AZ5413-01F.R7GR Datasheet

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AZ5413-01F

Ultra Low Capacitance ESD Protection Device


0402 DFN Package for ESD Protection

Features AZ5413-01F is a unique design which includes


proprietary clamping cells with ultra low
! ESD Protection for 1 line with Uni-directional
capacitance in a small package. During transient
! Provide ESD protection for the protected line to
conditions, the proprietary clamping cells prevent
IEC 61000-4-2 (ESD) ±20kV (air/contact)
IEC 61000-4-4 (EFT) 50A (5/50ns)
over-voltage on the control/data lines, protecting
IEC 61000-4-5 (Lightning) 7.5A (8/20µs) any downstream components.
Cable Discharge Event (CDE)
AZ5413-01F may be used to meet the ESD
! Ultra low capacitance: 0.75pF typical
immunity requirements of IEC 61000-4-2, Level 4
! For low operating voltage applications: 3.3V
(±15kV air, ±8kV contact discharge).
! 0402 small DFN package saves board space
! Protect one I/O line
! Fast turn-on and Low clamping voltage
! Solid-state silicon-avalanche and active circuit
Circuit Diagram /
triggering technology
Pin Configuration
! Green Part

Applications
!

!
Antenna applications
Hand Held Portable Applications
1 2
! Data and I/O lines protection
! Analog input lines protection
! Video lines protection
! 3.3V operating systems DFN1006P2E (Bottom View)

Description
AZ5413-01F is a design which includes a
uni-directional ESD rated clamping cell to protect
high speed data interfaces in an electronic
systems. The AZ5413-01F has been specifically
designed to protect sensitive components which
are connected to data and transmission lines
from over-voltage caused by Electrostatic
Discharging (ESD), Electrical Fast Transients
(EFT), Lightning, and Cable Discharge Event
(CDE).

Revision 2015/12/07 © 2015-2016 Amazing Micro. 1 www.amazingIC.com


AZ5413-01F
Ultra Low Capacitance ESD Protection Device
0402 DFN Package for ESD Protection

SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL RATING UNITS
Peak Pulse Current (tp=8/20µs) IPP 7.5 A
Operating Supply Voltage (pin-1 to pin-2) VDC 3.6 V
ESD per IEC 61000-4-2 (Air) VESD ±20 kV
ESD per IEC 61000-4-2 (Contact) ±20
o
Lead Soldering Temperature TSOL 260 (10 sec.) C
o
Operating Temperature TOP -55 to +85 C
o
Storage Temperature TSTO -55 to +150 C

ELECTRICAL CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS MINI TYP MAX UNITS

Reverse Stand-Off
VRWM Pin-1 to pin-2, T = 25oC. 3.3 V
Voltage

Reverse Leakage VRWM = 3.3V, T = 25oC, pin-1


ILeak 1.0 µA
Current to pin-2.

Reverse Breakdown IBV = 1mA, T = 25oC, pin-1 to


VBV 5 7.5 V
Voltage pin-2.
IF = 15mA, T = 25oC, pin-2 to
Forward Voltage VF 0.6 0.85 1 V
pin-1.
Surge Clamping IPP = 5A, T = 25oC, pin-1 to
VCL-surge 5.6 V
Voltage pin-2.

IEC 61000-4-2 +8kV (ITLP =


ESD Clamping
Vclamp 16A), T = 25oC, Contact 8.5 V
Voltage (Note 1)
mode, pin-1 to pin-2.
IEC 61000-4-2, 0~+8kV,
ESD Dynamic
Rdynamic Contact mode, T = 25 oC, 0.2 Ω
Turn-on Resistance
pin-1 to pin-2.
Channel Input VR = 1.65V, f = 1MHz,
CIN 0.75 1 pF
Capacitance pin1-to-pin2, T = 25 oC.

Note 1: ESD Clamping Voltage was measured by Transmission Line Pulsing (TLP) System.
TLP conditions: Z0= 50Ω, tp= 100ns, tr= 1ns.

Revision 2015/12/07 © 2015-2016 Amazing Micro. 2 www.amazingIC.com


AZ5413-01F
Ultra Low Capacitance ESD Protection Device
0402 DFN Package for ESD Protection

Typical Characteristics
T ypical Variation of C IN vs. V IN Reverse Clamping Voltage vs. Peak Pulse Current
1.5 8.0
1.4 f = 1MHz, T = 25°C Pin-1 to Pin-2
Pin-1 to Pin-2
1.3 7.5
1.2
7.0
Input Capacitance (pF)

1.1

Clamping Voltage (V)


1.0
0.9 6.5

0.8
6.0
0.7
0.6
5.5
0.5
0.4 5.0 Waveform
0.3 Parameters:
tr = 8µs
0.2 4.5 td = 20µs
0.1 T = 25 C
0.0 4.0
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0

Input Voltage (V) Peak Pulse Current (A)

