ESP8685-WROOM-06: Datasheet

ESP8685-WROOM-06
Datasheet
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2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 5 module
Built around ESP8685 series of SoC, RISC-V single-core microprocessor
2 MB or 4 MB flash in chip package
15 or 5 GPIOs
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On-board PCB antenna
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ESP8685-WROOM-06
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Pre-release v0.7
Espressif Systems
Copyright © 2023
www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://espressif.com/sites/default/files/documentation/esp8685-wroom-06_datasheet_en.pdf
1.1 Features
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CPU and On-Chip Memory • 802.11mc FTM
• ESP8685H2 or ESP8685H4 embedded, 32-bit Bluetooth®

RISC-V single-core processor, up to 160 MHz
• Bluetooth LE: Bluetooth 5, Bluetooth mesh
• 384 KB ROM
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• 400 KB SRAM (16 KB for cache)
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• Advertising extensions
• 8 KB SRAM in RTC
• 2 MB or 4 MB flash in chip package • Multiple advertisement sets
Wi-Fi
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Peripherals
• IEEE 802.11 b/g/n-compliant
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• Center frequency range of operating channel: • GPIO, SPI, UART, I2C, I2S, remote control
2412 ~ 2484 MHz peripheral, LED PWM controller, general DMA
controller, TWAI® controller (compatible with ISO
• Supports 20 MHz, 40 MHz bandwidth in 2.4 GHz
11898-1, i.e. CAN Specification 2.0), USB
band
Serial/JTAG controller, temperature sensor, SAR
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• 1T1R mode with data rate up to 150 Mbps ADC, general-purpose timers, watchdog timers
• Wi-Fi Multimedia (WMM)

Integrated Components on Module
• TX/RX A-MPDU, TX/RX A-MSDU
• 40 MHz crystal oscillator
• Immediate Block ACK
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• Fragmentation and defragmentation Antenna Options

• Transmit opportunity (TXOP)
• On-board PCB antenna
• Automatic Beacon monitoring (hardware TSF)
Operating Conditions
• 4 × virtual Wi-Fi interfaces
• Simultaneous support for Infrastructure BSS in • Operating voltage/Power supply: 3.0 ~ 3.6 V
Station mode, SoftAP mode, Station + SoftAP
• Operating ambient temperature: –40 ~ 105 °C
mode, and promiscuous mode
Note that when ESP8685 series scans in Station
Test
mode, the SoftAP channel will change along with
the Station channel • HTOL/HTSL/uHAST/TCT/ESD
Espressif Systems 2 ESP8685-WROOM-06 Datasheet v0.7

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1 Module Overview
1.2 Description
ESP8685-WROOM-06 is a powerful, generic Wi-Fi and Bluetooth LE module. This module is an ideal choice for
smart homes, industrial automation, health care, consumer electronics, etc.
ESP8685-WROOM-06 can be mounted onto the surface of a PCB board via reflow soldering, or vertically
soldered to a PCB board via wave soldering. When surface mounted, the module has 15 available GPIOs; when
vertically soldered, the module has 5 available GPIOs.
ESP8685-WROOM-06 comes with an on-board PCB antenna.
The ordering information for ESP8685-WROOM-06 is as follows:
Table 1: ESP8685-WROOM-06 Ordering Information
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Module Ordering code Chip Embedded Module Dimensions (mm)
ESP8685-WROOM-06-H2 ESP8685H2
ESP8685-WROOM-06 15.8 × 20.3 × 2.7
ESP8685-WROOM-06-H4 ESP8685H4
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The ESP8685H2 chip and the ESP8685H4 chip fall into the same category, namely ESP8685 chip series.
ESP8685 series of chips have a 32-bit RISC-V single-core processor. They integrate a rich set of peripherals,
ranging from UART, I2C, I2S, remote control peripheral, LED PWM controller, general DMA controller, TWAI®
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controller, USB Serial/JTAG controller, temperature sensor, and ADC.
The ESP8685H2 chip and the ESP8685H4 chip vary only in the size of the flash in chip package. For details,
please refer to ESP8685 Series Comparison in ESP8685 Series Datasheet.
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1.3 Applications
• Smart Home – Smart watch and bracelet
– Light control – Over-the-top (OTT) devices

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– Smart button – Wi-Fi speaker
– Smart plug – Logger toys and proximity sensing toys
– Indoor positioning • Smart Agriculture

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• Industrial Automation – Smart greenhouse
– Industrial robot – Smart irrigation
– Mesh network – Agriculture robot
– Human machine interface (HMI) • Retail and Catering
– Industrial field bus – POS machines
• Health Care – Service robot
– Health monitor • Audio Device
– Baby monitor – Internet music players
• Consumer Electronics – Live streaming devices

