Journal Pre-proofs

Mixed convective heat transfer with surface radiation in a rectangular channel

with heat sources in presence of heat spreader

SK Mandal, Arnab Deb, Dipak Sen

PII: S2451-9049(19)30110-6
DOI: https://doi.org/10.1016/j.tsep.2019.100423
Reference: TSEP 100423

To appear in: Thermal Science and Engineering Progress

Received Date: 11 March 2019

Revised Date: 22 September 2019
Accepted Date: 22 September 2019

Please cite this article as: S. Mandal, A. Deb, D. Sen, Mixed convective heat transfer with surface radiation in a
rectangular channel with heat sources in presence of heat spreader, Thermal Science and Engineering Progress
(2019), doi: https://doi.org/10.1016/j.tsep.2019.100423

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© 2019 Published by Elsevier Ltd.

Mixed convective heat transfer with surface radiation in a rectangular channel with heat sources in
presence of heat spreader

S K Mandal, Arnab Deb and Dipak Sen*

Department of Mechanical Engineering, National Institute of Technology Arunachal Pradesh, Yupia-
791112, India
*Corresponding author e-mail: [email protected]

Abstract

A computational study of mixed convective heat transfer with surface radiation in a rectangular channel
with heat spreader attached to each heat source is performed. The working fluid is air and flow is steady,
incompressible and laminar. The parameters like thickness of the substrate and heat spreader, heat source
and channel width and the distance between the heat sources are fixed. The governing equations are
solved using ANSYS 16.2 with SIMPLE algorithm. The influence of Reynolds number (Re = 100, 250,
500, and 750), emissivity of the heat source (εc = 0.1 to 0.9), heat spreader (εsp = 0.1 to 0.9) and channel
wall (εs = 0.1 to 0.9) on the rate of heat transfer is studied. It is revealed that the non-dimensional
maximum temperature (θm) decreases 11.53% at reference values with respect to without spreader case
due to insertion of heat spreader. It is also observed that emissivity of the heat source is insignificant
compared to emissivity of heat spreader and channel wall.

Keywords: Mixed convective heat transfer; surface radiation; rectangular channel; heat spreader.

Nomenclature

Ek Emissive power of surface k

Fjk View factor from jth element to the kth element of an enclosure

h Height of the heat source, (m)

H Width of the channel, (m)

Jj Radiosity of surface j

Jk Radiosity of surface k

k Thermal conductivity, (W/m-K)

Δ𝑇𝑟𝑒𝑓 Reference temperature difference

w Heat source width, (m)

Ws Heat spreader width, (m)

θ Non-dimensional temperature

θm Non-dimensional maximum temperature

ε Emissivity
Subscript

c Heat source

sp Heat spreader

s Channel wall (substrate)

