Pulugurtha Markondeya Raj

• Associate Professor, Biomedical Engineering, Florida International University

• Associate Professor, Electrical and Computer Engineering, Florida International University

Major Research Areas: Packaging of bioelectronic and electronic systems, heterogeneous system integration,
passive components, power and data telemetry, flex and 3D packaging, Hermetic packaging, interconnects and
connectors

Application focus: Wireless sensors, Neural Recording and stimulation, Photonic biosensors, Power modules,

Degree Month, Year University Field

Ph.D June, 1999 Rutgers University, New Jersey, USA Materials Science and Engin.
M.S June, 1997 Rutgers University, New Jersey, USA Ceramic and Materials Engin.
M.E May, 1995 Indian Inst. of Science, Bangalore, India Metallurgy
B.Tech May, 1993 Indian Inst. of Technology, Kanpur, India Metallurgy and Materials Engin.

Major Scholastic Achievements:

• ~340 publications in journals, books, magazines, patents and conference proceedings
• ~30 best-paper and other technical achievement awards in various IEEE and other Conferences.
• ~10 Million Dollars of fund-raising, mostly from industry
• >30 MS and PhD students – Co-advised or mentored
• ~25 invited presentations in technical conferences, at industry executive board, technical society webinars
• Associate Director, Industry Consortium on Power and RF Module Integration, Georgia Tech Packaging
Research Center with focus on 3D passive component integration : Qualcomm, TDK-EPCOS, Intel, Texas
Instruments, Medtronic, Maxim Integrated, Infineon, Nitto Denko, NGK-NTK, Rockwell Collins,
Honeywell Inc., Applied Materials, Asahi Glass, Nagase, Namics Inc.
• IEEE Nanotechnology Council, Distinguished Lecturer 2020
• Associate Editor for IEEE Transactions on Components, Packaging and Manufacturing Technologies and
IEEE Nanotechnology Magazine
• Committee Chair: Nanopackaging Technical Committee of IEEE Electronic Packaging Society (EPS) and
Nanopackaging Technical Council (NTC), ECTC High-speed wireless and components (2017)
• Technology roadmapping: Heterogeneous integration (IEEE EPS) – Power passives components and
materials, Printed Circuit Boards (IPC), 3D Power Packaging (PSMA),
• 25 invited talks in IEEE conferences, industry technology boards, technical society webinars
• Developed first 3D glass LTE diversity module, and 3D glass antenna-integrated package module for 5G
mm wave applications;
• Developed substrate-integrated high-density power inductors and power capacitors for integrated power
modules and voltage regulators;
• Developed embedded embedded-flex and fan-out packaging for wearables and implantables
• Industry Short Courses on Embedded Components and Heterogeneous Integration: Offered at multiple
conferences as short courses, society webinars and lectures

PRIOR EMPOLYMENT HISTORY:

Georgia Tech, Packaging Research Center

Associate Research Director, 2017-2018
Research Program Manager, 2009-2017
Assistant Research Director, 2005- 2009
Technical Leader, 2003-2005
Post-Doctoral Fellow 1999-2003
AWARDS AND RECOGNITIONS:
A. Research Recognition Awards
1. IEEE Nanotechnology Council, Nanotechnology Distinguished Lecturer, 2020
2. IEEE Transactions of Components, Packaging and Manufacturing Technologies – Best Associate
Editor Award
3. IEEE CPMT Japan Chapter Young Award (Atom Watanabe, Mentored by P Markondeya Raj),
for the paper entitled: “Design and Demonstration of Ultra-thin 3D Glass-based 5G Modules with
Low-loss Interconnects”, International Conference on Electronics Packaging (ICEP), held in Mie,
Japan, Fall 2018
4. Intel Best Student Paper Award (Muhammad Ali, Mentored by P. Markondeya Raj), 2019, for
the paper entitled "Miniaturized High-Performance Filters for 5G Small-Cell Applications.”, IEEE
68th Electronic Components and Technology
5. Best paper award, IEEE Nanotechnology Materials and Devices Conference (NMDC)”, Carmine
Gianfagna, Madhavan Swaminathan, P M Raj, Rao Tummala, Giulio Antonini, Enabling Antenna
Design with Nano-Magnetic Materials using Machine Learning, Presented at Anchorage, Alaska,
Sept 13-16, 2015
6. Best of Track (Advanced Packaging), at the 49th International Symposium on Microelectronics,
2016, October 10th-13th in Pasadena, United States, “Electrodeposited copper-graphite composites
for low-CTE integrated thermal structures”, Shreya Dwarakanath, P M Raj, Vanessa Smet, Venky
Sundaram, Rao Tummala
7. “IEEE EPTC Outstanding Technical Paper Award”, 6th Electronics Packaging Technology
Conference (EPTC 2004), “High Frequency Characteristics of Supercapacitive Nanocomposite
Thin Films and Their Suitability for Embedded Decoupling” P.Markondeya Raj, D. Balaraman,
V. Govind, L.X. Wan, R. Abothu, R. Gerhardt, S. Bhattacharya, M. Swaminathan and R.
Tummala, Georgia Institute of Technology, USA, 2005
8. “Distinguished Committee Service Award 2017,” from Institute for Printed Circuits (IPC) —
Association Connecting Electronics Industries, in recognition of contributions to IPC-7091, Design
and Assembly Process Implementation for 3D Components
9. Finalist, best conference paper, IEEE-NANO 2014, “Tunable and Miniaturized RF Components
with Nanocomposite and Nanolayered Dielectrics” P. M. Raj, Parthasarathi Chakraborti, Saumya
Gandhi, Himani Sharma, Srikrishna Sitaraman, Kyuhwan Han, Madhavan Swaminathan and Rao
Tummala
10. “IEEE Transactions on Advanced Packaging, Commendable Paper of 2004”, “The SOP for
miniaturized, mixed-signal computing, communication, and consumer systems of the next
decade”, Tummala, R.R.; Swaminathan, M.; Tentzeris, M.M.; Laskar, J.; Gee-Kung Chang;
Sitaraman, S.; Keezer, D.; Guidotti, D.; Zhaoran Huang; Kyutae Lim; Lixi Wan; Bhattacharya,
S.K.; Sundaram, V.; Fuhan Liu; Markondeya Raj, P
11. Best Poster Award, IEEE Electronic Components and Technology Conference, 2011, H. Sharma,
K. Sethi, P. M. Raj, Venky Sundaram, and Rao Tummala, “Conformal Atomic Layer Deposition
(ALD) of Alumina on High Surface-Area Porous Copper Electrodes to Achieve Ultra-High
Capacitance Density on Silicon Interposers
12. Medtronic MBTS – Invention of Distinction, “Systems and methods for providing high-density
capacitors”, Inventors: P. M. Raj, Rao Tummala, Himani sharma, Kanika Sethi (Georgia Tech.,
PRC), Anna Malin and Andy Fenner (Medtronic Microelectronics Corp), August 26, 2009
13. “Philips Best Paper Award”, International Conference on Electronic Packaging Technology
(ICEPT), China, August 2005, “Design, Simulation and Measurements of High-Speed Embedded
Decoupling Capacitors for Multi GHz Packages/PCBs” (Lixi Wan, P. M. Raj, Rao Tummala and
M. Swaminathan)
14. "Best Paper of the Session", Emerging Technologies Session, Novel Low-Cost Sol-Gel Derived
Nano-structured and Repairable Interconnects, 36th International Symposium on Microelectronics,
Sponsored by International Microelectronics and Packaging Society (IMAPS), 2003 Boston;
Ankur Aggarwal, P. M. Raj, Isaac Robin Abothu, Michael D. Sacks and Rao Tummala
15. "Best paper of the Session", Integral passives, Low-cost embedded capacitor technology with
hydrothermal and sol-gel processes 9th International Symposium on Advanced packaging
Materials: Processing, Properties and Interfaces, 2004; Devarajan Balaraman, P. M. Raj, Isaac
Robin Abothu and Rao Tummala
16. Distinguished Scholar Award, 1998 - Awarded by the Microbeam Analysis Society, USA; Edge
sharpening for unbiased edge detection in FESEM images. Presented at the symposium on applied
image processing, Annual Microscopy and Microanalysis Meeting, Atlanta, July, 1998
17. First Place - Best Student Paper, First International workshop on Future Car Electronics, Nov.
8-9, 2016, Atlanta, Atom Watanabe, P. M. Raj, Rao Tummala, Denny Wong, Ravi Mullapudi,
Sven Lamprecht, Robin Taylor, Title: Highly-effective Integrated EMI Shields
18. Best Student Paper award at the 49th International Symposium on Microelectronics, 2016 held
October 10th-13th in Pasadena, United States, “Electrodeposited copper-graphite composites for
low-CTE integrated thermal structures”, Shreya Dwarakanath, P M Raj, Vanessa Smet, Venky
Sundaram, Rao Tummala
19. Motorola CPMT Fellowship Award, Tapobrata Bandyopadhyay, Gaurav Mehrotra, Mahadevan
K. Iyer, P. M. Raj, Madhavan Swaminathan and Rao R. Tummala, "Microwave Design &
Characterization of a Novel Nano-Cu Based Ultra-fine Pitch Chip-to-Package Interconnect", 58th
Electronic Components and Technology Conference, Orlando, May 2008
20. 'Best Interactive Presentation Paper' at IEEE ECTC 2015 - San Diego, Ninad Shahane, P.M.
Raj Modeling, Design and Demonstration of Low-Temperature, Low-Pressure and High-
Throughput Thermocompression Bonding of Copper Interconnections without Solders
21. Best Student Paper (Third Place): Ninad Shahane, P.M. Raj Low-temperature copper
interconnections without solders, at 2015 IEEE Global Interposer Technology Workshop
22. Third Place - Best Student Paper, First International workshop on Future Car Electronics, Nov.
8-9, 2016, Atlanta, Title: Integrated Magnetic Substrates for High-frequency DC-DC Converter in
(H)EV Applications. Haksun Lee, Vanessa Smet, P.M. Raj and Rao Tummala
23. Best Student Paper (Third place): Tantalum based high density capacitor with low leakage for
high frequency and low power applications Partha Chakraborti, P.M. Raj, 2015 Global
Interposer Technology Workshop, Atlanta, Nov
24. “Intel Best Student Paper Award”, New paradigms for IC-package reworkable nanointerconnects,
Electronic Components and Technology Conference – ECTC 2004 (Student: Ankur Aggarwal,
Co-authors: Rao Tummala and P. M. Raj)
25. “Best Student Paper (First Place), Dibyajat Mishra, P. M. Raj and Rao Tummala, Multilayered
ferromagnetic-polymer composite structures and their integration into high-density power supply
inductors, Third Annual Global Interposer Technology workshop, Nov. 20, 2014
26. “Best Student Paper (Third place), Ting-Chia Huang, Vanessa Smet, Satomi Kawamoto, P. M.
Raj, Rao Tummala, Metastable Cu-Sn interconnections for high-throughput ultra-fine pitch SLID
bonding, Third Annual Global Interposer Technology workshop, Nov. 20, 2014
27. “Best Student Paper (Third place), Ninad Shahane, Scott McCann, Vanessa Smet, P. M. Raj,
Rao Tummala, Low-temperature low-pressure Cu interconnections without solders at fine pitch,
Third Annual Global Interposer Technology workshop, Nov. 20, 2014
28. “Best Student Paper (Third place)”, Parthasarathi Chakraborti, Himani Sharma, P. M. Raj,
Rao Tummala, Third Annual Global Interposer Technology workshop, Nov. 20, 2013
29. IEEE CPMT ECTC Travel Award, Dibyajat Mishra, Electronic Components and Technology
Conference, Highly-loaded metal nanoparticles in insulators for high-frequency magnetic films,
Dibyajat Mishra, K P Murali, P. M. Raj, Himani Sharma and Rao Tummala
30. IEEE CPMT ECTC 2011 Travel Award, Kanika Sethi - IEEE Electronic Components and
Technology Conference, H. Sharma, K. Sethi, P. M. Raj, Venky Sundaram, and Rao Tummala,
“Conformal Atomic Layer Deposition (ALD) of Alumina on High Surface-Area Porous Copper
Electrodes to Achieve Ultra-High Capacitance Density on Silicon Interposers
 31. Second Prize at the “Regional Science Fair”, Arulita Gupta (High School Intern), Nitesh
Kumbhat, P. M. Raj, Rao Tummala, “Compliant Silicon/Glass Interposer to PWB
Interconnection”
32. SECOND PLACE - Second International Workshop on Future Car Electronics (FCE), November
8-10 2017, Georgia Learning Center, Atlanta, Shreya Dwarakanath, Raj Pulugurtha, Etizaz-Shah
Hassan, Vanessa Smet, Venky Sundaram, Mark Losego and Rao Tummala, “High-Temperature
reliability of high-density power packages for electric vehicles”
33. SECOND PLACE - Second International Workshop on Future Car Electronics (FCE), November
8-10 2017, Georgia Learning Center, Muhammad Ali, Raj Pulugurtha, Venky Sundaram and Rao
Tummala, “High-performance mm-wave passive components for V2X and V2V connectivity”

Other Recognitions
1. Outstanding Staff Achievements Award, 2005 from the Packaging Research Center, Georgia Institute of
Technology (for publications and research funding).
2. Outstanding Student Mentor Award, from the Packaging Research Center, Georgia Institute of Technology,
March 2016.
3. Outstanding Student Mentor Award, from the Packaging Research Center, Georgia Institute of Technology,
March 2015.
4. Best of the Best - Outstanding Research Mentor Award, from the Packaging Research Center, Georgia
Institute of Technology, March 2014.
5. Georgia Tech. Certificate of Excellence, for volunteering as STEM (Science, Technology, Engineering and
Mathematics) outreach Ambassador for local high school students.
6. First Rank, National (India) Graduate Aptitude Test in Engineering (GATE), 1993 Metallurgy.
7. First Rank, Metallurgy Department, ME, Indian Institute of Science, Bangalore, Class of 1995.

Special Activities

1. Panelist for National Science Foundation.

2. Mentor for Senior Design Projects:
1. Field Therapy Accelerator for Wound Healing, Marisol Roman, Paulo Castro, Jorge Garcia,
Jarvin Kelly, Dayan Rodriguez, Spring 2020.
2. Wearable Bioelectronic Systems with Next Generation Device Assembly Technologies Antony
Arun Maria, Prashant Gautam, Jessica E. Molina, John Murnin, Dennis Ramos Trinidad;
Sponsored by Jabil
3. Wireless Power Transfer System, Christopher Bolig, Micheal Clarke-Wilson, Zachary Forbes,
Kevin Mata, Joshua Holoman, ECE, Spring 2020
4. WhereAbouts with RFID tags, William Fernandez, Johnathan Duque, Jordan Lewis, Tidjan
Simpson, Saad Alsafeh, Summer 2019
5. NeuroBeats: A Wearable Stimulator for Parkinson’s Disease, Vanessa Guevara, Kelsey
Quevedo, Jose Solis, Jorge Barter, Fall 2019
6. Field Therapy Accelerator, Lina Bernier-Colon, Shebin George, Valentina Melero, Claudia
Pinochet, Spring 2019

Invited Presentations:
1. Heterogeneous System Integration with Nanopackaging, IEEE Distinguished Lecture Series, 2020,
o Nanotechnology Council, Northern Virginia/Washington Jt. Sections.
o IEEE NANOTECHNOLOGY, 2020, July 29-31.
o 26th IEEE International Symposium for Design and Technology in Electronic Packaging
(IEEE-SIITME) and as the chair of the IEEE Hungary & Romania Joint EPS & NTC Chapter,
Pitesti, Romania on October 21st–24th, 2020
o International Conference (in online mode) on Emerging Electronics (ICEE-2020) at
the Indian Institute of Technology, Delhi, India from 26th – 28th Nov 2020
2. Invited Speaker, Micro Device Fabrication & Material Analysis Workshop Outline March 6-7, 2020
Advanced Materials Engineering Research Institute, AMERI,
3. (Plenary Speaker), Applied Power Electronics Conference (APEC), “3D Power Packaging made Real
with Embedded Component and Substrate Technologies,” Plenary session on Monday, IEEE March
5-8, 2018
4. (Invited Speaker) P M Raj, Nanostructures for Enabling Implantable Bioelectronic Systems,
IEEE Nanotechnology Materials and Devices (NMDC), Portland, Oregon, October 14-17, 2018

5. (Invited Speaker) 3D Passive Component Integration for Power Conversion and Delivery, 2018
Electronics Packaging Symposium that GE co-hosts with Binghamton University Sept 17-19,
Binghamton, New York.

6. Invited Webinar Speaker, Power Sources Manufacturers Association (PSMA), Product Technology
Roadmap Presentation, October 4, 2018, Emerging Embedded Passive Technologies that Enable High-
Density 3D Power Packaging with Roadmap Projections

7. (Invited Industry Short Course Instructor), Passive Components and Integration for Power and RF
Modules, P. Markondeya Raj, Georgia Tech – Packaging Research Center, 22nd Annual Components
for Military & Space Electronics Conference & Exhibition, May 7-10th, 2018, Four Points by Sheraton
(LAX), Los Angeles, California

8. (Invited Speaker), Industry Session on Innovative Component, Reliability and Manufacturing for 3D
Power Packaging Solutions, Title: Embedded passives – Recent Advances and Opportunities ,
Advanced Power Electronics Conference, APEC 2018, March 5-8, San Antonio, Texas

9. (Invited Speaker), Integrated Power Conversion and Power Management (PwrSoC), Title: Reliability
and Manufacturing Readiness of High-Density (1 mF/mm2) Ultra-thin (75 microns) Wafer- or
Package-integrated Film Capacitors, October 17-19, 2018, Hsinchu, Taiwan

10. (Industry Short Course Instructor), Passive Components and Integration for Power and RF Modules,
P. Markondeya Raj, Georgia Tech – Packaging Research Center, 22nd Annual Components for
Military & Space Electronics Conference & Exhibition, May 7-10th, 2018, Four Points by Sheraton
(LAX), Los Angeles, California

11. (Invited Speaker), Integrated Power Conversion and Power Management (PwrSoC), Title: Reliability
and Manufacturing Readiness of High-Density (1 mF/mm2) Ultra-thin (75 microns) Wafer- or
Package-integrated Film Capacitors, October 17-19, 2018, Hsinchu, Taiwan

12. Panel Speaker, Industry Session on 3D power packaging, “Emerging passive component technologies
for power modules”, Advanced Power Electronics Conference, APEC 2017, March 28-30, Orlando

13. Invited Talk, International Conferences for Power Sources on Chip, “High-density capacitors on
silicon”, October 3-5, 2016, Madrid, Spain

14. Invited Talk, System Scaling as new electronic systems frontier with frontier materials, Symposium
on "Material Frontiers in Semiconductor Advanced Packaging” at the 2016 Spring MRS Conference in
Phoenix, AZ (March 28-April 1, 2016)

15. Distinguished Professor Lecture, “Capacitors and their integration”, Texas Instruments, Santa Clara
April 16, 2015.

16. Invited Talk, Third Annual Global Interposer Technology workshop, Nov. 20, 2014, “Miniaturized
RF, Power and Bioelectronic modules using Nanoscale Component Integration”

17. Invited Talk, Integration of Power-Supply Capacitors with Ultrahigh Density on Silicon Using
Particulate Electrodes " International Conferences for Power Sources on Chip”, November 17, 2012.

