MPU-6000 and MPU-6050 Product Specification Revision 3.1
MPU-6000 and MPU-6050 Product Specification Revision 3.1
MPU-6000 and MPU-6050 Product Specification Revision 3.1
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Document Number: PS-MPU-6000A-00
MPU-6000/MPU-6050 Product Specification Revision: 3.1
Release Date: 10/24/2011
CONTENTS
1 REVISION HISTORY ...................................................................................................................................5
2 PURPOSE AND SCOPE .............................................................................................................................6
3 PRODUCT OVERVIEW ...............................................................................................................................7
3.1 MPU-60X0 OVERVIEW ........................................................................................................................7
4 APPLICATIONS...........................................................................................................................................9
5 FEATURES ................................................................................................................................................10
5.1 GYROSCOPE FEATURES .....................................................................................................................10
5.2 ACCELEROMETER FEATURES .............................................................................................................10
5.3 ADDITIONAL FEATURES ......................................................................................................................10
5.4 MOTIONPROCESSING .........................................................................................................................11
5.5 CLOCKING .........................................................................................................................................11
6 ELECTRICAL CHARACTERISTICS .........................................................................................................12
6.1 GYROSCOPE SPECIFICATIONS ............................................................................................................12
6.2 ACCELEROMETER SPECIFICATIONS .....................................................................................................13
6.3 ELECTRICAL AND OTHER COMMON SPECIFICATIONS............................................................................14
6.4 ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................15
6.5 ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................16
6.6 ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................17
6.7 I2C TIMING CHARACTERIZATION..........................................................................................................18
6.8 SPI TIMING CHARACTERIZATION (MPU-6000 ONLY) ...........................................................................19
6.9 ABSOLUTE MAXIMUM RATINGS ...........................................................................................................20
7 APPLICATIONS INFORMATION ..............................................................................................................21
7.1 PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................21
7.2 TYPICAL OPERATING CIRCUIT.............................................................................................................22
7.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ..............................................................................22
7.4 RECOMMENDED POWER-ON PROCEDURE ...........................................................................................23
7.5 BLOCK DIAGRAM ...............................................................................................................................24
7.6 OVERVIEW ........................................................................................................................................24
7.7 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ................................25
7.8 THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................25
7.9 DIGITAL MOTION PROCESSOR ............................................................................................................25
7.10 PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................25
7.11 AUXILIARY I2C SERIAL INTERFACE ......................................................................................................26
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MPU-6000/MPU-6050 Product Specification Revision: 3.1
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1 Revision History
Revision
Revision Description
Date
11/24/2010 1.0 Initial Release
For Rev C parts. Clarified wording in sections (3.2, 5.1, 5.2, 6.1-6.4, 6.6, 6.9, 7,
05/19/2011 2.0
7.1-7.6, 7.11, 7.12, 7.14, 8, 8.2-8.4, 10.3, 10.4, 11, 12.2)
07/28/2011 2.1 Edited supply current numbers for different modes (section 6.4)
08/05/2011 2.2 Unit of measure for accelerometer sensitivity changed from LSB/mg to LSB/g
Updated accelerometer self test specifications in Table 6.2. Updated package
10/12/2011 2.3
dimensions (section 11.2). Updated PCB design guidelines (section 11.3)
For Rev D parts. Updated accelerometer specifications in Table 6.2. Updated
10/18/2011 3.0 accelerometer specification note (sections 8.2, 8.3, & 8.4). Updated qualification
test plan (section 12.2).
