Technical Data TD

X-Ray Flat Panel Imager

FDX4343R
Active Area:
430(H)×439(V)mm (16.9″ ×17.3″ )

FEATURING:
● High MTF
● High Sensitivity
● High Contrast
● Short Cycle Time

– Connect X-ray Image Intensifier with the equipment of class Ⅰ –

– High Resolution and High DQE CsI Phosphor Screen –

• TETD has long experience to develop and manufacture fine and thick pillar structure of CsI
phosphor screen with high resolution and high sensitivity.

– Low Noise ROIC and Analog Circuit –

• ROIC and analog circuit are designed and specified to be suitable for high sensitivity X-ray
conversion layer.

★ The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA ELECTRON TUBES & DEVICES CO., LTD. (TETD) for any infringements of patents or other rights of the
third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TETD or others.
★ The information contained herein may be changed without prior notice. It is therefore advisable to contact TETD before proceeding with the design of
equipment incorporating this product.

No.TE-FDX4343R 2009-10-08
FDX4343R

COMPONENTS AND CHARACTERISTICS

Flat Panel Sensor Unit:

Sensor Protection Plate................................................................................. Carbon Fiber Plate
Cooling .......................................................................................................... Natural Air Cooling
Input ................................................................................. DC 24V (from AC/DC Power Supply)
Power Consumption ............................................................................................ Maximum 20W
Overall Dimensions ..................................................... 512 x 495 x 43 mm (W（H） x D (V) x H )
Weight ................................................................................................................................. 17 kg

Power Supply Unit:

Input ................................................................................................... AC 100 to 240V, 50/60Hz
Output............................................................................................................ DC 24V 1.3A 60W
Overall Dimensions .......................................................... 126 x 200 x 60mm (W(H) x D(V) x H)
Weight ................................................................................................................... 1 kg (approx.)

Dimensional Outline:
Refer to pages 18 to 20.

ACCESSORIES

Cables:
AC Cable ........................................................................ 1.8 m x 1（with 90°angle connector）
DC Cable ........................................................................... 2 m x 1（with 90°angle connector）
(Power Supply Unit -> Sensor Unit)
GND cable....................................................................................................................... 3 m x 2

Environmental
Under delivery and stock Under operating
Temperature -15 ～ 55 ℃ +10 ～ 35 ℃
10 ～ 90 % 30 ～ 85 %
Humidity
(Non-Condensing) (Non-Condensing)
Pressure 50 ～ 106 kPa 70 ～ 106 kPa

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 FDX4343R

MAIN CHARACTERISTICS

Image Format:
X-ray Conversion Layer............ Cesium Iodide (Csl) with Amorphous Silicon (a-Si) Photodiode
Active Area ....................................................................... 430(H)×439(V)mm (16.9 x 17.3 inch)
Pixel Matrix...................................................................................................... 3008(H)×3072(V)
Pixel Pitch..................................................................................................................... 143 μ m
Cycle Time .................................................................................................... Shot to Shot 6sec.

Performance:
Limiting Resolution ............................................................................................... 3.5 lp/mm typ.
MTF (2.0 lp/mm, 70 kVp, 1x1) ..................................................................................... 30 % Typ.
DQE (0), Quantum - Limited･ ........................................................................................... > 70 %
A/D Conversion .................................................................................................................. 14 bit

Ratings:
Energy Range ........................................................................................................ 40 - 150 kVp
Maximum Entrance Dose (low Gain)...................................................................... 4 mR / frame

Interface:
Data Output .......................................................... 16 bit Digital Output Ethernet (1000BASE-T)
Command Control .................................................................................･Ethernet (1000BASE-T)
X-ray Synchronization Control........................................................................................ External
Power Input ........................................................ DC 24V 2A (from Power Supply Unit (Option))

Image Acquisition Mode Table

Frame rate
Mode Binning/non-Binning X-ray period (ms)
(Frame/s)
Standard: 500
3072 lines
1(approx) Non-binning (Variable between 50 to 500）
Full Scan mode
Optional: 2300, 3200 or 4000

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FDX4343R

Product Components and Interface

Detector DC24V ACDC

Power
Control Board Supply

Image Data
&Control
PC (User)
Ethernet

X-ray Sync X-ray

Control Unit (User)

