Picozed 7Z015 / 7Z030 Som: (System-On Module)
Picozed 7Z015 / 7Z030 Som: (System-On Module)
Picozed 7Z015 / 7Z030 Som: (System-On Module)
7Z015 / 7Z030
SOM
(System-On Module)
Hardware
User Guide
Version 1.1
12/8/2014
(XC7Z030 Model Shown)
Contents
1 INTRODUCTION ...................................................................................................................... 3
2 FUNCTIONAL DESCRIPTION ................................................................................................. 5
2.1 ALL PROGRAMMABLE SOC................................................................................................... 5
2.2 MEMORY ............................................................................................................................. 5
2.2.1 DDR3 ......................................................................................................................... 5
2.2.2 Quad SPI Flash.......................................................................................................... 6
2.2.3 eMMC (Multi-Media Card) ......................................................................................... 7
2.3 USB 2.0 OTG .................................................................................................................... 9
2.3.1 USB Host 2.0 ............................................................................................................. 9
2.4 10/100/1000 ETHERNET PHY ........................................................................................... 10
2.5 USER I/O .......................................................................................................................... 11
2.5.1 Available PS MIO User Pins .................................................................................... 11
2.5.2 Available PL IO User Pins ....................................................................................... 12
2.6 CLOCK SOURCE ................................................................................................................. 12
2.7 RESET SOURCES............................................................................................................... 12
2.7.1 Power‐on Reset (PS_POR_B) ................................................................................. 12
2.7.2 PROGRAM_B, DONE, PUDC_B, INIT_B Pins ....................................................... 13
2.7.3 Processor Subsystem Reset ................................................................................... 13
2.8 EXPANSION HEADERS ........................................................................................................ 13
2.8.1 Micro Headers.......................................................................................................... 13
2.9 MULTI-GIGABIT TRANSCEIVERS (MGTS)............................................................................. 18
2.10 CONFIGURATION MODES.................................................................................................... 19
2.10.1 JTAG Connections ................................................................................................... 21
2.11 POWER SUPPLIES.............................................................................................................. 21
2.11.1 Voltage Rails and Sources ...................................................................................... 21
2.11.2 Voltage Regulators .................................................................................................. 23
2.11.3 Power Supply Sequencing ....................................................................................... 24
2.11.4 Bypassing/Decoupling ............................................................................................. 25
2.11.5 Power Good LED ..................................................................................................... 26
2.11.6 Power Estimation ..................................................................................................... 26
2.11.7 XADC Power Configuration ..................................................................................... 27
2.11.8 Battery Backup for Device Secure Boot Encryption Key ......................................... 27
2.11.9 Cooling Fan.............................................................................................................. 27
3 ZYNQ-7000 AP SOC I/O BANK ALLOCATION ..................................................................... 28
3.1 PS MIO ALLOCATION ........................................................................................................ 28
3.2 ZYNQ-7000 AP SOC BANK VOLTAGES ............................................................................... 29
4 MECHANICAL ........................................................................................................................ 30
5 REVISION HISTORY ............................................................................................................. 32
1 8-December-2014
Figures
FIGURE 1 – PICOZED 7015/7030 BLOCK DIAGRAM 4
FIGURE 2 – EMMC / JX2 MIO MULTIPLEXER BLOCK DIAGRAM 8
FIGURE 3 – 10/100/1000 ETHERNET INTERFACE 10
FIGURE 4 ‐ PICOZED 7015/7030 POWER SCHEME 22
FIGURE 5 ‐ REGULATION CIRCUITRY (VCCIO_EN IS PG_1V8) 23
FIGURE 6 ‐ POWER SEQUENCING 24
FIGURE 7 ‐ POWER SEQUENCING WITH CARRIER CARD 25
FIGURE 8 ‐ CLG4485/SBG485 PL DECOUPLING 25
FIGURE 9 ‐ CLG4485/SBG485 PS DECOUPLING 26
FIGURE 10 ‐ XADC POWER CONFIGURATION 27
FIGURE 11 ‐ PICOZED 7015/7030 MECHANICAL 30
FIGURE 12 ‐ PICOZED 7015/7030 SIDE VERTICAL DIMENSIONS 31
Tables
TABLE 1 – DDR3 CONNECTIONS 6
TABLE 2 – QSPI FLASH PIN ASSIGNMENT AND DEFINITIONS 7
TABLE 3 ‐ USB 2.0 JX3 PIN ASSIGNMENTS 9
TABLE 4 ‐ USB HOST PIN ASSIGNMENT AND DEFINITIONS 10
TABLE 5 ‐ ETHERNET PHY PIN ASSIGNMENT AND DEFINITIONS 11
TABLE 6 ‐ PS MIO USER INTERFACE 11
TABLE 7 – MICRO HEADER JX1 AND JX2 PIN‐OUT 14
TABLE 8 – MICRO HEADER JX3 PIN‐OUT 15
TABLE 9 – JX1 CONNECTIONS 15
TABLE 10 – JX2 CONNECTIONS 16
TABLE 11 – JX3 CONNECTIONS 17
TABLE 12 – MGT PIN ASSIGNMENTS 19
TABLE 13 – PICOZED 7015/7030 CONFIGURATION MODES 20
TABLE 14 – JTAG PIN CONNECTIONS 21
TABLE 15 ‐ PICOZED 7015/7030 VOLTAGE RAILS 22
TABLE 16 – VOLTAGE RAILS W/ MAX OUTPUT CURRENT 24
TABLE 17 – PS MIO INTERFACE REQUIREMENTS 28
TABLE 18 – PS GPIO ASSIGNMENTS 28
TABLE 19 – ZYNQ BANK VOLTAGE ASSIGNMENTS 29
2 8-December-2014
1 Introduction
The PicoZed 7Z015 / 7Z030 SOM (System-On Module) is a low cost evaluation board targeted
for broad use in many applications. The features provided by the PicoZed SOM consist of:
Software
o Vivado Design Suite
Download from www.xilinx.com/support/download.html
Request a free DVD from
www.xilinx.com/onlinestore/dvd_fulfillment_request.htm
3 8-December-2014
XC7Z015/30‐ USB 2.0 JX3
128 Mb QSPI
1SBG485 ULPI PHY Connector
Ethernet JX3
1 GB DDR3 PHY Connector
JX3
4 GB eMMC * 13 MIO Connector
Processing JX2
OSC @ 33.33 MHz 8 MIO *
System Connector
JX3 Micro Header (Bank 13)
20 User I/O
JX2 Micro Header (Bank 13)
JX1 Micro Header (Bank 13)
7 User I/O
8 User I/O
Programmable
JX1 Micro Header Logic JX2 Micro Header
50 User I/O 50 User I/O
4 8-December-2014
2 Functional Description
2.1 All Programmable SoC
PicoZed 7015/7030 includes a Xilinx Zynq XC7Z015-1CLG485 or Zynq XC7Z030-1SBG485 AP
SoC. The PicoZed 7015/7030 is available in both commercial and industrial temperature grade
options.