Edits for clarity
Changed operating voltage range to 2.375V-3.46V
Added accelerometer Intelligence Function increment value of 1mg/LSB
(Section 6.2)
10/24/2011 3.1
Updated absolute maximum rating for acceleration (any axis, unpowered) from
0.3ms to 0.2ms (Section 6.9)
Modified absolute maximum rating for Latch-up to Level A and ±100mA (Section
6.9, 12.2)
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3 Product Overview
3.1 MPU-60X0 Overview
The MPU-60X0 Motion Processing Unit is the world’s first motion processing solution with integrated 9-Axis
sensor fusion using its field-proven and proprietary MotionFusion™ engine for handset and tablet
applications, game controllers, motion pointer remote controls, and other consumer devices. The MPU-60X0
has an embedded 3-axis MEMS gyroscope, a 3-axis MEMS accelerometer, and a Digital Motion
Processor™ (DMP™) hardware accelerator engine with an auxiliary I2C port that interfaces to 3rd party digital
sensors such as magnetometers. When connected to a 3-axis magnetometer, the MPU-60X0 delivers a
complete 9-axis MotionFusion output to its primary I2C or SPI port (SPI is available on MPU-6000 only). The
MPU-60X0 combines acceleration and rotational motion plus heading information into a single data stream
for the application. This MotionProcessing™ technology integration provides a smaller footprint and has
inherent cost advantages compared to discrete gyroscope plus accelerometer solutions. The MPU-60X0 is
also designed to interface with multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary
I2C port. The MPU-60X0 is a 2nd generation motion processor and is footprint compatible with the MPU-
30X0 family.
The MPU-60X0 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs
and three 16-bit ADCs for digitizing the accelerometer outputs. For precision tracking of both fast and slow
motions, the parts feature a user-programmable gyroscope full-scale range of ±250, ±500, ±1000, and
±2000°/sec (dps) and a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g.
An on-chip 1024 Byte FIFO buffer helps lower system power consumption by allowing the system processor
to read the sensor data in bursts and then enter a low-power mode as the MPU collects more data. With all
the necessary on-chip processing and sensor components required to support many motion-based use
cases, the MPU-60X0 uniquely supports a variety of advanced motion-based applications entirely on-chip.
The MPU-60X0 thus enables low-power MotionProcessing in portable applications with reduced processing
requirements for the system processor. By providing an integrated MotionFusion output, the DMP in the
MPU-60X0 offloads the intensive MotionProcessing computation requirements from the system processor,
minimizing the need for frequent polling of the motion sensor output.
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz
(MPU-6000 only). For applications requiring faster communications, the sensor and interrupt registers may
be read using SPI at 20MHz (MPU-6000 only). Additional features include an embedded temperature sensor
and an on-chip oscillator with ±1% variation over the operating temperature range.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers
with companion CMOS electronics through wafer-level bonding, InvenSense has driven the MPU-60X0
package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest
performance, lowest noise, and the lowest cost semiconductor packaging required for handheld consumer
electronic devices. The part features a robust 10,000g shock tolerance, and has programmable low-pass
filters for the gyroscopes, accelerometers, and the on-chip temperature sensor.
For power supply flexibility, the MPU-60X0 operates from VDD power supply voltage range of 2.375V-3.46V.
Additionally, the MPU-6050 provides a VLOGIC reference pin (in addition to its analog supply pin: VDD),
which sets the logic levels of its I2C interface. The VLOGIC voltage may be 1.8V±5% or VDD.
The MPU-6000 and MPU-6050 are identical, except that the MPU-6050 supports the I2C serial interface only,
and has a separate VLOGIC reference pin. The MPU-6000 supports both I2C and SPI interfaces and has a
single supply pin, VDD, which is both the device’s logic reference supply and the analog supply for the part.
The table below outlines these differences:
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4 Applications
BlurFree™ technology (for Video/Still Image Stabilization)
AirSign™ technology (for Security/Authentication)
TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)
MotionCommand™ technology (for Gesture Short-cuts)
Motion-enabled game and application framework
InstantGesture™ iG™ gesture recognition
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
Toys
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5 Features
5.1 Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-60X0 includes a wide range of features:
Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable full-
scale range of ±250, ±500, ±1000, and ±2000°/sec
External sync signal connected to the FSYNC pin supports image, video and GPS synchronization
Integrated 16-bit ADCs enable simultaneous sampling of gyros
Enhanced bias and sensitivity temperature stability reduces the need for user calibration
Improved low-frequency noise performance
Digitally-programmable low-pass filter
Gyroscope operating current: 3.6mA
Standby current: 5µA
Factory calibrated sensitivity scale factor
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20MHz SPI serial interface for reading sensor and interrupt registers (MPU-6000 only)
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
5.4 MotionProcessing
Internal Digital Motion Processing™ (DMP™) engine supports 3D MotionProcessing and gesture
recognition algorithms
The MPU-60X0 collects gyroscope and accelerometer data while synchronizing data sampling at a
user defined rate. The total dataset obtained by the MPU-60X0 includes 3-Axis gyroscope data, 3-
Axis accelerometer data, and temperature data. The MPU’s calculated output to the system
processor can also include heading data from a digital 3-axis third party magnetometer.