Gate Driver ROIC Unit

TFT Panel

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 FDX4343R

Image Acquisition Communication Block Diagram

Ethernet
PC Connector FPI
Command Ethernet
module

CPU

Signal
IO module

D-SUB
Connector
X-ray Controller

Communication Availability

Ethernet Command Control D-SUB Signal Control

Signal Name Type
(PC) (X-Ray Controller)
EXP_REQ INPUT OK OK
EXP_OK OUTPUT N.A OK
READ_OK OUTPUT ＊EXP_REQ OK Command Response OK

＊EXP_REQ Command Response

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FDX4343R

Image Acquisition Control Interface

D-SUB Signal Control Interface Operation Sequence
B C D
FPI Drive Ref Ref Ref Exposure Read Ref Ref Ref Ref Ref
#1 #1
③ ②
①
A

EXP_REQ <IN>
C
EXP_OK <OUT>

EXPOSURE

DATA_STORAGE Data
#1
F

READ_OK <OUT>

POWER ON

A: EXP_REQ width
Minimum 1ms
B: Refresh period
For line drive (3072 Line scan), 36.9ms
C: EXP period
Set value: see the Image Acquisition mode table (5 to 500ms & 4000ms, Standard 500ms)
When you want to change EXP period, put in some period Command
D: Read period
For line drive (3072 Line Scan) 1222ms
E: READ_OK
Active High (Low: EXP_REQ to Data storage)
①：EXP_REQ－EXPOSURE_OK period Maximum 40ms
②：EXP_REQ－DATA STORAGE period Maximum 2,000ms(In case of EXPOSURE
500ms)
③：POWER ON－EXP_REQ period Minimum 30s

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 FDX4343R

Image Acquisition Control Interface

Ethernet Interface Command Control Operation Sequence

FPI Drive Ref Ref Ref Exposure Read Ref Ref Ref Ref Ref
#1 #1
③ ②
①

EXP_REQ <IN>

EXP_OK <OUT>
（DSUB)

EXPOSURE

DATA_STORAGE Data
#1

READ_OK <OUT>

POWER ON

①：EXP_REQ－EXP_OK period Maximum 40ms

②：EXP_REQ－DATA STORAGE period Maximum 2,000ms (case EXPOSURE 500ms)
③：POWER ON－EXP_REQ period Minimum 520ms

Description of the sequence

■ By receiving “EXP_REQ” during “Refresh” status, proceeds to “Exposure” after completion
of “Refresh”.
■ Continues “EXP_OK” signal ON during “Exposure”. ON period is defined by Image
Acquisition mode table.
■ Proceeds to “Data Read” after completion of Exposure.
■ After “Read”, FPI proceeds to status of “Refresh”.
■ As in D-sub ,After “Data Storage”, “READ_OK” remains ON until next “EXP_REQ” signal
comes in.

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FDX4343R

Image Acquisition Control Interface

- Pins assign

Pin No Signal name I/O Contents

1 TEST+ - Don’t connect. This pin is used for TEST.
Image acquisition (X-ray exposure)
2 EXP_REQ+ Input
Request signal +
Image acquisition (X-ray exposure)
3 EXP_OK+ Output
Period signal +
4 READ_OK+ Output Read-out OK signal+
5 NC - Not connected
6 TEST- - Don’t connect. This pin is used for TEST.
Image acquisition (X-ray irradiation)
7 EXP_REQ- Input
Request signal +
Image acquisition (X-ray irradiation)
8 EXP_OK- Output
Period signal +
9 READ_OK- Output Read-out OK signal -

Power Supply Connector

- Pins assign

Pin No Signal name I/O Contents

1 DC INPUT + Input DC 24V Positive Voltage Input
2 DC INPUT + Input DC 24V Positive Voltage Input
3 DC INPUT - Input DC 24V Negative Voltage Input
4 DC INPUT- Input DC 24V Negative Voltage Input
5 FG - Frame Ground

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 FDX4343R

The information about EMC conformity (IEC60601-1-2 Ed2, 2001)

Guidance and manufacturer’s declaration - electromagnetic emissions
The X-ray Flat Panel Imager (hereafter called FPI) is intended for use in the electromagnetic
specified below.
The customer or the user of the FPI should assure that it is used in such an environment.
Emissions test Compliance Electromagnetic environment - guidance
RF emissions Group1 The FPI users RF energy only for its internal
function. Therefore, its RF emissions are very low
CISPR 11 and are not likely to cause any interference in
nearby electronic equipment.
RF emissions Group A The FPI is suitable for use in all establishments
other than domestic and those directly connected to
CISPR 11 the public low-voltage power supply network that
Harmonic emissions Not applicable supplies building sued for domestic purposes.

