Ar0330cm D 888215

AR0330CM
1/3‐inch CMOS
Digital Image Sensor
Description
The AR0330 from ON Semiconductor is a 1/3-inch CMOS digital www.onsemi.com
image sensor with an active-pixel array of 2304 (H) × 1536 (V). It can
support 3.15 Mp (2048 (H) × 1536 (V)) digital still image capture and
a 1080p60 + 20% EIS (2304 (H) × 1296 (V)) digital video mode. It
incorporates sophisticated on-chip camera functions such as
windowing, mirroring, column and row sub-sampling modes, and
snapshot modes.
CLCC48 ODCSP64
Table 1. KEY PERFORMANCE PARAMETERS CASE 848AU CASE 570BH
Parameter Typical Value

ORDERING INFORMATION
Optical Format 1/3-inch (6.0 mm) See detailed ordering and shipping information on page 2 of
Entire Array: 6.09 mm this data sheet.
Still Image: 5.63 mm (4:3)
HD Image: 5.82 mm (16:9)
Active Pixels 2304 (H) × 1536 (V): (Entire Array) Features
5.07mm (H) × 3.38mm (V)
2048 (H) × 1536 (V) (4:3, Still Mode)
• 2.2 mm Pixel with A−Pixt Technology
2304 (H) × 1296 (V) (16:9, HD Mode) • Full HD support at 60 fps
Pixel Size 2.2 × 2.2 mm (2304 (H) × 1296 (V)) for Maximum
Video Performance
Color Filter Array RGB Bayer
• Superior Low-light Performance
Shutter Type ERS and GRR
• 3.4 Mp (3:2) and 3.15 Mp (4:3) Still Images
Input Clock Range 6–27 MHz • Support for External Mechanical Shutter
Output Clock Maximum 196 Mp/s (4-lane HiSPi or MIPI) • Support for External LED or Xenon Flash
Output Video − 4-lane HiSPi 2304 × 1296 at 60 fps • Data Interfaces: Four-lane Serial High-speed
< 450 mW (VCM 0.2 V, 198 MP/s)
2304 × 1296 at 30 fps
Pixel Interface (HiSPi) Differential
< 300 mW (VCM 0.2 V, 98 MP/s) Signaling (SLVS), Four-lane Serial MIPI
Interface, or Parallel
Responsivity 2.0 V/lux−sec
• On-chip Phase-locked Loop (PLL)
SNRMAX 39 dB Oscillator
Dynamic Range 69.5 dB • Simple Two-wire Serial Interface
Supply Voltage • Auto Black Level Calibration
Digital 1.7–1.9 V (1.8 V Nominal)
Analog 2.7–2.9 V
• 12-to-10 Bit Output A−Law Compression
HiSPi PHY 1.7–1.9 V (1.8 V Nominal) • Slave Mode for Precise Frame-rate Control
HiSPi I/O (SLVS) 0.3–0.9 V (0.4 or 0.8 V Nominal)
HiSPi I/O (HiVCM) 1.7–1.9 V (1.8 V Nominal)
and for Synchronizing Two Sensors
I/O/Digital 1.7–1.9 V (1.8 V Nominal) or
2.4–3.1 V (2.8 V Nominal) Applications
Operating Temperature –30°C to + 70°C
• 1080p High-definition Digital Video
(Junction) −TJ Camcorder
Package Options CLCC − 11.4 mm × 11.4mm • Web Cameras and Video Conferencing
CSP − 6.28 mm × 6.65 mm Cameras
Bare Die
• Security
© Semiconductor Components Industries, LLC, 2010 1 Publication Order Number:

March, 2017 − Rev. 18 AR0330CM/D
AR0330CM
ORDERING INFORMATION
Table 2. AVAILABLE PART NUMBERS

Part Number Product Description Orderable Product Attribute Description
AR0330CM1C00SHAA0−DP 3 MP 1/3″ CIS Dry Pack with Protective Film
AR0330CM1C00SHAA0−DR 3 MP 1/3″ CIS Dry Pack without Protective Film
AR0330CM1C00SHAA0−TP 3 MP 1/3″ CIS Tape & Reel with Protective Film
AR0330CM1C00SHKA0−CP 3 MP 1/3″ CIS Chip Tray with Protective Film
AR0330CM1C00SHKA0−CR 3 MP 1/3″ CIS Chip Tray without Protective Film
AR0330CM1C12SHAA0−DP 3 MP 1/3″ CIS Dry Pack with Protective Film
AR0330CM1C12SHAA0−DR 3 MP 1/3″ CIS Dry Pack without Protective Film
GENERAL DESCRIPTION FUNCTIONAL OVERVIEW

The AR0330 can be operated in its default mode or The AR0330 is a progressive-scan sensor that generates
programmed for frame size, exposure, gain, and other a stream of pixel data at a constant frame rate. It uses an
parameters. The default mode output is a 2304 × 1296 image on-chip, phase-locked loop (PLL) that can generate all
at 60 frames per second (fps). The sensor outputs 10- or internal clocks from a single master input clock running
12-bit raw data, using either the parallel or serial (HiSPi, between 6 and 27 MHz. The maximum output pixel rate is
MIPI) output ports. 196 Mp/s using a 4-lane HiSPi or MIPI serial interface and
98 Mp/s using the parallel interface.
Test Pattern
Ext Generator
Clock
Analog Core 12-bit

Digital Core Output Data-Path
Row Noise Correction Compression (Optional)
PLL
Black Level Correction
Row Drivers
Timing Digital Gain

Pixel Column
and Data Pedestal
Array Amplifiers
Control 12-bit 10- or 12-bit
12-bit
ADC
Registers 8-,
12-bit
10-
or 12-bit
Two-wire
Serial I/F Parallel I/O: MIPI I/O: HiSPi I/O:
PIXCLK, FV, CLK P/N, SLVS C P/N,
LV, DOUT[11:0] DATA[11:0] P/N SLVS[3:0] P/N
Figure 1. Block Diagram
User interaction with the sensor is through the two-wire controlled by varying the time interval between reset and
serial bus, which communicates with the array control, readout. Once a row has been read, the signal from the
analog signal chain, and digital signal chain. The core of the column is amplified in a column amplifier and then digitized
sensor is a 3.4 Mp active-pixel sensor array. The timing and in an analog-to-digital converter (ADC). The output from
control circuitry sequences through the rows of the array, the ADC is a 12-bit value for each pixel in the array.
resetting and then reading each row in turn. In the time The ADC output passes through a digital processing signal
interval between resetting a row and reading that row, the chain (which provides further data path corrections and
pixels in the row integrate incident light. The exposure is applies digital gain).
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AR0330CM
WORKING MODES
The AR0330 sensor working modes are specified from the
following aspect ratios:
Table 3. AVAILABLE ASPECT RATIOS IN THE AR0330 SENSOR

Aspect Ratio Sensor Array Usage
3:2 Still Format #1 2256 (H) × 1504 (V)
4:3 Still Format #2 2048 (H) × 1536 (V)
16:10 Still Format #3 2256 (H) × 1440 (V)
16:9 HD Format 2304 (H) × 1296 (V)
The AR0330 supports the following working modes. To operate at half-speed (98 Mp/s) when using the parallel
operate the sensor at full speed (196 Mp/s) the sensor must interface.
use the 4-lane HiSPi or MIPI interface. The sensor will
Table 4. AVAILABLE WORKING MODES IN THE AR0330 SENSOR

Active Sensor FPS
Aspect Readout Output (4-lane MIPI/ FPS
Mode Ratio Window Resolution HiSPi Interface) (Parallel Interface) Subsampling FOV
1080p + EIS 16:9 2304 × 1296 2304 × 1296 60 N/A − 100%
30 30 − 100%
3M Still 4:3 2048 × 1536 2048 × 1536 30 25 − 100%
3:2 2256 × 1504 2256 × 1504 30 25 − 100%
WVGA + EIS 16:9 2304 × 1296 1152 × 648 60 60 2×2 100%
WVGA + EIS 16:9 2304 × 1296 1152 × 648 120 N/A 2×2 100%
Slow-motion
VGA Video 16:10 2256 × 1440 752 × 480 60 60 3×3 96%

VGA Video 16:10 2256 × 1440 752 × 480 215 107 3×3 96%
Slow-motion
HiSPi POWER SUPPLY CONNECTIONS

The HiSPi interface requires two power supplies. Two prior naming conventions have also been used with
The VDD_HiSPi powers the digital logic while the the VDD_HiSPi and VDD_HiSPi_TX pins:
VDD_HiSPi_TX powers the output drivers. The digital logic 1. Digital logic supply was named VDD_SLVS while
supply is a nominal 1.8 V and ranges from 1.7 to 1.9 V. the driver supply was named VDD_SLVS_TX.
The HiSPi drivers can receive a supply voltage of 0.4 to 2. Digital logic supply was named VDD_PHY while
0.8 V or 1.7 to 1.9 V. the driver supply was named VDD_SLVS.
The common mode voltage is derived as half of the
VDD_HiSPi _TX supply. Two settings are available for the
output common mode voltage:
1. SLVS Mode:
The VDD_HiSPi_Tx supply must be in the range
of 0.4 to 0.8 V and the high_vcm register bit
R0x306E[9] must be set to “0”.
The output common mode voltage will be in the
range of 0.2 to 0.4 V.
2. HiVCM Mode:
The VDD_HiSPi_Tx supply must be in the range
of 1.7 to 1.9 V and the high_vcm register bit
R0x306E[9] must be set to “1”. The output
common mode voltage will be in the range of 0.76
to 1.07 V.
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AR0330CM
TYPICAL CONFIGURATIONS
Digital Digital
I/O Core HiSPi PLL Analog Analog
Power1 Power1 Power1 Power1 Power1 Power1
VDD_IO VDD VAA VAA_PIX

1.5 kW3, 4
VDD_HiSPi_TX
VDD_PLL
VDD_MIPI
VDD_HiSPi
1.5 kW3
SLVS0_P
SLVS0_N
Master Clock SLVS1_P

(6−27 MHz) EXTCLK
SLVS1_N
SLVS2_P
To Controller
OE_BAR SLVS2_N
(HiSPi-serial
TRIGGER SLVS3_P Interface)
SADDR SLVS3_N
From
Controller SCLK SLVSC_P
SDATA SLVSC_N
FLASH
RESET_BAR SHUTTER
TEST
DGND GND_SLVS AGND
Digital Analog
Ground Ground
VDD_HiSPi_TX VDD_IO VDD VDD_HiSPi VDD_PLL VAA VAA_PIX
1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF
Notes:
1. All power supplies must be adequately decoupled. ON Semiconductor recommends having 1.0 mF and 0.1 mF decoupling capacitors for
every power supply. If space is a concern, then priority must be given in the following order: VAA, VAA_PIX, VDD_PLL, VDD_IO, and VDD.
Actual values and results may vary depending on layout and design considerations.
2. To allow for space constraints, ON Semiconductor recommends having 0.1 mF decoupling capacitor inside the module as close to the pads
as possible. In addition, place a 10 mF capacitor for each supply off-module but close to each supply.
3. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two-wire speed.
4. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is
minimized.
6. TEST pin should be tied to DGND.
7. Set High_VCM (R0x306E[9]) to 0 (default) to use the VDD_HiSPi_TX in the range of 0.4–0.8 V. Set High_VCM to 1 to use a range of
1.7–1.9 V.
8. The package pins or die pads used for the MIPI data and clock as well as the parallel interface must be left floating.
9. The VDD_MIPI package pin and sensor die pad should be connected to a 2.8 V supply as VDD_MIPI is tied to the VDD_PLL supply both
in the package routing and also within the sensor die itself.
10. If the SHUTTER or FLASH pins or pads are not used, then they must be left floating.
11. If the TRIGGER pin or pad is not used then it should be tied to DGND.
12. The GND_SLVS pad must be tied to DGND. It is connected this way in the CLCC and CSP packages.
Figure 2. Serial 4-lane HiSPi Interface
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AR0330CM
Digital Digital
I/O Core PLL Analog Analog
Power1 Power1 Power1 Power1 Power1
VDD_IO VDD VAA VAA_PIX
1.5 kW3, 4
VDD_PLL
VDD_MIPI
1.5 kW3
DATA1_P
DATA1_N
Master Clock DATA2_P

(6−27 MHz) EXTCLK
DATA2_N
DATA3_P
To Controller
OE_BAR DATA3_N
(MIPI-serial
TRIGGER DATA4_P Interface)
From SADDR DATA4_N
Controller SCLK CLK_P
SDATA CLK_N
RESET_BAR SHUTTER
FLASH
TEST
DGND AGND
Digital Analog
Ground Ground
VDD_IO VDD VDD_PLL VAA VAA_PIX
1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF
Notes:
every power supply. If space is a concern, then priority must be given in the following order: VAA, VAA_PIX, VDD_PLL, VDD_MIPI, VDD_IO,
and VDD. Actual values and results may vary depending on layout and design considerations.
minimized.
6. TEST pin must be tied to DGND for the MIPI configuration.
7. ON Semiconductor recommends that GND_MIPI be tied to DGND.
8. VDD_MIPI is tied to VDD_PLL in both the CLCC and the CSP package. ON Semiconductor strongly recommends that VDD_MIPI must be
connected to a VDD_PLL in a module design since VDD_PLL and VDD_MIPI are tied together in the die.
9. The package pins or die pads used for the HiSPi data and clock as well as the parallel interface must be left floating.
10. HiSPi Power Supplies (VDD_HISPI and VDD_HISPI_TX) can be tied to ground.
Figure 3. Serial MIPI
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AR0330CM
Digital Digital
I/O Core PLL Analog Analog
Power1 Power1 Power1 Power1 Power1

1.5 kW3, 4
1.5 kW3
Master Clock DOUT[11:0]

