Compatible Design: GSM/GPRS Module Series

M65&M66
Compatible Design
GSM/GPRS Module Series
Rev. M65&M66_Compatible_Design_V1.0
Date: 2019-11-08
Status: Released
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M65&M66 Compatible Design
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About the Document
History
Revision Date Author Description

Claude WEI/
1.0 2019-11-08 Initial
Tate WANG
Contents
About the Document ................................................................................................................................... 2

Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 4
Figure Index ................................................................................................................................................. 5
1 Introduction .......................................................................................................................................... 6
2 General Description ............................................................................................................................. 7

2.1. Product Description ................................................................................................................... 7
2.2. Features Overview .................................................................................................................... 8
2.3. Pin Assignment........................................................................................................................ 10
3 Pin Description ................................................................................................................................... 11
4 Hardware Reference Design ............................................................................................................. 14

4.1. Power Supply .......................................................................................................................... 14
4.1.1. Module Operating Voltage ............................................................................................. 14
4.1.2. Decrease Supply Voltage Drop ...................................................................................... 15
4.1.3. Reference Design for Power Supply .............................................................................. 16
4.2. Power-on Circuit ...................................................................................................................... 16
4.3. Power-off Circuit ...................................................................................................................... 18
4.4. Restart the module .................................................................................................................. 18
4.5. Network Status Indication........................................................................................................ 19
4.6. (U)SIM Interface ...................................................................................................................... 19
4.7. UART Interfaces ...................................................................................................................... 20
4.8. ADC Interface .......................................................................................................................... 21
4.9. RF Antenna Interface .............................................................................................................. 22
4.10. RF Receiving Sensitivity ......................................................................................................... 22
5 Electrical, Reliability and Radio Characteristics ............................................................................ 23

5.1. Absolute Maximum Ratings .................................................................................................... 23
5.2. Power Supply Ratings ............................................................................................................. 24
5.3. Current Consumption .............................................................................................................. 26
6 Recommended Footprint and Stencil Design ................................................................................. 28

6.1. Bottom Views........................................................................................................................... 28
6.2. Recommended Compatible Footprint ..................................................................................... 29
6.3. Recommended Stencil Design ................................................................................................ 30
6.4. Installation Sketch Map ........................................................................................................... 31
7 Manufacturing and Packaging .......................................................................................................... 32

7.1. Manufacturing and Soldering .................................................................................................. 32
7.2. Packaging ................................................................................................................................ 33
8 Appendix A References..................................................................................................................... 35
Table Index
TABLE 1: MODULE GENERAL INFORMATION ................................................................................................. 7

TABLE 2: FEATURES OVERVIEW ..................................................................................................................... 8
TABLE 3: I/O PARAMETERS DEFINITION ........................................................................................................ 11
TABLE 4: PIN COMPARISON ............................................................................................................................ 11
TABLE 5: OPERATING VOLTAGE RANGE ...................................................................................................... 14
TABLE 6: UART INTERFACES COMPARISON ................................................................................................ 20
TABLE 7: PIN DEFINITION COMPARISON OF ADC INTERFACE .................................................................. 21
TABLE 8: CONDUCTED RF RECEIVING SENSITIVITY .................................................................................. 22
TABLE 9: ABSOLUTE MAXIMUM RATINGS .................................................................................................... 23
TABLE 10: POWER SUPPLY RATINGS ........................................................................................................... 24
TABLE 11: CURRENT CONSUMPTION ........................................................................................................... 26
TABLE 12: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 33
TABLE 13: RELATED DOCUMENTS ................................................................................................................ 35
TABLE 14: TERMS AND ABBREVIATIONS ...................................................................................................... 35
Figure Index
FIGURE 1: M65&M66 PIN ASSIGNMENT ........................................................................................................ 10