The FIFO buffers the complete data set, reducing timing requirements on the system processor by
allowing the processor burst read the FIFO data. After burst reading the FIFO data, the system
processor can save power by entering a low-power sleep mode while the MPU collects more data.
Programmable interrupt supports features such as gesture recognition, panning, zooming, scrolling,
zero-motion detection, tap detection, and shake detection
Digitally-programmable low-pass filters
Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the
step count.
5.5 Clocking
On-chip timing generator ±1% frequency variation over full temperature range
Optional external clock inputs of 32.768kHz or 19.2MHz
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6 Electrical Characteristics
6.1 Gyroscope Specifications
VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
PARAMETER CONDITIONS MIN TYP MAX UNITS NOTES
GYROSCOPE SENSITIVITY
Full-Scale Range FS_SEL=0 ±250 º/s
FS_SEL=1 ±500 º/s
FS_SEL=2 ±1000 º/s
FS_SEL=3 ±2000 º/s
Gyroscope ADC Word Length 16 bits
Sensitivity Scale Factor FS_SEL=0 131 LSB/(º/s)
FS_SEL=1 65.5 LSB/(º/s)
FS_SEL=2 32.8 LSB/(º/s)
FS_SEL=3 16.4 LSB/(º/s)
Sensitivity Scale Factor Tolerance 25°C -3 +3 %
Sensitivity Scale Factor Variation Over ±2 %
Temperature
Nonlinearity Best fit straight line; 25°C 0.2 %
Cross-Axis Sensitivity ±2 %
GYROSCOPE ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance 25°C ±20 º/s
ZRO Variation Over Temperature -40°C to +85°C ±20 º/s
Power-Supply Sensitivity (1-10Hz) Sine wave, 100mVpp; VDD=2.5V 0.2 º/s
Power-Supply Sensitivity (10 - 250Hz) Sine wave, 100mVpp; VDD=2.5V 0.2 º/s
Power-Supply Sensitivity (250Hz - 100kHz) Sine wave, 100mVpp; VDD=2.5V 4 º/s
Linear Acceleration Sensitivity Static 0.1 º/s/g
GYROSCOPE NOISE PERFORMANCE FS_SEL=0
Total RMS Noise DLPFCFG=2 (100Hz) 0.05 º/s-rms
Low-frequency RMS noise Bandwidth 1Hz to10Hz 0.033 º/s-rms
Rate Noise Spectral Density At 10Hz 0.005 º/s/√Hz
GYROSCOPE MECHANICAL
FREQUENCIES
X-Axis 30 33 36 kHz
Y-Axis 27 30 33 kHz
Z-Axis 24 27 30 kHz
LOW PASS FILTER RESPONSE
Programmable Range 5 256 Hz
OUTPUT DATA RATE
Programmable 4 8,000 Hz
GYROSCOPE START-UP TIME DLPFCFG=0
ZRO Settling to ±1º/s of Final 30 ms
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Parameter Rating
Supply Voltage, VDD -0.5V to +6V
VLOGIC Input Voltage Level (MPU-6050) -0.5V to VDD + 0.5V
REGOUT -0.5V to 2V
Input Voltage Level (CLKIN, AUX_DA, AD0, FSYNC, INT,
-0.5V to VDD + 0.5V
SCL, SDA)
CPOUT (2.5V ≤ VDD ≤ 3.6V ) -0.5V to 30V
Acceleration (Any Axis, unpowered) 10,000g for 0.2ms
Operating Temperature Range -40°C to +105°C
Storage Temperature Range -40°C to +125°C
2kV (HBM);
Electrostatic Discharge (ESD) Protection
200V (MM)
