Esp32 s2 Mini 2 - Esp32 s2 Mini 2u - Datasheet - en

ESP32S2MINI2
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ESP32S2MINI2U
Datasheet
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2.4 GHz WiFi (802.11 b/g/n) module
Built around ESP32S2 series of SoC (chip revision v1.0), Xtensa® singlecore 32bit LX7 mi
croprocessor
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4 MB flash and optional 2 MB PSRAM in chip package
37 GPIOs, rich set of peripherals
Onboard PCB antenna or external antenna connector
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ESP32S2MINI2 ESP32S2MINI2U
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Pre-release v0.5
Espressif Systems
Copyright © 2022
www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://www.espressif.com/documentation//esp32-s2-mini-2_esp32-s2-mini-2u_datasheet_en.pdf
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1.1 Features
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CPU and OnChip Memory (compatible with ISO 11898-1, i.e. CAN
Specification 2.0), full-speed USB OTG, ADC,
• ESP32-S2FH4 or ESP32-S2FN4R2 embedded, DAC, touch sensor, temperature sensor,
Xtensa® single-core 32-bit LX7 microprocessor, general-purpose timers, watchdog timers
up to 240 MHz
• 128 KB ROM
Integrated Components on Module
• 320 KB SRAM
• 16 KB SRAM in RTC
• 4 MB flash
• 2 MB PSRAM (ESP32-S2FN4R2 only)

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Antenna Options
• On-board PCB antenna (ESP32-S2-MINI-2)

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WiFi
• External antenna via a connector
• 802.11 b/g/n (ESP32-S2-MINI-2U)
• Bit rate: 802.11n up to 150 Mbps

Operating Conditions
• A-MPDU and A-MSDU aggregation
• 0.4 µs guard interval support • Operating voltage/Power supply: 3.0 ~ 3.6 V

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• Center frequency range of operating channel: • Operating ambient temperature:

2412 ~ 2484 MHz
– 85 °C version: –40 ~ 85 °C
Peripherals
– 105 °C version: –40 ~ 105 °C
• GPIO, SPI, LCD, UART, I2C, I2S, Camera (ESP32-S2-MINI-2-H4) and
® ESP32-S2-MINI-2U-H4 only)
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interface, IR, pulse counter, LED PWM, TWAI
1.2 Description
ESP32-S2-MINI-2 and ESP32-S2-MINI-2U are two powerful, generic Wi-Fi MCU modules that have a rich set of
peripherals. They are an ideal choice for a wide variety of application scenarios related to Internet of Things (IoT),
such as wearable electronics and smart home.
ESP32-S2-MINI-2 comes with a PCB antenna (ANT). ESP32-S2-MINI-2U comes with an external antenna
connector (CONN). A wide selection of module variants are available for customers as shown in Table 1 and
Table 2.
Espressif Systems 2 ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5

Submit Documentation Feedback (Chip Revision v1.0)
1 Module Overview
Table 1: ESP32S2MINI2 (ANT) Series Comparison1
Ambient Temp.2 Size3

Ordering Code Flash PSRAM
(°C) (mm)
ESP32-S2-MINI-2-N4 — –40 ∼ 85
ESP32-S2-MINI-2-H4 4 MB (Quad SPI) 4 — –40 ∼ 105 15.4 × 20.5 × 2.4
ESP32-S2-MINI-2-N4R2 2 MB (Quad SPI) 5
–40 ∼ 85
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1
This table shares the same notes presented in Table 2 below.
Table 2: ESP32S2MINI2U (CONN) Series Comparison
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Ambient Temp.2 Size3
Ordering Code Flash PSRAM
(°C) (mm)
ESP32-S2-MINI-2U-N4 — –40 ∼ 85
ESP32-S2-MINI-2U-H4 4 MB (Quad SPI) 4 — –40 ∼ 105 15.4 × 15.4 × 2.4
ESP32-S2-MINI-2U-N4R2 2 MB (Quad SPI) 5
–40 ∼ 85
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Ambient temperature specifies the recommended temperature range of the environment immediately out-
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side the Espressif module.
The flash is integrated in the chip’s package.

The PSRAM is integrated in the chip’s package.
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For details, refer to Section 7.1 Physical Dimensions.
In this datasheet unless otherwise stated, ESP32-S2-MINI-2 refers to all variants of ESP32-S2-MINI-2, whereas
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ESP32-S2-MINI-2U refers to all variants of ESP32-S2-MINI-2U.
At the core of the modules is ESP32-S2 series chip revision v1.0. ESP32-S2 series of chips has an Xtensa®
32-bit LX7 CPU that operates at up to 240 MHz. It has a low-power co-processor that can be used instead of
the CPU to save power while performing tasks that do not require much computing power, such as monitoring of
peripherals.
ESP32-S2 series integrates a rich set of peripherals, ranging from SPI, I2S, UART, I2C, LED PWM, TWAI® , LCD,
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Camera interface, ADC, DAC, touch sensor, temperature sensor, 43 GPIOs, full-speed USB On-The-Go (OTG)
interface to enable USB communication, etc.
For more information on ESP32-S2 series of SoCs, please refer to ESP32-S2 Series Datasheet and ESP32-S2
Series SoC Errata.
Information about ESP-IDF release that supports a specific chip revision is provided in ESP Product
Selector.
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1.3 Applications
• Generic Low-power IoT Sensor Hub • USB Devices
• Generic Low-power IoT Data Loggers • Speech Recognition
• Cameras for Video Streaming • Image Recognition
• Over-the-top (OTT) Devices • Mesh Network