EXTCLK
(6−27 MHz)
PIXCLK
OE_BAR LINE_VALID To Controller
TRIGGER FRAME_VALID
From SADDR
Controller FLASH
SCLK
SDATA SHUTTER
RESET_BAR
TEST
DGND AGND
Digital Analog
Ground Ground
1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF 1.0 mF 0.1 mF
Notes:
every power supply. If space is a concern, then priority must be given in the following order: VAA, VAA_PIX, VDD_PLL, VDD_IO, and VDD.
Actual values and results may vary depending on layout and design considerations.
minimized.
6. TEST pin should be tied to the ground.
7. The data and clock package pins or die pads used for the HiSPi and MIPI interface must be left floating.
8. The VDD_MIPI package pin and sensor die pad should be connected to a 2.8 V supply as it is tied to the VDD_PLL supply both in the
package routing and also within the sensor die itself. HiSPi Power Supplies (VDD_HISPI and VDD_HISPI_TX) can be tied to ground.
Figure 4. Parallel Pixel Data Interface
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AR0330CM
PIN DESCRIPTIONS
Table 5. PIN DESCRIPTIONS

Name Type Description
RESET_BAR Input Asynchronous reset (active LOW). All settings are restored to factory default.
EXTCLK Input Master input clock, range 6−27 MHz.
OE_BAR Input Output enable (active LOW). Only available on bare die version.
TRIGGER Input Receives slave mode VD signal for frame rate synchronization and trigger to start a GRR frame.
SADDR Input Two-wire serial address select.
SCLK Input Two-wire serial clock input.
SDATA I/O Two-wire serial data I/O.
PIXCLK Output Pixel clock out. DOUT is valid on rising edge of this clock.
DOUT[11:0] Output Parallel pixel data output.
FLASH Output Flash output. Synchronization pulse for external light source. Can be left floating if not used.
FRAME_VALID Output Asserted when DOUT data is valid.
LINE_VALID Output Asserted when DOUT data is valid.
VDD Power Digital power.
VDD_IO Power IO supply power.
VDD_PLL Power PLL power supply. The MIPI power supply (VDD_MIPI) is tied to VDD_PLL in both packages.
DGND Power Digital GND.
VAA Power Analog power.
VAA_PIX Power Pixel power.
AGND Power Analog GND.
TEST Input Enable manufacturing test modes. Tie to DGND for normal sensor operation.
SHUTTER Output Control for external mechanical shutter. Can be left floating if not used.
SLVS0_P Output HiSPi serial data, lane 0, differential P.
SLVS0_N Output HiSPi serial data, lane 0, differential N.
SLVSC_P Output HiSPi serial DDR clock differential P.
SLVSC_N Output HiSPi serial DDR clock differential N.
DATA1_P Output MIPI serial data, lane 1, differential P.

DATA1_N Output MIPI serial data, lane 1, differential N.
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AR0330CM
Table 5. PIN DESCRIPTIONS (continued)

Name Type Description
CLK_P Output Output MIPI serial clock, differential P.
CLK_N Output Output MIPI serial clock, differential N.
VDD_HiSPi Power 1.8 V power port to HiSPi digital logic.
VDD_HiSPi_TX Power 0.4−0.8 V or 1.7−1.9 V. Refer to “HiSPi Power Supply Connections”.
VAA_HV_NPIX Power Power supply pin used to program the sensor OTPM (one-time programmable memory).
This pin should be open if OTPM is not used.
Table 6. CSP (HiSPi/MIPI) PACKAGE PINOUT

1 2 3 4 5 6 7 8
A VAA VAA_HV_NPIX AGND AGND VAA VDD TEST DGND
B DGND NC VAA_PIX DGND VDD_IO TRIGGER RESET_BAR EXTCLK
C VDD SHUTTER DGND SLVSC_P SLVS3_P SLVS3_N SLVS2_N SLVS2_P
D SADDR SCLK SDATA FLASH SLVSC_N SLVS1_P VDD_HiSPi_TX VDD_HiSPi
E VDD_IO VDD_IO CLK_N CLK_P DGND SLVS1_N SLVS0_N SLVS0_P
F DGND VDD_IO DGND DGND DATA4_P DATA_N DATA_P VDD_PLL
G VDD_IO VDD DGND VDD_IO DATA4_N DATA3_N DATA2_N VDD
H DGND VDD_IO VDD_IO DGND VDD_PLL DATA3_P DATA2_P VDD_PLL
NOTE: NC = No Connection.
VAA_HV_NPIX
VDD_IO
FLASH
SADDR
SDATA
DGND
DGND
DGND
SCLK
VDD
VDD
NC
43 48 1 6
VAA_PIX 42 7 DATA4_N
AGND DATA4_P
VAA DATA3_N
DGND DATA3_P
EXTCLK CLK_N
RESET_BAR CLK_P
TRIGGER DATA2_N
SHUTTER DATA2_P
TEST DATA1_N
VDD DATA1_P
VDD_IO VDD_PLL
DGND 31 18 DGND
30 19
SLVS3_P
SLVS2_P
VDD_HiSPi
SLVS1_P
SLVS0_P
SLVS3_N
SLVS2_N
VDD_HiSPi_TX
SLVS1_N
SLVS0_N
SLVSC_P
SLVSC_N
NOTE: Pins labeled NC (Not Connected) should be tied to ground.
Figure 5. CLCC Package Pin Descriptions
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AR0330CM
SENSOR INITIALIZATION
Power-Up Sequence 6. Assert RESET_BAR for at least 1 ms.

The recommended power-up sequence for the AR0330CS 7. Wait 150,000 EXTCLK periods (for internal
is shown in Figure 6. The available power supplies initialization into software standby.
(VDD_IO, VDD_PLL, VDD_MIPI, VAA, VAA_PIX) must 8. Write R0x3152 = 0xA114 to configure the internal
have the separation specified below. register initialization process.
1. Turn on VDD_PLL and VDD_MIPI power supplies. 9. Write R0x304A = 0x0070 to start the internal
2. After 100 ms, turn on VAA and VAA_PIX power register initialization process.
supply. 10. Wait 150,000 EXTCLK periods.
3. After 100 ms, turn on VDD power supply. 11. Configure PLL, output, and image settings to
4. After 100 ms, turn on VDD_IO power supply. desired values.
5. After the last power supply is stable, enable 12. Wait 1ms for the PLL to lock.
EXTCLK. 13. Set streaming mode (R0x301A[2] = 1).
VDD_PLL,
VDD_MIPI (2.8) t0
VAA_PIX
VAA (2.8) t1
VDD (1.8)
t2
VDD_IO (1.8/2.8)
EXTCLK
t3
RESET_BAR
Streaming
t4 t5 t6
tX Hard Internal R0x3152 = 0xA114 Internal Software
Reset Initialization R0x304A = 0x0070 Initialization Standby PLL Clock
Notes:
1. A software reset (R0x301A[0] = 1) is not necessary after the procedure described above since a Hard Reset will automatically triggers
a software reset. Independently executing a software reset, should be followed by steps seven through thirteen above.
2. The sensor must be receiving the external input clock (EXTCLK) before the reset pin is toggled. The sensor will begin an internal initialization
sequence when the reset pin toggle from LOW to HIGH. This initialization sequence will run using the external input clock. Power on default
state is software standby state, need to apply two-wire serial commands to start streaming. Above power up sequence is a general power
up sequence. For different interface configurations, MIPI, and Parallel, some power rails are not needed. Those not needed power rails
should be ignored in the general power up sequence.
Figure 6. Power Up
Table 7. POWER-UP SEQUENCE

Symbol Definition Min Typ Max Unit
t0 VDD_PLL, VDD_MIPI to VAA/VAA_PIX (Note 3) 0 100 – ms
t1 VAA/VAA_PIX to VDD 0 100 – ms
t2 VDD to VDD_IO 0 100 – ms
tX External Clock Settling Time (Note 1) – 30 – ms
t3 Hard Reset (Note 2) 1 – – ms
t4 Internal Initialization 150000 – – EXTCLKs
t5 Internal Initialization 150000 – – EXTCLKs
t6 PLL Lock Time 1 – – ms
1. External clock settling time is component-dependent, usually taking about 10–100 ms.
2. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard reset is held down by RC circuit, then the
RC time must include the all power rail settle time and Xtal settle time.
3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered before or at least at the same time as the
others. If the case happens that VDD_PLL is powered after other supplies then sensor may have functionality issues and will experience high
current draw on this supply.
4. VDD_MIPI is tied to VDD_PLL in the both the CLCC and CSP packages and must be powered to 2.8 V. The VDD_HiSPi and VDD_HiSPi_TX
supplies do not need to be turned on if the sensor is configured to use the MIPI or parallel interface.
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AR0330CM
Power-Down Sequence 2. The soft standby state is reached after the current
The recommended power-down sequence for the AR0330 row or frame, depending on configuration, has
is shown in Figure 7. The available power supplies ended.
(VDD_IO, VDD_HiSPi, VDD_HiSPi_TX, VDD_PLL, 3. Turn off VDD_HiSPi_TX.
VDD_MIPI, VAA, VAA_PIX) must have the separation 4. Turn off VDD_IO.
specified below. 5. Turn off VDD and VDD_HiSPi.
1. Disable streaming if output is active by setting 6. Turn off VAA/VAA_PIX.
standby R0x301a[2] = 0. 7. Turn off VDD_PLL, VDD_MIPI.
VDD_HiSPi_TX (0.4)
t0
VDD_IO (1.8/2.8)
t1
VDD,
VDD_HiSPi (1.8)
t2
VAA_PIX, VAA (2.8)

t3
VDD_PLL,
VDD_MIPI (2.8)
EXTCLK
t4
Power Down until Next

Power Up Cycle
Figure 7. Power Down
Table 8. POWER-DOWN SEQUENCE

Symbol Parameter Min Typ Max Unit
t0 VDD_HiSPi_TX to VDD_IO 0 – – ms
t1 VDD_IO to VDD and VDD_HiSPi 0 – – ms
t2 VDD and VDD_HiSPi to VAA/VAA_PIX 0 – – ms
t3 VAA/VAA_PIX to VDD_PLL 0 – – ms
t4 PwrDn until Next PwrUp Time 100 – – ms
NOTE: t4 is required between power down and next power up time; all decoupling caps from regulators must be completely discharged.
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AR0330CM
ELECTRICAL CHARACTERISTICS
Table 9. DC ELECTRICAL DEFINITIONS AND CHARACTERISTICS (MIPI MODE)

(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output Load = 68.5 pF; TJ = 60°C;
Data Rate = 588 Mbps; 2304 × 1296 at 60 fps)
VDD Core Digital Voltage 1.7 1.8 1.9 V
VDD_IO I/O Digital Voltage 1.7 1.8 1.9 V
2.4 2.8 3.1
VAA Analog Voltage 2.7 2.8 2.9 V
VAA_PIX Pixel Supply Voltage 2.7 2.8 2.9 V
VDD_PLL PLL Supply Voltage 2.7 2.8 2.9 V
VDD_MIPI MIPI Supply Voltage 2.7 2.8 2.9 V
I (VDD) Digital Operating Current − 114 136 mA
I (VDD_IO) I/O Digital Operating Current − 0 0 mA
I (VAA) Analog Operating Current − 41 53 mA
I (VAA_PIX) Pixel Supply Current − 9.9 12 mA
I (VDD_PLL) PLL Supply Current − 15 27 mA
I (VDD_MIPI) MIPI Digital Operating Current − 35 49 mA
Table 10. DC ELECTRICAL DEFINITIONS AND CHARACTERISTICS (HiSPi MODE)

(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; VDD_HiSPi = 1.8 V,
VDD_HiSPi_TX = 0.4 V; Output Load = 68.5 pF; TJ = 60°C; Data Rate = 588 Mbps; DLL Set to 0; 2304 × 1296 at 60 fps)
2.4 2.8 3.1
VDD_HiSPi HiSPi Digital Voltage 1.7 1.8 1.9 V
VDD_HiSPi_TX HiSPi I/O Digital Voltage 0.3 0.4 0.9 V
1.7 1.8 1.9
I (VDD) Digital Operating Current − 96.3 137 mA
I (VAA) Analog Operating Current − 45.1 53 mA
I (VDD_PLL) PLL Supply Current − 6.4 11 mA
I (VDD_HiSPi) HiSPi Digital Operating Current − 21.8 36 mA
I (VDD_HiSPi_TX) HiSPi I/O Digital Operating Current − 22.3 40 mA
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AR0330CM
Table 11. DC ELECTRICAL DEFINITIONS AND CHARACTERISTICS (PARALLEL MODE)

(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output Load = 68.5 pF; TJ = 60°C;
2304 × 1296 at 30 fps)
2.4 2.8 3.1
I (VDD) Digital Operating Current − 66.5 75 mA
I (VAA) Analog Operating Current − 36 44 mA
I (VDD_PLL) PLL Supply Current − 6 11 mA
Table 12. STANDBY POWER

(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output Load = 68.5 pF; TJ = 60°C)
Power Typ Max Unit

Hard Standby (CLK OFF) Digital 19.8 35.8 mA
Analog 5.8 7.0 mA
Soft Standby (CLK OFF) Digital 23.5 39.7 mA
Analog 5.4 5.9 mA
Soft Standby (CLK ON) Digital 15700 16900 mA
Analog 5.5 5.7 mA
CAUTION: Stresses greater than those listed in Table 13 may cause permanent damage to the device. This is a stress rating
only, and functional operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied.
Table 13. ABSOLUTE MAXIMUM RATINGS

