12C509
12C509
12C509
CMOS Technology:
Low power, high speed CMOS EPROM technology Fully static design Wide operating voltage range: - Commercial: 2.5V to 5.5V - Industrial: 2.5V to 5.5V Low power consumption - < 2 mA @ 5V, 4 MHz - 15 A typical @ 3V, 32 KHz - < 1 A typical standby current
Pin Diagram
PDIP, SOIC
VDD GP5/OSC1/CLKIN GP4/OSC2 GP3/MCLR/VPP
PIC12C508 512 x 12 25 PIC12C509 1024 x 12 41 12-bit wide instructions 8-bit wide data path Seven special function hardware registers Two-level deep hardware stack Direct, indirect and relative addressing modes for data and instructions Internal 4 MHz RC oscillator with programmable calibration In-circuit serial programming
1 2 3 4
8 7 6 5
PIC12C508 PIC12C509
Peripheral Features:
8-bit real time clock/counter (TMR0) with 8-bit programmable prescaler Power-On Reset (POR) Device Reset Timer (DRT) Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation Programmable code-protection Power saving SLEEP mode Wake-up from SLEEP on pin change Internal pull-ups on I/O pins Selectable oscillator options: - INTRC: Internal 4 MHz RC oscillator - EXTRC: External low-cost RC oscillator - XT: Standard crystal/resonator - LP: Power saving, low frequency crystal Internal pull-up on MCLR pin
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This document was created with FrameMaker 4 0 4
DS40139A-page 1
PIC12C5XX
TABLE OF CONTENTS
1.0 General Description ..........................................................................................................................................3 2.0 PIC12C5XX Device Varieties............................................................................................................................5 3.0 Architectural Overview ......................................................................................................................................7 4.0 Memory Organization......................................................................................................................................11 5.0 I/O Port............................................................................................................................................................19 6.0 Timer0 Module and TMR0 Register................................................................................................................21 7.0 Special Features of the CPU ..........................................................................................................................25 8.0 Instruction Set Summary.................................................................................................................................37 9.0 Development Support .....................................................................................................................................49 10.0 Electrical Characteristics - PIC12C5XX ..........................................................................................................53 11.0 Packaging Information ....................................................................................................................................65 Appendix A:PIC16/17 Microcontrollers..........................................................................................................................69 Index..............................................................................................................................................................................79 PIC12C5XX Product Identification System ...................................................................................................................83
DS40139A-page 2
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PIC12C5XX
1.0 GENERAL DESCRIPTION
1.1 Applications
The PIC12C5XX from Microchip Technology is a family of low-cost, high performance, 8-bit, fully static, EPROM/ROM-based CMOS microcontrollers. It employs a RISC architecture with only 33 single word/ single cycle instructions. All instructions are single cycle (1 s) except for program branches which take two cycles. The PIC12C5XX delivers performance an order of magnitude higher than its competitors in the same price category. The 12-bit wide instructions are highly symmetrical resulting in 2:1 code compression over other 8-bit microcontrollers in its class. The easy to use and easy to remember instruction set reduces development time signicantly. The PIC12C5XX products are equipped with special features that reduce system cost and power requirements. The Power-On Reset (POR) and Device Reset Timer (DRT) eliminate the need for external reset circuitry. There are four oscillator congurations to choose from, including INTRC internal oscillator mode and the power-saving LP (Low Power) oscillator. Power saving SLEEP mode, Watchdog Timer and code protection features improve system cost, power and reliability. The PIC12C5XX are available in the cost-effective One-Time-Programmable (OTP) versions which are suitable for production in any volume. The customer can take full advantage of Microchips price leadership in OTP microcontrollers while beneting from the OTPs exibility. The PIC12C5XX products are supported by a full-featured macro assembler, a software simulator, an in-circuit emulator, a C compiler, fuzzy logic support tools, a low-cost development programmer, and a full featured programmer. All the tools are supported on IBM PC and compatible machines. The PIC12C5XX series ts perfectly in applications ranging from personal care appliances and security systems to low-power remote transmitters/receivers. The EPROM technology makes customizing application programs (transmitter codes, appliance settings, receiver frequencies, etc.) extremely fast and convenient. The small footprint packages, for through hole or surface mounting, make this microcontroller series perfect for applications with space limitations. Low-cost, low-power, high performance, ease of use and I/O exibility make the PIC12C5XX series very versatile even in areas where no microcontroller use has been considered before (e.g., timer functions, replacement of glue logic and PLDs in larger systems, coprocessor applications).
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DS40139A-page 3
TABLE 1-1:
DS40139A-page 4 Clock
n (M ) Hz
PIC12C5XX
Memory
or y
Peripherals
ch a e ng
Features
m ra
em
on
pi
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4 4 512 1024 25 41 TMR0 TMR0 Yes Yes 5 5 1 1 Yes Yes 2.5-5.5 2.5-5.5 Yes Yes 33 33
PIC12C508 PIC12C509
All PIC12C5XX devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability. All PIC12C5XX devices use serial programming with data pin GP0 and clock pin GP1.
PIC12C5XX
2.0 PIC12C5XX DEVICE VARIETIES
2.1
A variety of packaging options are available. Depending on application and production requirements, the proper device option can be selected using the information in this section. When placing orders, please use the PIC12C5XX Product Identication System at the back of this data sheet to specify the correct part number.
The availability of OTP devices is especially useful for customers expecting frequent code changes and updates. The OTP devices, packaged in plastic packages, permit the user to program them once. In addition to the program memory, the conguration bits must be programmed.
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DS40139A-page 5
PIC12C5XX
NOTES:
DS40139A-page 6
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PIC12C5XX
3.0 ARCHITECTURAL OVERVIEW
The high performance of the PIC12C5XX family can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC12C5XX uses a Harvard architecture in which program and data are accessed on separate buses. This improves bandwidth over traditional von Neumann architecture where program and data are fetched on the same bus. Separating program and data memory further allows instructions to be sized differently than the 8-bit wide data word. Instruction opcodes are 12-bits wide making it possible to have all single word instructions. A 12-bit wide program memory access bus fetches a 12-bit instruction in a single cycle. A two-stage pipeline overlaps fetch and execution of instructions. Consequently, all instructions (33) execute in a single cycle (1s @ 4MHz) except for program branches. The PIC12C508 address 512 x 12 of program memory, the PIC12C509 addresses 1K x 12 of program memory. All program memory is internal. The PIC12C5XX can directly or indirectly address its register les and data memory. All special function registers including the program counter are mapped in the data memory. The PIC12C5XX has a highly orthogonal (symmetrical) instruction set that makes it possible to carry out any operation on any register using any addressing mode. This symmetrical nature and lack of special optimal situations make programming with the PIC12C5XX simple yet efcient. In addition, the learning curve is reduced signicantly. The PIC12C5XX device contains an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between data in the working register and any register le. The ALU is 8-bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two's complement in nature. In two-operand instructions, typically one operand is the W (working) register. The other operand is either a le register or an immediate constant. In single operand instructions, the operand is either the W register or a le register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register. Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC), and Zero (Z) bits in the STATUS register. The C and DC bits operate as a borrow and digit borrow out bit, respectively, in subtraction. See the SUBWF and ADDWF instructions for examples. A simplied block diagram is shown in Figure 3-1, with the corresponding device pins described in Table 3-1.
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PIC12C5XX
FIGURE 3-1: PIC12C5XX BLOCK DIAGRAM
12 EPROM 512 x 12 or 1024 x 12 Program Memory Program Bus Program Counter 8 GPIO GP0 GP1 GP2/T0CKI GP3/MCLR/Vpp GP4/OSC2 GP5/OSC1/CLKIN
Data Bus
STACK1 STACK2
FSR reg STATUS reg 8 3 Device Reset Timer Instruction Decode & Control Timing Generation Power-on Reset Watchdog Timer ALU 8 W reg
MUX
OSC1/CLKIN OSC2
Timer0
DS40139A-page 8
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PIC12C5XX
TABLE 3-1:
Name GP0
TTL/ST Bi-directional I/O port/ serial programming clock. Can be software programmed for internal weak pull-up and wake-up from SLEEP on pin change. This buffer is a Schmitt Trigger input when used in serial programming mode. TTL/ST Bi-directional I/O port/ serial programming data. Can be software programmed for internal weak pull-up and wake-up from SLEEP on pin change. This buffer is a Schmitt Trigger input when used in serial programming mode. ST TTL Bi-directional I/O port. Can be congured as T0CKI. Input port/master clear (reset) input/programming voltage input. When congured as MCLR, this pin is an active low reset to the device. Voltage on MCLR/VPP must not exceed VDD during normal device operation. Can be software programmed for internal weak pull-up and wake-up from SLEEP on pin change. Weak pullup always on if congured as MCLR Bi-directional I/O port/oscillator crystal output. Connections to crystal or resonator in crystal oscillator mode (XT and LP modes only, GPIO in other modes).
GP1
I/O
GP2/T0CKI GP3/MCLR/VPP
5 4
5 4
I/O I
GP4/OSC2
I/O
TTL
GP5/OSC1/CLKIN
I/O
TTL/ST Bidirectional IO port oscillator crystal input/external clock source input (GPIO in Internal RC mode only, OSC1 in all other oscillator modes). Positive supply for logic and I/O pins Ground reference for logic and I/O pins
VDD VSS
1 8
1 8
P P
Legend: I = input, O = output, I/O = input/output, P = power, = not used, TTL = TTL input, ST = Schmitt Trigger input
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DS40139A-page 9
PIC12C5XX
3.1 Clocking Scheme/Instruction Cycle 3.2 Instruction Flow/Pipelining
The clock input (OSC1/CLKIN pin) is internally divided by four to generate four non-overlapping quadrature clocks namely Q1, Q2, Q3 and Q4. Internally, the program counter is incremented every Q1, and the instruction is fetched from program memory and latched into instruction register in Q4. It is decoded and executed during the following Q1 through Q4. The clocks and instruction execution ow is shown in Figure 3-2 and Example 3-1. An Instruction Cycle consists of four Q cycles (Q1, Q2, Q3 and Q4). The instruction fetch and execute are pipelined such that fetch takes one instruction cycle while decode and execute takes another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g., GOTO) then two cycles are required to complete the instruction (Example 3-1). A fetch cycle begins with the program counter (PC) incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3, and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write).
FIGURE 3-2:
CLOCK/INSTRUCTION CYCLE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
EXAMPLE 3-1:
1. MOVLW 03H 2. MOVWF GPIO 3. CALL 4. BSF SUB_1
GPIO, BIT1
All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction is ushed from the pipeline while the new instruction is being fetched and then executed.
DS40139A-page 10
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PIC12C5XX
4.0 MEMORY ORGANIZATION
FIGURE 4-1:
PIC12C5XX memory is organized into program memory and data memory. For devices with more than 512 bytes of program memory, a paging scheme is used. Program memory pages are accessed using one STATUS register bit. For the PIC12C509 with a data memory register le of more than 32 registers, a banking scheme is used. Data memory banks are accessed using the File Select Register (FSR).
CALL, RETLW
4.1
0000h
The PIC12C508 and PIC12C509 each have a 12-bit Program Counter (PC) capable of addressing a 2K x 12 program memory space. Only the rst 512 x 12 (0000h-01FFh) for the PIC12C508 and 1K x 12 (0000h-03FFh) for the PIC12C509 are physically implemented. Refer to Figure 4-1. Accessing a location above these boundaries will cause a wrap-around within the rst 512 x 12 space (PIC12C508) or 1K x 12 space (PIC12C509). The reset vector is at 0000h. Location 01FFh (PIC12C508) or location 03FFh (PIC12C509) contains the internal clock oscillator calibration value. This value should never be overwritten.
User Memory Space
01FFh 0200h
03FFh 0400h
7FFh
Note 1: Address 0000h becomes the effective reset vector. Location 01FFh (PIC12C508) or location 03FFh (PIC12C509) contains the MOVLW XX clock calibration value.
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DS40139A-page 11
PIC12C5XX
4.2 Data Memory Organization FIGURE 4-2:
Data memory is composed of registers, or bytes of RAM. Therefore, data memory for a device is specied by its register le. The register le is divided into two functional groups: special function registers and general purpose registers. The special function registers include the TMR0 register, the Program Counter (PC), the Status Register, the I/O registers (ports), and the File Select Register (FSR). In addition, special purpose registers are used to control the I/O port conguration and prescaler options. The general purpose registers are used for data and control information under command of the instructions. For the PIC12C508, the register le is composed of 7 special function registers and 25 general purpose registers (Figure 4-2). For the PIC12C509, the register le is composed of 7 special function registers, 25 general purpose registers, and 16 general purpose registers that may be addressed using a banking scheme (Figure 4-3). 4.2.1 GENERAL PURPOSE REGISTER FILE
Note 1:
File Address 00h 01h 02h 03h 04h 05h 06h 07h INDF(1) TMR0 PCL STATUS FSR OSCCAL GPIO
1Fh
Not a physical register. See Section 4.7
The general purpose register le is accessed either directly or indirectly through the le select register FSR (Section 4.7).
FIGURE 4-3:
01
DS40139A-page 12
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PIC12C5XX
4.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and peripheral functions to control the operation of the device (Table 4-1). The special registers can be classied into two sets. The special function registers associated with the core functions are described in this section. Those related to the operation of the peripheral features are described in the section for each peripheral feature.
TABLE 4-1:
Address N/A N/A 00h 01h 02h(1) 03h 04h 04h 04h 05h 06h
Name TRIS OPTION INDF TMR0 PCL STATUS FSR (12C508) FSR (12C509) FSR OSCCAL GPIO
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
I/O control registers Contains control bits to congure Timer0, Timer0/WDT prescaler, interrupt on change, and weak pull-ups Uses contents of FSR to address data memory (not a physical register) 8-bit real-time clock/counter Low order 8 bits of PC GPWUF
PA0
Indirect data memory address pointer Indirect data memory address pointer Indirect data memory address pointer CAL7 CAL6 CAL5 GP5 CAL4 GP4 GP3
Legend: Shaded boxes = unimplemented or unused, = unimplemented, read as '0' (if applicable) x = unknown, u = unchanged, q = see the tables in Section 7.7 for possible values. Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.5 for an explanation of how to access these bits.
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PIC12C5XX
4.3 STATUS Register
This register contains the arithmetic status of the ALU, the RESET status, and the page preselect bit for program memories larger than 512 words. The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). It is recommended, therefore, that only BCF, BSF and MOVWF instructions be used to alter the STATUS register because these instructions do not affect the Z, DC or C bits from the STATUS register. For other instructions, which do affect STATUS bits, see Table 82, Instruction Set Summary.