18. Invited Panel Speaker on “Hermetic Packaging”, IEEE Neural Interfaces Conference, June 17,
Cleveland, Ohio, 2008.
 19. Invited Talk “SOP For Miniaturized Multifunctional Wearable Electronics”, Oral presentation within
Track #1, Technical Session #4 (Enabling Technologies II), Future technologies Conference, National
Nuclear Security Administration, October 10-13, Washington DC., 2006

20. Invited Talk, “SOP for Miniaturizing Implantable Devices”, Medtronic’s Quarterly Technical Review,
Minneapolis, MN, Aug 5, 2008.

21. Invited Panel speaker, “Wafer Level Packaging”, “DuPont’s Quarterly Technical Review, April 12,
2006

SERVICES:
• Associate Editor IEEE Nanotechnology Magazine
• Associate Editor IEEE Transactions on Components, Packaging and Manufacturing
Technologies
• Co-Chair, IEEE CPMT Technical Committee on “Nanopackaging”; 2013-
• Co-Chair, IEEE Nanopackaging Technical Committee
• Chair, IEEE ECTC High-Speed wireless and components, 2016-2017.
• IEEE CPMT US Representative for Nanotechnology Research Council, 2013-
• GUEST EDITOR, P. Markondeya Raj and Ravi Mahajan, Nanopackaging, IEEE Transactions on
Components, Packaging and Manufacturing Technologies (CPMT), December 2016.
• Power Sources Manufacturers Association (PSMA) lead for their third Industry Technology Survey
report (2017-2018)
• Heterogeneous Integration Roadmap (Passive Components – Materials and power components:
contributed technical summary and future trends)
• Chair, IEEE Webinar for Electronic Packaging Society, Implantable Electronics: Emerging Packaging
Needs, Challenges and Recent Industry Breakthroughs, Feb 4, 2020
• Host, IEEE EPS Distinguished Lecturer, FAN-OUT PACKAGING FOR FUTURE ELECTRONICS
AND BIOELECTRONICS, Feb 18, 2020
• Co-Chair, FIU Biomedical Engineering, Industry Advisory Board, 2019-2020.
• Session Chair, IEEE Electronic Components and Technology Conference, ECTC
o 2021 (3D power components and power integrity)
o 2020 (power components and modules) – with Rockwell Hsu,
o 2019 (high-bandwidth packaging) – with Amit Agarwal
o 2017-2018 (power delivery and integrity) – with Rajen Murugan
o 2014 Session Chair, IEEE Electronic Components and Technology Conference, Integrated
Power and RF Modules (Co-Chair: Rockwell Hsu, CISCO Systems Inc.)
o 2013, Session Chair, IEEE Electronic Components and Technology Conference, System
Components for RF and mm wave (Co-Chair: Prof. Lih-Tyng Hwang, National Sun Yat-Sen,
University), Lake Buena Vista, FL
o 2012, MEMS Integration and Processing (Co-Chair, John Cunningham, Oracle), San Diego,
CA.
• Session Chair, Capacitors and Energy Storage, Power Sources on Chip, Pittsburgh, October 25-28,
2020
• Track Chair for Nanopackaging, IEEE Nanotechnology Conference, July 29-31, 2020, 2021, Montreal,
Canada.
• Organizing Committee, , IEEE Nanotechnology Materials and Device Conference, October 17th to
20th, 2021.
• Session Chair, 3D PEIM (Power Electronics Integration and Manufacturing), Heterogeneous
component integration, June 2018
• Session Chair, Nanopackaging Session, IEEE Nanotechnology Materials and Devices Conference
2018, Pittsburg, USA
• Session Chair, Nanopackaging Session, IEEE Nanotechnology Conference 2017, Pittsburg, USA
• Session Chair, Nanopackaging Session, IEEE Nanotechnology Conference 2015, Rome, Italy.
• Session Chair, Future Car Electronics, High-temperature packaging, 2017, Atlanta, USA
• Session Chair, Future Car Electronics, High-temperature packaging, 2016, Atlanta, USA
• Session Chair, Global Interposer Technologies (GIT, 2014), Power and RF modules, USA
• Session Chair, Global Interposer Technology Workshop (GIT, 2012), Integrated Passive Devices, USA
• Session Chair, IEEE Electronic Components and Technology Conference, 2014, Integrated Power and
RF Modules (Co-Chair: Rockwell Hsu, CISCO Systems Inc.)
 • Session Chair, IEEE Electronic Components and Technology Conference, 2013, System Components
for RF and mm wave (Co-Chair: Prof. Lih-Tyng Hwang, National Sun Yat-Sen University), Lake
Buena Vista, FL.
• Member, Institute of Electrical and Electronic Engineers IEEE, 2008-date
• Member, Power Source Manufacturers Association (PSMA) (2017-)
• Past Member, American Ceramic Society (1997 – 2004)
• Past Member, Microbeam Analysis Society (1997 -1999),
• Member, International Microelectronics and Packaging Society (IMAPS) (2000-2005, 2019-).

STEM Outreach Activities

• Hosted elementary school students for Science Demonstrations at Georgia Tech (Nanoenergy,
bioelectronics) – 12/5/2016, 2017,
• STEM Science Career Fair, Trickum Middle School, 11/19/2014
• Science Demonstrations at Arcado Elementary School (Lilburn, GA) on electromagnetism, electromagnetic
induction and transformers (4/28/2014)
• Science Demonstrations at Arcado Elementary School (Lilburn, GA) on heat-generation in electronics and
chip cooling with heat-sinks and thermal interface materials (3/10/2012)
• Hosted several semiconductor and packaging companies as a part of PRC promotion and fund-raising

Key Delivered Products

1. Silicon-integrated high-density capacitors: Process-of-record, yield and reliability data, supply-chain
and commercialization path, to Texas Instruments, AVX and HCStarck; Raj is the program manager for
this project
2. Substrate-integrated inductors: Intellectual property, design, Process-of-record and samples for
integrated inductors to Nitto Denko Corp and Advanced Microdevices; Raj is the program manager for
this project
3. 3D IPD diplexers: Design, process-of-record, fabrication and model-to-hardware correlations for glass-
based 3D IPD diplexers, supply-chain and commercialization path; Raj is the program manager for this
project
4. 3D IPAC LTE modules: Design, process-of-record, fabrication and model-to-hardware correlations for
glass-based 3D integrated passive and active component modules, supply-chain and commercialization
path; Raj is the program manager for this project
5. Compliant board-level interconnections: Microwire array technology – process, reliability
characterization data for board-level reliability - to Qualcomm Inc.; Raj is the program manager for this
project
6. Fine-pitch Cu interconnections without solders: Process development, fabrication and reliability
characterization of 30 micron pitch Cu interconnections to Intel, TI, Infineon; Raj is the task leaders for
this project
7. High-density capacitor array, (Medtronic), 2008-2010 - This prototype demonstrates the ability to
integrate multiple capacitors on a single Integrated Passive Device (IPD) that can be embedded in a 3D
package; This technology can miniaturize medical devices such as pace-makers; Raj is the Project
Leader and Program Manager
8. Novel nanomagnetic planar antennas (Intel), 2010-2012- This prototype shows antenna
miniaturization with a novel nanomagnetic dielectric; This technology can miniaturize broadband
antennas in a mobile product; Raj is the Project Leader
9. Embedded thin-film ceramic capacitor prototypes (NGK-NTK, Korean Electronics Technology
Institute) 2004-2009, This prototype shows high reliability and low leakage currents with a thin-film
capacitor that is compatible with organic packages; Raj is the Project Leader
10. Integrated thin-film Resistor and Capacitors in organic packages (Army Research Labs), 2006-2008,
This prototype demonstrate simultaneous resistor and capacitor integration on a novel ceramic
composite substrate. Raj is the Project Leader
 11. High-density planar thin-film capacitors (Texas Instruments), 2009-2010 – This prototype show
integration of thin-film capacitors on silicon for a medical implant application - Raj is the Project
Leader
Academic Courses Taught
Semester (Year) Number of
(# of Lectures) Topic and Course number Other Instructors Students
2019, 2020 and 2021, BME 3721 Data Evaluation Principles 3150
Spring
2021, Spring Engineering Data Evaluation 35
2020, Fall Biomedical Device Design 10
2019, Fall Miniaturized Neuroelectronics 16
2018, Fall BME 4990 Bioelectronic Packaging 9
2013-2017 ECE 4754 With Prof. Rao Tummala 15-20
2008-2011 Electronic Packaging Module Assembly and Dr. Vanessa Smet

2000-2005 ECE 6776 With Prof. Rao Tummala 50-60

(1 Lecture) Packaging materials and passive
2005-2017 components
(3-4 Lectures)
Spring, 2007, 2008 ECE 4460 With Prof. M. 8-10
(1 Lecture) Passive components Swaminathan
Fall, ECE 4755 With Prof. Rao Tummala, 8-10
2008-2011 (2 Lectures) Packaging materials and passive Dr. Venky Sundaram
components
Spring MSE 4803 With Dr. Erik Shipton 8-10
2013 Magnetic components

Continuing Education Courses Taught

1. Co-instructor for Short course, 3D and nanosystems, Offered at the 59th Electronic Component an
d Technology Conference, ECTC 2009, May 28, 2009

2. Industry Short Course: Passive Components and Integration for Power and RF Modules,
International Microelectronics and Packaging Society (IMAPS) 2019, Boston, 9/30/19 – 10/3/19

3. (Invited Industry Short Course Instructor), Passive Components and Integration for Power and RF
Modules, P. Markondeya Raj, Georgia Tech – Packaging Research Center, 22nd Annual Components
for Military & Space Electronics Conference & Exhibition, May 7-10th, 2018, Four Points by Sheraton
(LAX), Los Angeles, California
1.
Curriculum and/or Short Course Development

4. Developed short courses on 3D systems packaging with systems scaling, (with Prof. Tummala and the
PRC team), Electronic Component and Technology Conference, Offered 2010-2017
5. “3D and Nanosystems”, Offered at the IEEE 59th Electronic Component and Technology Conference,
ECTC 2009, May 28, 2009
6. Developed short course on: System-On-Package (with Prof. Tummala and the PRC team), Electronic
Component and Technology Conference, Offered 2000-2008

PUBLICATIONS
Published Books and Parts of Books
1. Shubhendu Bhardwaj, Raj (Markondeyaraj) Pulugurtha, John L. Volakis, High Density
Electronic Integration for Wearable Sensing, in “Antenna and Sensor Technologies
in Modern Medical Applications”, Editors: Yahya Rahmat Sami and Erdem Topsakal.
2. P. M. Raj, Parthasarathi Chakraborti, Srikrishna Sitaraman, Saumya Gandhi, John
 Prymak, Swapan Bhattacharya; “Passives and integration with actives to form
power and RF modules”, Fundamentals of Microelectronic Systems Packaging,
Editor: Tummala, R. R; McGraw Hill Publications, August 2017

3. P. Markondeya Raj, Melinda Varga and Rao Tummala, Applications of Packaging Technologies in
Bioelectronics Fundamentals of Electronic Device and Systems Packaging Technologies, 2019

4. Muhammad Ali, P Markondeya Raj and Rao Tummala, Applications of Packaging Technologies in
Communication Systems, Fundamentals of Electronic Device and Systems Packaging Technologies,
2019

5. Siddharth Ravichandran, Markondeya Raj Pulugurtha, Vanessa Smet, Rao Tummala, ,

Applications of Packaging Technologies in Flexible Electronics, Fundamentals of Electronic Device
and Systems Packaging Technologies, 2019

6. Srikrishna Sitaraman, Manos Tentzeris, John Papapolymerou and P. M. Raj, “Fundamentals of RF and
5G packaging”, Fundamentals of Microelectronic Systems Packaging, Editor: Tummala, R. R.;
McGraw Hill Publications, August 2017

7. Himani Sharma, P M Raj, Shreya Dwarakanath, “Micro and nanopackaging materials”, Fundamentals
of Microelectronic Systems Packaging, Editor: Tummala, R. R.; McGraw Hill Publications, August
2017

8. Chandra Nair, Venky Sundaram and P M Raj, “Fundamentals of Packaging substrate materials,
Fundamentals of Microelectronic Systems Packaging, Editor: Tummala, R. R.; McGraw Hill
Publications, August 2017

9. P. M. Raj, D. W. Lee, L. Li, S. X. Wang, P. Chakraborti, H. Sharma, S. Jain, and R. Tummala,

"Embedded Passives," Materials for Advanced Packaging, pp. 537-588: Editors: Daniel Lu and C P
Wong; Springer International Publishing, 2017

10. P. M. Raj, Teng Sun, Gopal C. Jha, Swapan K. Bhattacharya and Rao R. Tummala. "Nanogranular
magnetic core inductors: Design, fabrication and packaging", NANOPACKAGING: Nanotechnologies
& Electronics Packaging, J E Morris, Ed. Wiley: 2nd edition

11. P. M. Raj, Parthasarathi Chakraborti, Dibyajat Mishra, Himani Sharma, Saumya Gandhi, Srikrishna
Sitaraman and Rao Tummala, “Nanostructured passive components for power and RF applications,”
Nanopackaging – from nanomaterials to the atomic scale, Edited by Xavier Baillin and Poupon Gilles;
Springer

12. P. M. Raj, Dibyajat Mishra, Erik Shipton, Himani Sharma and Rao Tummala; “Nanomagnetic
Structures, Properties and Applications In integrated RF and Power Modules and Sub-systems,”
Nanomagnetism, Edited by: Julian Gonzalez; One Central Press, UK; Appeared online in 2014, pp. 1-
28

13. Sharma, H., Chakraborthi, Raj, P. M., Wang, Y., Tummala, R., “Nanocapacitors”, Nanoelectronic
Device Applications Handbook, Editors: Morris, J. E., and Iniewski, K.,), CRC Press (Taylor & Francis
Group), 2012

14. Raj, P. M., Wong, C. P., Zhang, Z., and Tummala, R., “Wafer Level Packaging and Assembly”,
Chapter 11, System-On-Package, Editors: Tummala, R.R and Swaminathan, McGraw Hill
Publications, 2008

15. Venky Sundaram, Ganesh Krishnan, Raj, P. M., Kohl, P., and Fukuoka, Y., “Digital System-On-
Package”, Chapter 8 in “System-On-package”, Editors: Tummala, R.R and Swaminathan, McGraw
Hill Publications, 2008
 16. Raj, P. M., Liu, J., and Ohlckers, P., “Packaging Materials, Properties and Processes”, Fundamentals
of Electronic Packaging Materials, Processes and Properties, Chapter 18, Fundamentals of
Microelectronic Systems Packaging, Editor: Tummala, R. R.; McGraw Hill Publications, April 2001

17. Raj, P. M. and Cannon, W. R., “Electrosteric stabilization mechanisms in non-aqueous high solids
loading suspensions”, Polymers in Particulate Systems, Editors: Hackley, V. A., Somasundaram, P.,
and Lewis, J. A., Chapter 2, Marcel-Dekker Publications, April, 2001

18. Raj, P. M. and Cannon, W. R., “2-D Sintering of Oriented Ellipses by Grain Boundary and Surface
Diffusion – A Numerical Study of the Shrinkage Anisotropy” Sintering Science and Technology,
Editors: R. German, G. Messing and Robert G. Cornwall, Pennsylvania State University Press, pp. 393-
398, 1999
Patents
19. Interconnect structures and methods of making the same, P M Raj, Nitesh Kumbhat, Venky Sundaram
and Rao Tummala, US Patent 9,173,282
20. Second Level Interconnect Structures and Methods of Making the Same, P M Raj, Nitesh Kumbhat,
Venky Sundaram, Rao Tummala and Qin Xian, US 8, 970, 036
21. Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system
architectures, United States Patent Application, P. M. Raj, M. Swaminathan, M. K. Iyer, I R Abothu, J
H Hwang, R. Tummala, US 7,977,758 B2
22. Systems and methods for providing high density capacitor processes, P M Raj, Rao Tummala, Andy
Fenner, Anna Malin, J D Goud, US 8084841 B2
23. Integrating Three-Dimensional High Capacitance Density Structures, P. M. Raj, Devarajan Balaraman,
Farrokh Ayazi, Isaac Robin Abothu, Rao Tummala, Patent number 8,174,017
24. High aspect ratio metal-polymer composite structures for nanointerconnects, US Patent 7,262, 075,
Ankur Aggarwal, P. M. Raj and Rao Tummala issue 2007 October
25. Lead-free bonding systems, US 7,5556,189 B2, july 7, 2009, Ankur Aggarwal, Isaac Robin Abothu, P.
M. Raj, Rao Tummala
26. High aspect ratio metal polymer composite structures for nanointerconnects, Ankur Aggarwal, P. M.
Raj and Rao Tummala, US 7,557,448 B2, July 7, 2009.

Journal Publications:
27. A. O. Watanabe, B. K. Tehrani, T. Ogawa, P. M. Raj, M. M. Tentzeris, and R. R. Tummala, "Ultralow-
loss substrate-integrated waveguides in glass-based substrates for millimeter-wave applications," IEEE
Transactions on Components, Packaging and Manufacturing Technology, vol. 10, pp. 531-533, 2020.

28. M. Ali, A. Watanabe, T. Kakutani, P. M. Raj, R. R. Tummala, and M. Swaminathan, "Heterogeneous

Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates," in 2020 IEEE 70th
Electronic Components and Technology Conference (ECTC), 2020, pp. 1376-1382.

29. M. Ali, A. O. Watanabe, T.-H. Lin, D. Okamoto, M. R. Pulugurtha, M. M. Tentzeris, et al., "Package-
Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio
Bands," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, pp.
1515-1523, 2020.

