ORDER NO.

KM40109678C3

Telephone Equipment

KX-TC1709LBB
900MHz Digital Cordless Phone
Black Version
(for Brazil)

© 2001 Kyushu Matsushita Electric Co., Ltd. All

rights reserved. Unauthorized copying and
distribution is a violation of law.
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CONTENTS
Page Page
1 STANDARD BATTERY LIFE 4 11 EXPLANATION OF BBIC (Base Band IC) DATA
2 LOCATION OF CONTROLS 6 COMMUNICATION 37
2.1. Base unit 6 11.1. Calling 37
2.2. Handset 7 11.2. To Terminate Communication 37
3 DISPLAY 8 11.3. Ringing 37
4 CONNECTIONS 10 11.4. Ports for Transmitting and Receiving of Data 37
4.1. Adding Another Phone 11 12 BLOCK DIAGRAM (Base Unit) 38
5 OPERATION 12 13 CIRCUIT OPERATION (Base Unit) 39
5.1. Making Calls 12 13.1. DSP (Digital Speech/Signal Processing: IC501) 39
5.2. Answering Calls 16 13.2. EEPROM (IC551) 39
5.3. FLASH Button 17 13.3. Power Supply Circuit 40
6 DISASSEMBLY INSTRUCTIONS 18 13.4. Reset Circuit 41
7 ASSEMBLY INSTRUCTIONS 20 13.5. Telephone Line Interface 42
7.1. Assembly the LCD to P.C. Board (Handset) 20 13.6. Parallel Connection Detect Circuit 43
8 TROUBLESHOOTING GUIDE 21 13.7. Signal Route 44
8.1. Check Power 22 13.8. Calling Line Identification Circuit (Caller ID) 45
8.2. Check Battery Charge 23 14 BLOCK DIAGRAM (Handset) 47
8.3. Check Link 23 15 CIRCUIT OPERATION (Handset) 48
8.4. Check the RF Unit 24 15.1. Construction 48
8.5. Check Handset Transmission 29 15.2. Power Supply Circuit 48
8.6. Check Handset Reception 29 15.3. Charge Circuit 49
8.7. Check Call ID 29 15.4. Ringer and Handset SP-Phone 49
9 TEST MODE 30 15.5. Sending Signal 49
9.1. Test mode flow chart for Base Unit 30 15.6. Reception Signal 50
9.2. Test mode flow chart for Handset 31 16 CPU DATA (Base Unit) 51
9.3. X101 Check 32 16.1. IC501 51
9.4. Base Unit Reference Drawing 32 17 CPU DATA (Handset) 52
9.5. Handset Reference Drawing 33 17.1. IC201 52
9.6. FREQUENCY TABLE 34 18 EXPLANATION OF IC TERMINALS (RF Unit) 53
10 DESCRIPTION 35 18.1. IC101 53
10.1. Frequency 35 19 HOW TO REPLACE FLAT PACKAGE IC 54
10.2. Time Division Duplex (TDD) operation 35 19.1. Preparation 54
10.3. Signal Flowchart in the Whole System 36 19.2. Procedure 54

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19.3. Modification Procedure of Bridge 54 25.2. Handset (28 SCHEMATIC DIAGRAM (Handset)) 63
20 CABINET AND ELECTRICAL PARTS (Base Unit) 55 25.3. Memo 64
21 CABINET AND ELECTRICAL PARTS (Handset) 56 26 SCHEMATIC DIAGRAM (RF Unit) 65
22 ACCESSORIES AND PACKING MATERIALS 57 27 SCHEMATIC DIAGRAM (Base Unit) 66
23 TERMINAL GUIDE OF ICｴS, TRANSISTORS AND DIODES 58 28 SCHEMATIC DIAGRAM (Handset) 68
23.1. Base Unit 58 29 CIRCUIT BOARD (RF Unit) 70
23.2. Handset 58 30 CIRCUIT BOARD (Base Unit) 71
24 REPLACEMENT PARTS LIST 59 30.1. Component View 71
24.1. Base Unit 59 30.2. Flow Solder Side View 72
24.2. Handset 60 31 CIRCUIT BOARD (Handset) 73
25 FOR SCHEMATIC DIAGRAM 63 31.1. Component View 73
25.1. Base Unit (27 SCHEMATIC DIAGRAM (Base Unit)) 63 31.2. Flow Solder Side View 74

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1 STANDARD BATTERY LIFE

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2 LOCATION OF CONTROLS
2.1. Base unit

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2.2. Handset

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3 DISPLAY
The handset shows you instructions and information on the display. These display prompts are shown below.

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4 CONNECTIONS

Note:
· USE ONLY WITH Panasonic AC ADAPTOR PQLV2LBZ.
· The AC adaptor must remain connected at all times. (It is normal for the adaptor to feel warm during use.)
· If your unit is connected to a PBX which does not support Caller ID, you cannot access the service.

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4.1. Adding Another Phone

This unit will not function during a power failure. To connect a standard telephone on the same line, use the Panasonic T-adaptor.

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5 OPERATION
5.1. Making Calls

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5.2. Answering Calls

When a call is received, the unit rings and the CALLER ID indicator on the base unit flashes quickly. If you subscribe to a Caller
Display service, the calling party information will be displayed after the first ring. In order to view the Caller ID information,
please wait until the second ring to answer a call.

5.2.1. With the Handset

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5.3. FLASH Button

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6 DISASSEMBLY INSTRUCTIONS

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Shown in Fig. To Remove Remove

1 Lower Cabinet Screws (2.6 X 12).....(A) × 4
2 Main P.C. Board Tapes and solder
Main P.C. Board
3 Battery Cover Battery Cover
4 Rear Cabinet Screws (2.6 X 12).....(B) × 2
5 Rear Cabinet Rear Cabinet
6 Main P.C. Board Screw (2.6 × 12).....(C) × 1
Screws (2.6 × 10).....(D) × 2
Lead wire
Main P.C. Board

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7 ASSEMBLY INSTRUCTIONS
7.1. Assembly the LCD to P.C. Board (Handset)

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8 TROUBLESHOOTING GUIDE

Cross Reference:
8.1. Check Power (P.22)
8.2. Check Battery Charge (P.23)
8.3. Check Link (P.23)
8.4. Check the RF Unit (P.24)
8.5. Check Handset Transmission (P.29)
8.6. Check Handset Reception (P.29)
8.7. Check Call ID (P.29)

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8.1. Check Power

Cross Reference:
13.3. Power Supply Circuit (P.40)
13.4. Reset Circuit (P.41)
NOTE:
EEPROM is IC551.
DSP is IC501.
** Models with no LCD can skip.

