NICHIA STS-DA1-2009E <Cat.No.

120828>

N I CH I A CORPORATI ON SPECI FI CATI ON S FOR W ARM W H I TE LED

N VSL2 1 9 BT
Pb-free Reflow Soldering Application
Built-in ESD Protection Device
RoHS Compliant
 NICHIA STS-DA1-2009E <Cat.No.120828>

SPECIFICATIONS

(1) Absolute Maximum Ratings

Item Symbol Absolute Maximum Rating Unit
Forward Current IF 1500 mA
Pulse Forward Current IFP 2000 mA
Allowable Reverse Current IR 85 mA
Power Dissipation PD 5.4 W
Operating Temperature Topr -40~100 °C
Storage Temperature Tstg -40~100 °C
Junction Temperature TJ 150 °C
* Absolute Maximum Ratings at TS=25°C.
* IFP conditions with pulse width ≤10ms and duty cycle ≤10%.

(2) Initial Electrical/Optical Characteristics

Item Symbol Condition Typ Max Unit
IF=700mA 3.13 -
Forward Voltage VF V
IF=350mA 2.95 -
IF=700mA 260 -
Luminous Flux v lm
IF=350mA 140 -
IF=700mA 71 -
Luminous Intensity Iv cd
R70 IF=350mA 38 -
Color Rendering Index Ra IF=700mA 73 - -
x - IF=700mA 0.3817 - -
Chromaticity Coordinate
y - IF=700mA 0.3795 - -
IF=700mA 220 -
Luminous Flux v lm
IF=350mA 117 -
IF=700mA 62 -
Luminous Intensity Iv cd
R8000 IF=350mA 33 -
Color Rendering Index Ra IF=700mA 83 - -
x - IF=700mA 0.4100 - -
Chromaticity Coordinate
y - IF=700mA 0.3900 - -
Thermal Resistance R JS - 6 11 °C/W
* Characteristics at TS=25°C.
* Luminous Flux value as per CIE 127:2007 standard.
* Chromaticity Coordinates as per CIE 1931 Chromaticity Chart.
*R JS is Thermal Resistance from junction to TS measuring point.

1
 NICHIA STS-DA1-2009E <Cat.No.120828>

RANKS

Item Rank Condition Min Max Unit

M2 3.4 3.6
M1 3.2 3.4
Forward Voltage IF=700mA V
L2 3.0 3.2
L1 2.8 3.0
D260 260 280
D240 240 260
Luminous Flux D220 IF=700mA 220 240 lm
D200 200 220
D180 180 200
R70 Ra 70 - -
Color Rendering Index Ra IF=700mA 80 - -
R8000
R9 0 - -

Color Ranks
Rank d1
x 0.3575 0.3610 0.3780 0.3988 0.3897 0.3720
y 0.3612 0.3850 0.3970 0.4116 0.3823 0.3714

Rank d2
x 0.3545 0.3575 0.3720 0.3897 0.3822 0.3667
y 0.3408 0.3612 0.3714 0.3823 0.3580 0.3484

Rank sw27 Rank sw30

x 0.4373 0.4562 0.4813 0.4593 x 0.4147 0.4299 0.4562 0.4373
y 0.3893 0.4260 0.4319 0.3944 y 0.3814 0.4165 0.4260 0.3893

Rank sw35 Rank sw40

x 0.3898 0.3996 0.4299 0.4147 x 0.3670 0.3736 0.3996 0.3898
y 0.3716 0.4015 0.4165 0.3814 y 0.3578 0.3874 0.4015 0.3716

Rank sw45
x 0.3515 0.3548 0.3736 0.3670
y 0.3487 0.3736 0.3874 0.3578
* Ranking at TS=25°C.
* Forward Voltage Tolerance: ±0.05V
* Luminous Flux Tolerance: ±7%
* Color Rendering Index Ra Tolerance: ±2
* Color Rendering Index R9 Tolerance: ±6.5
* The R9 value for the above rank shall be greater than 0.
* Chromaticity Coordinate Tolerance: ±0.005
* LEDs from the above ranks will be shipped.
The rank combination ratio per shipment will be decided by Nichia.