2.2 Memory
Zynq contains a hardened PS memory interface unit. The memory interface unit includes a
dynamic memory controller and static memory interface modules. PicoZed 7015/7030 takes
advantage of these interfaces to provide system RAM as well as two different non-volatile
memory sources.
2.2.1 DDR3
PicoZed 7015/7030 includes two Micron MT41K256M16HA-125:E DDR3 memory components
creating a 256M x 32-bit interface, totaling 1 GB of random access memory. The DDR3 memory
is connected to the hard memory controller in the PS of the Zynq AP SoC. The PS incorporates
both the DDR controller and the associated PHY, including its own set of dedicated I/Os.
The DDR3L interface uses 1.35V SSTL-compatible inputs by default. There is an option to
support 1.5V capable DDR3 devices via a resistor change on the PicoZed 7015/7030. This option
is provided as a note on the PicoZed 7015/7030 schematics.
DDR3L Termination is utilized on the PicoZed 7015/7030 and configured for fly-by routing
topology, as recommended in UG933. Additionally the board trace lengths are matched,
compensating for the XC7Z015-SBG485 internal package flight times, to meet the requirements
listed in the Zynq-7000 AP SoC PCB Design and Pin Planning Guide (UG933).
All single-ended signals are routed with 40 ohm trace impedance. DCI resistors (VRP/VRN), as
well as differential clocks, are set to 80 ohms. DDR3-CKE0 is terminated through 40 ohms to
VTT as described in UG933. DDR3-ODT has the same 40 ohm to VTT termination.
Each DDR3 chip has its own 240-ohm pull-down on ZQ. Note DDR-VREF is not the same as
DDR-VTT.
5 8-December-2014
Table 1 – DDR3 Connections
Signal Name Description Zynq AP SOC pin DDR3 pin
DDR_CK_P Differential clock output N19 J7
DDR_CK_N Differential clock output N18 K7
DDR_CKE Clock enable T19 K9
DDR_CS_B Chip select P17 L2
DDR_RAS_B RAS row address select R18 J3
DDR_CAS_B RAS column address select P20 K3
DDR_WE_B Write enable R19 L3
DDR_BA[2:0] Bank address PS_DDR_BA[2:0] BA[2:0]
DDR_A[14:0] Address PS_DDR_A[14:0] A[14:0]
DDR_ODT Output dynamic termination P18 K1
DDR_RESET_B Reset F20 T2
DDR3_DQ pins [15:0]
DDR_DQ[31:0] I/O Data PS_DDR_[31:0]
x2
DDR_DM[3:0] Data mask PS_DDR_DM[3:0] LDM/UDM x2
DDR_DQS_P[3:0] I/O Differential data strobe PS_DDR_DQS_P[3:0] UDQS/LDQS x2
DDR_DQS_N[3:0] I/O Differential data strobe PS_DDR_DQS_N[3:0] UDQS#/LDQS# x2
I/O Used to calibrate input
DDR_VRP N16 N/A
termination
I/O Used to calibrate input
DDR_VRN M16 N/A
termination
DDR_VREF[1:0] I/O Reference voltage H16, P16 VTTREF
The SPI Flash connects to the Zynq PS QSPI interface. This requires connection to specific pins
in MIO Bank 0/500, specifically MIO[1:6,8] as outlined in the Zynq TRM. Quad-SPI feedback
mode is used, thus qspi_sclk_fb_out/MIO[8] is connected to a 20K pull-up resistor to 3.3V and
nothing else. This allows a QSPI clock frequency greater than FQSPICLK2. The 20K pull-up
straps VMODE[1], setting the Bank 1 Voltage to 1.8V.
