CC3301, CC3300

SWRS310A – MARCH 2023 – REVISED APRIL 2023

CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

– Easy to design with 40-pin, 5-mm x 5-mm quad
1 Features flat noleaded (QFN) package, 0.4-mm pitch
Key Features
• Wi-Fi 6 (802.11ax)
• Bluetooth low energy 5.3 in CC33x1 devices
• Companion IC to any processor or MCU host
capable of running a TCP/IP stack
• Integrated 2.4-GHz PA for complete wireless
solution with up to +20-dBm output power.
• Operating temperature: -40°C to +105°C
• Application throughput up to 50 Mbps

ADVANCE INFORMATION
Extended Features
• Wi-Fi 6
– 2.4 GHz, 20 MHz, single spatial stream
– MAC, baseband, and RF transceiver with
support for IEEE 802.11 b/g/n/ax
– Target wake time (TWT), OFDMA, MU-MIMO
(Downlink), Basic Service Set Coloring, and
trigger frame for improved efficiency
– Hardware-based encryption and decryption
supporting WPA2 and WPA3
– Excellent interoperability
– Support for 4 bit SDIO or SPI host interfaces
• Bluetooth Low Energy 5.3
– LE Coded PHYs (Long Range), LE 2M PHY
(High Speed) and Advertising Extension
– Host controller interface (HCI) transport with
option for UART or shared SDIO
• Enhanced Security
– Secured host interface
– Firmware authentication
– Anti-rollback protection
• Multirole support (for example, concurrent STA and
AP) to connect with Wi-Fi devices on different RF
channels (Wi-Fi networks)
• Optional antenna diversity or selection
• 3-wire or 1-wire PTA for external coexistence with
additional 2.4-GHz radios (for example, Thread or
Zigbee)
• Power Management
– VMAIN, VIO, Vpp: 1.8 V
– VPA: 3.0 V to 4.2 V
• Clock Sources
– 40-MHz XTAL fast clock
– Internal LFOSC or external 32.768-kHz slow
clock
• Small Package Size

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change
without notice.
 CC3301, CC3300
SWRS310A – MARCH 2023 – REVISED APRIL 2023 www.ti.com

2 Applications
• Grid Infrastructure
– Electricity Meter
– String Inverter
– Micro Inverter
– Energy Storage Power Conversion System
(PCS)
– EV Charging Infrastructure
• Building and Home Automation
– HVAC Controller
– HVAC Gateway
– Thermostat
– Building Security Gateway
ADVANCE INFORMATION

– Garage door system

– IP network camera/ Video doorbell
– Wireless security camera
• Appliances
– Refrigerator & freezer
– Oven
– Washer & dryer
– Residential water heater & heating system
– Air purifier & humidifier
– Coffee machine
– Air conditioner indoor unit
– Vacuum robot
– Robotic lawn mower
• Medical
– Infusion pump
– Electronic hospital bed & bed control
– Multiparameter patient monitor
– Blood pressure monitor
– CPAP machine
– Telehealth systems
– Ultrasound scanner
– Ultrasound smart probe
– Electric toothbrush
• Retail Automation and Payment
• Printers

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3 Description
The SimpleLink™ Wi-Fi CC33xx family of devices is where affordability meets reliability, enabling engineers
to connect more applications with confidence. CC33xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.3
devices. The CC3300 and CC3301 are the first devices in this pin to pin compatible family.
• CC3300: A 2.4GHz Wi-Fi 6 companion IC.
• CC3301: A 2.4GHz Wi-Fi 6 and Bluetooth low energy 5.3 companion IC.
The CC330x offers the latest standards from Wi-Fi and BLE while maintaining compatibility with Wi-Fi 4 (802.11
b/g/n) and Wi-Fi 5 (802.11ac). These CC330x are the 10th-generation connectivity combo chip from Texas
Instruments. As such, the CC330x is based upon proven technology. These devices are ideal for use in cost-
sensitive embedded applications with a Linux or RTOS host running TCP/IP, CC330x brings the efficiency of
Wi-Fi 6 to embedded device applications for the internet of things (IoT), with a small PCB footprint and highly
optimized bill of materials.