1 Module Overview
– Internet radio players • Generic Low-power IoT Data Loggers
• Generic Low-power IoT Sensor Hubs
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Contents
Contents
1 Module Overview 2
1.1 Features 2
1.2 Description 3
1.3 Applications 3
2 Block Diagram 9
3 Pin Definitions 10
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3.1 Pin Layout 10
3.2 Pin Description 10
3.3 Strapping Pins 11
4 Electrical Characteristics 14
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4.1 Absolute Maximum Ratings 14
4.2 Recommended Operating Conditions 14
4.3 DC Characteristics (3.3 V, 25 °C) 14
4.4 Current Consumption Characteristics
4.4.1 RF Current Consumption in Active Mode
IN 15
15
4.4.2 Current Consumption in Other Modes 15
4.5 Wi-Fi Radio 16
4.5.1 Wi-Fi RF Standards
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16
4.5.2 Wi-Fi RF Transmitter (TX) Specifications 16
4.5.3 Wi-Fi RF Receiver (RX) Specifications 17
4.6 Bluetooth LE Radio 19
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications 19
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4.6.2 Bluetooth LE RF Receiver (RX) Specifications 20
5 Module Schematics 23
6 Peripheral Schematics 24
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7 Physical Dimensions and PCB Land Pattern 25

7.1 Physical Dimensions 25
7.2 Recommended PCB Land Pattern 26
8 Product Handling 28
8.1 Storage Conditions 28
8.2 Electrostatic Discharge (ESD) 28
8.3 Reflow Profile 28
8.4 Ultrasonic Vibration 29
8.5 Wave Soldering Profile 30
9 Related Documentation and Resources 31

Contents
Revision History 32
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List of Tables
List of Tables
1 ESP8685-WROOM-06 Ordering Information 3
2 Pin Definitions 11
3 Strapping Pins 12
4 Parameter Descriptions of Setup and Hold Times for the Strapping Pins 13
5 Absolute Maximum Ratings 14
6 Recommended Operating Conditions 14
7 DC Characteristics (3.3 V, 25 °C) 14
8 Current Consumption Depending on RF Modes 15
9 Current Consumption in Modem-sleep Mode 15
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10 Current Consumption in Low-Power Modes 15
10 Current Consumption in Low-Power Modes 16
11 Wi-Fi RF Standards 16
12 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 16
13 TX EVM Test 17
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14 RX Sensitivity 17
15 Maximum RX Level 18
16 RX Adjacent Channel Rejection 18
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Transmitter General Characteristics
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Transmitter Characteristics - Bluetooth LE 1 Mbps
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19 Transmitter Characteristics - Bluetooth LE 2 Mbps 19
20 Transmitter Characteristics - Bluetooth LE 125 Kbps 19
21 Transmitter Characteristics - Bluetooth LE 500 Kbps 20
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22 Receiver Characteristics - Bluetooth LE 1 Mbps 20
23 Receiver Characteristics - Bluetooth LE 2 Mbps 21
24 Receiver Characteristics - Bluetooth LE 125 Kbps 21
25 Receiver Characteristics - Bluetooth LE 500 Kbps 22
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List of Figures
List of Figures
1 ESP8685-WROOM-06 Block Diagram 9
2 Pin Layout (Top View) 10
3 Setup and Hold Times for the Strapping Pins 13
4 ESP8685-WROOM-06 Schematics 23
5 Peripheral Schematics 24
6 Physical Dimensions 25
7 Recommended PCB Land Pattern for SMD Soldering 26
8 Recommended PCB Land Pattern for Vertical Module Soldering 27
9 Reflow Profile 28
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10 Wave Soldering Profile 30
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2 Block Diagram
2 Block Diagram
40 MHz
3V3 Crystal Antenna
RF Matching
ESP8685
GPIOs
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SPI Flash
GND
Figure 1: ESP8685-WROOM-06 Block Diagram
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3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
Keepout Zone
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1 IO1 IO8 21
2 IO2 IO9 20
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3 NC IO10 19
4 NC EN 18
5 IO0
IN EPAD
NC 17
IO9
6 RX0 22 IO19 16
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7 TX0 IO18 15
IO3 IO7 IO6 IO4 IO5 GND 3V3

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8 9 10 11 12 13 14
Figure 2: Pin Layout (Top View)

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3.2 Pin Description

Pin Layout (Top View)
The module has 21 pins. See pin definitions in Table 2.
When the module is vertically soldered, only pin 8 ~14 are available.
For peripheral pin configurations, please refer to ESP8685 Series Datasheet.