Symbol Definition Min Max Unit
VDD_MAX Core Digital Voltage –0.3 2.4 V
VDD_IO_MAX I/O Digital Voltage –0.3 4 V
VAA_MAX Analog Voltage –0.3 4 V
VAA_PIX Pixel Supply Voltage –0.3 4 V
VDD_PLL PLL Supply Voltage –0.3 4 V
VDD_MIPI MIPI Supply Voltage –0.3 4 V
VDD_HiSPi_MAX HiSPi Digital Voltage –0.3 2.4 V
VDD_HiSPi_TX_MAX HiSPi I/O Digital Voltage –0.3 2.4 V
tST Storage Temperature –40 85 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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AR0330CM
Two-Wire Serial Register Interface

The electrical characteristics of the two-wire serial
register interface (SCLK, SDATA) are shown in Figure 8 and
Table 14.
SDATA
tLOW tBUF
tf tr tSU;DAT tf tHD;STA tr
SCLK
tHD;STA tSU;STA tSU;STO

tHD;DAT tHIGH
S Sr P S
NOTE: Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register address are issued.
Figure 8. Two-Wire Serial Bus Timing Parameters
Table 14. TWO-WIRE SERIAL BUS CHARACTERISTICS

(fEXTCLK = 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; TA = 25°C)
Standard Mode Fast Mode
Parameter Symbol Min Max Min Max Unit

SCLK Clock Frequency tSCL 0 100 0 400 kHz
Hold Time (Repeated) START Condition
After this Period, the First Clock Pulse is tHD;STA 4.0 − 0.6 − ms
Generated
LOW Period of the SCLK Clock tLOW 4.7 − 1.3 − ms
HIGH Period of the SCLK Clock tHIGH 4.0 − 0.6 − ms
Set-up Time for a Repeated START tSU;STA 4.7 − 0.6 − ms
Condition
Data Hold Time tHD;DAT 0 3.45 0 0.9 ms
(Note 4) (Note 5) (Note 6) (Note 5)
Data Set-up Time tSU;DAT 250 − 100 − ns
(Note 6)
Rise Time of both SDATA and SCLK tr − 1000 20 + 0.1 Cb 300 ns
Signals (Note 7)
Fall Time of both SDATA and SCLK tf − 300 20 + 0.1 Cb 300 ns
Signals (Note 7)
Set-up Time for STOP Condition tSU;STO 4.0 − 0.6 − ms
Bus Free Time between a STOP and tBUF 4.7 − 1.3 − ms
START Condition
Capacitive Load for Each Bus Line Cb − 400 − 400 pF
Serial Interface Input Pin Capacitance CIN_SI − 3.3 − 3.3 pF
SDATA Max Load Capacitance CLOAD_SD − 30 − 30 pF
SDATA Pull-up Resistor RSD 1.5 4.7 1.5 4.7 kW
1. This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.
2. Two-wire control is I2C-compatible.
3. All values referred to VIHmin = 0.9 VDD and VILmax = 0.1 VDD levels. Sensor EXCLK = 27 MHz.
4. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK.
5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal.
6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This
will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW period
of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode
I2C-bus specification) before the SCLK line is released.
7. Cb = total capacitance of one bus line in pF.
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AR0330CM
tR tF tRP tFP
90% 90% 90% 90%

10% 10% 10% 10%
tEXTCLK
EXTCLK
tCP
PIXCLK
tPD tPD
Data[11:0] Pxl_0 Pxl_1 Pxl_2 Pxl_n
tPLH tPFL
FRAME_VALID/ tPFH tPLL
LINE_VALID FRAME_VALID Leads LINE_VALID FRAME_VALID Trails LINE_VALID
by 609 PIXCLKs by 16 PIXCLKs
NOTE: PLL disabled for tCP.
Figure 9. I/O Timing Diagram
Table 15. I/O PARAMETERS

(fEXTCLK = 24 MHz; VDD = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output Load = 68.5 pF; TJ = 60°C; CLK_OP = 98 Mp/s)
Symbol Definition Condition Min Max Unit

VIH Input HIGH Voltage VDD_IO = 1.8 V 1.4 VDD_IO + 0.3 V
VDD_IO = 2.8 V 2.4 VDD_IO + 0.3
VIL Input LOW Voltage VDD_IO = 1.8 V GND – 0.3 0.4 mV
VDD_IO = 2.8 V GND – 0.3 0.8
IIN Input Leakage Current No Pull-up Resistor; VIN = VDD OR DGND –20 20 mA
VOH Output HIGH Voltage At Specified IOH VDD_IO − 0.4 – V
VOL Output LOW Voltage At Specified IOL – 0.4 V
IOH Output HIGH Current At Specified VOH – –12 mA
IOL Output LOW Current At Specified VOL – 9 mA
IOZ Tri-state Output Leakage Current – 10 mA
Table 16. I/O TIMING

(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output load = 68.5 pF; TJ = 60°C;
CLK_OP = 98 Mp/s)
Symbol Definition Conditions Min Typ Max Unit
fEXTCLK Input Clock Frequency PLL Enabled 6 24 27 MHz
tEXTCLK Input Clock Period PLL Enabled 166 41 20 ns
tR Input Clock Rise Time 0.5 – Sine Wave ns
Rise Time
tF Input Clock Fall Time 0.5 – Sine Wave ns
Fall Time
Clock Duty Cycle 45 50 55 %
tJITTER Input Clock Jitter – – 0.3 ns
Output Pin Slew Fastest CLOAD = 15 pF – 0.7 – V/ns
fPIXCLK PIXCLK frequency Default – 80 – MHz
tPD PIXCLK to data valid Default – – 3 ns
tPFH PIXCLK to FRAME_VALID HIGH Default – – 3 ns
tPLH PIXCLK to LINE_VALID HIGH Default – – 3 ns
tPFL PIXCLK to FRAME_VALID LOW Default – – 3 ns
tPLL PIXCLK to LINE_VALID LOW Default – – 3 ns
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AR0330CM
Table 17. PARALLEL I/O RISE SLEW RATE

(fEXTCLK = 24 MHz; VDD = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output Load = 68.5 pF; TJ = 60°C; CLK_OP = 98 Mp/s)
Parallel Slew Rate (R0x306E[15:13])
VDD_IO 0 1 2 3 4 5 6 7 Unit
1.70 V 0.069 0.115 0.172 0.239 0.325 0.43 0.558 0.836 V/ns
1.80 V 0.078 0.131 0.195 0.276 0.375 0.507 0.667 1.018
1.95 V 0.093 0.156 0.233 0.331 0.456 0.62 0.839 1.283
2.50 V 0.15 0.252 0.377 0.539 0.759 1.07 1.531 2.666
2.80 V 0.181 0.305 0.458 0.659 0.936 1.347 1.917 3.497
3.10 V 0.212 0.361 0.543 0.78 1.114 1.618 2.349 4.14
HiSPi TRANSMITTER
NOTE: Refer to “High-Speed Serial Pixel Interface Physical Layer Specification v2.00.00” for further explanation of the
HiSPi transmitter specification.
SLVS Electrical Specifications
Table 18. POWER SUPPLY AND OPERATING TEMPERATURE

(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output load = 68.5 pF; TJ = 60°C;
CLK_OP = 98 Mp/s)
IDD_HiSPi_TX SLVS Current Consumption (Notes 1, 2) − − n × 18 mA
IDD_HiSPi HiSPi PHY Current Consumption (Notes 1, 2, 3) − − n × 45 mA
TJ Operating Temperature (Note 4) −30 − 70 °C

1. Where ‘n’ is the number of PHYs.
2. Temperature of 25°C.
3. Up to 700 Mbps.
4. Specification values may be exceeded when outside this temperature range.
Table 19. SLVS ELECTRICAL DC SPECIFICATION (TJ = 25°C)

VCM SLVS DC Mean Common Mode Voltage 0.45 * VDD_TX 0.5 * VDD_TX 0.55 * VDD_TX V
|VOD| SLVS DC Mean Differential Output Voltage 0.36 * VDD_TX 0.5 * VDD_TX 0.64 * VDD_TX V
DVCM Change in VCM between Logic 1 and 0 − − 25 mV
|VOD| Change in |VOD| between Logic 1 and 0 − − 25 mV
NM VOD Noise Margin − − ±30 %
|DVCM| Difference in VCM between any Two Channels − − 50 mV
|DVOD| Difference in VOD between any Two Channels − − 100 mV
VCM_AC Common-mode AC Voltage (pk) without VCM Cap − − 50 mV

Termination
VCM_AC Common-mode AC Voltage (pk) with VCM Cap − − 30 mV

Termination
VOD_AC Maximum Overshoot Peak |VOD| − − 1.3 * |VOD| V
VDiff_pk-pk Maximum Overshoot VDiff_pk-pk − − 2.6 * VOD V
RO Single-ended Output Impedance 35 50 70 W

DRO Output Impedance Mismatch − − 20 %
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AR0330CM
Table 20. SLVS ELECTRICAL TIMING SPECIFICATION

Symbol Parameter Min Max Unit
1/UI Data Rate (Note 1) 280 700 Mbps
tPW Bitrate Period (Note 1) 1.43 3.57 ns
tPRE Max Setup Time from Transmitter (Notes 1, 2) 0.3 − UI
tPOST Max Hold Time from Transmitter (Notes 1, 2) 0.3 − UI
tEYE Eye Width (Notes 1, 2) − 0.6 UI
tTOTALJIT Data Total Jitter (pk-pk) @1e−9 (Notes 1, 2) − 0.2 UI
tCKJIT Clock Period Jitter (RMS) (Note 2) − 50 ps
tCYCJIT Clock Cycle-to-Cycle Jitter (RMS) (Note 2) − 100 ps
tR Rise Time (20−80%) (Note 3) 150 ps 0.25 UI
tF Fall Time (20−80%) (Note 3) 150 ps 0.25 UI
DCYC Clock Duty Cycle (Note 2) 45 55 %
tCHSKEW Mean Clock to Data Skew (Notes 1, 4) −0.1 0.1 UI
tPHYSKEW PHY-to-PHY Skew (Notes 1, 5) − 2.1 UI
tDIFFSKEW Mean Differential Skew (Note 6) −100 100 ps

1. One UI is defined as the normalized mean time between one edge and the following edge of the clock.
2. Taken from the 0 V crossing point with the DLL off.
3. Also defined with a maximum loading capacitance of 10 pF on any pin. The loading capacitance may also need to be less for higher bitrates
so the rise and fall times do not exceed the maximum 0.3 UI.
4. The absolute mean skew between the Clock lane and any Data Lane in the same PHY between any edges.
5. The absolute skew between any Clock in one PHY and any Data lane in any other PHY between any edges.
6. Differential skew is defined as the skew between complementary outputs. It is measured as the absolute time between the two
complementary edges at mean VCM point. Note that differential skew also is related to the DVCM_AC spec which also must not be exceeded.
HiVCM Electrical Specifications still scalable with VDD_HiSPi_TX, but with

The HiSPi 2.0 specification also defines an alternative VDD_HiSPi_TX nominal set to 1.8 V the common-mode is
signaling level mode called HiVCM. Both VOD and VCM are elevated to around 0.9 V.
Table 21. HiVCM POWER SUPPLY AND OPERATING TEMPERATURES

IDD_HiSPi_TX HiVCM Current Consumption (Notes 1, 2) − − n * 34 mA
IDD_HiSPi HiSPi PHY Current Consumption (Notes 1, 2, 3) − − n * 45 mA
TJ Operating Temperature (Note 4) −30 − 70 °C

1. Where ‘n’ is the number of PHYs.
2. Temperature of 25°C.
3. Up to 700 Mbps.
4. Specification values may be exceeded when outside this temperature range.
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AR0330CM
Table 22. HiVCM ELECTRICAL VOLTAGE AND IMPEDANCE SPECIFICATION (TJ = 25°C)
VCM HiVCM DC Mean Common Mode Voltage 0.76 0.90 1.07 V
|VOD| HiVCM DC Mean Differential Output Voltage 200 280 350 mV
DVCM Change in VCM between Logic 1 and 0 − − 25 mV
|VOD| Change in |VOD| between Logic 1 and 0 − − 25 mV
NM VOD Noise Margin − − ±30 %
|DVCM| Difference in VCM between any Two Channels − − 50 mV
|DVOD| Difference in VOD between any Two Channels − − 100 mV
DVCM_AC Common-mode AC Voltage (pk) without VCM Cap − − 50 mV

Termination
DVCM_AC Common-mode AC Voltage (pk) with VCM Cap − − 30 mV

Termination
VOD_AC Maximum Overshoot Peak |VOD| − − 1.3 * |VOD| V
VDiff_pk-pk Maximum Overshoot VDiff pk-pk − − 2.6 * VOD V
RO Single-ended Output Impedance 40 70 100 W
DRO Output Impedance Mismatch − − 20 %
Table 23. HiVCM ELECTRICAL AC SPECIFICATION

tPOST Max Gold Time from Transmitter (Notes 1, 2) 0.3 − UI
tCHSKEW Clock to Data Skew (Notes 1, 4) −0.1 0.1 UI

5. The absolute mean skew between any Clock in one PHY and any Data lane in any other PHY between any edges.
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AR0330CM
Electrical Definitions VCM use the DC test circuit shown in Figure 11 and set the
Figure 10 is the diagram defining differential amplitude HiSPi PHY to constant Logic 1 and Logic 0. Measure Voa,
VOD, VCM, and rise and fall times. To measure VOD and Vob and VCM with voltmeters for both Logic 1 and Logic 0.
Single-Ended Signals
Voa
VOD_AC VOD V oa ) V ob
V CM +
2
Vob
Differential Signal
80%
VOD =
VDiff |Voa − Vob|
tR tF
0V
VOD =
|Vob − Voa| Vdiff_pkpk
20%
Figure 10. Single-Ended and Differential Signals
50 W
Voa
V VCM
Vob
50 W
V
Figure 11. DC Test Circuit
V OD(m) + ŤV oa(m) * V ob(m)Ť (eq. 1) Both VOD and VCM are measured for all output channels.
The worst case DVOD is defined as the largest difference in
Where m is either “1” for logic 1 or “0” for logic 0. VOD between all channels regardless of logic level. And the
V OD(1) ) V OD(0) worst case DVCM is similarly defined as the largest
V OD + (eq. 2)
2 difference in VCM between all channels regardless of logic
level.
V Diff + V OD(1) ) V OD(0) (eq. 3)
DV OD + ŤV OD(1) * V OD(0)Ť (eq. 4)
V CM(1) ) V CM(0)
V CM + (eq. 5)
2
DV CM + ŤV CM(1) * V CM(0)Ť (eq. 6)
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AR0330CM
Timing Definitions edge, as shown in Figure 12. This time is

