EMCH 362 Mechanical Engineering Laboratory II

Thermal conductivity of two materials

Alexis Steenberg, 004
Course Instructor: Dr. Subramani Sockalingam
Lab TA: Saad Oudah, and ASM Fakhrul Islam

Date of the experiment - Spring 2020

Lab location: 300 Main, A232

Department of Mechanical Engineering
University of South Carolina

ABSTRACT

Overall, we were asked to study the thermal conductivity of engineering materials by using an

Armfield Linear conduction Apparatus for the brass sample and using a C-Therm for PLA. For

the brass sample, there was eight thermocouples between the heat source and heat sink and that

was connected to the DAQ (data acquisition). We measured the distance between the

thermocouples and once the reading of the thermocouples reached steady state, the data was

recorded, and we determined the thermal conductivity of the sample. From this data, I found that

the thermocouples reached steady state conditions a little after 1000 seconds and each

thermocouple equaled out at different temperatures. The thermal conductivity of brass is found to

be 96.870 W/m*(°C). For the PLA sample, a C-Therm is used with TCi software. We

determined the thermal conductivity of this and collected five values for non-metals. From this

data, table 3 shows the five k values, and I concluded that as time increased as well as effusivity,

thermal conductivity ranged between 0.788 to 0.799.

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1. OBJECTIVES OF THE EXPERIMENT

1.1 Overall objective:

To study the thermal conductivity of engineering materials.

1.2 Specific objectives:

To determine the thermal conductivity of Brass using Armfield li conduction apparatus and to

determine the thermal conductivity of PLA using C-Therm.

1.3 Hypothesis:

As temperature increases, the randomness of molecular movements increases. This obstructs

transport of heat through liquids; thus the thermal conductivity of liquids decreases with increase

in temperature.

1.4 Purpose of this experiment:

The purpose of this experiment is to find thermal conductivity of a metal (brass) material using

Armfield linear conduction apparatus, and to find thermal conductivity of PLA using a C-Therm.

This can be related to the real world because thermal conductivity of a material is a measure of

its ability to conduct heat. Knowing which type of material is best, for example construction and

textile industries, is key characteristic because if you choose the wrong material it could result in

bad after effects.

2. EXPERIMENTAL DESIGN PROCEDURE

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2.1 Approach

In this experiment we try to use a low heat conduction to calculate thermal conductivity using

Fourier’s Law. First, we use the Armfield apparatus (figure 2) to connect the power source, then

connect the heat source and heat sink. Some thermal grease is added to higher the thermal

conductivity. We have eight thermocouples type K that need to be measured including: distance,

thickness (about 30 mm). Then we add some cooling water from the sink, which is connected by

a hose that goes into the heat sink and comes out at an ambient temperature. Then apply 11 volts

and we get 1.07 Amps. When the experiment is running, you can see temperature gradually

increases until it is at steady state, which takes about 25-30 min. Heat loss is assumed zero

because of the insulation. We then find Thot and Tcold.

For the C-Therm, we get Diffusivity, density, and heat capacity through this software. We get the

results easier and faster, however the results are not as accurate as the Armfield Apparatus. First,

turn on the C-Therm, place the non-metal specimen in-between the plates. Hit new test, select

thermal lab, then hit next, then polymers, then thermal lab, hit next and change contact agent.

Place some water on material. Data then appears and use this data to do our calculations.

2.2 Independent (cause – x) and dependent (effect – y) variables:

We are measuring thermal conductivity. The independent variable is temperature and the

dependent variable is the k value (thermal conductivity).

2.3 Instrumentation required:

One instrument used in the lab is the C-Therm T-Ci (figure 3). It helps to measure thermal

conductivity and effusivity in solids, fluids, powders, and paste. It employs a one-sided,

interfacial heat reflectance sensor that applies a momentary constant heat source to the sample

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(measurement pulse is between 1-3 seconds). We use the C-Ti to measure the thermal

conductivity of PLA based on thermal effusivity. This instrument gives fast and easier results;

however, it is not as accurate as the Armfield Apparatus (figure 2). The Armfield Apparatus

(figure 2) is a service unit, which can be used in conjunction with a range of small-scale

accessories for a wide range of demonstrations into the modes of heat transfer. A specific feature

of this is that it incorporates the facilities and safety features to allow the accessories to be

remotely controlled from an external computer. There are many features, one specifically is the

computer control of heaters, water flow, air flow, with safety functions implemented to allow for

remote operation. The Vernier Calipers (figure 1) allow for precise measurements to the

millimeter to find the dimensions of the specimen wee are looking at. It has a digital reading for

precise measurements. Lastly, the power supply (HT 10 XC power supply) (figure 4). Two

major characteristics are efficiency and performance over its specified temperature range, which

may require cooling. Also, there are important characteristics that protect the power supply and

its load from damage, such as overcurrent, overtemperature, and overvoltage, etc.