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8.2. Check Battery Charge 8.3. Check Link

NOTE:
EEPROM is IC551.
DSP is IC501.

NOTE:
EEPROM is IC551.
DSP is IC501.

(*1) Refer to 8.4.1. Finding out the Defective Unit (P.24).

Cross Reference:
8.4. Check the RF Unit (P.24)
13.3. Power Supply Circuit (P.40)
15.2. Power Supply Circuit (P.48)

Cross Reference:
8.1. Check Power (P.22)

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8.4. Check the RF Unit

8.4.1. Finding out the Defective Unit
Prepare HS JIG (Handset-jig) and BS JIG (Base Unit-jig) 2).
Place the HS JIG on the cradle of the base unit for checking,
then confirm that they are linked. Place the handset for
checking on the cradle of the BS JIG, then confirm that they are
linked. How to confirm the link is as follows; press the TALK
button and confirm that the LEDs of the base unit is turned ON.

8.4.2. Check Items

8.4.2.1. Handset-jig (HS JIG) for Base
Unit
The handset unit jig also uses two modes: TEST LOW mode
and NORMAL POWER mode.
(1) NORMAL POWER mode (Stand-By). In this mode the LCD
will remain blank.
(2) TEST LOW mode. Place the portable unit on the base unit
while pushing and key at the same time within 5
seconds after Power supply the portable unit. Refer to fixation
CH table, figure 1 for the key. This test simulates the handset
is at very large distance from the base unit and the TX signal
from handset to base is very small.
Procedure: First place handset jig on base under test to
charge (exchange security code); press CLEAR and then TALK
to operate. The LCD will show TALK. This means that the base
unit sensitivity is OK.
Fig. Using TC1703 Handset-jig.
* HS JIG becomes [NORMAL POWER] mode immediately after
the power supply turning on. * KX-TC1703 is used as the jig.

NOTES:
1) If when setting the handset to TEST LOW mode, if
handset beeps 3 times and the LCD shows "No link to base.
Place on cradle and try again", press 2, 5, 8, 0
simultaneously and then disconnect battery. Re-install
battery, place unit on cradle to get security codes and tries
again.
2) Only KX-TC1703 with marks HS JIG/BS JIG can be used
for troubleshooting. However, regular production set also
can be used as a JIG.
Fixation CH Figure 1
CH POWER making key
1CH “Lo“ "FLASH" + "1"
3CH “Lo“ "FLASH" + "2"
5CH “Lo“ "FLASH" + "3"
7CH “Lo“ "FLASH" + "4"
9CH “Lo“ "FLASH" + "5"
11CH “Lo“ "FLASH" + "6"
13CH “Lo“ "FLASH" + "7"
15CH “Lo“ "FLASH" + "8"
17CH “Lo“ "FLASH" + "9"
19CH “Lo“ "FLASH" + " "
21CH “Lo“ "FLASH" + "0"

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8.4.2.2. Base Unit - jig (BS JIG) for

Handset
The base unit jig uses two modes: NORMAL POWER mode
and TEST POWER mode.
(1) NORMAL POWER mode. This test simulates the handset is
at normal/close distance. The base unit is in NORMAL POWER
mode right after the AC adapter has been inserted.
(2) TEST LOW (POWER) mode. Place the portable unit on the
base unit while pushing and key at the same time
within 5 seconds after Power supply the portable unit. Refer to
fixation CH table, figure 1 for the key. This test simulates the
handset is at very large distance from the base unit and the TX
signal from base to handset is very small.
Procedure: First, place handset under test to charge
(exchange security code), then remove handset from base
after you hear a beep. Press TALK button on handset and if it
links with the base, then this handset sensitivity is OK.
* BS JIG becomes [NORMAL POWER] mode immediately after
the power supply turning on.

NOTES:
1) If when setting the base to TEST LOW mode, if handset
beeps 3 times, press 2, 5, 8, 0 simultaneously and then
disconnect battery. Re-install battery, place unit on cradle to
get security codes and tries again. Fig. Using TC1703 BaseUnit-jig.
2) Only KX-TC1703 with marks BS JIG/HS JIG can be used for * KX-TC1703 is used as the jig.
troubleshooting. However, regular production set also can be
used as a JIG.

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8.4.3. RF Check Flowchart

~ : Details of confirmation items are following in “8.4.4. Check Table for RF Block (P.27)”.
NOTE:
<Base Unit>
EEPROM is IC551.
DSP is IC501.
<Handset>
EEPROM is IC202.
DSP is IC201.

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8.4.4. Check Table for RF Block

