Features

• Compatible with MCS-51™ Products

• 2K Bytes of Reprogrammable Flash Memory
– Endurance: 1,000 Write/Erase Cycles
• 2.7V to 6V Operating Range
• Fully Static Operation: 0 Hz to 24 MHz
• Two-level Program Memory Lock
• 128 x 8-bit Internal RAM
• 15 Programmable I/O Lines
• Two 16-bit Timer/Counters
•
•
Six Interrupt Sources
Programmable Serial UART Channel
8-bit
•
•
Direct LED Drive Outputs
On-chip Analog Comparator
Microcontroller
• Low-power Idle and Power-down Modes
with 2K Bytes
Description Flash
The AT89C2051 is a low-voltage, high-performance CMOS 8-bit microcomputer with
2K bytes of Flash programmable and erasable read only memory (PEROM). The
device is manufactured using Atmel’s high-density nonvolatile memory technology AT89C2051
and is compatible with the industry-standard MCS-51 instruction set. By combining a
versatile 8-bit CPU with Flash on a monolithic chip, the Atmel AT89C2051 is a power-
ful microcomputer which provides a highly-flexible and cost-effective solution to many
embedded control applications.
The AT89C2051 provides the following standard features: 2K bytes of Flash, 128
bytes of RAM, 15 I/O lines, two 16-bit timer/counters, a five vector two-level interrupt
architecture, a full duplex serial port, a precision analog comparator, on-chip oscillator
and clock circuitry. In addition, the AT89C2051 is designed with static logic for opera-
tion down to zero frequency and supports two software selectable power saving
modes. The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial
port and interrupt system to continue functioning. The power-down mode saves the
RAM contents but freezes the oscillator disabling all other chip functions until the next
hardware reset.

Pin Configuration

PDIP/SOIC

RST/VPP 1 20 VCC
(RXD) P3.0 2 19 P1.7
(TXD) P3.1 3 18 P1.6
XTAL2 4 17 P1.5
XTAL1 5 16 P1.4
(INT0) P3.2 6 15 P1.3
(INT1) P3.3 7 14 P1.2
(TO) P3.4 8 13 P1.1 (AIN1)
(T1) P3.5 9 12 P1.0 (AIN0)
GND 10 11 P3.7

Rev. 0368E–02/00

1
Block Diagram

2 AT89C2051
 AT89C2051

Pin Description Each machine cycle takes 12 oscillator or clock cycles.

XTAL1
VCC
Input to the inverting oscillator amplifier and input to the
Supply voltage.
internal clock operating circuit.
GND
XTAL2
Ground.
Output from the inverting oscillator amplifier.
Port 1
Port 1 is an 8-bit bi-irectional I/O port. Port pins P1.2 to Oscillator Characteristics
P1.7 provide internal pullups. P1.0 and P1.1 require exter-
XTAL1 and XTAL2 are the input and output, respectively,
nal pullups. P1.0 and P1.1 also serve as the positive input
of an inverting amplifier which can be configured for use as
(AIN0) and the negative input (AIN1), respectively, of the
an on-chip oscillator, as shown in Figure 1. Either a quartz
on-chip precision analog comparator. The Port 1 output
crystal or ceramic resonator may be used. To drive the
buffers can sink 20 mA and can drive LED displays directly.
device from an external clock source, XTAL2 should be left
When 1s are written to Port 1 pins, they can be used as
unconnected while XTAL1 is driven as shown in Figure 2.
inputs. When pins P1.2 to P1.7 are used as inputs and are
There are no requirements on the duty cycle of the external
externally pulled low, they will source current (IIL) because
clock signal, since the input to the internal clocking circuitry
of the internal pullups.
is through a divide-by-two flip-flop, but minimum and maxi-
Port 1 also receives code data during Flash programming mum voltage high and low time specifications must be
and verification. observed.