FIGURE 2: VOLTAGE RIPPLE DURING TRANSMITTING .............................................................................. 15
FIGURE 3: REFERENCE CIRCUIT OF VBAT .................................................................................................. 15
FIGURE 4: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 16
FIGURE 5: DRIVER CIRCUIT OF THE PWRKEY (M65/M66).......................................................................... 17
FIGURE 6: TIMING OF TURNING ON THE MODULE (M65/M66) .................................................................. 17
FIGURE 7: TIMING OF TURNING OFF THE MODULE (M65/M66) ................................................................. 18
FIGURE 8: TIMING OF RESTARTING THE MODULE ..................................................................................... 19
FIGURE 9: REFERENCE CIRCUIT OF NETLIGHT ......................................................................................... 19
FIGURE 10: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 20
FIGURE 11: REFERENCE CIRCUIT OF MAIN UART INTERFACE LEVEL CONVERSION ........................... 21
FIGURE 12: REFERENCE CIRCUIT OF RF ANTENNA INTERFACES ........................................................... 22
FIGURE 13: BOTTOM VIEWS OF M65 AND M66............................................................................................ 28
FIGURE 14: RECOMMENDED FOOTPRINT OF M65 AND M66..................................................................... 29
FIGURE 15: RECOMMENDED STENCIL DESIGN FOR M65 AND M66 (UNIT: MM) ..................................... 30
FIGURE 16: INSTALLATION SKETCH MAP FOR M65 AND M66 ................................................................... 31
FIGURE 17: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 32
FIGURE 18: TAPE DIMENSIONS ..................................................................................................................... 34
FIGURE 19: REEL DIMENSIONS ..................................................................................................................... 34
1 Introduction
Quectel GSM/GPRS modules M65 and M66 are compatible, and this document briefly describes the
compatible design between them.
2 General Description
2.1. Product Description
M65 and M66 are quad-band GSM/GPRS modules supporting GSM850/EGSM900/DCS1800/PCS1900.

The two modules are compatible, and customers can choose a suitable product for terminal applications
according to their needs.
Table 1: Module General Information
Module Appearance Packaging Dimensions Description
Quad-band
M65 44 LCC pins 17.7mm × 15.8mm × 2.4mm GSM/GPRS
module
Quad-band
M66 44 LCC pins 17.7mm × 15.8mm × 2.3mm GSM/GPRS
module
2.2. Features Overview
The following table compares the general properties and features of M65 and M66 modules.
Table 2: Features Overview
Features M65 M66 Remarks
3.45V~4.25V 3.3V~4.6V
Power Supply
Typ. 4.0V Typ. 4.0V
Peak Current 2.0A 1.6A
1.2mA @DRX=5 1.3mA @DRX=5

Sleep Current
1.1mA @DRX=9 1.2mA @DRX=9
Quad-band: Quad-band:
Frequency Bands GSM850/EGSM900/ GSM850/EGSM900/
DCS1800/PCS1900 DCS1800/PCS1900
Operation temperature range: Operation temperature range:
-35°C ~ +75°C 1) -35°C ~ +75°C 1)
Extended temperature range: Extended temperature range:
Temperature Range
-40°C ~ +85°C 2) -40°C ~ +85°C 2)
Storage temperature range: Storage temperature range:
-40°C ~ +90°C -40°C ~ +90°C
Main UART port:
Main UART port:
 Full function serial port
 Full function serial port
 Used for AT command
transfer and GPRS data
transfer and GPRS data
transfer
transfer
 Adaptive baud rate
 Adaptive baud rate range:
range: 4800bps~
4800bps~115200bps
115200bps
Debug UART port:
 For firmware upgrade
 For software debugging
Debug UART port: Signal level:
UART Interface  For firmware upgrade,
 For software debugging 2.8V
fixed baud rate:
only, baud rate must be
921600bps
460800bps
Auxiliary UART port:
Auxiliary UART port:
transfer
transfer
 The default baud rate of
 The default baud rate of
the module is 115200bps
the module is 115200bps
 Adaptive baud rate is not
 Adaptive baud rate is not
supported
supported
(U)SIM Interface 1.8V/3.0V (U)SIM card 1.8V/3.0V (U)SIM card
One analog input channel One analog input channel