No Item BS (Base unit) (*1) HS (Handset) (*1)
1a. Link confirmation Procedure 1. Put “HS JIG” on BS. 1. Put HS on “BS JIG”.
[NORMAL
2. Set MODE to [NORMAL POWER] position 2. Set MODE to [NORMAL POWER] position
POWER]
of “HS JIG“. of “BS JIG“.
3. Press [TALK] key of “HS JIG” to establish 3. Press [TALK] key of “HS” to establish link.
link.
1b. Link confirmation Procedure 1. Change MODE to [TEST POWER] position 1. Change MODE to [TEST POWER]
[TEST POWER] of “HS JIG”. position of “BS JIG”.
2. Press [TALK] key of “HS JIG” to establish 2. Press [TALK] key of “HS“ to establish link
link about 30cm away from “BS”. about 30cm away from “BS JIG”.
2 IC101 working Procedure 1. Set Test-mode [Continuos Send Low 1. Set Test-mode [Continuos Send Low
confirmation Power].(*3) Power].(*3)
2. Confirm oscillate signal (4.096 MHz at Pin 2. Confirm oscillate signal (4.096 MHz at Pin
33). (*4) 33). (*4).
Check point 1. Check Pin 33 oscillator. 1. Check Pin 33 oscillator.
2. Check DSP interface(IC101←→DSP/BS) 2. Check DSP interface(IC101←→DSP/HS)
(*5). (*5).
3 TX frequency Procedure 1. Set Test-mode [Continuos Send].(*3) 1. Set Test-mode [Continuos Send Low
confirmation Power].(*3)
2. Confirm TX-carrier frequency (1CH =
902.713MHz ± 20kHz). 2. Confirm TX-carrier frequency (1CH =
902.713MHz ± 20kHz).
Check point 1. Check DSP or X200 oscillator Circuit. 1. Check DSP or X201 oscillator Circuit.
4 TX Power Procedure 1. Put RF wire to ANT and ANT_GND (See 1. Put RF wire to ANT and ANT_GND (See
confirmation 9.4. Base Unit Reference Drawing). 9.5. Handset Reference Drawing ).
Connect this wire Marconi or Spectrum 2. Set Test-mode.
Analyzer.
3. Confirm TX power level within -3±5dBm
2. Set Test-mode. (*2)
3. Confirm TX power level within -3±5dBm (*2) (0.158~1.58mW)
(0.158~1.58mW)
Check point 1. Check C102~C103, C161, L102, L111, 1. Check C102~C103, C161, L102, L111,
R147 soldering. R147 soldering.
2. Check Antenna in BS. 2. Check Antenna in HS.
5 Receiver Procedure 1. Put “HS JIG” on BS. 1. Put HS on “BS JIG”.
confirmation
2. Set MODE to [NORMAL POWER] position 2. Set MODE to [NORMAL POWER] position
of “HS JIG”. of “BS JIG”.
3. Press [TALK] key of “HS JIG“ to establish 3. Press [TALK] key of “HS” to establish link.
link.
4. Change MODE to [TEST POWER]
4. Change MODE to [TEST POWER] position position of “BS JIG”.
of “HS JIG“.
5. Press [TALK] key of “HS” to establish link
5. Press [TALK] key of “HS JIG” to establish about 30cm away from “BS JIG“.
link about 30cm away from “BS”.
Check point 1. Check L103, L104, L106, L111~L113, 1. Check L103, L104, L106, L111~L113,
X101, C103~C106, C110, C118, R103 X101, C103~C106, C110, C118, R103
soldering. soldering.
2. Check Antenna in BS. 2. Check Antenna in HS.

(*1) BS: Base unit, HS: Handset unit, HS JIG: Handset-jig, (*3)See 9 TEST MODE ( P.30).
BS JIG: Base unit-jig (*4)See 8.4.5. RF-DSP interface signal wave form (P.28).
(*2)<Marconi setting> (*5)See 9.4. Base Unit Reference Drawing (P.32).
TX Freq.; 902.713MHz mode; WB See 9.5. Handset Reference Drawing (P.33).
<Spectrum analyzer setting> NOTE:
Freq. 902.713MHz Span 10MHz Flash Memory is IC300.
RBW 1MHz or above VBW same as RBW DSP is IC501 (Base Unit) / IC201 (Handset).

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8.4.5. RF-DSP interface signal wave form

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8.5. Check Handset Transmission

Cross Reference:
13.7. Signal Route (P.44).

8.6. Check Handset Reception

Cross Reference:
13.7. Signal Route (P.44).
NOTE:
When checking the RF UNIT, Refer to 8.4. Check the RF
Unit (P.24)

8.7. Check Call ID

Cross Reference:
13.5. Telephone Line Interface (P.42).
13.8. Calling Line Identification Circuit (Caller ID) (P.45).
Note:
· Make sure the format of the Caller ID or Call Waiting
Caller ID service of the Telephone company that the
customer subscribed to.
· Also we recommend to confirm that the customer is
really a subscriber of the service.

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9 TEST MODE
9.1. Test mode flow chart for Base Unit

(*1) See 9.4. Base Unit Reference Drawing (P.32) - Insert AC adaptor for entering the test mode during pressing the test
switch .
(*2) While the Tele line is connected, the “Caller ID” LED is ON/OFF as well.
(*3) It shows whether the telephone line is connected or not.
-ON: OFF HOOK.
-OFF: ON HOOK

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9.2. Test mode flow chart for Handset

(*1) See 9.5. Handset Reference Drawing ( P.33).---Insert Battery for entering the Test mode during pressing the test switch.

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9.3. X101 Check

The confirmation is made under the Continuous Send mode of TEST MODE.

Equipment: Frequency counter

TP for adjustment: TP_ANT
Measure range: 902.713 MHz ± 5 kHz (1ch) at Test Standby mode in 9 TEST MODE (P.30).

9.4. Base Unit Reference Drawing

(COMPONENT VIEW)

IC301

ANT GND
IC331 IC321

RF UNIT
ANT

IC501

(FLOW SOLDER SIDE VIEW)

Line A

IC551
Line B
B
C
E E
C
B

TEST

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HANDSET
(COMPONENT VIEW) SP- SP+

IC203
10µ

IC205
-
+

MIC-
ANT GND
-
+

IC201
MIC+
10µ
ANT
IC202
IC204

100Ω

TEST PULL UP

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9.6. FREQUENCY TABLE

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10 DESCRIPTION
10.1. Frequency
The frequency range of 902.713 MHz ~ 927.289 MHz is used. Transmitting and receiving channel between base unit and handset
is same frequency. Refer to the Frequency Table.

10.2. Time Division Duplex (TDD) operation

Transmission/reception between the base unit and handset is performed by time-sharing as shown in Fig. 7. 1 slot time of
transmission and reception is 1mS.Same frequency is used in transmitting and receiving. The figure shows an example; the
frequency of 3ch is used in transmitting between the base unit and handset.

