Lecture 4 Piezoresistive Sensors
Lecture 4 Piezoresistive Sensors
Lecture 4 Piezoresistive Sensors
Piezoresistive Sensors
• Piezoresistive sensors are based on piezoresistive effect of
monocrystalline silicon and are made up by using an integrated
circuit technique.
• It only causes a change in resistance and does not produce an electric potential.
Δρ/ρ=Π⋅σ (3.3)
where Π is the piezoresistivity coefficient
Piezoresistive Effect
• The sensitivity of piezoresistive devices is
characterized by the gage factor:
K=(ΔR/R)/ε (3.4)
• where ΔR is the change in resistance due to
deformation, R is the undeformed resistance and
ε is the strain
Piezoresistive Effect
• The resistance of silicon changes is affected not only by the stress dependent change of geometry, but also
by the stress dependent resistivity of the material.
• The latter is the dominant factor, which results in sensitivity to orders of magnitudes larger than those
observed in metals.
• This effect is present in materials like germanium, polycrystalline silicon, amorphous silicon, silicon
carbide, and single crystal silicon, which are among the several types of semiconductor materials.
• Since Silicon is today the material of choice for integrated digital and analog circuits, the use of
piezoresistive silicon devices has been of great interest.
• Many commercial devices such as pressure sensors and acceleration sensors employ the piezoresistive
effect in silicon.
• Usually the resistance change in metals is mostly due to the change of geometry resulting from applied
mechanical stress (as in case of strain resistive sensors). However, even though the piezoresistive effect is
small in those cases it is often not negligible
Measurement
• The measuring circuits for piezoresistive sensors are similar to strain
sensor measurement
• Besides, resistor RTZ works against the change of offset with temperature.
Fig. 3.8. Interaction of the three compensation mechanisms in a conventional resistive
compensation circuit (RTS for sensitivity drift, RTZ for offset drift, and zero trim resistors)
Measurement
• But biomedical detection needs better precision.
• The sensing array of the cochlear microsystem consists of the electrode array, flip-chip
bonded to a signal-processing chip.
• As shown in Fig. 3.11b, the position sensors with each formed using two strain-sensing
resistors in a half-bridge configuration are implemented underneath electrode sites using
piezoresistive polysilicon strain gages and extra passivating dielectrics (Kensall et al., 2008).
• Polysilicon wall-contact and strain gages are buried under IrO sites distributed along the
shank
Biomedical Applications
• A microprocessor gives instructions to the circuit chip
to select the addressed sensor, and the addressed
sensor bridge is connected to the positive input of an
instrumentation amplifier (Wang et al., 2005), which is
referenced to a voltage generated by the DAC (Fig.
3.11c).