Audio Interface
Two analog output channels Two analog output channels
PCM Interface Not supported Supported
ADC Supported Supported
BT Not supported Support BT 3.0
Vnorm=3.1V Vnorm=2.8V
RTC
VI=3.0V~3.5V VI=1.5V~3.3V
Firmware Upgrade Debug UART or DFOTA Main UART or DFOTA
NOTES
1. The part marked in red are the differences between M65 and M65 features.
2. 1) Within operation temperature range, the module is 3GPP compliant.
3. 2) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects
on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce
in their value and exceed the specified tolerances. When the temperature returns to normal operation
temperature levels, the module will meet 3GPP specifications again.
2.3. Pin Assignment
The following figure shows the pin assignment of M65 and M66.
DBG_RXD DBG_RXD
DBG_TXD DBG_TXD
VBAT
VBAT
GND
GND
GND
GND
VBAT
VBAT
GND
GND
GND
GND
44
43
40
42
41
37
36
39
38
AGND AG ND 1 35 RF_ANT RF_ANT
SPK2P SPK2P 2 34 GND GND
MICP MICP 3 33 PCM_OUT RESERVED

MICN MICN 4 32 PCM_IN RESERVED
SPK1P SPK1P 5 31 PCM_SYNC RESERVED

SPK1N SPK1N 6 M65/M66 30 PCM_CLK RESERVED
PWRKEY PWRKEY 7 29 TXD_AUX TXD_AUX

AVDD
ADC0
AVDD
ADC0
8
9
Top View 28
27
RXD_AUX
GND
RXD_AUX
GND
SIM_GND SI M_GND 10 26 BT_ANT RESERVED
SI M_DATA SIM_DATA 11 25 RFTXMON RFTXMON
SIM_RST SI M_RST 12 24 VDD_EXT VDD_EXT

SI M_CLK SIM_CLK 13 23 RTS RTS
16
19
21
22
20
15
18
14
17
RXD
RI
DCD
CTS
DTR
NETLIGHT
SIM_VDD
RESERVED RESERVED
TXD
Red = M66
Blue = M65
RXD
DCD
DTR
CTS
NETLIGHT
SIM_VDD
TXD
RI
Figure 1: M65&M66 Pin Assignment
NOTES
1. The pin names marked in blue are for M65 module.

2. The pin names marked in red are for M66 module.
3 Pin Description
This chapter describes the pin definition of M65 and M66, as well as the pin comparison between them.
Table 3: I/O Parameters Definition
Symbol Description
AI Analog Input
AO Analog Output
DI Digital Input
DO Digital Output
IO Bidirectional
PI Power Input
PO Power Output
Table 4: Pin Comparison
M65 M66
Pin No.
Pin Name IO Description Pin Name IO Description
Analog ground. Separate Analog ground. Separate

1 AGND ground connection for external AGND ground connection for external
audio circuits audio circuits
2 SPK2P AO Channel 2 voice output SPK2P AO Channel 2 voice output
3 MICP AI Positive voice input MICP AI Positive voice input
4 MICN AI Negative voice input signal MICN AI Negative voice input signal
Channel 1 Channel 1
5 SPK1P AO SPK1P AO
Positive voice output Positive voice output
6 SPK1N AO Channel 1 SPK1N AO Channel 1
Negative voice output Negative voice output
Pull down PWRKEY to turn Pull down PWRKEY to turn

7 PWRKEY DI PWRKEY DI
on/off the module on/off the module
Reference voltage of ADC Reference voltage of ADC

8 AVDD PO AVDD PO
circuit circuit
General-purpose analog to General-purpose analog to

9 ADC0 AI ADC0 AI
digital converter interface digital converter interface
Specified ground for (U)SIM Specified ground for (U)SIM

10 SIM_GND SIM_GND
card card
11 SIM_DATA IO (U)SIM card data signal SIM_DATA IO (U)SIM card data signal
12 SIM_RST DO (U)SIM card reset signal SIM_RST DO (U)SIM card reset signal
13 SIM_CLK DO (U)SIM card clock signal SIM_CLK DO (U)SIM card clock signal
14 SIM_VDD PO Power supply for (U)SIM card SIM_VDD PO Power supply for (U)SIM card
15 RESERVED / / RESERVED / /
16 NETLIGHT DO Network status indication NETLIGHT DO Network status indication
17 TXD DO Transmit data TXD DO Transmit data
18 RXD DI Receive data RXD DI Receive data
Data terminal ready/

