Optimizing Dimension of Heat Sinks Plate db461907
Optimizing Dimension of Heat Sinks Plate db461907
Optimizing Dimension of Heat Sinks Plate db461907
2018 19
Abstract - Nowadays, heat dissipation for electronic chips, T: The absolute temperature of the object (K).
microprocessors in electrical and electronic equipment, especially
in Site Router telecommunication equipment when operating at ΔT = T1-T2: The difference in wall thickness (K).
high intensity is an urgent process to increase life expectancy,
Tw: Average temperature of the object (K,0C).
productivity and performance. Many telecom providers such as
Huawei, Ericsson, Cisco etc have offered solutions for liquid Tf: Average temperature of the gas or liquid (K,0C).
cooling, cold air, heat pipes. However, the complexity, the cost and
the effect are not high. Furthermore, there is shortage in optimal T0=291,15: Standard temperature of air (K).
parameters of design and operation [1-5]. Derived from the above T0=273+55: Absolute temperature environment (K).
fact, the author has calculated and modeled a Site Router
equipment using extruded blast heat exchanger with a large heat t: Thickness of fin.
exchanger structure which withstands pressure when falling, tb: Thickness of base.
combining airflow from fans to speed up the dissipation of heat. In
this paper, the author presents the optimal calculation and control W: Width of heatsink.
process of the size of the heat sink and the contact plate under the
influence of actual operation conditions at the specified velocity of 2. Introduction
the air flow from which the model is built directly to determine the
number and the size of the heat sink’s plate fins. Today's thermal technology evolves from material to
heat dissipation for liquid, nitrogen, gas or heatpipe
Key words - Airflow; cooling process; heat dissipation; optimal
control; SiteRouter equipment. applications such as "Laser-cooling Brings Large Object
Near Absolute Zero" by Hänsch and Schawlow [7].
1. Nomanclature The variety of solutions offers great efficiency for
A: Surface area in m2. devices that require large amounts of heat dissipation.
Ac: Cross-sectional area in m2. However, the complex structure and the need for external
power sources such as heat pumps have increased costs and
Af = H.W: Total frontal area of heatsink. are difficult to implement for limited-sized devices such as
Ap: Fin profile area. SiteRouter. One of the studies: "Design and Optimization
α: The convective heat transfer coefficient depends on of Horizontally-Finished Plate HeatSink for High Power
a number of parameters determined by experiment LED street lamps" by Xiaobing Luo and Wei Xiong [6]
(W/m2.K). launched in 2009 has reduced the complexity of liquid-
b: Fin spacing in m. liquid heat sinks as well as the use of extruded extruded
heatsinks to optimize heat dissipation.The study has
C=120: Sutherland's constant for air. created the premise for the placement of heatsinks in
F: surface area of heat exchanger (m2). telecommunication equipment with optimal size compact.
H: Fin height in m. However, the new study stops at passive heat dissipation
k= 209: Thermal conductivity of Al6063-T5 (W/m.K). through radiation and convection without impact from
wind flow.
θb: Temperature excess = Tb- T0(K,0C).
Based on the research on extruded bladed heat
λ: Thermal conductivity of the material (W/m.K). exchanger, the team combined the airflow through the
L: Fin length in m. layout solution of the blower in the SiteRouter, calculating
μ: Dynamic viscosity at input temperature T0. the fin height adjustment and the distance between the fins.
heat dissipation to reduce the heat at specified values of
μ0= 18,27x10-6 Viscosity reference at standard
wind speed, increase the ability to dissipate heat to the
temperature T0.
environment. The obtained results are achieved through
W −t using NLP solve optimization function on Maple for the
N= +1
b+t : Number of fins. heat dissipation of Site Router’s Mathematic model [8].