ADVANCE INFORMATION
Device Information
PART NUMBER Wi-Fi 2.4-GHz SISO Bluetooth Low Energy
CC3300ENJARSBR ✔
CC3301ENJARSBR ✔ ✔

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SWRS310A – MARCH 2023 – REVISED APRIL 2023 www.ti.com

4 System Diagram
Figure 4-1 shows a basic system diagram for the CC3301.
CC330x Wi-Fi and BLE Companion IC

Interfaces Wi-Fi & BLE Core

SDIO / SPI
DMA Crypto ELP

UART
Wi-Fi BLE
MAC / Modem MAC / Modem
Coexistence
ADVANCE INFORMATION

2.4 GHz Wi-Fi / BLE RF

Antenna Diversity

nReset 2.4 GHz

System ANT

Power
Execution / Data
User OTP Packet RAM
RAM
Clock

CC3301 only

Figure 4-1. CC3301 High-Level System Diagram

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Table of Contents
1 Features............................................................................1 4 System Diagram.............................................................. 4
2 Applications..................................................................... 2 5 Revision History.............................................................. 5
3 Description.......................................................................3 6 Mechanical, Packaging, and Orderable Information.... 6

5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from March 16, 2023 to April 24, 2023 (from Revision * (*) to Revision A (April 2023)) Page
• Updated features list.Updated numbering format for tables, figures, and cross-references throughout
the document......................................................................................................................................................1

ADVANCE INFORMATION
• Updated system diagram....................................................................................................................................4

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SWRS310A – MARCH 2023 – REVISED APRIL 2023 www.ti.com

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
ADVANCE INFORMATION

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PACKAGE OUTLINE
RSB0040B SCALE 3.000
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

5.15
B A
4.85

PIN 1 INDEX AREA

5.15
4.85

ADVANCE INFORMATION
0.8
0.7
C

SEATING PLANE
0.05 0.08 C
0.00

2X 3.6
SYMM (0.2) TYP
EXPOSED
THERMAL PAD 11 20

10 21

SYMM 41
2X 3.6 3.5 0.1

1 30
36X 0.4
0.25
40 31 40X
PIN 1 ID 0.15
0.1 C A B
0.5
40X 0.05
0.3
4219094/A 11/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

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SWRS310A – MARCH 2023 – REVISED APRIL 2023 www.ti.com

EXAMPLE BOARD LAYOUT

RSB0040B WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

( 3.5)
SYMM
40 31 SEE SOLDER MASK
40X (0.6) DETAIL

40X (0.2) 1 30

36X (0.4)
(0.9) TYP
ADVANCE INFORMATION

(R0.05) TYP (0.6) TYP

41
SYMM (4.8)

( 0.2) TYP
VIA

10 21

11 20
(0.6) TYP (0.9) TYP
(4.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 20X
0.05 MIN
0.05 MAX ALL AROUND
ALL AROUND
METAL UNDER
METAL EDGE SOLDER MASK

EXPOSED METAL SOLDER MASK EXPOSED SOLDER MASK

OPENING METAL OPENING

NON SOLDER MASK

DEFINED SOLDER MASK DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4219094/A 11/2018
NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.

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EXAMPLE STENCIL DESIGN

RSB0040B WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

(1.2) TYP
40 31
40X (0.6)

40X (0.2) 1 30

36X (0.4)

ADVANCE INFORMATION
(1.2) TYP
(R0.05) TYP
41
SYMM (4.8)

METAL
TYP

10 21

11 20
SYMM
9X (1)

(4.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL
SCALE: 20X

EXPOSED PAD 41
73% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

4219094/A 11/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

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 PACKAGE OPTION ADDENDUM

www.ti.com 19-Apr-2023

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

XCC3300ENJARSBR ACTIVE WQFN RSB 40 3000 TBD Call TI Call TI -40 to 105 Samples

XCC3301ENJARSBR ACTIVE WQFN RSB 40 3000 TBD Call TI Call TI -40 to 105 Samples

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 19-Apr-2023

Addendum-Page 2
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