74HC4002 74HCT4002: 1. General Description

Download as pdf or txt
Download as pdf or txt
You are on page 1of 17

74HC4002; 74HCT4002

Dual 4-input NOR gate


Rev. 4 — 17 September 2012 Product data sheet

1. General description
The 74HC4002; 74HCT4002 is a dual 4-input NOR gate. Inputs also include clamp diodes
that enable the use of current limiting resistors to interface inputs to voltages in excess of
VCC.

2. Features and benefits


 Complies with JEDEC standard JESD7A
 Low-power dissipation
 Input levels:
 For 74HC4002: CMOS level
 For 74HCT4002: TTL level
 ESD protection:
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V
 Multiple package options
 Specified from 40 C to +80 C and from 40 C to +125 C.

3. Ordering information
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC4002N 40 C to +125 C DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1
74HCT4002N
74HC4002D 40 C to +125 C SO14 plastic small outline package; 14 leads; body width SOT108-1
74HCT4002D 3.9 mm

74HC4002DB 40 C to +125 C SSOP14 plastic shrink small outline package; 14 leads; body SOT337-1
74HCT4002DB width 5.3 mm

74HC4002PW 40 C to +125 C TSSOP14 plastic thin shrink small outline package; 14 leads; SOT402-1
body width 4.4 mm
NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

4. Functional diagram

$
 $
% 
 < %
&   <
 & 
' 
 '
$ 
 $
% 
 < %
&   <
 & 
' 
 '

DDD DDD

Fig 1. Functional diagram Fig 2. Logic symbol

 •

  $


%

 • <
  &


'
DDD DDD

Fig 3. IEC Logic symbol Fig 4. Logic diagram

5. Pinning information

5.1 Pinning

+&
+&7

<   9&&
+&
$   <
+&7

%   ' <   9&&


$   <
&   &
%   '
'   % &   &
'   %
QF   $
QF   $
*1'   QF *1'   QF

DDD DDD

Fig 5. Pin configuration SOT27-1 and SOT108-1 Fig 6. Pin configuration SOT337-1 and SOT402-1

74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 2 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

5.2 Pin description


Table 2. Pin description
Symbol Pin Description
1Y 1 data output
1A, 1B, 1C, 1D 2, 3, 4, 5 data input
n.c. 6, 8 not connected
GND 7 ground (0 V)
2Y 13 data output
2A, 2B, 2C, 2D 9, 10, 11, 12 data input
VCC 14 supply voltage

6. Functional description
Table 3. Function table[1]
Input Output
nA nB nC nD nY
L L L L H
H X X X L
X H X X L
X X H X L
X X X H L

[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care.

7. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V [1] - 20 mA
IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V [1] - 20 mA
IO output current 0.5 V < VO < VCC + 0.5 V - 25 mA
ICC supply current - 50 mA
IGND ground current 50 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation [2]

DIP14 package - 750 mW


SO14, and (T)SSOP14 - 500 mW
packages

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For DIP14 package: Ptot derates linearly with 12 mW/K above 70 C.
For SO14 package: Ptot derates linearly with 8 mW/K above 70 C.
For (T)SSOP14 packages: Ptot derates linearly with 5.5 mW/K above 60 C.

74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 3 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

8. Recommended operating conditions


Table 5. Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions 74HC4002 74HCT4002 Unit
Min Typ Max Min Typ Max
VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V
VI input voltage 0 - VCC 0 - VCC V
VO output voltage 0 - VCC 0 - VCC V
Tamb ambient temperature 40 +25 +125 40 +25 +125 C
t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V
VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V
VCC = 6.0 V - - 83 - - - ns/V

9. Static characteristics
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit
Min Typ Max Min Max Min Max
74HC4002
VIH HIGH-level VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
input voltage VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
input voltage VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
VOH HIGH-level VI = VIH or VIL
output voltage IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO = 4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO = 5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
VOL LOW-level VI = VIH or VIL
output voltage IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V
IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V
II input leakage VI = VCC or GND; - - 0.1 - 1 - 1 A
current VCC = 6.0 V
ICC supply current VI = VCC or GND; IO = 0 A; - - 2 - 20 - 40 A
VCC = 6.0 V