30. Y. Wang, A. O. Watanabe, N. Ogura, P. M. Raj, and R. Tummala, "Sintered Nanocopper Paste for
High-Performance 3D Heterogeneous Package Integration," Journal of Electronic Materials, vol. 49,
pp. 6737-6745, 2020.

31. A. O. Watanabe, M. Ali, R. Zhang, S. Ravichandran, T. Kakutani, P. M. Raj, et al., "Glass-based IC-
embedded antenna-integrated packages for 28-GHz high-speed data communications," in 2020 IEEE
70th Electronic Components and Technology Conference (ECTC), 2020, pp. 89-94.
32. A. O. Watanabe, H. Ito, R. P. Markondeya, R. R. Tummala, and M. Swaminathan, "Low-Loss
Impedance-Matched Sub-25-µm Vias in 3-D Millimeter-Wave Packages," IEEE Transactions on
Components, Packaging and Manufacturing Technology, vol. 10, pp. 870-877, 2020.

33. A. O. Watanabe, T.-H. Lin, M. Ali, Y. Wang, V. Smet, P. M. Raj, et al., "Ultrathin Antenna-Integrated
Glass-Based Millimeter-Wave Package With Through-Glass Vias," IEEE Transactions on Microwave
Theory and Techniques, vol. 68, pp. 5082-5092, 2020.

34. A. O. Watanabe, M. Ali, S. Y. B. Sayeed, R. R. Tummala, and P. M. Raj, "A Review of 5G Front-End
Systems Package Integration," IEEE Transactions on Components, Packaging and Manufacturing
Technology, 2020.

35. T.-H. Lin, K. Kanno, A. O. Watanabe, P. M. Raj, R. R. Tummala, M. Swaminathan, et al., "Broadband
and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications," IEEE Antennas and
Wireless Propagation Letters, vol. 19, pp. 1963-1967, 2020.

36. S. Dwarakanath, T. Kakutani, D. Okamoto, P. M. Raj, M. Swaminathan, and R. R. Tummala,

"Reliability of fine-pitch< 5 µm diameter microvias for high-density interconnects," IEEE Transactions
on Components, Packaging and Manufacturing Technology, 2020.

37. Shreya Dwarakanath, Kimiyuki Kanno, Pratik C. Nimbalkar, Mohanalingam Kathaperumal,

Markondeya Raj Pulugurtha, Madhavan Swaminathan and Rao R. Tummala, Emerging dielectric
materials and performance to meet next-generation high-performance computing needs, Transactions
of components, packaging and manufacturing technologies, (Submitted), April 2020.

38. Yiteng Wang, Atom O. Watanabe, Nobuo Ogura, P. Markondeya Raj, Rao R. Tummala,
Comprehensive Study on Copper Sintering Paste for High-Performance Integrated-Circuit Packaging,
Transactions of components, packaging and manufacturing technologies, 2019 (Accepted, Jan 2020)

39. S. Dwarakanath, P. M. Raj, N. Kondekar, M. D. Losego, and R. Tummala, "Vapor phase infiltration of
aluminum oxide into benzocyclobutene-based polymer dielectrics to increase adhesion strength to thin
film metal interconnects," Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films,
vol. 38, p. 033210, 2020. Shreya Dwarakanath, Pulugurtha Markondeya Raj Neha P Kondekar, Mark
D. Losego, Rao Tummala,

40. R.G. Spurney, H. Sharma, M.R. Pulugurtha, R. Tummala, N. Lollis, M. Weaver, S. Gandhi, M. Romig,
H. Brumm, Modeling and Validation the Effects of Nanostructure of ESR and Frequency-Stability of
High-Density Nanostructured Capacitors for Future in Embedded Power Converters, (Submitted, 2020)

41. M. Ali, A. Watanabe, T.-H. Lin, D. Okamoto, P. M. Raj, M. M. Tentzeris, et al., "Package-Integrated,
Wideband Power Dividing Networks and Antenna Arrays for 28 GHz 5G New Radio Bands," IEEE
Transactions on Components, Packaging and Manufacturing Technology, 2020.

42. T. Sun, H. Sharma, P. M. Raj, F. Yoshihiro, S. Hachiya, K. Takemura, et al., "Substrate embedded
thin-film inductors with magnetic cores for integrated voltage regulators," IEEE Transactions on
Magnetics, vol. 53, pp. 1-9, 2017.

43. Muhammad Ali, Fuhan Liu, Atom Watanabe, P. Markondeya Raj, Venkatesh Sundaram, Manos M.
Tentzeris and Rao. R. Tummala, First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass
Filters for 5G Small-Cell Applications, IEEE Microwave and Wireless Components Letters ( Volume:
28 , Issue: 12 , Dec. 2018 ) Page(s): 1110 - 1112

44. T.C. Huang, V. Smet, S. Kawamoto, P. M. Raj, R.R. Tummala, “Accelerated solid-liquid
interdiffusion bonding (SLID) with thermal stability and power handling,” Journal of Electronic
Materials, January 2018, Volume 47, Issue 1, pp 368–377
45. K. Demir, A. El Amrani, K. Ramachandran, V. Sukumaran, Y. Sato, V. Sundaram, P. M. Raj, R.
Tummala, “Reliability of Fine-Pitch Through-Vias in Glass Interposers and Packages for High-
Bandwidth Computing and Communications,” Journal of Materials Science: Materials in Electronics,
August 2018, Volume 29, Issue 15, pp 12669–12680

46. M.S. Kim, P. M. Raj, Y. Kim, G. Park, K. Cho. V. Smet, V. Sundaram, J. Kim, R. Tummala,
“Miniaturized and High-Performance RF Packages with Ultra-thin Glass Substrates”, Microelectronics
Journal, Volume 77, July 2018, Pages 66-72.

47. M.S. Kim, P. M. Raj, V. Sundaram, R. Tummala, “Ultra-thin High-Q RF 3D Inductors on Glass,”
IEEE Components Packaging and Manufacturing Technology, IEEE Transactions on Components,
Packaging and Manufacturing Technology, Volume: 8, Issue: 4, April 2018.

48. Z. Wu, J. Min, P. M. Raj, V. Sundaram, R. Tummala, “Ultra-miniaturized 3D IPD diplexers for LTE
applications on 200 µm thick glass substrates”, J. International Microelectronics and Packaging Society
(IMAPS), Accepted, June 2018.

49. Atom O. Watanabe, Pulugurtha Markondeya Raj, Denny Wong, Ravi Mullapudi, Rao Tummala, "
Multilayered Electromagnetic -Interference Shielding Structures for Suppressing Magnetic Field
Coupling," Journal of Electronic Materials, September 2018, Volume 47, Issue 9, pp 5243–5250

50. R. Grant Spurney, Himani Sharma1, M. Raj Pulugurtha, Rao Tummala, Naomi Lollis, Mitch Weaver,
Saumya Gandhi, Matt Romig, Holger Brumm, Ultra-High Density, Thin-Film Tantalum Capacitors
with Improved Frequency Characteristics for MHz Switching Power Converters, Journal of Electronic
Materials, September 2018, Volume 47, Issue 9, pp 5632–5639.

51. R. Grant Spurney, Himani Sharma1, M. Raj Pulugurtha, Rao Tummala, Naomi Lollis, Mitch Weaver,
Saumya Gandhi, Matt Romig, Holger Brumm, 3-D Packaging and Integration of High-Density
Tantalum Capacitors on Silicon, IEEE Transactions on Components, Packaging and Manufacturing
Technology ( Volume: 9 , Issue: 8 , Aug. 2019 ), pp. 1466-1472.

52. Youngwoo Kim; Jonghyun Cho; Kyungjun Cho; Junyong Park; Subin Kim; Dong-Hyun Kim; Gapyeol
Park; Srikrishna Sitaraman; P. M. Raj; Rao R. Tummala; Joungho Kim, “Glass-Interposer
Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of
Power/Ground Noise Coupling”, IEEE Transactions on Components, Packaging and Manufacturing
Technology, Year: 2017, Volume: 7, Issue: 9, Pages: 1493 - 1505

53. Youngwoo Kim; Jonghyun Cho; Jonghoon J. Kim; Kyungjun Cho; Subin Kim; Srikrishna Sitaraman;
Venky Sundaram; P. M. Raj; Rao R. Tummala; Joungho Kim, “Glass Interposer Electromagnetic
Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling”, IEEE Transactions on
Electromagnetic Compatibility, Year: 2017, Volume: 59, Issue: 3, Pages: 940 - 951

54. K. Demir, T. Ogawa, V. Sundaram, P. M. Raj, R. Tummala, “Reliability of Through-Package-Vias

from Via-First Processing with Ultra-Thin Glass,” IEEE Devices and Materials Reliability, Accepted
Sept 2017, (Volume: 17 , Issue: 4 , Dec. 2017), Page(s): 683 - 691.

55. S. Sitaraman, V. Sukumaran, P. M. Raj, Z. Wu, Y. Suzuki, Y. Kim, V. Sundaram, R. R. Tummala, J.

Kim, “Miniaturized Band-Pass filters as Ultra-thin 3D IPDs and Embedded Thinfilms in 3D Glass
Modules,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Year: 2017,
Volume: 7, Issue: 9, Pages: 1410 – 1418.

56. Z. Wu, J. Min, V. Smet, P. M. Raj, V. Sundaram, R. Tummala, “Ultra-thin 3D IPAC glass interposers
for RF front-end modules,”, J. Electron. Package 139(4), 041001 (Jul 27, 2017), Paper No: EP-16-
1151; doi: 10.1115/1.4037221

57. Bhupender Singh, Gary Menezes, Scott McCann, Vidya Jayaram, Jaesik Lee, Urmi Ray, Venky
Sundaram, P. M. Raj, Vanessa Smet and Rao Tummala, “Board-level Thermal Cycling and Drop Test
Reliability of Large, Ultra-thin Glass BGA Packages for Smart Mobile Applications”, IEEE
Transaction on Components Packaging and Manufacturing Technology, 2017, Volume 7, Issue 5, pp.
726-733
58. K. Demir, A. Armutlulu, V. Sundaram, P. M. Raj, R. Tummala, “Reliability of Copper Through-
Package Vias in Bare Glass Interposers,” IEEE Transaction on Components Packaging and
Manufacturing Technology, Year: 2017, Volume: 7, Issue: 6, Pages: 829 – 837

59. Parthasarathi Chakraborti.; Himni Sharma; Markondeya P. M. Raj; Saumya Gandhi; Rao Tummala;,
“Oxide Composition Studies Of Electrochemically Grown Tantalum Oxide On Sintered Tantalum
Using XPS Depth-Profiling And Co-Relation With Leakage Properties", Accepted in Journal of
Materials Science, 2017 (In press)

60. P. M. Raj, Himani Sharma, Srikrishna Sitaraman, Dibyajat Mishra and Rao Tummala, “System
Scaling with Nanostructured Power and RF Components”, Accepted in Proceedings of IEEE, 2017 (in
press), Print ISSN: 0018-9219, Online ISSN: 1558-2256, Digital Object Identifier:
10.1109/JPROC.2017.2748520

61. Shreya Dwarakanath, P. M. Raj, Kaya Demir, Vanessa Smet, Venky Sundaram, and Rao Tummala
(2017), “Electrodeposited Copper-Graphite Composites for Low-CTE-Integrated Thermal Structures”.
Journal of Microelectronics and Electronic Packaging: April 2017, Vol. 14, No. 2, pp. 56-62

62. C. Gianfagna, H. Yu, M. Swaminathan, P. M. Raj, R. Tummala, G. Antonini, “A Machine-Learning

Approach for the Design of NanoMagnetic-Based Antennas,” Journal of Electronic Materials, August
2017, Volume 46, Issue 8, pp 4963–4975

63. J. Min, M. Kim, T. Sun, P. M. Raj, R. Tummala, “High-Performance and Miniaturized RF

Components with Nanomagnetics”, J Mater Sci: Mater Electron (2017).
https://doi.org/10.1007/s10854-017-7396-2

64. P. Chakraborti, H. Sharma, P. M. Raj, K.-P. Rataj, C. Schnitter, N. Neuhart, S. Jain, S. Gandhi, R.
Tummala, "Ultrathin, Substrate-Integrated, and Self-Healing Nanocapacitors with Low-Leakage
Currents and High-Operating Frequencies," IEEE Transactions on Components, Packaging and
Manufacturing Technology, Vol., pp. 1-9, 2016

65. Kim, J. Cho, J. J. Kim, K. Kim, K. Cho, S. Kim, S. Sitaraman, P M Raj, V. Sundaram, R. Tummala
and J Kim, "Measurement and Analysis of Glass Interposer Power Distribution Network Resonance
Effects on a High-Speed Through Glass Via Channel," IEEE Transactions on Electromagnetic
Compatibility, vol. 58, pp. 1747-1759, 2016

66. H. Lee, B. S. Cook, K. P. Murali, P. M. Raj and M. M. Tentzeris, “Inkjet printed high-Q RF inductors
on paper substrate with ferromagnetic nanomaterial”, IEEE Microwave and Wireless Components
Letters, Vol. 26, (6), June, pp. 419-421, 2016

67. S. Gandhi, M. P. M. Raj, H. Sharma, P. Chakraborti, R. R. Tummala, "High-k Thin-Film Capacitors

With Conducting Oxide Electrodes on Glass Substrates for Power-Supply Applications," IEEE
Transactions on Components, Packaging and Manufacturing Technology, Vol. 6, issue 10, pp. 1561-
1566, 2016

68. K. Han, M. Swaminathan, P. M. Raj, H. Sharma, R. Tummala, S. Yang, et al., "Magneto-Dielectric

Nanocomposite for Antenna Miniaturization and SAR Reduction," IEEE Antennas and Wireless
Propagation Letters, Vol. 15, pp. 72-75, 2016

69. D. Mishra, P. M. Raj, J. Tishler, T. Sun, E. Shipton, R. Tummala, "Multilayered Ferromagnetic

Polymer Composite Structures for High-Density Power Inductors”, IEEE Transactions on Magnetics,
vol. 52, pp. 1-5, 2016

70. D. Mishra, P. M. Raj, R. Tummala, "Design, fabrication and characterization of thin power inductors
with multilayered ferromagnetic-polymer composite structures," Microelectronic Engineering, Vol.
160, pp. 34-38, 2016
71. S. Gandhi, S. Xiang, M. Kumar, H. Sharma, P. Chakraborti, P. M. Raj, R. Tummala, "Dielectric–
electrode interactions in glass and silicon-compatible thin-film (Ba, Sr) TiO3 capacitors," Journal of
Materials Science: Materials in Electronics, pp. 1-6, Sept 2016

72. K. P. Murali, H. Sharma, P. M. Raj, D. Mishra, M. Goyal, K. Silver, E. Shipton, R. Tummala,

"Structure-magnetic property correlations in nickel-polymer nanocomposites," Journal of Materials
Science: Materials in Electronics, Vol. 27, pp. 154-162, 2016

73. K. P. Murali, P. M. Raj, H. Sharma, R. Tummala, "CoY hexaferrite-PEEK composites for integrated
and miniaturized RF components," Journal of Materials Science: Materials in Electronics, Vol. 27, pp.
7010-7017, 2016

74. H. Sharma, P. M. Raj, R. Tummala, "Chemical synthesis of low-coercivity, silica/Co composites for
high-frequency magnetic components," Materials Chemistry and Physics, Vol. 175, pp. 46-53, 2016

75. Kyuhwan Han, Madhavan Swaminathan, P. M. Raj, Himani Sharma, Rao Tummala, Brandon
Rawlings, Vijay Nair. “RF Characterization of Magneto-dielectric Material using Cavity Perturbation
Technique”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume:
5, Issue: 12, Dec. 2015, pp. 1850 – 1859

76. Qin Xian, P M Raj, Vanessa Smet and Rao Tummala. “Direct SMT Interconnections of Large Silicon,
Glass and Low CTE Organic Interposers to Printed Wiring Board using Copper Microwire Arrays”,
IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 5, Issue: 11,
Nov. 2015, pp. 1709-1719

77. Parthasarathi Chakraborti, Himani Sharma, P M Raj, Rao Tummala, “XPS Depth Profiling and
Leakage Properties of Anodized Titania Dielectrics and their Application in High Density Capacitors”,
Journal of Materials Science, December 2015, Volume 50, Issue 23, pp 7600–7609

78. Himani Sharma, Shubham Jain, P M Raj, KP Murali,, Rao Tummala, "Magnetic and Dielectric
Property Studies in Fe- and NiFe-based Polymer Nanocomposites" Journal of Electronic Materials,
2015, Vol. 44, pp. 3819-3826

79. Kyu Han, Madhavan Swaminathan, P. M. Raj, Himani Sharma, Rao Tummala, Songnan Yang and
Vijay Nair, “Magneto-Dielectric Nanocomposite for Antenna Miniaturization and SAR Reduction”,
Antennas and Wireless Propagation Letters, IEEE, Volume: 15, ISSN 1536-1225, DOI:
10.1109/LAWP.2015.2430284, pp. 72-75

80. P. M. Raj, Dibyajat Mishra, Srikrishna Sitarman, Rao Tummala "Nanomagnetic Thinfilms for
Advanced Inductors and EMI Shields in Smart Systems", Journal of Materials Nanoscience, J. Mat.
NanoSci. 2014, 1(1), 31-38

81. P. M. Raj, Himani Sharma, G. Prashant Reddy, Nevin Altunyurt, Madhavan Swaminathan, Rao
Tummala, And Vijay Nair, Cobalt–Polymer Nanocomposite Dielectrics For Miniaturized Antennas,
Journal Of Electronic Materials, Doi: 10.1007/S11664-014-3025-5, April 2014, Volume 43, Issue
4, pp 1097-1106

82. Koushik Ramachandran, Jud Ready, P. M. Raj, Venky Sundaram, Rao Tummala, Insulation
Reliability of Fine-pitch Through-vias in Halogen-free Epoxy Substrates, Journal of Materials Science
D: Materials in Electronics; 15:1687-1695 (2014)

83. Xian Qin, Nitesh Kumbhat, P. M. Raj, Venky Sundaram and Rao Tummala, Finite Element Analysis
and Experimental Validation of Reliability of Silicon and Glass Interposers-to-Printed Wiring Board
SMT interconnections, IEEE Components, Packaging and Manufacturing Technologies, In press,
ISSN: 2156-3950, Digital Object Identified: 10.1109/TCPMT.2013.2296780, May 2014, pp. 696-806