f Fluid

1. Introduction
The reliability of electronic chip is a key importance for overall reliability of a device. The high
temperature of the chip has a considerable influence on a device. As temperature increases, performance
of the chip decreases and same time failure rate increases. So, the excess amount of heat has to be
removed from the chip to enhance the reliability of the system.
Smith et al. [1] have examined the influences of surface radiation with conjugate free convection
considering various sizes of chips mounted on a PCB. A thorough parametric investigation is conducted
for diverse thermophysical properties like wall conductivities, heat sources conductivities, wall emissivity
and emissivity of heat source.Thermo-fluidic behaviour under free convective heat transfer with surface
radiation is analyzed considering various geometries such as enclosure and cavities in presence of a heater
in case of laminar and turbulent flow by several researchers.[2-8]
A numerical study is conducted on forced convective heat transfer from protruding heat sources in a
series of parallel plates by Kim and Anand [9]. Balaji and Venkateshan [10] have conducted an
investigation on conjugate natural convection with surface radiation in a vertical cavity considering
conducting walls and isothermal bottom wall. A detailed investigation has been conducted on forced
convective heat transfer with heat sources in a channel by Young and Vafai [11]. Combined free-forced
convective heat transfer with surface radiation in presence of heat source in a vertical channel is
numerically investigated by Rao et al. [12].Conjugate convection and radiation from protruding heat
sources in a horizontal as well as vertical conduit is studied by Premachandran & Balaji [13,14]. The
influence of Re, Gr, heat source and substrate emissivity are demonstrated. A correlation is generated for
maximum non-dimensional temperature. A computational study is conducted of laminar mixed
convective heat transfer in a horizontal channel with heat sources by Hamouche & Bessaih [15]. The
effects of separation distance, height and width of the heat source on heat transfer are reported. Durgam et
al. [16] have examined the mixed convective heat transfer in a horizontal channel and optimized the heat
source array distribution. Mixed convective heat transfer on optimal arrangement of IC chips mounted on
a SMPS board has numerically studied by Mathew and Hotta [17]. The best possible arrangement of IC
chips is reported. Sharper et al. [18] have studied natural convective heat transfer in a vertical channel
with discrete heat source and discussed about the influence of the blockage ratio of discrete heat sources.
To improve the rate of heat transfer, a vortex generator may be used which generates a secondary flow.
Different types of vortex generators are used in diverse geometries like circular, non- circular channels in
micro-mini-macro channels in case of laminar and turbulent flow by several researchers [19-27].
The performance of cooling of heat spreading layers is proved to be a reasonable way of reducing peak
working temperatures in integrated power electronic applications. Heat spreader doesn’t have any fins; it
is a large plane surface on top, which creates an additional surface area like extended surface. They do not
cool the central processing unit by themselves; it only transfers heat to one more object where it can
securely disperse away from the central processing unit. Maranzana et al. [28] have studied the design
optimization of heat spreaders in electronic chip cooling. The optimal location, thickness and shape of
the heat spreaders are reported. Feng and Xu [29] have studied thermal characteristics in electronics chip
cooling with heat spreaders. The thermal behavior of composite layered structures with embedded heat
spreader in heat source of electronic applications has examined by Dirker and Meyer [30]. Amin et al.
[31] have investigated the thermal characteristics of the flip-chip heat spreaders. It is concluded that the
galvanic initiation technique is the best catalytic technique. Mjallal et al. [32] have considered various
types of phase change materials (PCM) for augmentation of the cooling efficiency of heat sinks.
Based on the literature survey, it is observed that a lot of investigations have been carried out on heat
spreaders to optimize the design specifications like shape, thickness, surface roughness, thermal
resistance. The thermal characteristics of heat spreader have also been reported. Most of the studies have
ignored the effect of the radiative heat transfer. However, radiation can also contribute some amount of
heat transfer. In this paper, a numerical investigation is conducted on mixed convective heat transfer with
surface radiation in a horizontal rectangular channel with heat spreader.

2. Physical model
A schematic diagram of a rectangular parallel plate channel with five identical protruding heat sources
along with heat spreader is presented in Fig. 1. Five protruding heat sources are mounted on the bottom
wall substrate of the channel. Fluid (air) has entered with a uniform temperature and velocity. At inlet, air
temperature is assumed to be 270C. Each heat source with a volumetric heat generating capacity of
100000 W/m3 is chosen in the present case.

Fig. 1. A schematic picture of the model

3. Governing Equations
The flow of fluid is considered as laminar, 2-D, steady and incompressible with constant fluid
properties. Since the assumed velocities are considered to be lower in magnitude, viscous dissipation is
negligible. Governing flow and energy equations are as follows:

Continuity equation
U V
 0 . (1)
X Y

Momentum equations

U U P 1   2U  2U 
.
U V    (2)
X Y X Re  X 2 Y 2 
 

V V P 1   2V  2V  Gr
U V      . (3)
X Y Y Re  X 2 Y 2  Re 2
 

Energy equation
   1   2  2 

U V   (4)
X Y Re Pr  X 2 Y 2 
 

Energy equation for the solid region

Channel walls

ks   2  2 
 2  0
kf  X Y 2  (5)

Heat spreader

k sp   2  2 
    0
k f  X 2 Y 2  (6)

Heat source

kc   2  2  H2
    0
 X Y 2
2
kf  Wh (7)

Radiation Modeling

In this present investigation, it is assumed that the interior surfaces are diffuse, opaque and gray. The
entrance and exit of the channel are supposed to be black at the ambient temperature. Air is assumed as a
non-participating media. The radiation heat flux and radiosity expression [18] given below.
n
qin, k  F
j 1
kj qout , j
(8)
n
J k  E k  k F
j 1
kj J j (9)

In order to complete the mathematical statement of the governing of fluid flow, boundary conditions
are to be specified. These boundary conditions are mentioned in the following section.

3.1. Boundary conditions

Boundary conditions of the problem are as follows:

At inlet

U  1, V  0,  0 (10)
At outlet

P  Patm , 0 (11)
X

At wall surfaces

U V  0 (12)
The couple boundary conditions are also used at wall to wall and wall to fluid interfaces as follows:

For heat Source and heat spreader

kc  
 ( )c   ( ) sp
k sp  Y Y
(13)
For heat source and substrate
kc  
 ( )c   ( )s
ks Y Y
(14)
For substrate and fluid interface
ks  
 ( )s  ( ) f  N RC q R
k f Y Y
(15)
For Heat source and fluid interface
kc  
 ( )c   ( ) f  N RC q R
k f Y Y
(16)
For heat spreader and fluid interface
k sp  
 ( ) sp   ( ) f  N RC q R
k f Y Y
(17)
4. Numerical approach
The finite volume method based software Ansys 16.2 is used to resolve the governing equations (Eq. 1-
4). The SIMPLE algorithm is employed with boundary conditions (Eq. 11-14). Table 1 shows the
variation of parameters that are used for the present investigation.