JEDEC Class II (2),125°C
Latch-up
Level A, ±100mA
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7 Applications Information
7.1 Pin Out and Signal Description
MPU- MPU-
Pin Number Pin Name Pin Description
6000 6050
1 Y Y CLKIN Optional external reference clock input. Connect to GND if unused.
2
6 Y Y AUX_DA I C master serial data, for connecting to external sensors
2
7 Y Y AUX_CL I C Master serial clock, for connecting to external sensors
8 Y /CS SPI chip select (0=SPI mode)
8 Y VLOGIC Digital I/O supply voltage
2
9 Y AD0 / SDO I C Slave Address LSB (AD0); SPI serial data output (SDO)
2
9 Y AD0 I C Slave Address LSB (AD0)
10 Y Y REGOUT Regulator filter capacitor connection
11 Y Y FSYNC Frame synchronization digital input. Connect to GND if unused.
12 Y Y INT Interrupt digital output (totem pole or open-drain)
13 Y Y VDD Power supply voltage and Digital I/O supply voltage
18 Y Y GND Power supply ground
19, 21 Y Y RESV Reserved. Do not connect.
20 Y Y CPOUT Charge pump capacitor connection
22 Y Y CLKOUT System clock output
2
23 Y SCL / SCLK I C serial clock (SCL); SPI serial clock (SCLK)
2
23 Y SCL I C serial clock (SCL)
2
24 Y SDA / SDI I C serial data (SDA); SPI serial data input (SDI)
2
24 Y SDA I C serial data (SDA)
2, 3, 4, 5, 14,
Y Y NC Not internally connected. May be used for PCB trace routing.
15, 16, 17
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7.6 Overview
The MPU-60X0 is comprised of the following key blocks and functions:
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Digital Motion Processor (DMP) engine
Primary I2C and SPI (MPU-6000 only) serial communications interfaces
Auxiliary I2C serial interface for 3rd party magnetometer & other sensors
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Accelerometer Self-test
Bias and LDO
Charge Pump
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7.7 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-60X0 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes
a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered
to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample
rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable
low-pass filters enable a wide range of cut-off frequencies.
7.8 Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning
The MPU-60X0’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a
particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the
displacement differentially. The MPU-60X0’s architecture reduces the accelerometers’ susceptibility to
fabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure
0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers’ scale factor is calibrated at the factory
and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing
digital outputs. The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.
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The I2C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor
can be configured to work single byte read/write mode.
Pass-Through Mode: Allows an external system processor to act as master and directly
communicate to the external sensors connected to the auxiliary I2C bus pins (AUX_DA and
AUX_CL). In this mode, the auxiliary I2C bus control logic (3rd party sensor interface block) of the
MPU-60X0 is disabled, and the auxiliary I2C pins AUX_DA and AUX_CL (Pins 6 and 7) are
connected to the main I2C bus (Pins 23 and 24) through analog switches.
Pass-Through Mode is useful for configuring the external sensors, or for keeping the MPU-60X0 in a
low-power mode when only the external sensors are used.
In Pass-Through Mode the system processor can still access MPU-60X0 data through the I2C
interface.
For further information regarding the MPU-6050’s logic levels, please refer to Section 10.2.
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7.12 Self-Test
Self-test allows for the testing of the mechanical and electrical portions of the accelerometers. The self-test
for each measurement axis can be activated by controlling the bits of the ACCEL_CONFIG control register.
When self-test is activated, the electronics cause the sensors to be actuated and produce an output signal.
The sensor reading is determined by the sum of the sensor output and the self-test response. The self-test
response for each accelerometer axis is defined in the specification table (Section 6) to be nominally 0.5g.
For further information regarding the Accel control register, please refer to the MPU-60X0 Register Map and
Register Descriptions document.
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7.13 MPU-60X0 Solution for 9-axis Sensor Fusion Using I2C Interface
In the figure below, the system processor is an I2C master to the MPU-60X0. In addition, the MPU-60X0 is an
I2C master to the optional external compass sensor. The MPU-60X0 has limited capabilities as an I2C
Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors.