Fig. 7

10.2.1. TDD Frame Format

The TDD frame is 2mS in length. Each subframe contains 128 bits of 7.8µS duration.
Each subframe consists of the following four fields:
· A 2-bit Preamble field
· An 8-bit Data Channel field
· An 16-bit Sync Word
· A 72-bit ADPCM Payload (CRC 8-bit)

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10.3. Signal Flowchart in the Whole System

Reception
CN1 of the base unit is connected to the TEL line, and the signal is input through the bridge diode D101. While talking the relay
(Q121) is turned ON and amplified at the amplifiers Q50, then led to DSP (IC201). DSP generates ADPCM signal. The ADPCM
signal is input to RFIC (IC101) of RF UNIT. RFIC outputs FSK modulated RF signal. The RF signal is passed through filter
(L111) to be transmitted from the antenna. As for the handset, RF signal from the antenna is input to RFIC passing through filter
(L111) then input to DSP (IC201). DSP performs ADPCM decoding to convert the signal into the voice signal, then it is output
to the speaker.
Transmission
The voice signal input from the microphone is led to DSP (IC201). The DSP generates ADPCM signal. As well as the reception,
it is converted into the RF signal by RFIC (IC101). Passing through filter (L111), it is transmitted from the antenna. As for the
base unit, RF signal from the antenna is input to RFIC (IC101) passing through filter (L111) and the balum then input to DSP
(IC201). DSP performs ADPCM decoding to convert the signal into the voice signal. The voice signal is amplified at the TX
amplifier (Q1), then output to the TEL line (CN1) through the relay (Q4) and bridge (D4).

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11 EXPLANATION OF BBIC (Base Band IC) DATA

COMMUNICATION
11.1. Calling 11.3. Ringing

11.4. Ports for Transmitting and

Receiving of Data
11.2. To Terminate Communication

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13 CIRCUIT OPERATION (Base Unit)

General Description:
(DSP, Flash Memory) is a digital speakerphone/speech/signal processing system that implements all the functions of speech
compression, record and playback, and memory management required in a digital telephone answering machine.
The DSP system is fully controlled by a host processor DSP. The host processor provides activation and control of all that
functions as follows.

13.1. DSP (Digital Speech/Signal Processing: IC501)

· DTMF Detection/Generator
The DTMF detection is implemented by the DSP system in software. The DTMF detection is performed during Record,
Playback, and Line Monitoring modes of operation.
When the DTMF data from the Handset is received, the DTMF signal is output.
· Caller ID and Call Waiting CID demodulation
The DSP implements monitor and demodulate the FSK signals that provide CID information from the Central Office.
· Analog Switching
The voice signal from telephone line is transmitted to the speaker or the voice signal from speakerphone microphone is
transmitted to the Telephone line, etc. They are determined by the signal path route operation of voice signal.
· Block Interface Circuit
RF unit, LED, Key scan, Speaker, Microphone, Telephone line, LCD

13.2. EEPROM (IC551)

Following information data is stored.
· Telephone number, etc.
ex: Telephone Directory number, Caller ID data, ID code
· Settings
ex: message numbers, caller ID numbers, pulse tone dial

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13.3. Power Supply Circuit

Function:
The power supply voltage from AC adaptor is converted to the desired voltage of each block.
Circuit Operation:
This unit supplies the voltage to each block as shown below.

13.3.1. Charge Circuit

The voltage from the AC is supplied to the main charge circuits. Normal charge (70 mA) of maximum 20-hours is started soon after
the Handset is placed on the base unit. Then it changes to trickle charge (15 mA on the average) to prevent from overcharging.
Normal charge : Q150 is ON
Trickle charge : Q150 is OFF

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13.4. Reset Circuit

Function:
This circuit is used for to initialize the microcomputer when it incorporates an AC adaptor.
Circuit Operation:
When the AC Adaptor is inserted into the unit, then the voltage is shifted by IC301, D306 and power is supplied to the DSP.
The set can operate beyond point in the circuit voltage diagram.

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13.5. Telephone Line Interface

Telephone Line Interface Circuit:
Function
· Bell signal detection
· ON/OFF hook and pulse dial circuit
· Side tone circuit
· Auto-disconnect circuit/Parallel connection detection circuit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q121 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T → L101 → R103 → C103 → Q101 → DSP pin 27. [BELL]
When the CPU (DSP) detects a ring signal, Q121 turns on, thus providing an off-hook condition (active DC current flow through
the circuit) and the following signal flow is for the voice signal.
T → D101 → Q121 → R140/R139 → C139 → R138 → R136 → D131 → D101 → L102 → P101 → R
ON HOOK Circuit:
Q121 is open, Q121 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-
hook condition.
Pulse Dial Circuit:
DSP (2) turns Q121 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal.
As for this unit, TX signal feed back from Q131 is canceled by the chancellor circuit of DSP.

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13.6. Parallel Connection Detect Circuit

Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook Q115 is ON, the voltage is monitored DCIN of DSP. There is no parallel connection if the voltage is 1.65 V or higher,
while a parallel connection is deemed to exist if the voltage is lower.

Parallel connection detection when off hook:

When off hook Q115 is OFF, the voltage is monitored DCIN of DSP; the presence/absence of a parallel connection is determined
when the voltage changes by 0.2 V or more.

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13.7. Signal Route

Each signal route is as follows.

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13.8. Calling Line Identification Circuit (Caller ID)

Function:
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. This model can receive 2 types of caller ID (FSK type, DTMF type).
· FSK type
The data for the caller ID from the telephone exchange is sent during the interval between the first and second rings of the bell
signal. The data from the telephone exchange is a modem signal which is modulated in an FSK (Frequency Shift Keying)
format. Data “0” is a 1200 Hz or 1300 Hz sine wave, and data 1 a 2200 Hz or 2100 Hz sine wave.

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14 BLOCK DIAGRAM (Handset)

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15 CIRCUIT OPERATION (Handset)

15.1. Construction
The circuit mainly consists of DSP and RF unit as shown in the block diagram.

15.1.1. DSP:IC201
Function
· Battery Low, Power down defect circuit
· Ringer Generation
· Interface circuit
RF unit, speaker, mic, LED, Key scan, LCD, Headset

15.1.2. RF unit
Mainly voice signal is modulated to RF, or it goes the other way.

15.1.3. EEPROM: IC202

All setting data is stored.
ex: ID code, user setting (Flash Time, Tone/Pulse)

15.2. Power Supply Circuit

Voltage is supplied separately to each block as shown Block Diagram.

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15.3. Charge Circuit

Ni-Cd battery is connected to CN202. When the handset is put on the cradle of the base unit, the power is supplied from CHARGE1
and CHARGE2 terminals to charge the battery. Q207 detects the voltage of CHARGE1 and CHARGE2 terminals, then the handset
makes ID code setting with the base unit.

