IMP23ABSU

Datasheet

High-performance MEMS microphone with extended frequency response up to

80 kHz for ultrasound applications

Features
• Single supply voltage operation 1.52 V - 3.6 V
• Omnidirectional sensitivity
• High signal-to-noise ratio
• High acoustic overload point: 130 dBSPL typ.
• Package compliant with reflow soldering
• Enhanced RF immunity
• Ultra-flat frequency response
• Ultrasound bandwidth (up to 80 kHz)
• Low latency
• Ultra-low-power: 150 µA max.
• ECOPACK, RoHS, and “Green” compliant

Applications
• Condition monitoring of industrial equipment
• Leak detection
• Electrical arcing
• Smart medical instruments
• Wearable devices
• Hearables
Product status link • Smart speakers
• Active noise-canceling headsets
IMP23ABSU

Product summary Description

Order code IMP23ABSU IMP23ABSUTR
The IMP23ABSU is a compact, low-power microphone built with a capacitive sensing
Temp. range
-40 to +85
element and an IC interface.
[°C]
The sensing element, capable of detecting acoustic waves, is manufactured using a
Package (3.5 x 2.65 x 0.98) mm
specialized silicon micromachining process to produce audio sensors.
Packing Tray Tape and reel
The IMP23ABSU has an acoustic overload point of 130 dBSPL with a typical 64 dB
signal-to-noise ratio.
Product label
The sensitivity of the IMP23ABSU is -38 dBV ±1 dB @ 94 dBSPL, 1 kHz.
The IMP23ABSU is available in a package compliant with reflow soldering and is
guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

DS13376 - Rev 2 - September 2020 www.st.com

For further information contact your local STMicroelectronics sales office.
 IMP23ABSU
Pin description

1 Pin description

Figure 1. Pin connections (bottom view)

Table 1. Pin description

Pin number Pin name Function

1 Out Output
2 GND GND
3 GND GND
4 GND GND
5 Vdd Supply voltage

DS13376 - Rev 2 page 2/15

 IMP23ABSU
Acoustic and electrical specifications

2 Acoustic and electrical specifications

2.1 Acoustic and electrical characteristics

The values listed in the table below are specified for Vdd = 2.75 V, no load, Tamb = 25 °C unless otherwise
specified.

Table 2. Acoustic and electrical characteristics

Symbol Parameter Test condition Min. Typ. Max. Unit

Vdd Supply voltage 1.52 2.75 3.6 V

Idd Current consumption 120 150 µA

So Sensitivity 1 kHz @ 94 dBSPL -39 -38 -37 dBV

SNR Signal-to-noise ratio 64 dB(A)

PSRR Power supply rejection 100 mVpp sine wave, 1 kHz, Vdd > 1.6 V 60 dB

AOP Acoustic overload point 130 dBSPL

Rload Load resistance(1) 15 kΩ

Top Operating temperature range -40 +85 °C

1. Guaranteed by design

DS13376 - Rev 2 page 3/15

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Frequency response

2.2 Frequency response

Figure 2. Typical free-field frequency response normalized at 1 kHz

10

4
Sensitivity (dB)

-2

-4

-6

-8

-10
10 100 1000 10000
Frequency (Hz)

Table 3. Frequency response mask

Frequency (Hz) LSL USL Unit

35 -2 0 dBr 1kHz

100 -1.5 0.5 dBr 1kHz

900 -1 1 dBr 1kHz

1000 0 0 dBr 1kHz

1100 -1 1 dBr 1kHz

8000 -1 4 dBr 1kHz

15000 0 9 dBr 1kHz

Figure 3. Typical ultrasonic free-field response normalized to 1 kHz

20

15

10
Sensitivity [dB]

-5

-10

-15
20000 30000 40000 50000 60000 70000 80000
Frequency [Hz]

DS13376 - Rev 2 page 4/15

 IMP23ABSU
Absolute maximum ratings

3 Absolute maximum ratings

Stresses above those listed as “Absolute maximum ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device under these conditions is not implied. Exposure to
maximum rating conditions for extended periods may affect device reliability.

