RF-35TC Thermally Conductive Low Loss Laminate

RF-35TC offers a "best in class" low dissipation factor with

high thermal conductivity. This material is best suited for Benefits & Applications:
high power applications where every 1/10th of a dB is critical
and the PWB substrate is expected to diffuse heat away from
both transmission lines and surface mount components • "Best in Class" Loss Tangent
such as transistors or capacitors. RF-35TC is a PTFE based, • Exceptional Thermal
ceramic filled fiberglass substrate. It will not oxidize, yellow Management
or show upward drift in dielectric constant and dissipation
• Dk Stability Across a Broad
factor like its synthetic rubber (hydrocarbon) competitors.
Temperature Range
The low Z axis CTE and temperature stable Dk are critical for • Enhanced Antenna Gains/
both narrow band and broad band overlay couplers. The Efficiencies
low X and Y CTE values are crucial for maintaining critical
distances between trace elements in a printed filter. The • Excellent Adhesion to Very
extremely low Df of 0.0011 and high thermal conductivity Low Profile copper
are particularly suited for power amplifier applications.
RF-35TC bonds very well to low profile copper, further
reducing insertion loss.
Like most material properties, there are many techniques
for measuring thermal conductivity. Thermal conductivity • Filters, Couplers & Power
measured on an unclad sample (no copper) offers the true Amplifiers
thermal conductivity of the laminate. Measurements on • Antennas
a copper clad laminate typically yield higher values as the
• Satellites
copper clad laminate offers the least thermal resistance at the
interface between the laminate and measuring equipment.
When measured with or without copper cladding, RF-35TC
has a state-of-the-art thermal conductivity. However, the
low dissipation factor differentiates RF-35TC from the
competition.

Thermal image of 0603 capacitor at

the center of a microstrip (47pF/250V/
C0G) assembled on RF-35TC under
200 watts applied power. RF-35TC

Asia/Australia China Europe/Middle East North & South America

Korea Taconic Company Taconic Advanced Material Co., Ltd. AGC Multi Material Europe SA AGC Multi Material America, Inc.
Republic of Korea Suzhou City, China Lannemezan, France Tempe, AZ USA 85281
Tel: +82-31-704-1858 Tel: +86-512-286-7170 Tel: +33-05-6298-5290 Tel: (602) 679-9196
[email protected] [email protected] [email protected] [email protected]
www.agc-multimaterial.com www.agc-multimaterial.com www.agc-multimaterial.com www.agc-multimaterial.com
RF-35TC Thermally Conductive Low Loss Laminate

RF-35TC offers superior heat dissipation performance compared to competitive materials

through a combination of exceptional thermal conductivity and "best in class" low dielectric
loss.

RF-35TC

Thermal image of a microstrip transmission Maximum temperature as a function of

line with 0805 capacitor at center applied power for a microstrip and 0805
(47pF/250V/C0G) assembled on RF-35TC capacitor assembled on RF-35TC, RF-35 and
under 200 watts applied power. two competitive materials.