15.4. Ringer and Handset SP-Phone

DSP (29-31) → SP/RINGER

15.5. Sending Signal

The voice signal from the microphone input to DSP (46-47). CN203 is the headset jack. When the headphone is connected, the
Q206 detect it. The input from the microphone of the handset (MIN, MIP) is cut and the microphone signal from the headphone is
input to DSP (36). Also the power for the microphone is supplied from Q211, and the power is turned OFF on standby.

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KX-TC1709LBB

15.6. Reception Signal

The voice signal from the base unit is output to DSP (33) (HSSOUT). This signal is led to the headset jack (CN203) and DSP (44)
(HSMIP). The signal input to DSP (44) is inverted and output to DSP (34) (LOUTO).The signal through the headset jack is inverted,
then output from DSP (34) to drive the speaker. When the headset is inserted to the jack, the voice signal is cut at the jack, so the
sound does not come out from the speaker, but from the headset only.

50
 KX-TC1709LBB

16 CPU DATA (Base Unit)

16.1. IC501

51
KX-TC1709LBB

17 CPU DATA (Handset)

17.1. IC201

52
 KX-TC1709LBB

18 EXPLANATION OF IC TERMINALS (RF Unit)

18.1. IC101

53
KX-TC1709LBB

iron as shown in below figure.

19 HOW TO REPLACE FLAT
PACKAGE IC
19.1. Preparation
· SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-
19RMA
· Soldering iron
Recommended power consumption will be between 30 W
to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 W to 80 W iron, but
beginner might damage foil by overheating.)
· Flux
HI115 Specific gravity 0.863.
(Original flux will be replaced daily.)

19.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two
marked 2 pins.

*Most important matter is accurate setting

of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.

3. Solder employing specified solder to direction of arrow, as

sliding the soldering iron.

19.3. Modification Procedure of

Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering
54
 KX-TC1709LBB

20 CABINET AND ELECTRICAL PARTS (Base Unit)

55
KX-TC1709LBB

21 CABINET AND ELECTRICAL PARTS (Handset)

56
 KX-TC1709LBB

22 ACCESSORIES AND PACKING MATERIALS

57
KX-TC1709LBB

23 TERMINAL GUIDE OF IC´S, TRANSISTORS AND DIODES

23.1. Base Unit

23.2. Handset

58
 KX-TC1709LBB

24 REPLACEMENT PARTS Ref.

No.
Part No. Part Name & Description Remarks

7 PQWE10022Z CHARGE TERMINAL

LIST 8
9
PQKE10131Z1
PQKE10134Z1
HOOK LEVER
HOOK KNOB
S
S
This replacement parts list are KX-TC1709LBB only. 10 1AKM10487Z3 UPPER CABINET S
11 PQQT22278Z CHARGE LABEL
Note:
12 PQHA10017Z LEG CUSHION RUBBER
1. RTL (Retention Time Limited) 13 PQHA10018Z FOOT RUBBER

The marking (RTL) indicates that the Retention Time is

limited for this item. 24.1.2. MAIN P.C. BOARD PARTS
After the discontinuation of this assembly in production, the Ref. Part No. Part Name & Description Remarks
No.
item will continue to be available for a specific period of
PCB1 PQWPC1709LBH MAIN P.C.BOARD ASS´Y (RTL)
time. The retention period of availability is dependent on the (ICS)
type of assembly, and in accordance with the laws IC301 C0CBABD00013 IC
governing part and product retention. IC321 PQVIPS3327UT IC
IC501 C2HBBG000025 IC
After the end of this period, the assembly will no longer be
IC551 PQWIC1709LBH IC
available. (TRANSISTORS)
2. Important safety notice Q101 2SD1819A TRANSISTOR(SI)
Q115 2SD1819A TRANSISTOR(SI)
Components identified by a mark special characteristics Q121 2SA1625 TRANSISTOR(SI) S
important for safety. When replacing any of these Q122 PQVT2N6517CA TRANSISTOR(SI) S
components, use only manufacture´s specified parts. Q131 2SC2120 TRANSISTOR(SI) S
Q303 2SD2136 TRANSISTOR(SI)
3. The S mark indicates service standard parts and may differ
Q371 2SD1994A TRANSISTOR(SI)
from production parts. Q381 2SD1819A TRANSISTOR(SI)
4. RESISTORS & CAPACITORS Q461 2SD1819A TRANSISTOR(SI)
Q501 2SD1819A TRANSISTOR(SI)
Unless otherwise specified; Q502 UN5213 TRANSISTOR(SI) S
All resistors are in ohms (Ω) K=1000Ω, M=1000kΩ (DIODES)
D101 PQVDS1ZB60F1 DIODE(SI)
All capacitors are in MICRO FARADS (µF) P=µµF D103 MA111 DIODE(SI)
*Type & Wattage of Resistor D117 MA111 DIODE(SI)
D118 MA111 DIODE(SI)
D121 PQVDRLZ20A DIODE(SI) S
D131 PQVDRLZ2R0 DIODE(SI) S
D303 MA8068M DIODE(SI)
D306 PQVDHRU0302A DIODE(SI) S
D376 MA8220 DIODE(SI)
D377 MA8220 DIODE(SI)
D511 PQVDHRU0302A DIODE(SI) S
D601 PQVDHRU0302A DIODE(SI) S
(LEDS)
LED541 PQVDSML310MT LED S
LED542 PQVDBR1111C LED S
(COILS)
L101 PQLQXF330K COIL S
L102 PQLQXF330K COIL S
L301 PQLQXF100K COIL S
L375 PQLQXF100K COIL S
L501 PQLQR2KA213 COIL S
L502 PQLQR4RB601D COIL
(SURGE ABSORBERS)
SA101 PQVDDSS301L SURGE ABSORBER S
SA102 PQVDDSS301L SURGE ABSORBER S
(OTHERS)
CN101 PQJJ2H003Z JACK SOCKET S
G601 PQJT10152Z CHARGE TERMINAL