1. Timing measurements are to be taken using the compared with the ideal Data transition point of
Square Wave test mode. 0.5 UI with the difference being the Clock-to-Data
2. Rise and fall times are measured between 20% to Skew (see Equation 7).
80% positions on the differential waveform, as t pw
shown in Figure 10. t CHSKEW(ps) + Dt * (eq. 7)
2
3. Mean Clock-to-Data skew should be measured
from the 0 V crossing point on Clock to the 0 V t CHSKEW(UI) +
Dt
* 0.5 (eq. 8)
crossing point on any Data channel regardless of t pw
tpw
Clock 1 UI
0.5 UI
Dt
Data tCHSKEW
Figure 12. Clock-to-Data Skew Timing Diagram
4. The differential skew is measured on the two corresponding transition on Vob signal at VCM
single-ended signals for any channel. The time is crossing point.
taken from a transition on Voa signal to
VCM
tDIFFSKEW
Common-mode AC Signal
VCM_AC
VCM
VCM_AC
Figure 13. Differential Skew
Figure 13 also shows the corresponding AC VCM which the receiver needs to be able to reject. VCM_AC is
common-mode signal. Differential skew between the Voa measured as the absolute peak deviation from the mean DC
and Vob signals can cause spikes in the common-mode, VCM common-mode.
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AR0330CM
Transmitter Eye Mask
1.3 * VOD
VOD
Eye Width
0.7 * VOD
Differential Amplitude
Eye Height
0
−0.7 * VOD
tPRE tPOST
−VOD
−1.3 * VOD
0 0.2 0.37 0.5 0.63 0.8 1

Normalized Time
Figure 14. Transmitter Eye Mask
Figure 14 defines the eye mask for the transmitter. 0.5 UI Clock Signal
point is the instantaneous crossing point of the Clock. The tHCLK is defined as the high clock period, and tLCLK is
area in white shows the area Data is prohibited from crossing defined as the low clock period as shown in Figure 15. The
into. The eye mask also defines the minimum eye height, the clock duty cycle DCYC is defined as the percentage time the
data tPRE and tPOST times, and the total jitter pk-pk +mean clock is either high (tHCLK) or low (tLCLK) compared with
skew (tTJSKEW ) for Data. the clock period T.
T
2 UI
tHCLK
Clock
tLCLK
Figure 15. Clock Duty Cycle
t HCLK T
D CYC(1) + (eq. 9) t pw + (i.e, 1 UI) (eq. 11)
T 2
t LCLK 1
Bitrate + (eq. 12)
D CYC(0) + (eq. 10) t pw
T
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AR0330CM
Figure 16 shows the definition of clock jitter for both the

period and the cycle-to-cycle jitter.
tHCLK tLCLK
tCKJIT (RMS)
tpw
Figure 16. Clock Jitter
Period Jitter (tCKJIT) is defined as the deviation of the Cycle-to-cycle jitter (tCYCJIT) is defined as the difference
instantaneous clock tPW from an ideal 1 UI. This should be in time between consecutive clock high and clock low
measured for both the clock high period variation DtHCLK, periods tHCLK and tLCLK, quoting the RMS value of the
and the clock low period variation DtLCLK taking the RMS variation D(tHCLK − tLCLK).
or 1-sigma standard deviation and quoting the worse case If pk-pk jitter is also measured, this should be limited to
jitter between DtHCLK and DtLCLK. ±3-sigma.
Table 24. HiVCM ELECTRICAL AC SPECIFICATION

tPOST Max Gold Time from Transmitter (Notes 1, 2) 0.3 − UI
tCHSKEW Clock to Data Skew (Notes 1, 4) −0.1 0.1 UI

5. The absolute mean skew between any Clock in one PHY and any Data lane in any other PHY between any edges.
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AR0330CM
SEQUENCER SENSOR PLL

The sequencer digital block determines the order and VCO
timing of operations required to sample pixel data from the The sensor contains a phase-locked loop (PLL) that is
array during each row period. It is controlled by an used for timing generation and control. The required VCO
instruction set that is programmed into RAM from the clock frequency is attained through the use of a pre-PLL
sensor OTPM (One Time Programmable Memory). The clock divider followed by a multiplier (see Figure 17). The
OTPM is configured during production. multiplier is followed by set of dividers used to generate the
The instruction set determines the length of the sequencer output clocks required for the sensor array, the pixel analog
operation that determines the “ADC Readout Limitation” and digital readout paths, and the output parallel and serial
(Equation 5) listed in the Sensor Frame Rate section. The interfaces.
instruction set can be shortened through register writes in
order to achieve faster frame rates. Instructions for Dual Readout Paths
shortening the sequencer can be found in the AR0330 There are two readout paths within the sensor digital block
Developer Guide. (see Figure 18).
The sequencer digital block can be reprogrammed using The sensor row timing calculations refers to each
the following instructions: data-path individually. For example, the sensor default
Program a new sequencer. configuration uses 1248 clocks per row (line_length_pck) to
1. Place the sensor in standby. output 2304 active pixels per row. The aggregate clocks per
2. Write 0x8000 to R0x3088 (“seq_ctrl_port”). row seen by the receiver will be 2496 clocks (1248 × 2
3. Write each instruction incrementally to R0x3086. readout paths).
Each write must be 16-bit consisting of two bytes
{Byte[N], Byte[N+1]}.
4. If the sequencer consists of an odd number of
bytes, set the last byte to “0”.
Read the instructions stored in the sequencer.
1. Place the sensor in standby.
2. Write 0xC000 to R0x3088 (“seq_ctrl_port”).
3. Sequentially read one byte at a time from R0x3086
with 8-bit read command.
EXTCLK pre_pll_clk_div pll_multiplier

2(1−64) 58(32−384) FVCO
(6−27 MHz)
Figure 17. Relationship between Readout Clock and Peak Pixel Rate
All Digital
Blocks
CLK_PIX
Serial Output
(MIPI or HiSPi) Pixel Rate = 2 × CLK_PIX
Pixel Array = # Data Lanes × CLK_OP (HiSPi or MIPI)
= CLK_OP (Parallel)
All Digital
Blocks
CLK_PIX
Figure 18. Sensor Dual Readout Paths
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AR0330CM
Parallel PLL Configuration
FVCO
pre_pll_clk_div pll_multiplier vt_sys_clk_div vt_pix_clk_div

EXTCLK 1(1, 2, 4, 6, 8, CLK_OP
(6−27 MHz) 2(1−64) 58(32−384) 6(4−16) (Max 98 Mpixel/s)
10, 12, 14, 16)
1/2 CLK_PIX
(Max 49 Mpixel/s)
Figure 19. PLL for the Parallel Interface
(The parallel interface has a maximum output data-rate of 98 Mpixel/s)
The maximum output of the parallel interface is FSERIAL, FSERIAL_CLK, or CLK_OP when configured to use
98 Mpixel/s (CLK_OP). This will limit the readout clock the parallel interface.
(CLK_PIX) to 49 Mpixel/s. The sensor will not use the
Table 25. PLL PARAMETERS FOR THE PARALLEL INTERFACE

EXTCLK External Clock 6 27 MHz
FVCO VCO Clock 384 768 MHz
CLK_PIX Readout Clock 49 Mpixel/s
CLK_OP Output Clock 98 Mpixel/s
Table 26. EXAMPLE PLL CONFIGURATION FOR THE PARALLEL INTERFACE

Parameter Value Output
FVCO 588 MHz (Max)
vt_sys_clk_div 1
vt_pix_clk_div 6
CLK_PIX 49 Mpixel/s (= 588 MHz/12)
CLK_OP 98 Mpixel/s (= 588 MHz/6)
Output Pixel Rate 98 Mpixel/s
Serial PLL Configuration
FVCO
pre_pll_clk_div pll_multiplier vt_sys_clk_div vt_pix_clk_div

EXTCLK 1(1, 2, 4, 6, 8, CLK_PIX
(6−27 MHz) 2(1−64) 58(32−384) 6(4−16)
10, 12, 14, 16)
op_sys_clk_div op_pix_clk_div
Constant − 1 12(8, 10, 12) CLK_OP
FVCO
FSERIAL
1/2 FSERIAL_CLK
Figure 20. PLL for the Serial Interface
The sensor will use op_sys_clk_div and op_pix_clk_div (1, 2, or 4) configured. To configure the sensor protocol and
to configure the output clock per lane (CLK_OP). The number of lanes, refer to “Serial Configuration”.
configuration will depend on the number of active lanes
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AR0330CM
Table 27. PLL PARAMETERS FOR THE SERIAL INTERFACE

EXTCLK External Clock 6 27 MHz
FVCO VCO Clock 384 768 MHz
CLK_PIX Readout Clock − 98 Mpixel/s
CLK_OP Output Clock − 98 Mpixel/s
FSERIAL Output Serial Data Rate Per Lane Mbps
HiSPi 300 700
MIPI 384 768
FSERIAL_CLK Output Serial Clock Speed Per Lane MHz
HiSPIi 150 350
MIPI 192 384
The serial output should be configured so that it adheres ♦ 4-lane: 4 × CLK_OP = 2 × CLK_PIX = Pixel Rate
to the following rules: (max: 196 Mpixel/s)
• The maximum data-rate per lane (FSERIAL) is ♦ 2-lane: 2 × CLK_OP = 2 × CLK_PIX = Pixel Rate
768 Mbps/lane (MIPI) and 700 Mbps/lane (HiSPi). (max: 98 Mpixel/s)
• The output pixel rate per lane (CLK_OP) should be ♦ 1-lane: 1 × CLK_OP = 2 × CLK_PIX = Pixel Rate
configured so that the sensor output pixel rate matches (max: 76 Mpixel/s)
the peak pixel rate (2 × CLK_PIX):
Table 28. EXAMPLE PLL CONFIGURATIONS FOR THE SERIAL INTERFACE

4-lane 2-lane 1-lane
Parameter 12-bit 10-bit 12-bit 10-bit 12-bit 10-bit 8-bit Unit

FVCO 588 490 588 490 768 768 768 MHz
vt_sys_clk_div 1 1 2 2 4 4 4
vt_pix_clk_div 6 5 6 5 6 5 4
op_sys_clk_div 1 1 1 1 1 1 1
op_pix_clk_div 12 10 12 10 12 10 8
FSERIAL 588 490 588 490 768 768 768 MHz
FSERIAL_CLK 294 245 294 245 384 384 384 MHz
CLK_PIX 98 98 49 49 32 38.4 48 Mpixel/s
CLK_OP 49 49 49 49 64 76.8 96 Mpixel/s
Pixel Rate 196 196 98 98 64 76.8 96 Mpixel/s
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AR0330CM
PIXEL OUTPUT INTERFACES

Parallel Interface When the parallel pixel data interface is in use, the serial
The parallel pixel data interface uses these output-only data output signals can be left unconnected. Set
signals: reset_register[12] to disable the serializer while in parallel
• FV output mode.
• LV Output Enable Control
• PIXCLK When the parallel pixel data interface is enabled, its
• DOUT[11:0] signals can be switched asynchronously between the driven
and High−Z under pin or register control, as shown in
The parallel pixel data interface is disabled by default at
Table 29. OE_BAR pin is only available on the bare die
power up and after reset. It can be enabled by programming
version.
R0x301A. Table 30 shows the recommended settings.
Table 29. OUTPUT ENABLE CONTROL

OE_BAR Pin Drive Signals R0x301A−B[6] Description
Disabled 0 Interface High−Z
Disabled 1 Interface Driven
1 0 Interface High−Z
X 1 Interface Driven
0 X Interface Driven
Configuration of the Pixel Data Interface

