2/CLKOUT 4.3 3.5

30 T0CKI 3.2 2.8
Typ +125°C variation of ±25% (three standard deviations) should be
25
taken into account.
Typ +85°C
20
Typ +25°C
15
Typ –40°C
10
5
2 3 4 5 6 7
VDD (Volts)

0 45
40 Max –40°C
–5
Min +85°C
35
30
–10
IOH (mA)
25
IOL (mA)
Typ +25°C
Typ +25°C
–15 20
Max –40°C
15
–20 Min +85°C

10
5
–25
0 0.5 1.0 1.5 2.0 2.5 3.0
VOH (Volts) 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VOL (Volts)
0 90
80 Max –40°C
–10 70
60
Typ +125°C
Typ +25°C
IOH (mA)
–20 50
IOL (mA)
Typ +85°C
Typ +25°C
40
Min +85°C
Typ –40°C
–30 30
20
–40 10
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VOH (Volts) 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VOL (Volts)

NOTES:

PIC16C5X
21.0 PACKAGING INFORMATION
21.1 Package Marking Information
18-Lead PDIP Example
MMMMMMMMMMMMXXX PIC16C56-
MMMMMMMMXXXXXXX RCI/P456
AABB CDE 9523 CBA
28-Lead Skinny PDIP (.300") Example
MMMMMMMMMMMMMMMMM PIC16C55-
XXXXXXXXXXXXXXXXX RCI/P456
AABB CDE 9523 CBA
28-Lead PDIP (.600") Example
MMMMMMMMMMMMXXX PIC16C55-
MMMMMMMMXXXXXXX XTI/P126
XXXXXXXXXXXXXXX
AABB CDE 9542 CDA
Legend: MM...M Microchip part number information

XX...X Customer specific information*
AA Year code (last two digits of calendar year)
BB Week code (week of January 1 is week ‘01’)
C Facility code of the plant at which wafer is manufactured
C = Chandler, Arizona, U.S.A.,
S = Tempe, Arizona, U.S.A.
D Mask revision number
E Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For OTP marking
beyond this, certain price adders apply. Please check with your Microchip
Sales Office. For QTP devices, any special marking adders are included in
QTP price.

PIC16C5X
18-Lead SOIC Example
MMMMMMMMM PIC16C54-
XXXXXXXXX XTI/S0218
AABB CDE 9518 CDK
28-Lead SOIC Example
MMMMMMMMMMMMMMMMMMXX PIC16C57-XT/SO
XXXXXXXXXXXXXXXXXXXX
AABB CDE 9515 CBK
20-Lead SSOP Example
MMMMMMMM PIC16C54
XXXXXXXX XTI/218
AABB CDE 9520 CBP
28-Lead SSOP Example

MMMMMMMMMMMM PIC16C57-
XXXXXXXXXXXX XT/SS123
AABB CDE 9525 CBK

part was assembled
QTP price.

PIC16C5X
18-Lead CERDIP Windowed Example
MMMMMMMM PIC16C54
MMMMMMMM /JW
AABB CDE 9501 CBA
28-Lead CERDIP Skinny Windowed Example
MMMMMMMMMMMMMM PIC16C57
XXXXXXXXXXXXXX /JW
AABBCDE 9338 CCT
28-Lead CERDIP Windowed Example
MMMMMMMMMM PIC16C57
MMMMMM /JW
AABB CDE 9538 CBA

part was assembled
QTP price.

PIC16C5X
21.2 18-Lead Plastic Dual In-Line (PDIP) - 300 mil
N
α
C
E1 E
eA
Pin No. 1 eB
Indicator
Area
D
S S1
Base
Plane
Seating
Plane L
B1 e1 A1 A2 A
B
D1
Package Group: Plastic Dual In-Line (PLA)

Millimeters Inches
Symbol Min Max Notes Min Max Notes
α 0° 10° 0° 10°
A – 4.064 – 0.160
A1 0.381 – 0.015 –
A2 3.048 3.810 0.120 0.150
B 0.355 0.559 0.014 0.022
B1 1.524 1.524 Reference 0.060 0.060 Reference
C 0.203 0.381 Typical 0.008 0.015 Typical
D 22.479 23.495 0.885 0.925
D1 20.320 20.320 Reference 0.800 0.800 Reference
E 7.620 8.255 0.300 0.325
E1 6.096 7.112 0.240 0.280
e1 2.489 2.591 Typical 0.098 0.102 Typical
eA 7.620 7.620 Reference 0.300 0.300 Reference
eB 7.874 9.906 0.310 0.390
L 3.048 3.556 0.120 0.140
N 18 18 18 18
S 0.889 – 0.035 –
S1 0.127 – 0.005 –

PIC16C5X
E1 E α
C
Pin No. 1 eA
Indicator eB
Area
B2 B1
D
S
Base
Plane
Seating
Plane L
Detail A B3 B
e1 A1 A2 A
D1 Detail A

Millimeters Inches
α 0° 10° 0° 10°
A 3.632 4.572 0.143 0.180
A1 0.381 – 0.015 –
A2 3.175 3.556 0.125 0.140
B 0.406 0.559 0.016 0.022
B1 1.016 1.651 Typical 0.040 0.065 Typical
B2 0.762 1.016 4 places 0.030 0.040 4 places
B3 0.203 0.508 4 places 0.008 0.020 4 places
D 34.163 35.179 1.385 1.395
E 7.874 8.382 0.310 0.330
E1 7.112 7.493 0.280 0.295
eB 8.128 9.652 0.320 0.380
L 3.175 3.683 0.125 0.145
N 28 - 28 -
S 0.584 1.220 0.023 0.048

PIC16C5X
α
E1 E C
Pin No. 1 eA
Indicator eB
Area
D
S S1
Base
Plane
Seating
Plane L
B1 e1 A1 A2 A
B
D1

Millimeters Inches
α 0° 10° 0° 10°
A – 5.080 – 0.200
A1 0.508 – 0.020 –
A2 3.175 4.064 0.125 0.160
B 0.355 0.559 0.014 0.022
D 35.052 37.084 1.380 1.460
E 15.240 15.875 0.600 0.625
E1 12.827 13.970 0.505 0.550
eB 15.240 17.272 0.600 0.680
L 2.921 3.683 0.115 0.145
N 28 28 28 28
S 0.889 – 0.035 –
S1 0.508 – 0.020 –

PIC16C5X
21.5 18-Lead Plastic Surface Mount (SOIC) - 300 mil
e
B
h x 45°
Index
Area
E H α C
Chamfer L
h x 45°
1 2 3
CP Base
Seating Plane
Plane
A1 A
Package Group: Plastic SOIC (SO)