24.1. Base Unit G602

G603
PQJT10152Z
PQJT10152Z
CHARGE TERMINAL
CHARGE TERMINAL
G604 PQJT10152Z CHARGE TERMINAL
24.1.1. CABINET AND ELECTRICAL G605 PQJT10152Z CHARGE TERMINAL
PARTS G606 PQJT10152Z CHARGE TERMINAL
P101 PQRPAR390N POSISTOR S
Ref. Part No. Part Name & Description Remarks S501 EVQPCQ05K PUSH SWITCH
No. X501 H0J409400006 CRYSTAL OSCILLATOR
1 PQUS10285Z HOOK SPRING (RESISTORS)
2 PQBC10338Z1 LOCATOR BUTTON S R103 ERJ3GEYJ104 100k
3 PQSA10095Z ANTENNA R104 ERJ3GEYJ104 100k
4 PQGT14771Z NAME PLATE R106 ERJ3GEYJ472 4.7k
5 PQKF10519Y1 LOWER CABINET S R107 ERJ3GEYJ473 47k
6 PQHR10857Z LED PLATE R108 ERJ3GEYJ102 1k

59
KX-TC1709LBB

Ref. Part No. Part Name & Description Remarks Ref. Part No. Part Name & Description Remarks
No. No.
R111 ERJ3GEYJ394 390k C111 ECKD2H681KB 680P S
R112 ERJ3GEYJ394 390k C112 ECKD2H681KB 680P S
R113 ERJ3GEYJ472 4.7k C115 ECUV1H103KBV 0.01
R115 ERJ3GEYJ155 1.5M C121 ECUV1H103KBV 0.01
R116 ERJ3GEYJ106 10M C131 ECUV1H101JCV 100P
R117 ERJ3GEYJ275 2.7M C132 ECUV1H103KBV 0.01
R118 ERJ3GEYJ102 1k C134 ECEA1HKA010 1
R120 ERJ3GEYJ103 10k C139 ECEA1CKA100 10
R121 ERJ3GEYJ104 100k C140 ECUV1C473KBV 0.047
R122 ERJ3GEYJ103 10k C302 ECUV1C104ZFV 0.1
R124 ERJ3GEYJ472 4.7k C303 ECUV1C104ZFV 0.1
R132 ERJ3GEYJ393 39k C304 ECEA1CKA100 10
R133 ERJ3GEYJ102 1k C305 ECUV1C104ZFV 0.1
R134 ERJ3GEY0R00 0 C306 ECEA1AU471 470
R136 ERDS1TJ330 33 S C308 ECUV1C104ZFV 0.1
R138 ERJ3GEYJ470 47 C333 ECUV1C104ZFV 0.1
R139 ERJ3GEYJ681 680 C341 ECUV1C104ZFV 0.1
R140 ERJ3GEYJ122 1.2k C371 ECUV1C104ZFV 0.1
R303 ERJ3GEYJ122 1.2k C411 ECUV1H121JCV 120P
R304 ERJ3GEYJ122 1.2k C412 ECUV1A105ZFV 1
R333 ERJ3GEYJ103 10k C414 ECEA1CKA100 10
R345 ERJ3GEYJ102 1k C415 ECUV1C104ZFV 0.1
R371 ERJ3GEYJ331 330 C431 ECUV1H272KBV 0.0027
R372 ERJ3GEYJ561 560 C432 ECUV1C104KBV 0.1
R373 ERJ3GEYJ390 39 C441 ECUV1C104KBV 0.1
R374 ERJ3GEYJ560 56 C445 ECUV1C104KBV 0.1
R375 ERJ3GEYJ470 47 C463 ECUV1C104KBV 0.1
R376 ERJ3GEYJ470 47 C464 ECUV1H102KBV 0.001
R377 ERDS1VJ271 270 C467 ECST0JY106 10
R381 ERJ3GEYJ563 56k C501 ECEA1AU221 220 S
R382 ERJ3GEYJ563 56k C502 ECUV1C104ZFV 0.1
R383 ERJ3GEYJ103 10k C503 ECUV1C104ZFV 0.1
R384 ERJ3GEYJ104 100k C504 ECUV1H681JCV 680P S
R385 ERJ3GEYJ102 1k C506 ECUV1H180JCV 18P
R411 ERJ3GEYJ394 390k C507 ECUV1H150JCV 15P
R412 ERJ3GEYJ564 560k C513 ECEA0JKA101 100
R431 ERJ3GEYJ222 2.2k C514 ECUV1C104ZFV 0.1
R433 ERJ3GEYJ333 33k C515 ECST0JY106 10
R434 ERJ3GEYJ102 1k C516 ECUV1C104ZFV 0.1
R461 ERJ3GEYJ102 1k C551 ECUV1C104ZFV 0.1
R462 ERJ3GEYJ392 3.9k C601 ECEA1AU101 100 S
R463 ERJ3GEYJ102 1k C602 ECUV1H103KBV 0.01
R464 ERJ3GEYJ394 390k C611 ECUV1H103KBV 0.01
R465 ERJ3GEYJ820 82 C613 ECUV1C104ZFV 0.1
R502 ERJ3GEYJ103 10k C616 ECUV1H330JCV 33P
R503 ERJ3GEYJ103 10k C618 ECUV1H030CCV 3P
R504 ERJ3GEYJ103 10k C620 ECUV1C104ZFV 0.1
R506 ERJ3GEYJ102 1k C681 ECUV1H030CCV 3P
R507 ERJ3GEYJ102 1k
R508 ERJ3GEYJ103 10k
R509 ERJ3GEYJ103 10k
24.1.3. RF P.C.BOARD PART
R511 ERJ3GEYJ274 270k Ref. Part No. Part Name & Description Remarks
R512 ERJ3GEYJ473 47k No.
R541 ERJ3GEYJ181 180 PCB2 PQLP10246Z RF BLOCK
R542 ERJ3GEYJ561 560
R601 ERJ3GEYJ123 12k
R602 ERJ3GEYJ103 10k 24.2. Handset
R603 ERJ3GEYJ472 4.7k
R604 ERJ3GEYJ472 4.7k 24.2.1. CABINET AND ELECTRICAL
R611 ERJ3GEYJ104 100k PARTS
R612 ERJ3GEYJ472 4.7k
R613 ERJ3GEYJ472 4.7k Ref. Part No. Part Name & Description Remarks
R615 ERJ3GEYJ102 1k No.
R650 ERJ3GEYJ332 3.3k 101 PQAS3P07Y SPEAKER
L100 PQ4R18XJ000 0 S 102 PQAX3P27Z RECEIVER
L511 ERJ3GEY0R00 0 103 PQBC10337Z1 NAVIKEY BUTTON S
(CAPACITORS) 104 PQGP10183Z1 LCD LABEL S
C100 ECUV1C104ZFV 0.1 105 PQGT14793Z NAME LABEL
C101 ECKD2H681KB 680P S 106 PQHE10121Z CUSHION, URETHANE FORM
C102 ECKD2H681KB 680P S 107 PQHG10589Y SP RUBBER SHEET
C103 PQCUV1H154KR 0.15 108 PQHR10778Z SP HOLDER
C104 PQCUV1H154KR 0.15 109 PQHR10855Z SP HOLDER
C106 PQCUV1A684KB 0.68 110 PQHR10856Z LCD HOLDER