74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 4 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

Table 6. Static characteristics …continued


At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit
Min Typ Max Min Max Min Max
CI input - 3.5 - - - - - pF
capacitance
74HCT4002
VIH HIGH-level VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V
input voltage
VIL LOW-level VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
input voltage
VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V
output voltage IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V
IO = 4.0 mA 3.84 4.32 - 3.84 - 3.7 - V
VOL LOW-level VI = VIH or VIL; VCC = 4.5 V
output voltage IO = 20 A - 0 0.1 - 0.1 - 0.1 V
IO = 5.2 mA - 0.15 0.26 - 0.33 - 0.4 V
II input leakage VI = VCC or GND; - - 0.1 - 1 - 1 A
current VCC = 5.5 V
ICC supply current VI = VCC or GND; IO = 0 A; - - 2 - 20 - 40 A
VCC = 5.5 V
ICC additional per input pin; - 45 162 - 203 - 221 A
supply current VI = VCC  2.1 V; IO = 0 A;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V
CI input - 3.5 - - - - - pF
capacitance

74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 5 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

10. Dynamic characteristics


Table 7. Dynamic characteristics
GND = 0 V; CL = 50 pF; for load circuit see Figure 8.
Symbol Parameter Conditions 25 C 40 C to +125 C Unit
Min Typ Max Max Max
(85 C) (125 C)
74HC4002
tpd propagation delay nA, nB, nC or nD to nY; [1]

see Figure 7
VCC = 2.0 V - 30 100 125 150 ns
VCC = 4.5 V - 11 20 25 30 ns
VCC = 6.0 V - 9 17 21 26 ns
VCC = 5.0 V; CL = 15 pF - 9 - - - ns
tt transition time see Figure 7 [2]

VCC = 2.0 V - 19 75 95 110 ns


VCC = 4.5 V - 7 15 19 22 ns
VCC = 6.0 V - 6 13 16 19 ns
CPD power dissipation per package; VI = GND to VCC [3] - 16 - - - pF
capacitance
74HCT4002
tpd propagation delay nA, nB, nC or nD to nY; [1]

see Figure 7
VCC = 4.5 V - 13 22 28 33 ns
VCC = 5.0 V; CL = 15 pF - 11 - - - ns
tt transition time VCC = 4.5 V; see Figure 7 [2] - 7 15 19 22 ns
CPD power dissipation per package; [3] - 22 - - - pF
capacitance VI = GND to VCC  1.5 V

[1] tpd is the same as tPHL and tPLH.


[2] tt is the same as tTHL and tTLH.
[3] CPD is used to determine the dynamic power dissipation (PD in W):
PD = CPD  VCC2  fi  N +  (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
 (CL  VCC2  fo) = sum of outputs.

74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 6 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

11. Waveforms

9,
Q$Q%Q& 90
Q'LQSXW
*1'

W3+/ W3/+
92+
9<
Q<RXWSXW 90
9;
92/
W7+/ W7/+
DDD

Measurement points are given in Table 8.


VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. Waveforms showing the input (nA, nB, nC, nD) to output (nY) propagation delays and the output
transition times

Table 8. Measurement points


Type Input Output
VM VM VX VY
74HC4002 0.5VCC 0.5VCC 0.1VCC 0.9VCC
74HCT4002 1.3 V 1.3 V 0.1VCC 0.9VCC

tW
VI
90 %
negative
VM VM
pulse
10 %
GND
tf tr
tr tf
VI
90 %
positive
VM VM
pulse
10 %
GND tW

VCC

VI VO
G DUT

RT CL

001aah768

Test data is given in Table 9.


