THERMAL INTERFACE MATERIALS

Giuseppe Caramella TCS Thermal – AEI EIMEA

AGENDA

01 Thermal management intro 04 Definition of requirements

02 Portfolio overview 05 Dispensing lab capability

03 Materials details

2
THERMAL MANAGEMENT – COOLING IS NEEDED
REMOVAL OF UNWANTED HEAT
 Heat generated by an electronic/electrical component affects:
 System reliability
 Product performance

 Limits design advances

 size requirements
 power density

More power and speed = more heat to remove per unit

volume.

3
WHAT IS THE PURPOSE OF A THERMAL INTERFACE
MATERIAL?
To minimize air-entrapments between two surfaces:
• Air: 0.025 W/(m.K)
• Polymers: 0.100 W/(m.K)
• Aluminium ~ 210 W/(m.K)
• Copper: ~ 400 W/(m.K)
• Ceramic Fillers: ~1000 W/(m.K)

Heat Sink
Our target: Fill the gap, replace the air, adapt to the
surfaces flatness and microscopic deviations TIM TIM
„As thin as possible – as thick as necessary“ Heat Source
4
 COMPOSITION OF A THERMAL INTERFACE MATERIAL
• Composite of polymer and filler to enable Cold
efficient phonon (heat) transfer

• Polymer (resin) imparts “soft” or adhesive nature Filler Polymer

• Filler imparts high Thermal Conductivity

Hot

5
 HENKEL THERMAL INTERFACE MATERIALS
PRODUCT PORTFOLIO
SIL PAD GAP PAD GAP FILLER Phase Change 1K GEL Thermal
Material Adhesives

Thin effective Thick effective Low stress, liquid Material changes 1k – Gel like Structural
TIM between and highly material for from solid to Gap Filling adhesive,
metal module conformable TIM interfacing liquid at certain Material removing the
housing and between metal fragile temperatures. Both pre-cured need for clips
components. module housing components Outstanding or cure-in- and other
Provides a and components. with high thermal place expensive
robust dielectric topography to impedance hardware.
interface to help metal module between
meet safety housing. components and
agency 2K versions metal module
housing
requirements

Complete portfolio of technological advanced solutions for thermal management

6
SIL-PAD
GENERAL DESCRIPTION
• Rigid, pre-cured thin pad used between heat sink or
metal housing & components

• Silicone & Silicone free chemistry

• Electrically insulating & non-insulating

• Thermal Conductivity – 0.8 to 3.5 W/mK

• Can be automated for high throughput (Pick and

place ready)

• Die cut to any configuration

• No standoff required

• Screw / Clip mount

• Easy Rework
7
SIL-PAD
PRODUCT PORTFOLIO

Thermally Conductive Compound

Carrier

Thermally Conductive Compound

Note: Not to scale or color
SIL-PAD
SUPPLY FORM
Sheets
 Standard Sheet Size 12" x 12“ (300x300mm)
 All Thickness

Punched Parts
 Standard and Custom Part Sizes
 All Sil-Pads & Thickness
 Piece Parts or in Piece Sheet Form

Rolls
 Rolls offered on Standard 3” Cores
 Standard Roll Widths: 1" to 12"

9
GAP PAD
GENERAL DESCRIPTION

 Soft pre-cured pad desined to fill gap

 Silicone and silicone free chemistry
 Thickness range from 0.25mm – 6.5mm
 Thermal conductivity (0.8 – 12.0) W/m-K
 Highly conformable TIM, used between heat sink/metal
housing & components
 Electrically insulating
 Die cut to any configuration
 No expensive equipment required to apply the parts
 Naturally tacky (sticky) on one side or both sides to assist
assembly process
 Easy to re-work