3 Pin Definitions
Table 2: Pin Definitions
Name No. Type1 Function

IO1 1 I/O/T GPIO1, ADC1_CH1, XTAL_32K_N
IO2 2 I/O/T GPIO2, ADC1_CH2, FSPIQ
NC 3 — NC
NC 4 — NC
IO0 5 I/O/T GPIO0, ADC1_CH0, XTAL_32K_P
RX0 6 I/O/T GPIO20, U0RXD
TX0 7 I/O/T GPIO21, U0TXD
IO3 8 I/O/T GPIO3, ADC1_CH3, LED PWM
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IO7 9 I/O/T GPIO7, FSPID, MTDO, LED PWM
IO6 10 I/O/T GPIO6, FSPICLK, MTCK, LED PWM
IO4 11 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS, LED PWM
IO5 12 I/O/T GPIO5, ADC2_CH0, FSPIWP, MTDI, LED PWM
GND 13 P Ground
3V3 14 P Power supply
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IO18 15 I/O/T GPIO18, USB_D-
IO19 16 I/O/T GPIO19, USB_D+
NC 17 — NC
EN 18 I
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High: on, enables the chip.
Low: off, the chip powers off.
By default, this pin is internally pulled high.
IO10 19 I/O/T GPIO10, FSPICS0
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IO9 20 I/O/T GPIO9
IO8 21 I/O/T GPIO8
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P: power supply; I: input; O: output; T: high impedance.
2
This pin can be used as a test point.
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3.3 Strapping Pins

Note:
The content below is excerpted from Section Strapping Pins in ESP8685 Series Datasheet. For the strapping pin mapping
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between the chip and modules, please refer to Chapter 5 Module Schematics.
ESP8685 series has three strapping pins:
• GPIO2
• GPIO8
• GPIO9
Software can read the values of GPIO2, GPIO8 and GPIO9 from GPIO_STRAPPING field in GPIO_STRAP_REG
register.
During the chip’s system reset, the latches of the strapping pins sample the voltage level as strapping bits of ”0”
or ”1”, and hold these bits until the chip is powered down or shut down.

3 Pin Definitions
Types of system reset include:
• power-on reset
• RTC watchdog reset
• brownout reset
• analog super watchdog reset
• crystal clock glitch detection reset
By default, GPIO9 is connected to the internal weak pull-up resistor. If GPIO9 is not connected or connected to
an external high-impedance circuit, the latched bit value will be ”1”
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To change the strapping bit values, you can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP8685 series.
After reset, the strapping pins work as normal-function pins.
Table 3 lists detailed booting configurations of the strapping pins.
Table 3: Strapping Pins
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Booting Mode 1
Pin Default SPI Boot Download Boot
GPIO2
GPIO8
N/A
N/A
1
Don’t care
IN 1
1
Internal weak
GPIO9 1 0
pull-up
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Enabling/Disabling ROM Messages Print During Booting
Pin Default Functionality
When the value of eFuse field EFUSE_UART_PRINT_CONTROL is
0 (default), print is enabled and not controlled by GPIO8.
GPIO8 N/A 1, if GPIO8 is 0, print is enabled; if GPIO8 is 1, it is disabled.
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2, if GPIO8 is 0, print is disabled; if GPIO8 is 1, it is enabled.

3, print is disabled and not controlled by GPIO8.
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The strapping combination of GPIO8 = 0 and GPIO9 = 0 is invalid and will trigger unexpected be-
havior.
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Figure 3 shows the setup and hold times for the strapping pins before and after the CHIP_EN signal goes high.
Details about the parameters are listed in Table 4.

3 Pin Definitions
t0 t1
VIL_nRST
CHIP_EN
VIH
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Strapping pin
Figure 3: Setup and Hold Times for the Strapping Pins
Table 4: Parameter Descriptions of Setup and Hold Times for the Strapping Pins
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Min
Parameter Description
(ms)
t0 Setup time before CHIP_EN goes from low to high 0
t1
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Hold time after CHIP_EN goes high 3
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4 Electrical Characteristics
4.1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 5: Absolute Maximum Ratings
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Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
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TST ORE Storage temperature –40 105 °C
4.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol
VDD33
IV DD
Parameter
Power supply voltage
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Current delivered by external power supply
Min
3.0
0.5
Typ
3.3
—
Max
3.6
—
Unit
V
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TA Operating ambient temperature –40 — 105 °C
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4.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit

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CIN Pin capacitance — 2 — pF

1 1
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
1
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
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2 1
VOH High-level output voltage 0.8 × VDD — — V
2 1
VOL Low-level output voltage — — 0.1 × VDD V
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High-level source current (VDD = 3.3 V, VOH >=
IOH — 40 — mA
2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Pull-up resistor — 45 — kΩ
RP D Pull-down resistor — 45 — kΩ
1 1
VIH_nRST Chip reset release voltage 0.75 × VDD — VDD + 0.3 V
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VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD V
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VDD is the I/O voltage for pins of a particular power domain.
2
VOH and VOL are measured using high-impedance load.