FIGURE 4-4:
R/W-0 GPWUF bit7 bit 7:
R/W-0
GPWUF: GPIO reset bit 1 = Reset from wake-up from SLEEP on pin change 0 = After power up or other reset Unimplemented PA0: Program page preselect bits 1 = Page 1 (200h - 3FFh) - PIC12C509 0 = Page 0 (000h - 1FFh) - PIC12C508 and PIC12C509 Each page is 512 bytes. Using the PA0 bit as a general purpose read/write bit in devices which do not use it for program page preselect is not recommended since this may affect upward compatibility with future products. TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions) ADDWF 1 = A carry from the 4th low order bit of the result occurred 0 = A carry from the 4th low order bit of the result did not occur SUBWF 1 = A borrow from the 4th low order bit of the result did not occur 0 = A borrow from the 4th low order bit of the result occurred C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions) ADDWF SUBWF 1 = A carry occurred 1 = A borrow did not occur 0 = A carry did not occur 0 = A borrow occurred RRF or RLF Load bit with LSB or MSB, respectively
bit 6: bit 5:
bit 4:
bit 3:
bit 2:
bit 1:
bit 0:
DS40139A-page 14
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PIC12C5XX
4.4 OPTION Register
Note that TRIS overrides OPTION control if GPPU is enabled and GPWU is disabled. Note: If TRIS bit is set to 0, the wake-up on change and pull-up functions are disabled for that pin. If the TOCS bit is set to 1, GP2 is forced to be an input even if TRIS GP2 = 0 The OPTION register is a 8-bit wide, write-only register which contains various control bits to congure the Timer0/WDT prescaler and Timer0. By executing the OPTION instruction, the contents of the W register will be transferred to the OPTION register. A RESET sets the OPTION<7:0> bits.
Note:
FIGURE 4-5:
W-1 GPWU bit7
OPTION REGISTER
W-1 T0CS 5 W-1 T0SE 4 W-1 PSA 3 W-1 PS2 2 W-1 PS1 1 W-1 PS0 bit0
W-1 GPPU 6
W = Writable bit U = Unimplemented bit - n = Value at POR reset Reference Table 4-1 for other resets.
bit 7:
GPWU: Enable wake-up on pin change (GP0, GP1, GP3) 1 = Disabled 0 = Enabled GPPU: Enable weak pull-ups (GP0, GP1, GP3) 1 = Disabled 0 = Enabled T0CS: Timer0 clock source select bit 1 = Transition on T0CKI pin 0 = Transition on internal instruction cycle clock, Fosc/4 T0SE: Timer0 source edge select bit 1 = Increment on high to low transition on the T0CKI pin 0 = Increment on low to high transition on the T0CKI pin PSA: Prescaler assignment bit 1 = Prescaler assigned to the WDT 0 = Prescaler assigned to Timer0 PS2:PS0: Prescaler rate select bits Bit Value 000 001 010 011 100 101 110 111 Timer0 Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 WDT Rate 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128
bit 6:
bit 5:
bit 4:
bit 3:
bit 2-0:
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DS40139A-page 15
PIC12C5XX
4.5 Program Counter
4.5.1 EFFECTS OF RESET As a program instruction is executed, the Program Counter (PC) will contain the address of the next program instruction to be executed. The PC value is increased by one every instruction cycle, unless an instruction changes the PC. For a GOTO instruction, bits 8:0 of the PC are provided by the GOTO instruction word. The PC Latch (PCL) is mapped to PC<7:0>. Bit 5 of the STATUS register provides page information to bit 9 of the PC (Figure 46). For a CALL instruction, or any instruction where the PCL is the destination, bits 7:0 of the PC again are provided by the instruction word. However, PC<8> does not come from the instruction word, but is always cleared (Figure 4-6). Instructions where the PCL is the destination, or Modify PCL instructions, include MOVWF PC, ADDWF PC, and BSF PC,5. Note: Because PC<8> is cleared in the CALL instruction, or any Modify PCL instruction, all subroutine calls or computed jumps are limited to the rst 256 locations of any program memory page (512 words long). The Program Counter is set upon a RESET, which means that the PC addresses the last location in the last page i.e., the oscillator calibration instruction. After executing MOVLW XX, the PC will roll over to location 00h, and begin executing user code. The STATUS register page preselect bits are cleared upon a RESET, which means that page 0 is preselected. Therefore, upon a RESET, a GOTO instruction will automatically cause the program to jump to page 0 until the value of the page bits is altered.
4.6
Stack
PIC12C5XX devices have a 12-bit wide hardware push/pop stack. A CALL instruction will push the current value of stack 1 into stack 2 and then push the current program counter value, incremented by one, into stack level 1. If more than two sequential CALLs are executed, only the most recent two return addresses are stored. A RETLW instruction will pop the contents of stack level 1 into the program counter and then copy stack level 2 contents into level 1. If more than two sequential RETLWs are executed, the stack will be filled with the address previously stored in level 2. Note that the W register will be loaded with the literal value specied in the instruction. This is particularly useful for the implementation of data look-up tables within the program memory.
FIGURE 4-6:
GOTO Instruction
11 10 PC 9 8 7 PCL 0
STATUS
STATUS
DS40139A-page 16
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PIC12C5XX
4.7 Indirect Data Addressing; INDF and FSR Registers EXAMPLE 4-2: HOW TO CLEAR RAM USING INDIRECT ADDRESSING
0x10 FSR INDF FSR,F FSR,4 NEXT ;initialize pointer ; to RAM ;clear INDF register ;inc pointer ;all done? ;NO, clear next ;YES, continue
The INDF register is not a physical register. Addressing INDF actually addresses the register whose address is contained in the FSR register (FSR is a pointer). This is indirect addressing.
NEXT
EXAMPLE 4-1:
INDIRECT ADDRESSING
Register le 07 contains the value 10h Register le 08 contains the value 0Ah Load the value 07 into the FSR register A read of the INDF register will return the value of 10h Increment the value of the FSR register by one (FSR = 08) A read of the INDR register now will return the value of 0Ah. Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF register indirectly results in a no-operation (although STATUS bits may be affected). A simple program to clear RAM locations 10h-1Fh using indirect addressing is shown in Example 4-2.
CONTINUE
The FSR is a 5-bit wide register. It is used in conjunction with the INDF register to indirectly address the data memory area. The FSR<4:0> bits are used to select data memory addresses 00h to 1Fh. PIC12C508: Does not use banking. FSR<6:5> are unimplemented and read as '1's. PIC12C509: Uses FSR<5>. Selects between bank 0 and bank 1. FSR<6> is unimplemented, read as '1 .
FIGURE 4-7:
DIRECT/INDIRECT ADDRESSING
Direct Addressing (FSR) 6 5 4 (opcode) 0 6 Indirect Addressing 5 4 (FSR) 0
bank select
location select 00 00h Addresses map back to addresses in Bank 0. Data Memory(1) 0Fh 10h 01
bank
location select
1Fh Bank 0
Note 1: For register map detail see Section 4.2. Note 2: PIC12C509 only
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DS40139A-page 17
PIC12C5XX
NOTES:
DS40139A-page 18
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PIC12C5XX
5.0 I/O PORT
5.3 I/O Interfacing
As with any other register, the I/O register can be written and read under program control. However, read instructions (e.g., MOVF GPIO,W) always read the I/O pins independent of the pins input/output modes. On RESET, all I/O ports are dened as input (inputs are at hi-impedance) since the I/O control registers are all set. GP0 and GP1 can be programmed in software with weak pull-ups. The equivalent circuit for an I/O port pin is shown in Figure 5-1. All port pins, except GP3 which is input only, may be used for both input and output operations. For input operations these ports are nonlatching. Any input must be present until read by an input instruction (e.g., MOVF GPIO,W). The outputs are latched and remain unchanged until the output latch is rewritten. To use a port pin as output, the corresponding direction control bit in TRIS must be cleared (= 0). For use as an input, the corresponding TRIS bit must be set. Any I/O pin (except GP3) can be programmed individually as input or output.
5.1
GPIO
GPIO is an 8-bit I/O register. Only the low order 6 bits are used (GP5:GP0). Bits 7 and 6 are unimplemented and read as '0's. Please note that GP3 is an input only pin. The conguration word can set several I/Os to alternate functions. When acting as alternate functions the pins will read as 0 during port read. Pins GP0, GP1, and GP3 can be congured with weak pull-ups and also with wake-up on change. The wake-up on change and weak pull-up functions are not pin selectable. If pin 4 is congured as MCLR, weak pullup is always on and wake-up on change for this pin is not set.
FIGURE 5-1:
Data Bus D WR Port
CK
5.2
TRIS Register
W Reg
I/O pin(1)
The output driver control register is loaded with the contents of the W register by executing the TRIS f instruction. A '1' from a TRIS register bit puts the corresponding output driver in a hi-impedance mode. A '0' puts the contents of the output data latch on the selected pins, enabling the output buffer. The exceptions are GP3 which is input only and GP2 which may be controlled by the option register, see Section 4.4. Note: A read of the ports reads the pins, not the output data latches. That is, if an output driver on a pin is enabled and driven high, but the external system is holding it low, a read of the port will indicate that the pin is low.
TRIS f
CK
Reset
RD Port Note 1: I/O pins have protection diodes to VDD and VSS.
The TRIS registers are write-only and are set (output drivers disabled) upon RESET.
TABLE 5-1:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1 Bit 0
GPPU T0CS T0SE PSA PS2 PS1 PS0 1111 1111 PA0 GP5 TO GP4 PD GP3 Z GP2 DC GP1 C GP0 0001 1xxx --xx xxxx
Legend: Shaded cells not used by Port Registers, read as 0, = unimplemented, read as '0', x = unknown, u = unchanged, q = see tables in Section 7.7 for possible values.
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DS40139A-page 19
PIC12C5XX
5.4
5.4.1
EXAMPLE 5-1:
Some instructions operate internally as read followed by write operations. The BCF and BSF instructions, for example, read the entire port into the CPU, execute the bit operation and re-write the result. Caution must be used when these instructions are applied to a port where one or more pins are used as input/outputs. For example, a BSF operation on bit5 of GPIO will cause all eight bits of GPIO to be read into the CPU, bit5 to be set and the GPIO value to be written to the output latches. If another bit of GPIO is used as a bidirectional I/O pin (say bit0) and it is dened as an input at this time, the input signal present on the pin itself would be read into the CPU and rewritten to the data latch of this particular pin, overwriting the previous content. As long as the pin stays in the input mode, no problem occurs. However, if bit0 is switched into output mode later on, the content of the data latch may now be unknown. Example 5-1 shows the effect of two sequential readmodify-write instructions (e.g., BCF, BSF, etc.) on an I/O port. A pin actively outputting a high or a low should not be driven from external devices at the same time in order to change the level on this pin (wired-or, wiredand). The resulting high output currents may damage the chip.
;Initial GPIO Settings ; GPIO<5:3> Inputs ; GPIO<2:0> Outputs ;GPIO<6> have external pull-ups and are ;not connected to other circuitry ; ; GPIO latch GPIO pins ; ---------- ---------BCF GPIO, 5 ;--01 -ppp --11 pppp BCF GPIO, 4 ;--10 -ppp --11 pppp MOVLW 007h ; TRIS GPIO ;--10 -ppp --11 pppp ; ;Note that the user may have expected the pin ;values to be --00 pppp. The 2nd BCF caused ;GP4 to be latched as the pin value (High).
5.4.2
The actual write to an I/O port happens at the end of an instruction cycle, whereas for reading, the data must be valid at the beginning of the instruction cycle (Figure 5-2). Therefore, care must be exercised if a write followed by a read operation is carried out on the same I/O port. The sequence of instructions should allow the pin voltage to stabilize (load dependent) before the next instruction, which causes that le to be read into the CPU, is executed. Otherwise, the previous state of that pin may be read into the CPU rather than the new state. When in doubt, it is better to separate these instructions with a NOP or another instruction not accessing this I/O port.
FIGURE 5-2:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC Instruction fetched GP5:GP0 Port pin written here Instruction executed MOVWF GPIO (Write to GPIO) Port pin sampled here MOVF GPIO,W (Read GPIO) NOP MOVWF GPIO PC + 1 MOVF GPIO,W PC + 2 NOP PC + 3 NOP
This example shows a write to GPIO followed by a read from GPIO. Data setup time = (0.25 TCY TPD) where: TCY = instruction cycle. TPD = propagation delay Therefore, at higher clock frequencies, a write followed by a read may be problematic.
DS40139A-page 20
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PIC12C5XX
6.0 TIMER0 MODULE AND TMR0 REGISTER
Counter mode is selected by setting the T0CS bit (OPTION<5>). In this mode, Timer0 will increment either on every rising or falling edge of pin T0CKI. The T0SE bit (OPTION<4>) determines the source edge. Clearing the T0SE bit selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 6.1. The prescaler may be used by either the Timer0 module or the Watchdog Timer, but not both. The prescaler assignment is controlled in software by the control bit PSA (OPTION<3>). Clearing the PSA bit will assign the prescaler to Timer0. The prescaler is not readable or writable. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4,..., 1:256 are selectable. Section 6.2 details the operation of the prescaler. A summary of registers associated with the Timer0 module is found in Table 6-1.
The Timer0 module has the following features: 8-bit timer/counter register, TMR0 - Readable and writable 8-bit software programmable prescaler Internal or external clock select - Edge select for external clock Figure 6-1 is a simplied block diagram of the Timer0 module. Timer mode is selected by clearing the T0CS bit (OPTION<5>). In timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If TMR0 register is written, the increment is inhibited for the following two cycles (Figure 6-2 and Figure 6-3). The user can work around this by writing an adjusted value to the TMR0 register.
FIGURE 6-1:
GP2/T0CKI Pin
Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register. 2: The prescaler is shared with the Watchdog Timer (Figure 6-5).
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DS40139A-page 21
PIC12C5XX
FIGURE 6-2:
PC (Program Counter) Instruction Fetch
T0
T0+1
T0+2
NT0
NT0
NT0
NT0+1
NT0+2
FIGURE 6-3:
PC (Program Counter) Instruction Fetch Timer0 T0
T0+1
NT0
NT0+1
T0
Instruction Execute
TABLE 6-1:
Name TMR0
Bit 7
Bit 6
Bit 5
xxxx xxxx uuuu uuuu uuuu uuuu PS0 1111 1111 1111 1111 1111 1111 --11 1111 --11 1111 --11 1111
OPTION GPWU GPPU T0CS T0SE PSA PS2 TRIS I/O control registers
DS40139A-page 22
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PIC12C5XX
6.1 Using Timer0 with an External Clock
When an external clock input is used for Timer0, it must meet certain requirements. The external clock requirement is due to internal phase clock (TOSC) synchronization. Also, there is a delay in the actual incrementing of Timer0 after synchronization. 6.1.1 EXTERNAL CLOCK SYNCHRONIZATION When a prescaler is used, the external clock input is divided by the asynchronous ripple counter-type prescaler so that the prescaler output is symmetrical. For the external clock to meet the sampling requirement, the ripple counter must be taken into account. Therefore, it is necessary for T0CKI to have a period of at least 4TOSC (and a small RC delay of 40 ns) divided by the prescaler value. The only requirement on T0CKI high and low time is that they do not violate the minimum pulse width requirement of 10 ns. Refer to parameters 40, 41 and 42 in the electrical specication of the desired device. 6.1.2 TIMER0 INCREMENT DELAY
When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks (Figure 6-4). Therefore, it is necessary for T0CKI to be high for at least 2TOSC (and a small RC delay of 20 ns) and low for at least 2TOSC (and a small RC delay of 20 ns). Refer to the electrical specication of the desired device.