Definitions test circuit:
RT = termination resistance should be equal to output impedance Zo of the pulse generator.
CL = load capacitance including jig and probe capacitance.
Fig 8. Test circuit for measuring switching times

74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 7 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

Table 9. Test data


Type Input Load Test
VI tr, tf CL
74HC4002 VCC 6.0 ns 15 pF, 50 pF tPLH, tPHL
74HCT4002 3.0 V 6.0 ns 15 pF, 50 pF tPLH, tPHL

74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 8 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

12. Package outline

DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1

D ME
seating plane

A2 A

L A1

c
Z e w M
b1
(e 1)
b
14 8 MH

pin 1 index
E

1 7

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT
A A1 A2
b b1 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 0.36 19.50 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 2.2
1.13 0.38 0.23 18.55 6.20 3.05 7.80 8.3
0.068 0.021 0.014 0.77 0.26 0.14 0.32 0.39
inches 0.17 0.02 0.13 0.1 0.3 0.01 0.087
0.044 0.015 0.009 0.73 0.24 0.12 0.31 0.33

Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE REFERENCES EUROPEAN


ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

99-12-27
SOT27-1 050G04 MO-001 SC-501-14
03-02-13

Fig 9. Package outline SOT27-1 (DIP14)


74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 9 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

D E A
X

y HE v M A

14 8

Q
A2
(A 3) A
A1
pin 1 index
θ
Lp

1 7 L

e w M detail X
bp

0 2.5 5 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)


A
UNIT A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ
max.
0.25 1.45 0.49 0.25 8.75 4.0 6.2 1.0 0.7 0.7
mm 1.75 0.25 1.27 1.05 0.25 0.25 0.1
0.10 1.25 0.36 0.19 8.55 3.8 5.8 0.4 0.6 0.3 8o
o
0.010 0.057 0.019 0.0100 0.35 0.16 0.244 0.039 0.028 0.028 0
inches 0.069 0.01 0.05 0.041 0.01 0.01 0.004
0.004 0.049 0.014 0.0075 0.34 0.15 0.228 0.016 0.024 0.012

Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

OUTLINE REFERENCES EUROPEAN


ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

99-12-27
SOT108-1 076E06 MS-012
03-02-19

Fig 10. Package outline SOT108-1 (SO14)


74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 10 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1

D E A
X

c
y HE v M A

14 8

Q
A2 A
A1 (A 3)

pin 1 index
θ
Lp
L

1 7 detail X

w M
e bp

0 2.5 5 mm
scale

DIMENSIONS (mm are the original dimensions)


A
UNIT A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ
max.

mm 2
0.21 1.80 0.38 0.20 6.4 5.4 7.9 1.03 0.9 1.4 8o
0.25 0.65 1.25 0.2 0.13 0.1 o
0.05 1.65 0.25 0.09 6.0 5.2 7.6 0.63 0.7 0.9 0

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN


ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

99-12-27
SOT337-1 MO-150
03-02-19

Fig 11. Package outline SOT337-1 (SSOP14)


74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 11 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1

D E A
X

y HE v M A

14 8

Q
A2 (A 3)
A
A1
pin 1 index

θ
Lp
L
1 7
detail X
w M
e bp

0 2.5 5 mm
scale

DIMENSIONS (mm are the original dimensions)


A
UNIT A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ
max.

mm 1.1
0.15 0.95 0.30 0.2 5.1 4.5 6.6 0.75 0.4 0.72 8o
0.25 0.65 1 0.2 0.13 0.1 o
0.05 0.80 0.19 0.1 4.9 4.3 6.2 0.50 0.3 0.38 0

Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN


ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

99-12-27
SOT402-1 MO-153
03-02-18

Fig 12. Package outline SOT402-1 (TSSOP14)


74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 12 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

13. Abbreviations
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic

14. Revision history


Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT4002 v.4 20120917 Product data sheet - 74HC_HCT4002 v.3
Modifications: • Table 1: Type number 74HC20DB changed into 74HC4002DB.
74HC_HCT4002 v.3 20120904 Product data sheet - 74HC_HCT4002_CNV v.2
Modifications: • The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
74HC_HCT4002_CNV v.2 19970829 Product specification - -

74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 13 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

