Switching Regulator Applications: Absolute Maximum Ratings

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2SK3561

TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π-MOSVI)

2SK3561
Switching Regulator Applications
Unit: mm

• Low drain-source ON resistance: RDS (ON) = 0.75Ω (typ.)


• High forward transfer admittance: |Yfs| = 6.5S (typ.)
• Low leakage current: IDSS = 100 μA (VDS = 500 V)
• Enhancement mode: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Drain-source voltage VDSS 500 V


Drain-gate voltage (RGS = 20 kΩ) VDGR 500 V
Gate-source voltage VGSS ±30 V
DC (Note 1) ID 8
1: Gate
Drain current Pulse (t = 1 ms) A 2: Drain
IDP 32 3: Source
(Note 1)
Drain power dissipation (Tc = 25°C) PD 40 W
Single pulse avalanche energy
EAS 312 mJ JEDEC ―
(Note 2)
Avalanche current IAR 8 A JEITA SC-67
Repetitive avalanche energy (Note 3) EAR 4 mJ TOSHIBA 2-10U1B
Channel temperature Tch 150 °C Weight : 1.7 g (typ.)
Storage temperature range Tstg -55~150 °C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Thermal Characteristics
2
Characteristics Symbol Max Unit

Thermal resistance, channel to case Rth (ch-c) 3.125 °C/W


Thermal resistance, channel to ambient Rth (ch-a) 62.5 °C/W

Note 1: Ensure that the channel temperature does not exceed 150℃. 1

Note 2: VDD = 90 V, Tch = 25°C(initial), L = 8.3 mH, IAR = 8 A, RG = 25 Ω


Note 3: Repetitive rating: pulse width limited by maximum channel temperature

This transistor is an electrostatic-sensitive device. Please handle with caution. 3

1
2SK3561
Electrical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Gate leakage current IGSS VGS = ±25 V, VDS = 0 V ⎯ ⎯ ±10 µA


Gate-source breakdown voltage V (BR) GSS IG = ±10 µA, VDS = 0 V ±30 ⎯ ⎯ V
Drain cut-off current IDSS VDS = 500 V, VGS = 0 V ⎯ ⎯ 100 µA
Drain-source breakdown voltage V (BR) DSS ID = 10 mA, VGS = 0 V 500 ⎯ ⎯ V
Gate threshold voltage Vth VDS = 10 V, ID = 1 mA 2.0 ⎯ 4.0 V
Drain-source ON resistance RDS (ON) VGS = 10 V, ID = 4 A ⎯ 0.75 0.85 Ω
Forward transfer admittance ⎪Yfs⎪ VDS = 10 V, ID = 4 A 3.0 6.5 ⎯ S
Input capacitance Ciss ⎯ 1050 ⎯
Reverse transfer capacitance Crss VDS = 25 V, VGS = 0 V, f = 1 MHz ⎯ 10 ⎯ pF

Output capacitance Coss ⎯ 110 ⎯


10 V ID = 4 A VOUT
Rise time tr VGS ⎯ 26 ⎯
0V
Turn-on time ton RL = ⎯ 45 ⎯
50 Ω
Switching time 50 Ω ns
Fall time tf ⎯ 38 ⎯
VDD ∼
− 200 V

Turn-off time toff Duty <


= 1%, tw = 10 µs ⎯ 130 ⎯

Total gate charge Qg ⎯ 28 ⎯


Gate-source charge Qgs VDD ∼
− 400 V, VGS = 10 V, ID = 8 A ⎯ 16 ⎯ nC

Gate-drain charge Qgd ⎯ 12 ⎯

Source-Drain Ratings and Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Continuous drain reverse current


IDR ⎯ ⎯ ⎯ 8 A
(Note 1)
Pulse drain reverse current (Note 1) IDRP ⎯ ⎯ ⎯ 32 A
Forward voltage (diode) VDSF IDR = 8 A, VGS = 0 V ⎯ ⎯ −1.7 V
Reverse recovery time trr IDR = 8 A, VGS = 0 V, ⎯ 1200 ⎯ ns
Reverse recovery charge Qrr dIDR/dt = 100 A/µs ⎯ 10 ⎯ µC

Marking

K3561 Part No. (or abbreviation code)


Lot No.

A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.

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