TL7702
TL7702
TL7702
SUPPLY-VOLTAGE SUPERVISORS
SLVS028I − APRIL 1983 − REVISED JULY 2009
description/ordering information
ORDERING INFORMATION{
ORDERABLE TOP-SIDE
TA PACKAGE}
PART NUMBER MARKING
PDIP (P) Tube of 50 TL7702ACP TL7702ACP
Tube of 75 TL7702ACD
SOIC (D) 7702AC
Reel of 2500 TL7702ACDR
PDIP (P) Tube of 50 TL7705ACP TL7705ACP
Tube of 75 TL7705ACD
SOIC (D) 7705AC
Reel of 2500 TL7705ACDR
SOP (PS) Reel of 2000 TL7705ACPSR T7705A
0°C
0 C to 70°C
70 C PDIP (P) Tube of 50 TL7709ACP TL7709ACP
Tube of 75 TL7709ACD
SOIC (D) 7709AC
Reel of 2500 TL7709ACDR
PDIP (P) Tube of 50 TL7712ACP TL7709ACP
Tube of 75 TL7712ACD
SOIC (D) 7712AC
Reel of 2500 TL7712ACDR
PDIP (P) Tube of 50 TL7715ACP TL7715ACP
SOIC (D) Tube of 75 TL7715ACD 7715AC
PDIP (P) Tube of 50 TL7702AIP TL7702AIP
Tube of 75 TL7702AID
SOIC (D) 7702AI
Reel of 2500 TL7702AIDR
−40°C
40 C to 85°C
85 C PDIP (P) Tube of 50 TL7705AIP TL7705AIP
Tube of 75 TL7705AID
SOIC (D) 7705AI
Reel of 2500 TL7705AIDR
SOIC (D) Reel of 2500 TL7712AIDR 7712AI
† For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
8
VCC
Reference
Voltage ≈100 µA
6
3 RESET
CT
7
SENSE 5
RESET
R1
(see Note A)
R2
(see Note A)
2
RESIN
1
REF
4
GND
timing diagram
VCC and SENSE
Threshold Voltage
VCC ≈ 3.6 V
VCC ≈ 2 V
RESET
Î
Î
td td
Output
Undefined Output
Undefined
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V
Input voltage range, VI, RESIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 20 V
Input voltage range, VI, SENSE: TL7702A (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
TL7705A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 20 V
TL7709A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 20 V
TL7712A, TL7715A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 20 V
High-level output current, IOH, RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA
Low-level output current, IOL, RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Package thermal impedance, θJA (see Notes 3 and 4): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. For proper operation of the TL7702A, the voltage applied to the SENSE terminal should not exceed VCC − 1 V or 6 V, whichever
is less.
3. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
4. The package thermal impedance is calculated in accordance with JESD 51-7.
0V
VIH
RESIN Undefined 2V
0.7 V
VIL
tf tr tpd
VOH(RESET)
90% 90% 90%
RESET
ÎÎ
50%
10%
td
td tf td
90%
RESET 50%
10% 10% 10% 10%
VOL(RESET)
tr
TYPICAL CHARACTERISTICS†
t − Deassertion Time − µ s
t − Assertion Time − ns
5
34
4
RESET tf
30 RESET tr
3
26
2
RESET tr
22 RESET tf 1
18 0
0 2 4 6 8 10 0 2 4 6 8 10
RL − Load Resistance − kΩ RL − Load Resistance − kΩ
Figure 2 Figure 3
2.8
t − Assertion Time − ns
36
RESET tf
RESET tr 2.4
32
2
28
1.6 RESET tr
24 RESET tf
1.2
20 0.8
0 25 50 75 100 125 150 175 200 0 25 50 75 100 125 150 175 200
CL − Load Capacitance − pF CL − Load Capacitance − pF
Figure 4 Figure 5
† For proper operation, both RESET and RESET should be terminated with resistors of similar value. Failure to do so may cause unwanted
plateauing in either output waveform during switching.
APPLICATION INFORMATION
5V
12 V
8 8
22 kΩ 10 kΩ
7 VCC VCC
7
SENSE SENSE
2 5 2 5
RESIN RESET RESIN RESET System Reset
TL7712A TL7705A
6 10 kΩ 6
RESET RESET
3 1 3 1
CT REF CT REF
GND 10 kΩ GND 10 kΩ
CT 4 CT 4
0.1 µF 0.1 µF
GND
8 t d(s)
C T(F) +
VCC 1.3 10 4
7
SENSE
2 5
RESIN RESET
TL7712A 6
RESET
3 1
CT REF
GND 10 kΩ
CT 4
0.1 µF
−12 V
5V
8
10 kΩ
VCC VCC
7
SENSE
2 5
RESIN RESET RESET
t d(s) TL7705A TMS7000
C T(F) + 6
1.3 10 4 RESET
3 1
CT REF
VSS
GND 10 kΩ
CT 4
0.1 µF
GND
APPLICATION INFORMATION
5V
µA7805 4.7 kΩ 25 kΩ
8
INPUT OUTPUT VCC System RESET
7 SENSE
Input S
5 G
COMMON RESET Q1
TL7705A 2N3994
6
RESET D
3 1
CT REF
GND 4.7 kΩ
CI CO CT 4
0.1 µF
VCC
10 kΩ 750 Ω
Q1
2N4036
8 2.7 kΩ
VCC System RESET
7 5
SENSE Input SENSE RESET
TL77xxA
2 6
RESIN RESET
3 1 10 kΩ 1 kΩ
CT REF
GND
CT 4 0.1 µF
www.ti.com 9-Jul-2010
PACKAGING INFORMATION
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jul-2010
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jul-2010
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jul-2010
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jul-2010
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Sep-2009
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Sep-2009
Pack Materials-Page 2
MECHANICAL DATA
0.400 (10,16)
0.355 (9,00)
8 5
0.280 (7,11)
0.245 (6,22)
1 4
0.065 (1,65)
0.045 (1,14)
0.023 (0,58)
0°–15°
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NO. OF A B
18 17 16 15 14 13 12
TERMINALS
** MIN MAX MIN MAX
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
4040140 / D 10/96
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