4.4 Current Consumption Characteristics

With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section Low Power Management
in ESP8685 Series Datasheet.
4.4.1 RF Current Consumption in Active Mode
Table 8: Current Consumption Depending on RF Modes
Work mode Description Peak (mA)

802.11b, 1 Mbps, @20 dBm 340
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802.11g, 54 Mbps, @17.5 dBm 276
TX
802.11n, HT20, MCS7, @17 dBm 268
Active (RF working)
802.11n, HT40, MCS7, @16.5 dBm 200
802.11b/g/n, HT20 84
RX
802.11n, HT40 86
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The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
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The current consumption figures for in RX mode are for cases when the peripherals are dis-
abled and the CPU idle.
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Note:
The content below is excerpted from Section Power Consumption in Other Modes in ESP8685 Series Datasheet.
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4.4.2 Current Consumption in Other Modes
Table 9: Current Consumption in Modem-sleep Mode

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Typ
CPU Frequency
Mode Description All Peripherals Clocks All Peripherals Clocks
(MHz)
Disabled (mA) Enabled (mA)1
CPU is running 23 28
160
CPU is idle 16 21
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Modem-sleep2,3
CPU is running 17 22
80
CPU is idle 13 18
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In practice, the current consumption might be different depending on which peripherals are enabled.
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In Modem-sleep mode, Wi-Fi is clock gated.
3
In Modem-sleep mode, the consumption might be higher when accessing flash. For a flash rated at 80
Mbit/s, in SPI 2-line mode the consumption is 10 mA.
Table 10: Current Consumption in Low-Power Modes
Mode Description Typ (µA)

Light-sleep VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance 130

Table 10: Current Consumption in Low-Power Modes
Mode Description Typ (µA)

Deep-sleep RTC timer + RTC memory 5
Power off CHIP_EN is set to low level, the chip is powered off 1
4.5 Wi-Fi Radio

4.5.1 Wi-Fi RF Standards
Table 11: Wi-Fi RF Standards
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Name Description
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Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
11b: 1, 2, 5.5 and 11 Mbps
20 MHz 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
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Data rate
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna
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IN
Device should operate in the center frequency range allocated by regional regulatory authorities.
Target center frequency range is configurable by software.
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4.5.2 Wi-Fi RF Transmitter (TX) Specifications
Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 12.
Table 12: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
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Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 20.0 —
802.11b, 11 Mbps — 20.0 —
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802.11g, 6 Mbps — 19.5 —

802.11g, 54 Mbps — 17.5 —
802.11n, HT20, MCS0 — 18.5 —
802.11n, HT20, MCS7 — 17.0 —
802.11n, HT40, MCS0 — 18.0 —
802.11n, HT40, MCS7 — 16.5 —

Table 13: TX EVM Test
Min Typ SL1

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps, @20 dBm — –24.5 –10
802.11b, 11 Mbps, @20 dBm — –25 –10
802.11g, 6 Mbps, @19.5 dBm — –24.5 –5
802.11g, 54 Mbps, @17.5 dBm — –29.5 –25
802.11n, HT20, MCS0, @18.5 dBm — –25.5 –5
802.11n, HT20, MCS7, @17 dBm — –30 –27
802.11n, HT40, MCS0, @18 dBm — –28 –5
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802.11n, HT40, MCS7, @16.5 dBm — –30 –27
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SL stands for standard limit value.
4.5.3 Wi-Fi RF Receiver (RX) Specifications
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Table 14: RX Sensitivity
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps
IN — –98.0 —
802.11b, 2 Mbps — –96.0 —
802.11b, 5.5 Mbps — –93.0 —
802.11b, 11 Mbps — –88.6 —
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802.11g, 6 Mbps — –93.0 —
802.11g, 9 Mbps — –92.0 —
802.11g, 12 Mbps — –90.8 —
802.11g, 18 Mbps — –88.6 —
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802.11g, 24 Mbps — –85.6 —

802.11g, 36 Mbps — –82.0 —
802.11g, 48 Mbps — –78.0 —
802.11g, 54 Mbps — –76.4 —
802.11n, HT20, MCS0 — –93.0 —
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802.11n, HT20, MCS1 — –90.8 —

802.11n, HT20, MCS2 — –88.2 —
802.11n, HT20, MCS3 — –84.6 —
802.11n, HT20, MCS4 — –81.4 —
802.11n, HT20, MCS5 — –77.4 —
802.11n, HT20, MCS6 — –75.4 —
802.11n, HT20, MCS7 — –74.4 —
802.11n, HT40, MCS0 — –90.0 —
802.11n, HT40, MCS1 — –87.6 —
802.11n, HT40, MCS2 — –84.8 —
802.11n, HT40, MCS3 — –81.8 —
Cont’d on next page