IEC61000-3-2
Voltage fluctuations/ Not applicable
flicker emissions

IEC61000-3-3
Note The FPI is not allowed to use the cables or components differ from
the originally attached.
If the different cables or components are used, they may deteriorate
the performance of electromagnetic emissions.

The limited length of cables for conforming EMC (IEC60601-1-2 Ed2, 2001)
Cables Cable length (Max.)
AC Cable 1.8m
DC Cable 2m
GND Cable 3m
Refer to pages 4 about wiring and connection of these cables.

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FDX4343R

Guidance and manufacturer’s declaration – electromagnetic immunity

The FPI is intended for use in the electromagnetic specified below.
The customer or the user of the FPI should assure that it is used in such an environment.
IEC60601 Electromagnetic environment -
Immunity test Compliance level
test level guidance
Electrostatic ±6kV contact ±6kV contact Floors should be wood, concrete
discharge (ESD) ±2/4kV contact ±2/4kV contact or ceramic tile. If floors are
covered with synthetic material.
IEC61000-4-2 ±8kV air ±8kV air The relative humidity should be at
±2/4kV air ±2/4 kV air least 30 %.
Electrical fast ±2 kV for power ±2kV for power Mains power quality should be that
transient／burst supply lines supply lines of a typical commercial or hospital
environment.
IEC61000-4-4 ±1kV for input/ ±1kV for input/
output lines output lines
Surge ±1kV differential ±1kV differential Mains power quality should be that
mode mode of a typical hospital environment.
IEC61000-4-5 ±0.5kV differential ±0.5kV differential
mode mode

±2kV common ±2kV common

mode mode
Voltage dips, short ＜5 % UT ＜5 % UT Mains power quality should be that
interruptions and (＞95 % dip in, UT) (＞95 % dip in, UT) of a typical hospital environment. If
voltage variations for 5 sec for 5 sec the user of the FPI requires
on power supply continued operation during power
input lines mains interruptions, it is
recommended that the FPI be
IEC61000-4-11 powered from an uninterruptible
power supply or a battery.
Power frequency 3A/m 3A/m Power frequency magnetic fields
(50/60Hz) should be at levels characteristic
magnetic field of a typical location in atypical
commercial or hospital
IEC61000-4-8 environment.
Note:
(1) UT is the a .c.mains voltage prior to application of the test level.
(2) This angiography X-ray system can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
recommended separation distance between portable and mobile RF communications
equipment and this system.

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 FDX4343R

Guidance and manufacturer’s declaration – electromagnetic immunity

The FPI is intended for use in the electromagnetic environment specified below. The customer or the
user of the FPI should assure that it is used such an environment.
IEC 60601 Compliance Electromagnetic environment –
Immunity test
test level level guidance
Portable and mobile RF communications
equipment should be used no closer to any
part of the FPI, including cables, than the
recommended separation distance
calculated from the equation applicable to
the frequency of the transmitter.

Recommended separation distance

Conducted RF 3 Vrms 3 Vrms d = 1.2 P 150kHz to 80MHz

IEC61000-4-6 150 kHz to 80 MHz d = 1.2 P 80 MHz to 800 MHz

Radiated RF 3 V/m 3 V/m

d = 2.3 P 800 MHz to 2.5 GHz
IEC61000-4-3 80 MHz to 2.5 GHz Where P is the maximum output power
rating of the transmitter in watts (W)
according to the transmitter manufacturer
and d is the recommended separation
distance in meters (m).

Field strengths from fixed RF transmitters,

as determined by an electromagnetic site
surveya, should be less than the compliance
level in each frequency rangeb.