Table 1. Range of parameters

Parameters Values
H 0.025
L 0.360
Ws 0.02
hs 0.0025
Re 100, 250, 500, 750
εc 0.1-0.9
εsp 0.1-0.9
εs 0.1-0.9
𝑘𝑐 1.3
𝑘𝑠𝑝 387.6
𝑘𝑠 0.3

4.1. Grid independency test

The grid independency test is carried out for Re=250, heat generation rate (qv) = 100000 W/m3. A non-
uniform grid is used along with very fine grids in front of the heat source and spreader. Result of the
study is shown in Table 2. It is observed that by increasing the total number of nodes from 1,61,265 to
2,16,279, a change in the maximum non-dimensional temperature (θm) is only 0.89%. Hence, the node of
161265 is considered in further study for computational time limits.

Table 2. Grid independency test

% of
Sl. No. Nodes θm
change
1 69,687 0.16627 -----
2 1,00,941 0.15468 6.9%
3 1,61,265 0.14648 5.3%
4 2,16,279 0.14517 0.89%

4.2. Validation
To authenticate the present work, it is validated with the study of Premachandra and Balaji [13]
maintaining the identical test field and parameters. The difference in the result is lies less than 4%, which
is shown in Fig. 2. It represents that present work is quite good agreement with the literature.

Fig. 2. Comparison of present work with the literature (Premachandran and Balaji [13])

5. Results and discussion

The study has been carried out considering with and without heat spreader for various Reynolds
number (Re= 100, 250, 500, and 750) to create sufficient data of non-dimensional maximum temperature
(θm). An isotropic conduction is considered in the channel walls and the heat spreaders. The geometric
parameters considered for the present study are L1=2H, L2=8H, d=w, h=0.4H and Ws=0.8H. Influence of
four important parameters such as Re, emissivity of heat source (εc), emissivity of heat spreader (εsp) and
emissivity of channel walls (εs) have been studied separately. The following set of thermal parameters is
considered as baseline case: Re=250, εc=0.5, εs=0.5 and εsp=0.5.

4.1. Average temperature of heat source

The average non-dimensional temperature (θ) of each heat source is depicted in Fig. 3. It shows that θ
decreases with increasing Re. This improvement of heat transfer is due to the flow of recirculation that
takes place between heat sources and decrease in the thickness of thermal boundary layer. Figure 4
represents the streamlines where as Fig. 5 represents the temperature contours at different Re. As Re
increases, the thermal boundary layer thickness reduces and augmentation of circulation strength which
can be seen in Fig. 4. Temperature contour as shown in Fig. 5 depicts that the temperature of the first heat
source is much lower than the others as because of cold air initially come in contact with the first heat
source. The maximum temperature arises at penultimate heat source (shown in Fig. 3) as large circulation
has been created beyond the last heat source which carries away heat to the core flow. Apart from
convection, the surface radiation is also cooled the heat sources. As the temperature of the first heat
source is lowest compared to the others, the radiative heat transfer is insignificant. As the heat sources are
mounted on the bottom wall substrate, there is a conduction heat transfer and due to that bottom wall
substrate temperature increases. The top wall substrate temperature is also increased due to the radiative
interaction with heat source and bottom wall substrate. A thermal boundary layer is developed below the
top wall substrate due to the radiation. With increasing Re the thickness of that layer decreases, which
depicts that convection dominates over the radiation heat transfer at higher Reynolds number.

Fig. 3. Deviation of non-dimensional temperature with heat source array for εc=0.5, εs =0.5, εsp=0.5
 Fig. 4. Streamline for εc=0.5, εs =0.5, εsp=0.5 for (a) Re=250, (b) Re=500 (c) Re=750

Fig. 5. Temperature contour εc=0.5, εs =0.5, εsp=0.5 for (a) Re=250, (b) Re=500 (c) Re=750

4.2. Influence of heat spreader on heat transfer

Heat spreader creates an additional surface area like an extended surface. Whenever heat spreader is
mounted on the heat source, conduction takes place from a heat source to the heat spreader and
temperature of the heat source decreases. Figure 6 shows the variation of θm with Re. It is observed that
θm decreases 11.53% at baseline case after introducing heat spreader and the contribution of radiation on
total heat transfer (from heat source) also reduces 79% at baseline case as shown in Fig. 7. The
temperature distribution is shown in Fig. 8. When the spreader is used the temperature of the heat source
decreases due to the transfer of heat from heat source to spreader though conduction, but after that the
heat spreader releases heat through convection as well as radiation. The thermal boundary layer becomes
thicker using heat spreader.