The MPU-60X0 has an interface bypass multiplexer, which connects the system processor I2C bus pins 23
and 24 (SDA and SCL) directly to the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
should be disabled so that the MPU-60X0 auxiliary I2C master can take control of the sensor I2C bus and
gather data from the auxiliary sensors.
For further information regarding I2C master control, please refer to Section 10.
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7.17 FIFO
The MPU-60X0 contains a 1024-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter
keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-60X0 Register Map and Register
Descriptions document.
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7.18 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) new data is available to be read (from the FIFO and Data registers); (3) accelerometer event
interrupts; and (4) the MPU-60X0 did not receive an acknowledge from an auxiliary sensor on the secondary
I2C bus. The interrupt status can be read from the Interrupt Status register.
For further information regarding interrupts, please refer to the MPU-60X0 Register Map and Register
Descriptions document.
For information regarding the MPU-60X0’s accelerometer event interrupts, please refer to Section 8.
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8 Programmable Interrupts
The MPU-60X0 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU-
6000/MPU-6050 Register Map and Register Descriptions document. Some interrupt sources are explained
below.
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The figure above shows a simplified example with just one axis. An example acceleration input signal
(simplified to only show one axis), qualifying sample counter, and Free Fall flag are shown.
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9 Digital Interface
9.1 I2C and SPI (MPU-6000 only) Serial Interfaces
The internal registers and memory of the MPU-6000/MPU-6050 can be accessed using either I2C at 400 kHz
or SPI at 1MHz (MPU-6000 only). SPI operates in four-wire mode.
Serial Interface
Pin Number MPU-6000 MPU-6050 Pin Name Pin Description
8 Y /CS SPI chip select (0=SPI enable)
8 Y VLOGIC Digital I/O supply voltage. VLOGIC must be ≤ VDD at all times.
2
9 Y AD0 / SDO I C Slave Address LSB (AD0); SPI serial data output (SDO)
2
9 Y AD0 I C Slave Address LSB
2
23 Y SCL / SCLK I C serial clock (SCL); SPI serial clock (SCLK)
2
23 Y SCL I C serial clock
2
24 Y SDA / SDI I C serial data (SDA); SPI serial data input (SDI)
2
24 Y SDA I C serial data
Note:
To prevent switching into I2C mode when using SPI (MPU-6000), the I2C interface should be disabled by
setting the I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the
time specified by the “Start-Up Time for Register Read/Write” in Section 6.3.
For further information regarding the I2C_IF_DIS bit, please refer to the MPU-60X0 Register Map and
Register Descriptions document.
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Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
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Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
followed by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from
or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing the
communications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
To write the internal MPU-60X0 registers, the master transmits the start condition (S), followed by the I2C
address and the write bit (0). At the 9th clock cycle (when the clock is high), the MPU-60X0 acknowledges the
transfer. Then the master puts the register address (RA) on the bus. After the MPU-60X0 acknowledges the
reception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the
MPU-60X0 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.
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To read the internal MPU-60X0 registers, the master sends a start condition, followed by the I2C address and
a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-60X0, the master transmits a start signal followed by the slave address and read bit. As a result, the
MPU-60X0 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the
9th clock cycle. The following figures show single and two-byte read sequences.
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AUX_VDDIO
MICROPROCESSOR LOGIC LEVELS AUXILLARY LOGIC LEVELS
(Pins: SDA, SCL, AD0, CLKIN, INT) (Pins: AUX_DA, AUX_CL)
0 VLOGIC VLOGIC
1 VLOGIC VDD
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Notes:
1. AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL
(0 = set output levels relative to VLOGIC)
2. CLKOUT is referenced to VDD.
3. All other MPU-6050 logic IOs are referenced to VLOGIC.
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I/O Levels and Connections for Two Example Power Configurations (AUX_VDDIO = 1)
Notes:
1. AUX_VDDIO determines the IO voltage levels of AUX_DA and AUX_CL. AUX_VDDIO = 1 sets
output levels relative to VDD.