84. Sadia A. Khan, Abhishek Choudhury, Nitesh Kumbhat, P. M. Raj, Venky Sundaram, Georg Meyer-
Berg*, and Rao Tummala, Multi-Chip Embedding Technology Using Fine Pitch Cu-Cu
Interconnections, Transactions on Components, Packaging and Manufacturing Technology. Issue 2,
Feb. 2013, pp. 197-204
85. Wang, Y., Xiang, S., Raj, P. M., Sharma, H., Williams, B., and Tummala, R. R., “All-Solution Thin-
film Capacitors and their Deposition in Trench and Through-Via Structures”, IEEE Transactions on
Components, Packaging and Manufacturing Technology (CPMT), Vol. 3, Issue 4, 2013, pp. 688-695

86. Ramachandran, K., Lui, F., Raj, P. M., Sundaram, V., Tummala, R., "Conductive anodic filament
failures in fine-pitch through-via interconnections in organic package substrates", Journal of Electronic
Materials, February 2013, Volume 42, Issue 2, pp 348-354

87. Raj, P. M., Reddy, G. P., Nataraj, N., Jha, G., Kumbhat, N., Brese, N., and Tummala, R., “Co-
electrodeposited Solder Composite Films for Advanced Thermal Interface Materials”, Transactions of
Components, Packaging and Manufacturing Technology, Issue 3, Vol. 6., June 2013, pp. 989-996

88. P. M. Raj, Himani Sharma, Saurabh Samtani, Dibyajat Mishra, Vijay Nair and Rao Tummala,
“Magnetic losses in metal nanoparticle-insulator nanocomposites”, Journal of Materials Science D,
Materials in Electronics, DOI: 10.1007/s 10854-013-1269-0, PRINT ISSN: 0957-4522, Online
ISSN:1573-482X, September 2013, Volume 24, Issue 9, pp 3448-3455

89. Kumbhat, N., Choudhury, A. , Mehrotra, G., Raj, P. M., Sundaram, V. , “Highly Reliable and
Manufacturable Ultrafine Pitch Cu-Cu Interconnections for Chip-Last Embedding With Chip-First
Benefits”, IEEE Transactions on Components, Packaging and Manufacturing Technology (CPMT),
VOL. 2, NO. 9, Sept 2012

90. Sharma, H., Sethi, K., Raj, P.M., Tummala, R., " Fabrication and characterization of novel silicon-
compatible high-density capacitors " Journal of Materials Science: Materials in Electronics, Vol. 28,
No. 2, pp. 528-535, 2012

91. Raj, P.M., Xiang, S., Kumar, M., Abothu, I.R., Hwang, J.H., Liu, Y., Yamamoto, H., Tummala, R., "
Leakage current suppression in solution-deposited barium titanate films on copper foils " Journal of
Materials Science: Materials in Electronics, Vol. 23, No. 4, pp. 901-908, 2012

92. Sharma, H., Sethi, K., Raj, P.M., Gerhardt, RA, Tummala, R., " Mechanistic interaction study of thin
oxide dielectric with conducting organic electrode " Materials Chemistry and Physics, Vol. 134, No. 1,
pp. 508-513, 2012

93. Raj, P.M., Lee, B.W., Balaraman, D., Tummala, R.R., " Leakage current analysis of hydrothermal
BaTiO 3 thin films " Journal of Electroceramics, Vol. 27, No. 3-4, pp. 169-175, 2011

94. Raj, P.M., Lee, B.W., Kang, N.K., Tummala, R.R., Lance, M.J., Meyer III, H.M., " Hydrothermal
Thin Film Characteristics and their Suitability for Power Supply Applications " Journal of the
American Ceramic Society, Vol. 93, No. 9, pp. , 2010

95. Cannon, W.R., Raj, P.M., " Evolution of Sintering Anisotropy Using a 2D Finite Difference Method ",
Journal of the American Ceramic Society, Vol. 92, No. 7, pp. 1391-1395, 2009

96. Hwang, J.H., Markondeya Raj, P., Abothu, I.R., Yoon, C., Iyer, M., Jung, H.M., Hong, J.K.,
Tummala, R., " Temperature dependence of the dielectric properties of polymer composite based RF
capacitors " Microelectronic Engineering, Vol. 85, No. 3, pp. 553-558, 2008

97. Aggarwal, A.; Markondeya Raj, P.; Baik-Woo Lee; Myung Jin Yim; A.; Iyer, M.; Wong, C.P.;
Tummala, R., “Thermomechanical Reliability of Nickel Pillar Interconnections Replacing FlipChip
Solder without Underfill”, IEEE Transactions on Electronics Packaging Manufacturing, October, vol.
31, No. 4, pp. 341-354, 2008

98. Raj, P.M., Balaraman, D., Abothu, I.R., Yoon, C., Kang, N.K., Tummala, R., " Integrating high-k
ceramic thin film capacitors into organic substrates via low-cost solution processing " Components and
Packaging Technologies, IEEE Transactions on, Vol. 30, No. 4, pp. 585-594, 2007

99. Raj, P.M., Balaraman, D., Govind, V., Abothu, I.R., Wan, L., Gerhardt, R., Swaminathan, M.,
Tummala, R., " Processing and dielectric properties of nanocomposite thin film “Supercapacitors” for
 high-frequency embedded decoupling " Components and Packaging Technologies, IEEE Transactions
on, Vol. 30, No. 4, pp. 569-578, 2007

100. Aggarwal, A.O., Raj, P.M., Tummala, R.R., " Metal–Polymer Composite Interconnections for Ultra
Fine-Pitch Wafer Level Packaging " Advanced Packaging, IEEE Transactions on, Vol. 30, No. 3, pp.
384-392, 2007

101. Aggarwal, A.O., Abothu, I.R., Raj, P.M., Sacks, M.D., Tummala, R.R., " Lead-Free Solder Films Via
Novel Solution Synthesis Routes " Components and Packaging Technologies, IEEE Transactions on,
Vol. 30, No. 3, pp. 486-493, 2007

102. Kumbhat, N., Raj, P.M., Pucha, R.V., Tsai, J.Y., Atmur, S., Bongio, E., Sitaraman, S.K., Tummala,
R.R., " Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging "
Advanced Packaging, IEEE Transactions on, Vol. 30, No. 4, pp. 641-653, 2007

103. Bhattacharya, S.K., Raj, P.M., Balaraman, D., Windlass, H., Tummala, R.R., " Process development
for PWB compatible embedded capacitors " Circuit World, Vol. 30, No. 1, pp. 31-35, 2004 . Raj is the
project leader and key author for the paper

104. Lee, B.W., Abothu, I.R., Raj, P.M., Yoon, C.K., Tummala, R.R., " Tailoring of temperature coefficient
of capacitance (TCC) in nanocomposite capacitors " Scripta materialia, Vol. 54, No. 7, pp. 1231-1234,
2006

105. Banerji, S., Raj, P.M., Bhattacharya, S., Tummala, R.R., " Warpage-induced lithographic limitations
of FR-4 and the need for novel board materials for future microvia and global interconnect needs "
Advanced Packaging, IEEE Transactions on, Vol. 28, No. 1, pp. 102-113, 2005

106. Tummala, R., Aggarwal, A., Bansal, S., Raj, PM, " SMT Goes From Micro to Nanoscale " SMTA
News And Journal Of Surface Mount Technology, Vol. 18, No. 3, pp. 19, 2005

107. Tummala, R.R., Swaminathan, M., Tentzeris, M.M., Laskar, J., Chang, G.K., Sitaraman, S., Keezer,
D., Guidotti, D., Huang, Z., Lim, K., Raj, P. M., " The SOP for miniaturized, mixed-signal computing,
communication, and consumer systems of the next decade " Advanced Packaging, IEEE Transactions
on, Vol. 27, No. 2, pp. 250-267, 2004, Cambridge Univ Press

108. Kumbhat, N., Raj, P. M., Hegde, S., Pucha, R. V., Sundaram, V., Hayes, S., Atmur, S., Bhattacharya,
S., Sitaraman, S. K., and Tummala, R. R., "Novel Board Material Technology for Next-Generation
Microelectronic Packaging" in "Developments in Dielectric Materials and Electronic Devices",
Ceramic Transactions (K.M.Nair et al, Editors), Vol.167, pp. 371-382, 2004

109. Pucha, R.V., Sitaraman, S.K., Hegde, S., Damani, M., Wong, C. P., Qu, J., Zhang, Z., Raj, P.M., and
Tummala, R., "Materials and mechanics challenges in SOP-based convergent systems", Invited paper,
Micromaterials and nanomaterials, Issue No. 3, pp. 110-123, Aug, 2004

110. Balaraman, D., Raj, PM, Wan, L., Abothu, IR, Bhattacharya, S., Dalmia, S., Lance, MJ, Swaminathan,
M., Sacks, MD, Tummala, RR, " BaTiO 3 films by low-temperature hydrothermal techniques for next
generation packaging applications " Journal of electroceramics, Vol. 13, No. 1, pp. 95-100, 2004

111. Tummala, R.R., Raj, P.M., Atmur, S., Bansal, S., Banerji, S., Liu, F., Bhattacharya, S., Sundaram, V.,
Shinotani, K., White, G., " Fundamental limits of organic packages and boards and the need for novel
ceramic boards for next generation electronic packaging " Journal of electroceramics, Vol. 13, No. 1,
pp. 417-422, 2004

112. Shinotani, K.I., Raj, P.M., Seo, M., Bansal, S., Sakurai, H., Bhattacharya, S.K., Tummala, R.,
"Evaluation of alternative materials for system-on-package (SOP) substrates " Components and
Packaging Technologies, IEEE Transactions on, Vol. 27, No. 4, pp. 694-701, 2004

113. Windlass, H., Raj, P.M., Balaraman, D., Bhattacharya, S.K., Tummala, R.R., " Colloidal processing of
polymer ceramic nanocomposite integral capacitors " Electronics Packaging Manufacturing, IEEE
Transactions on, Vol. 26, No. 2, pp. 100-105, 2003
 114. Windlass, H., Markondeya Raj, P., Balaraman, D., Bhattacharya, S.K., Tummala, R.R., " Polymer-
ceramic nanocomposite capacitors for system-on-package (SOP) applications " Advanced Packaging,
IEEE Transactions on, Vol. 26, No. 1, pp. , 2003

115. Raj, P.M., Odulena, A., Cannon, WR, " Anisotropic shrinkage during sintering of particle-oriented
systems--numerical simulation and experimental studies " Acta materialia, Vol. 50, No. 10, pp. 2559-
2570, 2002

116. Raj, P.M., Cannon, W.R., " Anisotropic Shrinkage in Tape-Cast Alumina: Role of Processing
Parameters and Particle Shape " Journal of the American Ceramic Society, Vol. 82, No. 10, pp. 2619-
2625, 1999

117. Raj, P.M., Cannon, W.R., " 2-D particle shape averaging and comparison using Fourier descriptors "
Powder technology, Vol. 104, No. 2, pp. 180-189, 1999

118. Raj, P.M., Dunn, S.M., Cannon, W.R., " Edge Sharpening for Unbiased Edge Detection in Field
Emission Scanning Electron Microscope Images " Microscopy and Microanalysis, Vol. 5, No. 2, pp.
136-146, 1999

119. Raj, P.M., Dunn, S.M., Cannon, W.R., " Measurement of particle orientation in tape cast ceramic
microstructures " Journal of computer-assisted microscopy, Vol. 10, No. 1, pp. 33-51, 1998

120. Raj, PM, Dunn, SM, Cannon, WR, " Edge sharpening for unbiased edge detection in field emission
scanning electron microscope (FESEM) Images " Microscopy And Microanalysis, Vol. 4, No. , pp. 62-
63, 1998

121. Cosandey, F., Raj, P. M., Cannon, W., " Texure Determination Of Ceramic Materials By EBSD "
Microscopy And Microanalysis-NEW YORK-, Vol. 5, pp. 224-225, 1999

122. Raj, P.M., and Jacob, K. T., “Standard molar Gibbs free energies of formation of CoMoO2 and
Co3MoO4: Consistency Requirements.”, Materials Transactions, Japan Institute of Metals, Vol. 36,
No. 5, pp. 693 - 694 (1995)

123. Raj, P.M., " A critical assessment of the standard molar Gibbs free energy of formation of NiWO 4 "
Bulletin of Materials Science, Vol. 18, No. 5, pp. 623-630, 1995

124. Raj, P.M., and Jacob, K. T., “Standard molar Gibbs free energies of formation of CoMoO2 and
Co3MoO4: Consistency Requirements.”, Materials Transactions, Japan Institute of Metals, Vol. 36,
No. 5, pp. 693 - 694 (1995)

125. Raj, P.M., " A critical assessment of the standard molar Gibbs free energy of formation of NiWO 4 "
Bulletin of Materials Science, Vol. 18, No. 5, pp. 623-630, 1995

Magazine Articles
126. P. Markondeya Raj, Nithin Nedumthakady and Rao Tummala, Packaging of Bio-Implantable
Electronics, Chip Scale Review, January, 2019.

127. Siddharth Ravichandran, Markondeya Raj Pulugurtha, Vanessa Smet, Rao Tummala,
Nanopackaging for Component Assembly and Embedded Power in Flexible Electronics:
Heterogeneous Component Integration for Flexible Systems, IEEE Nanotechnology Magazine, 2019

128. P. Markondeya Raj, Next-Generation Nanopackaging, IEEE Nanotechnology Magazine, 2018

129. P. Markondeya Raj, Nanopackaging Pervades Future Electronic and Bioelectronic Systems [Guest
Editorial], IEEE Nanotechnology Magazine, 2019

130. Rao R. Tummala, Venky Sundaram, P.M. Raj, Vanessa Smet, “Future of Embedding and Fan-out
Technologies”, Chip Scale Review, February 2017
 131. P. M. Raj, Saumya Gandhi, Srikrishna Sitaraman, Venky Sundaram, Rao Tummala, “3DIPAC, A New
Concept in integrated passive and active components”, Chip Scale Review, Sept-Oct 2013

132. P. M. Raj, Xian Qin, Jialing Tong, Gary Menezes, Vanessa Smet and Rao Tummala, “Large Silicon,
Glass or Low-CTE Organic Package to Printed Wiring Board SMT Interconnections”, Chip Scale
Review, Sept-Oct 2013

133. Raj, P.M., Sharma, H., Mishra, D., Murali, KP, Han, K., Swaminathan, M., Tummala, RR,
"Nanomagnetics for High-Performance, Miniaturized Power, and RF Components Nanopackaging] "
Nanotechnology Magazine, IEEE, Vol. 6, No. 3, pp. 18-23, 2012

134. Swaminathan, M., Sundaram, V., Papapolymerou, J., Markondeya Raj, P., " Polymers for RF Apps-
Advanced polymers for RF packaging applications " IEEE Microwave Magazine, Vol. 12, No. 7, pp.
62, 2011. Raj is the key author for one of the sections in the paper

135. Tummala, R.R., Sundaram, V., Raj, PM, Pucha, R., Bandyopadhyay, T., Kumbhat, N., Sridharan, V.,
Walden-Monroe, T., Sutter, D., " Georgia Tech’s Vision for Ultra-miniaturized Device and Systems
Packaging " Chip Scale Review, Vol. 14, No. 4, pp. 14-18, 2010

136. Tummala, R., Wong, CP, Markondeya Raj, P., " Nanopackaging research at Georgia Tech "
Nanotechnology Magazine, IEEE, Vol. 3, No. 4, pp. 20-25, 2009

137. Kumbhat, N., Raj, P.M., Pucha, R.V., Sundaram, V., Bongio, E., Sitaraman, S., Tummala, R.R., "
Packaging Substrates-A Novel Low CTE, High Stiffness Ceramic Composite Core-A new substrate
meets attributes for solder joint reliability, dielectric reliability, low warpage and microvia " Circuits
Assembly, Vol. 18, No. 1, pp. 28-29, 2007

138. Tummala, R., Raj, PM, "SoP for Multifunctional System Packages: Through Thin Film Component
Integration in Contrast to SiP with Stacked IC Modules " Advanced Packaging, Vol. 14, No. 7, pp. 18,
2005

139. Raj, P. M., Balaraman, D., Abothu, I. R., and Tummala, R. R., “Achieving ceramic properties for
embedding components in organic substrates”, Advanced Packaging, March 2006, pp. 20

140. Tummala, R., Raj, PM, Sundaram, V., " Next-generation Packaging Materials New Developments in
Board/Package Materials and Processes " Advanced Packaging, Vol. 13, No. , pp. 26-33, 2004

141. Tummala, R., RAJ, P.M., Sundaram, V., " Next-Generation Packaging Material " Advanced
Packaging, Vol. 13, No. 6, pp. , 2004

Conference publications
142. Dieff Vital, Md Monirojjaman Monshi, Shubhendu Bhardwaj, P. Markondeya Raj, John L. Volakis,
Flexible Ink-Based Interconnects for Textile-Integrated RF Components, 2020 IEEE International
Symposium on Antennas and Propagation and North American Radio Science Meeting, 5-10 July 2020
• Montréal, Québec, Canada

143. Pulugurtha Markondeya Raj, Md Monirojjaman Monshi, Shubhendu Bhardwaj, John Volakis, High-
Density Component Integration in Fabrics with Thin Flex Interposers, 2020 IEEE International
Symposium on Antennas and Propagation and North American Radio Science Meeting, 5-10 July 2020
• Montréal, Québec, Canada

144. Sepehr Soroushiani*, Jose F Solis Camara, Huy Nhut Hoang Nguyen, Kelly Nair Rojas, Carolina
Moncion, P Markondeya Ra, Low-Impedance Graphene - PEDOT-PSS Electrodes for Neural
Recording and Stimulation in Implantable Medical Devices, IEEE-NANO 2020, EEE International
Conference on Nanotechnology (IEEE-NANO 2020), Hotel Bonaventure in Montreal, July 29th to 31st
of 2020.
145. P. M Raj, Monir Monshi, Shubhendu Bhardwaj and John Volakis, High-Density Flexible and Textile
Electronics with Die (Fan-Out) Embedding, Remateable and Deformable Interconnects and Flexible
Embedded Passives, Gomactech 20, Microelectronics for a New Decade: Global Competition and
Near-Peer Challenges, Town and Country Resort, San Diego, CA, March 16-20, 2020.

146. Heterogeneous Package Integration for 5G Systems: Design and Packaging Advances, P. M Raj,
Satheesh Bojja Venkatakrishnan and John Volakis, Gomactech 20, Microelectronics for a New
Decade: Global Competition and Near-Peer Challenges, Town and Country Resort, San Diego, CA,
March 16-20, 2020.