Interference may occur in the vicinity of

equipment marked with the following
symbol:

Note:
(1) At 80 MHz and 800 MHz, the higher frequency range applies.
(2) These guidelines may not apply in all situations. Electromagnetic propagation is affected by
absorption and reflection from structures, object and people.
(3) This angiography X-ray system can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
electromagnetic immunity.
a
Field strengths from fixed transmitters, such as base stations for radio (cellular/cordless) telephones
and land mobile radios. Amateur radio, AM and FM radio broadcast and TV broadcast cannot be
predicted theoretically with accuracy. To assess the electromagnetic environment due to fixed RF
transmitters, an electromagnetic site survey should be considered. If the measured field strength in
the location in which the FPI is used exceeds the applicable RF compliance level above, the FPI
should be observed to verify normal operation. If abnormal performance is observed, additional
measures may be necessary, such as reorienting or relocating the FPI .
b
Over the frequency range 150 kHz to 80 MHz, field strengths should be less than 3V/m.

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FDX4343R

Recommended separation distances between portable and mobile RF communications equipment

and the FPI.
The FPI is intended for use in an electromagnetic environment in which radiated RF disturbances are
controlled. The customer or the user of the FPI can help prevent electromagnetic interference by
maintaining a minimum distance between portable and mobile RF communication equipment
(transmitters) and the FPI as recommended below, according to the maximum output power of the
communications equipment.
Separation distance according to frequency of transmitter
Rated maximum m
output power of 150 kHz to 80 MHz 80 MHz to 800 MHz 800 MHz to 2.5 GHz
transmitter
d = 1 .2 P d = 1 .2 P d = 2.3 P
W
0.01 0.12 0.12 0.23
0.1 0.38 0.38 0.73
1 1.2 1.2 2.3
10 3.8 3.8 7.3
100 12 12 23
For transmitters rated at a maximum output power listed above, the recommended separation
distance d in meters (m) can be estimated using the equation applicable to the frequency of the
transmitter. Where P is the maximum output power rating of the transmitter in watts (W) according to
the transmitter manufacturer.

Note:
(1) At 80 MHz and 800 MHz, the separation distance for the higher frequency range applies.
(2) These guidelines may not apply in all situations. Electromagnetic propagation is affected by
absorption by absorption and reflection from structures objects and people.
(3) The FPI can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
recommended separation distance between portable and mobile RF communications equipment
and this system.

CAUTION

CAUTION
DO NOT USE THE ELECTROMAGNETIC DEVICE, SUCH AS (CELLULAR/CORDLESS)
TELEPHONES AND RADIO CONTROLLED TOYS, CLOSE TO THIS SYSTEM. OTHERWISE,
IT MAY CAUSE MALFUNCTION OF THE SYSTEM.

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 FDX4343R

INSTALLATION

For installing the FPI in the apparatus, refer to the dimensional outlines.

INSTALLING HOUSING IN APPARATUS:

Use the screw holes 16-M4 (Depth 8).
The screws should be fixed all screw holes of each part. Also, the screw thread length entering
the screw holes should be each depth of holes.
Installation respect of the device that installs FPI should be smooth.
It is necessary to clean installation respect of the device before FPI is installed.
Tightening torque of screw; 1.35 - 1.65 [Nm]

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FDX4343R

SAFETY PRECAUTIONS AND WARNING

Find this document before using X-ray Flat Panel Imager (FPI)

This document describes the attention of equipment manufactures and users to use safety X-ray Flat
Panel Imager (hereafter called FPI). Please find the technical data sheet of each product and this
document “SAFETY PRECAUTIONS AND WARNING” and understand these contents before using
X-ray Flat Panel Imager. The X-ray Flat Panel imager is used under X-ray exposures. Therefore
engineers or service people who have sufficient technical knowledge and experience shall handle the
X-ray Flat Panel Imager with enough care. Moreover these documents are always stored and can be
seen in operating place. If you have any questions, please contact our local sales representatives for
further information.
The X-ray Flat Panel imager present a certain number of potential risks by the very nature of the
physical principles included in their manufacture or operation and because of the materials used to
make X-ray Flat Panel Imager. Therefore equipment manufactures and users shall take on themselves
the responsibility because of protecting against these risk and respecting local safety laws and
regulations.