Table 14 – cont’d from previous page

Min Typ Max
Rate
(dBm) (dBm) (dBm)
802.11n, HT40, MCS4 — –78.4 —
802.11n, HT40, MCS5 — –74.4 —
802.11n, HT40, MCS6 — –72.6 —
802.11n, HT40, MCS7 — –71.2 —
Table 15: Maximum RX Level
Min Typ Max
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Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 5 —
802.11b, 11 Mbps — 5 —
802.11g, 6 Mbps — 5 —
802.11g, 54 Mbps — 0 —
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802.11n, HT20, MCS0 — 5 —
802.11n, HT20, MCS7 — 0 —
802.11n, HT40, MCS0 — 5 —
802.11n, HT40, MCS7
IN — 0 —
Table 16: RX Adjacent Channel Rejection

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Min Typ Max
Rate
(dB) (dB) (dB)
802.11b, 1 Mbps — 35 —
802.11b, 11 Mbps — 35 —
802.11g, 6 Mbps — 31 —
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802.11g, 54 Mbps — 14 —
802.11n, HT20, MCS0 — 31 —
802.11n, HT20, MCS7 — 13 —
802.11n, HT40, MCS0 — 19 —
802.11n, HT40, MCS7 — 8 —
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4.6 Bluetooth LE Radio

4.6.1 Bluetooth LE RF Transmitter (TX) Specifications
Table 17: Transmitter General Characteristics
Parameter Min Typ Max Unit

RF transmit power — 0 — dBm
Gain control step — 3 — dB
RF power control range –24 — 20 dBm
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Table 18: Transmitter Characteristics - Bluetooth LE 1 Mbps
Parameter Description Min Typ Max Unit

F = F0 ± 2 MHz — –37.62 — dBm
In-band emissions F = F0 ± 3 MHz — –41.95 — dBm
F = F0 ± > 3 MHz — –44.48 — dBm
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∆ f 1avg — 245.00 — kHz
Modulation characteristics ∆ f 2max — 208.00 — kHz
∆ f 2avg /∆ f 1avg — 0.93 — —
Carrier frequency offset —
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|f0 − fn |n=2, 3, 4, ..k
—
—
–9.00
1.17
—
—
kHz
kHz
Carrier frequency drift |f1 − f0 | — 0.30 — kHz
|fn − fn−5 |n=6, 7, 8, ..k — 4.90 — kHz
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Table 19: Transmitter Characteristics - Bluetooth LE 2 Mbps

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F = F0 ± 4 MHz — –43.55 — dBm

F = F0 ± > 5 MHz — –47.00 — dBm
∆ f 1avg — 497.00 — kHz
Modulation characteristics ∆ f 2max — 398.00 — kHz
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∆ f 2avg /∆ f 1avg — 0.95 — —

Carrier frequency offset — — –9.00 — kHz
|f0 − fn |n=2, 3, 4, ..k — 0.46 — kHz
|fn − fn−5 |n=6, 7, 8, ..k — 6.80 — kHz
Table 20: Transmitter Characteristics - Bluetooth LE 125 Kbps

F = F0 ± 2 MHz — –37.90 — dBm


F = F0 ± > 3 MHz — –42.50 — dBm
∆ f 1avg — 252.00 — kHz
Modulation characteristics
∆ f 1max — 200.00 — kHz
|f0 − fn |n=1, 2, 3, ..k — 1.52 — kHz
|fn − fn−3 |n=7, 8, 9, ..k — 0.70 — kHz
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Table 21: Transmitter Characteristics - Bluetooth LE 500 Kbps

F = F0 ± 2 MHz — –37.90 — dBm
F = F0 ± > 3 MHz — –42.80 — dBm
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∆ f 2avg — 220.00 — kHz
Modulation characteristics
∆ f 2max — 205.00 — kHz
Carrier frequency drift |f0 − f3 |

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|f0 − fn |n=1, 2, 3, ..k —
—
1.37
1.09
—
—
kHz
kHz
|fn − fn−3 |n=7, 8, 9, ..k — 0.51 — kHz
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4.6.2 Bluetooth LE RF Receiver (RX) Specifications
Table 22: Receiver Characteristics - Bluetooth LE 1 Mbps

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Sensitivity @30.8% PER — — –96 — dBm

Maximum received signal @30.8% PER — — 5 — dBm
Co-channel C/I — — 8 — dB
F = F0 + 1 MHz — –4 — dB
F = F0 – 1 MHz — –3 — dB
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F = F0 + 2 MHz — –32 — dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz — –36 — dB
F ≥ F0 + 3 MHz (1)
— — — dB
F ≤ F0 – 3 MHz — –39 — dB
Image frequency — — –29 — dB
F = Fimage + 1 MHz — –38 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –34 — dB
30 MHz ~ 2000 MHz — –9 — dBm
2003 MHz ~ 2399 MHz — –18 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –16 — dBm
3000 MHz ~ 12.75 GHz — –6 — dBm


Intermodulation — — –44 — dBm
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Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz.
Table 23: Receiver Characteristics - Bluetooth LE 2 Mbps