147. S. Y. B. Sayeed, D. Wilding, J. S. Camara, D. Vital, S. Bhardwaj, and P. Raj, "Deformable

Interconnects with Embedded Devices in Flexible Fan-Out Packages," in International Symposium on
Microelectronics, 2019, pp. 000163-000168.

148. S. Y. B. Sayeed, S. B. Venkatakrishnan, M. M. Monshi, A. Abdulhameed, J. L. Volakis, and P. Raj, "3D

Heterogeneous and Flexible Package Integration for Zero-Power Wireless Neural Recording," in 2020
IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 1003-1009.

149. M. M. Monshi, J.-S. Camara, S. Bhardwaj, J. L. Volakis, and P. Raj, "High-Density Embedded
Electronics in Textiles with 3D Flex Package Transfer," in 2020 IEEE 70th Electronic Components and
Technology Conference (ECTC), 2020, pp. 835-840.

150. Atom Watanabe, Takenori Kakutani, Markondeya Raj Pulugurtha and Rao R. Tummala, Integrated 5G
and mm-Wave Passive Components with 3D Glass Substrates, Muhammad Ali, 70th IEEE Electronic
Components and Technology Conference, (ECTC) 2020, Orlando, FL, United States, May 26-29,
2020, accepted Nov 2019.

151. Ali, Muhammad, Ravichandran, Siddharth, Takenori Kakutani, Markondeyaraj Pulugurtha, Tummala,
Rao R, Swaminathan, Madhavan; Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz
High-Speed Data Communications, 70th IEEE Electronic Components and Technology Conference,
(ECTC) 2020, Orlando, FL, United States, May 26-29, 2020, accepted Nov 2019.

152. P M Raj, Shreya Dwarakanath, Robert G Spurney, Kathaperumal Mohanlingam and Rao Tummala,
Nanostructures for Enabling Implantable Bioelectronic Systems, IEEE Nanotechnology Materials
and Devices (NMDC), Portland, Oregon, October 14-17, 2018

153. J. F. S. Camara, S. Soroushiani, D. Wilding, S. Y. B. Sayeed, M. Monshi, J. L. Volakis, et al.,

"Remateable and Deformable Area-Array Interconnects in 3D Smart Wireless Sensor Packages," in
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 671-676.

154. S. Bhardwaj, S. Y. B. Sayeed, J. S. Camara, D. Vital, and P. Raj, "Reconfigurable mm Wave Flexible
Packages with Ultra-thin Fan-Out Embedded Tunable Ceramic IPDs," in International Symposium on
Microelectronics, 2019, pp. 000434-000437.

155. Tong-Hong Lin, P. M. Raj, Atom Watanabe, Venky Sundaram, Rao Tummala, and Manos M.
Tentzeris, “Nanostructured Miniaturized Artificial Magnetic Conductors (AMC) for High-Performance
Antennas in 5G, IoT, and Smart Skin Applications”, IEEE Nanotechnology Conference, 2017,
Pittsburg, July 25-28

156. K. Mohan, N. Shahane, P. M. Raj, A. Antoniou, V. Smet, R. Tummala, " Low-temperature, organics-
free sintering of nanocopper foams for reliable, high-temperature and high-power die-attach
interconnections" 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), Tampa,
FL, 2017, 26-30 March 2017, 10.1109/APEC.2017.7931137

157. S. Dwarakanath, P. M. Raj, K. Demir, V. Smet, V. Sundaram, R. Tummala, "Electrodeposited copper-

graphite composites for low-CTE integrated thermal structures," in International Symposium on
Microelectronics: FALL 2016, Vol. 2016, No. 1, pp. 88-93 *Best Paper Award*
158. W. T. Khan; S. Sitaraman; A. L. Vera; M. P. M. Raj; V. Sundaram; R. R. Tummala; J.
Papapolymerou, A V-band end-fire Yagi-Uda antenna on an ultra-thin glass packaging technology,
2015 European Microwave Conference (EuMC), Year: 2015, Pages: 618 – 621

159. Carmine Gianfagna, Madhavan Swaminathan, P M Raj, Rao Tummala, Giulio Antonini, Enabling
Antenna Design with Nano-Magnetic Materials using Machine Learning, IEEE Nanotechnology
Materials and Devices (NMDC), pp. 86-90, 2015

160. Erik Shipton, Harley Hayden and Greg Mohler, P. M. Raj, Teng Sun, Srikrishna Sitaraman, and Rao
Tummala, Nanomagnetic Films and Arrays for Nonlinear Devices in Highly-Integrated RF Modules,
IEEE-NANO 2015, Rome, July 26-29, 2015

161. H. Lee, M.M. Tentzeris, P. M. Raj, K P Murali and Y.Kawahara, “Inkjet-Printed Ferromagnetic
Nanoparticles for Miniaturization of Flexible Printed RF Inductors”, Procs. 2013 IEEE International
Symposium on Antennas and Propagation, pp.994-994, Orlando, FL, July 2013

Conference Presentations with Proceedings

162. Muhammad Ali, Atom Watanabe, Tong-Hong Lin, Fuhan Liu, Markondeya Raj Pulugurtha, Manos
M. Tentzeris and Rao R. Tummala, 3D Glass Package-Integrated, High-Performance Power Dividing
Networks for 5G Broadband Antennas, Proceedings of the 69th Electronic Components and
Technology Conference, ECTC 2019, Las Vegas, May 28-31, 2019.

163. Atom O. Watanabe, Yiteng Wang, Nobuo Ogura, P. Markondeya Raj, Vanessa Smet, Manos M.
Tentzeris, and Rao R. Tummala, Low-Loss Additively-Deposited Ultra-Short Copper-Paste
Interconnections in 3D Antenna-Integrated Packages for 5G and IoT Applications, Proceedings of the
69th Electronic Components and Technology Conference, ECTC 2019, Las Vegas, May 28-31, 2019.

164. Shreya Dwarakanath, Atsushi Kubo, Daichi Okamoto, Fuhan Liu, Chandra Nair, Pulugurtha
Markondeya Raj, Mohan Kathaperumal, Rao R. Tummala Evaluation Of Fine-Pitch Routing
Capabilites Of Advanced Dielectric Materials For Low Capacitance Panel-RDL In 2.5D Interposer
And Fan-Out Packages, Proceedings of the 69th Electronic Components and Technology Conference,
ECTC 2019, Las Vegas, May 28-31, 2019.

165. Teng Sun, Robert G. Spurney, P. Markondeya Raj, Himani Sharma, Furukawa Yoshihiro and Rao
Tummala, 3D Packaging with Embedded High-Power-Density Passives for Integrated Voltage
Regulators, Proceedings of the 69th Electronic Components and Technology Conference, ECTC 2019,
Las Vegas, May 28-31, 2019.

166. Atom O. Watanabe, Yiteng Wang, P. Markondeya Raj, Manos M. Tentzeris, and Rao R. Tummala,
Design and demonstration of ultra-thin 3D glass-based 5G modules with low-loss interconnects, 2018
International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC),
DOI: 10.23919/ICEP.2018.8374698, Apr 17-21, 2018.

167. Tong-Hong Lin, Ryan A. Bahr, and Manos M. Tentzeris, P. Markondeya Raj, Venky Sundaram, and
Rao Tummala, “Novel 3D-/Inkjet-Printed Flexible On-Package Antennas, Packaging Structures, and
Modules for Broadband 5G Applications”, Proceedings of the 68th IEEE Electronic Components and
Technology Conference (ECTC), San Diego, May 29 - June 1, 2018.

168. Shreya Dwarakanath, P. Markondeya Raj, Vanessa Smet, Venky Sundaram, Mark Losego, Rao
Tummala, “High-Temperature and Moisture Ageing Reliability of High-Density Power Packages for
Electric Vehicles”, Proceedings of the 68th IEEE Electronic Components and Technology Conference
(ECTC), San Diego, May 29 - June 1, 2018.

169. Kashyap Mohan, Ninad Shahane, Ramon Sosa, P. M. Raj, Vanessa Smet, Rao Tummala and Sadia
Khan, “Demonstration of Patternable, Compliant Cu Pillar with Nanocopper Cap Interconnections for
Manufacturable Cu-Cu Bonding in Chip-to-Substrate Applications”, Proceedings of the 68th IEEE
Electronic Components and Technology Conference (ECTC), San Diego, May 29 - June 1, 2018.
170. Nithin Nedumthakady, Bartlet Deprospo, P. Markondeya Raj, Venky Sundaram, Rao Tummala, Kyle
Byers, Sean Garrison, Chris Gibson, Michael Elsbury, “Integrated Cu Heat Spreaders in Glass Fan-Out
(GFO) Packages Using Near-Zero Resistance Thermal Interface Material (TIM) for High-Power
Devices”, Proceedings of the 68th IEEE Electronic Components and Technology Conference (ECTC),
San Diego, May 29 - June 1, 2018.

171. Atom O. Watanabe, Tong-Hong Lin, P. Markondeya Raj, Venky Sundaram, Manos M. Tentzeris, and
Rao R. Tummala, Tomonori Ogawa, “Leading-Edge and Ultra-Thin 3D GlassPolymer 5G Modules
With Seamless Antenna-to-Transceiver Signal Transmissions”, Proceedings of the 68th IEEE
Electronic Components and Technology Conference (ECTC), San Diego, May 29 - June 1, 2018.

172. Muhammad Ali, Atom O. Watanabe, Fuhan Liu, Markondeya R. Pulugurtha, Venkatesh Sundaram,
Manos M. Tentzeris and Rao. R. Tummala, “Miniaturized High-Performance Filters for 5G Small-Cell
Applications”, Proceedings of the 68th IEEE Electronic Components and Technology Conference
(ECTC), San Diego, May 29 - June 1, 2018.

173. Robert Grant Spurney, Himani Sharma, P.M. Raj, Rao Tummala, Naomi Lollis, Mitch Weaver,
Saumya Gandhi, Matt Romig, “High-Temperature Embedded Aluminum Capacitors on Silicon for
Miniaturized High-Voltage Power Modules”, Proceedings of the 68th IEEE Electronic Components
and Technology Conference (ECTC), San Diego, May 29 - June 1, 2018.

174. Martin Letz, Wu Zihan, Sukhadha Viswanathan, Matthias Jotz, Holger Maune, Matthias Jost, P.
Markondeya Raj, Venkatesh Sundaram and Rao Tummala, “Glass in electronic packaging and
integration: High Q inductances for 2.35 GHz impedance matching in 0.05 mm thin, glass substrates”,
Proceedings of the 68th IEEE Electronic Components and Technology Conference (ECTC), San
Diego, May 29 - June 1, 2018.

175. Wenjing Su, Zihan Wu, Yunnan Fang, Ryan Bahr, Pulugurtha Markondeya Raj, Rao Tummala, and
Manos M. Tentzeris, “3D Printed Wearable Flexible SIW and Microfluidics Sensors for Internet of
Things and Smart Health Applications”, International Microwave Symposium, 2017, 4-9 June 2017,
Honolulu, Hawaii