Port 3 Figure 1. Oscillator Connections

Port 3 pins P3.0 to P3.5, P3.7 are seven bi-irectional I/O
pins with internal pullups. P3.6 is hard-wired as an input to
the output of the on-chip comparator and is not accessible
as a general purpose I/O pin. The Port 3 output buffers can
sink 20 mA. When 1s are written to Port 3 pins they are
pulled high by the internal pullups and can be used as
inputs. As inputs, Port 3 pins that are externally being
pulled low will source current (IIL) because of the pullups.
Port 3 also serves the functions of various special features
of the AT89C2051 as listed below:

Port Pin Alternate Functions

P3.0 RXD (serial input port) Note: C1, C2 = 30 pF ± 10 pF for Crystals
P3.1 TXD (serial output port) = 40 pF ± 10 pF for Ceramic Resonators

P3.2 INT0 (external interrupt 0) Figure 2. External Clock Drive Configuration

P3.3 INT1 (external interrupt 1)
P3.4 T0 (timer 0 external input)
P3.5 T1 (timer 1 external input)

Port 3 also receives some control signals for Flash pro-

gramming and verification.

RST
Reset input. All I/O pins are reset to 1s as soon as RST
goes high. Holding the RST pin high for two machine
cycles while the oscillator is running resets the device.

3
Special Function Registers
A map of the on-chip memory area called the Special Func- random data, and write accesses will have an indetermi-
tion Register (SFR) space is shown in the table below. nate effect.
Note that not all of the addresses are occupied, and unoc- User software should not write 1s to these unlisted loca-
cupied addresses may not be implemented on the chip. tions, since they may be used in future products to invoke
Read accesses to these addresses will in general return new features. In that case, the reset or inactive values of
the new bits will always be 0.
Table 1. AT89C2051 SFR Map and Reset Values

0F8H 0FFH

0F0H B 0F7H
00000000
0E8H 0EFH

0E0H ACC 0E7H

00000000
0D8H 0DFH

0D0H PSW 0D7H

00000000
0C8H 0CFH

0C0H 0C7H

0B8H IP 0BFH
XXX00000
0B0H P3 0B7H
11111111
0A8H IE 0AFH
0XX00000
0A0H 0A7H

98H SCON SBUF 9FH

00000000 XXXXXXXX
90H P1 97H
11111111
88H TCON TMOD TL0 TL1 TH0 TH1 8FH
00000000 00000000 00000000 00000000 00000000 00000000
80H SP DPL DPH PCON 87H
00000111 00000000 00000000 0XXX0000