10
GAP PAD
PRODUCT PORTFOLIO Gap Pad Portfolio

Silicone Silicone Free

Sil-Pad Polyimide Fiberglass PEN No Base Fiberglass PET

Base Base Base Base (unsupported) Base Base

TGP1000VO TGP1000HD TGPHC1000 TGP1350

TGP1500 TGP1100SF TGP2202SF

TGP1000VOS TGP1500R
TGP3500ULM TGP2200SF TGP3004SF

TGP1000VOUS TGPA2000
TGP7000ULM
TGP2000 Clear PET liner: removable
TGP EMI1000
Base-Coat
TGP10000ULM
TGP2600
Up-Coat
TGPHC3000/ TGP12000ULM
HC5000

Blue diamond liner:

TGP6000ULM removable

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 GAP PAD
SUPPLY FORM

Sheets
 Standard Sheet Size 8" x16“ (200x400mm)
 All Gap Pads & Thickness

Punched Parts
 Standard and Custom Part Sizes
 All Gap Pads & Thickness
 Piece Parts or in Piece Sheet Form
 2K LIQUID GAP FILLER
 Cure-in-place liquid gap filling material
 Silicone and Silicone free chemistry
 Thermal Conductivity - 1.0 to 7.0W/m-K
 Ultra conformable and excellent wet-out for better heat
dissipation
 Requires precision metering/mixing, 1:1 ratio
 High throughput via automation
 One part-number to fit multiple applications
 Reduced stress on component during assembly

Pad Liquid

WASTE
Better wet-out with liquids
Lower thermal resistance Less waste due to optimized dispensing pattern
Improved thermal performance
2K LIQUID GAP FILLER
PRODUCT PORTFOLIO

2K Liquid Gap Fillers

Standard Low Slump Self Silicone

Silicone Volatility Resistance Leveling Free

TGF 1000 TGF1500LVO TGF1000SR TGF1400SL TGF1100SF

TGF 1500 TGF3500LVO TGF 3010APS

TGF 2000

TGF 3600

TGF 4000

TGF 4500CVO

TGF 7000
Manual dispensing
 2K LIQUID GAP FILLER
PACKAGING AND MIXING
50 / (200) / 400 cc Kits = MixPac 6, 7 + 10 gal Kits = NamPac design
2 x 600 = 1200 cc Kit : Semco
(Sulzer) or Sempac (Semco)
Standard
standard

1-to-1 Static Mixing Nozzles available

for all cartridge sizes
1K GEL GAP FILLER

 Cure in place or pre cured 1K Gel

 Silicone and silicone free chemistry
 Thermal Conductivity – 2.0-6.0 W/m-K
 Ultra low stress on components during assembly
 Consistent rheology over shelf life
 Optimized rheology to achieve good flow rate
Gap Filler  Excellent reworkability

Better wet-out with liquids

Lower thermal resistance
Improved thermal performance

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1K GEL GAP FILLER
PRODUCT PORTFOLIO

1K GEL

Manual dispensing
Pre cured Curable

Silicone base Silicone base Silicone free

TLF LF2000 TLF 3500CGEL TLF 4500CGEL-SF

TLF LF3500

TLF LF3800LVO

TLF LF5800LVO

TLF LF6000

Automated dispensing
1K GEL
SUPPLY FORM

30 Kits = EFD Optimum 600 cc Kit : Semco Standard 1-5 gal metal pail
PHASE CHANGE MATERIALS (PCM)

 Phase Change Materials (PCM) are wax-like thermal

compounds that goes from solid to liquid at a specific
temperature (450 – 600C)
 It is typically used for bond line thickness < 250µm
 Thermal Conductivity - 0.45 – 3.4 W/m-K
 It comes in film with/without carrier and printable paste
 It provides a very low thermal impedance and extremely
good wetting properties.
 No “pump-out” of the interface during thermal cycling
Spring Clip
 It requires constant pressure in application
PHASE CHANGE MATERIAL
PRODUCT PORTFOLIO

THF- Bergquist brand

PCM TCF/TCP – Loctite brand

Electrically Isolating Non-Electrically Isolating

Fiberglass PEN Polyimide Aluminum No Substrate Dryable

Substrate Substrate Substrate Substrate Paste

THF 1600G THF 500 THF 1500P THF 900 THF 700UT TCP 4000 D

THF 1600P TCF 1000 THF 3000UT TCP 4000 P

EIF 1000 THF 100F-AC TCF 4000 PXF TCP 7000

TCF 2000
PHASE CHANGE MATERIAL
SUPPLY FORM
Sheets
 Standard Sheet Size 12" x 12“ (300x300mm)
 All Thickness

