Public Roadmap

Desktop, Mobile & Data Center

1H’ 2010

1
 Public Roadmap
Desktop Platform
1H’ 2010

2
Desktop Processor: Roadmap
Consumer Platforms 2H’09
Q3’09 Q4’09
Intel® Core™ i7 Processor Extreme Edition
Codename: Tylersburg DT platform

Intel® X58 Express Chipset

- 2x16 or 4x8 graphics
Extreme
Intel® Core™ i7 Processor
Codename: Tylersburg DT platform
Intel® X58 Express Chipset
- 2x16 or 4x8 graphics

Intel® Core™2 Quad Proc.

Q9xxx &Q8xxx series
Codename: Boulder Creek platform
Intel® G45 & P45 Express Chipsets
Best
Intel® Core™2 Duo Processor
E8xxx & E7xxx series
Codename: Boulder Creek platform

Intel® G45, G43, & P43 Express Chipsets

Better

Intel® Pentium® & Celeron® Proc.

Intel® G41 Express Chipset
Intel® G31/P31 Express Chipsets
Good
Desktop Processor: Roadmap
Consumer Platforms 1H’10
Q1’10 Q2 ’10
Intel® Core™ i7-975 Extreme Edition
Intel® Turbo Boost Technology
Intel® X58 Express Chipset
Extreme - 2x16 or 4x8 graphics
Intel® Core™ i7 Processor
Intel® Core™ i7-900 series & Core™ i7-800 series
Intel® Turbo Boost Technology

Intel® H57, H55, P55 Express Chipsets

Best

Intel® Core™ i5 Processor

Intel ® Core™ i5-700 series and Core™ i5-600 series

Intel® Turbo Boost Technology

Better Intel® H57, H55, P55 Express Chipsets

Intel® Core™ i3 Processor

Intel® Core™ i3-500 series

Good Intel® H57, H55, P55 Express Chipsets

Intel® Pentium® Proc.

G6950, E6000 series, and E5000 series
Intel® H55 Express Chipset1
Value Intel® G41 Express Chipsets
1. Intel H55 chipset compatible with Clarkdale based Intel® Pentium® Processor

4
 Desktop Platform: Roadmap
Business Platforms 2H’09
Q3’09 Q4’09
Intel® SIPP Deploy 2008/2009 Platform**

Intel® vPro Tech. for 2009

Intel® Core™2 Quad & Duo proc. Q9000,E8000 series2
Intel® Q45 Express Chipset w/ICH10DO, Intel® TPM

Business Security:
Prior generation Intel® vPro™ technology Plus:Microsoft NAP,
Access Monitor

Best Proactive IT Care:

Prior generation Intel® vPro™ Technology plus: Fast Call for Help,
Remote Schedule Maintenance, Remote Alerts, DASH, Intel®
Remote PC Assist Technology.

Intel® Core™2 Duo Proc. E8000 series

Intel® Q43 Express Chipset w/ICH10D, Intel® TPM
Intel® Standard Manageability
Intel® SIPP
Better

Upgradeable Intel® Pentium® processor1

Intel® B43 Express Chipset w/ICH10D
- Manageability Upgrade Available
Intel® G41 Express Chipset
Intel® G31 Express Chipset
Good
* Qualification window begins at platform launch and continues for 3 months.
** Deployment begins at the end of the Qualification window and continues for 12 months.
1 Intel® Pentium® dual-core proc not SIPP eligible.
2. Check the feature set reference table for vPro and SIPP CPU details.
3. Intel Std. Manageability and Intel AMT support WS-MAN and DASH

5
 Business Desktop Platforms: Roadmap
Business Platforms 1H’10
Workstations
Q1 ’10 Q2’10
Business
Platform Intel® SIPP Qual/Deploy 2010 Platform**

Intel® vPro Tech. for 2010

Best Intel® Core™: i7-800 series and i5-600 series1
Intel® vProTM Intel® Q57 Express Chipset
Technology
Intel® SIPP

Intel® Core™2 Duo Processors E8000 series

Intel® Q43 Express Chipset w/ICH10D
Intel® Standard Manageability
Better
Intel® SIPP

Intel® Core™2 Duo Processors E7000 series2 Intel® Core™ i3-500 series2
Intel® B55 Express Chipset
Intel®B43 Express Chipset with ICH10D
Manageability upgrade available
Good Manageability upgrade available
Upgradeable

Value Intel® Pentium® processor2

Intel® G41 Express Chipsets

** Qualification window begins at platform launch and continues for 3 months. Deployment begins at the end of the Qualification window and continues for 12 months.
1. Check the feature set reference table for vPro and SIPP CPU details.
2. Intel® CoreTM 2 Duo E7000 series, Intel® CoreTM i3-500 series, and Intel® Pentium® dual-core proc not SIPP eligible.
PC Boards as shipped must provide hardware support of Intel® Active Management Technology to enable this upgrade later.
6
 Public Roadmap
Intel® Mobile Platform
1H’10

