INTEGRATED CIRCUITS

DATA SHEET

TDA1013B
4 W audio power amplifier with
DC volume control
Product specification July 1994
File under Integrated Circuits, IC01
Philips Semiconductors Product specification

4 W audio power amplifier with

TDA1013B
DC volume control

GENERAL DESCRIPTION
The TDA1013B is an integrated audio amplifier circuit with DC volume control, encapsulated in a 9-lead single in-line
(SIL) plastic package. The wide supply voltage range makes this circuit ideal for applications in mains and battery-fed
apparatus such as television receivers and record players.
The DC volume control stage has a logarithmic control characteristic with a range of more than 80 dB; control is by means
of a DC voltage variable between 2 and 6.5 V.
The audio amplifier has a well defined open loop gain and a fixed integrated closed loop. This device requires only a few
external components and offers stability and performance.

Features
• Few external components • Fixed gain
• Wide supply voltage range • High signal-to-noise ratio
• Wide control range • Thermal protection
• Pin compatible with TDA1013A

QUICK REFERENCE DATA

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage VP 10 18 40 V
Repetitive peak output
current IORM − − 1.5 A
Total sensitivity Po = 2.5 W;
DC control at max. gain Vi 44 55 69 mV
Audio amplifier
Output power THD = 10%; RL = 8 Ω Po 4.0 4.2 − W
Total harmonic distortion Po = 2.5 W; RL = 8 Ω THD − 0.15 0.1 %
Sensitivity Po = 2.5 W Vi 100 125 160 mV
DC volume control unit
Gain control range |∆Gv| 80 − − dB
Signal handling THD < 1%;
DC control = 0 dB Vi 1.2 1.7 − V
Sensitivity (pin 6) Vo = 125 mV;
max. voltage gain Vi 39 45 55 mV
Input impedance (pin 8) |Zi| 23 29 35 kΩ

PACKAGE OUTLINE
9-lead SIL; plastic (SOT110B); SOT110-1; 1996 July 23.

July 1994 2
Philips Semiconductors Product specification

4 W audio power amplifier with

TDA1013B
DC volume control

Fig.1 Block diagram.

PINNING
1. power ground
2. amplifier output
3. supply voltage
4. electronic filter
5. amplifier input
6. control unit output
7. control voltage
8. control unit input
9. signal ground (substrate)

July 1994 3
Philips Semiconductors Product specification

4 W audio power amplifier with

TDA1013B
DC volume control

RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER MIN. MAX. UNIT
VP Supply voltage − 40 V
IOSM Non-repetitive peak output current − 3 A
IORM Repetitive peak output current − 1.5 A
Tstg Storage temperature range −55 +150 °C
Tc Crystal temperature − +150 °C
Ptot Total power dissipation see Fig.2

Fig.2 Power derating curve.

HEATSINK DESIGN EXAMPLE

Assume VP = 18 V; RL = 8 Ω; Tamb = 60 °C; Tc = 150 °C (max.); for a 4 W application, the maximum dissipation is
approximately 2.5 W. The thermal resistance from junction to ambient can be expressed as:
Rth j-a = Rth j-tab + Rth tab-h + Rth h-a =

T j max – T amb max 150 – 60

------------------------------------------- = ---------------------- = 36 K/W
P max 2.5

Since Rth j-tab = 9 K/W and Rth tab-h = 1 K/W, Rth h-a = 36 − (9 + 1) = 26 K/W.

July 1994 4
Philips Semiconductors Product specification

4 W audio power amplifier with

TDA1013B
DC volume control

CHARACTERISTICS
VP = 18 V; RL = 8 Ω; f = 1 kHz; Tamb = 25 °C; see Fig.10; unless otherwise specified

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage range VP 10 18 40 V
Total quiescent current Itot − 25 60 mA
Noise output voltage note 1
at maximum gain RS = 0 Ω Vn − 0.5 − mV
at maximum gain RS = 5 kΩ Vn − 0.6 1.4 mV
at minimum gain RS = 0 Ω Vn − 0.25 − mV
Total sensitivity Po = 2.5 W;
DC control at max. gain Vi 44 55 69 mV
Audio amplifier
Repetitive peak output current IORM − − 1.5 A
Output power THD = 10%; RL = 8 Ω Po 4.0 4.2 − W
Total harmonic distortion Po = 2.5 W; RL = 8 Ω THD − 0.15 1.0 %
Sensitivity Po = 2.5 W Vi 100 125 160 mV
Input impedance (pin 5) |Zi| 100 200 500 kΩ
Power bandwidth BP − 30 to
40 000 − Hz
DC volume control unit
Gain control range |∆Gv| 80 90 − dB
Signal handling THD < 1%;
DC control = 0 dB Vi 1.2 1.7 − V
Sensitivity (pin 6) Vo = 125 mV;
max. voltage gain Vi 39 44 55 mV
Input impedance (pin 8) |Zi| 23 29 35 kΩ
Output impedance (pin 6) |Zo| 45 60 75 Ω

Note to the characteristics

1. Measured in a bandwidth in accordance with IEC 179, curve ‘A’.

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Philips Semiconductors Product specification

4 W audio power amplifier with

TDA1013B
DC volume control

APPLICATION INFORMATION

Fig.3 Output power as a function of supply voltage; f = 1 kHz; THD = 10% and control voltage (V7) = 6.5 V.

Fig.4 Power dissipation as a function of output power; VP = 18 V; f = 1 kHz; RL = 8 Ω

and control voltage (V7) = 6.5 V.

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Philips Semiconductors Product specification

4 W audio power amplifier with

TDA1013B
DC volume control

Fig.5 Power bandwidth; VP = 18 V; RL = 8 Ω; THD = 10% and control voltage (V7) = 6.5 V.

Fig.6 Total harmonic distortion as a function of frequency;

VP = 18 V; RL = 8 Ω; Po = 2.5 W and control voltage = 6.5 V.

July 1994 7
Philips Semiconductors Product specification

4 W audio power amplifier with

TDA1013B
DC volume control

Fig.7 Total harmonic distortion as a function of output power; VP = 18 V; RL = 8 Ω and control voltage = 6.5 V.

Fig.8 Typical control curve.

July 1994 8
Philips Semiconductors Product specification

4 W audio power amplifier with

TDA1013B
DC volume control

Fig.9 Noise output voltage as a function of the control voltage; VP = 18 V;

RL = 8 Ω (in accordance with IEC 179, curve ‘A’).

Fig.10 Application diagram.

July 1994 9
Philips Semiconductors Product specification

4 W audio power amplifier with

TDA1013B
DC volume control

PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1

D1
q
P P1 A2

A3
q2
q1

A4
E
seating plane

pin 1 index

L c
1 9

Z e b Q
b2 w M
b1

0 5 10 mm
scale

DIMENSIONS (mm are the original dimensions)

UNIT A
A2
A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1)
max. max.
18.5 8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 3.9 2.75 3.4 1.75 15.1 4.4 5.9
mm 3.7 0.25 1.0
17.8 8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20 3.4 2.50 3.2 1.55 14.9 4.2 5.7

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

92-11-17
SOT110-1
95-02-25

July 1994 10
Philips Semiconductors Product specification

4 W audio power amplifier with

TDA1013B
DC volume control

SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

July 1994 11