A Review On Optimization of Process Parameters in Turning Operation Carried Out by Coated Insert
A Review On Optimization of Process Parameters in Turning Operation Carried Out by Coated Insert
A Review On Optimization of Process Parameters in Turning Operation Carried Out by Coated Insert
point of the turning tool occurred due to the variation the functional variation are termed as losses due to the
in the cutting condition is well known due to relentless variation of the product’s functional characteristics
effects on the tool and work piece materials properties. from its aimed target value. In addition to that, the
During machining process, the heat is generated at the noise factors are the unmanageable factors that cause
cutting point from primary, secondary and tertiary the functional characteristics of a product which do not
zones. The chip, tool and work piece helps in achieve its aimed values. The noise factors can be
removing this heat from those cutting zones. The distinguished as the manufacturing imperfections,
temperature increment at cutting point of the tool is external factors (temperature and human errors) and
primarily due to secondary shear zone, but primary product deterioration. The main objective of quality
shear zone too contributes for the rise in temperature engineering is to make sure that the product can be
of the cutting tool and indirectly influences the vigorous with the respect of all possible noise factors.
temperature distribution on the tool rake face. These So, the Taguchi method could minimize the
days most of the tool inserts are used with a coated experimental or product cycle time, minimize the cost
surface. while improving the profit and determines the
important factors in a shorter time period as it can
II. DESIGN OF EXPERIMENTS-TAGUCHI
make sure the quality in the design phase. The
Design of experiments is an effective analysis tool for procedure of Taguchi’s design can be categorized into
modeling and analyzing the influence of control three stages such as parameter design, system design
parameters on output performance. The usage of and tolerance design. Parameter design [4] which is
conventional experimental design is difficult, considered as the most important stage, can decide the
especially when dealing with more number of factors affecting quality characteristics in the
experiments and when the number of machining manufacturing process. The first step in Taguchi’s
parameter is very high. The most important stage in parameter design is chosing the proper orthogonal
the design of experiment is in the selection of the array (OA) according to the controllable factors
control parameters. So, the Taguchi method [1], which (parameters). Then, experiments are carried out
is introduced by Dr. Genichi Taguchi[3], can be used according to the OA set before and the experimental
as an experimental technique which gives the data are analyzed in order to determine the optimum
diminution of experimental number with the help of condition. Once the optimum conditions are
orthogonal arrays and taking away the effect from determined, then confirmation runs are done with the
control parameters. Taguchi is a method which identified optimum levels of all the factors.
constitutes a plan of experiments with the aim of
III. INSERTS
acquiring data in a controlled way, executing these
experiments and analysis data in order to get the Inserts are detachable cutting tips, which mean they
information about performance of the given process. are neither brazed nor welded to the tool body [8].
Besides that, it is a set of methodologies [2] that is They are generally indexed, which means that it can
taken into account of the inbuilt variability of be flipped or rotated without affecting the overall
materials and manufacturing process in the design geometry of the tool (tool length offset, effective
stage. It is almost like the design of experiment (DOE) diameter etc.). This minimizes time in manufacturing
but the Taguchi design’s balanced (orthogonal) by making way for fresh cutting edges to be changed
experimental combination delivers more efficient periodically without the need for setup changes, tool
technique than the fractional factorial design. This grinding, or programming new values in a CNC
technique has been implemented in the manufacturing program. Carbide insert grades rely on their ability to
processes to solve the majority of confusing problems resist wear and their toughness. A manufacturer’s
especially to observe the degree of authority of the technical guide can be utilized to select the proper
control factors and in finding of optimal set of grade needed for machining different materials. Inserts
conditions. In the Taguchi definition, the quality of a of different grades [9] are also chosen based on the
product is mentioned in terms of the loss imparted by type of cuts. American National Standards Institute
the product to the society right from the time the (ANSI) and the International Standards Organization
product is shipped to the customer. The losses due to (ISO) developed systems for grading carbide inserts
based on insert’s physical characteristics and its moving stage by introducing a reactive gas (nitrogen,
application. Different insert shapes bring about oxygen or simple hydrocarbon containing the
specific types of machining operations on different preferred reactant), and post-deposition modification
work piece shapes. The strength of the insert also relies through mechanical or thermal processing. PVD [12]
on the insert shape. For an example, the round inserts is used in various applications, including production of
possesses greatest strength [10] and the more cutting microelectronic devices, battery, interconnects and
edges. Insert size is found by the largest inscribed fuel cell electrodes, optical and conductive coatings,
circle (IC) that will fit within the insert or touch all diffusion barriers and surface modifications.