1 Module Overview
• Home Automation • Health Care Applications
• Smart Home Control Panel

• Wi-Fi-enabled Toys
• Smart Building
• Wearable Electronics
• Industrial Automation
• Retail & Catering Applications
• Smart Agriculture
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• Audio Applications • Smart POS Machines
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Contents
Contents
1 Module Overview 2
1.1 Features 2
1.2 Description 2
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1.3 Applications 3
2 Block Diagram 8
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3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 10
3.3 Strapping Pins 12
4 Electrical Characteristics 14
4.1 Absolute Maximum Ratings 14
4.2
4.3
4.4
4.5
Recommended Operating Conditions
DC Characteristics (3.3 V, 25 °C)
Current Consumption Characteristics
Wi-Fi Radio
4.5.1 Wi-Fi RF Standards
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4.5.2 Wi-Fi RF Transmitter (TX) Specifications 16
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4.5.3 Wi-Fi RF Receiver (RX) Specifications 17
5 Module Schematics 20
6 Peripheral Schematics 22
7 Physical Dimensions and PCB Land Pattern

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7.1 Physical Dimensions 23
7.2 Recommended PCB Land Pattern 25
7.3 Dimensions of External Antenna Connector 27
8 Product Handling 28
8.1 Storage Conditions 28
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8.2 Electrostatic Discharge (ESD) 28

8.3 Reflow Profile 28
8.4 Ultrasonic Vibration 29
9 Related Documentation and Resources 30
Revision History 31

List of Tables
List of Tables
1 ESP32-S2-MINI-2 (ANT) Series Comparison 3
2 ESP32-S2-MINI-2U (CONN) Series Comparison 3
3 Pin Definitions 10
4 Strapping Pins 12
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5 Absolute Maximum Ratings 14
6 Recommended Operating Conditions 14
7 DC Characteristics (3.3 V, 25 °C) 14
8 RF Current Consumption in Active Mode 15
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9 Current Consumption in Modem-sleep Mode 15
10 Current Consumption in Low-Power Modes 16
11 Wi-Fi RF Standards 16
12 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 17
13 TX EVM Test 17
14 RX Sensitivity 17
15 Maximum RX Level 18
16 RX Adjacent Channel Rejection
IN 18
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List of Figures
List of Figures
1 ESP32-S2-MINI-2 Block Diagram 8
2 ESP32-S2-MINI-2U Block Diagram 8
3 ESP32-S2-MINI-2 Pin Layout (Top View) 9
4 ESP32-S2-MINI-2U Pin Layout (Top View) 10
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5 ESP32-S2-MINI-2 Schematics 20
6 ESP32-S2-MINI-2U Schematics 21
7 Peripheral Schematics 22
8 ESP32-S2-MINI-2 Physical Dimensions 23
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9 ESP32-S2-MINI-2U Physical Dimensions 24
10 ESP32-S2-MINI-2 Recommended PCB Land Pattern 25
11 ESP32-S2-MINI-2U Recommended PCB Land Pattern 26
12 Dimensions of External Antenna Connector 27
13 Reflow Profile 28
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2 Block Diagram
2 Block Diagram
ESP32-S2-MINI-2
40 MHz
ESP32-S2-MINI-2
40 MHz
Crystal
3V3 Crystal Antenna
3V3 Antenna
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RF Matching
ESP32-S2FH4 RF Matching
ESP32-S2FN4R2
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ESP32-S2FH4
EN GPIOs
ESP32-S2FN4R2
EN FLASH PSRAM(opt.) GPIOs
(QSPI) (QSPI)
FLASH PSRAM(opt.)
(QSPI) (QSPI)
Figure 1: ESP32S2MINI2 Block Diagram
3V3
3V3
IN
40 MHz
Crystal
40 MHz
Crystal
ESP32-S2-MINI-2U
ESP32-S2-MINI-2U
Antenna
Antenna
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RF Matching
ESP32-S2FH4
RF Matching
ESP32-S2FN4R2
EN ESP32-S2FH4 GPIOs
ESP32-S2FN4R2
FLASH PSRAM(opt.)
EN (QSPI) (QSPI)
GPIOs
FLASH PSRAM(opt.)
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(QSPI) (QSPI)
Figure 2: ESP32S2MINI2U Block Diagram

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3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
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Keepout Zone
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin 51
Pin 52
Pin 60
Pin 59
Pin 58
Pin 57
Pin 56
Pin 55
Pin 54
Pin 53
Pin 50
Pin 49
Pin 48
Pin 47
Pin 46
Pin 62 Pin 65
GND GND
GND Pin 1 Pin 45 EN
GND Pin 2 Pin 44 IO46
3V3
IO0
IO1
IO2
Pin 3
Pin 4
Pin 5
Pin 6 GND
IN GND GND
Pin 43
Pin 42
Pin 41
Pin 40
GND
GND
IO45
RXD0
IO3 Pin 7 Pin 39 TXD0

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Pin 61
IO4 Pin 8 GND
GND
GND Pin 38 IO42
IO5 Pin 9 Pin 37 IO41
IO6 Pin 10 GND GND GND Pin 36 IO40

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Pin 21
Pin 22
Pin 16
Pin 17
Pin 18
Pin 19
Pin 20
Pin 23
Pin 24
Pin 25
Pin 26
Pin 27
Pin 28
Pin 29
Pin 30
Pin 63 Pin 64
GND GND
IO21
GND
IO12
IO14
IO20
IO34
IO13
IO16
IO17
IO18
IO19
IO26
IO33
IO15
NC
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Figure 3: ESP32S2MINI2 Pin Layout (Top View)