Since the prescaler output is synchronized with the internal clocks, there is a small delay from the time the external clock edge occurs to the time the Timer0 module is actually incremented. Figure 6-4 shows the delay from the external clock edge to the timer incrementing. 6.1.3 OPTION REGISTER EFFECT ON GP2 TRIS
If the option register is set to read TIMER0 from the pin, the port is forced to an input regardless of the TRIS register setting.
FIGURE 6-4:
External Clock Input or Prescaler Output (2) (1) External Clock/Prescaler Output After Sampling Increment Timer0 (Q4) Timer0 T0 T0 + 1 (3)
T0 + 2
Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc). Therefore, the error in measuring the interval between two edges on Timer0 input = 4Tosc max. 2: External clock if no prescaler selected, Prescaler output otherwise. 3: The arrows indicate the points in time where sampling occurs.
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DS40139A-page 23
PIC12C5XX
6.2 Prescaler EXAMPLE 6-1:
CLRF CLRWDT MOVLW OPTION TMR0
An 8-bit counter is available as a prescaler for the Timer0 module, or as a postscaler for the Watchdog Timer (WDT), respectively (Section 7.6). For simplicity, this counter is being referred to as prescaler throughout this data sheet. Note that the prescaler may be used by either the Timer0 module or the WDT, but not both. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the WDT, and vice-versa. The PSA and PS2:PS0 bits (OPTION<3:0>) determine prescaler assignment and prescale ratio. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1,x, etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. The prescaler is neither readable nor writable. On a RESET, the prescaler contains all '0's. 6.2.1 SWITCHING PRESCALER ASSIGNMENT
'xxxx1xxx'
To change prescaler from the WDT to the Timer0 module, use the sequence shown in Example 6-2. This sequence must be used even if the WDT is disabled. A CLRWDT instruction should be executed before switching the prescaler.
EXAMPLE 6-2:
CLRWDT MOVLW
'xxxx0xxx'
OPTION
The prescaler assignment is fully under software control (i.e., it can be changed on the y during program execution). To avoid an unintended device RESET, the following instruction sequence (Example 6-1) must be executed when changing the prescaler assignment from Timer0 to the WDT.
FIGURE 6-5:
GP2/T0CKI Pin
T0CS
PSA
0 M U X
Watchdog Timer
WDT Time-Out Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register.
DS40139A-page 24
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PIC12C5XX
7.0 SPECIAL FEATURES OF THE CPU
The PIC12C5XX has a Watchdog Timer which can be shut off only through conguration bit WDTE. It runs off of its own RC oscillator for added reliability. If using XT or LP selectable oscillator options, there is always an 18 ms delay provided by the Device Reset Timer (DRT), intended to keep the chip in reset until the crystal oscillator is stable. If using INTRC or EXTRC there is an 18 ms delay only on VDD power-up. With this timer on-chip, most applications need no external reset circuitry. The SLEEP mode is designed to offer a very low current power-down mode. The user can wake-up from SLEEP through a change on input pins or through a Watchdog Timer time-out. Several oscillator options are also made available to allow the part to t the application, including an internal 4 MHz oscillator. The EXTRL RC oscillator option saves system cost while the LP crystal option saves power. A set of conguration bits are used to select various options.
What sets a microcontroller apart from other processors are special circuits to deal with the needs of real-time applications. The PIC12C5XX family of microcontrollers has a host of such features intended to maximize system reliability, minimize cost through elimination of external components, provide power saving operating modes and offer code protection. These features are: Oscillator selection Reset - Power-On Reset (POR) - Device Reset Timer (DRT) - Wake-up from SLEEP on pin change Watchdog Timer (WDT) SLEEP Code protection ID locations In-circuit Serial Programming
7.1
Conguration Bits
The PIC12C5XX conguration word consists of 5 bits. Conguration bits can be programmed to select various device congurations. Two bits are for the selection of the oscillator type, one bit is the Watchdog Timer enable bit, and one bit is the MCLR enable bit. One bit is the code protection bit (Figure 7-1). OTP devices have the oscillator conguration programmed at the factory and these parts are tested accordingly (see Product Identication System on the inside back cover).
FIGURE 7-1:
bit11 bit 4: 10
bit 11-5: Unimplemented MCLRE: MCLR enable bit. 1 = MCLR enabled 0 = MCLR disabled CP: Code protection bit. 1 = Code protection off 0 = Code protection on WDTE: Watchdog timer enable bit 1 = WDT enabled 0 = WDT disabled FOSC1:FOSC0: Oscillator selection bits 11 = EXTRC - external RC oscillator 10 = INTRC - internal RC oscillator 01 = XT oscillator 00 = LP oscillator
bit 3:
bit 2:
bit 1-0:
Note 1: Refer to the PIC12C5XX Programming Specications to determine how to access the conguration word. This register is not user addressable during device operation.
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DS40139A-page 25
PIC12C5XX
7.2
7.2.1
Oscillator Congurations
OSCILLATOR TYPES
TABLE 7-1:
The PIC12C5XX can be operated in four different oscillator modes. The user can program two conguration bits (FOSC1:FOSC0) to select one of these four modes: LP: XT: INTRC: EXTRC: Low Power Crystal Crystal/Resonator Internal 4 MHz Oscillator External Resistor/Capacitor
Osc Type XT
Resonator Freq
455 kHz 68-100 pF 68-100 pF 2.0 MHz 15-33 pF 15-33 pF 4.0 MHz 10-22 pF 10-22 pF These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components.
7.2.2
TABLE 7-2:
In XT or LP modes, a crystal or ceramic resonator is connected to the GP5/OSC1/CLKIN and GP4/OSC2 pins to establish oscillation (Figure 7-2). The PIC12C5XX oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specications. When in XT or LP modes, the device can have an external clock source drive the GP5/ OSC1/CLKIN pin (Figure 7-3).
Osc Type LP XT
Resonator Freq
FIGURE 7-2:
C1(1)
PIC12C5XX
SLEEP
RF(3)
To internal logic
15 pF 15 pF 32 kHz(1) 200-300 pF 15-30 pF 100 kHz 100-200 pF 15-30 pF 200 kHz 15-100 pF 15-30 pF 455 kHz 15-30 pF 15-30 pF 1 MHz 15 pF 15 pF 2 MHz 15 pF 15 pF 4 MHz Note 1: For VDD > 4.5V, C1 = C2 30 pF is recommended. These values are for design guidance only. Rs may be required in HS mode as well as XT mode to avoid overdriving crystals with low drive level specication. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components.
Note 1: See Capacitor Selection tables for recommended values of C1 and C2. 2: A series resistor (RS) may be required for AT strip cut crystals. 3: RF varies with the crystal chosen (approx. value = 10 M).
FIGURE 7-3:
OSC2
DS40139A-page 26
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PIC12C5XX
7.2.3 EXTERNAL CRYSTAL OSCILLATOR CIRCUIT 7.2.4 EXTERNAL RC OSCILLATOR For timing insensitive applications, the RC device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (Rext) and capacitor (Cext) values, and the operating temperature. In addition to this, the oscillator frequency will vary from unit to unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low Cext values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 7-6 shows how the R/C combination is connected to the PIC12C5XX. For Rext values below 2.2 k, the oscillator operation may become unstable, or stop completely. For very high Rext values (e.g., 1 M) the oscillator becomes sensitive to noise, humidity and leakage. Thus, we recommend keeping Rext between 3 k and 100 k. Although the oscillator will operate with no external capacitor (Cext = 0 pF), we recommend using values above 20 pF for noise and stability reasons. With no or small external capacitance, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance or package lead frame capacitance. The Electrical Specications sections show RC frequency variation from part to part due to normal process variation. The variation is larger for larger R (since leakage current variation will affect RC frequency more for large R) and for smaller C (since variation of input capacitance will affect RC frequency more). Also, see the Electrical Specications sections for variation of oscillator frequency due to VDD for given Rext/Cext values as well as frequency variation due to operating temperature for given R, C, and VDD values.
Either a prepackaged oscillator or a simple oscillator circuit with TTL gates can be used as an external crystal oscillator circuit. Prepackaged oscillators provide a wide operating range and better stability. A well-designed crystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator circuits can be used: one with parallel resonance, or one with series resonance. Figure 7-4 shows implementation of a parallel resonant oscillator circuit. The circuit is designed to use the fundamental frequency of the crystal. The 74AS04 inverter performs the 180-degree phase shift that a parallel oscillator requires. The 4.7 k resistor provides the negative feedback for stability. The 10 k potentiometers bias the 74AS04 in the linear region. This circuit could be used for external oscillator designs.
FIGURE 7-4:
Figure 7-5 shows a series resonant oscillator circuit. This circuit is also designed to use the fundamental frequency of the crystal. The inverter performs a 180degree phase shift in a series resonant oscillator circuit. The 330 resistors provide the negative feedback to bias the inverters in their linear region.
FIGURE 7-5:
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DS40139A-page 27
PIC12C5XX
FIGURE 7-6:
VDD Rext OSC1 N Internal clock
RC OSCILLATOR MODE
7.3
RESET
The device differentiates between various kinds of reset: a) Power on reset (POR) b) MCLR reset during normal operation
Cext VSS
PIC12C5XX
c) MCLR reset during SLEEP d) WDT time-out reset during normal operation e) WDT time-out reset during SLEEP f) Wake-up from SLEEP on pin change
7.2.5
INTERNAL 4 MHZ RC OSCILLATOR Some registers are not reset in any way; they are unknown on POR and unchanged in any other reset. Most other registers are reset to reset state on poweron reset (POR), on MCLR or WDT reset during normal operation . They are not affected by a WDT reset during SLEEP or MCLR reset during SLEEP, since these resets are viewed as resumption of normal operation. The exceptions to this are TO, PD, and GPWUF bits. They are set or cleared differently in different reset situations. These bits are used in software to determine the nature of reset. See Table 7-3 for a full description of reset states of all registers.
The internal RC oscillator provides a xed 4 MHz (nominal) system clock. In addition, a calibration instruction is programmed into the top of memory which indicates the calibration value for the internal RC oscillator. This value, OSCCAL, is programmed as a MOVLW XX instruction where XX is the calibration value, and is placed at the reset vector. This will load the W register with the calibration value upon reset and the PC will then roll over to 0x000. The user then has the option of writing the value to the OSCCAL Register (05h) or ignoring it.
TABLE 7-3:
Register W INDF TMR0 PC STATUS FSR (12C508) FSR (12C509) OSCCAL GPIO OPTION TRIS Note 1: Note 2:
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as 0, ? = value depends on condition. Bits <7:4> of W register contain oscillator calibration (OSCCAL) values due to MOVLW XX instruction at top of memory. See Table 7-6 for reset value for specic conditions
DS40139A-page 28
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PIC12C5XX
TABLE 7-4: RESET CONDITION FOR SPECIAL REGISTERS
STATUS Addr: 03h Power on reset MCLR reset during normal operation MCLR reset during SLEEP WDT reset during SLEEP WDT reset normal operation Wake-up from SLEEP on pin change 0001 1xxx 000u uuuu 0001 0uuuu 0000 0uuu 0000 1uuu 1001 0uuu PCL Addr: 02h 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111
7.3.1
MCLR ENABLE
This conguration bit when unprogrammed (left in the 1 state) enables the external MCLR function. When programmed, the MCLR function is tied to the internal VDD, and the pin is assigned to be a GPIO. See Figure 7-7.
The Power-On Reset circuit and the Device Reset Timer (Section 7.5) circuit are closely related. On power-up, the reset latch is set and the DRT is reset. The DRT timer begins counting once it detects MCLR to be high. After the time-out period, which is typically 18 ms, it will reset the reset latch and thus end the onchip reset signal. A power-up example where MCLR is tied to VSS is shown in Figure 7-9. VDD is allowed to rise and stabilize before bringing MCLR high. The chip will actually come out of reset TDRT msec after MCLR goes high. In Figure 7-10, the on-chip Power-On Reset feature is being used (MCLR and VDD are tied together). The VDD is stable before the start-up timer times out and there is no problem in getting a proper reset. However, Figure 7-11 depicts a problem situation where VDD rises too slowly. The time between when the DRT senses a high on the GP3/MCLR/VPP pin, and when the GP3/MCLR/VPP pin (and VDD) actually reach their full value, is too long. In this situation, when the startup timer times out, VDD has not reached the VDD (min) value and the chip is, therefore, not guaranteed to function correctly. For such situations, we recommend that external RC circuits be used to achieve longer POR delay times (Figure 7-10). Note: When the device starts normal operation (exits the reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be meet to ensure operation. If these conditions are not met, the device must be held in reset until the operating conditions are met.
FIGURE 7-7:
MCLR SELECT
7.4
The PIC12C5XX family incorporates on-chip PowerOn Reset (POR) circuitry which provides an internal chip reset for most power-up situations. A Power-on Reset pulse is generated on-chip when VDD rise is detected (in the range of 1.5V - 2.1V). To take advantage of the POR, tie the MCLR pin directly to VDD. An internal weak pull-up resistor is implemented using a transistor. Refer to Table 10-5 for the pull-up resistor ranges. This will eliminate external RC components usually needed to create a Power-on Reset. A maximum rise time for VDD is specied. See Electrical Specications for details. When the device starts normal operation (exits the reset condition), device operating parameters (voltage, frequency, temperature, ...) must be met to ensure operation. If these conditions are not met, the device must be held in reset until the operating parameters are met. A simplied block diagram of the on-chip Power-On Reset circuit is shown in Figure 7-8.
For additional information refer to Application Notes Power-Up Considerations - AN522 and Power-up Trouble Shooting - AN607.
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DS40139A-page 29
PIC12C5XX
FIGURE 7-8: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Power-Up Detect VDD POR (Power-On Reset) Pin Change SLEEP GP3/MCLR/VPP Wake-up on pin change
WDT Time-out MCLRE 8-bit Asynch Ripple Counter (Start-Up Timer) RESET On-Chip DRT OSC
Q
CHIP RESET
DS40139A-page 30
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PIC12C5XX
FIGURE 7-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR PULLED LOW)
FIGURE 7-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME
DRT TIME-OUT
INTERNAL RESET
FIGURE 7-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME
V1 VDD MCLR INTERNAL POR TDRT
DRT TIME-OUT
INTERNAL RESET When VDD rises slowly, the TDRT time-out expires long before VDD has reached its nal value. In this example, the chip will reset properly if, and only if, V1 VDD min.
