EPOXY RESINS

Product Overview Guide

NORTH AMERICA
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Dow is a global supplier of epoxy resins, diluents, curing agents, and intermediates.
With more than 50 years of innovation, we offer advanced epoxy products and solutions
based on the industry’s leading product and process technology. And, as one of the most
vertically-integrated epoxy suppliers, we are a highly reliable source of supply.

Dow is committed to your success. To better assist you during each stage of
formulation development, we have compiled this convenient overview of resin
products available in North America. Use it in combination with product information for
our robust line of epoxy hardeners to compare product options and decide which Dow
products provide the performance required in your applications.

Talk to your Dow representative to learn more about

how Dow can provide the products and support you
need to strengthen system differentiation and your
competitive position in the marketplace.

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Resins from Dow

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 1
Calculation of Stoichiometric Ratios Equation 1
To calculate the Amine H equivalent Amine H eq wt = MW of amine
To obtain optimum properties with poly- weight, use the following equation: no. of active hydrogens
functional epoxide-reactive curing agents, Example
particularly the amines, it is desirable to react Amine H eq wt D.E.H. 20 = 103.2 = 20.6 gr/eq
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the resin and the curing agent at approximately

2
stoichiometric quantities. To determine the Equation 2
ratio required, calculations can be made as To calculate the stoichiometric ratio of phr1 of amine = Amine H eq wt x 100
D.E.H.™ 20 hardener to use with D.E.R.™ 331 Epoxide eq wt of resin
follows, using D.E.H.™ 20 epoxy hardener epoxy resin having an epoxide equivalent Example
(NH2 – CH2 – CH2 – NH – CH2 – CH2 – NH2) as weight of 189: phr D.E.H. 20 hardener to be used with D.E.R. 331 epoxy resin
an example:
phr = 20.6 x 100 = 10.9
189

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Equation 3
Frequently, epoxy resins are blended, EEW of mix = Total Wt
filled, or modified with reactive and Wt a + Wt b + Wt c
non-reactive components. It is therefore EEW a EEW b EEW c
necessary to adjust the concentration of
the curing agent to cure only the portion Total weight includes all materials, both reactive and
of the mix that is reactive; e.g., the resins non-reactive. a,b,c, etc., are only the materials reactive with
and any reactive diluent present. This the curing agent, and are characterized by an epoxy ring.
may be simply done by calculating the
epoxide equivalent weight (EEW) of the Example
total mix and then applying equation (2) to 100 parts D.E.R. 331 Average EEW 189
determine the amount of curing agent to 100 parts D.E.R. 337 Average EEW 240
add to 100 parts of formulation. 30 parts BDDGE (diluent) Average EEW 130
230 parts Filler –
460 Total

EEW of mix = 460 = 460 = 391

100 + 100 + 30 1.176
189 240 130
By Equation 2
Amount D.E.H. 20 = 20.6 x 100 = 5.27 parts per hundred
391 parts filled formulation

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Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow 1 Parts by wt per 100 parts resin

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Resins from Dow

Liquid Epoxy Resins

Grade EEW Viscosity Description

(gr/eq) (mPa.s @ 25 °C)
Bisphenol A Epoxy Resins
D.E.R.™ 332 171 – 175 4000 – 6000 High purity diglycidyl ether of bisphenol A. Its high purity and low oligomer content assures uniform performance,
exceptionally low viscosity and can provide improved elevated temperature properties over standard epoxy resins.
This resin grade is mainly used in filament winding, electrical laminates and encapsulation applications.
D.E.R. 383 176 – 183 9000 – 10500 D.E.R. 383 epoxy resin is a low viscosity bisphenol A epoxy resin. Applications are similar to those of D.E.R. 331 liquid
epoxy resin. D.E.R. 383 epoxy resin frequently crystallizes at room temperature. Heating to 50-55°C restores the resin
to a liquid state. Long-term warm storage may result in a slight discoloration but does not affect the resin performance.

