Oppo A73 CPH1725 Servicemanual
Oppo A73 CPH1725 Servicemanual
Oppo A73 CPH1725 Servicemanual
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Contents
A. Guidance ..................................................................................................................................................................... 2
D. Disassemble process.............................................................................................................................................. 11
E. Assembly procedure................................................................................................................................................19
F. Materials prepared for loss and all whole device assembly components............................................... 24
G. Attention.................................................................................................................................................................... 25
Confidential files
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No spreading
A. Guidance
The purpose of this document is to help OPPO levels 1 and 2 maintenance technicians to carry out service to
OPPO products. This Service Manual is to be used only by authorized OPPO maintenance service centers, and
the content is confidential. Please note that OPPO provides also other guidance documents (e.g. Technical
Service Notice) for maintenance service cooperative corporations, therefore, please follow these regularly and
comply with the given instructions. While every endeavor has been made to ensure the accuracy of this
document, some errors may exist. If you find any errors or if you have further suggestions, please notify OPPO
using the address below:[email protected]. Please keep in mind also that this documentation is continuously
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being updated and modified, please keep watching out for the newest version.
Please refer to the handset's user guide for instructions relating to operation, service and maintenance
Warnings:
1. Service centers may be required to install the handset's vehicle-mounted system in vehicles. Under certain
fault conditions, the handset's RF signals may affect the operation of the vehicles' electric power management
systems and anti – skid braking systems (ABSs). If necessary, consult the vehicle dealer/manufacturer to
2. The handset must not be operated in areas likely to contain potentially explosive atmospheres, such as petrol
3. Operation of any radio transmitting equipment, including handsets, may interfere with the functionality of
the medical devices protected by industrial mechanisms. Consult the manufacturer of the medical device if
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Attention:
2. Ensure all work is carried out at an anti-static workstation and that an anti-static
3. Use only approved materials as specified in the bill of materials (BOM) list.
4. Ensure all components, screws and insulators are correctly re-fitted after maintenance and calibration.
Electrostatic discharge can easily damage the sensitive components of electronic products. Therefore,
every service center has to take care of OPPO's ESD protection requirements. Also see ESD Protection
※In this section the technician will get some general hints to carry out repairs:
Customer service personnel can download and read product documentation on : Download and read the
Before starting the repair, you must enter the ESD Protected Area and connect your wristband. Use gloves
to avoid corrosion and fingerprints. Protect windows and display screens with a film to avoid dust and scratches.
When cleaning the metal pads, you have to use a soft cloth/ESD brush and isopropanol. It is not allowed to use
an eraser because it scratches the surface and will lead later on to oxidation and corrosion. Mechanical parts
(except shielding covers and bent parts), which cannot be repaired in the event of a failure, can only be
replaced, if they are not soldered. After removing and maintaining the shielding covers, make sure to replace
them with new ones. Otherwise, the high-frequency leakage can have an influence on the device. Always use
original OPPO spare parts. Check the soldering joints of the parts, which are concerned regarding the indicated
error (e.g. soldered connectors or switches) and re-solder them if necessary (only repair centers that can
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conduct lead-free soldering). Remove redundant soldering flux after soldering. Assemble the handset with the
Always use your own equipment for testing where you are sure that it works. For complaints about charger
function, please test the handset with your own charger to be sure if the handset or charger causes the
malfunction. When doing the fault log entries, always note the fault code, which caused the malfunction. The
accuracy of this code will be a great help to quality improvement. Also, fill in the replaced part, if needed.
Many service documents are available on the FTP server, which will be notified via email. Please note that the
documents shall be updated in time.
1. Product Introduction
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Screen Specifications or parameters
Operating
Operating system Android 7.1 + ColorOS 3.2
system
RAM 3G LPDDR3
Storage
ROM 32G eMMC
Front 16MP
Camera
real 13MP
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TD-LTE: B38/B39/B40/B41
bluetooth BT4.2
Date
WIFI 2.4G/5G
headset MH133
Adapter 5V 2A
Note: This table lists a portion of parameters only. For details, please refer to the OPPO Smartphone
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Specification Comparison List.
2. Introduction to machine components
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3. Decomposition of materials
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Touch screen protection soft film DC023 HD 1 pcs
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Note: This table is only used for annotating the names of parts. To prepare materials, please refer to the
material codes in the Price List of Common After-sales Materials and Fittings
4. Material pictures
4901208
4901206
1 4901204 Battery cover assembly
4901202
4901211
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3880919 Battery BTB fixing support
semi-finished products
13 4961546
(small board)
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9670506 Y board
19 8520145 Receiver
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Declaration: This table is only used for comparing the fittings with real objects. To prepare materials, the
customer service center shall refer to the material codes in the Price List of Common After-sales Materials and
Fittings.