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DS40139A-page 31
PIC12C5XX
7.5 Device Reset Timer (DRT) 7.6 Watchdog Timer (WDT)
In the PIC12C5XX, the DRT runs any time the device is powered up. DRT runs from RESET only in XT and LP modes. It is disabled from RESET in INTRC and EXTRC modes. The Device Reset Timer (DRT) provides a xed 18 ms nominal time-out on reset. The DRT operates on an internal RC oscillator. The processor is kept in RESET as long as the DRT is active. The DRT delay allows VDD to rise above VDD min., and for the oscillator to stabilize. Oscillator circuits based on crystals or ceramic resonators require a certain time after power-up to establish a stable oscillation. The on-chip DRT keeps the device in a RESET condition for approximately 18 ms after the voltage on the GP3/MCLR/VPP pin has reached a logic high (VIHMC) level. Thus, external RC networks connected to the MCLR input are not required in most cases, allowing for savings in costsensitive and/or space restricted applications. The Device Reset time delay will vary from chip to chip due to VDD, temperature, and process variation. See AC parameters for details. The DRT will also be triggered upon a Watchdog Timer time-out (only in XT and LP modes). This is particularly important for applications using the WDT to wake from SLEEP mode automatically. The Watchdog Timer (WDT) is a free running on-chip RC oscillator which does not require any external components. This RC oscillator is separate from the external RC oscillator of the GP5/OSC1/CLKIN pin and the internal 4 MHz oscillator. That means that the WDT will run even if the clock on the GP5/OSC1/ CLKIN and GP4/OSC2 pins have been stopped, for example, by execution of a SLEEP instruction. During normal operation or SLEEP, a WDT reset or wake-up reset generates a device RESET. The TO bit (STATUS<4>) will be cleared upon a Watchdog Timer reset. The WDT can be permanently disabled by programming the conguration bit WDTE as a '0' (Section 7.1). Refer to the PIC12C5XX Programming Specications to determine how to access the conguration word.
DS40139A-page 32
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PIC12C5XX
7.6.1 WDT PERIOD 7.6.2 WDT PROGRAMMING CONSIDERATIONS The WDT has a nominal time-out period of 18 ms, (with no prescaler). If a longer time-out period is desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT (under software control) by writing to the OPTION register. Thus, time-out a period of a nominal 2.3 seconds can be realized. These periods vary with temperature, VDD and part-topart process variations (see DC specs). Under worst case conditions (VDD = Min., Temperature = Max., max. WDT prescaler), it may take several seconds before a WDT time-out occurs. The CLRWDT instruction clears the WDT and the postscaler, if assigned to the WDT, and prevents it from timing out and generating a device RESET. The SLEEP instruction resets the WDT and the postscaler, if assigned to the WDT. This gives the maximum SLEEP time before a WDT wake-up reset.
PS2:PS0
To Timer0 (Figure 6-4) 0 MUX Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register. WDT Time-out 1 PSA
TABLE 7-5:
Address N/A
Name OPTION
Bit 7 GPWU
Bit 6 GPPU
Bit 5 T0CS
Bit 4 T0SE
Bit 3 PSA
Bit 2 PS2
Legend: Shaded boxes = Not used by Watchdog Timer, = unimplemented, read as '0', u = unchanged
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DS40139A-page 33
PIC12C5XX
7.7 Time-Out Sequence, Power Down, and Wake-up from SLEEP Status Bits (TO/PD/GPWUF) 7.8 Reset on Brown-Out
A brown-out is a condition where device power (VDD) dips below its minimum value, but not to zero, and then recovers. The device should be reset in the event of a brown-out. To reset PIC12C5XX devices when a brown-out occurs, external brown-out protection circuits may be built, as shown in Figure 7-13 and Figure 7-14.
The TO, PD, and GPWUF bits in the STATUS register can be tested to determine if a RESET condition has been caused by a power-up condition, a MCLR or Watchdog Timer (WDT) reset, or a MCLR or WDT reset.
TABLE 7-6:
GPWUF
0 0 0 0 0 1 Legend:
TO
0 0 1 1 u 1
RESET caused by WDT wake-up from SLEEP WDT time-out (not from SLEEP) MCLR wake-up from SLEEP Power-up MCLR not during SLEEP Wake-up from SLEEP on pin change
Legend: u = unchanged Note 1: The TO, PD, and GPWUF bits maintain their status (u) until a reset occurs. A low-pulse on the MCLR input does not change the TO, PD, and GPWUF status bits.
This circuit will activate reset when VDD goes below Vz + 0.7V (where Vz = Zener voltage). *Refer to Figure 7-7 and Table 10-5 for internal weak pullup on MCLR.
These STATUS bits are only affected by events listed in Table 7-7.
TABLE 7-7:
Event Power-up WDT Time-out
TO
1 0 1 1 1
PD
1 u 0 1 0
Remarks No effect on PD
PIC12C5XX
Legend: u = unchanged A WDT time-out will occur regardless of the status of the TO bit. A SLEEP instruction will be executed, regardless of the status of the PD bit. Table 7-6 reects the status of TO and PD after the corresponding event.
This brown-out circuit is less expensive, although less accurate. Transistor Q1 turns off when VDD is below a certain level such that: VDD R1 R1 + R2 = 0.7V
Table 7-4 lists the reset conditions for the special function registers, while Table 7-3 lists the reset conditions for all the registers.
*Refer to Figure 7-7 and Table 10-5 for internal weak pull-up on MCLR.
DS40139A-page 34
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PIC12C5XX
7.9 Power-Down Mode (SLEEP) 7.10 Program Verication/Code Protection
A device may be powered down (SLEEP) and later powered up (Wake-up from SLEEP). 7.9.1 SLEEP If the code protection bit has not been programmed, the on-chip program memory can be read out for verication purposes.
The Power-Down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the TO bit (STATUS<4>) is set, the PD bit (STATUS<3>) is cleared and the oscillator driver is turned off. The I/O ports maintain the status they had before the SLEEP instruction was executed (driving high, driving low, or hi-impedance). It should be noted that a RESET generated by a WDT time-out does not drive the GP3/MCLR/VPP pin low. For lowest current consumption while powered down, the T0CKI input should be at VDD or VSS and the GP3/ MCLR/VPP pin must be at a logic high level (VIHMC) if MCLR is enabled. 7.9.2 WAKE-UP FROM SLEEP
7.11
ID Locations
Four memory locations are designated as ID locations where the user can store checksum or other codeidentication numbers. These locations are not accessible during normal execution but are readable and writable during program/verify. Use only the lower 4 bits of the ID locations and always program the upper 8 bits as '1's.
The device can wake-up from SLEEP through one of the following events: 1. 2. 3. An external reset input on GP3/MCLR/VPP pin. A Watchdog Timer time-out reset (if WDT was enabled). A change on input pin GP0, GP1, or GP3
These events cause a device reset. The TO, PD, and GPWUF bits can be used to determine the cause of device reset.. The TO bit is cleared if a WDT time-out occurred (and caused wake-up). The PD bit, which is set on power-up, is cleared when SLEEP is invoked. The GPWUF bit indicates a change in state while in SLEEP at pins GP0, GP1, or GP3 (since the last time there was a le or bit operation on GP port). Caution: Right before entering SLEEP, read the input pins. When in SLEEP, wake up occurs when the values at the pins change from the state they were in at the last reading. If a wake-up on change occurs and the pins are not read before reentering SLEEP, a wake up will occur immediately even if no pins change while in SLEEP mode. The WDT is cleared when the device wakes from sleep, regardless of the wake-up source.
Advance Information
DS40139A-page 35
PIC12C5XX
7.12 In-Circuit Serial Programming
The PIC12C5XX microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground, and the programming voltage. This allows customers to manufacture boards with unprogrammed devices, and then program the microcontroller just before shipping the product. This also allows the most recent rmware or a custom rmware to be programmed. The device is placed into a program/verify mode by holding the GP1 and GP0 pins low while raising the MCLR (VPP) pin from VIL to VIHH (see programming specication). GP1 becomes the programming clock and GP0 becomes the programming data. Both GP1 and GP0 are Schmitt Trigger inputs in this mode. After reset, a 6-bit command is then supplied to the device. Depending on the command, 14-bits of program data are then supplied to or from the device, depending if the command was a load or a read. For complete details of serial programming, please refer to the PIC12C5XX Programming Specications. A typical in-circuit serial programming connection is shown in Figure 7-15.
DS40139A-page 36
Advanced Information
PIC12C5XX
8.0 INSTRUCTION SET SUMMARY
Each PIC12C5XX instruction is a 12-bit word divided into an OPCODE, which species the instruction type, and one or more operands which further specify the operation of the instruction. The PIC12C5XX instruction set summary in Table 8-2 groups the instructions into byte-oriented, bit-oriented, and literal and control operations. Table 8-1 shows the opcode eld descriptions. For byte-oriented instructions, 'f' represents a le register designator and 'd' represents a destination designator. The le register designator is used to specify which one of the 32 file registers is to be used by the instruction. The destination designator species where the result of the operation is to be placed. If 'd' is '0', the result is placed in the W register. If 'd' is '1', the result is placed in the le register specied in the instruction. For bit-oriented instructions, 'b' represents a bit eld designator which selects the number of the bit affected by the operation, while 'f' represents the number of the le in which the bit is located. For literal and control operations, 'k' represents an 8 or 9-bit constant or literal value. All instructions are executed within a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 s. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 s. Figure 8-1 shows the three general formats that the instructions can have. All examples in the gure use the following format to represent a hexadecimal number: 0xhhh where 'h' signies a hexadecimal digit.
FIGURE 8-1:
d = 0 for destination W d = 1 for destination f f = 5-bit le register address Bit-oriented le register operations 11 OPCODE 8 7 5 4 b (BIT #) f (FILE #) 0
TABLE 8-1:
Field
f W b k
b = 3-bit bit address f = 5-bit le register address Literal and control operations (except GOTO) 11 OPCODE k = 8-bit immediate value Literal and control operations - GOTO instruction 11 OPCODE k = 9-bit immediate value 9 8 k (literal) 0 8 7 k (literal) 0
Register le address (0x00 to 0x7F) Working register (accumulator) Bit address within an 8-bit le register Literal eld, constant data or label Don't care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. Destination select; d = 0 (store result in W) d = 1 (store result in le register 'f') Default is d = 1 Label name Top of Stack Program Counter Watchdog Timer Counter Time-Out bit Power-Down bit Destination, either the W register or the specied register le location Options Contents Assigned to Register bit eld In the set of User dened term (font is courier)
dest [ ] ( ) <>
italics
Advance Information
DS40139A-page 37
PIC12C5XX
TABLE 8-2:
Mnemonic, Operands ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF BCF BSF BTFSC BTFSS ANDLW CALL CLRWDT GOTO IORLW MOVLW OPTION RETLW SLEEP TRIS XORLW f,d f,d f f, d f, d f, d f, d f, d f, d f, d f f, d f, d f, d f, d f, d f, b f, b f, b f, b k k k k k k k k f k
2,4 2,4 2,4 2,4 2,4 2,4 1,4 2,4 2,4 1,2,4 2,4 2,4 2,4 2,4
BIT-ORIENTED FILE REGISTER OPERATIONS 0100 0101 0110 0111 bbbf bbbf bbbf bbbf ffff ffff ffff ffff
LITERAL AND CONTROL OPERATIONS 1110 1001 0000 101k 1101 1100 0000 1000 0000 0000 1111 kkkk kkkk 0000 kkkk kkkk kkkk 0000 kkkk 0000 0000 kkkk kkkk kkkk 0100 kkkk kkkk kkkk 0010 kkkk 0011 0fff kkkk 1
Note 1: The 9th bit of the program counter will be forced to a '0' by any instruction that writes to the PC except forGOTO. (Section 4.5) 2: When an I/O register is modied as a function of itself (e.g. MOVF GPIO, 1), the value used will be that value present on the pins themselves. For example, if the data latch is '1' for a pin congured as input and is driven low by an external device, the data will be written back with a '0'. 3: The instruction TRIS f, where f = 5, 6, or 7 causes the contents of the W register to be written to the tristate latches of GPIO. A '1' forces the pin to a hi-impedance state and disables the output buffers. 4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared (if assigned to TMR0).
DS40139A-page 38
Advance Information
PIC12C5XX
ADDWF Syntax: Operands: Operation: Status Affected: Encoding: Description: Add W and f [ label ] ADDWF 0 f 31 d [0,1] (W) + (f) (dest) C, DC, Z
0001 11df ffff Add the contents of the W register and register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is '1' the result is stored back in register 'f'.
f,d
1 1
ADDWF 0x17 0xC2 0xD9 0xC2 FSR, 0
1 1
ANDWF 0x17 0xC2 0x17 0x02 FSR, 1
Before Instruction
Before Instruction
After Instruction
After Instruction
BCF k Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Example:
f,b
1 1
BCF FLAG_REG, 7
1 1
ANDLW 0xA3 0x03 0x5F
Before Instruction
FLAG_REG = 0xC7
After Instruction
FLAG_REG = 0x47
Advance Information
DS40139A-page 39
PIC12C5XX
BSF Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Example: 1 1
BSF FLAG_REG, 7
Bit Test f, Skip if Set [ label ] BTFSS f,b 0 f 31 0b<7 skip if (f<b>) = 1 None
0111 bbbf ffff If bit 'b' in register 'f' is '1' then the next instruction is skipped. If bit 'b' is '1', then the next instruction fetched during the current instruction execution, is discarded and an NOP is executed instead, making this a 2 cycle instruction.
Before Instruction
FLAG_REG = 0x0A
1 1(2)
HERE FALSE TRUE BTFSS GOTO FLAG,1 PROCESS_CODE
After Instruction
FLAG_REG = 0x8A
Bit Test f, Skip if Clear [ label ] BTFSC f,b 0 f 31 0b7 skip if (f<b>) = 0 None 0110
bbbf ffff If bit 'b' in register 'f' is 0 then the next instruction is skipped. If bit 'b' is 0 then the next instruction fetched during the current instruction execution is discarded, and an NOP is executed instead, making this a 2 cycle instruction.
Before Instruction
PC = = = = = address (HERE) 0, address (FALSE); 1, address (TRUE)
After Instruction
If FLAG<1> PC if FLAG<1> PC
1 1(2)
HERE FALSE TRUE BTFSC GOTO
FLAG,1 PROCESS_CODE
address (HERE) 0, address (TRUE); 1, address(FALSE)
Before Instruction
PC = = = = =
After Instruction
if FLAG<1> PC if FLAG<1> PC
DS40139A-page 40
Advanced Information
PIC12C5XX
CALL Syntax: Operands: Operation: Subroutine Call [ label ] CALL k 0 k 255 (PC) + 1 Top of Stack; k PC<7:0>; (STATUS<6:5>) PC<10:9>; 0 PC<8> None
1001 kkkk kkkk Subroutine call. First, return address (PC+1) is pushed onto the stack. The eight bit immediate address is loaded into PC bits <7:0>. The upper bits PC<10:9> are loaded from STATUS<6:5>, PC<8> is cleared. CALL is a two cycle instruction.