6 8-December-2014
Table 2 – QSPI Flash Pin Assignment and Definitions
Zynq Pin MIO Quad-SPI Pin
Signal Name Description
CS Chip Select A22 (MIO Bank 0/500) 1 1
DQ0 Data0 A21 (Bank MIO0/500) 2 5
DQ1 Data1 F17 (MIO Bank 0/500) 3 2
DQ2 Data2 E19 (MIO Bank 0/500) 4 3
DQ3 Data3 A20 (MIO Bank 0/500) 5 7
SCK Serial Data Clock A19 (MIO Bank 0/500) 6 6
FB Clock QSPI Feedback D5 (MIO Bank 0/500) 8 N/A
Note: The QSPI data and clock pins are shared with the VMODE and BOOT_MODE jumpers
JT4 and SW1.
The eMMC connects to the Zynq PS via seven signals by way of 2 4-bit MUXs.
The eMMC I/O is MUXed with direct connections to the Zynq MIO PS_MIO[0, 15:9] pins allowing
the user to use the JX2 MIO[0, 15:9] pins as standard I/O or have access to the eMMC I/O. The
Zynq PS_MIO0 pin can be used as a MUX select to give the user software control to select either
interface in real time. Software control and hardware control of the multiplexer select line is
discussed in further detail below.
Software control of the Multiplexer Select signal is the default setting for the PicoZed 7015/7030
System-On-Module from the factory, and is enabled by the jumper resistor position at JT6
position 1-2.
In position 1-2 the Zynq PS_MIO0 pin is connected to the multiplexer select pins of U18 and U19.
In position 2-3 the Zynq PS_MIO0 pin is connected to the JX2 MIO0 pin via the multiplexer
channel 4 on device U19.
7 8-December-2014
Hardware Control of Multiplexer Select (Interface Strapping)
Another user option available is to “hard-wire” one of the two interfaces, JX2 MIO[0,15:9] or
eMMC I/O to the Zynq PS_MIO[0,15:9] pins. This can be done by modifying the resistor jumper
position at JT5, which sets the desired interface and JT6, which controls the use of PS_MIO0.
The default resistor jumper position for JT5 is 1-2, which selects the eMMC as the selected
interface.
If JT5 resistor jumper position is changed to position 2-3, JX2 MIO pins become selected by the
multiplexers. In this case, it is best to also change the JT6 jumper position to 2-3 to ensure that a
full 8-bit peripheral can be connected through the JX2 MIO interface if so desired.
The diagram below shows how the eMMC and JX2 MIO signals are connected to the Zynq via
the multiplexer ICs U18 and U19.
JX2
EMMC
8 8-December-2014
2.3 USB 2.0 OTG
2.3.1 USB Host 2.0
Zynq contains a hardened PS USB 2.0 controller. PicoZed 7015/7030 takes advantage of the
USB 2.0 controller to provide USB 2.0 On-The-Go signaling to the JX3 connector.
PicoZed 7015/7030 implements one of the two available PS USB 2.0 interfaces. An external
PHY with an 8-bit ULPI interface is required. A SMSC USB3320 Standalone USB Transceiver
Chip is used as the PHY. The PHY features a complete HS-USB Physical Front-End supporting
speeds of up to 480Mbs. VDDIO for this device can be 1.8V or 3.3V, and on the PicoZed
7015/7030 it is powered at 1.8V. The PHY is connected to MIO Bank 1/501, which is also
powered at 1.8V. This is critical since a level translator cannot be used as it would impact the
tight ULPI timing required between the PHY and the Zynq device.
Additionally the USB chip must clock the ULPI interface which requires a 24 MHz crystal or
oscillator (configured as ULPI Output Clock Mode). On the PicoZed 7015/7030, the 24 MHz
oscillator is an Abracon ASDMB CMOS oscillator.
The USB connector is not populated on the PicoZed 7015/7013 System-on-Module and is
designed to have the USB connector reside on the mating carrier card. The four USB connector
signals (USB_P, USB_N, USB_ID and USB_OTG_CPEN) are connected to the JX3 Micro
Header. The table below shows the connections of these four signals at JX3.
If using the Avnet PicoZed Carrier Card as the mating carrier card, a Micro-AB connector
provided by FCI is used. The FCI part number is 10104111-0001LF.
The usb0 peripheral is used on the PS, connected through MIO[28-39] in MIO Bank 1/501. The
USB Reset signal connected to MIO[7]. Signal PS_MIO7 is a 3.3V signal. It is AND-ed with the
power-on reset (PG_MODULE) signal and then level shifted to 1.8V through a TI TXS0102 level
translator before connecting to the USB3320 Pin 27 RESET.
PicoZed 7015/7030 is configured such that either Host Mode (OTG) or Device Mode can used
depending on the circuitry of the carrier card. With a standard connection to a baseboard (no
power supply used to provide USB power to the connector) the device will operate in Device
Mode. Using the USB_OTG_CPEN signal on JX3 allows the user to control an external power
source for USB VBUS on the carrier board. Other considerations need to be made to
accommodate Host Mode. Refer to the Avnet PicoZed Carrier Card design for an example design
for configuring the carrier card for either Host Mode or Device Mode.
9 8-December-2014
Table 4 - USB Host Pin Assignment and Definitions
SMSC
Signal Name Description Zynq Bank MIO
3320 Pin
Data[7:0] USB Data lines MIO Bank 1/501 Data[7:0]
REFCLOCK USB Clock MIO Bank 1/501 26
DIR ULPI DIR output signal MIO Bank 1/501 28:39 31
STP ULPI STP input signal MIO Bank 1/501 29
NXT ULPI NXT output signal MIO Bank 1/501 2
REFSEL[2:0] USB Chip Select 8,11,14
DP DP pin of USB Connector 18
DM DM pin of USB Connector N/C N/C 19
Identification pin of the
ID 23
USB connector
RESET_B Reset MIO Bank 1/501 7** 27**
** Connected through AND-gate with PG_MODULE through level translator (TI TXS0102DQE).
The RJ-45 interface signals are connected to the JX3 Micro Header.