7
Consumer Mobile Notebook Platforms: 1H’10 Roadmap
Standard Voltage, Power-Optimized, Low Voltage and Ultra Low-Voltage

2H’09 1H’10
‘Montevina’ / ‘Montevina Plus’ Calpella
Intel® Core™2 Extreme Intel® Core™ i7 Extreme Edition
Extreme
QX9300, X9100 featuring Intel® Turbo Boost Technology: i7-920XM

‘Montevina’ / ‘Montevina Plus’ Calpella

Intel® Centrino® 2 processor technology Intel® Core™ i7 featuring Intel® Turbo Boost Technology:
Featuring Intel® Core™2 Quad Q9100, Q9000 i7-820QM, i7-720QM processores
Featuring Intel® Core™2 Duo T9900 Intel® Core™ i7 with Intel® Turbo Boost Technology
featuring Intel® HD Graphics with dynamic frequency:
T9800, P9700 T9600, T9550, P8800, i7-620M, i7-620LM, i7-640LM, i7-640UM, i7-620UM
Perfor- T9400, P9600, P9500, P8700,
Intel® Core™ i5 with Intel® Turbo Boost Technology
P8600, P8400
mance featuring Intel® HD Graphics with dynamic frequency:
Intel® Core™2 Duo Small Form Factor processors: i5-540M, i5-520M, i5-430M, i5-520UM
SP9600, SP9400, SP9300, SL9600, SL9400, SL9300 Intel® Core™ i3 featuring Intel® HD Graphics with
SU9400, SU9300, SU9600, SU7300, SU3500*, SU3300* dynamic frequency: i3-350M, i3-330M

Mobile Intel® GM45, PM45 Express chipsets Mobile Intel® PM55 Express Chipset
with ICH9M or with ICH9M-Enhanced Intel® WiFi Link 5300; Intel® 82577LC Gigabit Network Connection
Mobile Intel® GS45 Express Chipset Mobile Intel® HM57, HM55 Express Chipsets
with ICH9M-SFF-Enhanced
Intel® Centrino® Advanced-N/WiMAX 6250
Intel® WiMAX/WiFi Link 6250, 5050 Series Intel® Centrino® Ultimate-N + Advanced-N 6000 Series
Intel® WiFi Link 5000 Series Intel® 82577LC Gigabit Network Connection
Intel® 82567LF Gigabit Network Connection Featuring Intel® Wireless Display

‘Montevina’ / ‘Montevina Plus’

Entry Intel® Celeron® processors Intel® Celeron® processors
T3100, T3000, 900, SU2300, 723 T3300
Mobile Intel® GM45, GL40 Express chipsets with ICH9M
Mobile Intel® GS45, GS40 Express Chipset with ICH9M-SFF-Enhanced
Intel® WiFi Link 1000 (Condor Peak)

*Intel® CoreTM 2 Solo processors are eligible for Centrino® branding only

8
Business Mobile Platforms: Roadmap : 1H’10 Roadmap
Standard Voltage, Power-Optimized, Low Voltage and Ultra Low-Voltage

2H’09 1H’10
Montevina Plus Calpella
Extreme Intel® Core™2 Extreme Intel® Core™ i7 Extreme Edition featuring
QX9300, X9100 Intel® Turbo Boost Technology: i7-920XM processor

‘Montevina’ / ‘Montevina Plus’ Calpella

Intel SIPP 2008-2009 Platforms
®
Intel® SIPP 2010 platforms
Intel® Centrino® 2 with vProTM technology Intel® Core™ i7 with vProTM Technology featuring
processor technology featuring: Intel® Turbo Boost Technology: i7-820QM, i7-720QM
Intel® Core™2 Quad Q9100, Q9000 Intel® Core™ i7 and i5 processor with vProTM
Intel® Core™2 Duo T9900, T9800, P9700 Technology and Intel® Turbo Boost Technology,
T9600, T9550, P8800, T9400, P9600, P9500, P8700, featuring Intel® HD Graphics with dynamic frequency:
P8600, P8400, SP9600, SP9400,P9300,SL9600, SL9400, i7-620M, i7-620LM, i7-640LM, i7-640UM, i7-620UM
SL9300, SU9400, SU9300, SU9600, SU3500*, SU3300* i5-540M, i5-520M, i5-520UM
Best
Mobile Intel® GM45, PM45 Express chipsets Mobile Intel® PM55 HM57, HM55 Express Chipset
with ICH9M or with ICH9M-Enhanced Intel® AMT 6.0; KVM remote control, Full featured Intel® Remote PC Assist
Mobile Intel® GS45 Express Chipset with ICH9M-SFF-Enhanced Technology; Advanced Encryption Standard New Instructions7 (AES- NI)
Intel® AMT 4.X, Intel® Anti-Theft Technology (AT), Intel® Virtualization, Intel® Remote Encryption Management Technology
Technology (VT-x, VT-d), Intel® Trusted Execution Technology (TXT) Intel® Centrino® Advanced-N/WiMAX 6250
Intel® WiMAX/WiFi Link 6250, 5050 Series; Intel® Centrino® Ultimate-N + Advanced-N 6000 Series
Intel® WiFi Link 5000 Series Intel® 82577LC Gigabit Network Connection
Intel® 82567LF Gigabit Network Connection