19 DTR DI DTR DI Data terminal ready
(U)SIM card detection
20 RI DO Ring indication RI DO Ring indication
21 DCD DO Data carrier detection DCD DO Data carrier detection
22 CTS DO Clear to send CTS DO Clear to send
23 RTS DI Request to send RTS DI Request to send
2.8V output power supply for 2.8V output power supply for an
24 VDD_EXT PO VDD_EXT PO
an external circuit external circuit
25 RFTXMON DO Transmission signal indication RFTXMON DO Transmission signal indication
26 RESERVED / / BT_ANT IO BT antenna pad
28 RXD_AUX DI Receive data RXD_AUX DI Receive data
29 TXD_AUX DO Transmit data TXD_AUX DO Transmit data
30 RESERVED / / PCM_CLK DO PCM clock
31 RESERVED / / PCM_SYNC DO PCM frame synchronization
32 RESERVED / / PCM_IN DI PCM data input
33 RESERVED / / PCM_OUT DO PCM data output
35 RF_ANT IO RF antenna pad RF_ANT IO RF antenna pad
38 DBG_RXD DI Receive data DBG_RXD DI Receive data
39 DBG_TXD DO Transmit data DBG_TXD DO Transmit data
Main power supply of the Main power supply of the

42 VBAT PI module: VBAT PI module:
VBAT=3.45V~4.25V VBAT=3.3V~4.6V
Main power supply of the Main power supply of the

43 VBAT PI module: VBAT PI module:
VBAT=3.45V~4.25V VBAT=3.3V~4.6V
Power supply for RTC when

Power supply for RTC when
44 VRTC IO module is not powered by VRTC IO
module is not powered by VBAT.
VBAT.
27, 34,
36, 37, GND / Ground GND / Ground
40, 41
NOTES
1. The pin names marked in red are compatible pins with different functions.
2. The pin names marked in black are compatible pins with the same function.
3. Keep all reserved and unused pins unconnected.
4. All GND pins should be connected to ground.
4 Hardware Reference Design

The following chapters describe the compatible design between M65 and M66 on main hardware
functions.
4.1. Power Supply
4.1.1. Module Operating Voltage
The following table shows the operating voltage range of M65 and M66 modules:
Table 5: Operating Voltage Range
Module Pin Name Description Min. Typ. Max. Unit
M65 VBAT The actual input voltage 3.45 4.0 4.25 V

must be within the range
M66 VBAT value. 3.3 4.0 4.6 V
When considering the compatible design between the two modules, please ensure that the module input
voltage is 3.45V~4.25V. Even when a voltage drop occurs in the module’s input power supply VBAT, make
sure that the VBAT voltage is greater than the module's minimum operating voltage value.
The maximum current consumption of the module could reach 2.0A during a burst transmission, which will
cause a large voltage drop on VBAT. In order to ensure the stability of the module’s operation, it is
recommended that the maximum voltage drop during the burst transmission should not exceed 400mV.
4.615ms
577us
Burst:2.0A
IBAT
VBAT
Vdrop
Figure 2: Voltage Ripple during Transmitting
4.1.2. Decrease Supply Voltage Drop
To ensure that the VBAT voltage does not fall below 3.45V, it is recommended to connect a 100μF
tantalum capacitor with low ESR (ESR=0.7Ω) and ceramic capacitors of 100nF, 33pF and 10pF (0603
package) in parallel close to the VBAT pin. The reference circuit of VBAT is shown below.
The VBAT trace should be short and wide enough to reduce the equivalent impedance so as to ensure
that there is not too much voltage drop during maximum transmit power. The width of VBAT trace should
be no less than 2mm; and in principle, the longer the trace is, the wider it will be.
VBAT
M65/M66 Module
VBAT
+
D1 C1 C2 C3 C4
TVS 100uF 100nF 33pF 10pF
Figure 3: Reference Circuit of VBAT
4.1.3. Reference Design for Power Supply
Power design for the module is very critical, as the performance of the module largely depends on the
power source. The power supply should be provided with sufficient current up to 2.0A at least. If the
voltage difference between the input and the output voltage is not too big, it is suggested to use an LDO to
supply power for the module; if there is a big voltage difference between the input and the output voltage,
a switcher power converter is preferred to be used.
The following figure shows a reference design for +5V input power supply. The designed output voltage
for the power supply is 4.0V and the maximum load current is 3.0A. A TVS is recommended to be added
close to the VBAT pin.
MIC29302WU U1
DC_5V VBAT
2 IN OUT 4
R2
GND
124K
ADJ
EN
1
C1 C2 R4 C3 C4 D1
R1
51K
470uF R3 TVS
100nF 470R 470uF 100nF
56K
R5
4.7K
MCU_POWER_ON/OFF
R6
47K
Figure 4: Reference Circuit of Power Supply
4.2. Power-on Circuit
M65 and M66 modules are normally powered on by the PWRKEY pin. Set PWRKEY to low, and the
module will be successfully booted after about 1.6s. It is recommended to use an open collector driver
circuit to control the pin. The following figure shows the reference circuit.
PWRKEY
T1
4.7K T1
Turn-on pulse
47K
Figure 5: Driver Circuit of the PWRKEY (M65/M66)
The timing of turning on M65 and M66 are illustrated in the figure below.
VBAT
VBAT
M65>1.6s
100ms M66>1s VIH > 0.6*VBAT
PWRKEY VIL<0.1*VBAT
PWRKEY
M65: 10ms
VDD_EXT M66: 54ms