A high-level block diagram the 10/100/1000 Ethernet interface is shown in the following figure.
Zynq requires a voltage reference for RGMII interfaces. Thus PS_MIO_VREF, F15, is tied to
0.9V, half the bank voltage of MIO Bank 1/501. The 0.9V is generated through a resistor divider.
10 8-December-2014
Table 5 - Ethernet PHY Pin Assignment and Definitions
Signal Name Description Zynq pin MIO 88E1512 pin
RX_CLK Receive Clock A9 46
RX_CTRL Receive Control D16 43
Receive Data RXD0: E12 44
RXD1: B16 45
RXD[3:0]
RXD2: F11 47
RXD3: A10 48
16:27
TX_CLK Transmit Clock D17 53
TX_CTRL Transmit Control F12 56
Transmit Data TXD0: E14 50
TXD1: A16 51
TXD[3:0]
TXD2: E13 54
TXD3: A15 55
MDIO Management Data C11 53 8
MDC Management Clock D13 52 7
ETH_RST_N PHY Reset B13 47 ** 16**
** Controlled via level translator U8 and can be held low using PG_MODULE signal.
The datasheet for the Marvell 88E1512 is not available publicly. An NDA is required for this
information. Please contact your local Avnet or Marvell representative for assistance.
Note: The bank 500 PS MIO are shared with the eMMC interface and proper operation of these 8
user PS MIO pins depends on the multiplexer implemented to support the shared interface.
Please review section 2.2.3 eMMC (Multi-Media Controller) for details on the multiplexer
interface.
11 8-December-2014
PS_MIO44 E10 (MIO Bank 501) JX3.39
PS_MIO45 B14 (MIO Bank 501) JX3.38
PS_MIO46 D11 (MIO Bank 501) JX3.41
PS_MIO47 B13 (MIO Bank 501) JX3.40
PS_MIO48 D12 (MIO Bank 501) JX3.42
PS_MIO49 C9 (MIO Bank 501) JX3.44
PS_MIO50 D10 (MIO Bank 501) JX3.64
PS_MIO51 C13 (MIO Bank 501) JX3.66
Note: PS_MIO47 is not implemented on connector JX3. Due to this limitation, USB1 peripheral
cannot be implemented on an end user carrier card.
The PL IO pins were routed with matched lengths to each of the JX connectors. The matched
pairs, noted by “LVDS” in the net name of Tables 9, 10 AND 11 may be used as either single
ended I/O or differential pairs depending on the end users design requirements.
Use of these signals for various interfaces depends on the bank voltages assigned. The end user
carrier card is responsible for providing VCCO for bank 34, bank 35, and bank 13 depending on
what it being implemented and whether you are using PicoZed 7015 or PicoZed 7030.
The PicoZed 7030 Banks 34 and 35 operate at 1.8V ONLY as they are high performance
banks, while the PicoZed 7015 banks 34 and 35 can operate at 1.8V, 2.5V or 3.3V.
It is recommended that any custom interface to be implemented be run through the Vivado tool
suite for a sanity check on place and route and timing closure in advance of end user carrier card
manufacturing.
Pin out details of the available PL IO are included in section 2.8: Expansion Headers.
To stall Zynq boot-up, this signal should be held low. No other signal (SRST, PROGRAM_B,
INIT_B) is capable of doing this as in other FPGA architectures.
12 8-December-2014
2.7.2 PROGRAM_B, DONE, PUDC_B, INIT_B Pins
INIT_B, PROGRAM_B and PUDC_B all have pull-up resistors to 3.3V. The INIT_B, PUDC_B
and DONE signals are routed to the carrier card via the Micro Headers, JX1 and JX2.
There is not a DONE LED indicator on the PicoZed 7015/7030 System-On-Module. When PL
configuration is complete DONE will go high. It is recommended that the DONE signal be
connected to an LED on the carrier card to indicate when the FPGA configuration is complete.
When mating to the Avnet PicoZed Carrier Card a blue LED labeled DONE will illuminate.
This active-low signal can be asserted via the carrier card through the Micro Header interface.
Note: This signal cannot be asserted while the boot ROM is executing following a POR reset. If
PS_SRST_B is asserted while the boot ROM is running through a POR reset sequence it will
trigger a lock-down event preventing the boot ROM from completing. To recover from lockdown
the device either needs to be power cycled or PS_POR_B needs to be asserted.
The JX1 and JX2 connectors interface PL, PS I/O to the carrier card as well as two dedicated
analog inputs, the four dedicated JTAG signals, power and control signals.
The JX3 connector interfaces to peripheral interfaces such as Ethernet, microSD Card, UART,
Gigabit transceivers (GTP/GTX), USB 2.0 and Bank 13 PL I/O.
The connectors are FCI 0.8mm Bergstak®, 100 Position, Dual Row, BTB Vertical Receptacles.
These have variable stack heights from 5mm to 16mm, making it easy to connect to a variety of
carrier or system boards. Each pin can carry 500mA of current and support I/O speeds in excess
of what Zynq can achieve.