Millimeters Inches
α 0° 8° 0° 8°
A 2.362 2.642 0.093 0.104
A1 0.101 0.300 0.004 0.012
B 0.355 0.483 0.014 0.019
C 0.241 0.318 0.009 0.013
D 11.353 11.735 0.447 0.462
E 7.416 7.595 0.292 0.299
e 1.270 1.270 Reference 0.050 0.050 Reference
H 10.007 10.643 0.394 0.419
h 0.381 0.762 0.015 0.030
L 0.406 1.143 0.016 0.045
N 18 18 18 18
CP – 0.102 – 0.004

PIC16C5X
21.6 28-Lead Plastic Surface Mount (SOIC) - 300 mil
e
B
h x 45°
Index
Area
E H α C
Chamfer L
h x 45°
1 2 3
CP Base
Seating Plane
Plane
A1 A
Package Group: Plastic SOIC (SO)

Millimeters Inches
α 0° 8° 0° 8°
A 2.362 2.642 0.093 0.104
A1 0.101 0.300 0.004 0.012
B 0.355 0.483 0.014 0.019
C 0.241 0.318 0.009 0.013
D 17.703 18.085 0.697 0.712
E 7.416 7.595 0.292 0.299
e 1.270 1.270 Typical 0.050 0.050 Typical
H 10.007 10.643 0.394 0.419
h 0.381 0.762 0.015 0.030
L 0.406 1.143 0.016 0.045
N 28 28 28 28
CP – 0.102 – 0.004

PIC16C5X
21.7 20-Lead Plastic Surface Mount (SSOP) - 209 mil
N
Index
area
E H
α
C
L
1 2 3
e B
A Base plane
CP
Seating plane
D A1
Package Group: Plastic SSOP

Millimeters Inches
α 0° 8° 0° 8°
A 1.730 1.990 0.068 0.078
A1 0.050 0.210 0.002 0.008
B 0.250 0.380 0.010 0.015
C 0.130 0.220 0.005 0.009
D 7.070 7.330 0.278 0.289
E 5.200 5.380 0.205 0.212
H 7.650 7.900 0.301 0.311
L 0.550 0.950 0.022 0.037
N 20 20 20 20
CP - 0.102 - 0.004

PIC16C5X
21.8 28-Lead Plastic Surface Mount (SSOP) - 209 mil
N
Index
area
E H
α
C
L
1 2 3
e B
A Base plane
CP
Seating plane
D A1
Package Group: Plastic SSOP

Millimeters Inches
α 0° 8° 0° 8°
A 1.730 1.990 0.068 0.078
A1 0.050 0.210 0.002 0.008
B 0.250 0.380 0.010 0.015
C 0.130 0.220 0.005 0.009
D 10.070 10.330 0.396 0.407
E 5.200 5.380 0.205 0.212
H 7.650 7.900 0.301 0.311
L 0.550 0.950 0.022 0.037
N 28 28 28 28
CP - 0.102 - 0.004

PIC16C5X
21.9 18-Lead Ceramic Dual In-Line (CERDIP) with Window - 300 mil
α C
E1 E
eA
Pin No. 1 eB
Indicator
Area
D
S S1
Base
Plane
Seating
Plane L
B1 e1 A1 A3 A A2
B
D1
Package Group: Ceramic Dual In-Line (CDP)

Millimeters Inches
α 0° 10° 0° 10°
A — 5.080 — 0.200
A1 0.381 1.7780 0.015 0.070
A2 3.810 4.699 0.150 0.185
A3 3.810 4.445 0.150 0.175
B 0.355 0.585 0.014 0.023
D 22.352 23.622 0.880 0.930
E 7.620 8.382 0.300 0.330
E1 5.588 7.874 0.220 0.310
e1 2.540 2.540 Reference 0.100 0.100 Reference
eA 7.366 8.128 Typical 0.290 0.320 Typical
eB 7.620 10.160 0.300 0.400
L 3.175 3.810 0.125 0.150
N 18 18 18 18
S 0.508 1.397 0.020 0.055
S1 0.381 1.270 0.015 0.050

PIC16C5X
21.10 28-Lead Ceramic Dual In-Line (CERDIP) with Window - 600 mil
E1 E
α C
Pin No. 1
Indicator eA
Area eB
D
S S1
Base
Plane
Seating
Plane L
B1 e1 A1 A3 A A2
B
D1
Package Group: Ceramic Dual In-Line (CDP)

Millimeters Inches
α 0° 10° 0° 10°
A — 5.461 — 0.215
A1 0.381 1.524 0.015 0.060
A2 3.810 4.699 0.150 0.185
A3 3.810 4.445 0.150 0.175
B 0.355 0.585 0.014 0.023
D 36.195 37.465 1.425 1.475
E 15.240 15.875 0.600 0.625
E1 12.954 15.240 0.510 0.600
eB 15.240 18.034 0.600 0.710
L 3.175 3.810 0.125 0.150
N 28 28 28 28
S 1.016 2.286 0.040 0.090
S1 0.381 1.778 0.015 0.070

PIC16C5X
APPENDIX A: COMPATIBILITY
To convert code written for PIC16CXX to PIC16C5X,
the user should take the following steps:
1. Check any CALL, GOTO or instructions that
modify the PC to determine if any program
memory page select operations (PA2, PA1, PA0
bits) need to be made.
2. Revisit any computed jump operations (write to
PC or add to PC, etc.) to make sure page bits
are set properly under the new scheme.
3. Eliminate any special function register page
switching. Redefine data variables to reallocate
them.
4. Verify all writes to STATUS, OPTION, and FSR
registers since these have changed.
5. Change reset vector to proper value for
processor used.
6. Remove any use of the ADDLW and SUBLW
instructions.
7. Rewrite any code segments that use interrupts.

PIC16C5X
NOTES:

PIC16C5X
INDEX ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator ............55
ID Locations ................................................................. 31, 42
A INDF ...................................................................................36
Absolute Maximum INDF Register .....................................................................24
Ratings ........................... 59, 67, 89, 103, 117, 131, 145, 171 Indirect Data Addressing ....................................................24
ALU ...................................................................................... 9 Instruction Cycle .................................................................13
Applications .......................................................................... 5 Instruction Flow/Pipelining ..................................................13
Architectural Overview ......................................................... 9 Instruction Set Summary ....................................................43
Assembler
MPASM Assembler .................................................... 56
K
KEELOQ Evaluation and Programming Tools ...................57
B
Block Diagram
L
On-Chip Reset Circuit ................................................ 36 Loading of PC .............................................................. 22, 23
PIC16C5X Series ....................................................... 10
M
Timer0 ........................................................................ 27
TMR0/WDT Prescaler ................................................ 30 MCLR .................................................................................36
Watchdog Timer ......................................................... 40 Memory Map .......................................................................15
Brown-Out Protection Circuit ............................................. 41 PIC16C52 ...................................................................15
PIC16C54s/CR54s/C55s ............................................15
C PIC16C56s/CR56s .....................................................15
Carry bit ............................................................................... 9 PIC16C57s/CR57s/C58s ............................................16
Clocking Scheme ............................................................... 13 Memory Organization .........................................................15
Code Protection ........................................................... 31, 42 Data Memory ..............................................................17
Configuration Bits ............................................................... 31 Program Memory ........................................................15
Configuration Word ............................................................ 31 MP-DriveWay - Application Code Generator ...................57
PIC16C52/C54/C54A/C55/C56/C57/C58A ................ 32 MPLAB C .........................................................................57
PIC16CR54A/C54B/CR54B/C56A/CR56A/ MPLAB Integrated Development
CR57B/C58B/CR58A/CR58B .................................... 31 Environment Software ........................................................56
D O
DC and AC Characteristics - PIC16C54/55/56/57 ............. 81 One-Time-Programmable (OTP) Devices ............................7
DC and AC Characteristics - OPTION ..............................................................................36
PIC16C54A/CR57B/C58A/CR58A ................................... 159 OPTION Register ...............................................................21
DC and AC Characteristics - OSC selection .....................................................................31
PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B ............ 183 Oscillator Configurations ....................................................33
DC Characteristics Oscillator Types
......... 60, 61, 69, 70, 71, 72, 73, 91, 105, 119, 133, 147, 173 HS ...............................................................................33
Development Support ........................................................ 55 LP ...............................................................................33
Development Tools ............................................................ 55 RC ..............................................................................33
Device Varieties ................................................................... 7 XT ...............................................................................33
Digit Carry bit ....................................................................... 9
P
E Package Marking Information .......................................... 193
Electrical Characteristics Packaging Information ..................................................... 193
PIC16C52 .................................................................. 59 PC .......................................................................................22
PIC16C54/55/56/57 ................................................... 67 PCL .....................................................................................36
PIC16C54A .............................................................. 103 PIC16C54/55/56/57 Product Identification System ......... 216
PIC16C54B/CR54B/C56A/CR56A/C58B/CR58B .... 171 PIC16C5X Product Identification System ........................ 215
PIC16C58A .............................................................. 131 PICDEM-1 Low-Cost PIC16/17 Demo Board .....................56
PIC16CR54A ............................................................. 89 PICDEM-2 Low-Cost PIC16CXX Demo Board ...................56
PIC16CR57B ........................................................... 117 PICDEM-3 Low-Cost PIC16CXXX Demo Board ................56
PIC16CR58A ........................................................... 145 PICMASTER In-Circuit Emulator ......................................55
External Power-On Reset Circuit ....................................... 37 PICSTART Plus Entry Level Development System .........55
Pin Configurations ................................................................2
F Pinout Description - PIC16C52s, PIC16C54s,
Family of Devices PIC16CR54s, PIC16C56s, PIC16CR56s,
PIC16C5X .................................................................... 6 PIC16C58s, PIC16CR58s ..................................................11
Features ............................................................................... 1 Pinout Description - PIC16C55s, PIC16C57s,
FSR .................................................................................... 36 PIC16CR57s .......................................................................12
FSR Register ..................................................................... 24 POR
Fuzzy Logic Dev. System (fuzzyTECH-MP) .................... 57 Device Reset Timer (DRT) .................................. 31, 39
PD ........................................................................ 35, 41
I Power-On Reset (POR) ................................. 31, 36, 37
I/O Interfacing .................................................................... 25 TO ........................................................................ 35, 41
I/O Ports ............................................................................. 25 PORTA ........................................................................ 25, 36
I/O Programming Considerations ....................................... 26 PORTB ........................................................................ 25, 36

PIC16C5X
PORTC ......................................................................... 25, 36 LIST OF EXAMPLES
Power-Down Mode (SLEEP) .............................................. 42 Example 3-1: Instruction Pipeline Flow ............................ 13
Prescaler ............................................................................ 30 Example 4-1: Indirect Addressing..................................... 24
PRO MATE II Universal Programmer .............................. 55 Example 4-2: How To Clear RAM Using Indirect
Program Counter ................................................................ 22 Addressing ................................................. 24
Q Example 5-1: Read-Modify-Write Instructions on an
I/O Port ....................................................... 26
Q cycles ............................................................................. 13
Example 6-1: Changing Prescaler (Timer0→WDT).......... 30
Quick-Turnaround-Production (QTP) Devices ..................... 7
Example 6-2: Changing Prescaler (WDT→Timer0).......... 30
R
RC Oscillator ...................................................................... 34
LIST OF FIGURES
Read Only Memory (ROM) Devices ..................................... 7 Figure 3-1: PIC16C5X Series Block Diagram ............... 10
Read-Modify-Write ............................................................. 26 Figure 3-2: Clock/Instruction Cycle ............................... 13
Register File Map Figure 4-1: PIC16C52 Program Memory Map
PIC16C52, PIC16C54s, PIC16CR54s, and Stack ................................................... 15
PIC16C55s, PIC16C56s, PIC16CR56s ..................... 17 Figure 4-2: PIC16C54s/CR54s/C55s
PIC16C57s/CR57s ..................................................... 18 Program Memory Map and Stack............... 15
PIC16C58s/CR58s ..................................................... 18 Figure 4-3: PIC16C56s/CR56s Program Memory
Registers Map and Stack ........................................... 15
Special Function ........................................................ 19 Figure 4-4: PIC16C57s/CR57s/C58s/CR58s
Reset ............................................................................ 31, 35 Program Memory Map and Stack............... 16
Reset on Brown-Out ........................................................... 41 Figure 4-5: PIC16C52, PIC16C54s, PIC16CR54s,
PIC16C55s, PIC16C56s, PIC16CR56s
S Register File Map ....................................... 17
SEEVAL Evaluation and Programming System .............. 57 Figure 4-6: PIC16C57s/CR57s Register File Map ........ 18
Serialized Quick-Turnaround-Production (SQTP) Figure 4-7: PIC16C58s/CR58s Register File Map ........ 18
Devices ................................................................................ 7 Figure 4-8: STATUS Register (Address:03h) ............... 20
SLEEP .......................................................................... 31, 42 Figure 4-9: OPTION Register ....................................... 21
Software Simulator (MPLAB SIM) ................................... 57 Figure 4-10: Loading of PC Branch Instructions -
Special Features of the CPU .............................................. 31 PIC16C52, PIC16C54s, PIC16CR54s,
Special Function Registers ................................................ 19 PIC16C55s ................................................. 22
Stack .................................................................................. 23 Figure 4-11: Loading of PC Branch Instructions -
STATUS ............................................................................. 36 PIC16C56s/PIC16CR56s ........................... 22
STATUS Register ........................................................... 9, 20 Figure 4-12: Loading of PC Branch Instructions -
PIC16C57s/PIC16CR57s, and
T PIC16C58s/PIC16CR58s ........................... 23
Timer0 Figure 4-13: Direct/Indirect Addressing .......................... 24
Switching Prescaler Assignment ................................ 30 Figure 5-1: Equivalent Circuit
Timer0 (TMR0) Module .............................................. 27 for a Single I/O Pin ..................................... 25
TMR0 with External Clock .......................................... 29 Figure 5-2: Successive I/O Operation........................... 26
Timing Diagrams and Figure 6-1: Timer0 Block Diagram ................................ 27
Specifications ................. 63, 75, 97, 111, 125, 139, 153, 178 Figure 6-2: Electrical Structure of T0CKI Pin ................ 27
Timing Parameter Symbology and Figure 6-3: Timer0 Timing: Internal Clock/
Load Conditions ............. 62, 74, 96, 110, 124, 138, 152, 177 No Prescale ................................................ 28
TMR0 ................................................................................. 36 Figure 6-4: Timer0 Timing: Internal Clock/
TRIS ................................................................................... 36 Prescale 1:2 ............................................... 28
TRIS Registers ................................................................... 25 Figure 6-5: Timer0 Timing With External Clock ............ 29
Figure 6-6: Block Diagram of the Timer0/WDT
U Prescaler .................................................... 30
UV Erasable Devices ........................................................... 7 Figure 7-1: Configuration Word for
PIC16CR54A/C54B/CR54B/C56A/
W CR56A/CR57B/C58B/CR58A/CR58B ........ 31
W ........................................................................................ 36 Figure 7-2: Configuration Word for
Wake-up from SLEEP ........................................................ 42 PIC16C52/C54/C54A/C55/C56/
Watchdog Timer (WDT) ............................................... 31, 39 C57/C58A ................................................... 32
Period ......................................................................... 39 Figure 7-3: Crystal Operation (or Ceramic Resonator)
Programming Considerations .................................... 39 (HS, XT or LP OSC Configuration)............. 33
Figure 7-4: External Clock Input Operation
Z
(HS, XT or LP OSC Configuration)............. 33
Zero bit ................................................................................. 9 Figure 7-5: External Parallel Resonant Crystal
Oscillator Circuit (using XT, HS or
LP oscillator mode)..................................... 34
Figure 7-6: External Series Resonant Crystal
Oscillator Circuit (using XT, HS or
LP oscillator mode)..................................... 34
Figure 7-7: RC Oscillator Mode .................................... 35