176. Rao R. Tummala, Venky Sundaram, P.M. Raj, Vanessa Smet, “Future of Embedding and Fan-out
Technologies”, Pan Pacific Microelectronics Symposium, February 6-9, 2017
177. S. Dwarakanath, P. M. Raj, C. Leng, M.D. Losego, R. R. Tummala, "Organic-inorganic hybrid
dielectrics with improved high-temperature reliability," 67th IEEE Electronic Components and
Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted
Nov 2016
178. V. Jayaram, S. McCann, B. Singh, P. M. Raj, H. Matsuura, Y. Takagi, T. Huang, V. Smet, R.
Tummala,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando,
FL, United States, May 30 - June 2, 2017, accepted Nov 2016
179. H. Lee, V. Smet, P. M. Raj, R. Tummala, “Design of Low-Profile Integrated Transformer and Inductor
for Substrate-Embedding in 1-5kW Isolated GaN DC-DC Converters,” 67th IEEE Electronic
Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2,
2017, accepted Nov 2016
180. N. Shahane, K. Mohan, G. Ramos, A. Kilian, R. Taylor, F. Wei, P. M. Raj, An. Antoniou, V. Smet, R.
Tummala, “Enabling chip-to-package Cu-Cu interconnections: design of engineered bonding interfaces
for improved manufacturability and low-temperature bonding,” 67th IEEE Electronic Components and
Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted
Nov 2016
181. V. Smet, P. M. Raj, R. Taylor, G. Ramos, R. Nichols, A. Kilian, R. Tummala, “Scaling Cu pillars to
20um pitch and below: strategic role of surface finish and barrier layers” 67th IEEE Electronic
Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2,
2017, accepted Nov 2016
182. R.G. Spurney, H. Sharma, M.P. M. Raj, N. Lollis, M. Romig, S. Gandhi, H. Brumm, R. Tummala,
"High Voltage and High Temperature Capacitors for Next-Generation Power Modules in Electric
 Vehicles," 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL,
United States, May 30 - June 2, 2017, accepted Nov 2016
183. V. Sundaram, B. DeProspo, P. M. Raj, N. Gezgin, R. Tummala, K. Byers, S. Garrison, G. Kraus, M.
Elsbury, “Integrated Copper Heat Slugs and EMI shields in Panel Laminate (LFO) and Glass Fanout
(GFO) Packages for High Power RF IC’s,” 67th IEEE Electronic Components and Technology
Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
184. S. Viswanathan, T. Huang, T. Ogawa, P. M. Raj, F. Liu, V. Sundaram, R. Tummala, "High Frequency
Electrical Performance and Thermo-Mechanical Reliability of Fine Pitch, Copper Metallized Through
Package Vias (TPVs) in Ultra-Thin Glass Substrates,” 67th IEEE Electronic Components and
Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted
Nov 2016
185. O. Watanabe, M. Ali, B. Tehrani, J. Hester, H. Matsuura, T. Ogawa, M. P. M. Raj, V. Sundaram, M.
M. Tentzeris, R. R. Tummala, “First Demonstration of 28GHz and 39GHz Transmission Lines and
Antennas on Glass Substrates for 5G Modules,” 67th IEEE Electronic Components and Technology
Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017, accepted Nov 2016
186. Buch, P. M. Raj, B. Brown, H. Sharma, T. Sun, K.-S. Moon, K-J Wolter, R. Tummala "Ultra-Thin
Wireless Power Module with Integration of Wireless Inductive Link and Supercapacitors," in 66th
IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016,
Las Vegas, NV, United States, 2016, pp. 2364-2371
187. P. Chakraborti, N. Neuhart, K. P. Rataj, C. Schnitter, S. Gandhi, H. Sharma, P. M. Raj, F. Stepniak, M.
Romig, N. Lollis, R. R. Tummala, "Fabrication and Integration of Ultrathin, High-Density, High-
Frequency Ta Capacitors on Silicon for Power Modules," in 66th IEEE Electronic Components and
Technology Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States,
2016, pp. 1958-1963
188. K. Demir, A. Benali, V. Sundaram, P. M. Raj, R. Tummala, "Reliability of Copper-Plated Through-
Package-Via (TPV) in Glass Packages with in-Situ Stress Measurements Using Raman Spectroscopy,"
in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 - June
3, 2016, Las Vegas, NV, United States, 2016, pp. 799-805
189. T. C. Huang, V. Smet, P. M. Raj, R. R. Tummala, G. Ramos, A. Kilian, R. Taylor, R. Nichols,
"Demonstration of Next-Generation Au-Pd Surface Finish with Solder-Capped Cu Pillars for Ultra-
Fine Pitch Applications," in 66th IEEE Electronic Components and Technology Conference, (ECTC)
2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 2553-2560
190. V. Jayaram, S. McCann, T. C. Huang, S. Kawamoto, P. M. Raj, V. Smet, R. Tummala,
"Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-Thin
Low-CTE Package Assemblies," in 66th IEEE Electronic Components and Technology Conference,
(ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 101-107
191. M. S. Kim, M. P. M. Raj, Z. Wu, V. Sundaram, R. Tummala, "Innovative Electrical Thermal Co-
Design of Ultra-High Q TPV-Based 3D Inductors in Glass Packages," in 66th IEEE Electronic
Components and Technology Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV,
United States, 2016, pp. 2384-2388
192. S. McCann, S. Kuramochi, H. Yun, V. Sundaram, M. P. M. Raj, R. R. Tummala, S. K. Sitaraman,
"Board-Level Reliability of 3D through Glass via Filters during Thermal Cycling," in 66th IEEE
Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016, Las
Vegas, NV, United States, 2016, pp. 1575-1582
193. Min, Z. Wu, M. P. M. Raj, V. Smet, V. Sundaram, A. Ravindran, C. Hoffmann, R. Tummala,
"Modeling Design Fabrication and Demonstration of RF Front-End Module with Ultra-Thin Glass
Substrate for LTE Applications," in 66th IEEE Electronic Components and Technology Conference,
(ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1297-1302
194. N. Shahane, K. Mohan, R. Behera, A. Antoniou, P. R. Markondeya, V. Smet, et al., "Novel High-
Temperature, High-Power Handling All-Cu Interconnections through Low-Temperature Sintering of
Nanocopper Foams," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016,
May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 829-836
195. B. Singh, T.-C. Huang, S. Kawamoto, V. Sundaram, P. M. Raj, V. Smet, R. Tummala, "Demonstration
of Enhanced System-Level Reliability of Ultra-Thin BGA Packages with Circumferential Polymer
Collars and Doped Solder Alloys," in 66th IEEE Electronic Components and Technology Conference,
(ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 1377-1385
196. T. Sun, P. M. Raj, J. Min, Z. Wu, H. Sharma, T. Takahashi, K. Takemura, H. Yun, F. Carobolante, R.
Tummala, "Magnetic Materials and Design Trade-Offs for High Inductance Density, High-Q and Low-
Cost Power and EMI Filter Inductors," in 66th IEEE Electronic Components and Technology
Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 374-
379
197. R. Tummala, K. J. Wolter, V. Sundaram, V. Smet, P. M. Raj, "New era in automotive electronics, a
co-development by Georgia tech and its automotive partners," in 2016 Pan Pacific Microelectronics
Symposium (Pan Pacific), January 25, 2016 - January 28, 2016, Big Island, HI, United States, 2016,
pp.1-4
198. A. O. Watanabe, S. Jeong, S. Kim, Y. Kim, J. Min, D. Wong, R. Mullapudi, P. M. Raj, Ra. Tummala,
Y. Kim, J. Kim, "Highly-Effective Integrated EMI Shields with Graphene and Nanomagnetic
Multilayered Composites," in 66th IEEE Electronic Components and Technology Conference, (ECTC)
2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 206-210
199. Z. Wu, J. Min, M. Kim, M. P. M. Raj, V. Sundaram, R. R. Tummala, "Design and Demonstration of
Ultra-Thin Glass 3D IPD Diplexers," in 66th IEEE Electronic Components and Technology
Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp.
2348-2352
200. Min Suk Kim, Sangbeom Cho ; Junki Min ; Pulugurtha, M.R. , Huang, N. ; Sitaraman, S. ; Sundaram,
V. ; Velez, M. ; Ravindran, A. ; Joshi, Y. ; Tummala, R., “Modeling, design and demonstration of
ultra-miniaturized glass PA modules with efficient thermal dissipation”, Electronic Components and
Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 1163-1167
201. Sitaraman, S., Junki Min, P M Raj, Venky Sundaram, Rao Tummala, (2015). “Modeling, Design and
Demonstration of Trench-based Electromagnetic Shielding in Miniaturized RF Glass Packages”.
Electronic Components and Technology Conference (ECTC), 2015, IEEE 65th, pp. 1956-1960
202. Saumya Gandhi, P. M. Raj, Bruce C. Chou, Parthasarathi Chakraborti, Min Suk Kim, Srikrishna
Sitaraman, Himani Sharma, Venky Sundaram and Rao Tummala, Ultra-thin and Ultra-small 3D
Double-side Glass Power Modules with Advanced Inductors and Capacitors, Electronic Components
and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 230-235
203. P. M. Raj, Chandrasekharan Nair, Hao Lu, Fuhan Liu, Venky Sundaram, Dennis W. Hess+, Rao
Tummala , “Zero-Undercut” Semi-Additive Copper Patterning – A Breakthrough for Ultrafine-line
RDL Lithographic Structures and Precision RF Thinfilm Passives, Electronic Components and
Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 402-405
204. Vanessa Smet, Ting-Chia Huang, Satomi Kawamoto, Bhupender Singh, Venky Sundaram, Pulugurtha
Markondeya Raj and Rao Tummala, Interconnection Materials, Processes and Tools for Fine-pitch
Panel Assembly of Ultra-thin Glass Substrates, Electronic Components and Technology Conference
(ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 475-483
205. Kaya Demir, Saumya Gandhi, Tomonori Ogawa, Raghu Pucha, Vanessa Smet, Venky Sundaram, P.
M. Raj and Rao Tummala, First Demonstration of Copper-plated Through-Package-Via (TPV)
Reliability in Ultra-thin 3D Glass Interposers with Double-side Component Assembly, Electronic
Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 666-671
206. Dibyajat Mishra, Srikrishna Sitaraman, Saumya Gandhi, Sun Teng, P.M.Raj, Himani Sharma and Rao
Tummala, T. N. Arunagiri, Z. Dordi and R. Mullapudi, Nanomagnetic Structures for Inductive
Coupling and Shielding in Wireless Charging Applications, Electronic Components and Technology
Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 941-945
207. Ting-Chia Huang, Vanessa Smet, Satomi Kawamoto, Venky Sundaram, P. M. Raj, and Rao R.
Tummala, Modeling, Design and Demonstration of Ultra-short and Ultra-fine Pitch Metastable Cu-Sn
Interconnections with High-throughput SLID Assembly, Electronic Components and Technology
Conference (ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 1377-1384
208. Bhupender Singh, Vanessa Smet, Jaesik Lee, Gary Menezes, Makoto Kobayashi, Pulugurtha
Markondeya Raj, Venky Sundaram, Brian Roggeman, Urmi Ray, Riko Radojcic, and Rao Tummala,
First Demonstration of Drop-test Reliability of Ultra-thin Glass BGA Packages Directly Assembled on
Boards for Smartphone Applications, Electronic Components and Technology Conference (ECTC),
IEEE 65th, Orlando, May 26-29, 2015, pp. 1566-1573
209. Ninad Shahane, Scott McCann, Gustavo Ramos, Arnd Killian, Robin Taylor, Venky Sundaram,
Pulugurtha Markondeya Raj, Vanessa Smet, and Rao Tummala, Modeling, Design and
Demonstration of Low-temperature, Low-pressure and High-throughput Thermocompression Bonding
of Copper Interconnections without Solders, Electronic Components and Technology Conference
(ECTC), IEEE 65th, Orlando, May 26-29, 2015, pp. 1859-1865
210. Kyu Han, Madhavan Swaminathan, P. M. Raj, Himani Sharma, Rao Tummala, Brandon Rawlings,
Songnan Yang and Vijay Nair, Synthesis of Magneto-Dielectrics from First Principles and Antenna
Design, Electronic Components and Technology Conference (ECTC), IEEE 65th, Orlando, May 26-29,
2015, pp. 2228-2234
211. Parthasarathi Chakraborti, Saumya Gandhi, Himani Sharma, P. M. Raj, Kamil-Paul Rataj2 and Rao
Tummala, Demonstration of Ultra-thin Tantalum Capacitors on Silicon Substrates for High-frequency
and High-efficiency Power Applications, Electronic Components and Technology Conference (ECTC),
IEEE 65th, Orlando, May 26-29, 2015, pp. 2254-2258
212. P. M. Raj, Himani Sharma, KyuHwan Han, Saumya Gandhi, Srikrishna Sitaraman, Madhavan
Swaminathan and Rao Tummala, Tunable and Miniaturized RF Components with Nanocomposite and
Nanolayered Dielectrics, IEEE-NANO 2014, Ontario, Aug 18-21, 2014, pp. 27-31
213. Magneto-dielectric material characterization and Antenna Design for RF applications, Kyu Han,
Madhavan Swaminathan, P. M. Raj, Himani Sharma, Rao Tummala and Vijay Nair, 8th European
Conference on Antennas and Propagation, The Hague, Netherlands, April 6-11, 2014
214. P. M. Raj, Chandrasekharan Nair, Hao Lu, Fuhan Liu, Venky Sundaram, Dennis W. Hess, Rao
Tummala, Zero-Undercut” Semi-Additive Copper Patterning – A Breakthrough for Ultrafine-line RDL
Lithographic Structures and Precision RF Thinfilm Passives, Electronic Components and Technology
Conference (ECTC), IEEE 64th, San Diego, May 26-28, 2015
215. Vanessa Smet, Makoto Kobayashi, Tao Wang, Pulugurtha Markondeya Raj, and Rao Tummala, A
New Era in Manufacturable, Low-Temperature and Ultra-Fine Pitch Cu Interconnections and
Assembly Without Solders; Electronic Components and Technology Conference (ECTC), IEEE 64th,
Orlando, May 27-30, 2014, pp. 484-489
216. Tao Wang, Vanessa Smet, Makoto Kobayashi+, Venky Sundaram, P Markondeya Raj, and Rao
Tummala, Modeling, Design, and Demonstration of Low-temperature Cu Interconnections to Ultra-thin
Glass Interposers at 20 µm Pitch; Electronic Components and Technology Conference (ECTC), IEEE
64th, Orlando, May 27-30, 2014, pp. 284-289
217. Gary Menezes, Vanessa Smet, Makoto Kobayashi+, Venky Sundaram, Pulugurtha Markondeya Raj,
and Rao Tummala, Large low-CTE Glass package-to-PCB interconnections with solder strain-relief
using polymer collars; Electronic Components and Technology Conference (ECTC), IEEE 64th,
Orlando, May 27-30, 2014, pp. 1959-1964
218. Chinmay Honrao, Ting-Chia Huang, Makoto Kobayashi#, Vanessa Smet, P. M. Raj, and Rao
Tummala, Accelerated Solid Liquid InterDiffusion(SLID) bonding using thin multi-layer copper-solder
stack for fine-pitch interconnections; Electronic Components and Technology Conference (ECTC),
IEEE 64th, Orlando, May 27-30, 2014, pp. 1160-1165
219. Timothy Huang, Akira Mieno, Venky Sundaram, P. M. Raj, Himani Sharma, and Rao Tummala,
Adhesion and Reliability of Direct Cu Metallization of Through-Package Vias in Glass Interposer;
Electronic Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014,
pp. 2266-2270
220. Gokul Kumar, P. M. Raj, Jounghyun Cho, Saumya Gandhi, Parthasarathi Chakraborti, Venky
Sundaram, Joungho Kim and Rao Tummala, Coaxial Through-Package-Vias (TPVs) for Enhancing
Power Integrity in 3D Double-side Glass Interposers; Electronic Components and Technology
Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 541-547
221. Saumya Gandhi, Liyi Li, Ho-Yee Hui, Parthasarathi Chakraborti, Himani Sharma, P. M. Raj, C.P.
Wong and Rao Tummala, Nanowires-based high-density capacitors and thinfilm power sources in
ultrathin 3D glass modules; Electronic Components and Technology Conference (ECTC), IEEE 64th,
Orlando, May 27-30, 2014, pp. 1492-1497
222. Srikrishna Sitaraman, Yuya Suzuki, Christopher White, Vijay Nair, Telesphor Kamgaing, Frank
Juskey, Sung Jin Kim, P. M. Raj, Venky Sundaram, and Rao Tummala, Modeling, Design and
Demonstration of Multi-Die Embedded WLAN RF Front-End Module with Ultra-miniaturized and
High-performance Passives; Electronic Components and Technology Conference (ECTC), IEEE 64th,
Orlando, May 27-30, 2014, pp. 1264-1271
223. Sung Jin Kim, Zihan Wu, Makoto Kobayashi, Fuhan Liu, Vanessa Smet, P. M. Raj, Venky Sundaram,
and Rao Tummala, Design and Demonstration of Paper-Thin and Low-Warpage Single and 3D
Organic Packages with Chip-Last Embedding Technology for Smart Mobile Applications; Electronic
Components and Technology Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 1384-
1388
224. Kyu Han, Madhavan Swaminathan, P. M. Raj, Himani Sharma, Rao Tummala and Vijay Nair,
Magneto-dielectric Characterization and Antenna Design; Electronic Components and Technology
Conference (ECTC), IEEE 64th, Orlando, May 27-30, 2014, pp. 782-788
225. Chinmay Honrao, Akira Mieno, Makoto Kobayashi, Vanessa Smet, P. M. Raj, Venky Sundaram, Sung
Jin Kim, Rao Tummala, “Leading-Edge Fine-Pitch Off-Chip Interconnection Processes for
Simultaneous Underfilling and Reflowing, Conference: SRC Techcon 2013, Austin TX; Date: 9-10
September 2013
226. Xian Qin ; Gottschall, S. ; Kumbhat, N. ; Raj, P.M. ;Sungjin Kim ; Sundaram, V. ; Tummala, R. ;
Large silicon, glass and low CTE organic interposers to printed wiring board SMT interconnections
using copper microwire arrays Electronic Components and Technology Conference (ECTC), 2013
IEEE 63rd ; Digital Object Identifier: 10.1109/ECTC.2013.6575675 ; Publication Year: 2013, Page(s):
867 – 871
227. Gandhi, S. ; Raj, P.M. ; Sundaram, V. ; Sharma, H. ;Swaminathan, M. ; Tummala, R. ; Electronic
Components and Technology Conference (ECTC), 2013 IEEE 63rd ; A new approach to power
integrity with thinfilm capacitors in 3D IPAC functional module; Digital Object
Identifier: 10.1109/ECTC.2013.6575727 ; Publication Year: 2013, Page(s): 1197 – 1203
228. Sung Jin Kim ; Honrao, C. ; Raj, P.M. ; Sundaram, V. ;Tummala, R.; Ultra-thin and ultra-high I/O
density package-on-package (3D Thin PoP) for high bandwidth of smart systems; Electronic
Components and Technology Conference (ECTC), 2013 IEEE 63rd ; Digital Object
Identifier: 10.1109/ECTC.2013.6575603 ; Publication Year: 2013, Page(s): 406 – 411
229. Chakraborti, P. ; Sharma, H. ; Raj, P.M. ; Tummala, R.; Ultra-thin, self-healing decoupling capacitors
on thin glass interposers using high surface area electrodes ; Electronic Components and Technology
Conference (ECTC), 2013 IEEE 63rd ; Digital Object Identifier: 10.1109/ECTC.2013.6575701 ;
Publication Year: 2013, Page(s): 1043 – 1047
230. Raj, P.M. ; Uei-Ming Jow ; Jinxiang Dai ; Murali, K.P. ;Sharma, H. ; Mishra, D. ; Xiao, T.D. ; Gandhi,
S. ;Ghovanloo, M. ; Tummala, R.; 3D IPAC — A new passives and actives concept for ultra-
miniaturized electronic and bioelectronic functional modules; Electronic Components and Technology
Conference (ECTC), 2013 IEEE 63rd ; Digital Object Identifier: 10.1109/ECTC.2013.6575621, pp.
517-522.
231. Sundaram, V. ; Qiao Chen ; Tao Wang ; Hao Lu ; Suzuki, Y. ;Smet, V. ; Kobayashi, M. ; Pulugurtha,
R. ; Tummala, R.; Low cost, high performance, and high reliability 2.5D silicon interposer; Electronic
Components and Technology Conference (ECTC), 2013 IEEE 63rd ; Digital Object
Identifier: 10.1109/ECTC.2013.6575593; Publication Year: 2013, Page(s): 342 – 347
232. P. Makondeya Raj, K. P. Murali, Saumya Gandhi and Rao Tummala, Kirk Slenes and Nathan Berg,
“Integration of Precision Resistors and Capacitors with Near-Zero Temperature Coefficients in Silicon
and Organic Packages" Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd,
pp. 910-914, 2012.
233. Chakraborti, P., Sharma, H., Raj, P.M., Tummala, R., " High-density capacitors with conformal high-k
dielectrics on etched-metal foils " Electronic Components and Technology Conference (ECTC), 2012
IEEE 62nd, pp. 1640-1643, 2012
234. Gandhi, S., Xiang, S., Raj, P.M., Sundaram, V., Swaminathan, M., Tummala, R., " A low-cost
approach to high-k thinfilm decoupling capacitors on silicon and glass interposers " Electronic
Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp. 1356-1360, 2012
235. Han, K., Swaminathan, M., Raj, P.M., Sharma, H., Murali, KP, Tummala, R., Nair, V., " Extraction of
electrical properties of nanomagnetic materials through meander-shaped inductor and inverted-F
antenna structures " Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp.
1808-1813, 2012
236. Khan, S.A., Kumbhat, N., Goyal, A., Okoshi, K., Raj, P.M., Meyer-Berg, G., Sundaram, V., Tummala,
R., " High current-carrying and highly-reliable 30µm diameter Cu-Cu area-array interconnections
without solder " Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp.
577-582, 2012
237. Raj, P.M., Sharma, H.,Tummala, R.R., “Silicon and glass-integrated thinfilm power components”,
Proceedings of the CARTS International 2012, Capacitor and resistor Technology Symposium, Las
Vegas, pp. 287-296, 2012
238. Mishra, D., Raj, P.M., Khan, S., Kumbhat, N., Wang, Y., Addya, S., Pucha, R.V., Choudhury, A.,
Sundaram, V., Tummala, R., " Co-W as an advanced barrier for intermetallics and electromigration in
fine-pitch flipchip interconnections " Electronic Components and Technology Conference (ECTC),
2011 IEEE 61st, pp. 916-920, 2011
239. Sethi, K., Sharma, H., Raj, P.M., Sundaram, V., Tummala, R., " Conformal Atomic Layer Deposition
(ALD) of alumina on high surface-area porous copper electrodes to achieve ultra-high capacitance
density on silicon interposers " Electronic Components and Technology Conference (ECTC), 2011
IEEE 61st, pp. 1928-1932, 2011
240. Wang, Y., Xiang, S., Raj, PM, Sharma, H., Williams, B., Tummala, R., " Solution-derived electrodes
and dielectrics for low-cost and high-capacitance trench and Through-Silicon-Via (TSV) capacitors "
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, pp. 1987-1991, 2011.
241. Choudhury, A., Kumbhat, N., Khan, S.A., Raj, P.M., Sundaram, V., Meyer-Berg, G., Tummala, R., "
High throughput and fine pitch Cu-Cu interconnection technology for multichip chip-last embedding "
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, pp. 2021-2027, 2011
242. Raj, P.M., Sharma, H., Reddy, G.P., Altunyurt, N., Swaminathan, M., Tummala, R., Nair, V., Reid,
D., " Novel nanomagnetic materials for high-frequency RF applications " Electronic Components and
Technology Conference (ECTC), 2011 IEEE 61st, pp. 1244-1249, 2011
243. Raj, P.M., Sharma, H., Sethi, K., Wang, Y., Sundaram, V., Tummala, R., " Thin film power
components with nanoscale electrodes and conformal dielectrics " Nanotechnology (IEEE-NANO),
2011 11th IEEE Conference on, pp. 106-110, 2011
244. Choudhury, A., Kumbhat, N., Raj, P.M., Zhang, R., Sundaram, V., Dunne, R., Bolanos-Avila, M.,
Wong, CP, Tummala, R., " Low temperature, low profile, ultra-fine pitch copper-to-copper chip-last
embedded-active interconnection technology " Electronic Components and Technology Conference
(ECTC), 2010 Proceedings 60th, pp. 350-356, 2010
245. Reddy, G.P., Raj, P.M., Nataraj, N., Rajesh, PM, Jha, G., Choudhury, A., Kumbhat, N., Tummala, R.,
Brese, N., Toben, M., " Co-electrodeposited graphite and diamond-loaded solder nanocomposites as
thermal interface materials " Electronic Components and Technology Conference (ECTC), 2010
Proceedings 60th, pp. 1708-1712, 2010
246. Kumbhat, N., Choudhury, A., Raine, M., Mehrotra, G., Raj, P.M., Zhang, R., Moon, K.S., Chatterjee,
R., Sundaram, V., Meyer-Berg, G., " Highly-reliable, 30µm pitch copper interconnects using nano-
ACF/NCF " Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, pp. 1479-
1485, 2009
247. Altunyurt, N., Swaminathan, M., Raj, P. M., Nair, V., “Analysis on the miniaturization of reactive
impedance surfaces with magneto-dielectrics”, Antennas and Propagation Society International
Symposium, APSURSI '09. IEEE,1-5 June, Page(s):1 – 2009
248. Tummala, R.R., Chatterjee, R., Raj, P.M., and Sundaram, V., Aschenbrenner, R., and Reichl, H., Kim,
J., “System-On-Wafer by 3D All Silicon Systems Technology”, Proceedings of SMTA Conference,
Feb. 10-12, 2009
249. Tummala, R.R., Sundaram, V., Chatterjee, R., Raj, P.M., Kumbhat, N., Sukumaran, V., Sridharan, V.,
Choudury, A., Chen, Q., Bandyopadhyay, T., " Trend from ICs to 3D ICs to 3D systems " Custom
Integrated Circuits Conference, CICC'09. IEEE, pp. 439-444, 2009.
250. Altunyurt, N., Swaminathan, M., Raj, P.M., Nair, V., " Antenna miniaturization using magneto-
dielectric substrates " Electronic Components and Technology Conference, 2009. ECTC 2009. 59th,
pp. 801-808, 2009
251. Liu, J., Goud, J., Raj, P.M., Iyer, M., Wang, Z.L., Tummala, RR, " Real-time protein detection using
ZnO nanowire/thin film bio-sensor integrated with microfluidic system " Electronic Components and
Technology Conference, ECTC 2008. 58th, pp. 1317-1322, 2008
252. Raj, P.M., Jha, G., Mehrotra, G., Goud, J., Iyer, M., and Tummala, R.R., “ A novel nano SMT
approach for WLSOP”, pp. 205-210, Pan Pacific Microelectronics symposium and Table top
exhibition, Jan 22-24 2008, Hawaii
253. Mehrotra, G., Jha, G., Goud, J.D., Raj, P.M., Venkatesan, M., Iyer, M., Hess, D., Tummala, R., " Low-
temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding
layer " Electronic Components and Technology Conference, ECTC 2008. 58th, pp. 1410-1416, 2008
254. Raj, P.M., Hwang, J.H., Jung, H.M., Kumar, M., Jha, G., Coulter, K., Wellinghoff, S., Iyer, M.,
Tummala, R., " Low Temperature (≪ 100° C) deposited pyrochlore films with high capacitance (200
nF/cm2), low loss (∼ 0.003) and low TCF (≪ 100 ppm/C) for integrating RF components " Electronic
Components and Technology Conference, 2008. ECTC 2008. 58th, pp. 688-693, 2008
255. Bandyopadhyay, T., Mehrotra, G., Iyer, M.K., Raj, P.M., Swaminathan, M., Tummala, R.R., "
Microwave design & characterization of a novel Nano-Cu based ultra-fine pitch chip-to-package
interconnect " Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pp.
1242-1248, 2008
256. Goud, J.D., Raj, P.M., Liu, J., Narayan, R., Iyer, M., Tummala, R., " Electrochemical Biosensors and
Microfluidics in Organic System-on-Package Technology " Electronic Components and Technology