15. Legal information

15.1 Data sheet status


Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Draft — The document is a draft version only. The content is still under
malfunction of an NXP Semiconductors product can reasonably be expected
internal review and subject to formal approval, which may result in
to result in personal injury, death or severe property or environmental
modifications or additions. NXP Semiconductors does not give any
damage. NXP Semiconductors and its suppliers accept no liability for
representations or warranties as to the accuracy or completeness of
inclusion and/or use of NXP Semiconductors products in such equipment or
information included herein and shall have no liability for the consequences of
applications and therefore such inclusion and/or use is at the customer’s own
use of such information.
risk.
Short data sheet — A short data sheet is an extract from a full data sheet
Applications — Applications that are described herein for any of these
with the same product type number(s) and title. A short data sheet is intended
products are for illustrative purposes only. NXP Semiconductors makes no
for quick reference only and should not be relied upon to contain detailed and
representation or warranty that such applications will be suitable for the
full information. For detailed and full information see the relevant full data
specified use without further testing or modification.
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the Customers are responsible for the design and operation of their applications
full data sheet shall prevail. and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
Product specification — The information and data provided in a Product design. It is customer’s sole responsibility to determine whether the NXP
data sheet shall define the specification of the product as agreed between Semiconductors product is suitable and fit for the customer’s applications and
NXP Semiconductors and its customer, unless NXP Semiconductors and products planned, as well as for the planned application and use of
customer have explicitly agreed otherwise in writing. In no event however, customer’s third party customer(s). Customers should provide appropriate
shall an agreement be valid in which the NXP Semiconductors product is design and operating safeguards to minimize the risks associated with their
deemed to offer functions and qualities beyond those described in the applications and products.
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
15.3 Disclaimers customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Limited warranty and liability — Information in this document is believed to
Semiconductors products in order to avoid a default of the applications and
be accurate and reliable. However, NXP Semiconductors does not give any
the products or of the application or use by customer’s third party
representations or warranties, expressed or implied, as to the accuracy or
customer(s). NXP does not accept any liability in this respect.
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no Limiting values — Stress above one or more limiting values (as defined in
responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC 60134) will cause permanent
source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
In no event shall NXP Semiconductors be liable for any indirect, incidental,
the Recommended operating conditions section (if present) or the
punitive, special or consequential damages (including - without limitation - lost
Characteristics sections of this document is not warranted. Constant or
profits, lost savings, business interruption, costs related to the removal or
repeated exposure to limiting values will permanently and irreversibly affect
replacement of any products or rework charges) whether or not such
the quality and reliability of the device.
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory. Terms and conditions of commercial sale — NXP Semiconductors
Notwithstanding any damages that customer might incur for any reason products are sold subject to the general terms and conditions of commercial
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards sale, as published at http://www.nxp.com/profile/terms, unless otherwise
customer for the products described herein shall be limited in accordance agreed in a valid written individual agreement. In case an individual
with the Terms and conditions of commercial sale of NXP Semiconductors. agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
Right to make changes — NXP Semiconductors reserves the right to make applying the customer’s general terms and conditions with regard to the
changes to information published in this document, including without purchase of NXP Semiconductors products by customer.
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior No offer to sell or license — Nothing in this document may be interpreted or
to the publication hereof. construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.

74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 14 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

Export control — This document as well as the item(s) described herein NXP Semiconductors’ specifications such use shall be solely at customer’s
may be subject to export control regulations. Export might require a prior own risk, and (c) customer fully indemnifies NXP Semiconductors for any
authorization from competent authorities. liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
Non-automotive qualified products — Unless this data sheet expressly
standard warranty and NXP Semiconductors’ product specifications.
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested Translations — A non-English (translated) version of a document is for
in accordance with automotive testing or application requirements. NXP reference only. The English version shall prevail in case of any discrepancy
Semiconductors accepts no liability for inclusion and/or use of between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer 15.4 Trademarks
(a) shall use the product without NXP Semiconductors’ warranty of the
Notice: All referenced brands, product names, service names and trademarks
product for such automotive applications, use and specifications, and (b)
are the property of their respective owners.
whenever customer uses the product for automotive applications beyond

16. Contact information


For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

74HC_HCT4002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 4 — 17 September 2012 15 of 16


NXP Semiconductors 74HC4002; 74HCT4002
Dual 4-input NOR gate

17. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Functional description . . . . . . . . . . . . . . . . . . . 3
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Recommended operating conditions. . . . . . . . 4
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
15.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
16 Contact information. . . . . . . . . . . . . . . . . . . . . 15
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2012. All rights reserved.


For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 17 September 2012
Document identifier: 74HC_HCT4002
This datasheet has been downloaded from:

www.DatasheetCatalog.com

Datasheets for electronic components.

You might also like