2
 NICHIA STS-DA1-2009E <Cat.No.120828>

Luminous Flux Ranks by Color Rank, Color Rendering Index Rank

Ranking by
Luminous Flux
D180 D200 D220 D240 D260
Ranking by
Color Coordinates, Color Rendering Index
d1,d2 R70
sw27 R8000
sw30,sw35 R8000
sw40,sw45 R8000

3
 NICHIA STS-DA1-2009E <Cat.No.120828>

CHROMATICITY DIAGRAM

0.50

0.45

d1

sw27
sw30
0.40
y

sw35

sw40

sw45

0.35

d2

0.30
0.30 0.35 0.40 0.45 0.50
x

4
 NICHIA STS-DA1-2009E <Cat.No.120828>

OUTLINE DIMENSIONS

* RoHS NVSL219B
This product complies with RoHS Directive. No. STS-DA7-1785

( Unit: mm, ( Unit:±0.2)

Tolerance: mm)

3.5
2.9 0.4
3.5

Cathode Mark
2

Item Description

Package Materials Ceramics

3.2 Encapsulating Resin

Silicone Resin (with phosphor)
0.5 Materials
0.45 1.3
Electrodes Materials Au-plated

Lens Materials Silicone Resin

3.2
2.4
1

Die Heat Sink

Au-plated
Materials

Weight 0.031g (TYP)

Cathode Anode

Die Heat Sink

Protection Device

K A

5
 NICHIA STS-DA1-2009E <Cat.No.120828>

SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder)

1 to 5°C per sec

260°C Max
10sec Max
Pre-heat
180 to 200°C
60sec Max
Above 220°C

120sec Max

Recommended Soldering Pad Pattern

0.5
0.4 1.3
1.2

3.3

0.5 ( Unit: mm)

4.1

* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and bump breaks, decreasing reliability.
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress
to the encapsulation of the LEDs.
Recommended conditions:
It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)
* Avoid direct contact to the resin lens
with the picking up nozzle.
Failure to comply might result in catastrophic failure
of the LEDs due to bump damage or breakage.
1.9
0.4

3.5
4.5 ( Unit: mm)

* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* The Die Heat Sink should be soldered to customer PCB.
If it is difficult or impossible, use high heat-dissipating adhesive.
* When soldering, do not apply stress to the LED while the LED is hot.
* This product uses an electrode pad design which improves thermal shock resistance.
After mounting, it is recommended to check if the solder fillets are properly formed on the sides of the pads.

6
 NICHIA STS-DA1-2009E <Cat.No.120828>

TAPE AND REEL DIMENSIONS

Nxxx219x
Tape
No. STS-DA7-1728

1.75±0.1
1.5+0.1 8±0.1 2±0.054±0.1 ( Unit: mm)
-0 0.25±0.05

3.7±0.1
Cathode Mark

5.5±0.05
12+0.3
-0.1
1.5+0.2
-0
2.25±0.1

3.7±0.1

Embossed Carrier Tape

/ Trailer and Leader

Top Cover Tape

Feed
Direction

160mm LED 100mm

Trailer 160mm MIN(Empty Pockets) Loaded Pockets Leader with Top Cover Tape
100mm MIN(Empty Pocket)

400mm
Leader without Top Cover Tape 400mm MIN
Reel 17.5±1
330±2 13.5±1

* 1 3500
Reel Size: 3500pcs
* JIS C 0806
21 ±
0.
8
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).
80±1
20.
13 ±

Label

7
 NICHIA STS-DA1-2009E <Cat.No.120828>

PACKAGING - TAPE & REEL

Nxxxxxxx
Reels are shipped with desiccants in heat-sealed moisture-proof bags. No. STS-DA7-0006C

Label

Reel
Desiccants XXXX LED
TYPE Nxxxxxxx
*******
LOT YMxxxx-RRR
QTY. PCS
RoHS
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN

Seal

Moisture-proof Bag

Moisture-proof bags are packed in cardboard boxes

with corrugated partitions.

Label

XXXX LED
TYPE Nxxxxxxx
*******
RANK
QTY.
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN

* *******
Nichia LED
******* is the customer part number.
If not provided, it will not be indicated on the label.
*

For details, see "LOT NUMBERING CODE"

in this document.
*
The label does not have the RANK field for
un-ranked products.

*
Products shipped on tape and reel are packed in a moisture-proof bag.
They are shipped in cardboard boxes to protect them from external forces during transportation.
*
Do not drop or expose the box to external forces as it may damage the products.
*
Do not expose to water. The box is not water-resistant.
*
Using the original package material or equivalent in transit is recommended.

8
 NICHIA STS-DA1-2009E <Cat.No.120828>

LOT NUMBERING CODE

Lot Number is presented by using the following alphanumeric code.