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F = F0 + 2 MHz — –7 — dB
F = F0 – 2 MHz — –7 — dB
(1)
F = F0 + 4 MHz — — — dB
F = F0 – 4 MHz — –34 — dB
F ≥ F0 + 6 MHz — –39 — dB
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F ≤ F0 – 6 MHz — –39 — dB
IN
F = Fimage – 2 MHz
30 MHz ~ 2000 MHz
(2)
—
—
—
–17
—
—
dB
dBm
2003 MHz ~ 2399 MHz — –19 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –16 — dBm
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3000 MHz ~ 12.75 GHz — –22 — dBm
Intermodulation — — –40 — dBm
1
Refer to the value of Image frequency.
2
Refer to the value of Adjacent channel selectivity C/I when F = F0 + 2 MHz.
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Table 24: Receiver Characteristics - Bluetooth LE 125 Kbps

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F = F0 + 1 MHz — –6 — dB
F = F0 – 1 MHz — –5 — dB
F = F0 + 2 MHz — –40 — dB
F = F0 – 2 MHz — –42 — dB
F ≥ F0 + 3 MHz (1)
— — — dB
F ≤ F0 – 3 MHz — –46 — dB
1

Table 25: Receiver Characteristics - Bluetooth LE 500 Kbps

F = F0 + 1 MHz — –5 — dB
F = F0 – 1 MHz — –7 — dB
F = F0 + 2 MHz — –39 — dB
F = F0 – 2 MHz — –40 — dB
F ≥ F0 + 3 MHz (1)
— — — dB
RY
F ≤ F0 – 3 MHz — –40 — dB
1
A
IN
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EL
PR

Espressif Systems
5 Module Schematics
5 Module Schematics
This is the reference design of the module.
ESP8685 Core
PR The values of C1 and C2 vary with

the selection of the crystal.
GND
GND
GND
ESP8685-WROOM-06(pin-out)
U3 ESP8685-WROOM-06
3
U1
EL
SPI_CLK GPIO1 1 21 GPIO8 SPI_CS
GND XOUT
GND
The value of R1 varies with the actual IO1 IO8
C1 C2
PCB board. SPI_MOSI GPIO2 2 20 GPIO9 SPI_MISO
TBD TBD IO2 IO9
XIN
3 19 GPIO10 PWM
The value of L1 varies with the actual NC IO10
VDD33 PCB board. 4 18 CHIP_EN EN
2
NC EN
ADC GPIO0 5 17
IO0 NC
TBD
C3 C4 GND LOG_RX U0RXD 6 16 GPIO19 COM_RX
40MHz(±10ppm) U0RXD IO19
1uF 10nF LOG_TX U0TXD 7 15 GPIO18 COM_TX
R2 499(1%) U0TXD U0TXD IO18
VDD33 GND GND U0RXD
GND
3V3
R1
IO3
IO7
IO6
IO4
IO5
GND
L1 TBD GPIO19
10
11
12
13
14
C5 C6 C7
29
28
27
26
25
24
23
22
IM
10uF 0.1uF 0.1uF(NC)
GND
VDDA
VDDA
XTAL_P
GPIO19
XTAL_N
U0TXD
U0RXD
GPIO3
GPIO7
GPIO6
GPIO4
GPIO5
GND GND GND
ANT1
23
1 RF_ANT L3 TBD L2 TBD LNA_IN 1 21 GPIO18 GND VDD33

2 2 LNA_IN GPIO18 20
3 VDD3P3 NC 19 VDD33
VDD3P3 NC
PWM
PWM
PWM
PWM
PWM
PCB_ANT C16 C15 C8 C9 GPIO0 4 18
GND
XTAL_32K_P NC
3V3
TBD TBD TBD TBD GPIO1 5 17
GPIO2 6 XTAL_32K_N VDD3P3_CPU 16 GPIO10
VDD3P3_RTC
CHIP_EN 7 GPIO2 GPIO10 15 GPIO9
GND GND GND GND GND CHIP_EN GPIO9
C10
GPIO3
GPIO8
MTDO
MTMS
MTCK
The values of C8, L2, C9, C15, L3 and C16 vary with R3
MTDI
0.1uF
the actual PCB board. 10K
U2 ESP8685 VDD33
8
9
10
11
12
13
14
IN
NC: No component. VDD33 GND
VDD33
GPIO3 R9 10K Test Point
GPIO4
VDD33 GPIO5
GPIO6 C12 C13 D1
GPIO7 ESD
GPIO8 0.1uF TP1 GPIO9 10uF(NC)
R11
10K GND
GND GND
CHIP_EN
C14
ESP8685-WROOM-06 Datasheet v0.7
1uF
A
GND
Figure 4: ESP8685-WROOM-06 Schematics
RY
6 Peripheral Schematics
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
ESP8685-WROOM-06
22 GND
EPAD
IO1 1 21 IO8
IO1 IO8
IO2 2 20 IO9
IO2 IO9
J2
3 19 IO10
NC IO10 2
4 18 EN 1 2
NC EN 1
RY
GND
IO0 5 17 Boot Option
J1 IO0 NC
4 RX0 6 16 IO19 GND
4 3 RX0 IO19
3 2 TX0 7 15 IO18
2 1 TX0 IO18
GND
1
3V3
IO3
IO7
IO6
IO4
UART VDD33 IO5 U1