3 Pin Definitions
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin 51
Pin 60
Pin 54
Pin 52
Pin 50
Pin 59
Pin 58
Pin 57
Pin 56
Pin 55
Pin 53
Pin 49
Pin 48
Pin 47
Pin 46
Pin 62 Pin 65
GND GND
GND Pin 1 Pin 45 EN
GND Pin 2 Pin 44 IO46
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3V3 Pin 3 Pin 43 GND
IO0 Pin 4 Pin 42 GND
IO2 Pin 6 GND GND GND Pin 40 RXD0
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IO3 Pin 7 Pin 39 TXD0
Pin 61
IO4 Pin 8 GND
GND
GND Pin 38 IO42
IO6 Pin 10 GND GND GND Pin 36 IO40
IO11 Pin 15
IN Pin 31 IO35
Pin 21
Pin 22
Pin 16
Pin 17
Pin 18
Pin 19
Pin 20
Pin 23
Pin 24
Pin 26
Pin 27
Pin 28
Pin 29
Pin 30
Pin 25
Pin 63 Pin 64
GND GND
IO21
IO12
GND
IO14
IO20
IO34
IO13
IO16
IO17
IO18
IO19
IO26
IO33
IO15
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Figure 4: ESP32S2MINI2U Pin Layout (Top View)
3.2 Pin Description

The module has 65 pins. See pin definitions in Table 3.
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For peripheral pin configurations, please refer to ESP32-S2 Series Datasheet.
Table 3: Pin Definitions
Name No. Type1 Function

1, 2, 30,
GND 42, 43, P Ground
46-65
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3V3 3 P Power supply

IO0 4 I/O/T RTC_GPIO0, GPIO0
IO1 5 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
Cont’d on next page

3 Pin Definitions
Table 3 – cont’d from previous page

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Name No. Type Function
IO9 13 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD
IO10 14 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4
IO11 15 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5
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IO12 16 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6
IO13 17 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7
IO14 18 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS
IO15 19 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
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IO16 20 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17 21 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1
IO18 22 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3
IO19 23 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-
IO20 24 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO21 25 I/O/T RTC_GPIO21, GPIO21
2
IO26 26 I/O/T SPICS1, GPIO26
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IO33
IO34
IO35
IO36
27
28
29
31
32
—
I/O/T
I/O/T
I/O/T
I/O/T
NC
IN
SPIIO4, GPIO33, FSPIHD
SPIIO5, GPIO34, FSPICS0
SPIIO6, GPIO35, FSPID
SPIIO7, GPIO36, FSPICLK
IO37 33 I/O/T SPIDQS, GPIO37, FSPIQ
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IO38 34 I/O/T GPIO38, FSPIWP
IO39 35 I/O/T MTCK, GPIO39, CLK_OUT3
IO40 36 I/O/T MTDO, GPIO40, CLK_OUT2
IO41 37 I/O/T MTDI, GPIO41, CLK_OUT1
IO42 38 I/O/T MTMS, GPIO42
TXD0 39 I/O/T U0TXD, GPIO43, CLK_OUT1
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RXD0 40 I/O/T U0RXD, GPIO44, CLK_OUT2

IO45 41 I/O/T GPIO45
IO46 44 I GPIO46
High: on, enables the chip.
EN 45 I Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
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1
P: power supply; I: input; O: output; T: high impedance.
2
IO26 is used by the embedded PSRAM on the ESP32-S2-MINI-2-N4R2 and ESP32-S2-MINI-2U-
N4R2 modules, and cannot be used for other purposes.

3 Pin Definitions
3.3 Strapping Pins

Note:
The content below is excerpted from Section Strapping Pins in ESP32-S2 Series Datasheet. For the strapping pin mapping
between the chip and modules, please refer to Chapter 5 Module Schematics.
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ESP32-S2 has three strapping pins:
• GPIO0
• GPIO45
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• GPIO46
Software can read the values of corresponding bits from register ”GPIO_STRAPPING”.
During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as
strapping bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down.
GPIO0, GPIO45 and GPIO46 are connected to the chip’s internal weak pull-up/pull-down during the chip reset.
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Consequently, if they are unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of these strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S2.
After reset, the strapping pins work as normal-function pins.

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Refer to Table 4 for a detailed boot-mode configuration of the strapping pins.
Table 4: Strapping Pins
VDD_SPI Voltage 1 2
Pin Default 3.3 V 1.8 V

GPIO45 Pull-down 0 1
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3
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO46 Pull-down Don’t-care 0
Enabling/Disabling ROM Messages Print During Booting 4 5
Pin Default Enabled Disabled

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GPIO46 Pull-down See note 5 See note 5
Note:
1. The functionality of strapping pin GPIO45 to select VDD_SPI voltage may be disabled by setting VDD_SPI_FORCE
eFuse to 1. In such a case the voltage is selected with eFuse bit VDD_SPI_TIEH.
2. Since ESP32-S2FH2, ESP32-S2FH4, ESP32-S2FN4R2, and ESP32-S2R2 come with both/either 3.3 V SPI flash
and/or PSRAM, VDD_SPI must be configured to 3.3 V.
3. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior.