PIC16C5X
Figure 7-8: Simplified Block Diagram of On-Chip Figure 12-19: Transconductance (gm) of
Reset Circuit ............................................... 36 XT Oscillator vs. VDD ...................................87
Figure 7-9: External Power-On Reset Circuit Figure 12-20: IOH vs. VOH, VDD = 5 V................................87
(For Slow VDD Power-Up)........................... 37 Figure 12-21: IOL vs. VOL, VDD = 3 V.................................88
Figure 7-10: Time-Out Sequence on Power-Up Figure 12-22: IOL vs. VOL, VDD = 5 V.................................88
(MCLR Not Tied to VDD) ............................. 38 Figure 13-1: Load Conditions ..........................................96
Figure 7-11: Time-Out Sequence on Power-Up Figure 13-2: External Clock Timing - PIC16CR54A.........97
(MCLR Tied to VDD): Fast VDD Figure 13-3: CLKOUT and I/O Timing - PIC16CR54A ....99
Rise Time.................................................... 38 Figure 13-4: Reset, Watchdog Timer, and Device
Figure 7-12: Time-Out Sequence on Power-Up Reset Timer Timing - PIC16CR54A ......... 100
(MCLR Tied to VDD): Slow VDD Figure 13-5: Timer0 Clock Timings - PIC16CR54A...... 101
Rise Time.................................................... 38 Figure 14-1: Load Conditions - PIC16C54A ................. 110
Figure 7-13: Watchdog Timer Block Diagram ................. 40 Figure 14-2: External Clock Timing - PIC16C54A ........ 111
Figure 7-14: Brown-Out Protection Circuit 1 ................... 41 Figure 14-3: CLKOUT and I/O Timing - PIC16C54A .... 113
Figure 7-15: Brown-Out Protection Circuit 2 ................... 41 Figure 14-4: Reset, Watchdog Timer, and
Figure 8-1: General Format for Instructions .................. 43 Device Reset Timer Timing -
Figure 10-1: Load Conditions - PIC16C52 ...................... 62 PIC16C54A .............................................. 114
Figure 10-2: External Clock Timing - PIC16C52 ............. 63 Figure 14-5: Timer0 Clock Timings - PIC16C54A ........ 115
Figure 10-3: CLKOUT and I/O Timing - PIC16C52......... 64 Figure 15-1: Load Conditions ....................................... 124
Figure 10-4: Reset and Device Reset Timer Timing - Figure 15-2: External Clock Timing - PIC16CR57B...... 125
PIC16C52 ................................................... 65 Figure 15-3: CLKOUT and I/O Timing -
Figure 10-5: Timer0 Clock Timings - PIC16C52 ............. 66 PIC16CR57B............................................ 127
Figure 11-1: Load Conditions - PIC16C54/55/56/57 ....... 74 Figure 15-4: Reset, Watchdog Timer, and Device
Figure 11-2: External Clock Timing - Reset Timer Timing - PIC16CR57B ......... 128
PIC16C54/55/56/57 .................................... 75 Figure 15-5: Timer0 Clock Timings - PIC16CR57B...... 129
Figure 11-3: CLKOUT and I/O Timing - Figure 16-1: Load Conditions - PIC16C58A,
PIC16C54/55/56/57 .................................... 77 PIC16LV58A............................................. 138
Figure 11-4: Reset, Watchdog Timer, and Figure 16-2: External Clock Timing - PIC16C58A ........ 139
Device Reset Timer Timing - Figure 16-3: CLKOUT and I/O Timing - PIC16C58A .... 141
PIC16C54/55/56/57 .................................... 78 Figure 16-4: Reset, Watchdog Timer, and
Figure 11-5: Timer0 Clock Timings - Device Reset Timer Timing -
PIC16C54/55/56/57 .................................... 79 PIC16C58A .............................................. 142
Figure 12-1: Typical RC Oscillator Frequency vs. Figure 16-5: Timer0 Clock Timings - PIC16C58A ........ 143
Temperature ............................................... 81 Figure 17-1: Load Conditions - PIC16CR58A............... 152
Figure 12-2: Typical RC Oscillator Frequency vs. Figure 17-2: External Clock Timing - PIC16CR58A...... 153
VDD, CEXT = 20 PF...................................... 82 Figure 17-3: CLKOUT and I/O Timing -
Figure 12-3: Typical RC Oscillator Frequency vs. PIC16CR58A............................................ 155
VDD, CEXT = 100 PF.................................... 82 Figure 17-4: Reset, Watchdog Timer, and
Figure 12-4: Typical RC Oscillator Frequency vs. Device Reset Timer Timing -
VDD, CEXT = 300 PF.................................... 82 PIC16CR58A............................................ 156
Figure 12-5: Typical IPD vs. VDD, Watchdog Disabled .... 83 Figure 17-5: Timer0 Clock Timings - PIC16CR58A...... 157
Figure 12-6: Maximum IPD vs. VDD, Figure 18-1: Typical RC Oscillator Frequency vs.
Watchdog Disabled..................................... 83 Temperature............................................. 159
Figure 12-7: Typical IPD vs. VDD, Watchdog Enabled..... 83 Figure 18-2: Typical RC Oscillator Frequency vs.
Figure 12-8: Maximum IPD vs. VDD, VDD, CEXT = 20 PF ................................... 160
Watchdog Enabled ..................................... 83 Figure 18-3: Typical RC Oscillator Frequency vs.
Figure 12-9: VTH (Input Threshold Voltage) of VDD, CEXT = 100 PF ................................. 160
I/O Pins vs. VDD .......................................... 84 Figure 18-4: Typical RC Oscillator Frequency vs.
Figure 12-10: VIH, VIL of MCLR, T0CKI and OSC1 VDD, CEXT = 300 PF ................................. 161
(in RC Mode) vs. VDD ................................. 84 Figure 18-5: Typical IPD vs. VDD, Watchdog
Figure 12-11: VTH (Input Threshold Voltage) of Disabled (25°C) ........................................ 161
OSC1 Input (in XT, HS, and LP modes) Figure 18-6: Typical IPD vs. VDD, Watchdog
vs. VDD........................................................ 84 Enabled (25°C)......................................... 162
Figure 12-12: Typical IDD vs. Frequency Figure 18-7: VTH (Input Threshold Voltage) of
(External Clock, 25°C) ................................ 85 I/O Pins vs. VDD ....................................... 162
Figure 12-13: Maximum IDD vs. Frequency Figure 18-8: VIH, VIL of MCLR, T0CKI and OSC1
(External Clock, –40°C to +85°C) ............... 85 (in RC Mode) vs. VDD ............................... 163
Figure 12-14: Maximum IDD vs. Frequency Figure 18-9: VTH (Input Threshold Voltage) of
(External Clock –55°C to +125°C) .............. 86 OSC1 Input (in XT, HS, and LP modes)
Figure 12-15: WDT Timer Time-out Period vs. VDD .......... 86 vs. VDD ..................................................... 163
Figure 12-16: Transconductance (gm) of Figure 18-10: Typical IDD vs. Frequency
HS Oscillator vs. VDD .................................. 86 (WDT dis, RC Mode @ 20 PF, 25°C) ....... 164
Figure 12-17: Transconductance (gm) of Figure 18-11: Maximum IDD vs. Frequency
LP Oscillator vs. VDD .................................. 87 (WDT Dis, RC Mode @ 20 PF,
Figure 12-18: IOH vs. VOH, VDD = 3 V ............................... 87 –40°C to +85°C) ....................................... 164