Conference, 2007. ECTC'07. Proceedings. 57th, pp. 1550-1555, 2007
257. Liu, J., Goud, J., Raj, PM, Iyer, M., Wang, Z., Tummala, RR, " Label-Free Protein Detection by ZnO
Nanowire Based Bio-Sensors " Electronic Components and Technology Conference, 2007. ECTC'07.
Proceedings. 57th, pp. 1971-1976, 2007
258. Hwang, J.H., Raj, P.M., Abothu, I.R., Yoon, C., Iyer, M., Jung, H.M., Hong, J.K., Tummala, R., "
Organic-based RF capacitors with ceramic-like properties " Electronic Components and Technology
Conference, 2007. ECTC'07. Proceedings. 57th, pp. 1866-1869, 2007
259. Abothu, I.R., Raj, P.M., Hwang, J.H., Kumar, M., Iyer, M., Yamamoto, H., Tummala, R., "
Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in
Organic Packages " Electronic Components and Technology Conference, 2007. ECTC'07. Proceedings.
57th, pp. 1014-1018, 2007
260. Tummala, R.R., Raj, P.M., Agrawal, A., Moon, J.K., Wong, C.P., Goud, J., Bandyopadhyay, T., and
Iyer, M., “NanoPackaging”, Proceedings of the Pan Pacific Symposium, Jan, 2007
261. Raj, P.M., Coulter, K., Hwang, J.H., Wellinghoff, S., Iyer, M., and Tummala, R.R., “Low Temperature
Processes to Integrate High k-Low Loss Thin Films In Organic Substrates for RF Capacitors”, IMAPS
Advanced Technology Workshop on Embedded Passives, Nov. 16-18, San Jose, CA, 2007
262. Raj, P.M., Sundaram, V., Goud, J.D., Swaminathan, M., and Iyer, M., and Tummala, R.R, “SOP for
Miniauturized Multifunctional Wearable Electronics”, IMAPS Advanced Technology Workshop on
Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications, May
7-10, Baltimore, MD, 2007
263. 8 Tummala, R.R., Swaminathan, M., Iyer, M., Raj, P.M., Sundaram, V., “Emerging Device and
Systems Packaging Trends”, Third International Conference and Exhibition on Device Packaging,
International Microelectronics And Packaging Society (IMAPS), Scottsdale, Arizona USA, March 19-
22, 2007
264. Tummala, R.R., Raj, P.M., Agrawal, A., Moon, J.C., Wong, C.P., Goud, J., Bandyopadhyay, T., and
Iyer, M., “Nanopackaging”, Proceedings of SMTA Conference, Hawaii, Feb, 2007
265. Goud, J.D., Raj, P.M., Iyer, M., and Tummala, R.R., “ Micro-electrochemical Enzyme Inhibition
Biosensor with MWCNTs, Zirconia / Nafion Enzyme Encapsulation for Environmental, Pesticide
Monitoring.” Electrochemical Society Workshop, Nov 16, 2007, Atlanta, GA
266. Aggarwal, A., Markondeya Raj, P., Lee, B.W., Yim, M.J., Tambawala, A., Iyer, M., Swaminathan,
M., Wong, CP, Tummala, R., " Reliability of nano-structured nickel interconnections replacing flipchip
solder assembly without underfill " Electronic Components and Technology Conference, 2007.
ECTC'07. Proceedings. 57th, pp. 905-913, 2007
267. Muthana, P., Engin, E., Raj, PM, Swaminathan, M., Tummala, R., Sundaram, V., Amey, D., Dietz, K.,
Banerji, S., " Design, Modeling and Characterization of Embedded Capacitors for Decoupling
Applications " 7th Annual Austin CAS Conference, pp. , 2006
268. Raj, PM, Abothu, IR, Abdolvand, R., Ayazi, F., Tummala, R., " Integrating Solution-Derived 3D PZT
Structures on Si Mems Platform for RF and Biomedical Applications " Advanced Packaging
Materials: Processes, Properties and Interface, 11th International Symposium on, pp. 122-122, 2006
269. Goud, JD, Raj, P.M., Iyer, M., Tummala, R., " Biofunctionalization of Multi-walled Carbon
Nanotubes (MWNTs) for the Fabrication of Protein Nano Biosensors " Advanced Packaging
Materials: Processes, Properties and Interface, 11th International Symposium on, pp. 119-121, 2007
270. Kumar, M., Xiang, S., Raj, P. M., Abothu, I. R., Hwang, J.-Hyun, Yamamoto, H.,* and Tummala, R.,
“Electrical Reliability of Solgel Barium Titanate Films on Copper Foils for Organic Package
Integration”, MRS Spring Meeting – 2010, Symposium C – Solution Processing of Inorganic and
Hybrid Materials for Electronics and Photonics
271. Goud, J., Raj, P.M., Liu, J., Iyer, M., Wang, ZL, Tummala, R., "Conductimetric Detection of Protein
and Cancer Cells with Oxide Nanosensors " MRS Proceedings, Vol. 1010, No. 1, 2007
272. Tummala, R., Wong, CP, Qu, J., Sitaraman, S., Markondeya Raj, P., " Fututre of Packaging and
packaging materials " Advanced Packaging Materials: Processes, Properties and Interface, 11th
International Symposium on, pp. 57-57, 2006
273. Abothu, I.R., Lee, B.W., Markondeya Raj, P., Engin, E., Muthana, P., Yoon, C.K., Swaminathan, M.,
Tummala, R.R., " Tailoring the temperature coefficient of capacitance (TCC), dielectric loss and
capacitance density with ceramic-polymer nanocomposites for RF applications " Electronic
Components and Technology Conference, Proceedings. 56th, pp. 5, 2006
274. Sundaram, V., Tummala, R., Wiedenman, B., Liu, F., Markondeya Raj, P., Abothu, IR, Bhattacharya,
S., Varadarajan, M., Bongio, E., Sherwood, W., " Recent advances in low CTE and high density
system-on-a-package (SOP) substrate with thin film component integration " Electronic Components
and Technology Conference, Proceedings. 56th, pp. 6., 2006
275. Tummala, R.R., Markondeya Raj, P., Aggarwal, A., Mehrotra, G., Koh, S.W., Bansal, S., Tiong,
T.T., Ong, CK, Chew, J., Vaidyanathan, K., " Copper interconnections for high performance and fine
pitch flip chip digital applications and ultra-miniaturized RF module applications " Electronic
Components and Technology Conference, 2006. Proceedings. 56th, pp. 10 pp., 2006
276. Tummala, R.R., Raj, P.M., Goud, J.D., and Iyer, M., “Nano SOP for Ultra-miniaturized Electronic and
Bio-electronic Systems”, Proceedings of SMTA Conference, pp. 191-200, Hawaii, Jan. 17, 2006
277. Xiao, TD, Raj, PM, Wan, L., Zhang, H., Ma, X., Reisner, DE, Zhang, YD, Balaraman, D.,
Bhattacharya, S., Abothu, IR, " Magnetic Nanocomposite Paste: An Ideal High-m , K and Q
Nanomaterial for Miniaturized Antennas and Inductors " , In session 5, Soft Nanotechnology and Self
Assembly, 2005 NSTI Nanotechnology and tradeshow, Nanotech
278. Muthana, P., Swaminathan, M., Engin, E., Raj, P.M., Tummala, R.R., "Mid-Frequency Decoupling
using Embedded Decoupling Capacitors." Electrical Performance of Electronic Packaging, Oct 24-26,
Page(s)271-274, 2005
279. Muthana, P., Swaminathan, M., Tummala, R., Raj, P.M., Engin, E., Wan, L., Balaraman, D.,
Bhattacharya, S., " Design, modeling and characterization of embedded capacitor networks for mid-
frequency decoupling in semiconductor systems " Electromagnetic Compatibility, 2005. EMC 2005.
2005 International Symposium on, Vol. 2, No. , pp. 638-643, 2005
280. Wan, L., Raj, P.M., Balaraman, D., Muthana, P., Bhattacharya, S.K., Varadarajan, M., Abothu, I.R.,
Swaminathan, M., Tummala, R., " Embedded decoupling capacitor performance in high speed circuits
" Electronic Components and Technology Conference, 2005. Proceedings. 55th, pp. 1617-1622, 2005
281. Muthana, P., Swaminathan, P., Tummala, R., Sundaram, V., Wan, L., Bhattacharya, SK, Raj, P.M., "
Packaging of Multi-Core Microprocessors: Tradeoffs and Potential Solutions " Electronic Components
and Technology Conference, 2005. Proceedings. 55th, pp. 1895-1903, 2005
282. Aggarwal, A.O., Raj, P.M., Sundaram, V., Ravi, D., Koh, S., Tummala, RR, Mullapudi, R., " 50
Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Package Nano Interconnects "
Electronc Components and Technology Conference, Vol. 55, No. 2, pp. 1139, 2005
283. Kumbhat, N., Raj, P.M., Pucha, R.V., Atmur, S., Doraiswamy, R., Sundaram, V., Bhattacharya, S.,
Sitaraman, S.K., Tummala, R.R., " Recent Advances in Composite Substrate Materials for High-
Density and High Reliability Packaging Applications " Electronic Components and Technology
Conference, pp. 1364-1372, 2005
284. Balaraman, D., Raj, PM, Abothu, R., Bhattacharya, S., Sacks, M., Lance, M., Meyer, H.,
Swaminathan, M., Tumrnala, R., " Exploring the limits of low cost, organics-compatible high-k
ceramic thin films for embedded decoupling applications " Electronic Components and Technology
Conference, 2005. Proceedings. 55th, pp. 1215-1221 Vol. 2, 2005
285. Lee, KJ, Bhattacharya, S., Varadarajan, M., Wan, L., Abothu, I.R., Sundaram, V., Muthana, P.,
Balaraman, D., Raj, PM, Swaminathan, M., " Design, fabrication, and reliability assessment of
embedded resistors and capacitors on multilayered organic substrates " Advanced Packaging
Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on, pp.
249-254, 2005
286. Raj, P. M., Balaraman, D., Govind, V., Abothu, I R., Bhattacharya S., Swaminathan M., and Tummala
R., “Magnetic nanocomposites for organic compatible miniaturized antennas and inductors”,
International Conference on Advanced Packaging Materials: Processing, Properties and Interfaces,
March 16-18, pp. 272-275, 2005
287. Xiao, TD, Ma, XQ, Zhang, H., Reisner, DE, Raj, PM, Wan, L., Tummala, R., " Magnetic
Nanocomposite Paste: An Ideal High-µ, k and Q Nanomaterial for Embedded Inductors in High
Frequency Electronic Applications " Proceedings of the 9th World Multiconference on Systemics,
Cybernetics and Informatics, pp. , 2005
288. Tummala, R. R., Raj, P. M., Goud, J. D., Iyer, M.,, “Nano- electronic system materials for electronic
and bio electronic applications”, International Conference on Advanced Materials Design &
Development, ICAMDD, Dec. 14-16, pp. 317-321, 2005
289. Wan, L., Markondeya Raj, P., Swaminathan, M., Tummala, R., " Design, simulation and
measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs "
Electronic Packaging Technology, 2005 6th International Conference on, pp. 108-112, 2005
290. Raj, P.M., Balaraman, D., Govind, V., Abothu, I.R., Bhattacharya, S., Swaminathan, M., and
Tummala, R.R., “Are supercapacitive nanocomposite thin films suitable for embedded decoupling?”,
International Workshop on Integrated Passives, Marco Island, International Symposium on
Microelectronics, International Microelectronics and Packaging Society, January 25-26, 2005
291. Muthana, P., Swaminathan, M., Tummala, R.R., Raj, P.M., Engin, E., Wan, L., Balaraman, D.,
Bhattacharya, S., “ Design, Modeling and Characterization of Embedded Capacitor Networks for Mid-
frequency Decoupling in Semiconductor Systems”, Proceedings, International Symposium on
Microelectronics, International Microelectronics and Packaging Society, Philadelphia, September 16-
18, 2005
292. Muthana, P.; Swaminathan, M.; Engin, E. Raj, P.M., Tummala, R.R., “Mid frequency decoupling
using embedded decoupling capacitors”, Electrical Performance of Electronic Packaging, 2005. IEEE
14th Topical Meeting on, 24-26 Oct., Page(s):271 – 274, 2005.
293. Tummala, R.R., Raj, P.M., Goud, J.D.,and Iyer, M., “Nano- electronic system materials for electronic
and bio electronic applications”, International Conference on Advanced Materials Design &
Development, ICAMDD, Dec. 14-16, pp. 317-321, – Goa, India, 2005
294. Aggarwal, A.O., Raj, PM, Abothu, I.R., Sacks, M.D., Tayl, AAO, Tummala, R.R., " New paradigm in
IC package interconnections by reworkable nano-interconnects " Electronic Components and
Technology Conference, 2004. Proceedings. 54th, Vol. 1, No., pp. 451-460, 2004
295. Abothu, I.R., Raj, P.M., Balaraman, D., Govind, V., Bhattacharya, S., Sacks, M.D., Swaminathan, M.,
Lance, M.J., Tummala, R.R., " Development of high-k embedded capacitors on printed wiring board
using sol-gel and foil-transfer processes " Electronic Components and Technology Conference, 2004.
Proceedings. 54th, pp. 514-520, 2004
296. Balaraman, D., Choi, J., Patel, V., Raj, P.M., Abothu, I.R., Bhattacharya, S., Wan, L., Swaminathan,
M., Tummala, R., " Simultaneous switching noise suppression using hydrothermal barium titanate thin
film capacitors " Electronic Components and Technology Conference, 2004. Proceedings. 54th, Vol. 1,
pp. 282-288 , 2004
297. Aggarwal, A.O., Raj, P.M., Tummala, R.R., " High aspect ratio metal-polymer composite structures
for nano interconnects " Advanced Packaging Materials: Processes, Properties and Interfaces, 2004.
2004 Proceedings. 9th International Symposium on, pp. 182-186, 2004
298. Aggarwal, A.O., Naeli, K., Raj, P.M., Ayazi, F., Bhattacharya, S., Tummala, R.R., " MEMS
composite structures for tunable capacitors and IC-package nano interconnects " Electronic
Components and Technology Conference, 2004. Proceedings. 54th, Vol. 1, No. , pp. 835-842, 2004
299. Aggarwal, A.O., Raj, P.M., Abothu, I.R., Ravi, D., Sacks, M.D., Tay, A.A.O., Tummala, R.R., "
Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-
interconnects " Advanced Packaging Materials: Processes, Properties and Interfaces, Proceedings. 9th
International Symposium on, pp. 69-73, 2004
300. Abothu, I.R., Raj, P.M., Balaraman, D., Sacks, M.D., Bhattacharya, S., Tummala, R.R., " Low-cost
embedded capacitor technology with hydrothermal and sol-gel processes " Advanced Packaging
Materials: Processes, Properties and Interfaces, Proceedings. 9th International Symposium on, pp.
78-83, 2004
301. Aggarwal, A.O., Markondeya Raj, P., Sacks, M.D., Tay, A.A.O., Tummala, R.R., " Ultra fine-pitch
wafer level packaging with reworkable composite nano-interconnects " Electronics Packaging
Technology Conference, 2004. EPTC 2004. Proceedings of 6th, pp. 132-137, 2004
302. Tummala, R.R., Raj, P.M., and Sundaram, V., "Microsystems packaging from microscale to
microscale to nanoscale", High Density Microsystem Design and Packaging and Component Failure
Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on 30 June-3 July,
Page(s):1 – 7, 2004.
303. Tummala, R.R., Raj, P.M. and Wang, Z.L., “Nanoscale packaging and nano-bio electronic systems
Proceedings”, Annual Symposium of the Electrochemical Society, Hawaii, October 4, 2004
304. Liu, F., Tummala, R.R., Sundaram, V., Guidotti, D., Huang, Z., Chang, Y-Z., Abothu, I.R., Raj, P.M.,
Bhattacharya, S., Balaraman, D., Chang, G.K., “Multifunctional Integrated Substrate Technology for
High Density SOP Packaging”, Proceedings of the 6th IEEE CPMT conference on High Density
Microsystem Design and Packaging, Shanghai, China, pp. 83-90, June, 2004
305. Kumbhat, N., Pucha, R.V., Raj, P.M., Sundaram, V., Bhattacharya, S., Hayes, S., Atmur, S.,
Sitaraman, S.K., and Tummala, R.R., “Development and Evaluation of Low-Cost C-SiC Substrates for
High-Density Build-up Microvia and Solder-Joint Reliability”, Proceedings, International Symposium
on Microelectronics, International Microelectronics and Packaging Society, Long Beach, California,
November 16-18, 2004
306. Aggarwal, O.A., Raj, P.M., Tummala, R.R., “Innovative, Scalable and Reworkable Metal-Polymer
Composite Nano Interconnects for Ultra Fine-Pitch Wafer Level Packages”, Proceedings, International
Symposium on Microelectronics, International Microelectronics and Packaging Society, Long Beach,
California, November 16-18, 2004
307. Sundaram, V., Tummala, R.R., White, G., Lim, K., Wan, L., Guidotti, D., Liu, F., Bhattacharya, S.,
Raj, P.M., Abothu, I.R., Doraiswami, R., Pucha, R.V., Laskar, J., Tentzeris, M., Chang, G.K., and
Swaminathan, M., “First single module demonstration of SOP with digital, optical and RF for last mile
broadband applications”, International Conference on Electronic Packaging, ICEP, April 14-16, pp.
399-404, Tokyo, Japan, 2004
308. Kumbhat, N., Markondeya Raj, P., Pucha, R.V., Sundaram, V., Doraiswami, R., Bhattacharya, S.,
Hayes, S., Atmur, S., Sitaraman, S.K., Tummala, R.R., " Next generation of package/board materials
technology for ultra-high density wiring and fine-pitch reliable interconnection assembly " Electronic
Components and Technology Conference, 2004 Proceedings. 54th, pp. 1843-1850 , 2004
309. Tummala, R.R., Markondeya Raj, P., Sundaram, V., "Microsystems packaging from milli to
microscale to nanoscale " High Density Microsystem Design and Packaging and Component Failure
Analysis, 2004 HDP'04. Proceeding of the Sixth IEEE CPMT Conference on, pp. , 2004
310. Markondeya Raj, P., Balaraman, D., Govind, V., Wan, L., Abothu, R., Gerhardt, R., Bhattacharya, S.,
Swaminathan, M., Tummala, R., " High frequency characteristics of nanocomposite thin film
supercapacitors and their suitability for embedded decoupling " Electronics Packaging Technology
Conference, 2004. EPTC 2004. Proceedings of 6th, pp. 154-161, 2004
311. Kumbhat, N., Hegde, S., Markondeya Raj, P., Pucha, R.V., Doraiswami, R., Hayes, S., Atmur, S.,
Bhattacharya, S., Sitaraman, S.K., Tummala, R.R., " Novel board material technology for next-
generation packaging " Advanced Packaging Materials: Processes, Properties and Interfaces,
Proceedings. 9th International Symposium on, pp. 247-252, 2004
312. Tummala, R., Raj, P. M., and Wang, Z. L., “Nanoscale packaging and nano-bio electronic systems”,
Proceedings, Annual Symposium of the Electrochemical Society, Hawaii, October 4, 2004
313. Bansal, S., Raj, PM, Shinotani, K., Bhattacharya, S., Tummala, R., Lance, MJ, " In-situ stress and
warpage measurements to investigate reliability of flip-chip on board assembly without underfill"
Electronic Components and Technology Conference, 2003. Proceedings. 53rd, pp. 148-155, 2003
314. Balaraman, D., Raj, P.M., Bhattacharya, S., Abothu, I.R., Dalmia, S., Wan, L., Swaminathan, M., and
Tummala, R.R., “Synthesis of Ceramic Thin Films for Organic Board Compatible Integral Capacitors –
Processing and Characterization”, Proceedings, International Microelectronics and Packaging Society,
pp. 200-206, Boston, MA, November, 2003
315. Balaraman, D., Raj, PM, Abothu, IR, Bhattacharya, S., Dalmia, S., Wan, L., Swaininathan, M.,
Tummala, R., " Integration and high-frequency characterization of PWB-compatible pure barium
titanate films synthesized by modified hydrothermal techniques (< 100° C) " Electronic Components
and Technology Conference, 2003. Proceedings. 53rd, pp. 1520-1527, 2003
316. Aggarwal, AO, Abothu, IR, Raj, PM, Ravi, D., Sacks, MD, Tay, AO, Tummala, RR, " Sol-gel derived
and repairable nano-interconnects " Electronics Packaging Technology, 2003 5th Conference (EPTC
2003), pp. 385-389, 2003
317. Kumbhat, N., Raj, P.M., Bansal, S., Doraiswami, R., Bhattacharya, S., Tummala, R., Hayes, S.,
Atmur, S., " New package/board materials technology for next-generation convergent microsystems "
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003), pp. 331-335, 2003
318. Brownlee, K., Shinotani, K., Raj, PM, Bbattacharya, SK, Wong, CP, Tummala, RR, " Evaluation of
low stress dielectrics for board application " Electronic Components and Technology Conference, 2003
Proceedings. 53rd, pp. 136-141, 2003
319. AGGARWAL, A.O., ABOTHU, I.R., MARKONDEYA RAJ, P., Ravi, D., SACKS, M.D.,
TUMMALA, R.R., " Novel low-cost sol-gel derived materials for nano-structured and repairable
interconnects " Proceedings, International Microelectronics and Packaging Society, pp. 943-948,
2003
320. BALARAMAN, D., MARKONDEYA RAJ, P., ABOTHU, I.R., BHATTACHARYA, S., SACKS,
M.D., TUMMALA, R., LANCE, M.J., " Synthesis of ceramic thin films for organic board compatible
integral capacitors: Processing and characterization ", Proceedings, International Microelectronics
and Packaging Society, Boston, MA, pp. 200-205, 2003
321. Tummala, R.R., Sundaram, V., White, G., Raj, P.M., Liu, F., Bhattacharya, S.,“ High density
packaging for 2010 and beyond ”, pp. 1-10, 4th International Symposium for Electronic Materials and
Packaging, Taiwan, 2002
322. Tummala, R.R., Dalmia, S., Balaraman, D., Hobbs, J., Windlass, H., Bavisi, A., Raj, P.M., Lee, S.H.,
Bhattacharya, S., White, G., Ayazi, F., Swaminathan, S., Erbil, A., Ogawa, T., “ Recent Advances in
Integral Passives Research at Georgia Tech”, International Conference on Electronic Packaging,
Tokyo, Japan, April, pp 116-123, 2002
323. Brownlee, K., Raj, P.M., Bhattacharya, S.K., Shinotani, K., Wong, CP, Tummala, R.R., "Evaluation of
liquid crystal polymers for high performance SOP application " Electronic Components and
Technology Conference, 2002. Proceedings. 52nd, pp. 676-680, 2002.
324. Aggarwal, AO, Markondeya Raj, P., Pratap, RJ, Saxena, A., Tummala, RR, " Design and fabrication
of high aspect ratio fine pitch interconnects for wafer level packaging " Electronics Packaging
Technology Conference, 2002. 4th, pp. 229-234, 2002
325. Banerji, S., Markondeya Raj, P., Liu, F., Shinotani, K., Bhattacharya, S., Tummala, R.R., "The role of
stiff base substrates in warpage reduction for future high-density-wiring requirements " Advanced
Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on, pp. 221-225, 2002
326. Balaraman, D., Markondeya Raj, P., Tanikella, R., Kohl, P., Bhattacharya, S., Tummala, R., " Low
temperature (3 films for integral capacitors " Electronics Packaging Technology Conference, 2002. 4th,
pp. 79-84, 2002
327. Balaraman, D., Markondeya Raj, P., Bhattacharya, S., Tummala, R.R., " Novel hydrothermal
processing (< 100° C) of ceramic-polymer composites for integral capacitor applications " Electronic
Components and Technology Conference, 2002. Proceedings. 52nd, pp. 1699-1703, 2002
328. Bansal, S., Markondeya Raj, P., Shinotani, K., Bhattacharya, S., Tummala, R., Lance, MJ,
"Reliability assessment of high density multi-layer board assembly using shadow Moire and
luminescence spectroscopy " Electronics Packaging Technology Conference, 2002. 4th, pp. 126-132,
2002
329. Windlass, H., Markondeya Raj, P., Balaraman, D., Bhattacharya, S.K., Tummala, R.R., "Processing
of polymer-ceramic nanocomposites for system-on-package applications" Electronic Components and
Technology Conference, 2001. Proceedings., 51st, pp. 1201-1206, 2001
330. Markondeya Raj, P., Shinotani, K., Seo, M., Bhattacharya, S., Sundaram, V., Zama, S., Lu, J.,
Zweben, C., White, G.E., Tummala, R.R., " Selection and evaluation of materials for future system-on-
package (SOP) substrate " Electronic Components and Technology Conference, Proceedings., 51st,
pp. 1193-1197, 2001
331. Banerji, S., Markondeya Raj, P., Shinotani, K.I., Seo, M., Zweben, C., Bhattacharya, S.K., Tummala,
R.R., " Control of warpage during build-up of multilayered high-density wiring with stiff and low-CTE
base substrates “, IMAPS - International symposium on High-Density Interconnects, Santa Clara, CA,
pp. 279-284, 2001
332. Tummala, R.R., Raj, P.M., and Mani, R., “Ceramics for IT”, Proceedings of International Society for
Advanced Ceramics, ISAC., Indian Ceramic Society, 2001, pp. 1-15.
333. Tummala, R.R., Shintotani, K., Sundaram, V., Bhattacharya, S., White, G., Liu, F., Raj, P.M., Wan,
L., Lee, S.H., Ravi, D., “What is the future of electronics? Is it SOP or SOC”, Invited Paper in ICEP
2001 Conference Japan, April 2001
334. Windlass, H., Raj, P.M., Balaraman, D., Bhattacharya, S.K., Tummala, R.R., “Colloidal processing of
nanosized ceramic-polymer composites for integral capacitor applications”, Proceedings, IMAPS, pp.
393-398, International symposium on packaging materials, processes and interfaces, Chateau Elan,
Braselton, GA, 2001
335. Raj, P.M., Bhattacharya, S.K., Zweben, C., Zama, S., Shinotani, K., Tummala, R.R., “Selection and
evaluation of materials for future system-on-package substrate”, Proceedings, International Council of
Electronic Packaging, ICEP, Japan. pp. 382-387, 2001
336. Bhattacharya, S.K., Morales, H., Raj, P.M., Shinotani, K., Tummala, R.R., “An Alternative method for
thin polymer coating on large area sop substrates”, Proceedings of INTERPACK’01 The Pacific/RIM
ASME International Electronics Packaging, Technical conference and Exhibition, Hyatt Regency
Hotel, July 8-13, Kauai, USA, 2001
337. Raj, P.M., SHINOTANI, K.I., AGARWAL, H., WHITE, G.E., TUMMALA, R.R., " Evaluation of
carbon-filled polymer composites for future base substrate and integral resistor applications ", IMAPS
33rd International Symposium on Microelectronics, Boston, pp. 351-356, 2000
338. Markondeya Raj, P. M, Windlass, H., Shinotani, K.I., Bhattacharya, S.K., Sundaram, V., Tummala,
R.R., " Delamination issues in integration of highly filled polymer-ceramic nanocomposite films on
 MCM-L compatible substrates " Electronic Components and Technology Conference, Proceedings.
50th, pp. 1681-1685, 2000
339. Windlass, H., Raj, P.M., Bhattacharya, S.K., and Tummala, R.R., “Optimized suspension formulations
for improved yield and dielectric properties of ceramic-polymer nanocomposites for integral passives”,
Proceedings, IMAPS, Advanced Technology Workshop on Integral Passives, Denver, Colarodo, April
28-30, 2000
340. Raj, P.M., Agarwal, H., Shinotani, K., White, G.E., and R. R. Tummala., “Evaluation of carbon-filled
composite materials for future base substrate and integral resistor applications”, IMAPS 33rd
International Symposium on Microelectronics, Boston, September 22-24, pp. 351-356, 2000
341. Raj, P.M., Cosandey, F., Cannon, WR, Mainwaring, P., "Particle orientation and texture formation in
tape cast ceramic materials " ICOTOM 12: 12 th International Conference on Textures of Materials,
pp. 1476-1481, 1999
Selected Conference Presentations without Proceedings
1. Sk Yeahia Been Sayeed, Jose Solis Camara, Daniel Wilding, Sharan Ramaswamy and P M Raj ,
Wearable Low-Power Microfabricated Magnetic Patches for Enhanced Cell Retention and
Growth, Miami Heart Month, FIU BME, Walter H Coulter Lecture Foundation Lecture Series,
2019

