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    Hybrid Integration - Cluster 1

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    nur afiqah
    Hybrid integration involves electrically connecting chip devices of various functions onto an insulating substrate with previously deposited conductors. Hybrid microcircuits are classified as thin or thick film based on the fabrication process. They are used where high density, low volume, and low weight are required, and are more versatile than printed circuit boards for small to moderate production quantities. Examples of hybrid applications include analog to digital converters and test equipment.

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    Hybrid Integration - Cluster 1

    Uploaded by

    nur afiqah
    39 views8 pages
    Hybrid integration involves electrically connecting chip devices of various functions onto an insulating substrate with previously deposited conductors. Hybrid microcircuits are classified as thin or thick film based on the fabrication process. They are used where high density, low volume, and low weight are required, and are more versatile than printed circuit boards for small to moderate production quantities. Examples of hybrid applications include analog to digital converters and test equipment.

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    Hybrid Integration_Cluster 1

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    Hybrid integration involves electrically connecting chip devices of various functions onto an insulating substrate with previously deposited conductors. Hybrid microcircuits are classified as thin or thick film based on the fabrication process. They are used where high density, low volume, and low weight are required, and are more versatile than printed circuit boards for small to moderate production quantities. Examples of hybrid applications include analog to digital converters and test equipment.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    39 views8 pages

    Hybrid Integration - Cluster 1

    Uploaded by

    nur afiqah
    Hybrid integration involves electrically connecting chip devices of various functions onto an insulating substrate with previously deposited conductors. Hybrid microcircuits are classified as thin or thick film based on the fabrication process. They are used where high density, low volume, and low weight are required, and are more versatile than printed circuit boards for small to moderate production quantities. Examples of hybrid applications include analog to digital converters and test equipment.

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    of 8

    HYBRID

    INTEGRATION
    Zulhelmi Ismail
    Hybrid Integration 2

    CONDUCTOR
    ❑ Conductivity is a
    function of the
    number of free
    electrons and their
    mobility.
    ❑ Conductors
    conduct electricity
    readily because they
    have many free and
    mobile electrons
    available to carry
    the current.
    Hybrid Integration 3

    INSULATOR
    ❑ At the other end of
    the spectrum from
    conductors are the
    insulators, which
    are very poor
    conductors of
    electricity.
    ❑ Their valence
    electrons are
    tightly bound and
    not free to move
    within the
    structure.
    Hybrid Integration 4

    SEMICONDUCTOR
    ❑ Materials that are
    intermediate in
    their conductivities
    between insulators
    and conductors are
    known as
    semiconductors.
    ❑ the Si-Si bond
    strength (43
    kcaVmol) is far
    weaker than the C-
    C bond strength
    (83 kcaVmol)
    Hybrid Integration 5

    HYBRID INTEGRATION
    Hybrid circuits are
    circuits in which chip
    devices of various
    functions are electrically
    interconnected on an
    insulating substrate on
    which conductors
    or combinations of
    conductors and resistors
    have previously been
    deposited.
    Hybrid microcircuits are
    often classified as either
    thin film or thick
    film based on the
    process used to fabricate
    the interconnect
    substrate.
    Hybrid Integration 6

    HYBRID INTEGRATION
    Hybrid microcircuits are
    used in applications
    where high density, low
    volume, and low weight
    are required for an
    electronic system.
    Without these
    constraints, printed
    wiring boards with
    solder-attached pre-
    packaged components
    are more economical.
    Hybrid Integration 7

    HYBRID INTEGRATION
    The development of
    masks and requirements
    for expensive equipment
    and special cleanroom
    facilities and controls
    make custom IC
    manufacture feasible only
    for high-volume
    production.
    The hybrid-circuit
    approach is more
    versatile and suitable for
    small to- moderate
    production quantities of
    many different circuit
    types. Hybrids are also
    more suited to custom
    circuits than are ICs.
    Hybrid Integration 8

    APPLICATIONS
    Analog-to-digital (A/D)
    converters are the closest
    thing to a “standard”
    product that the hybrid
    industry has. Hybrid
    technology allows the very
    best monolithic IC to be
    combined with high-
    accuracy laser trimmed
    thin-film resistors to provide
    the most accurate circuit.
    Still another area in which
    hybrids are extensively used
    is in electrical test
    equipment. The Tektronix
    2400 series of oscilloscopes
    employ eleven custom
    Hybrids circuits.

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