Ntcs0805E3..... T SMD 0805, Glass Protected NTC Thermistors: Vishay Bccomponents
Ntcs0805E3..... T SMD 0805, Glass Protected NTC Thermistors: Vishay Bccomponents
Ntcs0805E3..... T SMD 0805, Glass Protected NTC Thermistors: Vishay Bccomponents
T
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Vishay BCcomponents
SMD 0805, Glass Protected NTC Thermistors
FEATURES
• TCR ranging from -6 %/K at -40 °C to
-2 %/K at 150 °C
• Tolerance on R25 down to 1 %, and on B25/85
down to 1 %
• Suitable for wave or reflow soldering
• NiSn terminations
• Fully glass coated and protected
• cULus recognized, file E148885
(UL category XGPU2 / XGPU8)
LINKS TO ADDITIONAL RESOURCES • AEC-Q200 qualified
• Material categorization: for definitions of compliance
3D 3D please see www.vishay.com/doc?99912
3D Models Design Tools
APPLICATIONS
• Temperature sensing, protection and compensation in
QUICK REFERENCE DATA automotive, industrial, telecom and consumer
PARAMETER VALUE UNIT applications. Examples are:
Resistance value at 25 °C 2.2K to 680K Ω - Battery chargers
Tolerance on R25-value ± 1; ± 2; ± 3; ± 5 %
- Power suppliers
- Office equipment
B25/85-value 3430 to 4125 K
- LCD compensation
Tolerance on B25/85-value ± 1; ± 3 %
- In-car entertainment
Maximum dissipation at 25 °C 210 mW
Thermal time constant τ ≈ 10 s DESCRIPTION
Dissipation factor D 3.5 mW/K Size 0805 (M2012) glass protected SMD chip thermistor
with negative temperature coefficient (TCR) and matte
Operating temperature range
at zero power
-40 to +150 °C tin (Sn) plated terminations. The device has no marking.
Weight ≈ 0.008 g PACKAGING
Available in 8 mm punched paper tape on reel package of
AGENCY APPROVALS 4000 units.
Agency approval documents, please see:
www.vishay.com/ppg?29044&documents DESIGN-IN SUPPORT
For complete curve computation, please visit:
www.vishay.com/thermistors/ntc-curve-list/
T
2.0 ± 0.2 1.25 ± 0.15 0.8 ± 0.15 0.2 0.55
W
L2 L4 L3
L1
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC® J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
Reflow Soldering Lead (Pb)-free Reflow Soldering Profile
300 10 s 40 s max.
300
260 °C 260 °C
250 250 ≈ 245 °C
≈ 245 °C
Temperature (°C)
Temperature (°C)
200 215 °C 235 °C
10 s 200
180 °C ≈ 170 °C 20 s min.
150 150
130 °C ≈ 120 °C ≈ 60 s
40 s
100 100 6 K/s
2 K/s max.
2 K/s
50 50 max. limit
normal
0 0
0 50 100 150 200 250 0 50 100 150 200 250 300 350
Time (s) Time (s)
1.3
3.0
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
T DIMENSIONS OF PAPER TAPE in millimeters
P0
PARAMETER DIMENSION
D0 P2
A0 (1) 1.7 ± 0.2
E1
B0 (1) 2.35 ± 0.1
W 8.0 ± 0.2
E1 1.75 ± 0.1
F
W F 3.5 ± 0.05
B0 D0 1.55 ± 0.05
P0 (2) 4.0 ± 0.1
P1 4.0 ± 0.1
A0 P2 2.0 ± 0.05
P1 JWB288 T1 T tape thickness max. 1.1
T1 cover tape thickness max. 0.1
Notes
(1) Measured 0.3 mm above base pocket
(2) P pitch cumulative error over any 10 pitches ± 1.0 mm
0
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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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Authorized Distributor
Vishay:
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