Figure 1: Vernier Calipers.

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Figure 2: Armfield Apparatus

Figure 3: C-Therm

Figure 4: HT 10 XC power supply

Table 1. Instrumentation specifications

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 Instrument Accuracy Range
Vernier Calipers 1/1000” Precision 0-12”
HT 10 XC power supply
C-Therm (TCi-3-A) 5% 0-50°C
Armfield Apparatus

2.4 How was the experiment conducted?

Basically, we used an Armfield Apparatus to collect data for thermal conductivity of brass. For

the data, 11 Volts was applied, and 1.07 Amps was applied as well. When the experiment was

conducted, it took roughly 25-30 minutes for temperature to gradually increase until it reached

steady state. We then used this data to make a graph, shown in figure 5. For the PLA sample, a

C-Therm was used to further describe in principle by measuring the change in temperature of an

MTPS (Modified Transient Plane Source). This was used to determine the second thermal

conductivity value for the 3D printed Polylactic Acid sample. We then collected five values for

each material using the C-Therm computer software shown in table 3.

3. RESULTS AND DISCUSSION

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 Temperature of thermocouples Temperature vsersus Time
50
45
40
35
30
25
20
15
10
5
0
0 500 1000 1500 2000 2500
Time (seconds)

Figure 5: Temperature of thermocouple versus time at the steady state conditions.

3.1 Calculations:

Table 1:

Heat Flow (Power to heater) Q=VI (Watts)

Cross sectional area of sample π 2 4.909E-04 m2
A=
4()
D
Heated section high Temperature T1 43.32 (°C)
Heated section mid Temperature T2 40 (°C)
Heated section low Temperature T3 37 (°C)
Intermediate section high Temp. T4 34 (°C)
Intermediate section low Temp. T5 31 (°C)
Cooled section high Temp. T6 28 (°C)
Cooled section mid Temp. T7 25 (°C)
Cooled section low Temp. T8 22 (°C)

From Table 1, linear interpolation between T3 and T4 is necessary to find Thot surface. This value

came out to be 36.65 (°C). Also, linear interpolation is used between T4 and T5 to find Tcold surface.

This value came out to be 29.19 (°C).

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 Q∗∆ x
K= (eq. 1)
A∗∆ T

Where K=thermal conductivity, Q= heat content, Δ x= change in distance, A=cross sectional

area, Δ T= change in temperature.

Using eq. 1, you can fid the thermal conductivity from the Thot surface, to Tcold surface. Plugging in...

( 11.825)(0.03)
K= = 96.870 W/m*(°C)
(4.909E-04)(36.65−29.19)

Temperature versus Distance

50
43.32
45 40.4
37.3
Temperature (degrees C)

40
f(x) = 5.09 x 33.95
35 R² = 0.6 30.89
30 27.5
24.54
25 21.95
20
15
10
5
0
0 15 30 45 60 75 90 105
Position in mm

Figure 6: Temperature versus distance. (Legend broken down: first data point (43.32) is T1 and

follows all the way until T8. Slope is also defined as (ΔT/Δx).

Table 3:

Effusivity (Ws1/2m2K) K (W/mK( Time started

1138.9 0.788 13:13

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 1142.6 0.792 13:14
1144.8 0.795 13:15
1148.5 0.799 13:16
1145.1 0.795 13:17

3.2 Data Analysis and Estimated Uncertainties: Uncertainties in measurements related to the

instrumentation accuracy and range. Uncertainties in results. Statistical analysis, if applicable.

3.3 Validity of Experiment: Is the experiment valid? Explain.

4. CONCLUSIONS

4.1 What was done:

This lab studied thermal conductivity of two different materials using two different instruments

(Armfield Apparatus and a C-Therm).

4.2 Qualitative conclusions:

Looking at figure 5, the graph allows me to see how all eight thermocouples went to a steady

state condition and each thermocouple sits at a different temperature. Also from figure 6, as

temperature decreases, position increases in a linear formation.

4.3 Quantitative conclusions:

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4.4 Recommendations and Improvements for the lab:

5. APPENDIX

Temperature vsersus Time

Temperature of thermocouples

50
40
30
20
10
0
0 500 1000 1500 2000 2500
Time (seconds)

The rest of the graph from temperature of thermocouples vs. Time.

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