3 Pin Definitions
4. ROM code can be printed over U0TXD (by default) or DAC_1, depending on the eFuse bit.
5. When eFuse UART_PRINT_CONTROL value is:

0, print is normal during boot and not controlled by GPIO46.
1 and GPIO46 is 0, print is normal during boot; but if GPIO46 is 1, print is disabled.
2 and GPIO46 is 0, print is disabled; but if GPIO46 is 1, print is normal.
3, print is disabled and not controlled by GPIO46.
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4 Electrical Characteristics
4.1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
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indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 5: Absolute Maximum Ratings
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Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C
4.2 Recommended Operating Conditions
Symbol
VDD33
IV DD
Parameter
Power supply voltage
IN
Table 6: Recommended Operating Conditions
Current delivered by external power supply

Min
3.0
0.5
Typ
3.3
—
Max
3.6
—
Unit
V
A
85 °C version 85
TA Operating ambient temperature –40 — °C
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105 °C version 105
4.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)

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Symbol Parameter Min Typ Max Unit

CIN Pin capacitance — 2 — pF
1 1
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
1
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
2 1
VOH High-level output voltage 0.8 × VDD — — V
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2 1
VOL Low-level output voltage — — 0.1 × VDD V
1
High-level source current (VDD = 3.3 V, VOH >=
IOH — 40 — mA
2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Pull-up resistor — 45 — kΩ
RP D Pull-down resistor — 45 — kΩ
1 1
VIH_nRST Chip reset release voltage 0.75 × VDD — VDD + 0.3 V
1
VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD V

1
VDD is the I/O voltage for pins of a particular power domain.
2
VOH and VOL are measured using high-impedance load.
4.4 Current Consumption Characteristics

Owing to the use of advanced power-management technologies, the module can switch between different power
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modes. For details on different power modes, please refer to Section RTC and Low-Power Management
in ESP32-S2 Series Datasheet.
Table 8: RF Current Consumption in Active Mode
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Work mode Description Peak (mA)
802.11b, 20 MHz, 1 Mbps, @19 dBm 302
802.11g, 20 MHz, 54 Mbps, @17.5 dBm 264
TX
802.11n, 20 MHz, MCS7, @16.5 dBm 257
Active (RF working)
802.11n, 40 MHz, MCS7, @16.5 dBm 267
802.11b/g/n, 20 MHz 77
RX
802.11n, 40 MHz 81
1
2
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The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on 100% duty cycle.
The current consumption figures in RX mode are for cases where the peripherals are disabled
and the CPU idle.
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Note:
The content below is excerpted from Section Power Consumption in Other Modes in ESP32-S2 Series Datasheet.
The measurements below are applicable to ESP32-S2, ESP32-S2FH2, and ESP32-S2FH4. Since
ESP32-S2FN4R2 and ESP32-S2R2 are embedded with PSRAM, their current consumption might be
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higher.
Table 9: Current Consumption in Modemsleep Mode
Typ
CPU Frequency
Mode Description All Peripherals Clocks All Peripherals Clocks
(MHz)
Disabled (mA) Enabled (mA)1
CPU is idle 20.0 28.0
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240
CPU is running 23.0 32.0
Modem-sleep2,3 160
80
1
In practice, the current consumption might be different depending on which peripherals are enabled.
2
In Modem-sleep mode, Wi-Fi is clock gated.
3
In Modem-sleep mode, the consumption might be higher when accessing flash. For a flash rated at 80
Mbit/s, in SPI 2-line mode the consumption is 10 mA.

Table 10: Current Consumption in LowPower Modes
Mode Description Typ (µA)

1
Light-sleep VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance 750
The ULP co-processor ULP-FSM 170
2
is powered on ULP-RISC-V 190
3
Deep-sleep ULP sensor-monitored pattern 22
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RTC timer + RTC memory 25
RTC timer only 20
Power off CHIP_PU is set to low level, the chip is powered off 1
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1
In Light-sleep mode, with all related SPI pins pulled up, the current consumption of the embedded
PSRAM is 140 µA. Chip variants with embedded PSRAM include ESP32-S2FN4R2 and ESP32-S2R2.
2
During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I2C
are able to operate.
3
The “ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor
works periodically. When touch sensors work with a duty cycle of 1%, the typical current consumption
is 22 µA.
4.5 WiFi Radio

4.5.1 WiFi RF Standards
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Table 11: WiFi RF Standards
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Name Description
1
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
802.11b: 1, 2, 5.5 and 11 Mbps
20 MHz 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Data rate
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802.11n: MCS0-7, 72.2 Mbps (Max)

40 MHz 802.11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, external antenna connector
1
Device should operate in the center frequency range allocated by regional regulatory authorities.
Target center frequency range is configurable by software.
2
For the modules that use external antenna connectors, the output impedance is 50 Ω. For other
modules without external antenna connectors, the output impedance is irrelevant.
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4.5.2 WiFi RF Transmitter (TX) Specifications

Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 12.

