2023 Innovation Day1 Keynote

Forward-Looking Statements
This presentation contains forward-looking statements, including with respect to Intel’s business plans and strategy, process and product roadmaps, and current and future technologies,
as well as the anticipated benefits therefrom. Such statements involve many risks and uncertainties that could cause our actual results to differ materially from those expressed or implied,
including: changes in demand for our products; changes in product mix; the complexity and fixed cost nature of our manufacturing operations; the high level of competition and rapid
technological change in our industry; the significant upfront investments in R&D and our business, products, technologies, and manufacturing capabilities; vulnerability to new product
development and manufacturing-related risks, including product defects or errata, particularly as we develop next generation products and implement next generation process
technologies; risks associated with a highly complex global supply chain, including from disruptions, delays, trade tensions, or shortages; sales-related risks, including customer
concentration and the use of distributors and other third parties; potential security vulnerabilities in our products; cybersecurity and privacy risks; investment and transaction risk;
intellectual property risks and risks associated with litigation and regulatory proceedings; evolving regulatory and legal requirements across many jurisdictions; geopolitical and
international trade conditions; our debt obligations; risks of large scale global operations; macroeconomic conditions; impacts of the COVID 19 or similar such pandemic; and other risks
and uncertainties described in our earnings release dated July 27, 2023, our most recent Annual Report on Form 10-K and our other filings with the U.S. Securities and Exchange
Commission. All information in this presentation reflects Intel management views as of the date hereof unless an earlier date is specified. Intel does not undertake, and expressly disclaims
any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law.
Product, service and technology performance varies by use, configuration and other factors. Reference to research results, including comparisons to products, services or technology
performance are estimates and do not imply availability. The products and services described may contain defects or errors which may cause deviation from published specifications.
powering
Base: 641 security decision-makers at consumer electronic device organizations
Source: A commissioned study conducted by Forrester Consulting on behalf of Intel, December 2022
Available to all
1 week free
of Intel Developer Cloud access
for every in-person attendee
Artificial Platforms
Intelligence Next Generation and Edge
Systems to Cloud
Performance metrics based on MLPerf Inference v3.1 benchmark. For configuration details,
see the results published by MLCommons. Results may vary.
Performance metrics based on MLPerf Inference v3.1 benchmark. For configuration details,
see the results published by MLCommons. Results may vary.
1,000,000,000,000
100,000,000,000
Intel and non-Intel CPU
2X every 2 years
10,000,000,000
1,000,000,000
Transistors Per Device
100,000,000
10,000,000
1,000,000
100,000
10,000
1,000
1970 1980 1990 2000 2010 2020 2030
December 14, 2023
Copilot
Using
First on Intel 4 EUV
Technology
Thunderbolt 4
3D Performance Built-In Low Power

Hybrid NPU AI Engine
Island
E-cores
Architecture
Foveros New P-core Built - in Latest Media

3D & E-core & Display
Standards
Packaging Microarchitecture
WiFi 7 s
The Upcoming
Acer Swift
Thin & Powerful Laptop
The Upcoming
Acer Swift
Thin & Powerful Laptop
December 14, 2023
Birch Stream Platform Architecture
Based on architectural projections as of August 21, 2023 relative to prior generation. Your results may vary.
2 processors with 288 cores
Compute Connectivity Infrastructure Artificial Sensing
Intelligence
2023.1
Based on internal Intel data

GPT-J
Intel Intel Intel Intel Intel
Next Next + Next ++
7 4 3 20A 18A
Release the 0.9 PDK
to foundry customers
Test chips
for multiple programs
Intel
18A Next Next + Next ++
Ribbon FET and PowerVia

continuously evolving
process technology
High-NA EUV technology

development with 18A,
production with “Intel Next”
• Achronix • Blue Cheetah • Imec • National Institute of Advanced Industrial • Synopsys
• Advantest • Brite Semiconductor • Innosilicon Science and Technology • Tenstorrent
• AkroStar • Broadcom • JCET • Neuron IP • Teradyne
• Alchip • Bosch • Juniper Networks • Physim • Tongfu Microelectronics
• Alphawave Semi • Cadence • Keysight • Qualitas Semiconductor • Truechip
• Amkor Technology • Credo • Kiwimoore • Point2Tech • University of New Hampshire
• Ampere • Ecarx • LG • proteanTecs InterOperability Laboratory
• Analog Devices • Eliyan • Lightmatter • Rivos • Xi’an UniIC Semiconductors
• AP Memory • Ericsson • M2 Semi • Semitronix • UNISOC
• Applied Materials • eTopus • Macronix • Shanghai UniVista • Veri Silicon
• Arteris IP • Futurewei Technologies • Marvell • Siemens • Winbond
• Astera Labs • Global Foundries • Mercedes-Benz • Silicon Precision Industries • Xpeedic
• Ayar Labs • Global Unichip Corporation • Microchip • SK Hynix • Zero ASIC
• Beijing Stream Computing • Huixi Rhino • Micron • SkyeChip • Zentel
• IBM • MediaTek • Socionext
Property of Universal Chiplet Interconnect Express™ (UCIe™) as of September 2023

TSMC N3E Technology Intel 3 Technology
Advanced Packaging Technology

Technology performance varies by use, configuration and other factors. Learn more at www.Intel.com/ProcessInnovation
Quantum Application
Quantum Compiler
Quantum Runtime
Quantum Control Simulator
Quantum Dot Simulator

Inaugural Sequoia Professor in the Computer
Science Department at Stanford University, and
Co-Director of Stanford's Human-Centered AI
Bringing AI Everywhere
Exceptionally Engineered December 14, 2023
AI Platforms Advanced
Packaging
Open & Hardware Agnostic Industry-first
Software Approach Launch breakthroughs
of Intel® in glass substrates
Confidently Trusted
Core™ Ultra Quantum
Innovating for the future
Developing for the age of Launch

AI PC of 5th Gen
Intel® Xeon®
Software Initiative
codenamed
Project Strata
3-Dimensional
Silicon
Beyond 5 Nodes in 4 Years
Looking into the future today
Intel Intel Intel Intel Intel

7 4 3 20A 18A Next Next +
Neuromorphic
Computing
Notices and Disclaimers
For notices, disclaimers, and details
about performance claims, visit
www.intel.com/PerformanceIndex
or scan the QR code:

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Forward-Looking Statements

3D Performance Built-In Low Power

Foveros New P-core Built - in Latest Media

Based on internal Intel data

Ribbon FET and PowerVia

High-NA EUV technology

Property of Universal Chiplet Interconnect Express™ (UCIe™) as of September 2023

Advanced Packaging Technology

Quantum Control Simulator

Quantum Dot Simulator

Developing for the age of Launch

Intel Intel Intel Intel Intel

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