Table 4. Absolute maximum ratings

Symbol Ratings Maximum value Unit

Vdd Supply voltage -0.5 to 4.8 V

TSTG Storage temperature range -40 to +125 °C

This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.

This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part.

DS13376 - Rev 2 page 5/15

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Application recommendations

4 Application recommendations

4.1 IMP23ABSU schematic hints

Figure 4. IMP23ABSU electrical connections and external component values

DS13376 - Rev 2 page 6/15

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Soldering information

5 Soldering information

Figure 5. Recommended soldering profile limits

tp
TP
RAMP-UP CRITICAL ZONE
TL to T P

TL
TSMAX tL
TEMPERATURE

TSMIN

ts
PREHEAT
RAMP-DOWN

T25°C to PEAK
TIME
30 60 90 120 150 180 210 240 270 300 330 360 390

Table 5. Recommended soldering profile limits

Description Parameter Pb free

Average ramp rate TL to TP 3 °C/sec max

Preheat

Minimum temperature TSMIN 150 °C

Maximum temperature TSMAX 200 °C

Time (TSMIN to TSMAX) tS 60 sec to 120 sec

Ramp-up rate TSMAX to TL

Time maintained above liquidus temperature tL 60 sec to 150 sec

Liquidus temperature TL 217 °C

Peak temperature TP 260 °C max

Time within 5 °C of actual peak temperature 20 sec to 40 sec

Ramp-down rate 6 °C/sec max
Time 25 °C (t25 °C) to peak temperature 8 minutes max

DS13376 - Rev 2 page 7/15

 IMP23ABSU
Reliability tests

6 Reliability tests

Table 6. Reliability specifications

Test name Description Conditions

ESD-GUN: 25 discharges at ±8 kV, direct

contact to housing of MIC
Reference specification IEC 61000-4-2
ESD-HBM 3 discharges up to ±2 kV pin-to-pin

To classify ESD susceptibility the device is Reference specification ANSI/ESDA/JEDEC

submitted to a high voltage peak on all his JS001
Electrostatic Discharge Immunity Test
pins, simulating ESD stress according to ESD-MM, 3 discharges up to ±200 V pin-to-
(ESD)
different simulation models (GUN, HBM, MM, pin
CDM)
Reference specification JEDEC JESD22-
A115C
ESD-CDM, 3 discharges up to ±750 V
Reference specification ANSI/ESDA/JEDEC
JS002
To verify latch-up immunity the device is ±100 mA & 1.5 x Vdd @ 85 °C
Latch-Up
submitted to a current injection on I/O or
(LU) Reference specification JEDEC JESD78
supply overvoltage
Ta 125 °C, Tj 125 °C, 1000 Hrs, @ Max Op
To simulate the worst-case application stress
Voltage
High Temperature Operative Life conditions, the device is stressed in dynamic
(HTOL) configuration at operative max. absolute Preconditioning (PC) before
ratings
Reference specification JESD22-A108

To investigate failure mechanisms activated Ta 85°C, R.H. 85%, 1000 Hrs, @ Max Op
by electrical field and humidity, the device is Voltage
Temperature Humidity Bias
biased in static or dynamic operative
(THB) Preconditioning (PC) before
conditions at controlled high temperature and
relative humidity Reference specification JESD22-A101
To investigate effects of customer
manufacturing soldering enhanced by MSL3 as moisture soak conditions followed
Preconditioning MSL3 by n.3 reflow @ Tpeak 260 °C
package water absorption, the device is
(PC)
submitted to typical temperature profile after Reference specification JEDEC J-STD-020
controlled moisture absorption
To investigate the failure mechanisms
activated by extremely cold conditions, the Ta = -40 °C, 1000 Hrs
Low Temperature Storage
device is stored in unbiased condition at the
(LTS) Reference specification JESD22-A120
min. temperature allowed by the package
materials
To investigate the failure mechanisms
High Temperature Storage activated by high temperature, the device is Ta = 125 °C, 1000 Hrs
(HTS) stored in unbiased condition at the maximum Reference specification JESD22-A104
temperature allowed by the package materials
To investigate failure modes related to
Low T = - 40 °C, High T = +125 °C, 1000 Cys
thermo-mechanical stress, the device is
Temperature Cycling
submitted to cycled temperature excursions, Preconditioning (PC) before
(TC)
between a hot and a cold chamber in air
Reference specification JESD22-A105
atmosphere
Ta = 85°C, R.H. = 85%, 1000Hrs
To investigate degradations induced by wet
Temperature Humidity Storage
conditions, the device is stored at controlled Preconditioning (PC) before
(THS)
high temperature and relative humidity
Reference specification JESD22-A102

