4 Bit Incrementer Decrementer

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4 BIT

INCREMENTER/
DECREMENTER
Submitted to

Dr. A.B.M. Harun-Ur-Rashid Gobinda Saha


Professor Lecturer
Dept. of EEE, BUET Dept. of EEE, BUET
OBJECTIVE

 Design a 4 bit Incrementer / Decrementer

 Modular design

 Layout with I/O pads

 Clearing of DRC and LVS

 Generating GDS file


TASK 1

Design Specifications:
 4 bit Incrementer / Decrementer

 Synchronous +ve edge clock operation

 Synchronous Reset capability

 Enable option (Cin)

 Sequential addition/subtraction logic

 Cascading option (Cout)


TASK 1
VERILOG CODE
module incdec (clk, reset, incdec, cin, Q, c3);
input clk, reset, incdec, cin;
output reg [3:0] Q;
output reg c3;

always @(posedge clk)


if (~reset)
{c3, Q[3:0]} <= 5'b0 ;
else if (incdec)
{c3, Q[3:0]} <= {c3, Q[3:0]} + cin ;
else
{c3, Q[3:0]} <= {c3, Q[3:0]} - cin ;

endmodule
TASK 1
VERILOG CODE - TESTBENCH
module stimulus;
reg clk, reset, incdec, cin;
wire cout;
wire [3:0] Q;
incdec in1(clk, reset, incdec, cin, Q, cout);

initial
begin
clk = 1'b0;
forever begin #5 clk = ~clk; end
end
initial
TASK 1
VERILOG CODE - TESTBENCH
begin
$shm_open("shm.db",1); // Opens a waveform database
$shm_probe("AS"); // Saves all signals to database
#300 $finish;
#400 $shm_close(); // Closes the waveform database
end

initial // Stimulate the Input Signals


begin
cin<=1;
end
TASK 1
VERILOG CODE - TESTBENCH
initial
begin
#0 incdec<=1; #100 incdec<=0;
end

initial
begin
#0 reset=1; #30 reset=0; #40 reset=1; #250 reset=0;
#280 reset=1;
end
endmodule //stimulus
TASK 1
WAVEFORM: FUNCTIONAL VERIFICATION
TASK 1
WAVEFORM: FUNCTIONAL VERIFICATION
TASK 1
WAVEFORM: ZOOMED
TASK 2
GATE LEVEL SCHEMATIC DESIGN
Incrementer Logic

Qn  Ci  Qn1
Ci 1  Ci .Qn1

Decrementer Logic

Ci 1  Ci .Qn1
TASK 2
GATE LEVEL SCHEMATIC DESIGN

Pucknell’s
Design
TASK 2
GATE LEVEL SCHEMATIC DESIGN

Modified
Design
TASK 3
TRANSISTOR LEVEL DESIGN
Inverter
Schematic
TASK 3
TRANSISTOR LEVEL DESIGN
Inverter Inverter
Layout Symbol
TASK 3
TRANSISTOR LEVEL DESIGN
Inverter Simulation Result (Schematic)
TASK 3
TRANSISTOR LEVEL DESIGN
2 Input NAND
Schematic
TASK 3
TRANSISTOR LEVEL DESIGN
2 Input NAND 2 Input NAND
Layout Symbol
TASK 3
TRANSISTOR LEVEL DESIGN
2 Input NAND Simulation Result (Schematic)
TASK 3
TRANSISTOR LEVEL DESIGN
2 Input XOR
Schematic
TASK 3
TRANSISTOR LEVEL DESIGN
2 Input XOR Layout 2 Input XOR
Symbol
TASK 3
TRANSISTOR LEVEL DESIGN
2 Input XOR Simulation Result (Schematic)
TASK 3
TRANSISTOR LEVEL DESIGN
D Flip Flop Schematic
TASK 3
TRANSISTOR LEVEL DESIGN
D Flip Flop Layout
TASK 3
TRANSISTOR LEVEL DESIGN

D Flip Flop
Symbol
TASK 3
TRANSISTOR LEVEL DESIGN
D Flip Flop Simulation Result (Schematic)
TASK 4
TOP LEVEL LAYOUT PLACEMENT
1 bit Incrementer/Decrementer Schematic
TASK 4
TOP LEVEL LAYOUT PLACEMENT
1 bit Incrementer/Decrementer Layout
TASK 4
TOP LEVEL LAYOUT PLACEMENT

1 bit
Incrementer/Decrementer
Symbol
TASK 4
TOP LEVEL LAYOUT PLACEMENT
4 bit Incrementer/Decrementer Schematic
TASK 4
TOP LEVEL LAYOUT PLACEMENT
4 bit Incrementer/Decrementer Layout
TASK 4
TOP LEVEL LAYOUT PLACEMENT

4 bit
Incrementer/Decrementer
Symbol
TASK 4
TOP LEVEL LAYOUT PLACEMENT
4 bit Incrementer/Decrementer Simulation Result
(Schematic)
TASK 5
COMPLETE CHIP LAYOUT
ESD Protection: Schematic
TASK 5
COMPLETE CHIP LAYOUT
 ESD Protection: Layout
TASK 5
COMPLETE CHIP LAYOUT
 Bondpad Layout:
- - 70u x 70u dimension
- - 3 metal layers and 2 via layers
- - No slotting
TASK 5
COMPLETE CHIP LAYOUT
 Schematic of Final chip with IO pad:
TASK 5
COMPLETE CHIP LAYOUT
 Layout of final chip with IO pad:
TASK 5
COMPLETE CHIP LAYOUT
 Pin diagram of the final chip:
TASK 5
COMPLETE CHIP LAYOUT
 Av_extracted view of the final chip
TASK 5
COMPLETE CHIP LAYOUT
 Simulation from av_extracted view: (50 MHz
clock)
TASK 5
COMPLETE CHIP LAYOUT
 Circuit inventory:
TASK 5
COMPLETE CHIP LAYOUT
 Delay, rise time and fall time when clock
frequency is 50 MHz:

Clock to Q Rise time (ns) Fall time (ns)


propagation delay
(ns)

For Q0 1.4634 3.2 2.53


TASK 5
COMPLETE CHIP LAYOUT
 Dependency of power dissipation on clock
frequency:
Clock Frequency Average power dissipation Maximum instantaneous power
(µW) dissipation (µW)

50 MHz 44.41 959.5

100 MHz 82.75 1.08033


TASK 5
COMPLETE CHIP LAYOUT
 Final Chip Performance
- - Chip Dimension without I/O Pad:
- 36.56 µm ×31.09 µm
- - Final Chip Dimension: 660 µm ×660 µm
- Average Power Consumption: 44.41 µW
(at 50 MHz)
- Frequency Support: up 100 MHz
SUBMITTED BY:

Anik Saha (0906001)


Anupam Golder (0906004)
THANK YOU

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