Transient Voltage Suppression Diodes

Surface Mount – 200W > SMF Series

SMF Series RoHS Pb e3

Description
Uni-directional
The SMF series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.

SMF package is 50% smaller in footprint when compare

to SMA package and deliverying one of the low height
profiles (1.1mm) in the industry.

Features

•2  00W peak pulsepower • ESD protection of data

Agency Approvals capability at 10/1000µs lines in accordance with
waveform, repetition rate IEC 61000-4-2
AGENCY AGENCY FILE NUMBER (duty cycle): 0.01% • EFT protection of data
E230531
•Compatible with lines in accordance with
industrial standard IEC 61000-4-4
package SOD-123FL • Fast response time:
Maximum Ratings and Thermal Characteristics
•L  ow profile: maximum typically less than 1.0ns
(TA=25OC unless otherwise noted)
height of 1.1mm. from 0 Volts to VBR min
• Low inductance, excellent • Glass passivated junction
Parameter Symbol Value Unit clamping capability • Built-in strain relief
•F  or surface mounted • Plastic package is
Peak Pulse Power Dissipation at flammability rated
TA=25ºC by 10/1000µs (Note 1)
PPPM 200 W applications to optimize
board space V-0 per Underwriters
Thermal Resistance Junction- to- •H  igh temperature Laboratories
RθJA 220 °C/W
Ambient to reflow soldering • Meet MSL level1, per
Thermal Resistance Junction- to- guaranteed: 260°C/40sec J-STD-020, LF maximun
RθJL 100 °C/W peak of 260°C
Lead • Typical failure mode is
short from over-specified • Matte tin lead–free plated
Operating Temperature Range TJ -65 to 150 °C
voltage or current • Halogen-free and RoHS
• Whisker test is conducted compliant
Storage Temperature Range TSTG -65 to 175 °C
based on JEDEC • Pb-free E3 means 2nd
Notes: JESD201A per its table 4a level interconnect is
1. Non-repetitive current pulse, per Fig. 4 and derated above TJ (initial) =25ºC per Fig. 3. and 4c Pb-free and the terminal
• IEC-61000-4-2 ESD finish material is tin(Sn)
30kV(Air), 30kV (Contact) (IPC/ JEDEC J-STD-
609A.01)

Functional Diagram Applications

Bi-directional

SMF devices are ideal for the protection of I/O interfaces,

Cathode VCC bus and other vulnerable circuit used in cellular
Anode
phones, portable devices, business machines, power
Uni-directional supplies and other consumer applications.

Additional Infomarion

Datasheet Resources Samples

© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 12/06/17
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series

Electrical Characteristics (T =25°C unless otherwise noted)

A

Breakdown
Voltage VBR Test Maximum Maximum Maximum Agency
Part Marking (Volts) @ IT Current Reverse Stand
Reverse Peak Pulse Clamping Approval
Number Code off Voltage
IT Leakage @ VR Current Ipp Voltage @Ipp
VR (V)
(mA) IR (µA) (A) VC (V)
MIN MAX