DS13376 - Rev 2 page 8/15

 IMP23ABSU
Reliability tests

Test name Description Conditions

Microphone soldered on PCB which is

To investigate durability to mechanical mounted on a specific jig
Random Free-Fall on PCB repeated drops without any preferential
Random drop from 1 mt on steel base, 300
(TUMBLE) impact direction simulating drop effect on
drops
handheld devices
Reference specification IEC 60068-2-32
Microphone soldered on PCB which is
To verify durability of the whole device to mounted on a specific jig
Guided Free-Fall on PCB mechanical shocks, done by controlling height Guided drop from 1.5 mt on marble base,
(GFF) and impact direction simulating drop effect on
handheld devices 2 drops x 6 directions
Reference specification IEC 60068-2-32
Microphone membrane is subjected to
repeated air pulses controlled on duration,
Test dedicated on the MEMS Microphone to
Compressed Air Test rise and fall time and amplitude.
check mechanical robustness of sensor
(CAT)
membrane alone Amplitude is varied with increasing steps.
ST internal specification
To verify mechanical robustness of internal Five pulses of 10,000 g in each of six
structural elements (MEMS, package directions with duration time 0.2 ms
Mechanical Shock
components) to withstand severe shocks
(MS) Reference specification MIL 883, Method
produced by handling, transportation or field
operations 2002.5

The vibration variable frequency test is Peak acceleration of 20 g, from 20 Hz to 2000

Variable Frequency Vibration performed to determine the effect of vibration, Hz in three perpendicular directions
(VB) within a specified frequency range, on the Reference specification MIL 883, Method
internal structural elements 2007.3-A

DS13376 - Rev 2 page 9/15

 IMP23ABSU
Package information

7 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

7.1 RHLGA-5L package information

Figure 6. RHLGA metal cap 5-lead (3.5 x 2.65 x 0.98 mm) package outline and mechanical data

Dimensions are in millimeter unless otherwise specified

General Tolerance is +/-0.15mm unless otherwise specified

OUTER DIMENSIONS

ITEM DIMENSION [mm] TOLERANCE [mm]

Length [L] 3.5 ±0.1
W idth [W ] 2.65 ±0.1
Height [H] 1.08 MAX

DM00368430_2

DS13376 - Rev 2 page 10/15

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Land pattern

7.2 Land pattern

Figure 7. Land pattern and recommended stencil opening

Land pattern Stencil opening

1.675 1.675
0.838

0.725 0.725 0.640 0.640

0.522 0.460

0.822
1.364
0.522 0.460 2.074

1.252
0.710

φ
1.625
φ 1.025
φ 1.625 φ
φ 0.5 1.025 0.300

DS13376 - Rev 2 page 11/15

 IMP23ABSU
RHLGA-5L packing information

7.3 RHLGA-5L packing information

Figure 8. Carrier tape information for RHLGA-5L package

DS13376 - Rev 2 page 12/15

 IMP23ABSU

Revision history

Table 7. Document revision history

Date Version Changes

31-Aug-2020 1 Initial release

16-Sep-2020 2 Minor textual update

DS13376 - Rev 2 page 13/15

 IMP23ABSU
Contents

Contents
1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1 IMP23ABSU schematic hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5 Soldering information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 Reliability tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
7 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
7.1 RHLGA-5L package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7.2 Land pattern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7.3 RHLGA-5L packing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

DS13376 - Rev 2 page 14/15

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© 2020 STMicroelectronics – All rights reserved

DS13376 - Rev 2 page 15/15