8
10
11
12
13
14
A
GND
3V3
IO3
IO7
IO6
IO4
IO5
VDD33
C2 C1
IN GND 0.1uF 10uF
GND GND
SW1
EN R2 0
IM
EN on the module is pulled up to VDD33 through a 10KΩ
C4 0.1uF
resistor, and connected to GND through a 1 uF capacitor.
GND
Figure 5: Peripheral Schematics

EL
• Soldering the EPAD to the ground of the base board is not a must, though doing so can get optimized
thermal performance. If you do want to solder it, please ensure that you apply the correct amount of
soldering paste. Too much soldering paste may increase the gap between the module and the baseboard.
As a result, the adhesion between other pins and the baseboard may be poor.
PR
• To ensure that the power supply to the ESP8685 chip is stable during power-up, it is advised to add an RC
delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C =
1 µF (such RC delay circuit has already been built into the module). However, specific parameters should
be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of
the chip.
For ESP8685’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in
ESP8685 Series Datasheet.

7 Physical Dimensions and PCB Land Pattern
7.1 Physical Dimensions
Unit: mm
2.70±0.15
15.80±0.15
1.00
5.57
14x1.52
RY
14x0.75
2.75
.3 5 0.475
20.30±0.15
12.35 R0
1.00
x 0.60
21
1.40
14x1.00
5.80
2.80
2.09
10.15
14x1.00
.50
Ø0
1.13
14.20
1.72 IO9
0.70
7.35
6.88
0.395
2xR
0.60
2.59
0.50
1.80 4.37
7x1.00
7x2.80
7x2.80
A
0.79 7.72
1.50
7x1.00
2.50
13.30
14.30
Top View
IN Side View Bottom View
Figure 6: Physical Dimensions

IM
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.
EL
PR

7.2 Recommended PCB Land Pattern

This section provides the following resources for your reference:
• Figure for the recommended PCB land pattern with all the dimensions needed for PCB design. See Figure
7 Recommended PCB Land Pattern for SMD Soldering and Figure 8 Recommended PCB Land Pattern for
Vertical Module Soldering.
Unit: mm
Copper
RY
15.80
14x2.17 Antenna Area
2.75
0.395
1 21
0.60
2 0.60 20
1.40
20.30
3 19
A
0.475
14x1.00
4 18 0.70
5 17
14.20
2.59
6 16
7 15 4.37
IN
7.35
7.72
6.88
5.80
0.50 8 9 10 11 12 13 14
1.00
7x3.45
0.50
IM
1.80
7x1.00
2.50
13.30
EL
Top View
Figure 7: Recommended PCB Land Pattern for SMD Soldering

PR

Unit: mm
Copper
Pads are in bottom layer
13.30
15.80 1.25
13.30 1.80 14x1.00
8 9 10 11 12 13 14 14 13 12 11 10 9 8
RY
SLOT SLOT
14x2.80
8 9 10 11 12 13 14 14 13 12 11 10 9 8
4.60
1.30
Top View Bottom View
A
Figure 8: Recommended PCB Land Pattern for Vertical Module Soldering
IN
IM
EL
PR

8 Product Handling
8 Product Handling
8.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
/60%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)
RY
• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
8.3 Reflow Profile

Solder the module in a single reflow.
A
Temperature (℃)
IN
Peak Temp.
235 ~ 250 ℃
IM
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s
EL
Ramp-up zone
1 ~ 3 ℃/s
100
50
PR
25
Time (sec.)
0
0 50 100 150 200 250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 9: Reflow Profile

8 Product Handling
8.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.
A RY
IN
IM
EL
PR

8 Product Handling
8.5 Wave Soldering Profile
Temperature (℃)
260 Peak
250 230 ~ 260 °C
200
160
150
RY
100
Solder Point Temperature
50
Component Temperature
A
Preheating Soldering Cooling
Time (s)
0 50 80 100 150 200 250
IN
Preheating zone — Component temperature: 90 ~ 120 °C
PCB soak time: 2 ~ 5 s
PCB ramp-up rate: ≤ 5 °C /s
Soldering Zone — Solder point temperature: 245 ± 10 °C
Cooling Zone — Exit temperature: 100 °C
IM
Figure 10: Wave Soldering Profile
EL
PR