insert edges. When the size of the insert increases,
Aldrich Materials Science offers a variety of PVD
there will be an increase in the depth of cut as well. A
materials for variety of deposition processes.
general guideline is that to set the depth of cut not
Examples include evaporation slugs, sputtering targets
more than 2/3 of the cutting edge length.
and pellets and high-purity metal foils. Customized
IV. COATINGS materials, including metal filled crucibles for
Molecular Beam Epitaxy (MBE), can also be obtained
The methods employed for coating inserts are of
through Hard Materials Centre of Excellence [13].
mostly two primary methods namely Physical Vapor
Physical vapor deposition (PVD) describes a wide
Deposition (PVD) and Chemical Vapor Deposition
range of vacuum deposition methods that can be used
(CVD). Physical vapor deposition (PVD) is basically
to generate thin films and coatings. PVD is
a vaporization type of coating technique, involving
characterized by a process in which the material passes
material transfer at an atomic level. It is an
from a condensed phase into a vapor phase and then
unconventional process to the electroplating. The
gets back to a thin film condensed phase. PVD can be
process is identical to chemical vapour deposition
used in the manufacture of items that needs thin films
(CVD) but the difference is that the raw
for mechanical, chemical, optical or electronic
materials/precursors, i.e. the material that is going to
functions. Examples include semiconductor devices
be coated begins in solid form, whereas in CVD, the
like thin film solar panels, aluminized PET film for
precursors are enforced to the reaction chamber in the
food packaging and balloons. It can also be used for
gaseous state. It incorporates processes like sputter
coating cutting tools in metalworking. Besides PVD
coating and pulsed laser deposition (PLD). Different
tools for fabrication, some smaller tools (mainly for
PVD technologies make use of the same three
scientific purposes) are also developed. Industrial
fundamental steps but vary in the methods used to
coatings that are commonly applied by PVD are
generate and deposition of the material. The two PVD
zirconium nitride, titanium nitride, titanium aluminum
processes that are primarily used are sputtering and
nitride, chromium nitride. The source material is
thermal evaporation. The Sputtering technique is a
inevitably also deposited on most other surfaces
plasma assisted technique that forms a vapor out of the
interior to the vacuum chamber, including the fixtures
source target through bombardment accompanying
which are used to hold the parts. In general, CVD is a
accelerated gaseous ions (mostly Argon). Thermal
mode of depositing gaseous reactants onto a substrate.
evaporation is a deposition technique that mostly
The way CVD is done is by combining gas molecules
depends on vaporization of source material by heating
(often using carrier gases) in a reaction chamber that
the material using suitable methods under vacuum
is typically set at ambient temperature. When the
condition. In both evaporation and sputtering, the
combined gases approaches the substrate within the
vapor phase which is obtained is deposited
reaction chamber (which is heated), a reaction occurs
subsequently onto the preferred substrate through a
which creates a material film on the substrate surface.
mechanism of condensation.