Punched Parts
 Standard and Custom Part Sizes
 All Thickness
 Piece Parts or in Piece Sheet Form

Rolls
 Rolls offered on Standard 3” Cores
 Standard Roll Widths: 1" to 12“

Cartridges
 500g /12oz. Semco
THERMAL ADHESIVE
 Thermal Adhesives are a class of TIM
 Silicone and silicone free chemistry
 Available in films, laminate and paste
 Thermal Conductivity - 0.8-3.5 W/m-K
 They eliminate the need for mechanical fasteners
such as clips, springs, and screws
 They also offer elastic properties which assist in
relieving CTE mismatches

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 TLB – THERMALLY ADHESIVES
PRODUCT PORTFOLIO
Thermal Adhesives

Room Heat cure

temperature cure

Liquid adhesives Laminated

Acrylic-based PSA tape tape
activator cure
One component Two component
Shimming Non shimming TBP400P TBP 1400LMS HD

TLB SA1000 TLB EA1800

Loctite 383 Loctite 315
TBP800
TLB SA1800 TLB SA2005RT
Loctite 384 Loctite 3873
TBP850
TLB SA2000 TLB SA3500
Loctite 3874 Loctite 3876

Loctite
Loctite 3875 Ablestik 281

Loctite Ablestik
TE3530 23
NOMENCLATURE GUIDE
TSP Thermal Sil Pad Autopsy of product name
TGP Thermal Gap Pad

TGF Thermal Gap Filler BERGQUIST Gap Filler TGF 3500 LVO
TLF Thermal LiquiForm

Low volatile
2K Liquid
TLB Thermal LiquiBond
TC=3.5
Thermal BondPly
Brand
TBP
THF Thermal HiFlow
BERGQUIST LiquiForm TLF 3500CGEL
TCF Thermal Conductive Film

Curable gel
TCP Thermal Conductive Paste 1K GEL
TC=3.5
TGR Thermal Grease

-SF Sil Free Chemistry

-SL Self leveling

-SR Slump resistance
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 HOW TO SELECT A TIM
1. What is the total heat/power of the hot component you are trying to cool? (Watts)
System 2. Minimum and maximum use temperature? (In application? Shipping/storage?
Thermal Other?)
Conductivity, impedance 3. Bond line thickness with tolerance?
Mechanical
4. What are the dimensions and shape of the TIM (XY)?
BLT, tolerance, assembly
5. What are the two components the TIM is between?
Electrical
6. Is the TIM held in place by mechanical fasteners (screws/clips/chassis)?
Isolation, strength
Physics 7. Is elimination of mechanical fasteners desirable or feasible?
Use temperature, chemistry 8. If the application is a constant pressure fastener how much pressure?
9. Is electrical conductivity required? Is electrical isolation required to prevent a non-
isolated package from short circuit?
Process
Manual, robotic 10. Does the solution require UL94 testing and certification? To what certification
level? (HB, V2, V1, V0)
Logistic
11. Silicone allowed?
Packaging, storage
12. Outgassing requirements?
Commercial 13. What is the reliability requirements? (thermal cycles/shocks conditions, vibrations…)
Price, contract 14. Type of application process – manual, automatic, dispensing, printing
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IN-HOUSE DISPENSING CAPABILITY
GLOBAL Musashi

Equipment Model Pail Cartridge

Rampf DC-CNC

Scheugenpflug Dos A280

Nordson Servo-Flo801
Asmytek
Second SEC-400EDS- DV-8000
X
Automation W

Asmytek DV-8000 X

PVA 1GPU-Delta6

AeroJet
Musashi X
Superjet
C500, PC
Graco
pump
2K Viscoduo
Viscotec X
VM
THANK YOU