Table 12: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 19.0 —
802.11b, 11 Mbps — 19.0 —
802.11g, 6 Mbps — 17.5 —
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802.11g, 54 Mbps — 17.5 —
802.11n, HT20, MCS0 — 17.5 —
802.11n, HT20, MCS7 — 16.5 —
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802.11n, HT40, MCS0 — 17.5 —
802.11n, HT40, MCS7 — 16.5 —
Table 13: TX EVM Test
Min Typ SL1

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps, @19 dBm — –25.0 –10
802.11b, 11 Mbps, @19 dBm
802.11g, 6 Mbps, @17.5 dBm
802.11g, 54 Mbps, @17.5 dBm
802.11n, HT20, MCS0, @17.5 dBm
IN —
—
—
—
–25.0
–25.0
–28.5
–27.0
–10
–5
–25
–5
802.11n, HT20, MCS7, @16.5 dBm — –30.0 –27
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802.11n, HT40, MCS0, @17.5 dBm — –27.0 –5
802.11n, HT40, MCS7, @16.5 dBm — –30.0 –27
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SL stands for standard limit value.
4.5.3 WiFi RF Receiver (RX) Specifications

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Table 14: RX Sensitivity
Min Typ Max

Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — –96.5 —
802.11b, 2 Mbps — –94.0 —
802.11b, 5.5 Mbps — –91.5 —
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802.11b, 11 Mbps — –88.0 —

802.11g, 6 Mbps — –92.0 —
802.11g, 9 Mbps — –90.5 —
802.11g, 12 Mbps — –89.0 —
802.11g, 18 Mbps — –87.0 —
802.11g, 24 Mbps — –84.0 —
802.11g, 36 Mbps — –80.0 —
802.11g, 48 Mbps — –76.0 —


Min Typ Max
Rate
(dBm) (dBm) (dBm)
802.11g, 54 Mbps — –74.5 —
802.11n, HT20, MCS0 — –91.5 —
802.11n, HT20, MCS1 — –88.5 —
Y
802.11n, HT20, MCS2 — –86.0 —
802.11n, HT20, MCS3 — –83.0 —
802.11n, HT20, MCS4 — –79.0 —
802.11n, HT20, MCS5 — –75.0 —
AR
802.11n, HT20, MCS6 — –73.5 —
802.11n, HT20, MCS7 — –72.0 —
802.11n, HT40, MCS0 — –89.0 —
802.11n, HT40, MCS1 — –86.0 —
802.11n, HT40, MCS2 — –83.5 —
802.11n, HT40, MCS3 — –79.5 —
802.11n, HT40, MCS4 — –76.0 —
802.11n, HT40, MCS5
802.11n, HT40, MCS6
802.11n, HT40, MCS7
IN —
—
—
–72.0
–70.5
–69.5
—
—
—
Table 15: Maximum RX Level

IM
Min Typ Max
Rate
(dBm) (dBm) (dBm)
802.11b, 1 Mbps — 5 —
802.11b, 11 Mbps — 5 —
802.11g, 6 Mbps — 5 —
802.11g, 54 Mbps — 5 —
EL
802.11n, HT20, MCS0 — 5 —

802.11n, HT20, MCS7 — 5 —
802.11n, HT40, MCS0 — 5 —
802.11n, HT40, MCS7 — 5 —
Table 16: RX Adjacent Channel Rejection

PR
Min Typ Max

Rate
(dB) (dB) (dB)
802.11b, 1 Mbps — 35 —
802.11b, 11 Mbps — 35 —
802.11g, 6 Mbps — 31 —
802.11g, 54 Mbps — 14 —
802.11n, HT20, MCS0 — 31 —
802.11n, HT20, MCS7 — 13 —


Min Typ Max
Rate
(dB) (dB) (dB)
802.11n, HT40, MCS0 — 19 —
802.11n, HT40, MCS7 — 8 —
Y
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IN
IM
EL
PR

PR
Espressif Systems
5 Module Schematics
5 Module Schematics
This is the reference design of the module.
5 4 3 2 1
GND
E
GND GND
3
Y1
GND
GND XOUT
The values of C1 and C4 vary with C1 C4
LIM
the selection of the crystal.
XIN
D TBD TBD D
VDD33 The value of R4 varies with the actual
2
PCB board.
C2 C3 GND
40MHz(±10ppm)
100pF 1uF
CHIP_PU
VDD33 GPIO46
GND GND GPIO45
Submit Documentation Feedback
U0RXD
0
R3 499 U0TXD GND
C5 GPIO42
GPIO41
0.1uF GPIO40
GND
R4
GPIO39
VDD33
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
IN
GND
C L1 2.0nH C
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
C10 VDD33 62 65
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
C6 C7 C8 C9 GND GND
20
0.1uF VDD33 1 45 CHIP_PU