D. Disassemble process
1. Disassemble tools
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Disassemble the main tools required as shown above: static ring (static gloves), disassemble the bar
(disassemble), plastic tweezers, SIM card thimble, electric screwdriver (crosses). Also need clean cloth, fishing
line, alcohol syringe, low adhesive protective film.
2. Ready to work
1) The mobile phone must be forcibly powered off before disassembly and cannot be powered off by
using the power off option of the system, to completely cut the system power supply, thereby
protecting the electronic components to the greatest degree.
2) The handset can be forcibly powered off by: pressing and holding the power key+ upper volume
key for about 8 seconds until the screen is off.。
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3. Disassemble process
——Disassemble the battery cover with a disassemble bar, first open the lower right
corner of the battery cover;
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——Hand from the back of the battery cover to open the right side, pay attention to
the action to be careful to avoid damage to the fingerprint FPC
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——Use the disassemble bar to pry the fingerprint BTB bracket in the upper right
corner of the dismantling bit, with a thumb and hold the gently pry the bracket;
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— — With plastic tweezers to remove the back of the lower left corner of the screws
waterproof PET film, the sound box on the conductive cloth, the motherboard bracket conductive;
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——Respectively, with plastic tweezers lever the battery BTB bracket and display BTB
bracket left, remove the two brackets;
——From the top of the motherboard bracket at the top of the gap apart dismantling
note:
Disassemble the battery BTB bracket, display BTB bracket, motherboard support when the action should
be slow and careful to avoid the bracket hook end deformation
5. Remove the battery, sound chamber BOX, RF cable, motherboard and camera, small board
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——Disassemble the battery BTB, the U board BTB and the display screen BTB
——In the battery and the lid on the left and right side of the gap were injected
with 1 drop of alcohol
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——Tear off the battery compartment to tear the paper, with plastic tweezers to
tear the bottom of the battery compartment to support the foam
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-- Respectively, from the motherboard side and small board open RF line buckle to
remove the RF line;
-- From the left side of the motherboard tilt to remove the motherboard, separate BTB
buckle under the front camera (before dismantling the front of the camera to tear off the conductive fabric) and
rear camera;
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-- Open the U board and small board BTB buckle, from the bottom of the board slowly
breaking off the small plate, after the demolition need be careful to remove residual glue between the plate
and the cover。
note:
1. It needs to drop alcohol when removing battery, one side one drop, not too much;
2. Pull up the handle to be slowly and carefully, try to avoid battery deformation;
3. Small plate and the cover between the double-sided adhesive is relatively tight, breaking off the
dismantling should be slow, to avoid deformation or even small plate deformation;
4. Remove the motherboard to pick up from the left, and finally separate the right side of the motherboard
and the cover of the buckle;
5. The removed battery only can be reused with the new tear paper is attached
6. Remove the side keys, motor, receiver, Y board
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--Use plastic tweezers to remove the volume keys, power key PET film;;
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——Pry the two side keys, and then slowly tear off the paste of
the FPC, and then pry the motor removed (pay attention to the motor under the FPC cover with a removable
mouth is easy to operate), with tweezers pry up the receiver;
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note:
Use the release paper to cover the exposed gum, dismantling down the volume keys FPC, power button FPC,
motor, receiver, Y board should be scrapped。
7. At this point, all machine materials are dismantled. All parts of the machine as shown below
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Motherboard
battery Support Display BTB
motherboard bracket
Speaker BOX
receiver Fingerprint
module Light
sensitive
silicone case
Screen
Y board USB Silicone
Case
Rf line
Top cover
Battery
cover
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E. Assembly procedure
1. Install top cover assembly, tear off 2pcs release paper on power key FPC, volume key FPC and the side, tear
off 1pcs release paper below the sub mic foam.
2. Install the key FPC, mount the power button FPC: first put the gold finger one end, and then Smooth down
the FPC well, affixed to the upper cover side wall.V board must be placed in the positioning slot at once,
and check if placed in place . Mounting volume key FPC: first put the gold finger one end, and then the
FPC will be good, and then the dome piece affixed.