2. 3rd-party auxiliary device logic levels are referenced to VDD. Setting INT1 and INT2 to open drain
configuration provides voltage compatibility when VDD ≠ VLOGIC. When VDD = VLOGIC, INT1 and
INT2 may be set to push-pull outputs, and external pull-up resistors are not needed.
3. CLKOUT is referenced to VDD.
4. All other MPU-6050 logic IOs are referenced to VLOGIC.
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11 Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.
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b
13
6 L1
7 12 A1
D
D2
A
On 4 corners -
lead dimensions
s
s
SYMBOLS DIMENSIONS IN MILLIMETERS
MIN NOM MAX
A 0.85 0.90 0.95
A1 0.00 0.02 0.05
b 0.18 0.25 0.30
c ‐‐‐ 0.20 REF ‐‐‐
D 3.90 4.00 4.10
D2 2.65 2.70 2.75
E 3.90 4.00 4.10
E2 2.55 2.60 2.65
e ‐‐‐ 0.50 ‐‐‐
f (e‐b) ‐‐‐ 0.25 ‐‐‐
K 0.25 0.30 0.35
L 0.30 0.35 0.40
L1 0.35 0.40 0.45
s 0.05 ‐‐‐ 0.15
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e 1 18
b c E2 E E3
6 13 L3 L1
7 12
L2
Tout
Tout Tin
L
PCB Layout Diagram
SYMBOLS DIMENSIONS IN MILLIMETERS NOM
Nominal Package I/O Pad Dimensions
e Pad Pitch 0.50
b Pad Width 0.25
L Pad Length 0.35
L1 Pad Length 0.40
D Package Width 4.00
E Package Length 4.00
D2 Exposed Pad Width 2.70
E2 Exposed Pad Length 2.60
I/O Land Design Dimensions (Guidelines )
D3 I/O Pad Extent Width 4.80
E3 I/O Pad Extent Length 4.80
c Land Width 0.35
Tout Outward Extension 0.40
Tin Inward Extension 0.05
L2 Land Length 0.80
L3 Land Length 0.85
PCB Dimensions Table (for PCB Lay-out Diagram)
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The table below shows the cross-axis sensitivity as a percentage of the gyroscope or accelerometer’s
sensitivity for a given orientation error, respectively.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error Cross-Axis Sensitivity
(θ or Φ) (sinθ or sinΦ)
0º 0%
0.5º 0.87%
1º 1.75%
The specifications for cross-axis sensitivity in Section 6.1 and Section 6.2 include the effect of the die
orientation error with respect to the package.
The MPU-60X0 has been qualified to a shock tolerance of 10,000g. InvenSense packages its gyroscopes as
it deems proper for protection against normal handling and shipping. It recommends the following handling
precautions to prevent potential damage.
Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
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Restrict all device handling to ESD protected work areas that measure less than 200V static charge. Ensure
that all workstations and personnel are properly grounded to prevent ESD.
11.4.8 Reflow Specification
Qualification Reflow: The MPU-60X0 was qualified in accordance with IPC/JEDEC J-STD-020D.01. This
standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and
mechanical damage during the solder reflow attachment phase of assembly. The classification specifies a
sequence consisting of a bake cycle, a moisture soak cycle in a temperature humidity oven, followed by
three solder reflow cycles and functional testing for qualification. All temperatures refer to the topside of the
QFN package, as measured on the package body surface. The peak solder reflow classification temperature
requirement is (260 +5/-0°C) for lead-free soldering of components measuring less than 1.6 mm in thickness.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results,
production solder reflow processes should reduce exposure to high temperatures, and use lower ramp-up
and ramp-down rates than those used in the component qualification profile shown for reference below.
Production reflow should never exceed the maximum constraints listed in the table and shown in the figure
below that were used for the qualification profile, as these represent the maximum tolerable ratings for the
device.
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CONSTRAINTS
Step Setting
Temp (°C) Time (sec) Rate (°C/sec)
A Troom 25
B TSmin 150
C TSmax 200 60 < tBC < 120
D TLiquidus 217 r(TLiquidus-TPmax) < 3
E TPmin [255°C, 260°C] 255 r(TLiquidus-TPmax) < 3
F TPmax [ 260°C, 265°C] 260 tAF < 480 r(TLiquidus-TPmax) < 3
G TPmin [255°C, 260°C] 255 10< tEG < 30 r(TPmax-TLiquidus) < 4
H TLiquidus 217 60 < tDH < 120
I Troom 25
Notes:
For users TPmax must not exceed the Classification temperature (260°C).