4 AT89C2051
 AT89C2051

Restrictions on Certain Instructions Program Memory Lock Bits

The AT89C2051 and is an economical and cost-effective On the chip are two lock bits which can be left unpro-
member of Atmel’s growing family of microcontrollers. It grammed (U) or can be programmed (P) to obtain the
contains 2K bytes of flash program memory. It is fully com- additional features listed in the table below:
pati bl e with the MCS-51 arc hitec tur e, and c an be
programmed using the MCS-51 instruction set. However,
there are a few considerations one must keep in mind Lock Bit Protection Modes(1)
when utilizing certain instructions to program this device. Program Lock Bits
All the instructions related to jumping or branching should LB1 LB2 Protection Type
be restricted such that the destination address falls within
1 U U No program lock features.
the physical program memory space of the device, which is
2K for the AT89C2051. This should be the responsibility of 2 P U Further programming of the Flash
the software programmer. For example, LJMP 7E0H is disabled.
would be a valid instruction for the AT89C2051 (with 2K of 3 P P Same as mode 2, also verify is
memory), whereas LJMP 900H would not. disabled.
Note: 1. The Lock Bits can only be erased with the Chip Erase
1. Branching instructions:
operation.
LCALL, LJMP, ACALL, AJMP, SJMP, JMP @A+DPTR
These unconditional branching instructions will execute
correctly as long as the programmer keeps in mind that the Idle Mode
destination branching address must fall within the physical In idle mode, the CPU puts itself to sleep while all the on-
boundaries of the program memory size (locations 00H to chip peripherals remain active. The mode is invoked by
7FFH for the 89C2051). Violating the physical space limits software. The content of the on-chip RAM and all the spe-
may cause unknown program behavior. cial functions registers remain unchanged during this
CJNE [...], DJNZ [...], JB, JNB, JC, JNC, JBC, JZ, JNZ With mode. The idle mode can be terminated by any enabled
these conditional branching instructions the same rule interrupt or by a hardware reset.
above applies. Again, violating the memory boundaries P1.0 and P1.1 should be set to “0” if no external pullups are
may cause erratic execution. used, or set to “1” if external pullups are used.
For applications involving interrupts the normal interrupt It should be noted that when idle is terminated by a hard-
service routine address locations of the 80C51 family archi- ware reset, the device normally resumes program
tecture have been preserved. execution, from where it left off, up to two machine cycles
before the internal reset algorithm takes control. On-chip
2. MOVX-related instructions, Data Memory: hardware inhibits access to internal RAM in this event, but
The AT89C2051 contains 128 bytes of internal data mem- access to the port pins is not inhibited. To eliminate the
ory. Thus, in the AT89C2051 the stack depth is limited to possibility of an unexpected write to a port pin when Idle is
128 bytes, the amount of available RAM. External DATA terminated by reset, the instruction following the one that
memory access is not supported in this device, nor is exter- invokes Idle should not be one that writes to a port pin or to
nal PROGRAM memory execution. Therefore, no MOVX external memory.
[...] instructions should be included in the program.
A typical 80C51 assembler will still assemble instructions, Power-down Mode
even if they are written in violation of the restrictions men-
tioned above. It is the responsibility of the controller user to In the power down mode the oscillator is stopped, and the
know the physical features and limitations of the device instruction that invokes power down is the last instruction
being used and adjust the instructions used executed. The on-chip RAM and Special Function Regis-
correspondingly. ters retain their values until the power down mode is
terminated. The only exit from power down is a hardware
reset. Reset redefines the SFRs but does not change the
on-chip RAM. The reset should not be activated before VCC
is restored to its normal operating level and must be held
active long enough to allow the oscillator to restart and
stabilize.
P1.0 and P1.1 should be set to “0” if no external pullups are
used, or set to “1” if external pullups are used.