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Note :that the corner can not be drum, close to the wall, dome piece positioning column must be
aligned
3. Install Receiver,Take top cover components, remove the receiver hole release paper, use a magnet to take
receiver and put in the hole notice that the shrapnel is coming down on the receiver
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4. The motherboard installed Front and rear Front and rear the camera, the first installed front camera, after
aligning BTB , then input into supported cushion which cannot be tilt and bump; after installing rear
camera, align BTB well and install the main board as the following picture; the cushion can not be tilt and
bump;
5. Install motherboard,take top cover components,Tear off the screen FPC on the beauty-profile paper
and the camera hole of the beauty-profile paper, check the camera hole whether is dirty, firstly use ion air
gun blowing away the dust then clean with clean cloth. Before tearing the front release paper, insert the
right side of the motherboard into the card slot, install it on the cover assembly, and then install the rear
camera body into the
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6. Install small board,Tear off upper cover small board position’s 2PCS paper and the paper below screen
FPC, take the small board, check and tear apart the mic hole release paper, check if there is leakage of the
headset silicone sleeve or not, align A board along the right buckle, position it well and tiltedly insert, then
install it into top cover assembly by aligning with the left positioning pillar and then according to the left
positioning column correctly loaded in the top cover components. And then the screen BTB buckle to the
motherboard, from the bottom to up smooth the display FPC .
Note: Firstly press the display BTB, then smooth screen FPC
7. Tear off the U-board under the release paper, take the pre-bending U board, first buckle in the
motherboard side BTB, and then buckle to the small board side BTB, and finally push the upper and lower
ends of the battery compartment side wall into 90 degrees , And finally smooth U board FPC well from the
bottom to up。
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Note: press the BTB, and then smooth FPC
8. Buckle RF Line,Take the RF line, first buckle the motherboard RF seat, and then buckle small board, the RF
line board side of the card into the card was inside, and then one end of the board toward the small board
side into the cover RF slot
9. Install battery
1)Remove 2pcs paper from the battery compartment, and check the battery compartment no other
foreign bodies, there are no bumps and batches of the front, RF line can not run the outlet groove.
2)Take battery,Check the appearance of no bad, no damage scratch, poor leakage:
A. Lie flat the battery on the anti-static table, with the pull-position towards the right, then tear off the
plastic paper;
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B. Align the left side of the adhesive part of tape with the left side of battery, press to attach well, and
keep in mind to avoid bubbles and folds;
C. Tear off the plastic paper on the right, then attach on the right part of battery;
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D. Take up the battery and smooth other unattached areas with fingers;
3)The battery BTB buckle to the top cover components corresponding to BTB buckle position, and then the battery into
the cover battery compartment, from the left and the bottom of the battery compartment installed (check the battery
compartment with or without foreign body, screws and other bad)
Battery assembly method: first battery BTB buckle, and then the battery into the battery compartment
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10. Then install the speaker box, cover bracket, screw, buckle the battery cover and then the battery cover to
the top cover, the first buckle the head, then buckle the bottom, and then into the battery cover buckle
pressure tooling buckle
Way: from top to bottom buckle
1 2
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3 4
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assembly components
Screw
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Front camera Motherboard bracket USB FPC conductive
conductive cloth conductive cloth cloth
Screw anti-water PET Fingerprint anti-water Battery cushion Volume keys PET film
film PET piece
Note: After the parts highlighted red in the table are disassembled, they need to be scrapped. If refastening the
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G. Attention
a) All auxiliary materials, including the double-sided adhesive, graphite sheet, copper foil, conductive
fabric and foam can't be reused once disassembled;
b) Once removed, all the appearance parts need to undergo appearance verification, and can be used
only after it is confirmed that the appearance is intact;
c) All the electronic components should be tested for functionality before put into use again’
d) The disassembled components need to be marked according to the general specifications, and
defective products must be marked with an defective product mark so that they won't be used by
mistake.
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After maintenance, identify the faults described by the user and test other functions of the handset.
When the handset proves qualified after testing, return it to the user.
1. Appearance Inspection
1.1. Verify whether the handset display screen has abnormalities such as stains, wide gap, cracked shell,
cracked key, scratch and whether the USB port falls off.
2. Function Inspection
2.1. Eject the SIM card tray with an eject pin and insert two SIM cards, and the handset will automatically
reboot or you need to tap "Reboot".
2.2. The handset reboots and enters the idle screen. Tap the dialing icon and enter *#808# on the dial pad
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to enter the engineering mode. In the engineering mode, select the assembly test items:
2.3. Tap Assembly Test 2 to automatically initiate the vibration test. Draw the handset near the ear to verify
whether there is vibration, noise and cracking voice. If no, tap Succeed.
Automatically initiate "Whether the antenna plate matches the main board", and the system will
conduct automatic detection. If the detection is successful, the following information will be displayed:
"Detect the battery cover successfully. The A board matches successfully. The screen matches the main
board. Pass!"!!”
