XGZP6847 Pressure Sensor Module: Features

Only for MEMS Silicon Based Piezoresistive Pressure Sensor Solutions from Die to Package
XGZP6847 Pressure Sensor Module

Features
■ Ranges: -100kPa～0kPa…1000kPa(-15PSI～0PSI…150PSI)
■ Perfect Accuracy(±1.0%) of full scale
■ Gage,Vacuum Type
■ For Non-corrosive gas or dry air
■ Calibrated,Amplified analog output
■ Temp. Compensated:0℃～+85℃(32℉～+185℉)
■ Direct application,Low Cost.
Applications
■ For Medical equipment field, such as therapy equipment, breathing machine, oxygen
generating equipment,monitor,alcohol tester.etc.
■ For Sport and fitness equipment field,such as massage,air spring bed,etc.
■ For Home appliance field, such as washing machine,active oxygen water machine beer
machine,coffee machine, etc.
■ For Other fields, such as air pump,emergency lamp, dust collector, HVAC and pneumatic
device etc.
Introduction
XGZP6847 is a prefect silicon pressure sensor module offering a ratiometric analog interface
for reading pressure over the specified full scale pressure span and temp.range.
The XGZP6847 incorporates a silicon piezoresistive pressure sensor(XGZP SOP6) and an
on-board Application Specific Integrated Circuit(ASIC) under PC board in a DIP8 package.
The XGZP6847 is fully calibrated and temperature compensated for offset,sensitivity,
temperature and non-linearity,so XGZP6847 pressure sensor module satisfy the prefect
repeatability,linearity, stability and sensibility, which can be applied directly in medical equipment,
fitness machine,home electronics,and other pneumatic devices etc.
XGZP6847 pressure sensor module is for high volume application at an affordable cost and
perfect performance.
Custom calibrations(excitation voltage,output voltage,and pressure range) are available.
www.c-linktech.co.kr
Performance Parameter
Unless otherwise specified, measurements were taken with a supply voltage of 5 Vdc at a
temperature of 25±1℃ and humidity ranging from 25﹪～85
Item Data Unit

Output Signal 0.5-4.5 V
Accuracy ±1.0 %Span
TSO(Temp. Coefficient of Offset) ±0.03 %FS/℃
TCS(Temp. Coefficient of Span) ±0.03 %FS/℃
Long Term Stability(1year) ±2 %Span
2X (≤500kPa)
Over Pressure Rated
1.5X(≥500kPa)
Compensation Temp. 0 ～ 85/32 ～ 176
℃/℉
Ambient Temp. -20 ～ 100/-4 ～ 212

℃/℉
Storage Temp. -40 ～ 125/-40 ～ 257

℃/℉
Pressure Range (100kPa=0.1MPa=1bar≈14.5PSI)
Pressure Range（kPa） Model

0 ～ 10 XGZP6847010KPG
0 ～ 20 XGZP6847020KPG
0 ～ 40 XGZP6847040KPG
0 ～ 100 XGZP6847100KPG
0 ～ 200 XGZP6847200KPG
0 ～ 500 XGZP6847500KPG
0 ～ 700 XGZP6847700KPG
0 ～ 1000 XGZP6847001MPG
-100 ～ 0 XGZP6847100KPGN
-30 ～ 0 XGZP6847030KPGN
-20 ～ 0 XGZP6847020KPGN
-40 ～ 40 XGZP6847040KPGPN
-100 ～ 100 XGZP6847100KPGPN
-100 ～ 700 XGZP6847700KPGPN
Available for more custom pressure range
Dimension (Unit:mm/Inch)
Electric Connection
1 2 3 4 5 6
N/C Vdd GND Vdd OUT GND
NOTE:
1,N/C Pins must be left floating
2,Soldering of lead Pins:250’C for 5 sec max.
Notes:
1.Attention that the medium should be compatible with the pressure parts.
2.Please contact us if special request on parameter and application.
XGZP6847 Output VS.Pressure
Model 100KPGN 030KPGN 020KPGN

Output（V） Pressure（kPa）
0.5 -100 -30 -20
1.5 -75 -22.5 -15
2.5 -50 -15 -10
3.5 -25 -7.5 -5
4.5 0 0 0
Model 040KPGPN 100KPGPN 700KPGPN