VDD_EXT
M65 OFF BOOTING RUNNING
M66 OFF BOOTING RUNNING
Figure 6: Timing of Turning on the Module (M65/M66)
NOTES
1. When powering on M65/M66 by PWRKEY, PWRKEY pin shall be pulled down after VBAT has been
stable for a period of time (greater than 100ms) to ensure VBAT voltage stability.
2. The parts marked in blue in the above figure are for M65 module.
3. The parts marked in black in the above figure are for M66 module.
4.3. Power-off Circuit
M65 and M66 can be powered off by AT+QPOWD=1 to shut down or pull down the PWRKEY pin for
about 1.2s.
The timing of turning on M65 and M66 are illustrated in the figure below.
VBAT
Log out from network in 2s~40s
M65
RXD
M66
AT+QPOWD
M65 1.2s<T
M66 0.7s<T<1s
PWRKEY
M65 RUNNING OFF
Power-down procedure
RUNNING Power-down procedure

M66
OFF
Figure 7: Timing of Turning off the Module (M65/M66)
NOTES
1. The parts marked in blue in the above figure are for M65.
2. The parts marked in black in the above figure are for M66.
3. The time for the module to log out from network depends on local network quality.
4.4. Restart the module
After M65 and M66 are shut down normally, pull down the PWRKEY for a while can restart the module. It
is recommended to wait at least 500ms after shutting down the module for the internal LDO discharge of
the module. The timing of restarting the module shown below.
Turn off Delay >0.5s Restart

PWRKEY
(INP UT)
Pull down the PWRKEY

VDD_EXT to turn on the module
(OUTPUT)
Figure 8: Timing of Restarting the Module
4.5. Network Status Indication
The NETLIGHT pin can be used to drive a network status indicator LED. The reference design is shown
below.
VBAT
M65/M66 Module
2.2K
4.7K
NETLIGHT
47K
Figure 9: Reference Circuit of NETLIGHT
4.6. (U)SIM Interface
(U)SIM interfaces of M65 and M66 are compatible and support both 1.8V/3.0V (U)SIM cards.
The following figure shows a reference design for (U)SIM interface with a 6-pin (U)SIM card connector.
SIM_VDD
M65/M66 Module
15K
100nF
SIM_GND (U)SIM Card Connector
SIM_VDD VCC GND

22R
SIM_RST RST VPP
SIM_CLK CLK IO
22R
22R
SIM_DATA
33pF 33pF 33pF
ESD
GND GND
Figure 10: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector
4.7. UART Interfaces
M65's firmware can be upgraded via debug UART interface, and M66's firmware can be upgraded via the
main UART interface. The voltage domain of both the UART interfaces is 2.8V.
Table 6: UART Interfaces Comparison
Module Firmware upgrade Baud Rate for Firmware Upgrade Remark
M65 Via debug UART 921600bps Test points need to be