The waste gases are then evacuated from the reaction
Deposited films can cover a range of chemical chamber. The temperature of the substrate is a primary
compositions based on the source materials. Further condition that decides the type of reaction that will
compositions are reachable through reactive occur, so it is important that the temperature is precise.
deposition processes. Pertinent examples include co- During the CVD process, the substrate is generally
deposition from different sources, reaction during the coated in a very small amount, at a very low speed
which is often described in microns of thickness per The next phase of creating the carbon structure from
hour. The process is similar to that of physical vapor the disassociated carbon atoms, also demands a very
deposition (PVD). The only difference is that the high level of heat (over 2500°C without a catalyst), so
precursors are solid compounds, rather than gases, and a catalyst is very important at this stage to decrease the
so the process is somewhat different. The solid temperature needed for a reaction to occur to around
compounds are vaporized, and then deposited onto a 1000°C [14]. The setback in using catalysts is that you
substrate through condensation. The advantages of are effectively adding more compounds into the
using CVD to coat materials onto a substrate are that reaction chamber, which will have an impact on the
the quality of the output is normally very high. Other reactions within the chamber. An example of these
common characteristics of CVD coatings include impacts is the way the carbon atoms dissolve into
invulnerability, fine grained, high purity and increased some substrates such as Nickel during the cooling
hardness over other coating methods. It is a general phase. Effectively it means that it is more important
solution for the deposition of films in the that the CVD process is very effectively co-ordinated,
semiconductor industry, as well as in optoelectronics, and that controls are placed at every stage of the
due to its low costs involved when compared with the process to make sure that the reactions happen
high purity of films created. Even though there are effectively, and that the quality of graphene produced
various types of different formats of CVD, most is at its best.
modern processes come under two topics which are
The material properties can be bettered by modifying
separated by the chemical vapor deposition operating
the size, type, amount and distribution of the
pressure: LPCVD, and UHVCVD. LPCVD (low
incorporated particles. The studies, indeed, predicts
pressure CVD) is the CVD procedure that is
low quantity, pertaining it to physical and chemical
performed under sub-atmospheric pressures. This low
effects between particle and growing surface. Ni–
pressure aids in preventing undesirable reactions and
Al2O3 composite coatings were made with the help of
produce more unvarying thickness of coating on the
sediment co-deposition (SCD) technique and
base. UHVCVD (ultra-high vacuum CVD) is a
conventional electroplating (CEP) technique by using
process in which chemical vapor deposition is carried
Watt's type electrolyte devoid of any additives. The
out under tremendously low atmospheric pressures;
hardness, microstructure, and wear resistance of
usually in the range of 10-6 Pascal. The disadvantages
resulting composites were investigated. The results
in using CVD to perform material coatings are that the
imply that the inclusion of nano-Al2O3particles
gaseous by-products of the process are generally very
changes the surface morphology of nickel matrix. The
toxic. This is because the precursor gases considered
micro hardness value of the Ni–Al2O3 composite
must be highly volatile so as to react with the substrate,
coatings by using SCD technique are superior to that
but not very much volatile that it is difficult to carry
of the CEP technique and pure Ni coating and rise with
them to the reaction chamber. During the CVD
the increasing of the nano-Al2O3 particles
process, the toxic by-products are eliminated from the
concentration in the solution of plating. The rate of
reaction chamber by gas flow to be evacuated
wear in the Ni–Al2O3 composite coating that are
properly. CVD graphene can be formed in two steps,
fabricated by SCD technique is just about one order of
the precursor pyrolysis of a material to structure
magnitude lower when compared to pure Ni coating.
carbon, and the configuration of the carbon structure
The resistance of wear for SCD obtained composite
of graphene using the disassociated carbon atoms. The
coatings is higher than that obtained by the CEP
pyrolysis to disassociate carbon atoms is the first stage
technique. The mechanism of wear in nickel nano-
which must be carried out on the surface of the
Al2O3 composite coatings and pure Ni are wear
substrate to avoid the precipitation of carbon clusters
abrasive and adhesive wear, respectively.
(soot) in the gas phase. The difficulty with this is that
the pyrolytic decomposition of precursors needs V. CONCLUSION
extreme levels of heat, and so metal catalysts must be From the literature study carried out and the inference
used to bring down the reaction temperature. of the presented paper it can be concluded that better
output parameters like surface roughness, tool life