Fig. 6. Deviation of maximum non-dimensional temperature with Re for εc=0.5, εs =0.5, εsp=0.5

Fig. 7. Contribution of radiation on total heat transfer from heat source

 Fig. 8. Temperature distribution for Re=250, (a) Without spreader (b) With spreader

4.3 Influence of emissivity of heat source on heat transfer

Figure 9 indicates the deviation of θm with Re. It shows that the maximum temperature of heat source
changes from 344.24 K to 343.36 K with increasing emissivity of the heat source from 0.1 to 0.9 and
other parameters at base line case. As the emissivity increases, the interaction between the heat sources
with other surfaces also increases, but changes are insignificant as top surface of the heat source are
covered with heat spreader. The temperature distribution for different emissivity is shown in Fig. 10.

Fig. 9. Influence of heat source emissivity on maximum non-dimensional temperature

 Fig. 10. Temperature distributions for Re=250 (a) εc=0.1 (b) εc=0.7 (c) εc=0.9

4.4 Influence of emissivity of heat spreader on heat transfer

Figure 11 shows the variation of θm with emissivity. When εsp is varied from 0.1 to 0.9, θm decreases
23%, 14.3%, 12.19% and 11.3% at Re=100, 250, 500 and 750 respectively maintain other values at
baseline case. As radiation heat transfer increases, the surface to surface interaction between the heat
spreader and the top channel surface also increases and radiation-induced thermal boundary layer has
been developed below the top substrate. The influence of emissivity of the spreader on temperature
distribution is presented in Fig. 12.

Fig. 11. Variation of θm for different emissivity of heat spreader

 Fig. 12. Temperature distributions at Re=250 (a) εsp=0.1 (b) εsp=0.3 (c) εsp=0.7 and (d) εsp=0.9

4.5 Influence of emissivity of channel walls (εs) on heat transfer

Figure 13 & 14 show the variation of θm for various εs and temperature distribution, respectively. As
the εs increases from 0.1 to 0.9, the maximum temperature decreases from 347.2 K to 341.6 K. It is due to
the increase of the radiative interaction by the channel walls increases. The thickness of the radiation
induced thermal boundary layer also increases with the increase of εs.
Fig. 13. Variation of θm with εs
 Fig. 14. Temperature distribution for Re=250 (a) εs=0.1 (b) εs=0.3 (c) εs=0.7 and (d) εs=0.9

6. Conclusion
Mixed convection with surface radiation in a rectangular channel with five protruding heat sources
and heat spreader mounted on each heat source is carried out. The parameters like thickness of the
substrate and heat spreader, width of the channel and heat source and the distance between consecutive
heat sources are considered as fixed. The effects of parameters like heat source emissivity (εc = 0.1 to
0.9), emissivity of heat spreader (εsp = 0.1 to 0.9), emissivity of channel wall (εs = 0.1 to 0.9) and
Reynolds number (Re = 100, 250, 500, and 750) on the rate of heat transfer are presented. The following
important findings are listed below:

1) The non-dimensional maximum temperature (θm) decreases with increasing Reynolds number
(Re) and radiative heat transfer decreases.
2) It is observed that θm decreases 11.53% using heat spreader at baseline case.
3) When emissivity of the heat spreader (εsp) is varied from 0.1 to 0.9, θm decreases 23%, 14.3%,
12.19% and 11.3% at Re=100, 250, 500 and 750 respectively.
4) As the emissivity of the channel walls increases from 0.1 to 0.9, the maximum temperature of the
channel decreases by an amount of 70C.
5) It also shows that emissivity of the heat source is insignificant as compared to the heat spreader
and channel wall emissivity.

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The non-dimensional maximum temperature (θm) decreases with increasing
Reynolds
number (Re) and radiative heat transfer decreases.
It is observed that θm decreases 11.53% using heat spreader at baseline
case.
When emissivity of the heat spreader (εsp) is varied from 0.1 to 0.9, θm
decreases 23%,
14.3%, 12.19% and 11.3% at Re=100, 250, 500 and 750
respectively.
As the emissivity of the channel walls increases from 0.1 to
0.9, the maximum
temperature of the channel decreases by an amount of 70C.
It also shows that emissivity of the heat source is
insignificant as compared to the heat
spreader and channel wall emissivity.