YMxxxx - RRR
Y - Year
Year Y
2009 9
2010 A
2011 B
2012 C
2013 D
2014 E

M - Month
Month M Month M
1 1 7 7
2 2 8 8
3 3 9 9
4 4 10 A
5 5 11 B
6 6 12 C

xxxx-Nichia's Product Number

RRR-Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Forward Voltage, Ranking by Color Rendering Index

9
 NICHIA STS-DA1-2009E <Cat.No.120828>

DERATING CHARACTERISTICS
NVSx219B
No. STS-DA7-1723

R JA =15°C/W
Am b ien t T e m p e ra t u r e vs So ld er Te m pe r at u r e( C at h o d e Sid e) vs
R JA =25°C/W
Allo w ab le Fo r w ar d Cu rr en t A llow a b le Fo r w ar d Cu rr en t
R JA =35°C/W
Derating1 Derating2
2000 2000
Allowable Forward Current(mA)

Allowable Forward Current(mA)

(74, 1500) (94, 1500)
(24, 1500)
1500 1500
(0, 1270)
(100, 1350)

1000 1000

500 (100, 995) 500

(100, 597)
(100, 426)

0 0
0 20 40 60 80 100 120 0 20 40 60 80 100 120

Ambient Temperature(°C) Solder Temperature(Cathode Side)(°C)

D u t y R a t io vs
Allo w ab le Fo r w ar d Cu rr en t
Duty TA=25°C
10000
Allowable Forward Current(mA)

2000
1500
1000

100
1 10 100

Duty Ratio(%)

10
 NICHIA STS-DA1-2009E <Cat.No.120828>

OPTICAL CHARACTERISTICS

* NVSL219B
All characteristics shown are for reference only and are not guaranteed. No. STS-DA7-2444

Sp ect r u m
T A=25°C
Spectrum IFP=700mA
1.0

0.8
Relative Emission Intensity(a.u.)

0.6

0.4

0.2

0.0
400 450 500 550 600 650 700 750 800

Wavelength(nm)

Directivity1

Dir ect ivit y

T A=25°C
IFP=700mA

-10° 0° 10°
-20° 20°
-30° 30°

-40° 40°

-50° 50°
Radiation Angle

-60° 60°

-70° 70°

-80° 80°

-90° 90°
1 0.5 0 0.5 1

Relative Illuminance(a.u.)

* R70
The g raphs above show the characteristics for R70 LEDs of this product.

11
 NICHIA STS-DA1-2009E <Cat.No.120828>

OPTICAL CHARACTERISTICS

* NVSL219B
All characteristics shown are for reference only and are not guaranteed. No. STS-DA7-1729A

Sp ect r u m
T A=25°C
Spectrum IFP=700mA
1.0

0.8
Relative Emission Intensity(a.u.)

0.6

0.4

0.2

0.0
400 450 500 550 600 650 700 750 800

Wavelength(nm)

Directivity1

Dir ect ivit y

T A=25°C
IFP=700mA

-10° 0° 10°
-20° 20°
-30° 30°

-40° 40°

-50° 50°
Radiation Angle

-60° 60°

-70° 70°

-80° 80°

-90° 90°
1 0.5 0 0.5 1

Relative Illuminance(a.u.)

* R8000
The graphs above show the characteristics for R8000 LEDs of this p roduct.

12
 NICHIA STS-DA1-2009E <Cat.No.120828>

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

* NVSL219B
All characteristics shown are for reference only and are not guaranteed. No. STS-DA7-1730

Fo rw a rd V olt a g e vs Am b ien t T em p e ra t u r e vs
Fo rw a rd Cu r re n t F or w a rd Vo lt a g e
T A=25°C IFP=700mA
10000 4.0

2000 3.5
Forward Current(mA)

Forward Voltage(V)
1000
700

3.0

100

2.5

10 2.0
2.0 2.5 3.0 3.5 4.0 -60 -40 -20 0 20 40 60 80 100 120

Forward Voltage(V) Ambient Temperature(°C)

Fo rw a rd Cu r re n t vs A m b ien t T em p e ra t u re vs
Re lat ive Lu m in ou s Flu x R e la t ive L u m in o u s Flu x IFP= 700mA
T A=25°C

3.0 1.4

2.5
Relative Luminous Flux(a.u.)
Relative Luminous Flux(a.u.)

1.2

2.0

1.5 1.0

1.0
0.8

0.5

0.0 0.6
0 500 1000 1500 2000 2500 -60 -40 -20 0 20 40 60 80 100 120

Forward Current(mA) Ambient Temperature(°C)

13
 NICHIA STS-DA1-2009E <Cat.No.120828>

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

* NVSL219B
No. STS-DA7-2445A
All characteristics shown are for reference only and are not guaranteed.