‘Montevina’ / ‘Montevina Plus’

Intel® Centrino®2 processor technology Intel® Core™ i7 and i5 processors
Featuring Intel® Core™2 Duo processors featuring Intel® Turbo Boost Technology
Better
Mobile Intel® GM45, GL40 Express chipsets with ICH9M Mobile Intel® PM55 HM57, HM55 Express Chipset
Mobile Intel® GS45, GS40 Express Chipset
Networking: Same as above
with ICH9M-SFF-Enhanced
Networking: Intel® WiFi Link 1000 (Condor Peak) Intel® Anti-Theft Technology3 (AT)

9
Consumer Mobile Netbook Platforms: 1H’10 Roadmap

2H’09 1H’10

Netbook Platform for 2008 Pine Trail-M Platform

Intel® Atom™
Processor N470
Intel® Atom™ Intel® Atom™
Processor N270 Processor N450

Mobile Intel® 945GSE Intel® NM10

Express Chipset Express Chipset
with ICH7M Intel® Centrino® Advanced-N/WiMAX 6250
Intel® WiFi Link 1000
Intel® 82552V Gigabit Network Connection
 Intel® Data Center Group (DCG)
Public Roadmap

March 2010

11
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MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL,
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ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
• THE HARDWARE VENDOR REMAINS SOLELY RESPONSIBLE FOR THE DESIGN, SALE AND FUNCTIONALITY OF IT’S PRODUCT, INCLUDING ANY LIABILITY ARISING FROM
PRODUCT INFRINGEMENT OR PRODUCT WARRANTY.
• Intel may make changes to specifications and product descriptions at any time, without notice.
• “Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel® Turbo Boost Technology performance varies
depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost
Technology. For more information, see http://www.intel.com/technology/turboboost.”
• Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating
system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT
Technology, see here
• Intel Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and applications enabled for virtualization
technology. Functionality, performance or other virtualization technology benefits will vary depending on hardware and software configurations. Virtualization
technology-enabled BIOS and VMM applications are currently in development.
• Intel processor numbers are not a measure of performance. processor numbers differentiate features within each processor family, not across different processor
families. See www.intel.com/products/processor_number for details.
• Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
• 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64
architecture. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information.
• Intel, Intel Xeon, Intel Core micro-architecture, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and
other countries.
• Lead-free: 45nm product is manufactured on a lead-free process. Lead is below 1000 PPM per EU RoHS directive (2002/95/EC, Annex A). Some EU RoHS exemptions
for lead may apply to other components used in the product package.
• Halogen-free: Applies only to halogenated flame retardants and PVC in components. Halogens are below 900 PPM bromine and 900 PPM chlorine.
• Copyright © 2009, Intel Corporation. All rights reserved.
Risk Factors
Intel’s Roadmap Update presentations may contain
forward-looking statements and projections.

All statements and projections made that are not

historical facts are subject to a number of risks and
uncertainties, and actual results may differ
substantially.

Please refer to our recent Earnings Release and Form

10-Q for more information on the Risk Factors that
could cause actual results to differ.

13
Intel® Data Center Group (DCG) Public Roadmap

2010 Future
Boxboro-MC
Boxboro-MCPlatform
Platform
Future
Mission Intel ® Itanium® processor 9300 series Poulson processor Kittson
Critical processor
Intel® 7500 Chipset / OEM Chipset

Boxboro-EX Platform
Expandable Nehalem-EX processor (45nm) Westmere-EX processor (32nm)
Intel® 7500 Chipset

Tylersburg-EP Platform
Efficient Westmere-EP processor (32nm)
Performance Future
Intel® 5520 Chipset
Intel®
Tylersburg-EP Platform Micro-
Workstation architectur
2 socket Westmere-WS* processor (32nm) e codename
Intel® 5520 Chipset Sandy
Bridge
Tylersburg-EN Platform
Entry Westmere –EP processor (32nm)
(2 socket) Intel ®Xeon® processor 5500 series (Nehalem-EP)
Intel® 5500 Chipset