GND
CHIP_PU
GPIO46
VDDA
XTAL_P
XTAL_N
VDDA
GPIO45
U0RXD
U0TXD
MTMS
MTDO
MTCK
MTDI
VDD3P3_CPU
10uF 1uF 0.1uF 100pF 2 GND EN 44 GPIO46
3 GND IO46 43
GND GPIO0 4 3V3 GND 42
GND GND GND GND GPIO1 5 IO0 GND 41 GPIO45
ANT1 1 42 GPIO38 GPIO2 6 IO1 IO45 40 U0RXD
1 RF_ANT L2 TBD LNA_IN 2 VDDA GPIO38 41 GPIO37 GPIO3 7 IO2 RXD0 39 U0TXD
AR
2 3 LNA_IN GPIO37 40 GPIO36 GPIO4 8 IO3 TXD0 38 GPIO42
VDD3P3 GPIO36 IO4 ESP32-S2-MINI-2 IO42
C11 C12 4 39 GPIO35 GPIO5 9 37 GPIO41
GPIO0 5 VDD3P3 GPIO35 38 GPIO34 GPIO6 10 IO5 IO41 36 GPIO40
PCB_ANT
GPIO1 6 GPIO0 GPIO34 37 GPIO33 GPIO7 11 IO6 IO40 35 GPIO39
TBD TBD
GPIO2 7 GPIO1 GPIO33 36 GPIO8 12 IO7 IO39 34 GPIO38
GPIO3 8 GPIO2 SPID 35 GPIO9 13 IO8 IO38 33 GPIO37
GND GND GND GPIO4 9 GPIO3 SPIQ 34 GPIO10 14 IO9 IO37 32 GPIO36
GPIO5 10 GPIO4 SPICLK 33 GPIO11 15 IO10 IO36 31 GPIO35
GPIO6 11 GPIO5 SPICS0 32 IO11 IO35
The values of C11, L2 and C12 GPIO6 SPIWP
GPIO7 12 31 63 64
ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5
vary with the actual PCB board.
GND
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO33
IO34
GPIO8 13 GPIO7 VDD3P3_RTC_IO SPIHD 30 GND GND
NC
B B
GPIO9 14 GPIO8 VDD_SPI 29 GPIO26 VDD33
VDD3P3_RTC
GPIO9 SPICS1
XTAL_32K_N
XTAL_32K_P
U2
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
C14
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO19
GPIO20
GPIO21
C13
DAC_1
DAC_2
Y
VDD_SPI
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
GPIO33
GPIO34
0.1uF 1uF D1
ESD
U1 ESP32-S2FH4 GND
15
16
17
18
19
20
21
22
23
24
25
26
27
28
VDD33 ESP32-S2FN4R2 GND GND VDD33

ESP32-S2-MINI-2(pin-out)
GND
C15 C16
(Chip Revision v1.0)
0.1uF 0.1uF
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GND GND
A A
Figure 5: ESP32S2MINI2 Schematics Title

<ESP32-S2-MINI-2>
Size Page Name Rev

A4 <02_ESP32-S2-MINI-2> Proprietary
V1.0
Date: Friday, February 25, 2022 Sheet 2 of 2
5 4 3 2 1
PR
5 4 3 2 1
Espressif Systems
5 Module Schematics
GND
GND GND
3
Y1
GND
GND XOUT
The values of C1 and C4 vary with C1 C4
the selection of the crystal.
XIN
D TBD TBD D
VDD33 The value of R4 varies with the actual
2
E
PCB board.
C2 C3 GND
40MHz(±10ppm)
100pF 1uF
CHIP_PU GND
LIM
VDD33 GPIO46
GND GND GPIO45
U0RXD
0
R3 499 U0TXD
C5 GPIO42
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
GPIO41
0.1uF GPIO40
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
R4
GPIO39 62 65
VDD33 GND GND
GND VDD33 1 45 CHIP_PU
C L1 2.0nH 2 GND EN 44 GPIO46 C
C10 VDD33 3 GND IO46 43
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
Submit Documentation Feedback
C6 C7 C8 C9 GPIO0 4 3V3 GND 42

0.1uF GPIO1 5 IO0 GND 41 GPIO45
GND
CHIP_PU
GPIO46
VDDA
XTAL_P
XTAL_N
VDDA
GPIO45
U0RXD
U0TXD
MTMS
MTDO
MTCK
MTDI
VDD3P3_CPU
10uF 1uF 0.1uF 0.1uF GPIO2 6 IO1 IO45 40 U0RXD
GPIO3 7 IO2 RXD0 39 U0TXD
GND GPIO4 8 IO3 TXD0 38 GPIO42
IO4 ESP32-S2-MINI-2U IO42
GND GND GND GND GPIO5 9 37 GPIO41
1 42 GPIO38 GPIO6 10 IO5 IO41 36 GPIO40
IN
1 RF_ANT L2 TBD LNA_IN 2 VDDA GPIO38 41 GPIO37 GPIO7 11 IO6 IO40 35 GPIO39
3 LNA_IN GPIO37 40 GPIO36 GPIO8 12 IO7 IO39 34 GPIO38
4 VDD3P3 GPIO36 39 GPIO35 GPIO9 13 IO8 IO38 33 GPIO37
ANT1 C11 C12
4
3
2
VDD3P3 GPIO35 IO9 IO37

21
GPIO0 5 38 GPIO34 GPIO10 14 32 GPIO36

GPIO1 6 GPIO0 GPIO34 37 GPIO33 GPIO11 15 IO10 IO36 31 GPIO35
CONN TBD TBD
GPIO2 7 GPIO1 GPIO33 36 IO11 IO35
GPIO3 8 GPIO2 SPID 35 63 64
GND
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO33
IO34
GND GND GND GPIO4 9 GPIO3 SPIQ 34 GND GND
NC
GPIO5 10 GPIO4 SPICLK 33
GPIO6 11 GPIO5 SPICS0 32 U2
The values of C11, L2 and C12
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GPIO6 SPIWP
AR
GPIO7 12 31
vary with the actual PCB board. GPIO8 13 GPIO7 SPIHD 30
VDD3P3_RTC_IO
B B
GPIO9 14 GPIO8 VDD3P3_RTC VDD_SPI 29 GPIO26 VDD33
GPIO9 SPICS1
XTAL_32K_N
XTAL_32K_P
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO26
GPIO33
GPIO34
C14 GND
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO19
GPIO20
GPIO21
C13
DAC_1
DAC_2
VDD_SPI
0.1uF 1uF D1
ESD ESP32-S2-MINI-2U(pin-out)
ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5
U1 ESP32-S2FH4
15
16
17
18
19
20
21
22
23
24
25
26
27
28
VDD33 ESP32-S2FN4R2 GND GND VDD33
GND
C15 C16
Y
0.1uF 0.1uF
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GND GND
A A
Figure 6: ESP32S2MINI2U Schematics