Fo rw a r d Cu r r en t vs
Ifxy
Ch ro m a t icit y C oo r din a t e
TA=25°C
0.40

0.39 20mA
100mA

0.38
y

700mA

1500mA
2000mA
0.37

0.36
0.36 0.37 0.38 0.39 0.40

Am b ie n t Te m p er at u r e vs Taxy
Ch ro m a t icit y C oo r din a t e I FP= 700mA

0.40

0.39

50°C
0.38 100°C 25°C
y

0°C
-40°C

0.37

0.36
0.36 0.37 0.38 0.39 0.40

* R70
The graphs above show the characteristics for R70 LEDs of this product.

14
 NICHIA STS-DA1-2009E <Cat.No.120828>

FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS

* NVSL219B
No. STS-DA7-1731A
All characteristics shown are for reference only and are not guaranteed.

Fo rw a r d Cu r r en t vs
Ifxy
Ch ro m a t icit y C oo r din a t e
TA=25°C
0.41

0.40

700mA
1500mA 300mA
0.39
y

2000mA 20mA

0.38

0.37
0.39 0.40 0.41 0.42 0.43

Am b ie n t Te m p er at u r e vs Taxy
Ch ro m a t icit y C oo r din a t e I FP= 700mA

0.41

-40°C
0.40

0°C

0.39 25°C
y

50°C

100°C
0.38

0.37
0.39 0.40 0.41 0.42 0.43

* R8000
The graphs above show the characteristics for R8000 LEDs of this product.

15
 NICHIA STS-DA1-2009E <Cat.No.120828>

RELIABILITY

(1) Tests and Results

Failure
Reference Test Units
Test Test Conditions Criteria
Standard Duration Failed/Tested
#
Resistance to
JEITA ED-4701 Tsld=260°C, 10sec, 2reflows,
Soldering Heat #1 0/22
300 301 Precondition: 30°C, 70%RH, 168hr
(Reflow Soldering)
Solderability JEITA ED-4701 Tsld=245±5°C, 5sec,
#2 0/22
(Reflow Soldering) 303 303A Lead-free Solder(Sn-3.0Ag-0.5Cu)
JEITA ED-4701 -40°C(30min)~25°C(5min)~
Temperature Cycle 100cycles #1 0/22
100 105 100°C(30min)~25°C(5min)
Moisture Resistance JEITA ED-4701 25°C~65°C~-10°C, 90%RH,
10cycles #1 0/22
(Cyclic) 200 203 24hr per cycle
High Temperature JEITA ED-4701
TA=100°C 1000hours #1 0/22
Storage 200 201
Temperature Humidity JEITA ED-4701
TA=60°C, RH=90% 1000hours #1 0/22
Storage 100 103
Low Temperature JEITA ED-4701
TA=-40°C 1000hours #1 0/22
Storage 200 202
Room Temperature TA=25°C, IF=1000mA
1000hours #1 0/22
Operating Life Test board: See NOTES below
High Temperature TA=100°C, IF=400mA
1000hours #1 0/22
Operating Life Test board: See NOTES below
Temperature Humidity 60°C, RH=90%, IF=700mA
500hours #1 0/22
Operating Life Test board: See NOTES below
Low Temperature TA=-40°C, IF=700mA
1000hours #1 0/22
Operating Life Test board: See NOTES below
JEITA ED-4701 200m/s2, 100~2000~100Hz,
Vibration 48minutes #1 0/10
400 403 4cycles, 4min, each X, Y, Z
JEITA ED-4701 HBM, 2kV, 1.5k , 100pF, 3pulses,
Electrostatic Discharges #1 0/22
300 304 alternately positive or negative
NOTES:
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, R JA≈35°C/W

2) Measurements are performed after allowing the LEDs to return to room temperature.