CLRW Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Example:
W W Z = = =
1 1
CLRW 0x5A 0x00 1
1 2
HERE CALL THERE
Before Instruction
address (HERE) address (THERE) address (HERE + 1)
Clear Watchdog Timer [ label ] CLRWDT None 00h WDT; 0 WDT prescaler (if assigned); 1 TO; 1 PD TO, PD
0000 0000 0100 The CLRWDT instruction resets the WDT. It also resets the prescaler, if the prescaler is assigned to the WDT and not Timer0. Status bits TO and PD are set.
After Instruction
CLRF Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Example:
1 1
CLRWDT ? 0x00 0 1 1
1 1
CLRF = = = FLAG_REG 0x5A 0x00 1
Before Instruction
WDT counter =
Before Instruction
FLAG_REG
After Instruction
WDT counter WDT prescale TO PD = = = =
After Instruction
FLAG_REG Z
Advance Information
DS40139A-page 41
PIC12C5XX
COMF Syntax: Operands: Operation: Status Affected: Encoding: Description: Complement f [ label ] COMF 0 f 31 d [0,1] (f) (dest) Z
0010 01df ffff The contents of register 'f' are complemented. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'.
skip if result = 0
1 1
COMF = = = 0x13 0x13 0xEC REG1,0
1 1(2)
HERE DECFSZ GOTO CONTINUE = = = = = CNT, 1 LOOP
Before Instruction
PC CNT if CNT PC if CNT PC address (HERE) CNT - 1; 0, address (CONTINUE); 0, address (HERE+1)
After Instruction
1 1
DECF = = = = 0x01 0 0x00 1 CNT,
Before Instruction
After Instruction
1 2
GOTO THERE address (THERE)
After Instruction
DS40139A-page 42
Advanced Information
PIC12C5XX
INCF Syntax: Operands: Operation: Status Affected: Encoding: Description: Increment f [ label ] 0 f 31 d [0,1] (f) + 1 (dest) Z
0010 10df ffff The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'.
Inclusive OR literal with W [ label ] IORLW k 0 k 255 (W) .OR. (k) (W) Z
1101 kkkk kkkk The contents of the W register are ORed with the eight bit literal 'k'. The result is placed in the W register.
INCF f,d
1 1
IORLW = = = 0x9A 0xBF 0 0x35
1 1
INCF = = = = CNT,
Before Instruction
W W Z
Before Instruction
0xFF 0 0x00 1
After Instruction
After Instruction IORWF Syntax: INCFSZ Syntax: Operands: Operation: Status Affected: Encoding: Description: Increment f, Skip if 0 [ label ] 0 f 31 d [0,1] (f) + 1 (dest), skip if result = 0 None
0011 11df ffff The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. If the result is 0, then the next instruction, which is already fetched, is discarded and an NOP is executed instead making it a two cycle instruction.
IORWF
f,d
INCFSZ f,d
1 1
IORWF 0x13 0x91 0x13 0x93 0 RESULT, 0
Before Instruction
RESULT = W =
1 1(2)
HERE INCFSZ GOTO CONTINUE = = = = = address (HERE) CNT + 1; 0, address (CONTINUE); 0, address (HERE +1) CNT, LOOP 1
After Instruction
RESULT = W = Z =
Before Instruction
PC CNT if CNT PC if CNT PC
After Instruction
Advance Information
DS40139A-page 43
PIC12C5XX
MOVF Syntax: Operands: Operation: Status Affected: Encoding: Description: Move f [ label ] 0 f 31 d [0,1] (f) (dest) Z
0010 00df ffff The contents of register 'f' is moved to destination 'd'. If 'd' is 0, destination is the W register. If 'd' is 1, the destination is le register 'f'. 'd' is 1 is useful to test a le register since status ag Z is affected.
MOVWF MOVF f,d Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Example:
MOVWF
1 1
MOVWF = = = = TEMP_REG 0xFF 0x4F 0x4F 0x4F
1 1
MOVF FSR, 0
Before Instruction
TEMP_REG W
After Instruction
TEMP_REG W
After Instruction
value in FSR register
NOP MOVLW Syntax: Operands: Operation: Status Affected: Encoding: Description: Move Literal to W [ label ] k (W) None
1100 kkkk kkkk The eight bit literal 'k' is loaded into the W register. The dont cares will assemble as 0s.
Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Example:
NOP
MOVLW k
0 k 255
No operation. 1 1
NOP
1 1
MOVLW 0x5A 0x5A
After Instruction
DS40139A-page 44
Advanced Information
PIC12C5XX
OPTION Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Example
W
Rotate Left f through Carry [ label ] RLF 0 f 31 d [0,1] See description below C
0011 01df ffff The contents of register 'f' are rotated one bit to the left through the Carry Flag. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is stored back in register 'f'.
OPTION
f,d
1 1
OPTION
Before Instruction
= 0x07 0x07
register 'f'
After Instruction
OPTION =
Before Instruction
REG1 C REG1 W C
After Instruction
RRF f,d
1 2
CALL TABLE ;W contains ;table offset ;value. ;W now has table ;value. ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; RETLW kn ; End of table = = 0x07 value of k8
TABLE
register 'f'
1 1
RRF = = = = = REG1,0 1110 0110 0 1110 0110 0111 0011 0
Before Instruction
W W
Before Instruction
After Instruction
After Instruction
Advance Information
DS40139A-page 45
PIC12C5XX
SLEEP Syntax: Operands: Operation: Enter SLEEP Mode [label] None 00h WDT; 0 WDT prescaler; 1 TO; 0 PD TO, PD, GPWUF
0000 0000 0011 Time-out status bit (TO) is set. The power down status bit (PD) is cleared. GPWUF is unaffected. The WDT and its prescaler are cleared. The processor is put into SLEEP mode with the oscillator stopped. See section on SLEEP for more details.
Subtract W from f [label] SUBWF f,d 0 f 31 d [0,1] (f) (W) (dest) C, DC, Z
0000 10df ffff Subtract (2s complement method) the W register from register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'.
SLEEP
1 1
SUBWF = = = = = = 3 2 ? 1 2 1 REG1, 1
Before Instruction
1 1 SLEEP
After Instruction
; result is positive
After Instruction
; result is zero
After Instruction
; result is negative
DS40139A-page 46
Advanced Information
PIC12C5XX
SWAPF Syntax: Operands: Operation: Status Affected: Encoding: Description: Swap Nibbles in f [ label ] SWAPF f,d 0 f 31 d [0,1] (f<3:0>) (dest<7:4>); (f<7:4>) (dest<3:0>) None
0011 10df ffff The upper and lower nibbles of register 'f' are exchanged. If 'd' is 0 the result is placed in W register. If 'd' is 1 the result is placed in register 'f'.
1 1 XORLW
= = 0xB5 0x1A
1 1
SWAPF = = =
0xAF
Before Instruction
0xA5 0xA5 0X5A
After Instruction
After Instruction XORWF Syntax: Operands: TRIS Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Example
W TRIS
f,d
Load TRIS Register [ label ] TRIS f=6 (W) TRIS register f None
0000 0000 0fff TRIS register 'f' (f = 6) is loaded with the contents of the W register
1 1
TRIS = = 0XA5 0XA5 GPIO
1 1 XORWF
= = = = REG,1
Before Instruction
0xAF 0xB5 0x1A 0xB5
After Instruction
Advance Information
DS40139A-page 47
PIC12C5XX
NOTES:
DS40139A-page 48
Advanced Information
PIC12C5XX
9.0
9.1
DEVELOPMENT SUPPORT
Development Tools
9.3
The PIC16/17 microcontrollers are supported with a full range of hardware and software development tools: PICMASTER/PICMASTER CE Real-Time In-Circuit Emulator ICEPIC Low-Cost PIC16C5X and PIC16CXX In-Circuit Emulator PRO MATE II Universal Programmer PICSTART Plus Entry-Level Prototype Programmer PICDEM-1 Low-Cost Demonstration Board PICDEM-2 Low-Cost Demonstration Board PICDEM-3 Low-Cost Demonstration Board MPASM Assembler MPLAB-SIM Software Simulator MPLAB-C (C Compiler) Fuzzy logic development system (fuzzyTECHMP) The PIC12C508 and PIC12C509 are supported by the systems shown in Table 9-1.
ICEPIC is a low-cost in-circuit emulator solution for the Microchip PIC16C5X and PIC16CXX families of 8-bit OTP microcontrollers. ICEPIC is designed to operate on PC-compatible machines ranging from 286-AT through Pentium based machines under Windows 3.x environment. ICEPIC features real time, non-intrusive emulation.
9.4
The PRO MATE II Universal Programmer is a full-featured programmer capable of operating in stand-alone mode as well as PC-hosted mode. The PRO MATE II has programmable VDD and VPP supplies which allows it to verify programmed memory at VDD min and VDD max for maximum reliability. It has an LCD display for displaying error messages, keys to enter commands and a modular detachable socket assembly to support various package types. In standalone mode the PRO MATE II can read, verify or program PIC16C5X, PIC16CXX, PIC17CXX and PIC14000 devices. It can also set conguration and code-protect bits in this mode.
9.2
9.5
The PICMASTER Universal In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for all microcontrollers in the PIC12C5XX, PIC16C5X, PIC16CXX and PIC17CXX families. PICMASTER is supplied with the MPLAB Integrated Development Environment (IDE), which allows editing, make and download, and source debugging from a single environment. Interchangeable target probes allow the system to be easily recongured for emulation of different processors. The universal architecture of the PICMASTER allows expansion to support all new Microchip microcontrollers. The PICMASTER Emulator System has been designed as a real-time emulation system with advanced features that are generally found on more expensive development tools. The PC compatible 386 (and higher) machine platform and Microsoft Windows 3.x environment were chosen to best make these features available to you, the end user. A CE compliant version of PICMASTER is available for European Union (EU) countries.
The PICSTART programmer is an easy-to-use, lowcost prototype programmer. It connects to the PC via one of the COM (RS-232) ports. MPLAB Integrated Development Environment software makes using the programmer simple and efcient. PICSTART Plus is not recommended for production programming. PICSTART Plus supports all PIC16/17 devices with up to 40 pins. Larger pin count devices such as the PIC16C923 and PIC16C924 may be supported with an adapter socket.
Advance Information
DS40139A-page 49
PIC12C5XX
9.6 PICDEM-1 Low-Cost PIC16/17 Demonstration Board
include an RS-232 interface, push-button switches, a potentiometer for simulated analog input, a thermistor and separate headers for connection to an external LCD module and a keypad. Also provided on the PICDEM-3 board is an LCD panel, with 4 commons and 12 segments, that is capable of displaying time, temperature and day of the week. The PICDEM-3 provides an additional RS-232 interface and Windows 3.1 software for showing the demultiplexed LCD signals on a PC. A simple serial interface allows the user to construct a hardware demultiplexer for the LCD signals. PICDEM3 will be available in the 3rd quarter of 1996.
The PICDEM-1 is a simple board which demonstrates the capabilities of several of Microchips microcontrollers. The microcontrollers supported are: PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The users can program the sample microcontrollers provided with the PICDEM-1 board, on a PRO MATE II or PICSTART-16B programmer, and easily test rmware. The user can also connect the PICDEM-1 board to the PICMASTER emulator and download the rmware to the emulator for testing. Additional prototype area is available for the user to build some additional hardware and connect it to the microcontroller socket(s). Some of the features include an RS-232 interface, a potentiometer for simulated analog input, push-button switches and eight LEDs connected to PORTB.
9.9
The MPLAB IDE Software brings an ease of software development previously unseen in the 8-bit microcontroller market. MPLAB is a windows based application which contains: A full featured editor Three operating modes - editor - emulator - simulator A project manager Customizable tool bar and key mapping A status bar with project information Extensive on-line help MPLAB allows you to: Edit your source les (either assembly or C) One touch assemble (or compile) and download to PIC16/17 tools (automatically updates all project information) Debug using: - source les - absolute listing le Transfer data dynamically via DDE (soon to be replaced by OLE) Run up to four emulators on the same PC The ability to use MPLAB with Microchips simulator allows a consistent platform and the ability to easily switch from the low cost simulator to the full featured emulator with minimal retraining due to development tools.
9.7
The PICDEM-2 is a simple demonstration board that supports the PIC16C62, PIC16C64, PIC16C65, PIC16C73 and PIC16C74 microcontrollers. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-2 board, on a PRO MATE II programmer or PICSTART-16C, and easily test rmware. The PICMASTER emulator may also be used with the PICDEM-2 board to test rmware. Additional prototype area has been provided to the user for adding additional hardware and connecting it to the microcontroller socket(s). Some of the features include a RS-232 interface, push-button switches, a potentiometer for simulated analog input, a Serial EEPROM to demonstrate usage of the I2C bus and separate headers for connection to an LCD module and a keypad.
9.8
The PICDEM-3 is a simple demonstration board that supports the PIC16C923 and PIC16C924 in the PLCC package. It will also support future 44-pin PLCC microcontrollers with a LCD Module. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-3 board, on a PRO MATE II programmer or PICSTART Plus with an adapter socket, and easily test rmware. The PICMASTER emulator may also be used with the PICDEM-3 board to test rmware. Additional prototype area has been provided to the user for adding hardware and connecting it to the microcontroller socket(s). Some of the features
9.10
Assembler (MPASM)
The MPASM Universal Macro Assembler is a PChosted symbolic assembler. It supports all microcontroller series including the PIC16C5X, PIC16CXX, and PIC17CXX families. MPASM offers full featured Macro capabilities, conditional assembly, and several source and listing formats. It generates various object code formats to support Microchip's development tools as well as third party programmers.
DS40139A-page 50
Advanced Information
PIC12C5XX
MPASM allows full symbolic debugging from the Microchip Universal Emulator System (PICMASTER). MPASM has the following features to assist in developing software for specic use applications. Provides translation of Assembler source code to object code for all Microchip microcontrollers. Macro assembly capability. Produces all the les (Object, Listing, Symbol, and special) required for symbolic debug with Microchips emulator systems. Supports Hex (default), Decimal and Octal source and listing formats. MPASM provides a rich directive language to support programming of the PIC16/17. Directives are helpful in making the development of your assemble source code shorter and more maintainable. Both versions include Microchips fuzzyLAB demonstration board for hands-on experience with fuzzy logic systems implementation.