reserved for compatible
M66 Via main UART 115200bps design
The reference design of 3.3V level matching is shown below. If the host is a 3.0V system, please use the
10kΩ resistor instead of the 5.6kΩ one.
Module MCU/ARM
1K
RXD /TXD
1K
TXD /RXD
1K
RTS /RTS
1K
CTS /CTS
1K
DTR GPIO
1K
RI EINT
1K
DCD GPIO
GND GND
5.6K 5.6K 5.6K
Voltage level: 3.3V
Figure 11: Reference Circuit of Main UART Interface Level Conversion
NOTES
It is strongly recommended that when the host system level is 3V or 3.3V, add a voltage divider circuit to
the serial port connection between the module and the host to match the level. For the level matching
between higher voltage systems, level conversion chips need to be added between the module and the
host.
4.8. ADC Interface
M65 and M66 provide a 10-bit ADC input channel to read the voltage value.
 The ADC0 voltage collection range of M65 is 0~1.8V.

 The ADC0 voltage collection range of M66 is 0~2.8V.
Table 7: Pin Definition Comparison of ADC Interface
Module Pin Name Pin No. Description
M65 ADC0 9 Analog to digital converter interface
M66 ADC0 9 Analog to digital converter interface
4.9. RF Antenna Interface
The pin RF_ANT of M65 and M66 are compatible. Additionally, M66 offers a BT antenna interface
BT_ANT (pin 26).
The RF antenna interfaces of these modules have an impedance of 50Ω. In order to achieve better RF
performance, a π-type matching circuit is recommended to be reserved, and the π-type matching
components (R1&C1&C2) should be placed as close to the antenna as possible. By default, the
resistance of R1 is 0Ω and capacitors C1&C2 are not mounted. A reference circuit is shown below.
Module
M66 BT_ANT R1 0R
M65/M66 RF_ANT
C1 C2
NM NM
Figure 12: Reference Circuit of RF Antenna Interfaces
4.10. RF Receiving Sensitivity
Table 8: Conducted RF Receiving Sensitivity
Receiving Sensitivity
Frequency
M65 M66
GSM850 < -108dBm < -109dBm
EGSM900 < -108dBm < -109dBm
DCS1800 < -107dBm < -109dBm
PCS1900 < -107dBm < -109dBm
5 Electrical, Reliability and Radio

Characteristics
5.1. Absolute Maximum Ratings
Table 9: Absolute Maximum Ratings
Min. Max.
Parameter Unit
M65 M66 M65 M66
VBAT -0.3 -0.3 4.5 4.73 V
Peak Current of Power Supply 0 0 2.0 2.0 A
RMS Current of Power Supply

0 0 0.7 0.7 A
(during one TDMA- frame)
Voltage at Digital Pins -0.3 -0.3 3.08 3.08 V
Voltage at Analog Pins -0.3 -0.3 3.08 3.08 V
Voltage at Digital/Analog Pins in Power

N/A -0.25 N/A 0.25 V
Down Mode
5.2. Power Supply Ratings
Table 10: Power Supply Ratings
M65 M66
Parameter Description Conditions
Min. Typ. Max. Min. Typ. Max. Unit
The actual input voltages must be kept

Supply voltage between the minimum and maximum 3.45 4.0 4.25 3.3 4.0 4.6 V
VBAT values.
Voltage drop during Maximum power control level on
400 400 mV
burst transmission GSM850 and EGSM900.
Power down mode 39 150 μA
Sleep mode @DRX=5 1.2 1.3 mA
Minimum functionality mode
AT+CFUN=0
Idle mode 9.5 13 mA
Average supply Sleep mode 0.8 0.98 mA
IVBAT
current AT+CFUN=4
Idle mode 9.5 13 mA
Sleep mode 0.8 1.0 mA
Talk mode
GSM850/EGSM900 @PCL=5 241/229 223/219 mA
DCS1800/PCS1900 @PCL=0 178/156 153/151 mA
Data mode, GPRS (3 Rx, 2 Tx)