2. P M Raj, Shekhar Bhansali, Shubhendu Bhardwaj and John Volakis , 3D Component Integration
in Smart Sensor Packages, International Microelectronics and Packaging Society, Florida Chapter,
2018
3. 2018 Electronics Packaging Symposium that GE co-hosts with Binghamton University (Invited
talk) Industry Session on 3D power packaging, Title: Emerging passive component technologies
for power modules, Advanced Power Electronics Conference, APEC 2017, March 28-30, Tampa
4. (Invited Talk), Title: International Conferences for Power Sources on Chip (PwrSoC), Title:
High-density capacitors on silicon, October 3-5, 2016, Madrid, Spain
5. (Invited Talk), System Scaling as new electronic systems frontier with frontier materials,
Symposium on "Material Frontiers in Semiconductor Advanced Packaging” at the 2016 Spring
MRS Conference in Phoenix, AZ (March 28-April 1, 2016)
6. (Invited Talk), Third Annual Global Interposer Technology workshop, Nov. 20, 2014, Title:
Miniaturized RF, Power and Bioelectronic modules using Nanoscale Component Integration
7. (Invited Talk), Title: Integration of Power-Supply Capacitors with Ultrahigh Density on Silicon
Using Particulate Electrodes " International Conferences for Power Sources on Chip”, November
17, 2012
8. Raj, P. M., Goud, J., Iyer, M., and Tummala, R., “Integrating NanoSensing Components on SOP
platform for Detecting Chemical and Biological Agents”, Second International Workshop on 3S
(System-On-Chip, System-On-Package and System-In-Package) Technologies, September 27-29,
2006, Global Learning Center, GLC, 2006.
9. Raj, P. M., Goud, J., Iyer, M., and Tummala, R., “SOP For Miniaturized Multifunctional
Wearable Electronics”, Oral presentation within Track #1, Technical Session #4 (Enabling
Technologies II), Future technologies Conference, National Nuclear Security Administration,
October 10-13, Washington DC., 2006
10. Raj, P. M. and Cannon, W. R., “New board materials for next generation convergent electronic
systems”, 104th Annual Meeting of the American Ceramic Society, Indianapolis, April, 2004
11. Raj, P. M., Dunn, S. M., and Cannon, W. R., “Edge sharpening for unbiased edge detection in
FESEM images”. Symposium on applied image processing, Annual Microscopy and Microanalysis
Meeting, Atlanta, July, 1998
12. Raj, P. M. and Cannon, W. R., “Origin of anisotropic shrinkage in tape cast alumina”, 99th
Annual Meeting of the American Ceramic Society Composites and Interfaces Session of the
Electronics Division, Cincinnati, Ohio, May 3-5 1997
13. Raj, P. M. and Cannon, W. R., “Characterization of particle orientation and shape with computer-
assisted microscopy”, presented in the Characterization Session of the symposium on Powder
 Processing and Green Body Forming, 100th Annual Meeting of the American Ceramic Society,
Cincinnati, Ohio, May 5-7 1998
14. Raj, P. M. and Cannon, W. R., “Anisotropic shrinkage in tape cast ceramics - Role of powder
shape”, Powder Synthesis, Processing and Characterization Session of the symposium on Powder
Processing and Green Body Forming, 100th Annual Meeting of the American Ceramic Society,
Cincinnati, Ohio, May 5-7 1998
15. Raj, P. M. and Cannon, W. R., “Role of particle orientation in anisotropic sintering shrinkage in
tape cast alumina”, 101st Annual meeting of the American Ceramic Society, during the Session on
Microstructure/Texture Characterization, Symposium on Microstructural Evolution, Indianapolis,
May, 1998
16. Raj, P. M. and Cannon, W. R., “Characterization of texture in tape cast alumina with Electron
Backscattered Diffraction (EBSD)”, 101st Annual meeting of the American Ceramic Society,
Session on Microstructure/Texture Characterization, Symposium on Microstructural Evolution
(Indianapolis, May 1998)
17. Raj, P. M., Cosandey, F., and Cannon, W. R., “Particle orientation and texture formation in tape
cast ceramic materials”, 12th International conference on textures of materials, ICOTOM 12,,
Montreal, Canada, June 1997
18. Raj, P. M. and Cannon, W. R., “2-D Sintering of Oriented Ellipses by Grain Boundary and
Surface Diffusion - A Numerical Study of the Shrinkage Anisotropy”, Sintering '99, The second
international conference on the science, technology and applications of sintering, Nov., 1999
19. Raj, P. M. and Cannon, W. R., “Texture determination of ceramic materials by EBSD”,
Symposium on Automated Diffraction in SEM: EBSD and its applications; Microscopy and
Microanalysis Meeting, Portland, Oregon, August, 1999
20. Raj, P. M. and Cannon, W. R., “Anisotropic shrinkage in tape cast ceramics”, Symposium on
Mulitilayered and Graded Composites and Structures, Pacific Coast Regional, Basic Science
Division and Electronics Division, Meeting of the American Ceramic Society, October 27-29,
Bellevue, Washington, 1999

Reviewer for several journals, some of which are listed here:

1. Material Chemistry and Physics

2. IEEE Transactions on Electronic Devices
3. Journal of inorganic and organometallic materials and polymer
4. ACS Applied Materials and Interfaces
5. IEEE Components, Packaging and Manufacturing Technology Transactions;
6. ASME Journal of Electronic Packaging
7. Journal of Materials Science D – Materials in Electronics
8. Philosophical magazine and philosophical magazine letters
9. Materials, Multidisciplinary Publishing Institute
10. Journal of Alloys and Compounds
11. Microelectronics Engineering
12. Electrochemical and Solid State Letters
13. American Ceramic Society
14. European Ceramic Society,
15. Powder Technology
16. Materials Research Bulletin