(Chip Revision v1.0)
Title
<ESP32-S2-MINI-1U>
Size Page Name Rev

A4 <02_ESP32-S2-MINI-1U> 1.1 Confidential and Proprietary
Date: Monday, July 18, 2022 Sheet 2 of 2
5 4 3 2 1
6 Peripheral Schematics
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
GND
Y
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
EPAD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
62 65
GND GND
AR
VDD33 1 45 EN C2 TBD GND
2 GND EN 44 IO46
3 GND IO46 43 VDD33
IO0 4 3V3 GND 42 JP1
C1 C3 IO1 5 IO0 GND 41 IO45 R1 TBD 1
IO2 6 IO1 IO45 40 RXD0 2 1
22uF 0.1uF IO3 7 IO2 RXD0 39 TXD0 3 2
IO4 8 IO3 TXD0 38 IO42 4 3
IO4 ESP32-S2-MINI-2/ESP32-S2-MINI-2U IO42 4
GND GND IO5 9 37 IO41
IO6 10 IO5 IO41 36 IO40 UART
JP4 IO7 11 IO6 IO40 35 IO39 GND
1 IO8 12 IO7 IO39 34 IO38 JP2
1 2 IO9 13 IO8 IO38 33 IO37 TMS 1
2 IO10 14 IO9 IO37 32 IO36 TDI 2 1
IO10 IO36 2
Boot Option
GND
IO11 15
63
IO11 GND
IN IO35
31
64
IO35 TDO
TCK
3
4 3
4
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO33
IO34
GND GND JTAG

NC
U1 SW1
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
R7 0 EN
C8 0.1uF
IO12
IO13
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO33
IO34
IM
GND C4 12pF(NC) GND GND
R2
JP3
1
X1 R3 0(NC) R6 0 USB_D+ 2
32.768kHz(NC) R5 0(NC) R4 0 USB_D- 1 2
1
2
NC
X1: ESR = Max. 70 KΩ C6 C5 USB OTG

GND
C7 12pF(NC) NC: No component. TBD TBD
GNDGND
EL
Figure 7: Peripheral Schematics
• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste.
• To ensure that the power supply to the ESP32-S2 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
PR
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
4 and reset sequence timing of the chip. 3For ESP32-S2’s power-up and reset sequence
and the power-up 2
timing diagram, please refer to Section Power Scheme in ESP32-S2 Series Datasheet.

7.1 Physical Dimensions
Unit: mm
Y
15.4±0.15 0.8
5.05
AR
0.6
20.5±0.15
14 1.2
15.45
13.2
12.3
10.6
14.8
11.5
13.55
0.6
5
0.
4.5
0.5
Ø
4.5
1.2
Top view
0.7
IN
2.4±0.15
Side view
10.6
11.5
12.3
13.2
14.8
Bottom view
IM
Figure 8: ESP32S2MINI2 Physical Dimensions
EL
PR

Unit: mm
15.4±0.15 0.8
0.85
0.6
1.2
3.2
Y
1.6
15.4±0.15
14
13.2
14.8
12.3
10.6
11.5
13.55
0.6
5
0.
4.5
0.5
Ø
4.5
1.2
AR
0.7 2.4±0.15 10.6
11.5
12.3
13.2
14.8
Top view Side view Bottom view
Figure 9: ESP32S2MINI2U Physical Dimensions
Note:
IN
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.
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7.2 Recommended PCB Land Pattern
Unit: mm
: Pad
Y
15.4
5.05
AR
Pin 1 Antenna Area
1.2
0.6
20.5
13.2
12.3
10.6
14.8
11.5
IN 4.5 1.2
4.5
IM 0.6
10.6
11.5
12.3
13.2
14.8
EL
Figure 10: ESP32S2MINI2 Recommended PCB Land Pattern

PR

Unit: mm
: Pad
Pin 1 15.4
Y
1.2
0.6
AR
13.2
15.4
14.8
12.3
10.6
11.5
1.2
4.5
4.5
0.6
IN 10.6
11.5
12.3
13.2
IM
14.8
Figure 11: ESP32S2MINI2U Recommended PCB Land Pattern

EL
PR

7.3 Dimensions of External Antenna Connector

ESP32-S2-MINI-2U uses the third generation external antenna connector as shown in Figure 12. This connector
is compatible with the following connectors:
• W.FL Series connector from Hirose
• MHF III connector from I-PEX
Y
• AMMC connector from Amphenol
AR
Unit: mm
Tolerance: +/-0.1 mm
CONTACT
A
2.00±0.10
1.7
1.7
IN
GROUND CONTACT
2.05±0.10
IM
0.57
0.85
CONTACT
1.40
0.10
EL
HOUSING
HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;
SHELL
CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;

SECTION: A-A
SCALE: 1:1
SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;
PERFORMANCE:
CONTACT RESISTANCE: 20mOHM Max.