9 Related Documentation and Resources
9 Related Documentation and Resources

Related Documentation
• ESP8685 Series Datasheet – Specifications of the ESP8685 hardware.
• Certificates
https://espressif.com/en/support/documents/certificates
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
RY
• ESP-IDF Programming Guide for ESP8685 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
A
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
IN
https://espressif.com/en/support/download/sdks-demos
Products
• ESP8685 Series SoCs – Browse through all ESP8685 SoCs.
IM
https://espressif.com/en/products/socs?id=ESP8685
• ESP8685 Series Modules – Browse through all ESP8685-based modules.
https://espressif.com/en/products/modules?id=ESP8685
• ESP8685 Series DevKits – Browse through all ESP8685-based devkits.
EL
https://espressif.com/en/products/devkits?id=ESP8685
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
PR
(Online stores), Become Our Supplier, Comments & Suggestions.

https://espressif.com/en/contact-us/sales-questions

Revision History
Revision History
Date Version Release notes
• Updated Section 4.4.2 Current Consumption in Other Modes

• Updated ”RF power control range” in Table Bluetooth LE RF Transmitter (TX)
2023-02-27 v0.7
Specifications
• Updated note 1 in Chapter 6 Peripheral Schematics
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• Updated Chapter 5 Module Schematics
2022-05-19 v0.6
• Updated Chapter 6 Peripheral Schematics
2022-04-11 v0.5 First release
A
IN
IM
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A RY
IN
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Disclaimer and Copyright Notice

Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property
www.espressif.com of their respective owners, and are hereby acknowledged.
Copyright © 2023 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.

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ESP8685-WROOM-06

• ESP8685H2 or ESP8685H4 embedded, 32-bit Bluetooth®

• 2 MB or 4 MB flash in chip package • Multiple advertisement sets

• Wi-Fi Multimedia (WMM)

• Fragmentation and defragmentation Antenna Options

Espressif Systems 2 ESP8685-WROOM-06 Datasheet v0.7

ESP8685-WROOM-06 comes with an on-board PCB antenna.

The ordering information for ESP8685-WROOM-06 is as follows:

Table 1: ESP8685-WROOM-06 Ordering Information

– Light control – Over-the-top (OTT) devices

– Smart button – Wi-Fi speaker

– Smart plug – Logger toys and proximity sensing toys

– Indoor positioning • Smart Agriculture

• Industrial Automation – Smart greenhouse

– Industrial robot – Smart irrigation

– Mesh network – Agriculture robot

– Human machine interface (HMI) • Retail and Catering

– Industrial field bus – POS machines

• Health Care – Service robot

– Health monitor • Audio Device

– Baby monitor – Internet music players

• Consumer Electronics – Live streaming devices

Espressif Systems 3 ESP8685-WROOM-06 Datasheet v0.7

– Internet radio players • Generic Low-power IoT Data Loggers

• Generic Low-power IoT Sensor Hubs

Espressif Systems 4 ESP8685-WROOM-06 Datasheet v0.7

4.6.2 Bluetooth LE RF Receiver (RX) Specifications 20

7 Physical Dimensions and PCB Land Pattern 25

9 Related Documentation and Resources 31

Espressif Systems 5 ESP8685-WROOM-06 Datasheet v0.7

Espressif Systems 6 ESP8685-WROOM-06 Datasheet v0.7

Espressif Systems 7 ESP8685-WROOM-06 Datasheet v0.7

Espressif Systems 8 ESP8685-WROOM-06 Datasheet v0.7

Figure 1: ESP8685-WROOM-06 Block Diagram

Espressif Systems 9 ESP8685-WROOM-06 Datasheet v0.7

3.1 Pin Layout

IO3 IO7 IO6 IO4 IO5 GND 3V3

Figure 2: Pin Layout (Top View)

3.2 Pin Description

For peripheral pin configurations, please refer to ESP8685 Series Datasheet.

Espressif Systems 10 ESP8685-WROOM-06 Datasheet v0.7

Table 2: Pin Definitions

Name No. Type1 Function

3.3 Strapping Pins

ESP8685 series has three strapping pins:

Espressif Systems 11 ESP8685-WROOM-06 Datasheet v0.7

Types of system reset include:

• RTC watchdog reset

• analog super watchdog reset

• crystal clock glitch detection reset

After reset, the strapping pins work as normal-function pins.

Table 3 lists detailed booting configurations of the strapping pins.

Table 3: Strapping Pins

2, if GPIO8 is 0, print is disabled; if GPIO8 is 1, it is enabled.

Espressif Systems 12 ESP8685-WROOM-06 Datasheet v0.7

Figure 3: Setup and Hold Times for the Strapping Pins

Espressif Systems 13 ESP8685-WROOM-06 Datasheet v0.7

4.1 Absolute Maximum Ratings

Table 5: Absolute Maximum Ratings