9.14
MP-DriveWay is an easy-to-use Windows-based Application Code Generator. With MP-DriveWay you can visually congure all the peripherals in a PIC16/17 device and, with a click of the mouse, generate all the initialization and many functional code modules in C language. The output is fully compatible with Microchips MPLAB-C C compiler. The code produced is highly modular and allows easy integration of your own code. MP-DriveWay is intelligent enough to maintain your code through subsequent code generation.
9.15
9.11
The MPLAB-SIM Software Simulator allows code development in a PC host environment. It allows the user to simulate the PIC16/17 series microcontrollers on an instruction level. On any given instruction, the user may examine or modify any of the data areas or provide external stimulus to any of the pins. The input/ output radix can be set by the user and the execution can be performed in; single step, execute until break, or in a trace mode. MPLAB-SIM fully supports symbolic debugging using MPLAB-C and MPASM. The Software Simulator offers the low cost exibility to develop and debug code outside of the laboratory environment making it an excellent multi-project software development tool.
9.16
9.12
C Compiler (MPLAB-C)
The MPLAB-C Code Development System is a complete C compiler and integrated development environment for Microchips PIC16/17 family of microcontrollers. The compiler provides powerful integration capabilities and ease of use not found with other compilers. For easier source level debugging, the compiler provides symbol information that is compatible with the MPLAB IDE memory display (PICMASTER emulator software versions 1.13 and later).
The TrueGauge development tool supports system development with the MTA11200B TrueGauge Intelligent Battery Management IC. System design verication can be accomplished before hardware prototypes are built. User interface is graphically-oriented and measured data can be saved in a le for exporting to Microsoft Excel.
9.13
fuzzyTECH-MP fuzzy logic development tool is available in two versions - a low cost introductory version, MP Explorer, for designers to gain a comprehensive working knowledge of fuzzy logic system design; and a full-featured version, fuzzyTECH-MP, edition for implementing more complex systems.
Advance Information
DS40139A-page 51
Product
MPLAB C Compiler
TABLE 9-1:
PIC12C508, 509 SW006005 SW006005 SW006005 SW006005 SW006005 SW006005 SW006005 SW006005 SW006005 SW006005 SW006005 SW006005 SW006005 SW006005 SW006005 SW006006 SW006006 SW006006 SW006006 SW006006 SW006006 SW006006 SW006006 SW006006 SW006006 SW006006 SW006006
PIC14000
SW007002
PIC16C52, 54, 54A, 55, 56, 57, 58A PIC16C554, 556, 558
SW007002
SW007002
PIC16C61
SW007002
SW007002
SW007002
SW007002
SW007002
PIC16C71
SW007002
PIC16C710, 711
SW007002
PIC16C72
SW007002
Advance Information
PIC16F83
SW007002
PIC16C84
SW007002
PIC16F84
SW007002
PIC16C923, 924*
SW007002
PIC17C42, SW007002 SW006005 SW006006 42A, 43, 44 *Contact Microchip Technology for availability date **MPLAB Integrated Development Environment includes MPLAB-SIM Simulator and MPASM Assembler
PIC12C5XX
DS40139A-page 52
Product All 2 wire and 3 wire Serial EEPROM's MTA11200B HCS200, 300, 301 *
PIC12C5XX
10.0 ELECTRICAL CHARACTERISTICS - PIC12C5XX
Absolute Maximum Ratings
Ambient Temperature under bias ............................................................................................................. 40C to +85C Storage Temperature.............................................................................................................................. 65C to +150C Voltage on VDD with respect to VSS ................................................................................................................ 0 to +7.5 V Voltage on MCLR with respect to VSS(2) .......................................................................................................... 0 to +14 V Voltage on all other pins with respect to VSS ............................................................................... 0.6 V to (VDD + 0.6 V) Total Power Dissipation(1) ................................................................................................................................... 700 mW Max. Current out of VSS pin.................................................................................................................................. 200 mA Max. Current into VDD pin .................................................................................................................................... 150 mA Max. Current into VDD pin (Vclamp active)........................................................................................................... 100 mA Input Clamp Current, IIK (VI < 0 or VI > VDD).....................................................................................................................20 mA Output Clamp Current, IOK (VO < 0 or VO > VDD).............................................................................................................20 mA Max. Output Current sunk by any I/O pin ............................................................................................................... 25 mA Max. Output Current sourced by any I/O pin.......................................................................................................... 25 mA Max. Output Current sourced by I/O port (PORTA).............................................................................................. 100 mA Max. Output Current sourced by I/O port with VDD clamp active(PORTA)............................................................. 50 mA Max. Output Current sunk by I/O port (PORTA ) .................................................................................................. 100 mA Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL) Note 2: Voltage spikes below Vss at the MCLR pin, inducing currents greater than 80 mA may cause latch-up. Thus, a series resistor of 50 to 100W should be used when applying a low level to the MCLR pin rather than pulling this pin directly to Vss.
NOTICE:
Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specication is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
DS40139A-page 53
Advance Information
PIC12C5XX
10.1 DC CHARACTERISTICS: PIC12508/509 (Commercial) PIC12508/509 (Industrial)
Standard Operating Conditions (unless otherwise specied) Operating Temperature 0C TA +70C (commercial) 40C TA +85C (industrial) Sym VDD VDR VPOR SVDD IDD 0.05* Power-Down Current (5) WDT Enabled WDT Disabled IPD 4 5 0.25 0.3 12 14 4 5 A A A A VDD = 3.0 V, Commercial VDD = 3.0 V, Industrial VDD = 3.0 V, Commercial VDD = 3.0 V, Industrial 1.8 1.8 15 19 2.4 2.4 27 35 Min 2.5 1.5* VSS Typ(1) Max 5.5 Units V V V V/ms mA mA A A Conditions FOSC = DC to 4 MHz Device in SLEEP mode See section on Power-on Reset for details See section on Power-on Reset for details XT and EXTRC options (Note 4) FOSC = 4 MHz, VDD = 5.5 V INTRC Option FOSC = 4 MHz, VDD = 5.5 V LP OPTION, Commercial Temperature FOSC = 32 kHz, VDD = 3.0 V, WDT disabled LP OPTION, Industrial Temperature FOSC = 32 kHz, VDD = 3.0 V, WDT disabled
DC Characteristics Power Supply Pins Characteristic Supply Voltage RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3)
* These parameters are characterized but not tested. Note 1: Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specied. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in kOhm. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
DS40139A-page 54
Advance Information
PIC12C5XX
10.2 DC CHARACTERISTICS: PIC12508/509 (Commercial) PIC12508/509 (Industrial)
Standard Operating Conditions (unless otherwise specied) Operating Temperature 0C TA +70C (commercial) 40C TA +85C (industrial) Operating Voltage VDD range is described in Section 10.1. Sym VIL VSS VSS VSS VSS VIH 2.0 0.2VDD+1V 0.85 VDD 0.85 VDD 0.7 VDD 1 20 3 0.5 130 0.5 0.5 0.2 VDD 0.15 VDD 0.15 VDD 0.3 VDD VDD VDD VDD VDD VDD +1 250 +5 +3 V V V V V V V V V A A A A Pin at hi-impedance EXTRC option only(4) XT and LP options 4.0 V< VDD 5.5 V(5) Full VDD range(5) EXTRC option only(4) XT and LP options For VDD 5.5 V VSS VPIN VDD, Pin at hi-impedance VPIN = VSS + 0.25 V(2) VPIN = VDD VSS VPIN VDD, XT and LP options IOL = 8.7 mA, VDD = 4.5 V IOH = 5.4 mA, VDD = 4.5 V Min Typ(1) Max Units Conditions
DC Characteristics All Pins Except Power Supply Pins Characteristic Input Low Voltage I/O ports MCLR OSC1 OSC1 Input High Voltage I/O ports MCLR (Schmitt Trigger) OSC1 (Schmitt Trigger) Input Leakage Current(2,3) I/O ports MCLR OSC1 Output Low Voltage I/O ports Output High Voltage I/O ports
(3,4)
IIL
0.6
V V
* These parameters are characterized but not tested. Note 1: Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specied levels represent normal operating conditions. Higher leakage current may be measured at different input voltage. 3: Negative current is dened as coming out of the pin. 4: For PIC12C5XX devices, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. 5: The user may use the better of the two specications.
Advance Information
DS40139A-page 55
PIC12C5XX
10.3 Timing Parameter Symbology and Load Conditions
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F pp 2 ck cy drt io S F H I L Fall High Invalid (Hi-impedance) Low P R V Z Period Rise Valid Hi-impedance to CLKOUT cycle time device reset timer I/O port mc osc os t0 wdt MCLR oscillator OSC1 T0CKI watchdog timer Frequency T Time Lowercase subscripts (pp) and their meanings:
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP modes when external clock is used to drive OSC1
DS40139A-page 56
Advance Information
PIC12C5XX
10.4 Timing Diagrams and Specications FIGURE 10-2: EXTERNAL CLOCK TIMING - PIC12C5XX
Q4 OSC1 1 2 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 10-1:
AC Characteristics
Parameter No.
Sym
FOSC
Min
DC DC DC
Typ(1)
4/FOSC
Max
4 4 200 4 4 200 10,000 25* 50*
Units
Conditions
MHz EXTRC osc mode MHz XT osc mode kHz LP osc mode MHz EXTRC osc mode MHz XT osc mode kHz ns ns ms ns ns ms ns ms ns ns XT oscillator LP oscillator XT oscillator LP oscillator LP osc mode EXTRC osc mode XT osc mode LP osc mode EXTRC osc mode XT osc mode LP osc mode
Oscillator Frequency
(2)
DC 0.1 DC
TOSC
(2)
250 250 5
Oscillator Period(2)
250 250 5
2 3 4
Tcy
50* 2*
TosL, TosH Clock in (OSC1) Low or High Time TosR, TosF Clock in (OSC1) Rise or Fall Time
Note 1: Data in the Typical (Typ) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specied values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specied limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the max cycle time limit is DC (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
Advance Information
DS40139A-page 57
PIC12C5XX
FIGURE 10-3: I/O TIMING - PIC12C5XX
Q4 OSC1 Q1 Q2 Q3
Old Value
Note: All tests must be done with specied capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
TABLE 10-2:
AC Characteristics
Parameter No. 17 18 19 20 21
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical (Typ) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in EXTRC mode. 3: See Figure 10-1 for loading conditions.
DS40139A-page 58
Advance Information
PIC12C5XX
FIGURE 10-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC12C5XX
VDD MCLR 30 Internal POR 32 DRT Timeout (Note 2) Internal RESET Watchdog Timer RESET 31 34 I/O pin (Note 1) 34
32
32
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software. 2: Runs in MCLR or WDT reset only in XT and LP modes.
TABLE 10-3:
AC Characteristics Standard Operating Conditions (unless otherwise specied) Operating Temperature 0C TA +70C (commercial) 40C TA +85C (industrial) Operating Voltage VDD range is described in Section 10.1 Parameter No.
30 31
Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (No Prescaler) Device Reset Timer Period(2) I/O Hi-impedance from MCLR Low
Min 2000* 9* 9*
Units ns ms ms ns
32 34
* These parameters are characterized but not tested. Note 1: Data in the Typical (Typ) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested 2: DRT runs only on power-up and in normal execution in EXTRC and INTRC modes, and never runs in test modes. (i.e. does not run on wake-up from sleep)
Advance Information
DS40139A-page 59
PIC12C5XX
FIGURE 10-5: TIMER0 CLOCK TIMINGS - PIC12C5XX
T0CKI 40 41
42
TABLE 10-4:
AC Characteristics
* These parameters are characterized but not tested. Note 1: Data in the Typical (Typ) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
TABLE 10-5:
VDD (Volts) 2.5 2.5 2.5 5.5 5.5 5.5
*
DS40139A-page 60
Advance Information
PIC12C5XX
FIGURE 10-6: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. TEMPERATURE (VDD = 5.5V)
4.5
Frequency (MHz)
4.0
Note:
FIGURE 10-7: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. TEMPERATURE (VDD = 2.5V)
4.5
Frequency (MHz)
4.0
TYPICAL
Note:
Advance Information
DS40139A-page 61
PIC12C5XX
FIGURE 10-8: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. VDD AT TEMPERATURE = -40C
4.5
Frequency (MHz)
4.0
3.5 2.5 3.5 VDD Note: Altering calibration value by 1 is approximately a 4ns change. 4.5 5.5
FIGURE 10-9: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. VDD AT TEMPERATURE = 25C
4.5
Frequency (MHz)
4.0
3.5 2.5 3.5 VDD Note: Altering calibration value by 1 is approximately a 4ns change. 4.5 5.5
DS40139A-page 62
Advance Information
PIC12C5XX
FIGURE 10-10: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. VDD AT TEMPERATURE = 85C
4.5
Frequency (MHz)
4.0
3.5 2.5 3.5 VDD Note: Altering calibration value by 1 is approximately a 4ns change. 4.5 5.5
Advance Information
DS40139A-page 63
PIC12C5XX
NOTES:
DS40139A-page 64
Advance Information
PIC12C5XX
11.0
11.1
PACKAGING INFORMATION
Package Marking Information
Example
TO BE DETERMINED
8-Lead SOIC (200 mil) Example
TO BE DETERMINED
Microchip part number information Customer specic information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week 01) Facility code of the plant at which wafer is manufactured C = Chandler, Arizona, U.S.A., S = Tempe, Arizona, U.S.A. D Mask revision number E Assembly code of the plant or country of origin in which part was assembled Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specic information. * Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Ofce. For QTP devices, any special marking adders are included in QTP price.