D.E.R. 330 176 – 185 7000 – 10000 D.E.R. 330 epoxy resin is a low viscosity bisphenol A epoxy resin commonly used in civil engineering and industrial
coatings. D.E.R. 330 epoxy resin frequently crystallizes at room temperature, Heating to 50-55°C restores the resin
to liquid state. Long-term warm storage may result in slight discoloration but does not effect the resin performance.
D.E.R. 331 182 – 192 11000 – 14000 A widely used, general-purpose liquid epoxy resin based on bisphenol A. It is recognized as a standard from which
many variations have been developed.
D.E.R. 317 192 – 203 16000 – 25000 High viscosity, fast reacting bisphenol A epoxy resin.
Modified Bisphenol A Epoxy Resins
D.E.R. 321 180 – 188 500 – 700 Diglycidylether of bisphenol A/CGE.
D.E.R. 3212 179 – 193 750 – 1400 Diglycidylether of bisphenol A/CGE.
D.E.R. 322 183 – 193 5500 – 8500 Diglycidylether of bisphenol A/reactive diluent.
D.E.R. 323 190 – 204 1000 – 1200 Aliphatic glycidyl ether reactive diluent, modified liquid epoxy resin which is very similar to D.E.R. 324 liquid epoxy resin
but with lower diluent content.
D.E.R. 324 195 – 204 600 – 800 D.E.R. 324 liquid epoxy resin offers low viscosity and low surface tension. The low surface tension explains why this
resin wets the surface better, gives better adhesion and will have slightly lower viscosity at any given filler loading. The
diluent increases pot-life, flexibility (impact resistance) and acid resistance, but limits the solvent resistance. D.E.R. 324
liquid epoxy resin is prone to crystallization.
D.E.R. 325 185 – 206 850 – 2800 Diglycidylether of bisphenol A/AGE.
D.E.R. 329 145 – 155 900 – 1300 Diglycidylether of bisphenol A/TMPTGE.
D.E.R 362 185 – 205 4500 – 6500 Modified liquid epoxy resin.
XZ 92742.00 160 – 180 500 – 700 Diglycidylether of bisphenol A/BDDGE.

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Liquid Epoxy Resins (cont.)

Grade EEW Viscosity Description

(gr/eq) (mPa.s @ 25 °C)
Modified Bisphenol A/F Epoxy Resins
D.E.R.™ 353 190 – 200 800 – 1000 D.E.R. 353 liquid epoxy resin is a low viscosity epoxy resin with a very low crystallization tendency. The performance
of D.E.R. 353 in ambient cure formulations is similar to those obtained when using D.E.R. 324 liquid epoxy resin.
Bisphenol F Epoxy Resins
D.E.R. 354 167 – 174 3400 – 4200 Standard bisphenol F-based epoxy resin of low viscosity, used for solvent-free coatings, concrete reinforcements,
adhesives, electrical insulation and filament winding. This resin can provide improved resistance performance against
solvents compared to standard bisphenol A liquid epoxy resins.
Flexible Epoxy Resins
D.E.R. 736 175 – 205 30 – 60 D.E.R. 736 is a short chain length polyglycol di-epoxide liquid resin. Its applications include coatings and adhesives
for improved flexibility, elongation, and impact resistance.
D.E.R. 732 310 – 330 60 – 70 D.E.R. 732 is a long chain length polyglycol di-epoxide liquid resin. Its applications include coatings and adhesives
for improved flexibility, elongation, and impact resistance.
D.E.R. 750 176 – 186 2500 – 4500 Diglycidylether of bisphenol A/flexible epoxy resin.
D.E.R. 3913 345 – 365 7500 – 9500 D.E.R. 3913 epoxy resin is designed to impart flexibility into epoxy binder systems. In combination with suitable
curing agents, high elongations at break can be achieved, at room temperature as well as at -20 °C.

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Resins from Dow

Epoxy Emulsions and Dispersions

Grade EEW (gr/eq) Solids Content Description

on solids (wt%)
D.E.R.TM 917 193 – 204 63 – 65 Aqueous liquid epoxy resin emulsion of the D.E.R. 331 liquid epoxy resin type. This material is suitable for coatings on
metallic substrates, coating on concrete and also in concrete ad-mixtures (i.e. epoxy cement concrete). Note that the
use of water-borne systems requires some control of atmospheric conditions (temperature and humidity) to develop
optimum performance and appearance.
D.E.R. 916 184 – 204 57 – 59 Aqueous semi-solid epoxy novolac resin emulsion of the D.E.N.TM 438 epoxy novolac resin type. This
product can produce highly cross-linked matrices, providing excellent heat and chemical resistance similar
to solvent-borne novolac resins.
D.E.R. 915 475 – 500 46 – 48 Experimental aqueous solid “1-type“ epoxy resin dispersion of the D.E.R. 671 solid epoxy resin type. This resin
emulsion is not only suggested for corrosion protection applications on steel but can also be used for coatings on
concrete where solvent cannot be tolerated.