Fields in R0x301A are used to configure the operation of
the pixel data interface. The supported combinations are
shown in Table 30.
Table 30. CONFIGURATION OF THE PIXEL DATA INTERFACE
Serializer Parallel Standby
Disable Enable End-of-Frame
R0x301A−B[12] R0x301A−B[7] R0x301A−B[7] Description
0 0 1 Power up default. Serial pixel data interface and its clocks are enabled.
Transitions to soft standby are synchronized to the end of frames on the
serial pixel data interface.
1 1 0 Parallel pixel data interface, sensor core data output. Serial pixel data
interface and its clocks disabled to save power. Transitions to soft standby
are synchronized to the end of the current row readout on the parallel pixel
data interface.
1 1 1 Parallel pixel data interface, sensor core data output. Serial pixel data
interface and its clocks disabled to save power. Transitions to soft standby
are synchronized to the end of frames in the parallel pixel data interface.
High Speed Serial Pixel Data Interface The HiSPi interface supports three protocols, Streaming
The High Speed Serial Pixel (HiSPi) interface uses four S, Streaming SP, and Packetized SP. The streaming
data and one clock low voltage differential signaling protocols conform to a standard video application where
(LVDS) outputs. each line of active or intra-frame blanking provided by the
• SLVSC_P sensor is transmitted at the same length. The Packetized SP
• SLVSC_N protocol will transmit only the active data ignoring
line-to-line and frame-to-frame blanking data.
• SLVS0_P
These protocols are further described in the High-Speed
• SLVS0_N Serial Pixel (HiSPi) Interface Protocol Specification
• SLVS1_P V1.00.00.
• SLVS1_N The HiSPi interface building block is a unidirectional
• SLVS2_P differential serial interface with four data and one double
• SLVS2_N data rate (DDR) clock lanes. One clock for every four serial
data lanes is provided for phase alignment across multiple
• SLVS3_P
lanes. Figure 21 shows the configuration between the HiSPi
• SLVS3_N transmitter and the receiver.
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AR0330CM
A Camera Containing A Host (DSP) Containing

the HiSPi Transmitter the HiSPi Receiver
Dp0 Dp0
Dn0 Dn0
Dp1 Dp1
Dn1 Dn1
Dp2 Dp2
Tx Rx
PHY0 Dn2 Dn2 PHY0
Dp3 Dp3
Dn3 Dn3
Cp0 Cp0
Cn0 Cn0
Figure 21. HiSPi Transmitter and Receiver Interface Block Diagram
HiSPi Physical Layer The PHY will serialize a 10-, 12-, 14- or 16-bit data word
The HiSPi physical layer is partitioned into blocks of four and transmit each bit of data centered on a rising edge of the
data lanes and an associated clock lane. Any reference to the clock, the second on the falling edge of clock. Figure 22
PHY in the remainder of this document is referring to this shows bit transmission. In this example, the word is
minimum building block. transmitted in order of MSB to LSB. The receiver latches
data at the rising and falling edge of the clock.
TxPost
cp
….
cn
TxPre
dp
MSB …. LSB
dn
1 UI
Figure 22. Timing Diagram
DLL Timing Adjustment

The specification includes a DLL to compensate for increase the setup or hold time at the receiver circuits and
differences in group delay for each data lane. The DLL is can be used to compensate for skew introduced in PCB
connected to the clock lane and each data lane, which acts as design.
a control master for the output delay buffers. Once the DLL If the DLL timing adjustment is not required, the data and
has gained phase lock, each lane can be delayed in 1/8 unit clock lane delay settings should be set to a default code of
interval (UI) steps. This additional delay allows the user to 0x000 to reduce jitter, skew, and power dissipation.
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AR0330CM
delclock[2:0]
del0[2:0]
del1[2:0]
del2[2:0]
del3[2:0]
Delay Delay Delay Delay Delay
data_lane0 data_lane1 clock_lane0 data_lane2 data_lane3
Figure 23. Block Diagram of DLL Timing Adjustment
1 UI
dataN (delN = 000)
cp (delclock = 000)
cp (delclock = 001)
cp (delclock = 010)
cp (delclock = 011)
cp (delclock = 100)
cp (delclock = 101)
cp (delclock = 110)
cp (delclock =111)
increasing delclock_[2:0] increases clock delay
Figure 24. Delaying the Clock_lane with Respect to the Data_lane
cp (delclock = 000)
dataN (delN = 000)
dataN (delN = 001)
dataN (delN = 010)
dataN (delN = 011)

dataN (delN = 100)
dataN (delN = 101)
dataN (delN = 110)
dataN (delN = 111)

increasing delN_[2:0] increases data delay
tDLLSTEP
1 UI
Figure 25. Delaying the Data_lane with Respect to the Clock_lane
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AR0330CM
HiSPi Streaming Mode Protocol Layer Serial Configuration

The HiSPi protocol is described HiSPi Protocol V1.00.00 The serial format should be configured using R0x31AC.
A. This register should be programmed to 0x0C0C when using
the parallel interface.
MIPI Interface The R0x0112−3 register can be programmed to any of the
The serial pixel data interface uses the following following data format settings that are supported:
output-only signal pairs: • 0x0C0C – Sensor supports RAW12 uncompressed data
• DATA1_P format
• DATA1_N • 0x0C0A – The sensor supports RAW12 compressed
• DATA2_P format (10-bit words) using 12−10 bit A−LAW
• DATA2_N Compression. See “Compression” section
• DATA3_P • 0x0A0A – Sensor supports RAW10 uncompressed data
• DATA3_N format. This mode is supported by discarding all but the
• DATA4_P upper 10 bits of a pixel value
• DATA4_N • 0x0808 – Sensor supports RAW8 uncompressed data
format. This mode is supported by discarding all but the
• CLK_P upper 8 bits of a pixel value (MIPI only).
• CLK_N
The serial_format register (R0x31AE) register controls
The signal pairs use both single-ended and differential which serial interface is in use when the serial interface is
signaling, in accordance with the the MIPI Alliance enabled (reset_register[12] = 0). The following serial
Specification for D−PHY v1.00.00. The serial pixel data formats are supported:
interface is enabled by default at power up and after reset. • 0x0201 – Sensor supports single-lane MIPI operation
The DATA0_P, DATA0_N, DATA1_P, DATA1_N,
CLK_P and CLK_N pads are set to the Ultra Low Power
• 0x0202 – Sensor supports dual-lane MIPI operation
State (ULPS) if the serial disable bit is asserted • 0x0204 – Sensor supports quad-lane MIPI operation
(R0x301A−B[12] = 1) or when the sensor is in the hardware • 0x0304 − Sensor supports quad-lane HiSPi operation
standby or soft standby system states. The MIPI timing registers must be configured differently
When the serial pixel data interface is used, the for 10-bit or 12-bit modes. These modes should be
LINE_VALID, FRAME_VALID, PIXCLK and configured when the sensor streaming is disabled. See
DOUT[11:0] signals (if present) can be left unconnected. Table 31.
Table 31. RECOMMENDED MIPI TIMING CONFIGURATION

Configuration
10-bit, 490 Mbps/Lane 12-bit, 588 Mbps/Lane
Register Clocking: Continuous Description

0x31B0 40 36 Frame Preamble
0x31B2 14 12 Line Preamble
0x31B4 0x2743 0x2643 MIPI Timing 0
0x31B6 0x114E 0x114E MIPI Timing 1
0x31B8 0x2049 0x2048 MIPI Timing 2
0x31BA 0x0186 0x0186 MIPI Timing 3
0x31BC 0x8005 0x8005 MIPI Timing 4
0x31BE 0x2003 0x2003 MIPI Config Status
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AR0330CM
PIXEL SENSITIVITY
Row Integration
(tINTEGRATION)
Row Reset Row Readout

(Start of Integration)
Figure 26. Integration Control in ERS Readout
A pixel’s integration time is defined by the number of T INTEGRATION + T COARSE * T FINE (eq. 13)
clock periods between a row’s reset and read operation. Both
The coarse integration time is defined by the number of
the read followed by the reset operations occur within a row
row periods (TROW) between a row’s reset and the row read.
period (TROW) where the read and reset may be applied to
The row period is the defined as the time between row read
different rows. The read and reset operations will be applied
operations (see Sensor Frame Rate section).
to the rows of the pixel array in a consecutive order.
T COARSE + T ROW coarse_integration_time (eq. 14)
The integration time in an ERS frame is defined as:
Vertical Blanking
Horizontal Blanking
Read
TCOARSE =
coarse_integration_time × TROW TFRAME = frame_length_lines × TROW
8.33 ms = 654 Rows × 12.7 ms/Row Image 16.6 ms = 1308 Rows × 12.7 ms/Row
Time
Reset
Vertical Blanking
Figure 27. Example of 8.33 ms Integration in 16.6 ms Frame
The fine integration is then defined by the number of pixel within TROW. This period is defined by the
clock periods between the row reset and row read operation fine_integration_time register.
Start of Read Row N Start of Read Row N+1

and Reset Row K and Reset Row K+1
Read Row N Reset Row K
TFINE = fine_integration_time × (1 / CLK_PIX)
TROW = line_length_pck × (1 / CLK_PIX)
Figure 28. Row Read and Row Reset Showing Fine Integration
fine_integration_time ON Semiconductor recommends that the

T FINE + (eq. 15)
clk_pix fine_integration_time in the AR0330 be left at zero.
The maximum allowed value for fine_integration_time is
line_length_pck − 1204.
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AR0330CM
Vertical Blanking
Horizontal Blanking
Read
Pointer
TFRAME = frame_length_lines × TROW
Image 16.6 ms = 1308 Rows × 12.7 ms/Row
TCOARSE =
coarse_integration_time × TROW
20.7 ms = 1634 Rows × 12.7 ms/Row Vertical Blanking
Extended Vertical Blanking 4.1 ms

Time
Shutter Horizontal Blanking

Pointer Image
Figure 29. The Row Integration Time is Greater than the Frame Readout Time
The minimum frame-time is defined by the number of row equal to or greater than the frame_length_lines.
periods per frame and the row period. The sensor frame-time The maximum integration time can be limited to the frame
will increase if the coarse_integration_time is set to a value time by setting R0x30CE[5] to 1.
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AR0330CM
GAIN STAGES
The analog gain stages of the AR0330 sensor are shown will apply the same analog gain to each color channel.
in Figure 30. The sensor analog gain stage consists of Digital gain can be configured to separate levels for each
column amplifiers and a variable ADC reference. The sensor color channel.
ADC Digital Gain

Reference with Dithering
Coarse Gain: 1x to 15.992x

1x, 2x, 4x, 8x (128 Steps per 6 dB)
Fine Gain: “xxxx.yyyy”
1−2x: 16 Steps xxxx(15−0)
2−4x: 8 Steps yyyyyyy(127/128 to 0)
4−8x: 4 Steps
Figure 30. Gain Stages in AR0330 Sensor
The level of analog gain applied is controlled by the recommended gain tables are listed in Table 32. It is
coarse_gain and fine_gain registers. The analog readout can recommended that these registers are configured before
be configured differently for each gain level. The streaming images.
Table 32. RECOMMENDED SENSOR ANALOG GAIN TABLES

COARSE_GAIN FINE_GAIN Total Gain COARSE_GAIN FINE_GAIN Total Gain
Gain Gain Gain Gain
R0x3060[5:4] (x) R0x3060[3:0] (x) (x) (dB) R0x3060[5:4] (x) R0x3060[3:0] (x) (x) (dB)
0 1 0 1.00 1.00 0.00 0 1x 15 1.88 1.88 5.49
0 1 1 1.03 1.03 0.26 1 2x 0 1.00 2.00 6.00
0 1 2 1.07 1.07 0.56 1 2x 2 1.07 2.13 6.58
0 1 3 1.10 1.10 0.86 1 2x 4 1.14 2.29 7.18
0 1 4 1.14 1.14 1.16 1 2x 6 1.23 2.46 7.82
0 1 5 1.19 1.19 1.46 1 2x 8 1.33 2.67 8.52
0 1 6 1.23 1.23 1.80 1 2x 10 1.45 2.91 9.28
0 1 7 1.28 1.28 2.14 1 2x 12 1.60 3.20 10.10
0 1 8 1.33 1.33 2.50 1 2x 14 1.78 3.56 11.02
0 1 9 1.39 1.39 2.87 2 4x 0 1.00 4.00 12.00
0 1 10 1.45 1.45 3.25 2 4x 4 1.14 4.57 13.20
0 1 11 1.52 1.52 3.66 2 4x 8 1.33 5.33 14.54
0 1 12 1.60 1.60 4.08 2 4x 12 1.60 6.40 16.12
0 1 13 1.68 1.68 4.53 3 8x 0 1.00 8.00 18.00
0 1 14 1.78 1.78 5.00
Each digital gain can be configured from a gain of 0 to The sensor includes a digital dithering feature to reduce
15.875. The digital gain supports 128 gain steps per 6 dB of quantization resulting from using digital gain can be
gain. The format of each digital gain register is implemented by setting R0x30BA[5] to 1. The default value
“xxxx.yyyyyyy” where “xxxx” refers an integer gain of 1 to is 0. Refer to “Real-Time Context Switching” for the analog
15 and “yyyyyyy” is a fractional gain ranging from 0/128 to and digital gain registers in both context A and context B
127/128. modes.
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AR0330CM
DATA PEDESTAL time is changed (by using the two-wire serial interface
The data pedestal is a constant offset that is added to pixel to change register settings), the timing and control logic
values at the end of datapath. The default offset is 168 and controls the transition from old to new integration time
is a 12-bit offset. This offset matches the maximum range in such a way that the stream of output frames from the
used by the corrections in the digital readout path. AR0330 switches cleanly from the old integration time
The data pedestal value can be changed if the lock register to the new while only generating frames with uniform
bit (R0x301A[3]) is set to “0”. This bit is set to “1” by integration. See “Changes to Integration Time” in the
default. AR0330 Register Reference.
• Global Reset Mode:
SENSOR READOUT This mode can be used to acquire a single image at the
Image Acquisition Modes
current resolution. In this mode, the end point of the
The AR0330 supports two image acquisition modes: pixel integration time is controlled by an external
electromechanical shutter, and the AR0330 provides
• Electronic Rolling Shutter (ERS) Mode:
control signals to interface to that shutter.
This is the normal mode of operation. When the
The benefit of using an external electromechanical
AR0330 is streaming; it generates frames at a fixed
shutter is that it eliminates the visual artifacts
rate, and each frame is integrated (exposed) using the
associated with ERS operation. Visual artifacts arise in
ERS. When the ERS is in use, timing and control logic
ERS operation, particularly at low frame rates, because
within the sensor sequences through the rows of the
an ERS image effectively integrates each row of the
array, resetting and then reading each row in turn. In the
pixel array at a different point in time.
time interval between resetting a row and subsequently
reading that row, the pixels in the row integrate incident Window Control
light. The integration (exposure) time is controlled by The sequencing of the pixel array is controlled by the
varying the time between row reset and row readout. x_addr_start, y_addr_start, x_addr_end, and y_addr_end
For each row in a frame, the time between row reset registers. The x_addr_start equal to 6 is the minimum setting
and row readout is the same, leading to a uniform value. The y_addr_start equal to 6 is the minimum setting
integration time across the frame. When the integration value. Please refer to Table 33 and Table 34 for details.
Table 33. PIXEL COLUMN CONFIGURATION