Maximum temperature as a function of Maximum temperature as a function

applied power for a microstrip and 0603 of applied power for a microstrip
capacitor assembled on RF-35TC, RF-35 and two transmission line assembled on RF-35TC,
competitive materials. RF-35 and two competitive materials.
 RF-35TC Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified) 3.50 3.50
TcK (-30 to 120 °C) IPC-650 2.5.5.5.1 (Modified) ppm 24 ppm 24
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified) 0.0011 0.0011
Dielectric Breakdown IPC-650 2.5.6 (In-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149 (Through Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 2.6.2.1 % 0.05 % 0.05
Flexural Strength (MD) ASTM D 790 / IPC-650 2.4.4 psi 12,900 N/mm 2
88.94
Flexural Strength (CD) ASTM D 790 / IPC-650 2.4.4 psi 11,700 N/mm 2
80.67
Tensile Strength (MD) ASTM D 3039 / IPC-TM-650 2.4.19 psi 9,020 N/mm 2
62.19
Tensile Strength (CD) ASTM D 3039 / IPC-TM-650 2.4.19 psi 7,740 N/mm 2
53.37
Elongation at Break (MD) ASTM D 3039 / IPC-TM-650 2.4.19 % 1.89 % 1.89
Elongation at Break (CD) ASTM D 3039 / IPC-TM-650 2.4.19 % 1.70 % 1.70
Young's Modulus (MD) ASTM D 3039 / IPC-TM-650 2.4.19 psi 667,000 N/mm2 4,599
Young's Modulus (CD) ASTM D 3039 / IPC-TM-650 2.4.19 psi 637,000 N/mm 2
4,392
Poisson’s Ratio  (MD) ASTM D 3039 / IPC-TM-650 2.4.19 0.18 0.18
Poisson’s Ratio  (CD) ASTM D 3039 / IPC-TM-650 2.4.19 0.23 0.18
Compressive Modulus ASTM D 695  (23 °C) psi 560,000 N/mm 2
3,861
Flexural Modulus (MD) ASTM D 790 / IPC-650 2.4.4 psi 1.46 x10 6
N/mm 2
10,309
Flexural Modulus (CD) ASTM D 790 / IPC-650 2.4.4 psi 1.50 x 10 6
N/mm 2
10,076
Peel Strength (½ oz CVH) IPC-650 2.4.8 (Thermal Stress) lbs/in 7 N/mm 1.25
Thermal Conductivity (Unclad, 125 °C) ASTM F433 (Guarded Heat Flow) W/M*K 0.60 W/M*K 0.60
Thermal Conductivity (C1/C1, 125 °C) ASTM F433 (Guarded Heat Flow) W/M*K 0.92 W/M*K 0.92
Thermal Conductivity (CH/CH, 125 °C) ASTM F433 (Guarded Heat Flow) W/M*K 0.87 W/M*K 0.87
Dimensional Stability (MD) IPC-650-2.4.39 Sec. 5.4 (After Etch) mils/in 0.23 mm/M 0.23
Dimensional Stability (CD) IPC-650-2.4.39 Sec. 5.4 (After Etch) mils/in 0.64 mm/M 0.64
Dimensional Stability (MD) IPC-650-2.4.39 Sec. 5.5 (Thermal Stress) mils/in -0.04 mm/M -0.04
Dimensional Stability (CD) IPC-650-2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.46 mm/M 0.46
Surface Resistivity IPC-650 2.5.17.1 (After Elevated Temp.) Mohms 8.33 x 10 7
Mohms 8.33 x 107
Surface Resistivity IPC-650 2.5.17.1 (After Humidity) Mohms 6.42 x 107 Mohms 6.42 x 107
Volume Resistivity IPC-650 2.5.17.1 (After Elevated Temp.) Mohms/cm 5.19 x 108 Mohms/cm 5.19 x 108
Volume Resistivity IPC-650 2.5.17.1 (After Humidity) Mohms/cm 2.91 x 108 Mohms/cm 2.91 x 108
CTE (X axis) (23 to 125 °C) IPC-650 2.4.41 / ASTM D 3386 ppm/°C 11 ppm/°C 11
CTE (Y axis) (23 to 125 °C) IPC-650 2.4.41 / ASTM D 3386 ppm/°C 13 ppm/°C 13
CTE (Z axis) (23 to 125 °C) IPC-650 2.4.41 / ASTM D 3386 ppm/°C 34 ppm/°C 34
Density ASTM D 792 g/cm 3
2.35 g/cm 3
2.35
Hardness ASTM D 2240 (Shore D) 79.1 79.1
Strain at Break (MD) ASTM D 790 / IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break (CD) ASTM D 790 / IPC-650 2.4.4 % 0.013 % 0.013
Specific Heat ASTM E 1269-05, E 967-08, E 968-02 J/(g °C) 0.940 J(g °C) 0.940
Td (2% Wt. Loss) IPC-650 2.4.24.6/TGA °F 788 °C 420
Td (5% Wt. Loss) IPC-650 2.4.24.6/TGA °F 817 °C 436
All reported values are typical and should not be used for specification purposes. In all instances, the user shall determine
suitability in any given application.
RF-35TC Thermally Conductive Low Loss Laminate

Available Sheet Sizes

Designation Dielectric Constant Typical Thicknesses
Inches mm
Inches mm
12 x 18 305 x 457
0.0050 0.13
0.0100 0.25 16 x 18 406 x 457
RF-35TC 3.50 ± 0.05 18 x 24 457 x 610
0.0200 0.51
0.0300 0.76 16 x 36 406 x 914
0.0600 1.52 24 x 36 610 x 914

Please see our Product Selector Guide for Information on available copper cladding.

An example of our part number is: RF-35TC-0300-C1/C1- 18" x 24" (457 mm x 610 mm)

Rev. 6/21