Epoxy Toughening Agents and Toughened Epoxy Resins

Grade EEW Viscosity Description

(gr/eq) (mPa.s @ 25 °C)
FORTEGRATM 100 Epoxy N/A 3000 – 4000 FORTEGRA 100 epoxy toughener is a low viscosity toughening agent, designed for use in amine cured
Toughening Agent epoxy systems.
FORTEGRA 102 345 – 374 5000 – 8000 Blend of bisphenol A liquid epoxy resin (50 wt%) and a block copolymer toughening agent (50 wt%).
Toughened Epoxy Resin
FORTEGRA 104 960 – 1060 N/A Blend of bisphenol A solid epoxy resin (88 wt%) and FORTEGRA 100 (12 wt%).
Toughened Epoxy Resin
FORTEGRA 201 315 – 360 150,000 – 230,000 Blend of bisphenol A liquid epoxy resin and a carboxyl terminated butadiene-acrylonitrile elastomer (40 wt%).
Toughened Epoxy Resin
FORTEGRA 301 200 – 225 ~70,000 Blend of bisphenol A liquid epoxy resin and core shell rubber particles (15 wt%).
Toughened Epoxy Resin

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Resins from Dow

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Epoxy Novolac Resins

Grade EEW on solids Viscosity Description

(gr/eq) (mPa.s @ 25 °C)
D.E.N.TM 425 169 – 175 9500 – 12500 D.E.N. 425 epoxy novolac resin has an average functionality of 2.5.
D.E.N. 431 172 – 179 1100 – 17001 D.E.N. 431 epoxy novolac resin has multi-epoxy functionality (± 2.8) which makes it useful in adhesives, electrical
and structural laminates, coatings and castings for elevated temperature service. D.E.N. 431 will exhibit high
chemical resistance and excellent elevated temperature performance. Adhesives based on D.E.N. 431 are ideal
binders for abrasives in grinding and polishing products.
D.E.N. 438 176 – 181 31000 – 400001 D.E.N. 438 is a widely used, general-purpose epoxy novolac resin. It is recognized as a standard for high temperature
applications. D.E.N. 438 has multi-epoxy functionality (± 3.6).
D.E.N. 438L 176 – 181 27500 – 325001 Slightly lower viscosity version of D.E.N. 438.
D.E.N. 438-A85 176 – 181 500 – 1200 Solution of D.E.N. 438 in acetone.
D.E.N. 438-EK85 176 – 181 600 – 1600 Solution of D.E.N. 438 in methyl ethyl ketone.
D.E.N. 438-MAK80 176 – 181 600 – 1200 Solution of D.E.N. 438 in methyl n-amyl ketone.
D.E.N. 438-MK75 176 – 181 200 – 600 Solution of D.E.N. 438 in methyl isobutyl ketone.
D.E.N. 438-X80 176 – 181 1200 – 2000 Solution of D.E.N. 438 in xylene.
D.E.N. 439 191 – 210 15000 – 35000 2
D.E.N. 439 is a widely used, general-purpose epoxy novolac resin. It has multi-epoxy functionality (±3.8) which is
slightly higher than D.E.N. 438 epoxy novolac resin.
D.E.N. 439-EK85 191 – 210 4000 – 10000 Solution of D.E.N. 439 in methyl ethyl ketone.

Brominated Resins

Grade EEW on solids Viscosity Description

(gr/eq) (mPa.s @ 25 °C)
D.E.R.TM 530-A80 425 – 440 1500 – 2500 Brominated epoxy resin in acetone.
D.E.R. 538-A80 465 – 495 800 – 1800 Brominated epoxy resin in acetone.
D.E.R. 542 305 – 355 N/A Solid epoxy resin of the tetrabromo bisphenol A epichlorohydrin type. Softening point: 52 – 62˚C.
D.E.R. 560 440 – 470 140 – 2153 Solid brominated epoxy resin.
D.E.R. 592-A80 350 – 370 1000 – 2400 Brominated epoxy resin in acetone.
D.E.R. 593 350 – 370 400 – 1100 Brominated epoxy resin in DOWANOLTM PM glycol ether.

1
at 51.7 °C
2
at 71 °C
3
at 150 °C
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Resins from Dow