GSM850/EGSM900 @PCL=5 366/343 363/393 mA
DCS1800/PCS1900 @PCL=0 251/222 268/257 mA
GSM850/EGSM900 @PCL=5 423/397 506/546 mA
DCS1800/PCS1900 @PCL=0 283/254 366/349 mA
GSM850/EGSM900 @PCL=5 234/221 217/234 mA
DCS1800/PCS1900 @PCL=0 165/149 172/170 mA
GSM850/EGSM900 @PCL=5 457/437 458/485 mA
DCS1800/PCS1900 @PCL=0 315/283 462/435 mA
Peak supply current
(during Maximum power control level on
1.8 2 1.6 2 A
transmission GSM850 and EGSM900.
slot)
5.3. Current Consumption
Table 11: Current Consumption
Condition Current Consumption
M65 M66
Voice Call
@power level #5 <300mA, Typical 241mA @power level #5 <300mA, Typical 223mA
GSM850 @power level #12, Typical 103mA @power level #12, Typical 83mA
@power level #19, Typical 73mA @power level #19, Typical 62mA
EGSM900 @power level #12, Typical 102mA @power level #12, Typical 83mA
DCS1800 @power level #7, Typical 87mA @power level #7, Typical 73mA
PCS1900 @power level #7, Typical 85mA @power level #7, Typical 76mA
GPRS Data
DATA Mode, GPRS (3 Rx, 2 Tx) Class 12
@power level #5 <550mA, Typical 363mA

GSM850 @power level #5 <550mA, Typical 366mA @power level #12, Typical 131mA
@power level #19, Typical 91mA
EGSM900 @power level #5 <550mA, Typical 343mA @power level #12, Typical 132mA
DCS1800 @power level #0 <450mA, Typical 251mA @power level #7, Typical 112mA
PCS1900 @power level #0 <450mA, Typical 222mA @power level #7, Typical 119mA




NOTE
The GPRS Class of M65 and M66 can be configured from Class 1 to Class 12, and Class 12 is the default
setting. The lower the GPRS level is set, the lower requirement for the power supply current of the
module.
6 Recommended Footprint and Stencil

Design
This chapter mainly introduces the recommended footprint and stencil design for M65 and M66 modules.
All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05mm unless
otherwise specified.
6.1. Bottom Views
The following figure shows the bottom views of M65 and M66.
M65 M66
Figure 13: Bottom Views of M65 and M66
6.2. Recommended Compatible Footprint
The following figure shows the recommended compatible footprint of M65 and M66.
18.10±0.15
15.80±0.15
36
Pin 11 4.25
0.70 5.15
R1.75
17.70±0.15 20.00±0.15
R1.75
3.45
0.35
4.25
1.10
23
14 1.10
1.00 0.35
2.50 0.70
Figure 14: Recommended Footprint of M65 and M66
NOTES
1. The modules should be kept about 3mm away from other components in the host PCB.
2. The circular test points with a radius of 1.75mm in the above recommended footprint should not be
designed in schematic and PCB decal, and these test points should be served as a keepout area.
6.3. Recommended Stencil Design
The thickness of stencil for M65 and M66 is recommended to be 0.15mm~0.18mm. For more details,
please refer to document [3].
18.10±0.15
15.80±0.15
0.70
17.70±0.15 20.00±0.15
0.35
1.10
1.10
1.00 0.35
2.50 0.70
Figure 15: Recommended Stencil Design for M65 and M66 (Unit: mm)
6.4. Installation Sketch Map
The following figure shows the sketch map of installation for M65 and M66.
Figure 16: Installation Sketch Map for M65 and M66
7 Manufacturing and Packaging
7.1. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass.
It is suggested that the peak reflow temperature is 238ºC~245ºC, and the absolute maximum reflow
temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (°C)
Reflow Zone
Max slope: Cooling down
2~3°C/sec C slope: 1~4°C/sec
245
238
220
B D
200
Soak Zone
150 A
100
Max slope: 1~3°C/sec
Figure 17: Reflow Soldering Thermal Profile
Table 12: Recommended Thermal Profile Parameters
Factor Recommendation
Soak Zone
Max slope 1°C/sec~3°C/sec
Soak time (between A and B: 150°C and 200°C) 60sec~120sec
Reflow Zone
Max slope 2°C/sec~3°C/sec
Reflow time (D: over 220°C) 40sec~60sec
Max temperature 238°C~245°C
Cooling downslope 1°C/sec~4°C/sec
Reflow Cycle
Max reflow cycle 1
7.2. Packaging
The modules are stored inside a vacuum-sealed bag which is ESD protected. It should not be opened
until the devices are ready to be soldered onto the application.
The reel is 330mm in diameter and each reel contains 250 modules.
Figure 18: Tape Dimensions
Figure 19: Reel Dimensions
8 Appendix A References
Table 13: Related Documents
SN Document Name Remark
[1] Quectel_M65_Hardware_Design M65 Hardware Design
[2] Quectel_M66_Hardware_Design M66 Hardware Design
[3] Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide
Table 14: Terms and Abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
BT Bluetooth
CTS Clear to send
DCD Data Carrier Detect
DCS Digital Communication System
DRX Discontinuous Reception
DTR Data Terminal Ready
EGSM Extended Global System for Mobile
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
LCC Leadless Chip Carriers
MIC Microphone
PCB Printed Circuit Board
PCM Pulse Code Modulation
PCS Personal Communication System
RF Radio Frequency
RI Ring Indicator
RTC Real-Time Clock
RTS Require To Send
RXD Receive Direction
SPK Speaker
TXD Transmitting Direction
UART Universal Asynchronous Receiver & Transmitter
(U)SIM (Universal) Subscriber Identity Module
Vnorm Normal Output Voltage Value