Intel® Xeon® Processor 3400 Series Platform**

Entry Intel® Xeon® processor 3400 series (Lynnfield/Clarkdale)
(1 socket)
Intel® 3400/3420 Chipset
* Westmere processor available in 2010
** Also supports Clarkdale processors

All products, computer systems, dates, and figures specified are preliminary based on
14 current expectations, and are subject to change without notice.
Mission Critical (MC) Platform Roadmap

2010 Future

Boxboro-MC Platform
Intel ® Itanium® processor Future
Poulson processor Kittson
9300 series
processor
Intel® 7500 Chipset / OEM Chipset

Technologies Technologies
Mission Quad-Core, 30MB Total On-Die Cache Advanced multi-core architecture
Intel® Hyper-Threading Technology Optimized 32nm processor core
Critical Intel® QuickPath Interconnect Hyper-Threading improvements
Dual Integrated Memory Controllers Instruction-level enhancements
PCIe Gen 2 Large on-die cache
Advanced RAS New RAS features
Enhanced Virtualization in processor & Compatible with Itanium® processor
Chipset 9300 series platforms
Common Chipset w/ Next Gen Intel®
Xeon® processor EX
8-Socket Glueless
Intel® Turbo Boost Technology
Intel® 7500 Chipset
Intel® 7500 Scalable Memory Buffer
Enhanced Demand Based Switching

All products, computer systems, dates, and figures specified are preliminary based on
15 current expectations, and are subject to change without notice.
 Expandable Server (EX) Platform Roadmap

2010 Future

Boxboro-EX Platform

Nehalem-EX processor Westmere-EX processor

(45nm) (32nm)
Intel® 7500 Chipset
Technologies
Expandable
Future Intel®
Micro-
Up to 8 cores / 16 Threads architecture
codename
24MB Shared Cache Sandy Bridge

Integrated Memory Controllers

4 High-Bandwidth QPI links
Intel® Turbo Boost
Intel® Hyper-Threading
Advanced Reliability Features

All products, computer systems, dates, and figures specified are preliminary based on
16 current expectations, and are subject to change without notice.
Efficient Performance (EP) Platform Roadmap

2010 Future

Tylersburg-EP Platform

Westmere-EP processor (32nm)

Intel® 5520 Chipset Future Intel®

Micro-
architecture
codename
Technologies Sandy Bridge
Efficient Up to 6 cores/12 Threads
Performance
Improved Energy Efficiency
Cache Enhancements Intel® Trusted Execution Technology (TXT)
Advanced Encryption Standard New Instructions (AES-NI)

All products, computer systems, dates, and figures specified are preliminary based on
17 current expectations, and are subject to change without notice.
Entry Server (EN) Platform 2009 Roadmap
2010 Future

Tylersburg-EN Platform
Westmere –EP processor (32nm)
Intel ®
Xeon® processor 5500 series (Nehalem-EP)

Intel® 5500 Chipset

Technologies
Up to 6 Core /12 Thread
Up to 12MB of cache
Intel® Trusted Execution Technology (TXT)
Entry Advanced Encryption Standard New Instructions (AES-NI)
2 socket Intel® Turbo Boost Technology, Intel® VT-x, -d, & -c Future Intel®
Micro-
architecture
codename
Intel® Xeon® Processor 3400 Series Platform* Sandy Bridge

Intel® Xeon® processor 3400 series (Lynnfield/Clarkdale)

Intel® 3400/3420 Chipset

Technologies
Up to 4 cores/Up to 8 Threads
Up to 8MB of Cache
Entry Intel® Trusted Execution Technology (TXT)
Intel® Turbo Boost Technology, Intel® Hyper-Threading Technology, Intel® VT-x, -d
1 socket

*Also supports Clarkdale processors

All products, computer systems, dates, and figures specified are preliminary based on
18 current expectations, and are subject to change without notice.
Workstation (WS) Platform Roadmap
2010 Future

Tylersburg-WS Platform

Westmere-WS* processor (32nm)

Workstation Intel® 5520 Chipset

2 socket

Tylersburg-WS Platform
Future Intel®
Westmere-WS* processor (32nm) Micro-
architecture
Intel ® Xeon® processor 3500 series (Nehalem-WS)
codename
Workstation Sandy Bridge
1 socket Intel® X58 Express Chipset

Foxhollow-WS Platform

Intel® Xeon® processor 3400 series (Lynnfield)

Clarkdale processors (32nm)

Intel® 3450 Chipset

Entry
Workstation
1 socket
* Westmere processor available in 2010

All products, computer systems, dates, and figures specified are preliminary based on
19 current expectations, and are subject to change without notice.