Solid Epoxy Resins

Grade EEW Softening Point Description

(gr/eq) (°C)
Low Molecular Weight Solids
D.E.R.TM 661 500 – 560 75 – 85 D.E.R. 661 solid epoxy resin is a standard “1-type“ epoxy resin. Formulated with suitable hardeners it forms an excellent
base for many high quality chemical-resistant coatings withstanding exposure to corrosive atmospheres.
D.E.R. 6116 520 – 560 80 – 90 Low molecular weight “1.5-type“ epoxy resin.
D.E.R. 662E 590 – 630 87 – 93 D.E.R. 662E solid epoxy resin is a standard “2-type“ epoxy resin developed for use mainly in powder coatings where it
provides excellent flow.
D.E.R. 6224 675 – 725 88 – 98 Low molecular weight “2.5-type“ epoxy resin.
D.E.R. 662UH 675 – 750 90 – 98 Low molecular weight “2.5-type“ epoxy resin.
D.E.R. 663U 730 – 820 92 – 102 Low molecular weight “3-type“ epoxy resin.
D.E.R. 663UE 740 – 800 98 – 104 Low molecular weight “3-type“ epoxy resin for both pure epoxy and epoxy/polyester powder coatings requiring good gloss,
smoothness and excellent flexibility.
D.E.R 664 875 – 955 100 – 110 Low molecular weight “4-type“ epoxy resin. Non-powder grade solid epoxy resin catalyzed for esterification.
D.E.R. 664U 875 – 955 100 – 110 Medium molecular weight “4-type“ epoxy resin for both decorative and functional coatings.
D.E.R. 664UE 860 – 930 104 – 110 Medium molecular weight “4-type“ epoxy resin for both decorative and functional coatings to provide improved viscosity
characteristics and greater flexibility.
Specialty Solids
D.E.R. 6330-A10 780 – 900 98 – 106 Low molecular weight solid epoxy resin containing 10 wt% polyacrylate flow modifier.
D.E.R. 642U 500 – 560 89 – 97 Novolac-modified, medium molecular weight solid epoxy resin for functional powder coatings requiring high chemical
resistance.
D.E.R. 672U 740 – 830 110 – 120 Novolac-modified, high molecular weight solid epoxy resin for more flexible, corrosion-resistant epoxy powder coatings.
D.E.R. 6225 650 – 725 87 – 95 Modified bisphenol A solid epoxy resin for high flow, high gloss powder coatings.
D.E.R. 6508 380 – 420 95 – 105 High temperature performance solid epoxy resin for fusion-bonded epoxy powder coatings.
High Molecular Weight Solids
D.E.R. 6155 1250 – 1400 30000 – 550001 High molecular weight “5-type“ epoxy resin.
D.E.R. 667E 1600 – 1950 2000 – 2900 2
High molecular weight “7-type“ epoxy resin with good solution stability.
D.E.R. 668-20 2000 – 3500 2700 – 50002 High molecular weight “8-type“ epoxy resin designed for use in one pack stoving enamels for metal decoration,
interior and exterior can coatings, tube and drum linings, coil primers and many other industrial applications.
D.E.R. 669-20 3500 – 5500 4400 – 100002 High molecular weight “9-type“ epoxy resin.
(solution visc.)
D.E.R. 669E 2500 – 4000 4500 – 100002 High molecular weight “9-type“ epoxy resin with good solution stability.
1
at 150 °C
2
40 wt% in diethylene glycol monobutyl ether
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Resins from Dow

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Epoxy Resin Solutions

Grade EEW (gr/eq) Viscosity Description

on solids (mPa.s @ 25 °C)

D.E.R.TM 337-DA97 230 – 278 N/A Solution of D.E.R. 337 with diacetone alchohol.
D.E.R. 337-X80 230 – 260 500 – 1200 Solution of D.E.R. 337 in xylene.
D.E.R. 337-X90 230 – 250 5000 – 15000 Solution of D.E.R. 337 in xylene.
D.E.R. 338-X90 230 – 280 5000 – 50000 Solution in xylene.
D.E.R. 660-B80 300 – 350 2300 – 7500 Semi-solid epoxy resin solution of D.E.R. 660 in butanol.
D.E.R. 660-MAK80 300 – 350 1000 – 1500 Semi-solid epoxy resin solution of D.E.R. 660 in methyl n-amyl ketone.
D.E.R. 660-PA80 300 – 350 1500 – 4500 Semi-solid epoxy resin solution of D.E.R. 660 in propyl acetate.
D.E.R. 660-X80 300 – 335 3500 – 7000 Semi-solid epoxy resin solution of D.E.R. 660 in xylene.
D.E.R. 661-A75 500 – 550 800 – 2500 Solution of D.E.R. 661 in acetone.
D.E.R. 661-A80 475 – 575 3500 – 8500 Solution of D.E.R. 661 in acetone.
D.E.R. 671-MAK75 425 – 550 3000 – 15000 Solution of D.E.R. 671 in methyl n-amyl ketone.
D.E.R. 671-PM75 425 – 500 9500 – 15000 Solution of D.E.R. 671 in DOWANOLTM PM glycol ether.
D.E.R. 671-T75 425 – 550 2200 – 10000 Solution of D.E.R. 671 in toluene.
D.E.R. 671-X70 445 – 500 2000 – 4000 Solution of D.E.R. 671 in xylene.
D.E.R. 671-X75 430 – 480 7500 – 11500 Solution of D.E.R. 671 in xylene.
D.E.R. 671-XM75 425 – 550 2500 – 9000 Solution of D.E.R. 671 in xylene/methyl isobutyl ketone.
D.E.R. 684-EK40 2800 min. 600 – 25001 Solution of an ultra-high molecular weight epoxy resin. It has essentially no epoxy functionality and provides
coatings with outstanding physical and chemical resistance properties by solvent evaporation alone. Main
applications include maintenance- and flash-primers, shop coats, wire enamels, road markers and clear
coatings for brass, chrome and aluminium.

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cSt
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