PicoZed 7015/7030 does not power the PL VCCIO banks. This is required to be provided by the
carrier card. This gives the carrier card the flexibility to control the I/O bank voltages. Separate
routes/planes are used for VCCO_34 and VCCO_35 such that the carrier card could potentially
power these independently. The PicoZed 7015/7030 has three PL I/O banks. Banks 34 and 35
each contain 50 I/O. Bank 13 is partially connected (33 I/O) on the PicoZed 7015/7030. Bank
13’s power has an independent rail, VCCO_13, which is powered from the carrier card as well.
Within a PL I/O bank, there are 50 I/O capable of up to 24 differential pairs. Differential LVDS
pairs on a -1 speed grade device are capable of 950Mbps of DDR data. Each differential pair
from Bank 34 and 35 is isolated by a power or ground pin. Additionally, eight of these I/O can be
connected as clock inputs (four MRCC and four SRCC inputs). Each PL bank can also be
configured to be a memory interface with up to four dedicated DQS data strobes and data byte
13 8-December-2014
groups. Bank 35 adds the capability to use the I/O to interface up to 16 differential analog inputs.
One of the differential pairs (JX1_LVDS_2) in Bank 34 is shared with PUDC_B.
PL
Bank 13 pins Bank 13 8 Bank 13 pins Bank 13 7
PS
Zynq Bank 500 8
TDI_0 Zynq Bank 0 MIO[0,9-15]
JTAG
PWR_Enable Carrier 1
Vin Carrier 4
GND Carrier 23
VCCO_34 Carrier 3
VBATT Carrier 1
TOTAL 100
14 8-December-2014
Table 8 – Micro Header JX3 Pin-out
Micro Header #3 (JX3)
Signal Name Source Pins
PL
MGTREFCLK_P/N[1:0]
MGT
VCCO_13 Carrier 2
GND Carrier 25
USB_VBUS_OTG Carrier 1
Total 100
15 8-December-2014
N/A GND 51 52 GND N/A
Bank 35, D1 JX1_LVDS_14_P 53 54 JX1_LVDS_15_P Bank 35, A2
Bank 35, C1 JX1_LVDS_14_N 55 56 JX1_LVDS_15_N Bank 35, A1
N/A VIN 57 58 VIN N/A
N/A VIN 59 60 VIN N/A
Bank 35, E2 JX1_LVDS_16_P 61 62 JX1_LVDS_17_P Bank 35, D7
Bank 35, D2 JX1_LVDS_16_N 63 64 JX1_LVDS_17_N Bank 35, D6
N/A GND 65 66 GND N/A
Bank 35, F7 JX1_LVDS_18_P 67 68 JX1_LVDS_19_P Bank 35, A5
Bank 35,E7 JX1_LVDS_18_N 69 70 JX1_LVDS_19_N Bank 35, A4
N/A GND 71 72 GND N/A
Bank 35, G8 JX1_LVDS_20_P 73 74 JX1_LVDS_21_P Bank 35, A7
Bank 35, G7 JX1_LVDS_20_N 75 76 JX1_LVDS_21_N Bank 35, A6
N/A GND 77 78 VCCO_34 N/A
N/A VCCO_34 79 80 VCCO_34 N/A
Bank 35, B7 JX1_LVDS_22_P 81 82 JX1_LVDS_23_P Bank 35, C8
Bank 35, B6 JX1_LVDS_22_N 83 84 JX1_LVDS_23_N Bank 35, B8
N/A GND 85 86 GND N/A
Bank 13, AA14 BANK13_LVDS_0_P 87 88 BANK13_LVDS_1_P Bank 13, Y14
Bank 13, AA15 BANK13_LVDS_0_N 89 90 BANK13_LVDS_1_N Bank 13, Y15
Bank 13, U19 BANK13_LVDS_2_P 91 92 BANK13_LVDS_3_P Bank 13, V18
Bank 13, V19 BANK13_LVDS_2_N 93 94 BANK13_LVDS_3_N Bank 13, W18
N/A GND 95 96 GND N/A
Bank 0, L12 VP_0_P 97 98 DXP_0_P Bank 0, N12
Bank 0, M11 VN_0_N 99 100 DXN_0_N Bank 0, N11
16 8-December-2014
N/A GND 51 52 GND N/A
Bank 34, T2 JX2_LVDS_12_P 53 54 JX2_LVDS_13_P Bank 34, U2
Bank 34, T1 JX2_LVDS_12_N 55 56 JX2_LVDS_13_N Bank 34, U1
N/A VIN 57 58 VIN N/A
N/A VIN 59 60 VIN N/A
Bank 34, R3 JX2_LVDS_14_P 61 62 JX2_LVDS_15_P Bank 34, L6
Bank 34, R2 JX2_LVDS_14_N 63 64 JX2_LVDS_15_N Bank 34, M6
N/A GND 65 66 GND N/A
Bank 34, J5 JX2_LVDS_16_P 67 68 JX2_LVDS_17_P Bank 34, R5
Bank 34, K5 JX2_LVDS_16_N 69 70 JX2_LVDS_17_N Bank 34, R4
N/A GND 71 72 GND N/A
Bank 34, J7 JX2_LVDS_18_P 73 74 JX2_LVDS_19_P Bank 34, P6
Bank 34, J6 JX2_LVDS_18_N 75 76 JX2_LVDS_19_N Bank 34, P5