5
Programming The Flash the next cycle may begin. Data Polling may begin any time
after a write cycle has been initiated.
The AT89C2051 is shipped with the 2K bytes of on-chip
Ready/Busy: The Progress of byte programming can also
PEROM code memory array in the erased state (i.e., con-
be monitored by the RDY/BSY output signal. Pin P3.1 is
tents = FFH) and ready to be programmed. The code
pulled low after P3.2 goes High during programming to indi-
memory array is programmed one byte at a time. Once the
cate BUSY. P3.1 is pulled High again when programming is
array is programmed, to re-program any non-blank byte,
done to indicate READY.
the entire memory array needs to be erased electrically.
Program Verify: If lock bits LB1 and LB2 have not been
Internal Address Counter: The AT89C2051 contains an
programmed code data can be read back via the data lines
internal PEROM address counter which is always reset to
for verification:
000H on the rising edge of RST and is advanced by apply-
1. Reset the internal address counter to 000H by bringing
ing a positive going pulse to pin XTAL1.
RST from “L” to “H”.
Programming Algorithm: To program the AT89C2051,
2. Apply the appropriate control signals for Read Code data
the following sequence is recommended. and read the output data at the port P1 pins.
1. Power-up sequence:
3. Pulse pin XTAL1 once to advance the internal address
Apply power between VCC and GND pins
counter.
Set RST and XTAL1 to GND
4. Read the next code data byte at the port P1 pins.
2. Set pin RST to “H”
Set pin P3.2 to “H” 5. Repeat steps 3 and 4 until the entire array is read.
3. Apply the appropriate combination of “H” or “L” logic The lock bits cannot be verified directly. Verification of the
levels to pins P3.3, P3.4, P3.5, P3.7 to select one of the lock bits is achieved by observing that their features are
programming operations shown in the PEROM Pro- enabled.
gramming Modes table. Chip Erase: The entire PEROM array (2K bytes) and the
To Program and Verify the Array: two Lock Bits are erased electrically by using the proper
4. Apply data for Code byte at location 000H to P1.0 to combination of control signals and by holding P3.2 low for
P1.7. 10 ms. The code array is written with all “1”s in the Chip
5. Raise RST to 12V to enable programming. Erase operation and must be executed before any non-
6. Pulse P3.2 once to program a byte in the PEROM array blank memory byte can be re-programmed.
or the lock bits. The byte-write cycle is self-timed and Reading the Signature Bytes: The signature bytes are
typically takes 1.2 ms. read by the same procedure as a normal verification of
7. To verify the programmed data, lower RST from 12V to locations 000H, 001H, and 002H, except that P3.5 and
logic “H” level and set pins P3.3 to P3.7 to the appropiate P3.7 must be pulled to a logic low. The values returned are
levels. Output data can be read at the port P1 pins. as follows.
8. To program a byte at the next address location, pulse (000H) = 1EH indicates manufactured by Atmel
XTAL1 pin once to advance the internal address (001H) = 21H indicates 89C2051
counter. Apply new data to the port P1 pins.
9. Repeat steps 5 through 8, changing data and advancing
the address counter for the entire 2K bytes array or until Programming Interface
the end of the object file is reached. Every code byte in the Flash array can be written and the
10.Power-off sequence: entire array can be erased by using the appropriate combi-
set XTAL1 to “L” nation of control signals. The write operation cycle is self-
set RST to “L” timed and once initiated, will automatically time itself to
Turn VCC power off completion.
Data Polling: The AT89C2051 features Data Polling to All major programming vendors offer worldwide support for
indicate the end of a write cycle. During a write cycle, an the Atmel microcontroller series. Please contact your local
attempted read of the last byte written will result in the com- programming vendor for the appropriate software revision.
plement of the written data on P1.7. Once the write cycle
has been completed, true data is valid on all outputs, and

6 AT89C2051
 AT89C2051

Flash Programming Modes

Mode RST/VPP P3.2/PROG P3.3 P3.4 P3.5 P3.7
(1)(3)
Write Code Data 12V L H H H

Read Code Data(1) H H L L H H

Write Lock Bit - 1 12V H H H H

Bit - 2 12V H H L L

Chip Erase 12V (2) H L L L

Read Signature Byte H H L L L L

Notes: 1. The internal PEROM address counter is reset to 000H on the rising edge of RST and is advanced by a positive pulse at
XTAL 1 pin.
2. Chip Erase requires a 10 ms PROG pulse.
3. P3.1 is pulled Low during programming to indicate RDY/BSY.

Figure 3. Programming the Flash Memory Figure 4. Verifying the Flash Memory

PP

7
Flash Programming and Verification Characteristics
TA = 0°C to 70°C, VCC = 5.0 ± 10%
Symbol Parameter Min Max Units
VPP Programming Enable Voltage 11.5 12.5 V
IPP Programming Enable Current 250 µA
tDVGL Data Setup to PROG Low 1.0 µs
tGHDX Data Hold after PROG 1.0 µs
tEHSH P3.4 (ENABLE) High to VPP 1.0 µs
tSHGL VPP Setup to PROG Low 10 µs
tGHSL VPP Hold after PROG 10 µs
tGLGH PROG Width 1 110 µs
tELQV ENABLE Low to Data Valid 1.0 µs
tEHQZ Data Float after ENABLE 0 1.0 µs
tGHBL PROG High to BUSY Low 50 ns
tWC Byte Write Cycle Time 2.0 ms
tBHIH RDY/BSY\ to Increment Clock Delay 1.0 µs
tIHIL Increment Clock High 200 ns
Note: 1. Only used in 12-volt programming mode.