PR
DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE;
INSULATION RESISTANCE: 500MOHM Min.
Figure 12: Dimensions of External Antenna Connector

8 Product Handling
8 Product Handling
8.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
Y
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
/60%RH. If the above conditions are not met, the module needs to be baked.
AR
8.2 Electrostatic Discharge (ESD)
• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
8.3 Reflow Profile

Solder the module in a single reflow.
IN
Temperature (℃)
Peak Temp.
IM
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s
Ramp-up zone
EL
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0 50 100 150 200 250
PR
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 13: Reflow Profile

8 Product Handling
8.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.
Y
AR
IN
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PR

9 Related Documentation and Resources
9 Related Documentation and Resources

Related Documentation
• ESP32-S2 Series Datasheet – Specifications of the ESP32-S2 hardware.
• ESP32-S2 Technical Reference Manual – Detailed information on how to use the ESP32-S2 memory and peripherals.
Y
• ESP32-S2 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-S2 into your hardware product.
• ESP32-S2 Series SoC Errata – Descriptions of errors in ESP32-S2 series of SoCs from chip revision v0.0 forward.
• Certificates
https://espressif.com/en/support/documents/certificates
AR
• ESP32-S2 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns
• ESP32-S2 Advisories – Information on security, bugs, compatibility, component reliability.
https://espressif.com/en/support/documents/advisories
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
IN
• ESP-IDF Programming Guide for ESP32-S2 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
IM
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
EL
• ESP32-S2 Series SoCs – Browse through all ESP32-S2 SoCs.

https://espressif.com/en/products/socs?id=ESP32-S2
• ESP32-S2 Series Modules – Browse through all ESP32-S2-based modules.
https://espressif.com/en/products/modules?id=ESP32-S2
• ESP32-S2 Series DevKits – Browse through all ESP32-S2-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-S2
PR
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions

Revision History
Revision History
Date Version Release notes

2022-09-19 v0.5 Preliminary release
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Disclaimer and Copyright Notice

Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
PR
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.

NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property
www.espressif.com of their respective owners, and are hereby acknowledged.
Copyright © 2022 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.

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ESP32­S2­MINI­2

• 2 MB PSRAM (ESP32-S2FN4R2 only)

• On-board PCB antenna (ESP32-S2-MINI-2)

• Bit rate: 802.11n up to 150 Mbps

• 0.4 µs guard interval support • Operating voltage/Power supply: 3.0 ~ 3.6 V

• Center frequency range of operating channel: • Operating ambient temperature:

interface, IR, pulse counter, LED PWM, TWAI

Espressif Systems 2 ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5

Table 1: ESP32­S2­MINI­2 (ANT) Series Comparison1

Ambient Temp.2 Size3

Table 2: ESP32­S2­MINI­2U (CONN) Series Comparison

The flash is integrated in the chip’s package.

• Generic Low-power IoT Data Loggers • Speech Recognition

• Cameras for Video Streaming • Image Recognition

• Over-the-top (OTT) Devices • Mesh Network

Espressif Systems 3 ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5

• Home Automation • Health Care Applications

• Smart Home Control Panel

Espressif Systems 4 ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5

7 Physical Dimensions and PCB Land Pattern

8.2 Electrostatic Discharge (ESD) 28

9 Related Documentation and Resources 30

Espressif Systems 5 ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5

Espressif Systems 6 ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5

Espressif Systems 7 ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5

Figure 1: ESP32­S2­MINI­2 Block Diagram

Figure 2: ESP32­S2­MINI­2U Block Diagram

Espressif Systems 8 ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5

3.1 Pin Layout

GND Pin 1 Pin 45 EN

GND Pin 2 Pin 44 IO46

IO3 Pin 7 Pin 39 TXD0

IO5 Pin 9 Pin 37 IO41

IO6 Pin 10 GND GND GND Pin 36 IO40

IO7 Pin 11 Pin 35 IO39

IO8 Pin 12 Pin 34 IO38

IO9 Pin 13 Pin 33 IO37

IO10 Pin 14 Pin 32 IO36

IO11 Pin 15 Pin 31 IO35

Figure 3: ESP32­S2­MINI­2 Pin Layout (Top View)

Espressif Systems 9 ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5

GND Pin 1 Pin 45 EN

GND Pin 2 Pin 44 IO46

IO0 Pin 4 Pin 42 GND

IO1 Pin 5 Pin 41 IO45

IO2 Pin 6 GND GND GND Pin 40 RXD0

IO5 Pin 9 Pin 37 IO41

IO6 Pin 10 GND GND GND Pin 36 IO40

IO7 Pin 11 Pin 35 IO39

IO8 Pin 12 Pin 34 IO38

IO9 Pin 13 Pin 33 IO37

IO10 Pin 14 Pin 32 IO36

3.2 Pin Description

For peripheral pin configurations, please refer to ESP32-S2 Series Datasheet.

Table 3: Pin Definitions

Name No. Type1 Function

3V3 3 P Power supply

Espressif Systems 10 ESP32-S2-MINI-2 & MINI-2U Datasheet v0.5

Table 3 – cont’d from previous page

ESP32S2MINI2

Table 1: ESP32S2MINI2 (ANT) Series Comparison1

Table 2: ESP32S2MINI2U (CONN) Series Comparison

Figure 1: ESP32S2MINI2 Block Diagram

Figure 2: ESP32S2MINI2U Block Diagram

Figure 3: ESP32S2MINI2 Pin Layout (Top View)

Table 9: Current Consumption in Modemsleep Mode

Table 10: Current Consumption in LowPower Modes

4.5 WiFi Radio

4.5.2 WiFi RF Transmitter (TX) Specifications

4.5.3 WiFi RF Receiver (RX) Specifications

Figure 5: ESP32S2MINI2 Schematics Title

Figure 6: ESP32S2MINI2U Schematics

Figure 9: ESP32S2MINI2U Physical Dimensions

Figure 10: ESP32S2MINI2 Recommended PCB Land Pattern