(2) Failure Criteria

Criteria # Items Conditions Failure Criteria
Forward Voltage(VF) IF=700mA >Initial value×1.1
#1
Luminous Flux( V) IF=700mA <Initial value×0.7
#2 Solderability - Less than 95% solder coverage

16
 NICHIA STS-DA1-2009E <Cat.No.120828>

CAUTIONS

(1) Storage
Conditions Temperature Humidity Time
Before Opening Aluminum Bag ≤30°C ≤90%RH Within 1 Year from Delivery Date
Storage
After Opening Aluminum Bag ≤30°C ≤70%RH ≤168hours
Baking 65±5°C - ≥24hours
Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details.
Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination
and result in optical performance degradation. Products are packed in moisture-proof aluminum bags
to minimize moisture absorption during transportation and storage.
Included silica gel desiccants change from blue to red if moisture had penetrated bags.
After opening the moisture-proof aluminum bag, the products should go through the soldering process
within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants
in a hermetically sealed container, preferably the original moisture-proof bags for storage.
After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue,
the products should be baked. Baking should only be done once.
Although the leads or electrode pads (anode and cathode) of the product are plated with gold,
prolonged exposure to a corrosive environment might cause the gold plated the leads or electrode pads to tarnish,
and thus leading to difficulties in soldering. If unused LEDs remain, they must be stored in a hermetically sealed container.
Nichia recommends using the original moisture-proof bag for storage.
Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.
The contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended as a material for seals.
Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products,
caused by low molecular weight volatile siloxane.
To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions.

(2) Directions for Use

When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating.
Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended.
If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.

(A) (B)
...

...

LEDs should be operated in forward bias. Driving circuits must not subject LEDs to either forward or reverse voltage while off.
Continuous reverse voltage can cause migration and LED damage.
It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics.
For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.

(3) Handling Precautions

Do not handle LEDs with bare hands, it may contaminate the LED surface and affect optical characteristics.
In the worst case, catastrophic failure from excess pressure through bump-bond breaks and package damage may result.
When handling the product with tweezers, be careful not to apply excessive force to the resin.
Otherwise, The resin can be cut, chipped, delaminate or deformed, causing bump-bond breaks and catastrophic failures.
Dropping the product may cause damage.
Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed. It may cause bump to break, leading to catastrophic failures.

17
 NICHIA STS-DA1-2009E <Cat.No.120828>

(4) Design Consideration

PCB warpage after mounting the products onto a PCB can cause the package to break.
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.
The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
Board separation must be performed using special jigs, not using hands.
If an aluminum PCB is used, customer is advised to verity the PCB with the products before use.
Thermal stress during use can cause the solder joints to crack.

(5) Electrostatic Discharge (ESD)

The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Eliminating the charge
Grounded wrist strap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
Proper grounding is required for all devices, equipment, and machinery used in product assembly.
Surge protection should be considered when designing of commercial products.
If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
The customer is advised to check if the LEDs are damaged by ESD
when performing the characteristics inspection of the LEDs in the application.
Damage can be detected with a forward voltage measurement or a light-up test at low current (≤1mA).
ESD damaged LEDs may have current flow at a low voltage or no longer illuminate at a low current.
Failure Criteria: VF<2.0V at IF=0.5mA

(6) Thermal Management

Proper thermal management is an important when designing products with LEDs. LED die temperature is affected
by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature
does not exceed the maximum Junction Temperature (TJ).
Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product.
The following equations can be used to calculate the junction temperature of the products.
1) TJ=TA+R JA W 2) TJ=TS+R JS W
*TJ=LED junction temperature: °C
TA=Ambient temperature: °C
TS=Soldering temperature (cathode side): °C
R JA=Thermal resistance from junction to ambient: °C/W
R JS=Thermal resistance from junction to TS measuring point: °C/W

W=Input power(IF×VF): W

Ts Point

18
 NICHIA STS-DA1-2009E <Cat.No.120828>

(7) Cleaning
If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs
depending on the ultrasonic power and how LED is assembled.
If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning.

(8) Eye Safety

In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps
and lamp systems, which added LEDs in its scope.
On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope.
However, please be advised that some countries and regions have adopted standards
based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope.
Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1.
High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2.
Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs
with optical instruments which may greatly increase the damages to your eyes.
Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,
please be careful to avoid adverse effects on the human body caused by light stimulation.

(9) Others
The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment,
communications equipment, measurement instruments and household appliances).
Consult Nichia's sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or
health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles,
traffic control equipment, life support systems and safety devices).
The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent
from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis.
Both the customers and Nichia will agree on official specifications of supplied products before a customer's volume production.
Specifications and appearance subject to change for improvement without notice.

19