Flash Programming and Verification Waveforms

8 AT89C2051
 AT89C2051

Absolute Maximum Ratings*

Operating Temperature ................................. -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
Storage Temperature ..................................... -65°C to +150°C age to the device. This is a stress rating only and
functional operation of the device at these or any
Voltage on Any Pin other conditions beyond those indicated in the
with Respect to Ground .....................................-1.0V to +7.0V operational sections of this specification is not
implied. Exposure to absolute maximum rating
Maximum Operating Voltage ............................................ 6.6V conditions for extended periods may affect device
reliability.
DC Output Current...................................................... 25.0 mA

DC Characteristics
TA = -40°C to 85°C, VCC = 2.0V to 6.0V (unless otherwise noted)
Symbol Parameter Condition Min Max Units
VIL Input Low-voltage -0.5 0.2 VCC - 0.1 V
VIH Input High-voltage (Except XTAL1, RST) 0.2 VCC + 0.9 VCC + 0.5 V
VIH1 Input High-voltage (XTAL1, RST) 0.7 VCC VCC + 0.5 V
VOL Output Low-voltage(1) IOL = 20 mA, VCC = 5V 0.5 V
(Ports 1, 3) IOL = 10 mA, VCC = 2.7V

VOH Output High-voltage IOH = -80 µA, VCC = 5V ± 10% 2.4 V

(Ports 1, 3)
IOH = -30 µA 0.75 VCC V
IOH = -12 µA 0.9 VCC V
IIL Logical 0 Input Current VIN = 0.45V -50 µA
(Ports 1, 3)
ITL Logical 1 to 0 Transition Current VIN = 2V, VCC = 5V ± 10% -750 µA
(Ports 1, 3)
ILI Input Leakage Current 0 < VIN < VCC ±10 µA
(Port P1.0, P1.1)
VOS Comparator Input Offset Voltage VCC = 5V 20 mV
VCM Comparator Input Common 0 VCC V
Mode Voltage
RRST Reset Pull-down Resistor 50 300 KΩ
CIO Pin Capacitance Test Freq. = 1 MHz, TA = 25°C 10 pF
ICC Power Supply Current Active Mode, 12 MHz, VCC = 6V/3V 15/5.5 mA
Idle Mode, 12 MHz, VCC = 6V/3V 5/1 mA
P1.0 & P1.1 = 0V or VCC
Power-down Mode(2) VCC = 6V P1.0 & P1.1 = 0V or VCC 100 µA
VCC = 3V P1.0 & P1.1 = 0V or VCC 20 µA
Notes: 1. Under steady state (non-transient) conditions, IOL must be externally limited as follows:
Maximum IOL per port pin: 20 mA
Maximum total IOL for all output pins: 80 mA
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater
than the listed test conditions.
2. Minimum VCC for Power-down is 2V.

9
External Clock Drive Waveforms

External Clock Drive

VCC = 2.7V to 6.0V VCC = 4.0V to 6.0V
Symbol Parameter Min Max Min Max Units
1/tCLCL Oscillator Frequency 0 12 0 24 MHz
tCLCL Clock Period 83.3 41.6 ns
tCHCX High Time 30 15 ns
tCLCX Low Time 30 15 ns
tCLCH Rise Time 20 20 ns
tCHCL Fall Time 20 20 ns

10 AT89C2051
 AT89C2051

()

Serial Port Timing: Shift Register Mode Test Conditions

VCC = 5.0V ± 20%; Load Capacitance = 80 pF
12 MHz Osc Variable Oscillator
Symbol Parameter Min Max Min Max Units
tXLXL Serial Port Clock Cycle Time 1.0 12tCLCL µs
tQVXH Output Data Setup to Clock Rising Edge 700 10tCLCL-133 ns
tXHQX Output Data Hold after Clock Rising Edge 50 2tCLCL-117 ns
tXHDX Input Data Hold after Clock Rising Edge 0 0 ns
tXHDV Clock Rising Edge to Input Data Valid 700 10tCLCL-133 ns