N/A GND 77 78 VCCO_35 N/A
N/A VCCO_35 79 80 VCCO_35 N/A
Bank 34, J8 JX2_LVDS_20_P 81 82 JX2_LVDS_21_P Bank 34,N6
Bank 34, K8 JX2_LVDS_20_N 83 84 JX2_LVDS_21_N Bank 34,N5
N/A GND 85 86 GND N/A
Bank 34, M8 JX2_LVDS_22_P 87 88 JX2_LVDS_23_P Bank 34, N8
Bank 34, M7 JX2_LVDS_22_N 89 90 JX2_LVDS_23_N Bank 34, P8
N/A GND 91 92 GND N/A
Bank 13, AB21 BANK13_LVDS_4_P 93 94 BANK13_LVDS_5_P Bank 13, AB18
Bank 13, AB22 BANK13_LVDS_4_N 95 96 BANK13_LVDS_5_N Bank 13, AB19
Bank 13, AA19 BANK13_LVDS_6_P 97 98 VCCO_13 N/A
Bank 13, AA20 BANK13_LVDS_6_N 99 100 BANK13_SE_0 Bank 13, T16
17 8-December-2014
N/A VCCO_13 45 46 VCCO_13 N/A
N/A ETH_PHY_LED0 47 48 EETH_PHY_LED1 N/A
N/A GND 49 50 GND N/A
N/A ETH_MD1_P 51 52 ETH_MD2_P N/A
N/A ETH_MD1_N 53 54 ETH_MD2_N N/A
N/A GND 55 56 GND N/A
N/A ETH_MD3_P 57 58 ETH_MD4_P N/A
N/A ETH_MD3_N 59 60 ETH_MD4_N N/A
N/A GND 61 62 GND N/A
N/A USB_ID 63 64 PS_MIO51 Bank 501, C13
N/A GND 65 66 PS_MIO50 Bank 501, D10
N/A USB_OTG_P 67 68 USB_VBUS_OTG N/A
N/A USB_OTG_N 69 70 USB_OTG_CPEN N/A
N/A GND 71 72 GND N/A
Bank 13, Y18 BANK13_LVDS_7_P 73 74 BANK13_LVDS_8_P Bank 13, AA16
Bank 13, Y19 BANK13_LVDS_7_N 75 76 BANK13_LVDS_8_N Bank 13, AA17
N/A GND 77 78 GND N/A
Bank 13, AA11 BANK13_LVDS_9_P 79 80 BANK13_LVDS_10_P Bank 13, Y12
Bank 13, AB11 BANK13_LVDS_9_N 81 82 BANK13_LVDS_10_N Bank 13, Y13
N/A GND 83 84 GND N/A
Bank 13, V11 BANK13_LVDS_11_P 85 86 BANK13_LVDS_12_P Bank 13, V13
Bank 13, W11 BANK13_LVDS_11_N 87 88 BANK13_LVDS_12_N Bank 13, V14
N/A GND 89 90 GND N/A
Bank 13, W12 BANK13_LVDS_13_P 91 92 BANK13_LVDS_14_P Bank 13, R17
Bank 13, W13 BANK13_LVDS_13_N 93 94 BANK13_LVDS_14_N Bank 13, T17
N/A GND 95 96 GND N/A
Bank 13, V15 BANK13_LVDS_15_P 97 98 BANK13_LVDS_16_P Bank 13, V16
Bank 13, W15 BANK13_LVDS_15_N 99 100 BANK13_LVDS_16_N Bank 13, W16
The XC7Z015-1CLG484 is enabled with GTP transceivers which are capable of a transceiver
data rate up to 3.75Gb/s. Speed grade devices of -2 or -3 are capable of data transceiver rates
up to 6.25Gb/s.
The Xilinx XC7Z030-1SBG485 is enabled with GTX transceivers which are capable of a
transceiver data rate up to 6.6Gb/s. Speed grade devices of -2 or -3 are also capable of data
transceiver rates up to 6.6Gb/s in the SB package.
Two differential MGT reference clock inputs are available for use with the GTP/GTX lanes. Either
clock input can be used as the clock reference for any one or more of the GT lanes in bank 112.
This allows the user to implement various protocols requiring different line rates.
Gigabit transceiver lanes and their associated reference clocks are connected to the carrier board
via the JX3 Micro Header. The table below shows the connections between the Zynq device and
the JX Micro Header.
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Table 12 – MGT Pin Assignments
GTP/GTX Net Name Zynq Pin JX3 Pin
MGTTX0_P AA3 JX3.13
MGTTX0_N AB3 JX3.15
MGT0
MGTRX0_P AA7 JX3.8
MGTRX0_N AB7 JX3.10
MGTTX1_P W4 JX3.19
MGTTX1_N Y4 JX3.21
MGT1
MGTRX1_P W8 JX3.14
MGTRX1_N Y8 JX3.16
MGTTX2_P AA5 JX3.25
MGTTX2_N AB5 JX3.27
MGT2
MGTRX2_P AA9 JX3.20
MGTRX2_N AB9 JX3.22
MGTTX3_P W2 JX3.31
MGTTX3_N Y2 JX3.33
MGT3
MGTRX3_P W6 JX3.26
MGTRX3_N Y6 JX3.28
MGTREFCLK0_P U9 JX3.1
MGT_REFCLK0
MGTREFCLK0_N V9 JX3.3
MGTREFCLK1_P U5 JX3.2
MGT_REFCLK1
MGTREFCLK1_N V5 JX3.4
Note: SD Card and JTAG interfaces should be implemented on the end user carrier card.