;
Automatically enter “WLAN Setting” , open WLAN AND search the internet, tap connect. If WIFI test
is succeeded, system will automatically jump to next step; if no jumps then the WIFI test is failed;
Automatically initiate "Search Bluetooth Device", and the system will automatically conduct the switch
test on the Bluetooth device. If the test is successful, the system will automatically enter the
"Engineering Mode". Otherwise, the system will not jump automatically.
Automatically enter the “Engineering Mode” and start SIM test. Verify whether the Pass information
is displayed on both SIM cards 1 and 2. If yes, the handset is functional;
After the succeed of last test, enter the “Engineering Mode” and start OTG test. Insert USB to start
automatic test. System will check the USB every 3 seconds. If the check failed all 7 times, "FAIL" will be
displayed. If the check succeeds once, "PASS" will be displayed and the check process will stop!
When Assembly Test 2 is completed, the "Failed Automatic Test Record" will be displayed.
2.4. Select Assembly Test 3 to automatically initiate the touch screen test. It is forbidden to touch the
screen or key in the test process. If the test is successful, the PASS information will be displayed and
the system will automatically initiate the light intensity induction test.
Automatically initiate the light intensity induction test. Shield the upper left corner of the handset by
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hand, and the light intensity induction value will automatically decrease. Move your hand away, and
the value will automatically increase. The screen brightness value will decrease or increase accordingly.
When the light intensity induction value is less than 10, the test is successful and the system
automatically initiates the "GSensor" test.
In the "GSensor" test, rotate the handset along the X, Y and Z axis to test the gravity sensor. If the test
is successful, the PASS information will be displayed.
2.5. Select Assembly Test 4 to initiate the "Charger" test. Insert the charger. If the test is successful, the
PASS information will be displayed.
2.6. Quit the engineering mode, tap to enter music play interface, play music, insert headsets, verify if there
is any external sounds, and if the headsets can be recognized by the handset; Rotate headphones
twice in circle, listen if the sound is unilateral, verify the left and right sound volume are equal, and
there is no broken sound, noise, distortion, small volume and music stop and other defects; Listen at
least three lines to verify if the system displays volume changes. Press the pause key of the headset to
stop playing music. When listening to the music through headsets, do not listen to the prelude solely,
human voices must be heard.
2.7. Input *#808# to enter the engineering mode, select media adjusting test, Receiver test. Openreceiver.
Verify that it has no broken sound, noises, aliasing, low volume and other defects.
2.8. Select assembly test items and initiate Assembly Test 6. Then, adjust the screen brightness to observe
whether the brightness changes. If the test is successful, initiate the breathing light test.
Tap "Initiate the Breathing Light Test" to verify whether foreign matter exists inside the breathing light
on the upper left corner of the screen and whether the breathing light is not working. Tap "Breathing
Light Flicker" to verify whether the breathing light is not flickering and whether foreign matter exists
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inside the breathing light. If no abnormalities are found, tap Succeed to automatically proceed to the
screen test.
In the screen test, verify the screen for bright dot, bright line, black dot, black line and abnormal
display. If the test is successful, the system automatically initiates the "Key Backlight" test.
In the "Key Backlight" test, turn on and off the key backlight alternatively to verify whether the key
backlight at the bottom of the handset can be turned on and off normally, the brightness is uneven,
foreign matter exists inside the key backlight or the key cannot be turned on but the backlight can be
turned on.
2.9. When the screen is turned on, eject the SIM card tray with the eject pin and replace the card 2 with the
T card. Allow the handset to automatically reboot or tap "Reboot" to enter the handset desktop. On
the desktop, select "Document Management" to verify whether the system identifies the T card.
2.10. Tap to enter photo mode. Switch to front camera. Cover black surface of Black-White board
completely over front-camera lens. Verify that screen area has no bright dots or lines. Cover white
surface of Black-White board completely over front-camera lens. Verify that the screen has no obvious
black shadow or black dots or other defects. Take photos by targeting the camera to the light to verify
that there is no defects like exposure; Switch to rear camera, put the handset to the workbench (with
screen-off), verify that there are no bright dots, lines and abnormal display of the screen; Take photo
by targeting the handset to the whit board, verify that there are no defects like obvious dark shadow
or dark dots of the screen. Shoot photos by directing the camera at light to verify for exposure in the
shooting process.
Initiate the rear camera shooting. Pick up the handset for shooting for at least 2s. Meanwhile, say "hi"
twice to the primary microphone. Then, stop shooting and play the video to verify for abnormal
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display and noise ("hi" is said twice).
‒ Technical support team of the Overseas Customer Service
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