Qx: X- axis heat transfer for 1 second (W). 3. Method
Q: Heat dissipates in a second of the object (W). SiteRouter equipment is modeled by using built-in fan
qx: The density of the heat transfer current in the housings on the air flow bushes directly into the extruded-
direction x (W/m2). fins heatsink. At fixed velocities of 1 m/s, 5 m/s the authors
Rɵ: Thermal resistance (K/W). calculate the thickness of profiles of the fins as well as the
distance between the adjacent fins from which the number
Rsink: Thermal resistance of heatsink. of heat sink flutes is matched for the highest heat
Rfin: Thermal resistance of each fin. dissipation effect
20 Viet Dang-Thai, Thong Dinh-Sy
3.1. Thermal conductivity 3.2. Convection
Thermal conductivity occurs due to the difference in
temperature between regions in a solid or between two
solid objects in contact. General heat conduction [4, 5] is:
T Q T
Q x = − F ( W ) → qx = x = − ( W / m2 ) (1)
x F x
in case of flat wall (application of heat dissipation Figure 3. Convection process
calculation)
T T
Q = F = (W) → R = (K/ W, 0 C/ W) (2)
R F
with λ: Thermal conductivity of the material (W/m.K).
Diamonds, silver and copper have very good thermal
conductivity (see table 1). However, most manufacturers Figure 4. Thermodynamic model
use aluminum as their primary material. The main reason Convection is the process of heat exchange that occurs
is that aluminum is available, cheap and easy to make. when a surface of a solid comes into the contact with a
Besides, another important factor affecting the heat liquid or gaseous environment at different temperatures.
dissipation quality is the ability to radiate (Copper is able To calculate the heat in the convection process we use
to emit less heat than aluminum). the Newton formula as follows:
In this paper, the main purpose is to analyze geometric Tw − T f
parameters of heatsinks and based on the thermal Q = F (Tw − T f ) = ( W)
conductivity and manufacturing capability. The author R (3)
1
uses the Al 6063-T5 aluminum for the heatsink of → R =
(K/ W, 0 C/ W)
SiteRouter equipment. F
3.3. Influence of geometric parameters of heat
dissipation to heat dissipation
Figure 2. Heat conduction through flat wall and equivalent heat While b
= Q.Rsink (5)
Table 1. Table of thermal conductivity of 2
S gen 2
T 0 T 0
=
1
+
t b
(7)
R sink
) + h(N − 1) bL
(N/ R fin
kLW
2 c e includes: b, t, tb.
(1 2)
app
V ch
b b
fReDh = 24 − 32.527() + 46.721( ) 2 (14) Solve = [2.26046585938925793, b=0.00545000000000002,
H H t=0,000779266948589301]
b 3 b 4 b
−40.829( ) + 22.954( ) − 6.089( ) 5
H H H
2
2 Nt
) and K e = (1 − (1− ) )
N .t 2
Kc = 0.42(1 − (1− ) (15)
W W
The equation of heat transfer coefficient:
−1/3
−3
−3
Reb* Pr
Nub = + 0.664 Reb .Pr
* 1/3
1+
3.65
*
2 Re
b
(16)
b Figure 6. The graph shows the relationship between Rsink heat
Re b * = Re b (17)
L dissipation with fin’s thickness t at wind speed of 1 m/s.
S gen
=0 (21)
x
Ṡgen = Ṡgen (L, H, t b , W, b, t … ) = Ṡgen (x1 , x2 , x3 , … )
→ min
22 Viet Dang-Thai, Thong Dinh-Sy
0
b) N=8, ambient temperature 55 C, the highest heat The following optimal number of heat sink’s fin
gain on the heat sink 93,7176 0C. optimizes t parameters:
−3
W −t 60.10 − 0, 00137
N= +1 = −3
= 8( fins )
b+t 7.10 + 0, 00137
Number of fins is a positive integer, so in the low
velocity range from 1 ÷ 10 m/s the number of fins changing
10 ÷ 8 fins does not clearly show the change of temperature
when the velocity adjustment amplitude is small.
Therefore, based on the calculation of the thickness of
the fin, we compare the temperature when the fins have
different thicknesses.
a) t= 0.8 mm, ambient temperature 550C, the highest
c) Optimized parameters N=10, ambient temperature heat gain on the heatsink 71,60410C.
55 0C, the highest heat gain on the heat sink 90,1244 0C.
(The Board of Editors received the paper on 09/7/2018, its review was completed on 04/9/2018)