Advance Information
DS40139A-page 65
PIC12C5XX
11.2 8-Lead Plastic Dual In-line (300 mil)
Package Group: Plastic Dual In-Line (PLA) Millimeters Symbol A A1 A2 B B1 C D D1 E E1 e1 eA eB L N S S1 Min 0 0.381 3.048 0.355 1.397 0.203 9.017 7.620 7.620 6.096 2.489 7.620 7.874 3.048 8 0.889 0.254 Max 10 4.064 3.810 0.559 1.651 0.381 10.922 7.620 8.255 7.112 2.591 7.620 9.906 3.556 8 Notes Min 0 0.015 0.120 0.014 0.055 0.008 0.355 0.300 0.300 0.240 0.098 0.300 0.310 0.120 8 0.035 0.010 Inches Max 10 0.160 0.150 0.022 0.065 0.015 0.430 0.300 0.325 0.280 0.102 0.300 0.390 0.140 8 Notes
Typical Reference
Typical Reference
Typical Reference
Typical Reference
DS40139A-page 66
Advance Information
PIC12C5XX
11.3 8-Lead Plastic Surface Mount (SOIC - Medium, 200 mil Body)
h x 45
C L
Seating Plane
CP
Base Plane
A1
Package Group: Plastic SOIC (SM) Millimeters Symbol A A1 B C D E e H* h L N CP Min 0 1.778 0.101 0.355 0.190 5.080 5.156 1.270 7.670 0.381 0.508 14 Max 8 2.00 0.249 0.483 0.249 5.334 5.411 1.270 8.103 0.762 1.016 14 0.102 Notes Min 0 0.070 0.004 0.014 0.007 0.200 0.203 0.050 0.302 0.015 0.020 14 Inches Max 8 0.079 0.010 0.019 0.010 0.210 0.213 0.050 0.319 0.030 0.040 14 0.004 Notes
Reference
Reference
Advance Information
DS40139A-page 67
PIC12C5XX
NOTES:
DS40139A-page 68
Advance Information
TABLE A-1:
wo
M o l du e(
rd
s)
Memory ) s
Peripherals
Features
PIC14XXX DEVICES
pe
io at
or
4 x1
R SA
T)
g in m m ,U M ) O 2C ra ) em r ts W of /I t M te ls ol og es /P ip s PI yt or er ne cy (V ) Pr m re n v S s P et l a ch ce (b pa ia ue e )( e( ge on han our y gr nes o ul er C eq R or av t(s an om lO Pr Fr D ) C pt S s R Sl od or ut tS /C em na es m e M M A/ res ui -o el n re u lP u M i r ll n O e hu tio tur a rr ag irc P e im ri R ra ta lt di a pt te op g ow m -C ax Se In Pa EP I/O Da Vo Sl (hi Ti Ad Fe M In Br Ca
Pa
a ck
ge
Advance Information
TMR0 ADTMR 14 11 22 2.7-6.0 I2C/ SMD Yes
PIC14000
20
4K
192
Internal Oscillator, Bandgap Reference, Temperature Sensor, Calibration Factors, Low Voltage Detector, SLEEP, HIBERNATE, Comparators with Programmable References (2)
PIC12C5XX
DS40139A-page 69
TABLE A-2:
te
s)
(b y
cy of Op er at ion P (M ro g Hz (x ram ) 12 M w e or mo ds ry )
en
lts
or
(V o
qu
(s
em
le
ng
ns
tr
uc ti
on
Fr e
ta
od u
of I
Ra
ge
um
Da
ns
ge
be
RO
er
Pi
ax im
lta
AM
EP
RO
Ti m
I/O
PIC16C52 20 20 20 20 20 20 20 20 20 2K 73 2K 73 2K 72 2K 72 TMR0 TMR0 TMR0 TMR0 1K 25 TMR0 512 24 TMR0 20 12 20 20 12 12 512 25 TMR0 12 512 25 TMR0 12 512 25 TMR0 12
384
25
TMR0
12
2.5-6.25 2.5-6.25 2.0-6.25 2.0-6.25 2.5-6.25 2.5-6.25 2.5-6.25 2.5-6.25 2.0-6.25 2.5-6.25
Vo
33 33 33 33 33 33 33 33 33 33
PIC16C54
Advance Information
Nu m
18-pin DIP, SOIC 18-pin DIP, SOIC; 20-pin SSOP 18-pin DIP, SOIC; 20-pin SSOP 18-pin DIP, SOIC; 20-pin SSOP 28-pin DIP, SOIC, SSOP 18-pin DIP, SOIC; 20-pin SSOP 28-pin DIP, SOIC, SSOP 28-pin DIP, SOIC, SSOP 18-pin DIP, SOIC; 20-pin SSOP 18-pin DIP, SOIC; 20-pin SSOP
PIC16C54A
PIC16CR54A
PIC16C55
PIC16C56
PIC16C57
PIC16CR57B
PIC16C58A
PIC16CR58A
All PIC16/17 Family devices have Power-On Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability.
Pa
ck a
PIC12C5XX
PIC16C5X FAMILY OF DEVICES
TABLE A-3:
Memory
Peripherals
Features
tio
an
ge
o (V
lts
PIC16C554 PIC16C556 PIC16C558 PIC16C620 PIC16C621 PIC16C622 20 2K 128 TMR0 2 20 1K 80 TMR0 2 Yes Yes 20 512 80 TMR0 2 Yes 4 4 4 20 2K 128 TMR0 3 20 1K 80 TMR0 3 13 13 13 13 13
20
512
80
TMR0
13
Advance Information
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability. All PIC16C6XXX Family devices use serial programming with clock pin RB6 and data pin RB7.
PIC12C5XX
DS40139A-page 71
TABLE A-4:
Clock
(M H z)
Memory
s)
Peripherals
Features
DS40139A-page 72
y e( or ) ul g em s) RT od in ti M rd M m SA ra m wo e U m M p , ) ra ra O ) 2C W lts og 14 of og /I /P t es y Vo Pr (x yt t s Pr re or PI ) c ( l s P (b e se ce (S en pa ia e( ur ry m qu ve ng s) er Re ul o e a t( la t So Co Fr R tS od or es em ou lS e/ ui pt ins M M um lP ge nag rM ur lle rc O ru e r P w M im R pt ta lta ck ra ria Ci o m te ax Se Da In In Br Pa Ca EP RO Ti Pa Vo I/O M
on
PIC12C5XX
PIC16C62 20 20 20 20 20 20 20 20 20 20 4K 192 TMR0, TMR1, TMR2 4K 192 TMR0, TMR1, TMR2 4K 192 TMR0, TMR1, TMR2 2K 128 TMR0, TMR1, TMR2 1 SPI/I2C Yes 2K 128 TMR0, TMR1, TMR2 1 SPI/I2C Yes 8 8 11 11 2 SPI/I2C, Yes USART 11 2K 128 TMR0, TMR1, TMR2 1 SPI/I2C Yes 8 33 33 33 33 33 33 4K 192 TMR0, TMR1, TMR2 2 SPI/I2C, USART 10 22 4K 192 TMR0, TMR1, TMR2 2 SPI/I2C, USART 10 22 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2K 128 TMR0, TMR1, TMR2 1 SPI/I2C 7 22 2.5-6.0 Yes Yes Yes Yes Yes Yes Yes Yes Yes 2K 128 TMR0, TMR1, TMR2 1 SPI/I2C 7 22 2.5-6.0 Yes
20
2K
PIC16C62A(1)
Yes 28-pin SDIP, SOIC, SSOP Yes 28-pin SDIP, SOIC, SSOP Yes 28-pin SDIP, SOIC Yes 28-pin SDIP, SOIC 40-pin DIP; 44-pin PLCC, MQFP Yes 40-pin DIP; 44-pin PLCC, MQFP, TQFP Yes 40-pin DIP; 44-pin PLCC, MQFP, TQFP 40-pin DIP; 44-pin PLCC, MQFP Yes 40-pin DIP; 44-pin PLCC, MQFP, TQFP Yes 40-pin DIP; 44-pin PLCC, MQFP, TQFP
PIC16CR62(1)
PIC16C63
PIC16CR63(1)
PIC16C64
Advance Information
2 SPI/I2C, Yes USART 2 SPI/I2C, Yes USART
PIC16C64A(1)
PIC16CR64(1)
PIC16C65
PIC16C65A(1)
PIC16CR65(1)
All PIC16/17 family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect, and high I/O current capability. All PIC16C6X family devices use serial programming with clock pin RB6 and data pin RB7. Note 1: Please contact your local sales ofce for availability of these devices.
TABLE A-5:
Clock
(M ) Hz
Memory
rd s)
Peripherals
ul e( s)
Features
ne ls
g in m m ,U M 2C C ) O ra ) ts t) W em of t ol bi og es I/I /P M s yt or cy 8t (V ) Pr re (SP e n m s P l (b e r( se rc pa s) ra ia ue e( ry ve ng rte m ou ul ( er og eq Re o t a e la S s t Pr Fr R od Co Por tS nv em lS pt ins ou ge M e e/ ui um M rM O lle nCo ur rial ka rru ag irc m P e R i c ra ta lt pt D te ow m -C ax EP Pa Se In A/ Pa I/O Vo Da Ti M In Br Ca
p a er n tio
y or
(x
14
wo
od
R SA
T)
n ha
PIC16C710 PIC16C71 PIC16C711 20 20 20 20 20 20 4K 4K 4K 192 TMR0, 2 SPI/I2C, TMR1, TMR2 USART 4K 192 TMR0, 2 SPI/I2C, TMR1, TMR2 USART 5 5 8 8 2K 128 TMR0, 1 SPI/I2C TMR1, TMR2 5 8 11 11 12 12 1K 68 TMR0 4 4 13 22 22 22 33 33 PIC16C72 PIC16C73 PIC16C73A(1) PIC16C74 PIC16C74A(1) 20 1K 36 TMR0 4 4 13 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0
20
512
36
TMR0
13
2.5-6.0
Yes 18-pin DIP, SOIC; 20-pin SSOP 18-pin DIP, SOIC Yes 18-pin DIP, SOIC; 20-pin SSOP Yes 28-pin SDIP, SOIC, SSOP 28-pin SDIP, SOIC Yes 28-pin SDIP, SOIC 40-pin DIP; 44-pin PLCC, MQFP Yes 40-pin DIP; 44-pin PLCC, MQFP, TQFP
Advance Information
192 TMR0, 2 SPI/I2C, Yes TMR1, TMR2 USART 192 TMR0, 2 SPI/I2C, Yes TMR1, TMR2 USART
PIC12C5XX
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability. All PIC16C7X Family devices use serial programming with clock pin RB6 and data pin RB7. Note 1: Please contact your local sales ofce for availability of these devices.
DS40139A-page 73
TABLE A-6:
as
Fl
DS40139A-page 74 Clock
n (M ) Hz
PIC12C5XX
Memory
em
e yt s)
Peripherals
Features
q re
ue
cy
fO
pe
ra
tio
or
Pr
or y (b
M RO M
r og
em
am
xim
um
EE
O PR
Da
ta
Da
Ti
TMR0 TMR0 TMR0 TMR0 TMR0 4 4 4 4 4
ta
m
EE
er M
O PR
o
M
l du
y (b
e( s)
te
s)
o (V
lts
10
1K
36
64
13 13 13 13 13
2.0-6.0 18-pin DIP, SOIC 2.0-6.0 18-pin DIP, SOIC 2.0-6.0 18-pin DIP, SOIC 2.0-6.0 18-pin DIP, SOIC 2.0-6.0 18-pin DIP, SOIC
Advance Information
All PIC16/17 family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect, and high I/O current capability. All PIC16C8X family devices use serial programming with clock pin RB6 and data pin RB7. Note 1: Please contact your local sales ofce for availability of these devices.
TABLE A-7:
Memory
o
M M od ul e
Peripherals
) (s
Features
ne ls
ry
er
io at
Pr
og
am
M
es )
/ re PW
em
t by
I SP
/I
,U
R SA
T)
t) C n ha
r Po
(8
bi
es
o (V
lts
g in
4K
4 Com 32 Seg
25 25
27 27
3.0-6.0 3.0-6.0
Yes Yes
Advance Information
PIC16C924
Note
64-pin SDIP(1), TQFP, 68-pin PLCC, DIE All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability. All PIC16CXX Family devices use serial programming with clock pin RB6 and data pin RB7. 1: Please contact your local Microchip representative for availability of this package.
PIC12C5XX
DS40139A-page 75
TABLE A-8:
(M
Hz
io
(W or
ds
at
or
pe r
em
es
by t
T)
of
ts
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PIC17C42 25 25 25 25 25 8K 454 4K 454 Yes Yes 4K 454 TMR0,TMR1, 2 2 TMR2,TMR3 Yes Yes Yes Yes 2K 232 TMR0,TMR1, 2 2 TMR2,TMR3 Yes Yes Yes Yes Yes Yes 2K 232 TMR0,TMR1, 2 2 TMR2,TMR3 Yes Yes Yes 11 11 11 11 11 33 33 33 33 33
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TMR0,TMR1, 2 2 TMR2,TMR3
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Yes
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55 58 58 58 58 58
40-pin DIP; 44-pin PLCC, MQFP 40-pin DIP; 44-pin PLCC, MQFP 40-pin DIP; 44-pin PLCC, MQFP 40-pin DIP; 44-pin PLCC, TQFP, MQFP
PIC17C42A
PIC17CR42
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TMR0,TMR1, 2 2 TMR2,TMR3 TMR0,TMR1, 2 2 TMR2,TMR3
PIC17C43
PIC17CR43
PIC17C44
40-pin DIP; 44-pin PLCC, TQFP, MQFP 40-pin DIP; 44-pin PLCC, TQFP, MQFP
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability.
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PIC12C5XX
PIC12C5XX
PIN COMPATIBILITY
Devices that have the same package type and VDD, VSS and MCLR pin locations are said to be pin compatible. This allows these different devices to operate in the same socket. Compatible devices may only requires minor software modication to allow proper operation in the application socket (ex., PIC16C56 and PIC16C61 devices). Not all devices in the same package size are pin compatible; for example, the PIC16C62 is compatible with the PIC16C63, but not the PIC16C55. Pin compatibility does not mean that the devices offer the same features. As an example, the PIC16C54 is pin compatible with the PIC16C71, but does not have an A/D converter, weak pull-ups on PORTB, or interrupts.