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M65&M66

GSM/GPRS Module Series

Quectel Wireless Solutions Co., Ltd.

Or our local office. For more information, please visit:

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About the Document

Revision Date Author Description

About the Document ................................................................................................................................... 2

2 General Description ............................................................................................................................. 7

3 Pin Description ................................................................................................................................... 11

4 Hardware Reference Design ............................................................................................................. 14

5 Electrical, Reliability and Radio Characteristics ............................................................................ 23

6 Recommended Footprint and Stencil Design ................................................................................. 28

7 Manufacturing and Packaging .......................................................................................................... 32

TABLE 1: MODULE GENERAL INFORMATION ................................................................................................. 7

FIGURE 1: M65&M66 PIN ASSIGNMENT ........................................................................................................ 10

2.1. Product Description

M65 and M66 are quad-band GSM/GPRS modules supporting GSM850/EGSM900/DCS1800/PCS1900.

Table 1: Module General Information

Module Appearance Packaging Dimensions Description

2.2. Features Overview

Table 2: Features Overview

Features M65 M66 Remarks

Peak Current 2.0A 1.6A

1.2mA @DRX=5 1.3mA @DRX=5

(U)SIM Interface 1.8V/3.0V (U)SIM card 1.8V/3.0V (U)SIM card

One analog input channel One analog input channel

PCM Interface Not supported Supported

ADC Supported Supported

BT Not supported Support BT 3.0

Firmware Upgrade Debug UART or DFOTA Main UART or DFOTA

2.3. Pin Assignment

MICP MICP 3 33 PCM_OUT RESERVED

SPK1P SPK1P 5 31 PCM_SYNC RESERVED

PWRKEY PWRKEY 7 29 TXD_AUX TXD_AUX

SIM_GND SI M_GND 10 26 BT_ANT RESERVED

SI M_DATA SIM_DATA 11 25 RFTXMON RFTXMON

SIM_RST SI M_RST 12 24 VDD_EXT VDD_EXT

Figure 1: M65&M66 Pin Assignment

1. The pin names marked in blue are for M65 module.

Table 3: I/O Parameters Definition

Table 4: Pin Comparison

Analog ground. Separate Analog ground. Separate

2 SPK2P AO Channel 2 voice output SPK2P AO Channel 2 voice output

3 MICP AI Positive voice input MICP AI Positive voice input

6 SPK1N AO Channel 1 SPK1N AO Channel 1

Negative voice output Negative voice output

Pull down PWRKEY to turn Pull down PWRKEY to turn

Reference voltage of ADC Reference voltage of ADC

General-purpose analog to General-purpose analog to

Specified ground for (U)SIM Specified ground for (U)SIM

16 NETLIGHT DO Network status indication NETLIGHT DO Network status indication

17 TXD DO Transmit data TXD DO Transmit data

18 RXD DI Receive data RXD DI Receive data

Data terminal ready/

20 RI DO Ring indication RI DO Ring indication

21 DCD DO Data carrier detection DCD DO Data carrier detection

22 CTS DO Clear to send CTS DO Clear to send

23 RTS DI Request to send RTS DI Request to send