Shift Register Mode Timing Waveforms

AC Testing Input/Output Waveforms(1) Float Waveforms(1)

Note: 1. AC Inputs during testing are driven at VCC - 0.5V for a Note: 1. For timing purposes, a port pin is no longer floating
logic 1 and 0.45V for a logic 0. Timing measurements when a 100 mV change from load voltage occurs. A
are made at VIH min. for a logic 1 and VIL max. for a port pin begins to float when 100 mV change frothe
logic 0. loaded VOH/VOL level occurs.

11
 AT89C2051
TYPICAL ICC - ACTIVE (85°C)
20
Vcc=6.0V

I 15
C Vcc=5.0V
C 10
Vcc=3.0V
m
A 5

0
0 6 12 18 24
FREQUENCY (MHz)

AT89C2051
TYPICAL ICC - IDLE (85°C)
3
Vcc=6.0V

I
C 2 Vcc=5.0V
C

m 1
A
Vcc=3.0V

0
0 3 6 9 12
FREQUENCY (MHz)

AT89C2051
TYPICAL ICC vs. VOLTAGE- POWER DOWN (85°C)
20

I 15
C
C 10

µ
A 5

0
3.0V 4.0V 5.0V 6.0V
Vcc VOLTAGE

Notes: 1. XTAL1 tied to GND for ICC (power-down)

2. P.1.0 and P1.1 = VCC or GND
3. Lock bits programmed

12 AT89C2051
 AT89C2051

Ordering Information

Speed Power
(MHz) Supply Ordering Code Package Operation Range
12 2.7V to 6.0V AT89C2051-12PC 20P3 Commercial
AT89C2051-12SC 20S (0°C to 70°C)
AT89C2051-12PI 20P3 Industrial
AT89C2051-12SI 20S (-40°C to 85°C)
24 4.0V to 6.0V AT89C2051-24PC 20P3 Commercial
AT89C2051-24SC 20S (0°C to 70°C)
AT89C2051-24PI 20P3 Industrial
AT89C2051-24SI 20S (-40°C to 85°C)

Package Type
20P3 20-lead, 0.300” Wide, Plastic Dual In-line Package (PDIP)
20S 20-lead, 0.300” Wide, Plastic Gull Wing Small Outline (SOIC)

13
Packaging Information
20P3, 20-lead, 0.300" Wide, Plastic Dual Inline 20S, 20-lead, 0.300" Wide, Plastic Gull WIng Small
Package (PDIP) Outline (SOIC)
Dimensions in Inches and (Millimeters) Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-001 AD

1.060(26.9) 0.020 (0.508)

.980(24.9) PIN 0.013 (0.330)
1

.280(7.11) 0.299 (7.60) 0.420 (10.7)

.240(6.10) 0.291 (7.39) 0.393 (9.98)
PIN 1

.090(2.29)
.900(22.86) REF MAX
.050 (1.27) BSC
.210(5.33) .005(.127)
MAX MIN

SEATING
PLANE 0.513 (13.0)
0.497 (12.6) 0.105 (2.67)
.150(3.81) .015(.381) MIN 0.092 (2.34)

.115(2.92) .022(.559)
.014(.356)
.070(1.78)
.110(2.79) 0.012 (0.305)
.045(1.13)
.090(2.29) 0.003 (0.076)

.325(8.26)
.300(7.62)
0
REF 0.013 (0.330)
0 REF 8
0.009 (0.229)
.014(.356) 15
.008(.203)
0.035 (0.889)
.430(10.92) MAX 0.015 (0.381)

14 AT89C2051
 Atmel Headquarters Atmel Operations
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© Atmel Corporation 2000.

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0368E–02/00/xM