PIC16C5X
Figure 18-12: Typical IDD vs. Frequency LIST OF TABLES
(WDT Dis, RC Mode @ 100 PF, 25°C) ..... 165 Table 1-1: PIC16C5X Family of Devices ....................... 6
Figure 18-13: Maximum IDD vs. Frequency Table 3-1: Pinout Description - PIC16C52,
(WDT Dis, RC Mode @ 100 PF, PIC16C54s, PIC16CR54s, PIC16C56s,
–40°C to +85°C) ....................................... 165 PIC16CR56s, PIC16C58s, PIC16CR58s ... 11
Figure 18-14: Typical IDD vs. Frequency Table 3-2: Pinout Description - PIC16C55s,
(WDT Dis, RC Mode @ 300 PF, 25°C) ..... 166 PIC16C57s, PIC16CR57s .......................... 12
Figure 18-15: Maximum IDD vs. Frequency Table 4-1: Special Function Register Summary .......... 19
(WDT Dis, RC Mode @ 300 PF, Table 5-1: Summary of Port Registers ........................ 25
–40°C to +85°C) ....................................... 166 Table 6-1: Registers Associated With Timer0 ............. 28
Figure 18-16: WDT Timer Time-out Period vs. VDD ........ 167 Table 7-1: Capacitor Selection
Figure 18-17: Transconductance (gm) of For Ceramic Resonators - PIC16C5X,
HS Oscillator vs. VDD ................................ 168 PIC16CR5X ................................................ 33
Figure 18-18: Transconductance (gm) of Table 7-2: Capacitor Selection For Crystal
LP Oscillator vs. VDD ................................ 168 Oscillator - PIC16C5X, PIC16CR5X........... 33
Figure 18-19: Transconductance (gm) of Table 7-3: Reset Conditions for Special Registers ...... 36
XT Oscillator vs. VDD ................................ 168 Table 7-4: Reset Conditions for All Registers.............. 36
Figure 18-20: IOH vs. VOH, VDD = 3 V ............................. 169 Table 7-5: Summary of Registers Associated
Figure 18-21: IOH vs. VOH, VDD = 5 V ............................. 169 with the Watchdog Timer............................ 40
Figure 18-22: IOL vs. VOL, VDD = 3 V .............................. 169 Table 7-6: TO/PD Status After Reset .......................... 41
Figure 18-23: IOL vs. VOL, VDD = 5 V .............................. 169 Table 7-7: Events Affecting TO/PD Status Bits ........... 41
Figure 19-1: Load Conditions - Table 8-1: OPCODE Field Descriptions ...................... 43
PIC16C54B/CR54B/C56A/CR56A/ Table 8-2: Instruction Set Summary ............................ 44
C58B/CR58B, PIC16CR5X....................... 177 Table 9-1: Development Tools From Microchip........... 58
Figure 19-2: External Clock Timing - Table 10-1: External Clock Timing Requirements -
PIC16C5X, PIC16CR5X ........................... 178 PIC16C52 ................................................... 63
Figure 19-3: CLKOUT and I/O Timing - Table 10-2: CLKOUT and I/O Timing Requirements -
PIC16C5X, PIC16CR5X ........................... 180 PIC16C52 ................................................... 64
Figure 19-4: Reset, Watchdog Timer, and Table 10-3: Reset and Device Reset Timer -
Device Reset Timer Timing - PIC16C52 ................................................... 65
PIC16C5X, PIC16CR5X ........................... 181 Table 10-4: Timer0 Clock Requirements -
Figure 19-5: Timer0 Clock Timings - PIC16C52 ................................................... 66
PIC16C5X, PIC16CR5X ........................... 182 Table 11-1: Cross Reference of Device Specs for
Figure 20-1: Typical RC Oscillator Frequency vs. Oscillator Configurations (RC, XT & 10)
Temperature ............................................. 183 and Frequencies of Operation
Figure 20-2: Typical RC Oscillator Frequency vs. (Commercial Devices) ................................ 68
VDD, CEXT = 20 PF .................................... 184 Table 11-2: Cross Reference of Device Specs for
Figure 20-3: Typical RC Oscillator Frequency vs.
Oscillator Configurations (HS, LP & JW)
VDD, CEXT = 100 PF .................................. 184
and Frequencies of Operation
Figure 20-4: Typical RC Oscillator Frequency vs.
(Commercial Devices) ................................ 68
VDD, CEXT = 300 PF .................................. 185
Table 11-3: External Clock Timing Requirements -
Figure 20-5: Typical IPD vs. VDD, Watchdog
PIC16C54/55/56/57 .................................... 75
Disabled (25°C) ........................................ 185
Table 11-4: CLKOUT and I/O Timing Requirements -
PIC16C54/55/56/57 .................................... 77
Enabled (25°C) ......................................... 186
Table 11-5: Reset, Watchdog Timer, and Device
Reset Timer - PIC16C54/55/56/57 ............. 78
Enabled (–40°C, 85°C) ............................. 186
Table 11-6: Timer0 Clock Requirements -
Figure 20-8: VTH (Input Threshold Trip Point Voltage)
PIC16C54/55/56/57 .................................... 79
of I/O Pins vs. VDD .................................... 187
Table 12-1: RC Oscillator Frequencies ......................... 81
Figure 20-9: VIH, VIL of MCLR, T0CKI and OSC1
Table 12-2: Input Capacitance for PIC16C54/56........... 88
(in RC Mode) vs. VDD ............................... 187
Table 12-3: Input Capacitance for PIC16C55/57........... 88
Figure 20-10: VTH (Input Threshold Trip Point Voltage)
Table 13-1: Cross Reference of Device Specs for
of OSC1 Input (in XT, HS, and LP modes)
Oscillator Configurations and Frequencies
vs. VDD ...................................................... 188
of Operation (Commercial Devices) ........... 90
Figure 20-11: Typical IDD vs. Frequency
(WDT dis, RC Mode @ 20 PF, 25°C)........ 188
PIC16CR54A .............................................. 97
(WDT Dis, RC Mode @ 100 PF, 25°C) ..... 189
PIC16CR54A .............................................. 99
(WDT Dis, RC Mode @ 300 PF, 25°C) ..... 189
Reset Timer - PIC16CR54A ..................... 100
Figure 20-14: WDT Timer Time-out Period vs. VDD ........ 190
Figure 20-15: IOH vs. VOH, VDD = 3 V ............................. 191
PIC16CR54A ............................................ 101
Figure 20-16: IOH vs. VOH, VDD = 5 V ............................. 191
Figure 20-17: IOL vs. VOL, VDD = 3 V .............................. 191
Figure 20-18: IOL vs. VOL, VDD = 5 V .............................. 191
of Operation (Commercial Devices) ......... 104