For suppliers TPmax must equal or exceed the classification temperature.
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Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40°C and <90% RH
After opening moisture-sealed bag 168 hours -- Storage conditions: ambient ≤30°C at 60%RH
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Tape Dimensions
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User Direction of
Package Orientation Feed
Cover Tape
(Anti Static)
Label Carrier Tape
Pin 1
(Anti Static)
Terminal Tape
Reel
Reel Specifications
Quantity Per Reel 5,000
Reels per Box 1
Boxes Per Carton (max) 3
Pcs/Carton (max) 15,000
11.8 Label
Location of Label
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11.9 Packaging
Moisture-Sensitivity
Caution Label
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12 Reliability
12.1 Qualification Test Policy
InvenSense’s products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-60X0 followed the JEDEC 47G.01 Standard, “Stress-Test-Driven
Qualification of Integrated Circuits,” with the individual tests described below.
12.2 Qualification Test Plan
Accelerated Life Tests
Acc /
Lot Sample
TEST Method/Condition Reject
Quantity / Lot
Criteria
JEDEC JESD22-A108C, Dynamic,
High Temperature
3.63V biased, Tj>125°C 3 77 (0/1)
Operating Life (HTOL/LFR)
[read-points 168, 500, 1000 hours]
Highly Accelerated Stress JEDEC JESD22-A118
Test, Unbiased(1) (HAST) Condition A, 130°C, 85%RH, 33.3 psia., 3 77 (0/1)
unbiased, [read-point 96 hours]
JEDEC JESD22-A103C, Cond. A, 125°C,
High Temperature Storage 3
Non-Biased Bake 77 (0/1)
Life (HTS)
[read-points 168, 500, 1000 hours]
Device Component Level Tests
Acc /
Lot Sample
TEST Method/Condition Reject
Quantity / Lot
Criteria
ESD-HBM JEDEC JESD22-A114F, (2KV) 1 3 (0/1)
ESD-MM JEDEC JESD22-A115-A, (200V) 1 3 (0/1)
JEDEC JESD78B Class II (2), 125°C;
Latch Up 1 6 (0/1)
Level A ±100mA
JEDEC JESD22-B104C,
Mil-Std-883H, method 2002.5,
Mechanical Shock 3 5 (0/1)
Cond. E, 10,000g’s, 0.2ms,
±X, Y, Z – 6 directions, 5 times/direction
JEDEC JESD22-B103B, Variable Frequency
Vibration (random), Cond. B, 5-500Hz, 3 5 (0/1)
X, Y, Z – 4 times/direction
JEDEC JESD22-A104D Condition N,
Temperature Cycling (TC) (1) 3 77 (0/1)
[-40°C to +85°C], Soak Mode 2 [5’], 100 cycles
Board Level Tests
Acc /
Lot Sample
TEST Method/Condition Reject
Quantity / Lot
Criteria
JEDEC JESD22-B104C,
Board Mechanical Shock Mil-Std-883H, method 2002.5,
1 5 (0/1)
Cond. E, 10000g’s, 0.2ms,
±X, Y, Z – 6 directions, 5 times/direction
(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
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13 Environmental Compliance
The MPU-60X0 is RoHS and Green compliant and is in full environmental compliance as evidenced in report
HS-MPU-6000A, Materials Declaration Data Sheet.
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This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
InvenSense®, MotionCommand®, TouchAnywhere®, and AirSign® are registered trademarks of InvenSense, Inc. MPU™, MPU-
6000™, MPU-6050™, MPU-60X0™, Motion Processing Unit™ , MotionFusion™, MotionProcessing™, MotionApps™, Digital Motion
Processor™, Digital Motion Processing™, DMP™, BlurFree™, and InstantGesture™ are trademarks of InvenSense, Inc.
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