1. Electric Shock
In operating, do not touch the lead wires and connectors of the X-ray Flat Panel imager (FPI). If
necessary to touch lead wires and connectors, please turn off the power supply and confirm no
residual voltage exist before connecting, disconnecting and handling them. The housing of the FPI
should always be connected to ground. All ground terminals and ground wires shall be also done to
ground.

2. Ground Connection
Connect all ground terminals and cables of the FPI to ground. The housing with ground terminal
should be connected to ground. The resistance between ground terminal and ground cables shall be
less than 0.1 ohms. The sectional area of the conductor is required for 0.75 square meters or more.

3. Stop Operation During Abnormal Status

Shut down power supply and contact to sales representatives immediately when the FPI stops
operation during abnormal status.

4. Remodeling Electronics Parts

Do not reconstruct FPI electronics parts because it leads to deterioration of images and the cause of
malfunctions.

5. Processing of Housing
Do not process FPI housing because it leads to weakness of housing strength and the cause of
malfunctions.

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 FDX4343R

6. Screws of Housing
As the screws of FPI housing are tightened by proper torque, do not loosen or remove them.

7. Installing to the Equipment

Installing FPI housing to the equipment by according to the technical data sheet or the specification.
It will prevent dropping off of FPI from the equipment.

8. Shipping and Handling

The weight of FPI is mentioned at technical data sheet or the specification. Please take into account
on this weight for preventing any dangers during usage.

9. Unnecessary X-ray, Qualified Personnel

The FPI is used combined with x-ray tube assembly. Only Qualified personnel for x-ray handling
procedures can use the FPI.
For set-ups and services, only knowleged enigineers or special service personnels are able to handle
the FPI.

10. Stop Operation

A limited operating life and the possibility of random failures are inherent to FPI and shall be taken
into account for the protection of personnel and equipment. The operation of FPI under inappropriate
conditions, either due to the lack of care or knowledge, can lead to grave risk to the life and limb of
personnel, independent of the risk of FPI and/or equipment damage.

11. Contact to Patient

The FPI is not for equip to the patients. Install the FPI not to contact or touch the patients.

12. Installation
Be sure to install the FPI not to touch the patients during operation.
Combine FPI synchronized with main power supply of the equipment.
Provide the power supply for FPI from the equipment side.

13. Mechanical Shock and Vibration

Do not give a mechanical shock or vibration to the FPI housing. It may cause the malfunction of FPI
due to break down of TFT panel.
Do not use FPI in car, bus and/or truck. FPI is not designed to be used in such applications.

14. Protection of Input Plate

The FPI input plate consists of a thin carbon plate (CFRP). Therefore it shall never receive shock or
pressure. Do not let patients to touch FPI input plate directly.

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FDX4343R

15. Environmental Temperature, Humidity and Atmosphere (Electromagnetic waves)

The specified temperature and humidity in operating and storage are described at the technical data
sheet and the specification. Moreover, X-ray Flat Panel Imager shall not experience large and fast
temperature and humidity change. Do not use and set the X-ray Flat Panel Imager in an atmosphere
of inflammable and/or corrosion gasses.
Do not install FPI at around any electromagnetic wave noise sources.

16. Condensation
Do not let FPI in condensation situation at any time. It may cause malfunctions of electronics circuit
and deerioration of images.

17. Ingress of Liquid

Do not splash the FPI with any liquid. Occasionally that is a cause of damage.
Wipe of once when it get wet.

18. Dust and Particles

Do not use FPI in the environment where dust and particles exist. This will lead to deteriorate
performance or stop operation of cooling fans (if attached). Also deterioration of cooling performance
occurs due to narrowing ventilation area by dust and particles.
Keep FPI clean by implementing cleaning.

19. Power Supply

(1) Use the power supply attached to FPI.
(2) Do not remodel the power supply. Use the power supply as delivered.

20. Adjustment
The FPI requires adjustment (ex. Gain and image processing calibrations) according to input x-ray
conditions. Be sure to start using the FPI with equipment after adjustment. In the case of exchanging
x-ray tube assembly or change of x-ray intensity distribution, adjustment of the FPI is necessary.

21. Memory
The FPI contains memory chips. Be sure to take backups of memory considering in the case of
memory loss.

22. Environment Temperature

The FPI is equipped with cooling fans. Be sure to use the FPI under specified temperature conditions.
This is in order to prevent deterioration of FPI characteristics and the cause of malfunctions due to
lowering cooling availability.