PIC16C5X
PIC16C54A............................................... 111
PIC16C54A............................................... 113
Reset Timer - PIC16C54A ........................ 114
PIC16C54A............................................... 115
of Operation (Commercial Devices).......... 118
PIC16CR57B ............................................ 125
PIC16CR57B ............................................ 127
Reset Timer - PIC16CR57B ..................... 128
PIC16CR57B ............................................ 129
PIC16C58A............................................... 139
PIC16C58A............................................... 141
Reset Timer - PIC16C58A ........................ 142
PIC16C58A............................................... 143
PIC16CR58A ............................................ 153
PIC16CR58A ............................................ 155
Reset Timer - PIC16CR58A ..................... 156
PIC16CR58A ............................................ 157
Table 18-1: RC Oscillator Frequencies........................ 159
Table 18-2: Input Capacitance for
PIC16C54A/C58A..................................... 167
PIC16C5X, PIC16CR5X ........................... 178
PIC16C5X, PIC16CR5X ........................... 180
Reset Timer - PIC16C5X, PIC16CR5X .... 181
Table 19-5: Timer0 Clock Requirements - PIC16C5X,
PIC16CR5X .............................................. 182
Table 20-1: RC Oscillator Frequencies........................ 183
Table 20-2: Input Capacitance for
PIC16C54s/C58s ...................................... 190

PIC16C5X
NOTES:

PIC16C5X
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To provide you with the most responsive service possible, which is 7E1.
the Microchip systems team monitors the BBS, posts 2. Dial your local CompuServe access number.
the latest component data and software tool updates, 3. Depress the <Enter> key and a garbage string will
provides technical help and embedded systems appear because CompuServe is expecting a 7E1
insights, and discusses how Microchip products pro- setting.
vide project solutions. 4. Type +, depress the <Enter> key and “Host Name:”
The web site, like the BBS, is used by Microchip as a will appear.
means to make files and information easily available to 5. Type MCHIPBBS, depress the <Enter> key and you
customers. To view the site, the user must have access will be connected to the Microchip BBS.
to the Internet and a web browser, such as Netscape or In the United States, to find the CompuServe phone
Microsoft Explorer. Files are also available for FTP number closest to you, set your modem to 7E1 and dial
download from our FTP site. (800) 848-4480 for 300-2400 baud or (800) 331-7166
Connecting to the Microchip Internet Web Site for 9600-14400 baud connection. After the system
The Microchip web site is available by using your responds with “Host Name:”, type NETWORK, depress
favorite Internet browser to attach to: the <Enter> key and follow CompuServe's directions.
www.microchip.com For voice information (or calling from overseas), you
The file transfer site is available by using an FTP ser- may call (614) 723-1550 for your local CompuServe
vice to connect to: number.
Microchip regularly uses the Microchip BBS to distribute
ftp://ftp.futureone.com/pub/microchip
technical information, application notes, source code,
The web site and file transfer site provide a variety of errata sheets, bug reports, and interim patches for
services. Users may download files for the latest Microchip systems software products. For each SIG, a
Development Tools, Data Sheets, Application Notes, moderator monitors, scans, and approves or disap-
User's Guides, Articles and Sample Programs. A vari- proves files submitted to the SIG. No executable files
ety of Microchip specific business information is also are accepted from the user community in general to
available, including listings of Microchip sales offices, limit the spread of computer viruses.
distributors and factory representatives. Other data
available for consideration is: Systems Information and Upgrade Hot Line
• Latest Microchip Press Releases The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
• Technical Support Section with Frequently Asked Microchip's development systems software products.
Questions Plus, this line provides information on how customers
• Design Tips can receive any currently available upgrade kits.The
• Device Errata Hot Line Numbers are:
• Job Postings 1-800-755-2345 for U.S. and most of Canada, and
• Microchip Consultant Program Member Listing 1-602-786-7302 for the rest of the world.
• Links to other useful web sites related to
Microchip Products 970301
Connecting to the Microchip BBS Trademarks: The Microchip name, logo, PIC, PICSTART,
PICMASTER and PRO MATE are registered trademarks
Connect worldwide to the Microchip BBS using either of Microchip Technology Incorporated in the U.S.A. and
the Internet or the CompuServe communications net- other countries. FlexROM, MPLAB and fuzzyLAB, are
work. trademarks and SQTP is a service mark of Microchip in
Internet: the U.S.A.
You can telnet or ftp to the Microchip BBS at the fuzzyTECH is a registered trademark of Inform Software
Corporation. IBM, IBM PC-AT are registered trademarks
address: mchipbbs.microchip.com of International Business Machines Corp. Pentium is a
trademark of Intel Corporation. Windows is a trademark
CompuServe Communications Network: and MS-DOS, Microsoft Windows are registered trade-
When using the BBS via the Compuserve Network, marks of Microsoft Corporation. CompuServe is a regis-
in most cases, a local call is your only expense. The tered trademark of CompuServe Incorporated.
Microchip BBS connection does not use CompuServe All other trademarks mentioned herein are the property of
membership services, therefore you do not need their respective companies.
CompuServe membership to join Microchip's BBS.
There is no charge for connecting to the Microchip BBS.