Zynq has Voltage Mode pins, which are fixed on PicoZed 7015/7030
The boot mode pins are shared with MIO[8:2]. The usage of these mode pins can be and are
used as follows:
MIO[2] / Boot_Mode[3]
o sets the JTAG mode
MIO[5:3] / Boot_Mode[2:0]
o select the boot mode
o Boot_Mode[1] is fixed since it is only required for NOR boot, which is not
supported on PicoZed 7015/7030
MIO[6] / Boot_Mode[4]
o enables the internal PLL
o fixed to ‘enabled’ on PicoZed 7015/7030
MIO[8:7] / Vmode[1:0]
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o configures the I/O bank voltages
o fixed on PicoZed 7015/7030
o MIO Bank 0 / 500 (MIO[7] / Vmode[0]) set to ‘0’ for 3.3V
o MIO Bank 1 / 501 (MIO[8] / Vmode[1]) set to ‘1’ for 1.8V
All mode pins are pulled either high or low through a 20 KΩ resistor that is either hard wired or
connected to a switch or resistor jumper. By default, four mode signals are not jumper-adjustable
and are populated as follows:
The other three mode signals, MIO[2], MIO[4] and MIO[5], are configurable via a jumper resistor
or switch setting.
MIO[2] is pulled either high or low via a 0 ohm resistor jumper JT4. Default setting from the
factory it is pulled low (position 1-2) and puts the Zynq in Cascade JTAG mode.
MIO[5:4] is pulled high or low via a two channel dip switch SW1. Setting the switch positions will
determine whether the Zynq boots from QSPI or from the microSD card.
The table below shows the available boot mode configuration setting using JT4 and SW1.
Zynq has many other configuration options, PicoZed 7015/7030 uses this configuration:
VCCO_0 is tied to 3.3V on PicoZed 7015/7030.
PUDC_B can be pulled high or low on PicoZed 7015/7030 via a resistor (JT2). This
active-low input enables internal pull-ups during configuration on all SelectIO pins. By
default, JT2 is populated with a 1K resistor in the 1-2 position, which pulls down PUDC_B
and enables the pull-ups during configuration. PUDC_B is shared with Bank 34 I/O
IO_L3P and is connected to the Micro Header.
Init_B is pulled high via a 4.7KΩ resistor (RP2.2), but also connected to the Micro
Header.
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Program_B is pulled high via a 4.7KΩ resistor (RP2.4).
CFGBVS is pulled high via a 4.7KΩ resistor (RP2.1).
The PS is responsible for reconfiguring the PL. Zynq will not automatically reconfigure the PL as
in standard FPGAs by toggling PROG. Likewise, it is not possible to hold off Zynq boot up with
INIT_B as this is now done with POR. If the application needs to reconfigure the PL, the software
design must do this, or you can toggle POR to restart everything. When PL configuration is
complete and the end user is using the Avnet PicoZed FMC Carrier Card, a blue LED will
illuminate.
The Zynq Bank 0 reference voltage, Vcco_0, is connected to 3.3V. The JTAG Vref on the End
User Carrier Card should be connected to 3.3V to ensure compatibility between the interfaces.
For reference, see the PicoZed FMC Carrier Card schematics.
Four regulators reside on the PicoZed 7015/7030 SOM that provide 1.0V, 1.35V, 1.8V, 3.3V and
0.75V. These voltages are used to power the peripheral devices on the PicoZed System-On-
Module. These regulators are powered from the end user carrier card via the VIN pins on the
Micro Headers and are expected to carry 5V to the PicoZed System-On-Module for the input to
the regulators.
There are there also three bank voltages that are supplied form the carrier card to the PicoZed
System-On-Module. Bank 34 (VCCO_34), Bank 35 (VCCO_35) and Bank 13 (VCCO_13) are
generated on the carrier card and connected to the 7015/7030 System-On-Module via the Micro
Headers. The voltage at which these banks operate is up to the carrier card design as all I/O that
connect to these banks is exclusive to the Micro Headers (no on-board device is connected to
these banks).
Additionally, two of the voltages for the gigabit transceivers are also supplied from the carrier
card: MGTAVCC (1.0V) and MGTAVTT (1.2V). The MGT rails are filtered with 220 ohm
inductors prior to connecting to the MGTAVTT and MGTAVCC power pins to reduce noise
coupling into the transceivers.
The diagram below shows a high level depiction of the power scheme for PicoZed 7015/7030
System-On-Module.
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Figure 4 - PicoZed 7015/7030 Power Scheme
The table below shows the various voltage rail names on the schematic, the associated voltage
for each rail and where they are connected on the Zynq 7015/7030, and where the voltage
originates from.
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2.11.2 Voltage Regulators
The following power solution provides the power rails of the PicoZed 7015/7030. Sequencing of
the supplies is implemented by cascading the POWER GOOD outputs of each supply to the
ENABLE input for the next supply in the sequence. 3.3V is the last supply to come up, therefore
the PG for the 3.3V supply is used to drive the PG_MODULE net and is used as the power-on
reset control for Zynq (U1.pin B18), Ethernet PHY (U5.pin 16), and USB-Host PHY (U7.pin 27).
This net is also connected to the Micro Headers so power supplies on the carrier card can also
control this signal.
VIN
PG PG PG 3.3V
EN EN EN EN
PWR_Enable
(from carrier)
1.0V 1.8V DDR3L 3.3V
TPS51206
VTT/VREF PS_POR_B
&
PG_Module
VCCIO_EN
This circuit sequences power-up of PicoZed 7015/7030. 1.0V comes up first, then 1.8V, then
VCCO_DDR3 and then 3.3V. PG_MODULE is connected to PS_POR_B on Zynq, thus when the
power supplies are valid, PS_POR_B is released.