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 FDX4343R

23. Temperature Sensor

The FPI is equipped with temperature sensor. Alarm appears when it detects abnormal internal
temperature. Stop operating FPI when it appears then check surrounding temperature and cooling
fan operation.

24. Cables
Users must use cables attached with the FPI.
Be sure to connect correctly and do not loosen cables.

25. Ethernet
Cross type Ethernet cable must be used. Also, do not connect Ethernet cable to common networks,
must be directly connected to PC.

26. Fuses
Fuses are installed inside of power supply unit. Stop immediately using the FPI when fuse breaks.
Use same rating fuse when exchange broken one.

27. Defects
It is natural due to characteristics of TFT that the FPI has defects. Please calibrates/corrects defects
upon usage of FPI. Defects can be corrected by using defect maps.

28. Vibration Noise

Do not apply vibration noise during operation. It may becomes the cause of image deterioration or
noise.

29. Service/Maintenance
Service / Maintenance should be carried out periodically according to the technical data sheet or the
specification sheets.

30. Shipment
FPI should be removed from equipment then put into polyethylene-type bag and pack in TETD
packing box to be protected. Keep FPI input plate faced upwards during shipment.

31. Scrap
FPI has lead plate for the prevention of the X-ray leakage. The lead powder or vapor is harmful for
human health. Dispose the scrapped products according to the requirement of local regulation.
If you have any questions, please contact to our local sales representatives for further information.

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FDX4343R

CAUTION LABELS

This label is a caution label to notify the user of the following point.
"This contents are quite important for safety"
Attachment position: Housing

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 FDX4343R

DEFINITION SYMBOL MARKS

(1) CE MARKING OF CONFORMITY

(2) SERIAL NUMBER

(3) MANUFACTURE

(4) DATE OF MANUFACTURE

(5) AUTHORISED REPRESENTTATIVE IN THE EUROPEAN COMMUNITY

(6) PROTECTIVE EARTH

(7) EARTH

(8) ATTENTION, CONSULT ACCOMPANYING DOCUMENTS

(9) TYPE B APPLIED PART

(10) UL MARKING OF CONFORMITY

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 FDX4343R

DIMENSIONAL OUTLINE
(Flat Panel Sensor Unit)
Unit : mm

５１２
４９５ ５０１

４３

Power
Supply Connector

ＬＡＮ
Connector
ＬＥＤ
Ｄｓｕｂ （Display for Mode）
Connector

Wired Image

５３２

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 FDX4343R

DIMENSIONAL OUTLINE
(Flat Panel Sensor Unit)
Unit : mm

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FDX4343R

DIMENSIONAL OUTLINE
(Power Supply Unit)

Unit : mm

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 FDX4343R

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FDX4343R

OVERSEAS SUBSIDIARIES AND AFFILIATES

EU REPRESENTATIVE

・TOSHIBA ELECTRONICS EUROPE GMBH

HANSAALLEE 181 40549 DÜSSELDORF, GERMANY
PHONE (211) 5296 107 FAX (211) 5296 402

For Sales & Technical Services, please contact the following representative:

・TOSHIBA ELECTRONICS EUROPE GMBH

HANSAALLEE 181 40549 DÜSSELDORF, GERMANY
PHONE (211) 5296 107 FAX (211) 5296 402

・TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.

2150 EAST LAKE COOK ROAD, SUITE 310 BUFFALO GROVE,
ILLINOIS 60089 U.S.A
PHONE (847) 484-2400 FAX (847) 541-7287

・TOSHIBA ELECTRON DEVICES & MATERIALS (SHANGHAI) CO., LTD. (TEMS)

RM1606, SH-PLAZA,
No.336, XIZANG ROAD (MIDDLE), SHANGHAI, 200001,CHINA
PHONE (21) 6361-0077 FAX (21) 6351-5760

Sales & Marketing Department

1385 SHIMOISHIGAMI, OTAWARA-SHI, TOCHIGI, 324-8550,JAPAN
PHONE : +81-287-26-6666 FAX : +81-287-26-6060
http://www.toshiba-tetd.co.jp/

ISO 14001