Column Address Number Type Notes
0–5 6 Active Border columns
6–2309 2304 Active Active columns
2310–2315 6 Active Border columns
Table 34. PIXEL ROW CONFIGURATION

Row Address Number Type Notes
2–5 4 Active Not used in case of “edge effects”
6–1549 1544 Active Active rows
1550–1555 6 Active Not used in case of “edge effects”
Readout Modes
Horizontal Mirror
When the horizontal_mirror bit (R0x3040[14]) is set in a sequence of 6 pixels being read out with R0x3040[14] = 0
the image_orientation register, the order of pixel readout and R0x3040[14] = 1. Changing R0x3040[14] causes the
within a row is reversed, so that readout starts from Bayer order of the output image to change; the new Bayer
x_addr_end + 1and ends at x_addr_start. Figure 31 shows order is reflected in the value of the pixel_order register.
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AR0330CM
LINE_VALID
Horizontal_mirror = 0
G0[11:0] R0[11:0] G1[11:0] R1[11:0] G2[11:0] R2[11:0]
DOUT[11:0]
Horizontal_mirror = 1
G3[11:0] R2[11:0] G2[11:0] R1[11:0] G1[11:0] R0[11:0]
DOUT[11:0]
Figure 31. Effect of Horizontal Mirror on Readout Order
Vertical Flip
When the vertical_flip bit (R0x3040[15]) is set in the a sequence of 6 rows being read out with R0x3040[15] = 0
image_orientation register, the order in which pixel rows are and R0x3040[15] = 1. Changing this bit causes the Bayer
read out is reversed, so that row readout starts from order of the output image to change; the new Bayer order is
y_addr_end and ends at y_addr_start. Figure 32 shows reflected in the value of the pixel_order register.
FRAME_VALID
Vertical_flip = 0
Row0[11:0] Row1[11:0] Row2[11:0] Row3[11:0] Row4[11:0] Row5[11:0]
DOUT[11:0]
Vertical_flip = 1
Row6[11:0] Row5[11:0] Row4[11:0] Row3[11:0] Row2[11:0] Row1[11:0]
DOUT[11:0]
Figure 32. Effect of Vertical Flip on Readout Order
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AR0330CM
SUBSAMPLING
The AR0330 supports subsampling. Subsampling allows working modes described in the data sheet that use
the sensor to read out a smaller set of active pixels by either subsampling are configured to use either 2x2 or 3x3
skipping or binning pixels within the readout window. The subsampling.
Isb Isb Isb
Isb Isb Isb
Figure 33. Horizontal Binning in the AR0330 Sensor
Horizontal binning is achieved either in the pixel readout

or the digital readout. The sensor will sample the combined
2x or 3x adjacent pixels within the same color plane.
e−
e− e−
e−
Figure 34. Vertical Row Binning in the AR0330 Sensor
Vertical row binning is applied in the pixel readout. Row read together. As well, that the sensor will read a Gr-R row
binning can be configured of 2x or 3x rows within the same first followed by a B-Gb row.
color plane. ON Semiconductor recommends not to use 3x 1 ) x_odd_inc
binning in AR0330 as it may introduce some image artifacts. x subsampling factor + (eq. 16)
2
Pixel skipping can be configured up to 2x and 3x in both
the x-direction and y-direction. Skipping pixels in the 1 ) y_odd_inc
y subsampling factor + (eq. 17)
x-direction will not reduce the row time. Skipping pixels in 2
the y-direction will reduce the number of rows from the A value of 1 is used for x_odd_inc and y_odd_inc when
sensor effectively reducing the frame time. Skipping will no pixel subsampling is indicated. In this case, the sensor is
introduce image artifacts from aliasing. incrementing x and y addresses by 1 + 1 so that it reads
The sensor increments its x and y address based on the consecutive pixel and row pairs. To implement a 2x skip in
x_odd_inc and y_odd_inc value. The value indicates the the x direction, the x_odd_inc is set to 3 so that the x address
addresses that are skipped after each pair of pixels or rows increment is 1 + 3, meaning that sensor will skip every other
has been read. Gr-R pair.
The sensor will increment x and y addresses in multiples
of 2. This indicates that a GreenR and Red pixel pair will be
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AR0330CM
Table 35. CONFIGURATION FOR HORIZONTAL SUBSAMPLING

x_odd_inc Restrictions
No Subsampling x_odd_inc = 1 The horizontal FOV must be programmed to meet the following rule:
Skip = (1+1) * 0.5 = 1x
x_addr_end * x_addr_start ) 1
Skip 2x x_odd_inc = 3 + even number
Skip = (1+3) * 0.5 = 2x x_odd_inc
2
Skip 3x x_odd_inc = 5
Skip = (1+5) * 0.5 = 3x
Analog Bin 2x x_odd_inc = 3

Skip = (1+3) * 0.5 = 2x
col_sf_bin_en = 1
Analog Bin 3x x_odd_inc = 5
Skip = (1+5) * 0.5 = 3x
col_sf_bin_en = 1
Digital Bin 2x x_odd_inc = 3
Skip = (1+3) * 0.5 =2x
col_bin =1
Digital Bin 3x x_odd_inc = 5
Skip = (1+5) * 0.5 = 3x
col_bin = 1
Table 36. CONFIGURATION FOR VERTICAL SUBSAMPLING

y_odd_inc Restrictions
No Subsampling y_odd_inc = 1 The horizontal FOV must be programmed to meet the following rule:
Skip = (1+1) * 0.5 = 1x
row_bin = 0 y_addr_end * y_addr_start ) 1
+ even number
Skip 2x y_odd_inc = 3 y_odd_inc
skip = (1+3) * 0.5 = 2x 2
row_bin = 0
Skip 3x y_odd_inc = 5
skip = (1+5) * 0.5 = 3x
row_bin = 0
Analog Bin 2x y_odd_inc = 3
skip = (1+3) * 0.5 = 2x
row_bin = 1
Analog Bin 3x y_odd_inc = 5
skip = (1+5) * 0.5 = 3x
row_bin = 1
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AR0330CM
SENSOR FRAME RATE Row Period (TROW)

The time required to read out an image frame (TFRAME) The line_length_pck will determine the number of clock
can be derived from the number of clocks required to output periods per row and the row period (TROW) when combined
each image and the pixel clock. with the sensor readout clock. The line_length_pck includes
The frame-rate is the inverse of the frame period. both the active pixels and the horizontal blanking time per
row. The sensor utilizes two readout paths, as seen in
1
fps + (eq. 18) Figure 18, allowing the sensor to output two pixels during
T FRAME
each pixel clock.
The number of clocks can be simplified further into the The minimum line_length_pck is defined as the
following parameters: maximum of the following three equations:
• The number of clocks required for each sensor row ADC Readout Limitation:
(line_length_pck) This parameter also determines the 1024 (ADC_HIGH_SPEED) + 0
sensor row period when referenced to the sensor
or (eq. 20)
readout clock.
(TROW = line_length_pck × 1/CLK_PIX) 1116 (ADC_HIGH_SPEED) + 1(0)
• The number of row periods per frame Options to modify this limit, as mentioned in the
(frame_length_lines) “Sequencer” section, can be found in the AR0330 Developer
• An extra delay between frames used to achieve Guide.
a specific output frame period (extra_delay) Digital Readout Limitation:
T FRAME +
1
CLK_PIX
(eq. 19) 1
3
ǒx_addr_end * x_addr_start
(x_odd_inc ) 1) 0.5
Ǔ (eq. 21)
(frame_length_lines line_length_pck ) extra_delay)

Output Interface Limitations:
1
ǒx_addr_end * x_addr_start
Ǔ ) 96
frame_length_lines = Active Rows + VB
(eq. 22)
Vertical Blanking (VB) 2 (x_odd_inc ) 1) 0.5
Row Periods per Frame

Active Rows The frame_length_lines determines the number of row
periods (TROW) per frame. This includes both the active and
blanking rows. The minimum_vertical_blanking value is
Horizontal Active Columns
defined by the number of OB rows read per frame, two
Blanking
(HB) embedded data rows, and two blank rows.
y_addr_end * y_addr_start
Minimum frame_length_lines + )
y_odd_inc)1
2 (eq. 23)
extra_delay
) minimum_vertical_blanking
line_length_pck = Active Columns + HB
The sensor is configured to output frame information in
Figure 35. Frame Period Measured in Clocks two embedded data rows by setting R0x3064[8] to 1
(default). If R0x3064[8] is set to 0, the sensor will instead
output two blank rows. The data configured in the two
embedded rows is defined in MIPI CSI−2 Specification
V1.00.
Table 37. MINIMUM VERTICAL BLANKING CONFIGURATION

R0x3180[0x00F0] OB Rows minimum_vertical_blanking
0x8 (Default) 8 OB Rows 8 OB + 4 = 12
0x4 4 OB Rows 4 OB + 4 = 8
0x2 2 OB Rows 2 OB + 4 = 6
The locations of the OB rows, embedded rows, and blank

rows within the frame readout are identified in Figure 36.
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AR0330CM
SLAVE MODE
The slave mode feature of the AR0330 supports triggering The VD signal is input to the trigger pin. Both the GPI_EN
the start of a frame readout from a VD signal that is supplied (R0x301A[8]) and the SLAVE_MODE (R0x30CE[4]) bits
from an external ASIC. The slave mode signal allows for must be set to “1” to enable the slave mode.
precise control of frame rate and register change updates.
Frame Valid VD Signal
Start of frame N
Time
OB Rows (2, 4, or 8 rows)
Embedded Data Row (2 rows)
Active Data Rows
Blank Rows (2 rows)
Extra Vertical Blanking

The period between the
(frame_length_lines − min_frame_length_lines)
rising edge of the VD signal
and the slave mode ready
Extra Delay (clocks)
state is TFRAME = 16 clocks.
Slave Mode Active State
End of frame N
Start of frame N + 1
Figure 36. Slave Mode Active State and Vertical Blanking
If the slave mode is disabled, the new frame will begin slave mode will remain inactive for the period of one frame
after the extra delay period is finished. time minus 16 clock periods (TFRAME − (16 / CLK_PIX)).
The slave mode will react to the rising edge of the input After this period, the slave mode will re-enter the active state
VD signal if it is in an active state. When the VD signal is and will respond to the VD signal.
received, the sensor will begin the frame readout and the
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AR0330CM
Frame
Valid
Rising Rising Rising
Edge Edge Edge
VD Signal
Slave Mode Inactive Active Inactive Active Row Reset

Trigger
(start of integration)
Rising edge of VD Row reset and read
signal triggers the start operations begin Row Readout
of the frame readout. after the rising edge
of the VD signal. Programmed Integration
Row 0 Integration due to
Slave Mode Delay
Row N
The Slave Mode will become “Active” after the last row period.
Both the row reset and row read operations will wait until the rising edge of the VD signal.
Figure 37. Slave Mode Example with Equal Integration and Frame Readout Periods
(The integration of the last row is therefore started before the end of the programmed integration for the first row)
The row shutter and read operations will stop when the 2. If the sensor integration time is configured to be
slave mode becomes active and is waiting for the VD signal. less than the frame period, then the sensor will not
The following should be considered when configuring the have reset all of the sensor rows before it begins
sensor to use the slave mode: waiting for the input VD signal. This error can be
1. The frame period (TFRAME) should be configured minimized by configuring the frame period to be
to be less than the period of the input VD signal. as close as possible to the desired frame rate
The sensor will disregard the input VD signal if it (period between VD signals).
appears before the frame readout is finished.
Frame
Valid
Rising Rising Rising
Edge Edge Edge
VD Signal
Row Reset
Slave Mode
Trigger
Inactive Active Inactive Active (start of integration)
Row reset and read Row Readout
operations begin after
8.33 ms 8.33 ms the rising edge of the Programmed Integration
Vd signal.
Row0 Integration due to
Slave Mode Delay
Row N
Reset operation is held during slave mode “Active” state.
Figure 38. Slave Mode Example where the Integration Period is Half of the Frame Readout Period
(The sensor read pointer will have paused at row 0 while the shutter pointer pauses at row N/2. The extra integration caused
by the slave mode delay will only be seen by rows 0 to N/2. The example below is for a frame readout period of 16.6ms while
the integration time is configured to 8.33 ms)
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AR0330CM
When the slave mode becomes active, the sensor will To avoid uneven exposure, programmed integration time
pause both row read and row reset operations. cannot be larger than VD period. To increase integration
time more than current VD period, the AR0330 must be
NOTE: The row integration period is defined as the
configured to work at a lower frame rate and read out image
period from row reset to row read.
with new VD to match the new timing.
When the AR0330 is working in slave mode, the external The period between slave mode pulses must also be
trigger signal VD must have accurately controlled timing to greater than the frame period. If the rising edge of the VD
avoid uneven exposure in the output image. The VD timing pulse arrives while the slave mode is inactive, the VD pulse
control should make the slave mode “wait period” less than will be ignored and will wait until the next VD pulse has
32 pixel clocks. arrived.
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39
AR0330CM
FRAME READOUT
The sensor readout begins with vertical blanking rows The sensor will read the first vertical blanking row at the
followed by the active rows. The frame readout period can beginning of the frame period and the last active row at the
be defined by the number of row periods within a frame end of the row period.
(frame_length_lines) and the row period (line_length_pck).
1/60s 1/60s
Row Reset Row Read Row Reset Row Read

Vertical Blanking
Active Rows
Time Row Reset Row Read Row Reset Row Read
End of Frame End of Frame