TABLE A-9:
PIC12C508, PIC12C509 PIC16C54, PIC16C54A, PIC16CR54A, PIC16C56, PIC16C58A, PIC16CR58A, PIC16C61, PIC16C554, PIC16C556, PIC16C558 PIC16C620, PIC16C621, PIC16C622, PIC16C710, PIC16C71, PIC16C711, PIC16C83, PIC16CR83, PIC16C84, PIC16C84A, PIC16CR84 PIC16C55, PIC16C57, PIC16CR57B PIC16C62, PIC16CR62, PIC16C62A, PIC16C63, PIC16C72, PIC16C73, PIC16C73A PIC16C64, PIC16CR64, PIC16C64A, PIC16C65, PIC16C65A, PIC16C74, PIC16C74A PIC17C42, PIC17C43, PIC17C44
40-pin
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DS40139A-page 77
PIC12C5XX
NOTES:
DS40139A-page 78
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PIC12C5XX
INDEX A
ALU ...................................................................................... 7 Applications.......................................................................... 3 Architectural Overview ......................................................... 7 Assembler .......................................................................... 50 RC .............................................................................. 26 XT ............................................................................... 26
P
Package Marking Information............................................. 65 Packaging Information........................................................ 65 PC....................................................................................... 16 PICDEM-1 Low-Cost PIC16/17 Demo Board ............... 49, 50 PICDEM-2 Low-Cost PIC16CXX Demo Board............. 49, 50 PICDEM-3 Low-Cost PIC16C9XXX Demo Board .............. 50 PICMASTER RT In-Circuit Emulator ............................... 49 PICSTART Low-Cost Development System.................... 49 Pin Compatible Devices ..................................................... 77 POR Device Reset Timer (DRT) ................................... 25, 32 PD............................................................................... 34 Power-On Reset (POR).............................................. 25 TO............................................................................... 34 PORTA ............................................................................... 19 Power-Down Mode ............................................................. 35 Prescaler ............................................................................ 24 PRO MATE Universal Programmer ................................. 49 Program Counter ................................................................ 16
B
Block Diagram On-Chip Reset Circuit ................................................ Timer0........................................................................ TMR0/WDT Prescaler................................................ Watchdog Timer......................................................... Brown-Out Protection Circuit ............................................. 30 21 24 33 34
C
C Compiler (MP-C) ............................................................ 51 Carry .................................................................................... 7 Clocking Scheme ............................................................... 10 Code Protection ........................................................... 25, 35 Configuration Bits............................................................... 25 Configuration Word PIC16C54A/CR57A/C58A ......................................... 25
D
Development Support ........................................................ 49 Development Tools ............................................................ 49 Device Varieties ................................................................... 5 Digit Carry ............................................................................ 7
Q
Q cycles.............................................................................. 10
R
RC Oscillator ...................................................................... 27 Read Modify Write .............................................................. 20 Register File Map PIC16C54A/CR54A/CR54B/CR56 ............................. 12 PIC16C58A/CR58A/CR58B ....................................... 12 Registers Special Function ......................................................... 13 Reset .................................................................................. 25 Reset on Brown-Out ........................................................... 34
F
Family of Devices PIC14XXX.................................................................. 69 PIC16C5X .................................................................. 70 PIC16C62X ................................................................ 71 PIC16C7X .................................................................. 73 PIC16C8X .................................................................. 74 Features............................................................................... 1 FSR.................................................................................... 17 Fuzzy Logic Dev. System (fuzzyTECH-MP) .............. 49, 51
S
SLEEP .......................................................................... 25, 35 Software Simulator (MPSIM) .............................................. 51 Special Features of the CPU .............................................. 25 Special Function Registers................................................. 13 Stack................................................................................... 16 STATUS ............................................................................... 7 STATUS Register ............................................................... 14
I
I/O Interfacing .................................................................... 19 I/O Ports............................................................................. 19 I/O Programming Considerations....................................... 20 ID Locations ................................................................. 25, 35 INDF................................................................................... 17 Indirect Data Addressing.................................................... 17 Instruction Cycle ................................................................ 10 Instruction Flow/Pipelining ................................................. 10 Instruction Set Summary.................................................... 38
T
Timer0 Switching Prescaler Assignment ................................ 24 Timer0 ........................................................................ 21 Timer0 (TMR0) Module .............................................. 21 TMR0 with External Clock .......................................... 23 Timing Diagrams and Specifications .................................. 57 Timing Parameter Symbology and Load Conditions .......... 56 TRIS Registers ................................................................... 19
L
Loading of PC .................................................................... 16
M
Memory Organization......................................................... 11 Data Memory ............................................................. 12 Program Memory ....................................................... 11 MPASM Assembler...................................................... 49, 50 MP-C C Compiler ............................................................... 51 MPSIM Software Simulator.......................................... 49, 51
W
Wake-up from SLEEP ........................................................ 35 Watchdog Timer (WDT)................................................ 25, 32 Period ......................................................................... 33 Programming Considerations ..................................... 33
O
One-Time-Programmable (OTP) Devices............................ 5 OPTION Register............................................................... 15 OSC Selection ................................................................... 25 Oscillator Configurations.................................................... 26 Oscillator Types HS .............................................................................. 26 LP............................................................................... 26
Z
Zero bit ................................................................................. 7
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DS40139A-page 79
PIC12C5XX
LIST OF EXAMPLES
Example 3-1: Instruction Pipeline Flow ............................ 10 Example 4-1: Indirect Addressing .................................... 17 Example 4-2: How To Clear RAM Using Indirect Addressing................................................. 17 Example 5-1: Read-Modify-Write Instructions on an I/O Port ...................................................... 20 Example 6-1: Changing Prescaler (Timer0WDT .........) 24 Example 6-2: Changing Prescaler (WDTTimer0 .........) 24 Figure 10-7: Calibrated Internal RC Frequency Range vs. Temperature (VDD = 2.5V)................... 61 Figure 10-8: Calibrated Internal RC Frequency Range vs. VDD at Temperature = -40C ............... 62 Figure 10-9: Calibrated Internal RC Frequency Range vs. VDD at Temperature = 25C................. 62 Figure 10-10: Calibrated Internal RC Frequency Range vs. VDD at Temperature = 85C................ 63
LIST OF TABLES
Table 1-1: Table 3-1: Table 4-1: Table 5-1: Table 6-1: Table 7-1: Table 7-2: Table 7-3: Table 7-4: Table 7-5: Table 7-6: Table 7-7: Table 8-1: Table 8-2: Table 9-1: Table 10-1: Table 10-2: Table 10-3: Table 10-4: Table 10-5: PIC12C5XX Family of Devices.................... 4 PIC12C5XX Pinout Description................... 9 Special Function Register Summary ......... 13 Summary of Port Registers ....................... 19 Registers Associated With Timer0 ............ 22 Capacitor Selection For Ceramic Resonators - PIC12C5XX ......................... 26 Capacitor Selection For Crystal Oscillator - PIC12C5XX............................. 26 Reset Conditions For Registers ................ 28 Reset Condition For Special Registers ..... 29 Summary of Registers Associated with the Watchdog Timer .................................. 33 TO/PD/GPWUF Status After Reset........... 34 Events Affecting TO/PD Status Bits .......... 34 OPCODE Field Descriptions ..................... 37 Instruction Set Summary ........................... 38 Development Tools From Microchip.......... 52 External Clock Timing Requirements PIC12C5XX ............................................... 57 Timing Requirements - PIC12C5XX.......... 58 Reset, Watchdog Timer, and Device Reset Timer - PIC12C5XX ........................ 59 Timer0 Clock Requirements PIC12C5XX ............................................... 60 MCLR Pull-up Resistor Ranges ................ 60
LIST OF FIGURES
Figure 3-1: Figure 3-2: Figure 4-1: Figure 4-2: Figure 4-3: Figure 4-4: Figure 4-5: Figure 4-6: Figure 4-7: Figure 5-1: Figure 5-2: Figure 6-1: Figure 6-2: Figure 6-3: Figure 6-4: Figure 6-5: Figure 7-1: Figure 7-2: Figure 7-3: Figure 7-4: Figure 7-5: Figure 7-6: Figure 7-7: Figure 7-8: Figure 7-9: Figure 7-10: Figure 7-11: Figure 7-12: Figure 7-13: Figure 7-14: Figure 7-15: Figure 8-1: Figure 10-1: Figure 10-2: Figure 10-3: Figure 10-4: Figure 10-5: Figure 10-6: PIC12C5XX Block Diagram ......................... 8 Clock/Instruction Cycle .............................. 10 Program Memory Map and Stack for the PIC12C5XX ............................................... 11 PIC12C508 Register File Map ................... 12 PIC12C509 Register File Map ................... 12 STATUS Register (Address:03h)............... 14 OPTION Register....................................... 15 Loading of PC Branch Instructions PIC12C508/C509....................................... 16 Direct/Indirect Addressing.......................... 17 Equivalent Circuit for a Single I/O Pin........ 19 Successive I/O Operation .......................... 20 Timer0 Block Diagram ............................... 21 Timer0 Timing: Internal Clock/ No Prescale ............................................... 22 Timer0 Timing: Internal Clock/ Prescale 1:2............................................... 22 Timer0 Timing With External Clock ........... 23 Block Diagram of the Timer0/ WDT Prescaler .......................................... 24 Configuration Word for PIC12C508 or PIC12C509 ................................................ 25 Crystal Operation (or Ceramic Resonator) (XT or LP OSC Configuration) ................... 26 External Clock Input Operation (XT or LP OSC Configuration) ................... 26 External Parallel Resonant Crystal Oscillator Circuit......................................... 27 External Series Resonant Crystal Oscillator Circuit ......................................... 27 RC Oscillator Mode.................................... 28 MCLR Select.............................................. 29 Simplified Block Diagram of On-Chip Reset Circuit................................ 30 Time-Out Sequence on Power-Up (MCLR Pulled Low).................................... 31 Time-Out Sequence on Power-Up (MCLR Tied to Vdd): Fast Vdd Rise Time . 31 Time-Out Sequence on Power-Up (MCLR Tied to VDD): Slow Vdd Rise Time 31 Watchdog Timer Block Diagram ................ 33 Brown-Out Protection Circuit 1 .................. 34 Brown-Out Protection Circuit 2 .................. 34 Typical In-Circuit Serial Programming Connection................................................. 36 General Format for Instructions ................. 37 Load Conditions - PIC12C5XX .................. 56 External Clock Timing - PIC12C5XX ......... 57 I/O Timing - PIC12C5XX........................... 58 Reset, Watchdog Timer, and Device Reset Timer Timing - PIC12C5XX ............. 59 Timer0 Clock Timings - PIC12C5XX ......... 60 Calibrated Internal RC Frequency Range vs. Temperature (VDD = 5.5V)........ 61
DS40139A-page 80
Advanced Information
PIC12C5XX
ON-LINE SUPPORT
Microchip provides two methods of on-line support. These are the Microchip BBS and the Microchip World Wide Web (WWW) site. Use Microchip's Bulletin Board Service (BBS) to get current information and help about Microchip products. Microchip provides the BBS communication channel for you to use in extending your technical staff with microcontroller and memory experts. To provide you with the most responsive service possible, the Microchip systems team monitors the BBS, posts the latest component data and software tool updates, provides technical help and embedded systems insights, and discusses how Microchip products provide project solutions. The web site, like the BBS, is used by Microchip as a means to make les and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape or Microsoft Explorer. Files are also available for FTP download from our FTP site. The procedure to connect will vary slightly from country to country. Please check with your local CompuServe agent for details if you have a problem. CompuServe service allow multiple users various baud rates depending on the local point of access. The following connect procedure applies in most locations. 1. Set your modem to 8-bit, No parity, and One stop (8N1). This is not the normal CompuServe setting which is 7E1. 2. Dial your local CompuServe access number. 3. Depress the <Enter> key and a garbage string will appear because CompuServe is expecting a 7E1 setting. 4. Type +, depress the <Enter> key and Host Name: will appear. 5. Type MCHIPBBS, depress the <Enter> key and you will be connected to the Microchip BBS. In the United States, to nd the CompuServe phone number closest to you, set your modem to 7E1 and dial (800) 848-4480 for 300-2400 baud or (800) 331-7166 for 9600-14400 baud connection. After the system responds with Host Name:, type NETWORK, depress the <Enter> key and follow CompuServe's directions. For voice information (or calling from overseas), you may call (614) 723-1550 for your local CompuServe number. Microchip regularly uses the Microchip BBS to distribute technical information, application notes, source code, errata sheets, bug reports, and interim patches for Microchip systems software products. For each SIG, a moderator monitors, scans, and approves or disapproves les submitted to the SIG. No executable les are accepted from the user community in general to limit the spread of computer viruses.
Internet:
You can telnet or ftp to the Microchip BBS at the address: mchipbbs.microchip.com
Trademarks: The Microchip name, logo, PIC, PICSTART, PICMASTER, and are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FlexROM, MPLAB, PRO MATE, and fuzzyLAB, are trademarks and SQTP is a service mark of Microchip in the U.S.A.
fuzzyTECH is a registered trademark of Inform Software Corporation. IBM, IBM PC-AT are registered trademarks of International Business Machines Corp. Pentium is a trademark of Intel Corporation. Windows is a trademark and MS-DOS, Microsoft Windows are registered trademarks of Microsoft Corporation. CompuServe is a registered trademark of CompuServe Incorporated.
All other trademarks mentioned herein are the property of their respective companies.
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DS40139A-page 81
PIC12C5XX
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578. Please list the following information, and use this outline to provide us with your comments about this Data Sheet. To: RE: Technical Publications Manager Reader Response Total Pages Sent
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: PIC12C5XX Questions: 1. What are the best features of this document? Y N Literature Number: DS40139A FAX: (______) _________ - _________
2. How does this document meet your hardware and software development needs?
3. Do you nd the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
8. How would you improve our software, systems, and silicon products?
DS40139A-page 82
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PIC12C5XX
PIC12C5XX PRODUCT IDENTIFICATION SYSTEM
PART NO. -XX X /XX XXX Pattern: Package: Special Requirements SM P = 200 mil SOIC = 300 mil PDIP
b)
Examples
a) PIC12C508-04/P Commercial Temp., PDIP Package, 4 MHz, normal VDD limits PIC12C508-04I/SM Industrial Temp., SOIC package, 4 MHz, normal VDD limits PIC12C509-04I/P Industrial Temp., PDIP package, 4 MHz, normal VDD limits
I 04
PIC12C508 PIC12C509 PIC12C508T (Tape & reel for SOIC only) PIC12C509T (Tape & reel for SOIC only)
Please contact your local sales ofce for exact ordering procedures.
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DS40139A-page 83
AMERICAS (continued)
New York Microchip Technology Inc. 150 Motor Parkway, Suite 416 Hauppauge, NY 11788 Tel: 516 273-5305 Fax: 516 273-5335 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408 436-7950 Fax: 408 436-7955 Toronto Microchip Technology Inc. 5925 Airport Road, Suite 200 Mississauga, Ontario L4V 1W1, Canada Tel: 905 405-6279 Fax: 905 405-6253
EUROPE
United Kingdom Arizona Microchip Technology Ltd. Unit 6, The Courtyard Meadow Bank, Furlong Road Bourne End, Buckinghamshire SL8 5AJ Tel: 44 1 628 850303 Fax: 44 1 628 850178 France Arizona Microchip Technology SARL Zone Industrielle de la Bonde 2 Rue du Buisson aux Fraises 91300 Massy - France Tel: 33 1 69 53 63 20 Fax: 33 1 69 30 90 79 Germany Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125 D-81739 Muenchen, Germany Tel: 49 89 627 144 0 Fax: 49 89 627 144 44 Italy Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041, Agrate Brianza, Milan Italy Tel: 39 39 689 9939 Fax: 39 39 689 9883
ASIA/PACIFIC
Hong Kong Microchip Technology Rm 3801B, Tower Two Metroplaza, 223 Hing Fong Road, Kwai Fong, N.T., Hong Kong Tel: 852 2 401 1200 Fax: 852 2 401 3431 Korea Microchip Technology 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku, Seoul, Korea Tel: 82 2 554 7200 Fax: 82 2 558 5934 Singapore Microchip Technology 200 Middle Road #10-03 Prime Centre Singapore 188980 Tel: 65 334 8870 Fax: 65 334 8850 Taiwan Microchip Technology 10F-1C 207 Tung Hua North Road Taipei, Taiwan, ROC Tel: 886 2 717 7175 Fax: 886 2 545 0139
JAPAN
Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shin Yokohama Kohoku-Ku, Yokohama Kanagawa 222 Japan Tel: 81 45 471 6166 Fax: 81 45 471 6122 5/10/96
DS40139A - page 84
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