60
 KX-TC1709LBB

Ref. Part No. Part Name & Description Remarks Ref. Part No. Part Name & Description Remarks
No. No.
111 PQHS10457Z SP NET R218 ERJ3GEYF824 820k S
112 PQHS10470Z CUSHION LCD R222 ERJ3GEYJ101 100
113 PQHX11005Z LCD SHEET R224 ERJ3GEYJ103 10k
114 PQJT10176Z CHARGE TERMINAL (L) R225 ERJ3GEYJ472 4.7k
115 PQJT10177Z CHARGE TERMINAL (R) R228 ERJ3GEYJ224 220k
116 PQKE10132Z1 EARPHONE CAP S R229 ERJ3GEYJ102 1k
117 PQKF10518Z1 REAR CABINET S R230 ERJ3GEYJ102 1k
118 PQKK10120Z1 BATTERY COVER S R231 ERJ3GEYJ102 1k
119 1DKM10486Z1 FRONT CABINET S R232 ERJ3GEYJ103 10k
120 PQPP504SVC BATTERY S R233 ERJ3GEY0R00 0
121 PQSA10102X ANTENNA S R234 ERJ3GEYJ225 2.2M
122 PQSX10174Y KEY RUBBER SWITCH R235 ERJ3GEYJ225 2.2M
123 PQADGP332GN2 LIQUID CRYSTAL DISPLAY R236 ERJ3GEYJ473 47k
124 QQQT20007Z INSERT LABEL, BATTERY R241 ERJ3GEY0R00 0
R244 ERJ3GEYJ473 47k
R245 ERJ3GEYJ103 10k
24.2.2. MAIN P.C. BOARD PARTS R246 ERJ3GEYJ153 15k
Ref. Part No. Part Name & Description Remarks R247 ERJ3GEYJ391 390
No. R248 ERJ3GEYJ393 39k
PCB100 PQWPC1703BXR MAIN P.C.BOARD ASS´Y (RTL) R249 ERJ3GEYJ222 2.2k
(ICS) R250 ERJ3GEYJ222 2.2k
IC201 C2HBBG000024 IC R253 ERJ3GEYJ222 2.2k
IC202 PQWIC1703BXR IC R260 ERJ3GEYJ103 10k
IC203 C0CBABD00011 IC R265 ERJ3GEYJ103 10k
IC204 PQVIC62FP33M IC S R270 ERJ3GEYJ104 100k
IC205 PQVIC61CN32N IC S R271 ERJ3GEYJ104 100k
(TRANSISTORS) R272 ERJ3GEYJ104 100k
Q202 PQVTDTC143E TRANSISTOR(SI) S R300 ERJ3GEYJ104 100k
Q203 PQVTDTA143TU TRANSISTOR(SI) R302 ERJ3GEYJ180 18
Q205 2SD1819A TRANSISTOR(SI) R303 ERJ3GEYJ180 18
Q206 PQVTDTC143E TRANSISTOR(SI) S C301 ERJ3GEY0R00 0
Q207 2SD1819A TRANSISTOR(SI) L209 PQ4R10XJ000 0 S
Q211 PQVTDTA143TU TRANSISTOR(SI) (CAPACITORS)
(DIODES) C203 ECUV1C104ZFV 0.1
D201 MA2ZD1400 DIODE(SI) C205 ECUV1H101JCV 100P
D203 MA111 DIODE(SI) C206 ECUV1C104KBV 0.1
D206 PQVDS1ZB60F1 DIODE(SI) C207 ECUV1C104KBV 0.1
D211 MA8100M DIODE(SI) C208 ECUV1C104KBV 0.1
D214 MA111 DIODE(SI) C209 ECUV1C104KBV 0.1
D215 MA2ZD1400 DIODE(SI) C210 ECUV1C104KBV 0.1
D216 MA111 DIODE(SI) C211 ECUV1A474KBV 0.47
(LEDS) C212 ECUV1A474KBV 0.47
LED205 LNJ308G8JRA LED C213 ECEV0JA101 100
LED206 LNJ308G8JRA LED C214 ECUV1C104ZFV 0.1
LED207 LNJ308G8JRA LED C215 ECUV1A474KBV 0.47
(COILS) C217 ECUV1C104ZFV 0.1
L201 MQLRE15NJF COIL C218 ECUV1C104ZFV 0.1
L203 PQLQR3FL121 COIL S C220 ECEV0GA102P 1000
L211 PQLQR4RB601D COIL C221 ECUV1C104ZFV 0.1
L212 PQLQR4RB601D COIL C222 ECUV1C104ZFV 0.1
(CONNECTORS) C223 ECST0JY106 10
CN201 PQJS22A12Z FFC CONNECTOR S C224 ECUV1C104ZFV 0.1
CN202 PQJP2D13Z CONNECTOR PIN S C225 ECUV1C104ZFV 0.1
CN203 PQJJ1J007Z EAR JACK S C226 ECUV1C104ZFV 0.1
(OTHERS) C227 ECUV1C104ZFV 0.1
E101 PQJM147Y MICROPHONE C228 ECUV1C104ZFV 0.1
G1 PQJT10152Z CHARGE TERMINAL C229 ECUV1A105ZFV 1
G2 PQJT10152Z CHARGE TERMINAL C230 ECUV1E333KBV 0.033
G3 PQJT10152Z CHARGE TERMINAL C231 ECUV1A224KBV 0.22
G4 PQJT10152Z CHARGE TERMINAL C232 ECUV1E333KBV 0.033
G5 PQJT10152Z CHARGE TERMINAL C233 ECUV1A105ZFV 1
G6 PQJT10152Z CHARGE TERMINAL C234 ECUV1A224KBV 0.22
X201 H0J409400006 CRYSTAL OSCILLATOR C236 ECUV1H150JCV 15P
(RESISTORS) C237 ECUV1H150JCV 15P
R205 ERJ3GEYJ271 270 C239 ECUV1C104ZFV 0.1
R206 ERJ3GEYJ271 270 C242 ECUV1C104ZFV 0.1
R207 ERJ3GEYJ271 270 C255 ECUV1A224KBV 0.22
R209 ERJ3GEYJ102 1k C257 ECST0JY226 22
R210 ERJ3GEYJ103 10k C262 ECUV1A105ZFV 1
R211 ERJ3GEYJ103 10k C267 ECST0JX226 22
R212 ERJ3GEYJ101 100 C270 ECST0JY475 4.7
R213 ERJ3GEYJ101 100 C274 ECUV1C104ZFV 0.1
R217 ERJ3GEYF434 430k S C277 ECUV1C563KBV 0.056