SMF5.0A AE 6.40 7.00 10 5.0 400 21.7 9.2 X

SMF6.0A AG 6.67 7.37 10 6.0 400 19.4 10.3 X
SMF6.5A AK 7.22 7.98 10 6.5 250 17.9 11.2 X
SMF7.0A AM 7.78 8.60 10 7.0 100 16.7 12.0 X
SMF7.5A AP 8.33 9.21 1 7.5 50 15.5 12.9 X
SMF8.0A AR 8.89 9.83 1 8.0 25 14.7 13.6 X
SMF8.5A AT 9.44 10.40 1 8.5 10 13.9 14.4 X
SMF9.0A AV 10.00 11.10 1 9.0 5 13.0 15.4 X
SMF10A AX 11.10 12.30 1 10 2.5 11.8 17.0 X
SMF11A AZ 12.20 13.50 1 11 2.5 11.0 18.2 X
SMF12A BE 13.30 14.70 1 12 2.5 10.1 19.9 X
SMF13A BG 14.40 15.90 1 13 1.0 9.3 21.5 X
SMF14A BK 15.60 17.20 1 14 1.0 8.6 23.2 X
SMF15A BM 16.70 18.50 1 15 1.0 8.2 24.4 X
SMF16A BP 17.80 19.70 1 16 1.0 7.7 26.0 X
SMF17A BR 18.90 20.90 1 17 1.0 7.2 27.6 X
SMF18A BT 20.0 0 22.10 1 18 1.0 6.8 29.2 X
SMF20A BV 22.20 24.50 1 20 1.0 6.2 32.4 X
SMF22A BX 24.40 26.90 1 22 1.0 5.6 35.5 X
SMF24A BZ 26.70 29.50 1 24 1.0 5.1 38.9 X
SMF26A CE 28.90 31.90 1 26 1.0 4.8 42.1 X
SMF28A CG 31.10 34.40 1 28 1.0 4.4 45.4 X
SMF30A CK 33.30 36.80 1 30 1.0 4.1 48.4 X
SMF33A CM 36.70 40.60 1 33 1.0 3.8 53.3 X
SMF36A CP 40.00 44.20 1 36 1.0 3.4 58.1 X
SMF40A CR 44.40 49.10 1 40 1.0 3.1 64.5 X
SMF43A CT 47.80 52.80 1 43 1.0 2.9 69.4 X
SMF45A CV 50.00 55.30 1 45 1.0 2.8 72.7 X
SMF48A CX 53.30 58.90 1 48 1.0 2.6 77.4 X
SMF51A CZ 56.70 62.70 1 51 1.0 2.4 82.4 X
SMF54A DE 60.00 66.30 1 54 1.0 2.3 87.1 X
SMF58A RG 64.40 71.20 1 58 1.0 2.1 93.6
SMF60A RK 66.70 73.70 1 60 1.0 1.8 96.8
SMF64A RM 71.10 78.60 1 64 1.0 1.7 103.0
SMF70A RP 77.80 86.00 1 70 1.0 1.5 113.0
SMF75A RR 83.30 92.10 1 75 1.0 1.4 121.0
SMF78A RT 86.70 95.80 1 78 1.0 1.4 126.0
SMF85A RV 94.40 104.00 1 85 1.0 1.3 137.0
SMF90A RW 100.00 111.00 1 90 1.0 1.2 146.0
SMF100A RX 111.00 123.00 1 100 1.0 1.1 162.0

Notes:
1. VBR measured after IT applied for 300µs, IT = square wave pulse or equivalent.
2. Surge current waveform per 10/1000µs exponential wave and derated per Fig.2.
3. All terms and symbols are consistent with ANSI/IEEE C62.35.

© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 12/06/17
 Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series

I-V Curve Characteristics

Uni-directional

Vc VBR VR
V
IR VF
IT

Ipp

PPPM Peak Pulse Power Dissipation -- Max power dissipation

VR Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation
VBR Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT)
VC Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current)
IR Reverse Leakage Current -- Current measured at VR
VF Forward Voltage Drop for Uni-directional

Ratings and Characteristic Curves (T =25°C unless otherwise noted)

A

Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Curve

Voltage Transients 10
PPPM-Peak Pulse Power (kW)

Voltage Across TVS

Voltage or Current

Current Through TVS 1

0.1
0.000001 0.00001 0.0001 0.001
td-Pulse Width (sec.)
Time

continues on next page.

© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 12/06/17
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series

Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued) A

Figure 3 - Peak Pulse Power Derating Curve Figure 4 - Pulse Waveform - 10/1000µS
100 150
Peak Pulse Power (PPP) or Current (IPP)

tr=10µsec TJ=25°C

IPPM- Peak Pulse Current, % IRSM

Pulse Width(td) is defined
as the point where the peak
80
Derating in Percentage %

current decays to 50% of IPPM

Peak Value
100 IPPM
60
Half Value

40
( )
IPPM IPPM
2

50 10/1000µsec. Waveform
as defined by R.E.A
20

td
0
0
0 25 50 75 100 125 150 175 0 1.0 2.0 3.0 4.0
TJ - Initial Junction Temperature (ºC) t-Time (ms)