T ransmission Line Pulsing (T LP) M easurement Forward Clamping Voltage vs. Peak Pulse Current
18 5.0
Transmission Line Pulsing (TLP) Current (A)

17 V_pulse Pin-2 to Pin-1


16 4.5
Pulse from a
15 transmission line
TLP_I 4.0
14 100ns +
13
Clamping Voltage (V)

3.5
12 TLP_V DUT
11 3.0
10 _
Pin-1 to Pin-2
9 T = 25 C 2.5
8
7 2.0
6
5 1.5
Waveform
4 Parameters:
1.0
3 tr = 8µs
2 0.5 td = 20µs
1 T = 25 C
0 0.0
0 1 2 3 4 5 6 7 8 9 10 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0
Transmission Line Pulsing (TLP) Voltage (V) Peak Pulse Current (A)

Insertion Loss S21 (I/O-GND)


0

-5
Insertion Loss (dB)

-10

-15

-20

-25

-3dB freq. ~ 3.8GHz


-30
1e+8 1e+9 1e+10

Frequency (Hz)

Revision 2015/12/07 © 2015-2016 Amazing Micro. 3 www.amazingIC.com


AZ5413-01F
Ultra Low Capacitance ESD Protection Device
0402 DFN Package for ESD Protection

Applications Information In order to obtain enough suppression of ESD


induced transient, good circuit board is critical.
The AZ5413-01F is designed to protect one line Thus, the following guidelines are recommended:
against System ESD / EFT / Lightning pulses by ! Minimize the path length between the
clamping it to an acceptable reference. protected lines and the AZ5413-01F.
! Place the AZ5413-01F near the input
The usage of the AZ5413-01F is shown in Fig. 1. terminals or connectors to restrict transient
Protected lines, such as data lines, control lines, coupling.
or power lines, are connected at pin 1. The pin 2 ! The ESD current return path to ground
should be connected directly to a ground plane should be kept as short as possible.
on the board. All path lengths connected to the ! Use ground planes whenever possible.
pins of AZ5413-01F should be kept as short as ! NEVER route critical signals near board
possible to minimize parasitic inductance in the edges and near the lines which the ESD
board traces. transient easily injects to.

IC to be protected
VDD

Keyboard
Connector

Terminal
Printer data
.
.
.
GND
AZ5413-01F

AZ5413-01F
1

1
2

Fig. 1

Revision 2015/12/07 © 2015-2016 Amazing Micro. 4 www.amazingIC.com


AZ5413-01F
Ultra Low Capacitance ESD Protection Device
0402 DFN Package for ESD Protection

Fig. 2 shows another simplified example of using speed data lines, and power lines from ESD
AZ5413-01F to protect the control lines, high transient stress.

VDD

Chip-B

AZ5413-01F
Chip-A
High Speed Control Line

2
Data Line
Chip-C
1

AZ5413-01F
AZ5413-01F
2

GND

Fig. 2

Revision 2015/12/07 © 2015-2016 Amazing Micro. 5 www.amazingIC.com


AZ5413-01F
Ultra Low Capacitance ESD Protection Device
0402 DFN Package for ESD Protection

Mechanical Details LAND LAYOUT

DFN1006P2E
PACKAGE DIAGRAMS
A

TOP VIEW

C
C1
Notes:
SIDE VIEW
This LAND LAYOUT is for reference
G
purposes only. Please consult your
manufacturing partners to ensure your
company’s PCB design guidelines are met.
F
O
45
MARKING CODE
0.05
0.125 E
BOTTOM VIEW D
s
7
Millimeters Inches
Symbol
min max min max
A 0.95 1.05 0.037 0.041 Top View
B 0.55 0.65 0.022 0.026
C 0.45 0.60 0.018 0.024 Part Number Marking Code
D 0.45 0.018
AZ5413-01F
E 0.20 0.30 0.008 0.012 s
(Green Part)
F 0.45 0.55 0.018 0.022
Note. Green means Pb-free, RoHS, and
Halogen free compliant.

Revision 2015/12/07 © 2015-2016 Amazing Micro. 6 www.amazingIC.com


AZ5413-01F
Ultra Low Capacitance ESD Protection Device
0402 DFN Package for ESD Protection

Ordering Information
PN# Material Type Reel size MOQ MOQ/internal box MOQ/carton
AZ5413-01F.R7GR Green T/R 7 inch 12,000/reel 4 reel = 48,000/box 6 box = 288,000/carton

Revision History
Revision Modification Description
Revision 2014/03/27 Preliminary Release.
Revision 2014/08/20 Update the Marking Code.
Revision 2014/11/04 Update the level of ESD per IEC 61000-4-2.
Revision 2014/11/27 Update the Ordering Information.
Revision 2015/12/07 Formal Release.

Revision 2015/12/07 © 2015-2016 Amazing Micro. 7 www.amazingIC.com

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