PIC16C5X
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578.
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.
To: Technical Publications Manager Total Pages Sent

RE: Reader Response
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________ FAX: (______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device: PIC16C5X Literature Number: DS30453A
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
8. How would you improve our software, systems, and silicon products?

PIC16C5X
PIC16C5X PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. -XX X /XX XXX
Examples:
Device Frequency Temperature Package Pattern a) PIC16C54A -04/P 301 = Commercial
Range Range temp., PDIP package, 4MHz, normal VDD
limitis, QTP pattern #301.
Device PIC16C5X(2), PIC16C5XT(3)
b) PIC16LC58A - 04I/SO = Industrial temp.,
PIC16LC5X(2), PIC16LC5XT(3)
SOIC package, 4MHz, Extended VDD
PIC16CR5X(2), PIC16CR5XT(3)
limits.
PIC16LCR5X(2), PIC16LCR5XT(3)
PIC16LV5X(2), PIC16LV5XT(3) c) PIC16CR54A - 10I/P355 = ROM program
memory, Industrial temp., PDIP package,
Frequency 02 = 2 MHz 10MHz, normal VDD limits.
Range 04 = 4 MHz
10 = 10 MHz
20 = 20 MHz Note 1: b = blank
b(1) = No type for JW(4) devices 2: C = Standard VDD range
LC = Extended VDD range
Temperature b(1) = 0°C to +70°C (Commercial)
CR = ROM Version, Standard VDD
Range I = -40°C to +85°C (Industrial)
range
E = -40°C to +125°C (Automotive)
LCR = ROM Version, Extended VDD
Package JW = Windowed CERDIP range
P = PDIP LV = Low Voltage VDD range
SO = SOIC (Gull Wing, 300 mil body) 3: T = in tape and reel - SOIC, SSOP
SP = Skinny PDIP (28-pin, 300 mil body) packages only.
SS = SSOP (209 mil body) 4: UV erasable devices are tested to all
available voltage/frequency options.
Pattern 3-digit Pattern Code for QTP, ROM (blank otherwise) Erased devices are oscillator type
04. The user can select 04, 10 or 20
oscillators by programmng the appro-
priate configuration bits.

PIC16C5X
PIC16C54/55/56/57 PRODUCT IDENTIFICATION SYSTEM
To order or obtain information (e.g., on pricing or delivery) refer to the factory or the listed sales office.
PART NO. -XX X /XX XXX
Device Oscillator Temperature Package Pattern Examples:

Type Range
a) PIC16C54 - XT/PXXX = "XT" oscillator,
Device PIC16C54, PIC16C54T(2) commercial temp., PDIP, QTP pattern.
PIC16C55, PIC16C55T(2) b) PIC16C55 - XTI/SO = "XT" oscillator,
PIC16C56, PIC16C56T(2) industrial temp., SOIC (OTP device)
PIC16C57, PIC16C57T(2) c) PIC16C55 /JW = Commercial temp.
CERDIP with window.
Oscillator Type RC = Resistor Capacitor
LP = Low Power Crystal d) PIC16C57 - RC/S = "RC" oscillator, com-
XT = Standard Crystal/Resonator mercial temp., dice in waffle pack.
HS = High Speed Crystal
10 = 10 MHz Crystal
b(1) = No type for JW(3) devices
Note 1: b = blank
Temperature b(1) = 0°C to +70°C (Commercial)
2: T = in tape and reel - SOIC, SSOP
Range I = -40°C to +85°C (Industrial)
E = -40°C to +125°C (Automotive) packages only.
3: UV erasable devices are tested to all
Package JW = Windowed CERDIP available voltage/frequency options.
P = PDIP Erased devices are oscillator type RC.
S = Die in Waffle Pack The user can select RC, LP, XT or HS
SO = SOIC (Gull Wing, 300 mil body) oscillators by programming the appro-
SP = Skinny PDIP (28 pin, 300 mil body) priate configuration bits.
SS = SSOP (209 mil body)
Pattern 3-digit Pattern Code for QTP (blank otherwise)
Sales and Support

Products supported by a preliminary Data Sheet may possibly have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office (see below)
2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277
3. The Microchip’s Bulletin Board, via your local CompuServe number (CompuServe membership NOT required).
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
For latest version information and upgrade kits for Microchip Development Tools, please call 1-800-755-2345 or 1-602-786-7302.

PIC16C5X
NOTES:

PIC16C5X
NOTES:

PIC16C5X
NOTES:
 1997 Microchip Technology Inc. DS30453A-page 219

WORLDWIDE SALES & SERVICE
AMERICAS ASIA/PACIFIC EUROPE
Corporate Office Hong Kong United Kingdom
Microchip Technology Inc. Microchip Asia Pacific Arizona Microchip Technology Ltd.
2355 West Chandler Blvd. RM 3801B, Tower Two Unit 6, The Courtyard
Chandler, AZ 85224-6199 Metroplaza Meadow Bank, Furlong Road
Tel: 602-786-7200 Fax: 602-786-7277 223 Hing Fong Road Bourne End, Buckinghamshire SL8 5AJ
Technical Support: 602 786-7627 Kwai Fong, N.T., Hong Kong Tel: 44-1628-851077 Fax: 44-1628-850259
Web: http://www.microchip.com Tel: 852-2-401-1200 Fax: 852-2-401-3431 France
Atlanta India Arizona Microchip Technology SARL
Microchip Technology Inc. Microchip Technology India Zone Industrielle de la Bonde
500 Sugar Mill Road, Suite 200B No. 6, Legacy, Convent Road 2 Rue du Buisson aux Fraises
Atlanta, GA 30350 Bangalore 560 025, India 91300 Massy, France
Tel: 770-640-0034 Fax: 770-640-0307 Tel: 91-80-299-4036 Fax: 91-80-559-9840 Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Boston Korea Germany
Microchip Technology Inc. Microchip Technology Korea Arizona Microchip Technology GmbH
5 Mount Royal Avenue 168-1, Youngbo Bldg. 3 Floor Gustav-Heinemann-Ring 125
Marlborough, MA 01752 Samsung-Dong, Kangnam-Ku D-81739 Müchen, Germany
Tel: 508-480-9990 Fax: 508-480-8575 Seoul, Korea Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Chicago Tel: 82-2-554-7200 Fax: 82-2-558-5934 Italy
Microchip Technology Inc. Shanghai Arizona Microchip Technology SRL
333 Pierce Road, Suite 180 Microchip Technology Centro Direzionale Colleone
Itasca, IL 60143 RM 406 Shanghai Golden Bridge Bldg. Palazzo Taurus 1 V. Le Colleoni 1
Tel: 630-285-0071 Fax: 630-285-0075 2077 Yan’an Road West, Hongiao District 20041 Agrate Brianza
Dallas Shanghai, PRC 200335 Milan, Italy
Tel: 86-21-6275-5700 Tel: 39-39-6899939 Fax: 39-39-6899883
Microchip Technology Inc.
Fax: 86 21-6275-5060
14651 Dallas Parkway, Suite 816
Dallas, TX 75240-8809 Singapore
Tel: 972-991-7177 Fax: 972-991-8588 Microchip Technology Taiwan
Dayton Singapore Branch JAPAN
200 Middle Road Microchip Technology Intl. Inc.
#10-03 Prime Centre Benex S-1 6F
Two Prestige Place, Suite 150
Singapore 188980 3-18-20, Shin Yokohama
Miamisburg, OH 45342
Tel: 65-334-8870 Fax: 65-334-8850 Kohoku-Ku, Yokohama
Tel: 937-291-1654 Fax: 937-291-9175
Los Angeles Taiwan, R.O.C Kanagawa 222 Japan
Microchip Technology Taiwan Tel: 81-4-5471- 6166 Fax: 81-4-5471-6122
10F-1C 207
18201 Von Karman, Suite 1090 3/24/97
Tung Hua North Road
Irvine, CA 92612
Taipei, Taiwan, ROC
Tel: 714-263-1888 Fax: 714-263-1338
Tel: 886 2-717-7175 Fax: 886-2-545-0139
New York
150 Motor Parkway, Suite 416
Hauppauge, NY 11788
Tel: 516-273-5305 Fax: 516-273-5335
San Jose
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
5925 Airport Road, Suite 200
Mississauga, Ontario L4V 1W1, Canada
Tel: 905-405-6279 Fax: 905-405-6253
All rights reserved.  1997, Microchip Technology Incorporated, USA.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. No repre-
sentation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement
of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not autho-
rized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and
name are registered trademarks of Microchip Technology Inc. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.
DS30453A - page 220  1997 Microchip Technology Inc.

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M EPROM/ROM-Based 8-Bit CMOS Microcontroller Series

 1997 Microchip Technology Inc. Preliminary DS30453A-page 1

RA2 •1 18 RA1 T0CKI •1 28 MCLR/VPP

RA2 •1 20 RA1 VSS •1 28 MCLR/VPP

DS30453A-page 2 Preliminary  1997 Microchip Technology Inc.

 1997 Microchip Technology Inc. Preliminary DS30453A-page 3

DS30453A-page 4 Preliminary  1997 Microchip Technology Inc.

 1997 Microchip Technology Inc. Preliminary DS30453A-page 5

PIC16CR56s PIC16C57s PIC16CR57s PIC16C58s PIC16CR58s

DS30453A-page 6 Preliminary  1997 Microchip Technology Inc.

2.2 One-Time-Programmable (OTP)

 1997 Microchip Technology Inc. Preliminary DS30453A-page 7

DS30453A-page 8 Preliminary  1997 Microchip Technology Inc.

 1997 Microchip Technology Inc. Preliminary DS30453A-page 9

9-11 T0CKI OSC1 OSC2 MCLR

RA3:RA0 RB7:RB0 RC7:RC0

DS30453A-page 10 Preliminary  1997 Microchip Technology Inc.

DIP, SOIC SSOP I/O/P Input

 1997 Microchip Technology Inc. Preliminary DS30453A-page 11

DIP, SOIC SSOP I/O/P Input

DS30453A-page 12 Preliminary  1997 Microchip Technology Inc.

FIGURE 3-2: CLOCK/INSTRUCTION CYCLE

EXAMPLE 3-1: INSTRUCTION PIPELINE FLOW

1. MOVLW 55H Fetch 1 Execute 1

 1997 Microchip Technology Inc. Preliminary DS30453A-page 13

DS30453A-page 14 Preliminary  1997 Microchip Technology Inc.

vector for the PIC16C56s and PIC16CR56s is at On-chip Program 0FFh

PIC16CR57s, PIC16C58s, and PIC16CR58s is at 1FFh

FIGURE 4-1: PIC16C52 PROGRAM On-chip Program 2FFh

PC<8:0> Reset Vector 3FFh

Reset Vector 17Fh

 1997 Microchip Technology Inc. Preliminary DS30453A-page 15

Reset Vector 7FFh

DS30453A-page 16 Preliminary  1997 Microchip Technology Inc.

4.2.1 GENERAL PURPOSE REGISTER FILE

The register file is accessed either directly or indirectly

 1997 Microchip Technology Inc. Preliminary DS30453A-page 17

1Fh 3Fh 5Fh 7Fh

FIGURE 4-7: PIC16C58s/CR58s REGISTER FILE MAP

1Fh 3Fh 5Fh 7Fh

Note 1: Not a physical register. See Section 4.7

DS30453A-page 18 Preliminary  1997 Microchip Technology Inc.

TABLE 4-1: SPECIAL FUNCTION REGISTER SUMMARY

 1997 Microchip Technology Inc. Preliminary DS30453A-page 19

FIGURE 4-8: STATUS REGISTER (ADDRESS:03h)

R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x

DS30453A-page 20 Preliminary  1997 Microchip Technology Inc.

FIGURE 4-9: OPTION REGISTER

U-0 U-0 W-1 W-1 W-1 W-1 W-1 W-1

000 1:2 1:1

 1997 Microchip Technology Inc. Preliminary DS30453A-page 21

DS30453A-page 22 Preliminary  1997 Microchip Technology Inc.

The Program Counter is set upon a RESET, which

 1997 Microchip Technology Inc. Preliminary DS30453A-page 23

FIGURE 4-13: DIRECT/INDIRECT ADDRESSING

bank select location select bank location select

Addresses map back

1Fh 3Fh 5Fh 7Fh

Note 1: For register map detail see Section 4.2.

DS30453A-page 24 Preliminary  1997 Microchip Technology Inc.