Figure 5 - Forward Voltage Figure 6 - Typical Junction Capacitance

10000
0.9
Vf - Typical forward dropped voltage

0.8

0.7
1000
0.6
Measured@Vr=0v
0.5
Cj (pf)

0.4 Measured@50%Vr
100
0
-55 10 75 140
Temperature (ºC)

Figure 7 - Peak Forward Voltage Drop vs. Figure

10 8 - Maximum Non-Repetitive Forward Surge
Peak Forward Current 1 Current Uni-Directional
10 Only 100

Vbr - Reverse breakdown voltage

35
IFSM - Peak Forward Surve Current(A)

10 30
I F - Peak Forward Current(A)

25

1 20

15

0.1
10

5
0.01
0
0 0.5 1 1.5 2 2.5 3 3.5 4
1 10 100
V F - Peak Forward Voltage(V)
Number of Cycles at 60 Hz

© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 12/06/17
 Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series

Soldering Parameters

Lead–free
Reflow Condition
assembly
tp
TP
- Temperature Min (Ts(min)) 150°C
Ramp-up Critical Zone
Pre Heat - Temperature Max (Ts(max)) 200°C TL to TP
TL tL
- Time (min to max) (ts) 60 – 180 secs

Temperature (T)
Ts(max)

Average ramp up rate (Liquidus Temp (TA)

3°C/second max Ramp-down
to peak Ts(min)
ts
TS(max) to TA - Ramp-up Rate 3°C/second max Preheat

- Temperature (TA) (Liquidus) 217°C

Reflow 25˚C
t 25˚C to Peak
- Time (min to max) (ts) 60 – 150 seconds
Time (t)
Peak Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
20 – 40 seconds
Temperature (tp)
Ramp-down Rate 6°C/second max Environmental Specifications
Time 25°C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260°C High Temp. Storage JESD22-A103

HTRB JESD22-A108
Physical Specifications
Temperature Cycling JESD22-A104
SOD-123FL plastic over glass passivated
Case
junction
MSL JEDEC-J-STD-020, Level 1
 olor band denotes cathode except
C
Polarity
bipolar H3TRB JESD22-A101
Matte tin-plated leads, solderable per
Terminal
JESD22-B102 RSH JESD22-A111

Dimensions - SOD-123FL Package

Millimeters Inches
Dimensions
Min Max Min Max
E

A 2.50 2.90 0.0984 0.1142

B 3.40 3.90 0.1339 0.1535
B
A

C 0.70 1.20 0.0275 0.0472

D 1.50 2.00 0.0591 0.0787
E

C
F E 0.35 0.90 0.0138 0.0354
D F 0.05 0.26 0.0020 0.0102
G 0.00 0.10 0.000 0.0039
H 0.95 1.10 0.0374 0.0433
H
G

Mounting Pad Layout

1.6 (0.062) 1.3 (0.051)

1.4 (0.055)

© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 12/06/17
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series

Part Numbering System Part Marking System

SMF xx A

LF
XX
Cathode Band
(for uni-directional products only)

5% VBR VOLTAGE TOLERANCE YM Marking Code

Trace Code Marking
Y:Year Code
M: Month Code
VR VOLTAGE
SERIES

Packaging Options

Component Packaging
Part number Quantity Packaging Option
Package Specification

SMFXXX SOD-123FL 3000 Tape & Reel – 8mm tape/7” reel EIA RS-481

SMFXXX-T13 SOD-123FL 10000 Tape & Reel – 8mm tape/13” reel EIA RS-481

Tape and Reel Specification

0.157
(4.0)
Cathode
0.31
(8.0)

0.157 0.059 DIA Cover tape

(4.0) (1.5)

7.0 (178)
Dimensions are in inches
0.80 (20.2) (and millimeters).
Arbor Hole Dia.

Direction of Feed
0.33
(8.5)

Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.

© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 12/06/17