When the PicoZed 7015/7030 is mated to a carrier card, the power good outputs of the carrier
card should also be tied to the PG_MODULE net on JX1.pin 8. If the carrier card power supplies
do not have power good outputs, a voltage supervisor or open-drain buffer should be used to
complement this circuit.
PicoZed 7015/7030 also provides an Enable signal to the carrier card to signal that Vccint and
Vccaux are both up and the carrier card is free to bring up the Vcco supplies. This signal is called
VCCIO_EN (PG_1V8) and is tied to JX2.pin 10.
NOTE: VCCIO_EN is provided by the power good output of the 1.8V regulator.
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The table below shows the maximum output current for each regulator on the PicoZed 7015/7030
SOM.
TPS54618 1.0 6
TLV62130 1.8 3
TLV62130 3
1.35
TLV62130
3.3 3
TPS51206
0.675 2
Sequencing for the power supplies follows the recommendations for the Zynq device. PS and PL
INT and AUX supplies are tied together on the PicoZed 7015/7030 platform to create a low cost
design. The following diagram illustrates the supply sequencing:
5V
1V Vccint
1.8V XADC
1.8V Vccaux
3.3V Vcco
1.5V Vccoddr
0.75V Vtt
VCCIO**
As noted above, if connected to a carrier card, the 1.8V power supply’s power good output should
be used to enable the VCCIO regulators via the PG_1V8 (VCCIO_EN) signal on the Micro
Headers.
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The following diagram illustrates sequencing with a carrier card:
2.11.4 Bypassing/Decoupling
The PicoZed 7015/7030 design follows the PCB decoupling strategy as outlined in UG933. The
7015 version comes in a CLG485 package and the 7030 a SBG485 package. Since the two
packages have varying requirements for the number of some of the decoupling capacitors, the
PicoZed 7015/7030 was designed to have the minimum number of required capacitors for either
package.
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Figure 9 - CLG4485/SBG485 PS Decoupling
http://www.xilinx.com/products/design_tools/logic_design/xpe.htm
When designing the PicoZed 7015/7030 power system, this tool was used to insure that the SOM
system could supply enough power to the Zynq and its on-board peripherals using worst case
parameters including logic utilization, operating frequency and temperature.
Since the power supply for the VCCIO rails for banks 34, 35, 13 and the MGT Bank 112 are
supplied from the carrier card, it is important to make sure the carrier card power supplies are
adequate to power these rails over the desired and/or estimated operating scenario.
NOTE: When designing a custom PicoZed Carrier Board, be sure to use XPE (Xilinx Power
Estimator) to estimate the power needed by the FPGA. The designer will need this figure in
sizing the input supply to the SOM. In addition to the XPE results for the core power supplies,
Vccint/Vccpint (1V) and Vccaux/Vccpaux/Vccpll (1.8V), you will need to add an additional 3.0W to
your power estimate to compensate for the additional power that is needed for the peripherals on
the PicoZed System-On-Modules such as memory and USB and Ethernet PHY devices.
26 8-December-2014
2.11.7 XADC Power Configuration
The XADC component is powered from the filtered 1.8V VCCaux supply utilizing the on-chip
reference as shown below.
As specified in the Zynq TRM, if the battery is not used, connect VCCBATT to either ground or
VCCAUX. On PicoZed, VCCBATT is connected to net FPGA_VBATT and is tied through a 0 Ω resistor
(R51) to the PicoZed VCCAUX supply, which is 1.8V. However, FPGA_VBATT is also extended to
the carrier card. To apply an external battery to Zynq from the end user carrier card, remove R51
from the PicoZed System-On-Module.
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3 Zynq-7000 AP SoC I/O Bank Allocation
3.1 PS MIO Allocation
There are 54 I/O available in the PS MIO. The table below lists the number of required I/O per
peripheral and the MIO locations where the interface exists.
TOTAL 54
The Micro Header GPIO assignments aren’t specifically defined interfaces such as those that are
defined in Table 17. The table below provides the MIO locations of the PS MIO general purpose
pins and the functions that they are intended to support. The end user is encouraged to utilize the
Zynq TRM in defining the MIO peripheral mappings that they would like to utilize on a custom
PicoZed carrier card.
0, 9 3.3V PS GPIO
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3.2 Zynq-7000 AP SoC Bank Voltages
The I/O bank voltage assignments are shown in the table below.
DDR3L 1.35V
PL-Side
Bank0 3.3V
NOTE: If using a PicoZed 7030 Bank 34 and Bank 35 voltage MUST BE 1.8V ONLY!!!
PL I/O Banks 34, 35, and 13 are powered from the end user carrier card. These bank supplies
are designed to be independent on the PicoZed 7010/7020. Maximum flexibility is allowed to the
designer for these banks as the voltage level and standards are left to the end user carrier card
design. The designer of the end user carrier card VCCO supplies is provided the choice of
whether the IO banks use a shared voltage supply or independent voltage supplies.
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4 Mechanical
PicoZed 7015/7030 measures 2.25” x 4.00” (57.15 mm x 101.6 mm)
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PicoZed 7015/7030 has a maximum vertical dimension of 0.366” (9.3mm).
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5 Revision History
Rev date Rev # Reason for change
16 Oct 14 1.0 Initial PicoZed 7015/7030 Hardware User Guide
12/3/14 1.1 Updated Tables 9, 10, 11. Updated for DDR3L (text, tables, figures)
32 8-December-2014