0.5 -40 -100 -100
1.5 -20 -50 100
2.5 0 0 300
3.5 20 50 500
4.5 40 100 700
010KP 020KP 040KP 200KP 500KP 700KP

Model 100KPG 001MPG
G G G G G G
0.5 0 0 0 0 0 0 0 0
1.5 2.5 5 10 25 50 125 175 250
2.5 5 10 20 50 100 250 350 500
3.5 7.5 15 30 75 150 375 525 750
4.5 10 20 40 100 200 500 700 1000
Notes:
■ Mounting
Adopting land on the PC board for ensuring the sensor is securely fixed.
■ Soldering
Due to its small size, the thermal capacity of the pressure sensor is low.Therefore, take steps to
minimize the effects of external heat.
Damage and changes to characteristics may occur due to heat deformation.
Use a non-corrosive resin type of flux.
Since the pressure sensor is exposed to the atmosphere, do not allow flux to enter inside.
▼ Manual soldering
Set the soldering tip from 260 to 300°C (30W), and solder for no more than 5 seconds.
Please note that output may change if the pressure is applied on the terminals when the
soldering.
Thoroughly clean the soldering iron.
▼ SMD soldering
Please keep the SMD solder bath temperature no higher than 260°C/500°F. When soldering,
heat should be applied no longer than five seconds.
When mounting onto a PCB of low thermal capacity, please avoid SMD soldering as this may
cause heat deformity.
▼ Solder reworking
Finish reworking in one operation.
For reworking of the solder bridge, use a soldering iron with a flat tip. Please do not add more
flux when reworking.
Please use a soldering iron that is below the temperature given in the specifications in order to
maintain the correct temperature at the tip of the soldering iron.
Too much force on the terminals will cause deformation and loss in effectiveness of the solder.
Therefore, please avoid dropping and careless handling of the product.
Please control warping of the PCB within 0.05 mm of the sensor width.
When cut folding the PCB after mounting the sensor, take measures to prevent stress to the
soldered parts.
The sensor terminals are designed to be exposed, so contact of the terminals with metal shards
and the like will cause output errors. Therefore, please be careful and prevent things such as
metal shards and hands from contacting the terminals.
To prevent degradation of the PCB insulation after soldering, please be careful not to get
chemicals on the sensor when coating.
Please consult us regarding the use of lead-free solder.
■ Cleaning
▼ Since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to
enter inside.
▼ Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring.
■ Environment
▼Please avoid using or storing the pressure sensor chip in a place exposed to corrosive gases
(such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sulfides, etc.)
which will adversely affect the performance of the pressure sensor chip.
▼Since this pressure sensor chip does not have a water-proof construction, please do not use
the sensor in a location where it may be sprayed with water, etc.
▼Avoid using the pressure sensors chip in an environment where condensation may form.
Furthermore, its output may fluctuate if any moisture adhering to it freezes.
▼The pressure sensor chip is constructed in such a way that its output will fluctuate when it is
exposed to light. Especially when pressure is to be applied by means of a transparent tube, take
steps to prevent the pressure sensor chip from being exposed to light.
▼Avoid using the pressure sensor chip where it will be susceptible to ultrasonic or other
high-frequency vibration.
■ Quality check under actual loading conditions

To assure reliability, check the sensor under actual loading conditions. Avoid any situation that
may adversely affect its performance.
■ Other handling precautions

▼That using the wrong pressure range or mounting method may result in accidents.
▼The only direct pressure medium you can use is dry air. The use of other media, in particular,
corrosive gases (organic solvent based gases, sulfurous acid based gases, and hydrogen sulfide
based gases, etc.) and media that contains moisture or foreign substances will cause
malfunction and damage. Please do not use them.
▼The pressure sensor chip is positioned inside the pressure inlet. Never poke wires or other
foreign matter through the pressure inlet since they may damage the chip or block the inlet. Avoid
use when the atmospheric pressure inlet is blocked.
▼Use an operating pressure which is within the rated pressure range. Using a pressure beyond
this range may cause damage.
▼Since static charge can damage the pressure sensor chip, bear in mind the following handling
precautions.
When storing the pressure sensor chips, use a conductive material to short the pins or wrap the
entire chip in aluminum foil. Plastic containers should not be used to store or transport the
chips since they readily become charged.
When using the pressure sensor chips, all the charged articles on the bench surface and the
work personnel should be grounded so that any ambient static will be safely discharged.
▼Based on the pressure involved, give due consideration to the securing of the pressure sensor
DIP type and to the securing and selection of the inlet tube.
The listed specifications and dimensions are subject to change without prior notice.

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Only for MEMS Silicon Based Piezoresistive Pressure Sensor Solutions from Die to Package

XGZP6847 Pressure Sensor Module

■ Direct application,Low Cost.

Item Data Unit

Ambient Temp. -20 ～ 100/-4 ～ 212

Storage Temp. -40 ～ 125/-40 ～ 257

Pressure Range (100kPa=0.1MPa=1bar≈14.5PSI)

Pressure Range（kPa） Model

-100 ～ 100 XGZP6847100KPGPN

-100 ～ 700 XGZP6847700KPGPN

Available for more custom pressure range

XGZP6847 Output VS.Pressure

Model 100KPGN 030KPGN 020KPGN

Model 040KPGPN 100KPGPN 700KPGPN

010KP 020KP 040KP 200KP 500KP 700KP

■ Quality check under actual loading conditions

■ Other handling precautions

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