Readout Readout
Serial SYNC Codes
Start of Vertical Blanking
HB (192 Pixels/Column) HB (192 Pixels/Column)
(12 Rows)
Start of Frame
(12 Rows)
VB
Start of Active Row

VB
2304 x 1296 2304 x 1296
End of Line
End of Frame
Frame Valid
Line Valid
Figure 39. Example of the Sensor Output of a 2304 y 1296 Frame at 60 fps
(The frame valid and line valid signals mentioned in this diagram represent internal signals within the sensor.
The SYNC codes represented in this diagram represent the HiSPi Streaming SP protocol)
Frame 39 aligns the frame integration and readout output using the HiSPi Streaming SP protocol. Different
operation to the sensor output. It also shows the sensor sensor protocols will list different SYNC codes.
Table 38. SERIAL SYNC CODES INCLUDED WITH EACH PROTOCOL INCLUDED WITH THE AR0330 SENSOR
Start of Vertical
Blanking Row Start of Frame Start of Active Line End of Line End of Frame
Interface/Protocol (SOV) (SOF) (SOA) (EOL) (EOF)
Parallel Parallel Interface Uses FRAME VALID (FV) and LINE VALID (LV) Outputs to Denote Start and End of Line and
Frame.
HiSPi Streaming S Yes Send SOV Yes No SYNC Code No SYNC Code
HiSPi Streaming SP Yes Yes Yes Yes Yes
HiSPi Packetized SP No SYNC Code Yes Yes Yes Yes
MIPI No SYNC Code Yes Yes Yes Yes
Figure 40 illustrates how the sensor active readout time 2304 × 1296 frame rate from 60 fps to 30 fps without
can be minimized while reducing the frame rate. 1308 VB increasing the delay between the readout of the first and last
rows were added to the output frame to reduce the active row.
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AR0330CM
1/30s 1/30s
Row Reset Row Read Row Reset Row Read Vertical Blanking
Active Rows
Row Reset Row Read Row Reset Row Read

Time
End of Frame End of Frame
Readout Readout
Serial SYNC Codes
Start of Frame 2304 x 1296 2304 x 1296
VB VB
Start of Active Row (1320 Rows) (1320 Rows)
End of Line
HB (192 Pixels) HB (192 Pixels)
End of Frame
Frame Valid
Line Valid
Figure 40. Example of the Sensor Output of a 2304 y 1296 Frame at 30 fps
(The frame valid and line valid signals mentioned in this diagram represent internal signals within the sensor.
The SYNC codes represented in this diagram represent the HiSPi Streaming SP protocol)
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AR0330CM
CHANGING SENSOR MODES

Register Changes bit in R0x30B0[13]. When the context switch is configured
All register writes are delayed by 1x frame. A register that to context A the sensor will reference the “Context A
is written to during the readout of frame n will not be updated Registers”. If the context switch is changed from A to B
to the new value until the readout of frame n+2. This during the readout of frame n, the sensor will then reference
includes writes to the sensor gain and integration registers. the context B coarse_integration_time registers in frame
n+1 and all other context B registers at the beginning of
Real-Time Context Switching
reading frame n+2. The sensor will show the same behavior
In the AR0330, the user may switch between two full when changing from context B to context A.
register sets A and B by writing to a context switch change
Table 39. LIST OF CONFIGURABLE REGISTERS FOR CONTEXT A AND CONTEXT B

Context A Context B
Register Description Address Register Description Address
Coarse_integration_time 0x3012 Coarse_integration_time_CB 0x3016
Fine_integration_time 0x3014 Fine_integration_time_CB 0x3018
Line_length_pck 0x300C Line_length_pck_CB 0x303E
Frame_length_lines 0x300A Frame_length_lines_CB 0x30AA
COL_SF_BIN_EN 0x3040[9] COL_SF_BIN_EN_CB 0x3040[8]
ROW_BIN 0x3040[12] ROW_BIN_CB 0x3040[10]
COL_BIN 0x3040[13] COL_BIN_CB 0x3040[11]
FINE_GAIN 0x3060[3:0] FINE_GAIN_CB 0x3060[11:8]
COARSE_GAIN 0x3060[5:4] COARSE_GAIN_CB 0x3060[13:12]
x_addr_start 0x3004 x_addr_start_CB 0x308A
y_addr_start 0x3002 y_addr_start_CB 0x308C
x_addr_end 0x3008 x_addr_end_CB 0x308E
y_addr_end 0x3006 y_addr_end_CB 0x3090
Y_odd_inc 0x30A6 Y_odd_inc_CB 0x30A8
X_odd_inc 0x30A2 X_odd_inc_CB 0x30AE
ADC_HIGH_SPEED 0x30BA[6] ADC_HIGH_SPEED_CB 0x30BA[7]
GREEN1_GAIN 0x3056 GREEN1_GAIN_CB 0x30BC
BLUE_GAIN 0x3058 BLUE_GAIN_CB 0x30BE
RED_GAIN 0x305A RED_GAIN_CB 0x30C0
GREEN2_GAIN 0x305C GREEN2_GAIN_CB 0x30C2
GLOBAL_GAIN 0x305E GLOBAL_GAIN_CB 0x30C4
NOTE: ON Semiconductor recommends leaving fine_integration_time at 0.
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AR0330CM
1/60s 1/60s 1/54s
Vertical Blanking
Active Rows
Time End of Frame End of Frame End of Frame

Readout Readout Readout
Serial SYNC Codes HB (192 Pixels/Column) HB (192 Pixels/Column) HB (192 Pixels/Column)
(12 Rows)
(12 Rows)
(12 Rows)
2304 x 1296 2304 x 1296 2048 x 1536
VB
VB
VB
Start of Frame
Frame N Frame N+1 Frame N+2
Start of Active Row
End of Line
End of Frame Write context A to B Integration time of context Context B mode is
during readout of Frame N B mode implemented implemented in frame N+2
during readout of frame
N+1
Figure 41. Example of Changing the Sensor from Context A to Context B
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AR0330CM
COMPRESSION
The sensor can optionally compress 12-bit data to 10-bit The A-law compression is disabled by default and can be
using A-law compression. The compression is applied after enabled by setting R0x31D0 from “0” to “1”.
the data pedestal has been added to the data. See Figure 1.
Table 40. A-LAW COMPRESSION TABLE FOR 12−10 BITS

Input Values Compressed Codeword
Input Range 11 10 9 8 7 6 5 4 3 2 1 0 9 8 7 6 5 4 3 2 1 0
0 to 127 0 0 0 0 0 a b c d e f g 0 0 0 a b c d e f g
128 to 255 0 0 0 0 1 a b c d e f g 0 0 1 a b c d e f g
256 to 511 0 0 0 1 a b c d e f g X 0 1 0 a b c d e f g
512 to 1023 0 0 1 a b c d e f g X X 0 1 1 a b c d e f g
1024 to 2047 0 1 a b c d e f g h X X 1 0 a b c d e f g h
2048 to 4095 1 a b c d e f g h X X X 1 1 a b c d e f g h
TEST PATTERNS
The AR0330 has the capability of injecting a number of Test_Pattern_Mode register according to Table 41. When
test patterns into the top of the datapath to debug the digital test patterns are enabled the active area will receive the value
logic. With one of the test patterns activated, any of the specified by the selected test pattern and the dark pixels will
datapath functions can be enabled to exercise it in receive the value in Test_Pattern_Green (R0x3074 and
a deterministic fashion. Test patterns are selected by R0x3078) for green pixels, Test_Pattern_Blue (R0x3076)
Test_Pattern_Mode register (R0x3070). Only one of the test for blue pixels, and Test_Pattern_Red (R0x3072) for red
patterns can be enabled at a given point in time by setting the pixels.
Table 41. TEST PATTERN MODES

Test_Pattern_Mode Test Pattern Output
0 No Test Pattern (Normal Operation)
1 Solid Color
2 100% Vertical Color Bars
3 Fade-to-Gray Vertical Color Bars
256 Walking 1s Test Pattern (12-bit)
Solid Color
When the color field mode is selected, the value for each
pixel is determined by its color. Green pixels will receive the
value in Test_Pattern_Green, red pixels will receive the
value in Test_Pattern_Red, and blue pixels will receive the
value in Test_Pattern_Blue.
Vertical Color Bars

When the vertical color bars mode is selected, a typical
color bar pattern will be sent through the digital pipeline.
Walking 1s
When the walking 1s mode is selected, a walking 1s
pattern will be sent through the digital pipeline. The first
value in each row is 1.
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44
AR0330CM
TWO-WIRE SERIAL REGISTER INTERFACE [0] indicates a WRITE, and a “1” indicates a READ. The
The two-wire serial interface bus enables read/write default slave addresses used by the AR0330 sensor are 0x20
access to control and status registers within the AR0330. (write address) and 0x21 (read address). Alternate slave
This interface is designed to be compatible with the addresses of 0x30 (WRITE address) and 0x31 (READ
electrical characteristics and transfer protocols of the I2C address) can be selected by asserting the SADDR signal (tie
specification. HIGH).
The interface protocol uses a master/slave model in which Alternate slave addresses can also be programmed
a master controls one or more slave devices. The sensor acts through R0x31FC.
as a slave device. The master generates a clock (SCLK) that Message Byte
is an input to the sensor and is used to synchronize transfers. Message bytes are used for sending register addresses and
Data is transferred between the master and the slave on register write data to the slave device and for retrieving
a bidirectional signal (SDATA). SDATA is pulled up to register read data.
VDD_IO off-chip by a 1.5 kW resistor. Either the slave or
master device can drive SDATA LOW − the interface protocol Acknowledge Bit
determines which device is allowed to drive SDATA at any Each 8-bit data transfer is followed by an acknowledge bit
given time. or a no-acknowledge bit in the SCLK clock period following
The protocols described in the two-wire serial interface the data transfer. The transmitter (which is the master when
specification allow the slave device to drive SCLK LOW; the writing, or the slave when reading) releases SDATA. The
AR0330 uses SCLK as an input only and therefore never receiver indicates an acknowledge bit by driving SDATA
drives it LOW. LOW. As for data transfers, SDATA can change when SCLK
is LOW and must be stable while SCLK is HIGH.
Protocol
No-Acknowledge Bit
Data transfers on the two-wire serial interface bus are
The no-acknowledge bit is generated when the receiver
performed by a sequence of low-level protocol elements:
does not drive SDATA LOW during the SCLK clock period
1. a (repeated) start condition
following a data transfer. A no-acknowledge bit is used to
2. a slave address/data direction byte
terminate a read sequence.
3. an (a no-) acknowledge bit
4. a message byte Typical Sequence
5. a stop condition A typical READ or WRITE sequence begins by the
The bus is idle when both SCLK and SDATA are HIGH. master generating a start condition on the bus. After the start
Control of the bus is initiated with a start condition, and the condition, the master sends the 8-bit slave address/data
bus is released with a stop condition. Only the master can direction byte. The last bit indicates whether the request is
generate the start and stop conditions. for a read or a write, where a “0” indicates a write and a “1”
indicates a read. If the address matches the address of the
Start Condition slave device, the slave device acknowledges receipt of the
A start condition is defined as a HIGH-to-LOW transition address by generating an acknowledge bit on the bus.
on SDATA while SCLK is HIGH. At the end of a transfer, the If the request was a WRITE, the master then transfers the
master can generate a start condition without previously 16-bit register address to which the WRITE should take
generating a stop condition; this is known as a “repeated place. This transfer takes place as two 8-bit sequences and
start” or “restart” condition. the slave sends an acknowledge bit after each sequence to
Stop Condition indicate that the byte has been received. The master then
A stop condition is defined as a LOW-to-HIGH transition transfers the data as an 8-bit sequence; the slave sends an
on SDATA while SCLK is HIGH. acknowledge bit at the end of the sequence. The master stops
writing by generating a (re)start or stop condition.
Data Transfer If the request was a READ, the master sends the 8-bit write
Data is transferred serially, 8 bits at a time, with the MSB slave address/data direction byte and 16-bit register address,
transmitted first. Each byte of data is followed by an the same way as with a WRITE request. The master then
acknowledge bit or a no-acknowledge bit. This data transfer generates a (re)start condition and the 8-bit read slave
mechanism is used for both the slave address/data direction address/data direction byte, and clocks out the register data,
byte and for message bytes. eight bits at a time. The master generates an acknowledge bit
One data bit is transferred during each SCLK clock period. after each 8-bit transfer. The slave’s internal register address
SDATA can change when SCLK is LOW and must be stable is automatically incremented after every 8 bits are
while SCLK is HIGH. transferred. The data transfer is stopped when the master
Slave Address/Data Direction Byte sends a no-acknowledge bit.
Bits [7:1] of this byte represent the device slave address
and bit [0] indicates the data transfer direction. A “0” in bit
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AR0330CM
Single READ From Random Location

This sequence (Figure 42) starts with a dummy WRITE to register data. The master terminates the READ by
the 16-bit address that is to be used for the READ. The generating a no-acknowledge bit followed by a stop
master terminates the WRITE by generating a restart condition. Figure 42 shows how the internal register address
condition. The master then sends the 8-bit read slave maintained by the AR0330 is loaded and incremented as the
address/data direction byte and clocks out one byte of sequence proceeds.
Previous Reg Address, N Reg Address, M M+1
Slave Reg Reg

S 0 A A A Sr Slave Address 1 A Read Data A P
Address Address[15:8] Address[7:0]
S = Start Condition
P = Stop Condition
Sr = Restart Condition
A = Acknowledge Slave to Master
A = No-acknowledge Master to Slave
Figure 42. Single READ from Random Location
Single READ From Current Location The master terminates the READ by generating
This sequence (Figure 43) performs a read using the a no-acknowledge bit followed by a stop condition. The
current value of the AR0330 internal register address. figure shows two independent READ sequences.
Previous Reg Address, N Reg Address, N+1 N+2
S Slave Address 1 A Read Data A P S Slave Address 1 A Read Data A P
Figure 43. Single READ from Current Location
Sequential READ, Start From Random Location