61
KX-TC1709LBB

Ref. Part No. Part Name & Description Remarks

No.
C279 ECUV1H010CCV 1P
C280 ECUV1C104ZFV 0.1
C282 ECUV1C104ZFV 0.1
C285 ECUV1C105ZF 1
C291 ECUV1C104ZFV 0.1
C294 ECUV1C104ZFV 0.1
C303 ECST0JY106 10
C304 ECUV1C104ZFV 0.1
C305 ECUV1H030CCV 3P

24.2.3. RF P.C.BOARD PART

Ref. Part No. Part Name & Description Remarks
No.
PCB200 PQLP10246Z RF BLOCK

24.2.4. ACCESSORIES AND PACKING

MATERIALS
Ref. Part No. Part Name & Description Remarks
No.
A1 PQLV2LBZ AC ADAPTOR
A2 PQJA10075Z TEL CORD
A3 PQKE10130Z1 BELT CLIP S
A4 PQKL10035Z1 WALL MOUNT ADAPTOR S
A5 PQQX13147Z INSTRUCTION BOOK
A6 PQQW12582Z BETTERY LEAFLET
P1 XZB20X35A01 PROTECTION COVER
(for Base Unit)
P2 XZB10X35A02 PROTECTION COVER
(for Handset)
P3 PQPK13481Z CARTON BOX

62
 KX-TC1709LBB

25 FOR SCHEMATIC DIAGRAM

25.1. Base Unit (27 SCHEMATIC DIAGRAM (Base Unit))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. This schematic diagram and circuit board may be modified at any time with the development of new technology.

25.2. Handset (28 SCHEMATIC DIAGRAM (Handset))

Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams and circuit board may be modified at any time with the development of new technology.

63
KX-TC1709LBB

25.3. Memo

64
 26 SCHEMATIC DIAGRAM (RF Unit)

16 2
IC102

TX
15

14

13

12

11

10

IC101 9

65
8

RX
4
KX-TC1709LBB
KX-TC1709LBB

27 SCHEMATIC DIAGRAM (Base Unit)

3.3Vp-p

3.3Vp-p

(13~16)
IC551

(12)
-16.1dBm
343mVp-p

IC501

(6~11)
(5)
(4)
-14.5dBm
413mVp-p

(3)
(2)
(1)

66
 KX-TC1709LBB

-27.2dBm
96mVp-p
-20.4dBm
209mVp-p

Input f=1.1kHz
140mVp-p
(-25dBm/600 )
(13~16)

Output
Call ID -15.5dBm
Data

3.3V

IC331
(12)

IC321

3.6V 6.0V
IC301
(5) (6~11)
(4)
(3)

9V
DC
(2)

3.3V To H/S
(1)

KX-TC1709LBB: SCHEMATIC DIAGRAM (Base Unit)

67
 KX-TC1709LBB

IC202

68
28 SCHEMATIC DIAGRAM (Handset)

3Vp-p

3Vp-p

(1) (2, 3) (4) (5) (6~23) (24~26) (27) (28~40) (41~45) (46~48)(49~51)(52) (53~59)
 KX-TC1709LBB

TX

(53~59) RX
Input 1.1kHz
18mVp-p (-45dBm/600 )
(46~48)(49~51)(52)

(Headset)
Input 1.1kHz
-43dBm/600

130mV -24.5dBm
(41~45)

IC201 (Headset)
(28~40)

51mV -33.0dBm
62mV
-31.0dBm
(27)
(24~26)
(6~23)

IC205

3.3V
IC203
(5)

3.3V
(4)

IC204
(2, 3)
(1)

KX-TC1709LBB: SCHEMATIC DIAGRAM (Handset)

69
KX-TC1709LBB

29 CIRCUIT BOARD (RF Unit)

IC101

70
 KX-TC1709LBB

30 CIRCUIT BOARD (Base Unit)

30.1. Component View
Power Down
(PDN) Reset (RST)

G 5 4 3 G 2 1
IC301
G

6
7
8
ANT
9
GND

IC331 IC321
G RF UNIT
10
ANT
11 G 18
12
13
G 17

G 14 15 G 16

IC501

B (3.3 V) C (3.3 V) X' tal CLK Charge Detect VRF (3.3 V)

71
KX-TC1709LBB

30.2. Flow Solder Side View

Line A

Line B
IC551

B
C
E E
C
B

Test

72
 KX-TC1709LBB

31 CIRCUIT BOARD (Handset)

31.1. Component View

TP_VCC
TP_PDN
SP1
TP_Reset
CLK (4MHz)

16 G 15 14 G

IC203
17 G
13
80 51
12 81 50

IC205
18 G 11

MICP MICM
10
G
9
IC201
8
7 100
6
IC202 31
30
1
G

IC204
1 2 G 3 4 5 G
G

73
KX-TC1709LBB

31.2. Flow Solder Side View

74
 KX-TC1709LBB

M
KXTC1709LBB-AK
75 Printed in Japan