This sequence (Figure 44) starts in the same way as the has been transferred, the master generates an acknowledge
single READ from random location (Figure 42). Instead of bit and continues to perform byte READs until “L” bytes
generating a no-acknowledge bit after the first byte of data have been read.
S Slave Address 0 A Reg Address[15:8] A Reg Address[7:0] A Sr Slave Address 1 A Read Data A
M+1 M+2 M+3 M+L−2 M+L−1 M+L
Read Data A Read Data A Read Data A Read Data A P
Figure 44. Sequential READ, Start from Random Location
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AR0330CM
Sequential READ, Start From Current Location

This sequence (Figure 45) starts in the same way as the has been transferred, the master generates an acknowledge
single READ from current location (Figure 43). Instead of bit and continues to perform byte READs until “L” bytes
generating a no-acknowledge bit after the first byte of data have been read.
Previous Reg Address, N N+1 N+2 N+L−1 N+L
S Slave Address 1 A Read Data A Read Data A Read Data A Read Data A P
Figure 45. Sequential READ, Start from Current Location
Single WRITE to Random Location then LOW bytes of the register address that is to be written.
This sequence (Figure 46) begins with the master The master follows this with the byte of write data. The
generating a start condition. The slave address/data WRITE is terminated by the master generating a stop
direction byte signals a WRITE and is followed by the HIGH condition.
S Slave Address 0 A Reg Address[15:8] A Reg Address[7:0] A Write Data A P

A
Figure 46. Single WRITE to Random Location
Sequential WRITE, Start at Random Location

This sequence (Figure 47) starts in the same way as the been transferred, the master continues to perform byte
single WRITE to random location (Figure 46). Instead of WRITEs until “L” bytes have been written. The WRITE is
generating a stop condition after the first byte of data has terminated by the master generating a stop condition.
S Slave Address 0 A Reg Address[15:8] A Reg Address[7:0] A Write Data A
M+1 M+2 M+3 M+L−2 M+L−1 M+L
A
Write Data A Write Data A Write Data A Write Data P
A
Figure 47. Sequential WRITE, Start at Random Location
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AR0330CM
SPECTRAL CHARACTERISTICS
70
Red Green Blue

60
50
Quantum Efficiency (%)
40
30
20
10
0
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050 1100 1150
Wavelength (nm)
Figure 48. Bare Die Quantum Efficiency
Image Height CRA

CRA vs. Image Height Plot (%) (mm) (deg)
0 0 0
AR0330 CRA Characteristic
20 5 0.152 0.80
19 10 0.305 1.66
18
15 0.457 2.54
17
16
20 0.609 3.42
25 0.761 4.28
Chief Ray Angle (Degrees)
15
14 30 0.914 5.11
13
35 1.066 5.94
12
11 40 1.218 6.75
10 45 1.371 7.57
9
50 1.523 8.37
8
7 55 1.675 9.16
6 60 1.828 9.90
5 65 1.980 10.58
4
70 2.132 11.15
3
2 75 2.284 11.57
1 80 2.437 11.80
0
85 2.589 11.78
0 10 20 30 40 50 60 70 80 90 100 110
90 2.741 11.48
Image Height (%)
95 2.894 10.88
100 3.046 9.96
NOTE: The CRA listed in the advanced data sheet described the 2048 × 1536 field of view (2.908 mm image height). This information was
sufficient for configuring the sensor to read both the 4:3 (2048 × 1536) and 16:9 (2304 × 1296) aspect ratios. The CRA information
listed in the data sheet has now been updated to represent the entire pixel array (2304 × 1536).
Figure 49. Chief Ray Angle (CRA) − 125
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AR0330CM
Image Height CRA

0 0 0
30 5 0.152 1.10
28 10 0.305 2.20
26
15 0.457 3.30
24
20 0.609 4.40
25 0.761 5.50
22
30 0.914 6.60
20
35 1.066 7.70
18
40 1.218 8.80
16
45 1.371 9.90
14
50 1.523 11.00
12
55 1.675 12.10
10
60 1.828 13.20
8
65 1.980 14.30
6
70 2.132 15.40
4
75 2.284 16.50
2
80 2.437 17.60
0
85 2.589 18.70
0 10 20 30 40 50 60 70 80 90 100 110
90 2.741 19.80
Image Height (%)
95 2.894 20.90
100 3.046 22.00
Image Height CRA

0 0 0
30 5 0.152 2.24
28 10 0.305 4.50
26
15 0.457 6.75
24
20 0.609 8.95
25 0.761 11.11
22
30 0.914 13.19
20
35 1.066 15.20
18
40 1.218 17.10
16
45 1.371 18.88
14
50 1.523 20.50
12
55 1.675 21.95
10
60 1.828 23.18
8
65 1.980 24.17
6
70 2.132 24.89
4
75 2.284 25.35
2
80 2.437 25.54
0
85 2.589 25.51
0 10 20 30 40 50 60 70 80 90 100 110
90 2.741 25.33
Image Height (%)
95 2.894 25.11
100 3.046 25.01
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AR0330CM
Read the Sensor CRA

Follow the steps below to obtain the CRA value of the
Image Sensor:
1. Set the register bit field R0x301A[5] = 1.
2. Read the register bit fields R0x31FA[11:9].
3. Determine the CRA value according to Table 42.
Table 42. CRA VALUE

Binary Value of
R0x31FA[11:9] CRA Value
000 0
001 21
010 25
011 12
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AR0330CM
PACKAGES
The AR0330 comes in two packages:
• CLCC Package
• CSP HiSPi/MIPI Package
PACKAGE DIMENSIONS
CLCC48
CASE 848AU
ISSUE O
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AR0330CM
PACKAGE DIMENSIONS
ODCSP64
CASE 570BH
ISSUE O
A S1 J1
1 2 3 4 5 6 7 8 8 7 65 4 3 21
S2
First clear pixel(−1987.5,2776.5)
A A
J2
B B
C C
Package Center=Die Center(0,0) Package Center=Die Center(0,0)
D D
B
E E
E
Optical center(−290,230) Optical center(290,230)
F F
G G
Last clear pixel(1407.5,−2316.5)
H H
Notch
Top View (Image side) Bottom View (BGA side)

Unit:um
C4
Package Size:6278.15*6648.15
C3
C2
C1
C
Ball diameter:250
Cross−section View (E−E) Ball pitch:650
Table 43. CSP (MIPI/HISPI) PACKAGE DIMENSIONS

Nom Min Max Nom Min Max
Parameter Symbol Millimeters Inches

Package Body Dimension X A 6.278 6.253 6.303 0.247 0.246 0.248
Package Body Dimension Y B 6.648 6.623 6.673 0.262 0.261 0.263
Package Height C 0.700 0.645 0.745 0.028 0.025 0.029
Cavity Height (Glass to Pixel Distance) C4 0.041 0.037 0.045 0.002 0.001 0.002
Glass Thickness C3 0.400 0.390 0.410 0.016 0.015 0.016
Package Body Thickness C2 0.570 0.535 0.605 0.022 0.021 0.024
Ball Height C1 0.130 0.100 0.160 0.005 0.004 0.006
Ball Diameter D 0.250 0.220 0.280 0.010 0.009 0.011
Total Ball Count N 64
Ball Count X Axis N1 8
Ball Count Y Axis N2 8
UBM U 0.280 0.270 0.290 0.011 0.011 0.011
Pins Pitch X Axis J1 0.650 0.026
Pins Pitch Y Axis J2 0.650 0.026
BGA Ball Center to Package Center Offset in X-direction X 0.000 −0.025 0.025 0.000 −0.001 0.001
BGA Ball Center to Package Center Offset in Y-direction Y 0.000 −0.025 0.025 0.000 −0.001 0.001
BGA Ball Center to Chip Center Offset in X-direction X1 0.000 −0.014 0.014 0.000 −0.001 0.001
BGA Ball Center to Chip Center Offset in Y-direction Y1 0.000 −0.014 0.014 0.000 −0.001 0.001
Edge to Ball Center Distance along X S1 0.864 0.834 0.894 0.034 0.033 0.035
Edge to Ball Center Distance along Y S2 1.049 1.019 1.079 0.041 0.040 0.042
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AR0330CM
PACKAGE ORIENTATION IN CAMERA DESIGN

In a camera design, the package should be placed in a PCB that the image captured using a lens will be oriented
so that the first clear pixel is located at the bottom left of the correctly.
package (look at the package). This orientation will ensure
Lens
The package is oriented so

that the first clear pixel is
located in bottom left.
Figure 52. Image Orientation with Relation to Camera Lens
The package pin locations after the sensor has been

oriented correctly can be shown below.
CSP Package CLCC Package
(2304,1536) (2304,1536)
Pixel Array
1−−−−−−−−−−−−8
First Clear First Clear

Pixel Pixel
(0,0) (0,0)
A −−−−−−−−−−−−−−−H
48 1
Pin Orientation
Figure 53. First Clear Pixel and Pin Location

(Looking Down on Cover Glass)
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53
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ON Semiconductor:
AR0330CM1C00SHAAD3-GEVK AR0330CM1C00SHAAH3-GEVB AR0330CM1C21SHKAD3-GEVK
AR0330CS1C12SPKAD3D3-GEVK AR0330CS1C12SPKAH3-GEVB AR0330CM1C12SHKA0-CP
AR0330CM1C00SHAA0-TP AR0330CM1C12SHKA0-CR AR0330CM1C00SHAA0-DP AR0330CM1C00SHAA0_DP
AR0330CS1C12SPKA0-CR AR0330CSSC12SPBA0-DR AR0330CM1C00SHAA0-DR1 AR0330SR1C00SUKA0-CR
AR0330CM1C12SHAA0-DR AR0330CM1C00SHKA0-CP AR0330CM1C12SHAA0-DP1 AR0330CM1C12SHAA0-DP
AR0330CM1C12SHAA0-DR1 AR0330CS1C12SPKA0-CP AR0330SR1C00SUKA0-CP AR0330CM1C00SHAA0-DP1
AR0330CM1C21SHKA0-CP AR0330CM1C21SHKA0-CR AR0330CM1C00SHKA0-CR AR0330CM1C00SHAA0-DR
AR0330CM1C12SUW90 AR0330CM1C25SUD20 AR0330CM1C00SHAA0-DP2 AR0330CM1C00SHAAH-GEVB

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Parameter Typical Value

© Semiconductor Components Industries, LLC, 2010 1 Publication Order Number:

Table 2. AVAILABLE PART NUMBERS

GENERAL DESCRIPTION FUNCTIONAL OVERVIEW

Analog Core 12-bit

Timing Digital Gain

Figure 1. Block Diagram

Table 3. AVAILABLE ASPECT RATIOS IN THE AR0330 SENSOR

Table 4. AVAILABLE WORKING MODES IN THE AR0330 SENSOR

VGA Video 16:10 2256 × 1440 752 × 480 60 60 3×3 96%

HiSPi POWER SUPPLY CONNECTIONS

VDD_IO VDD VAA VAA_PIX

Master Clock SLVS1_P

VDD_HiSPi_TX VDD_IO VDD VDD_HiSPi VDD_PLL VAA VAA_PIX

Figure 2. Serial 4-lane HiSPi Interface

VDD_IO VDD VAA VAA_PIX

Master Clock DATA2_P

VDD_IO VDD VDD_PLL VAA VAA_PIX

Figure 3. Serial MIPI

VDD_IO VDD VDD_PLL VAA VAA_PIX

Master Clock DOUT[11:0]

VDD_IO VDD VDD_PLL VAA VAA_PIX

Figure 4. Parallel Pixel Data Interface

Table 5. PIN DESCRIPTIONS

SLVS0_P Output HiSPi serial data, lane 0, differential P.

SLVS0_N Output HiSPi serial data, lane 0, differential N.

SLVS1_P Output HiSPi serial data, lane 1, differential P.

SLVS1_N Output HiSPi serial data, lane 1, differential N.

SLVS2_P Output HiSPi serial data, lane 2, differential P.

SLVS2_N Output HiSPi serial data, lane 2, differential N.

SLVS3_P Output HiSPi serial data, lane 3, differential P.

SLVS3_N Output HiSPi serial data, lane 3, differential N.

SLVSC_P Output HiSPi serial DDR clock differential P.

SLVSC_N Output HiSPi serial DDR clock differential N.

DATA1_P Output MIPI serial data, lane 1, differential P.

Table 5. PIN DESCRIPTIONS (continued)

Table 6. CSP (HiSPi/MIPI) PACKAGE PINOUT

NOTE: Pins labeled NC (Not Connected) should be tied to ground.

Figure 5. CLCC Package Pin Descriptions

Power-Up Sequence 6. Assert RESET_BAR for at least 1 ms.

Table 7. POWER-UP SEQUENCE

VAA_PIX, VAA (2.8)

Power Down until Next

Figure 7. Power Down

Table 8. POWER-DOWN SEQUENCE

Table 9. DC ELECTRICAL DEFINITIONS AND CHARACTERISTICS (MIPI MODE)

Table 10. DC ELECTRICAL DEFINITIONS AND CHARACTERISTICS (HiSPi MODE)

Table 11. DC ELECTRICAL DEFINITIONS AND CHARACTERISTICS (PARALLEL MODE)

Table 12. STANDBY POWER

Power Typ Max Unit

Table 13. ABSOLUTE MAXIMUM RATINGS

Two-Wire Serial Register Interface

tHD;STA tSU;STA tSU;STO

Figure 8. Two-Wire Serial Bus Timing Parameters

Table 14. TWO-WIRE SERIAL BUS CHARACTERISTICS

Standard Mode Fast Mode

Parameter Symbol Min Max Min Max Unit