Data Sheet: P-Channel Enhancement Mode Vertical D-MOS Transistor
Data Sheet: P-Channel Enhancement Mode Vertical D-MOS Transistor
Data Sheet: P-Channel Enhancement Mode Vertical D-MOS Transistor
DATA SHEET
BST120
P-channel enhancement mode
vertical D-MOS transistor
Product specification April 1995
File under Discrete Semiconductors, SC13b
Philips Semiconductors Product specification
PIN CONFIGURATION
handbook, halfpage d
1 2 3 s
Bottom view MAM354
marking: LM
April 1995 2
Philips Semiconductors Product specification
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Drain-source voltage −VDS max. 60 V
Gate-source voltage (open drain) ±VGSO max. 20 V
Drain current (DC) −ID max. 0.3 A
Drain current (peak) −IDM max. 0.8 A
Total power dissipation up to Tamb = 25 °C (note 1) Ptot max. 1 W
Storage temperature range Tstg −65 to + 150 °C
Junction temperature Tj max. 150 °C
THERMAL RESISTANCE
From junction to ambient (note 1) Rth j-a = 125 K/W
Note
1. Transistor mounted on ceramic substrate: area = 2,5 cm2 and thickness = 0,7 mm.
April 1995 3
Philips Semiconductors Product specification
CHARACTERISTICS
Tj = 25 °C unless otherwise specified
Drain-source breakdown voltage
−ID = 10 µA; VGS = 0 −V(BR)DSS min. 60 V
Drain-source leakage current
−VDS = 48 V; VGS = 0 −IDSS max. 1 µA
Gate-source leakage current
−VGS = 20 V; VDS = 0 −IGSS max. 100 nA
Gate threshold voltage
min. 1.5 V
−ID = 1 mA; VDS = VGS −VGS(th)
max. 3.5 V
Drain-source ON-resistance
typ. 4.5 Ω
−ID = 200 mA; −VGS = 10 V RDS(on)
max. 6 Ω
Transfer admittance
−ID = 200 mA; −VDS = 15 V Yfs typ. 200 mS
Input capacitance at f = 1 MHz
typ. 55 pF
−VDS = 10 V; VGS = 0 Ciss
max. 70 pF
April 1995 4
Philips Semiconductors Product specification
handbook, halfpage 10 %
handbook, halfpage VDD = −50 V
INPUT
90 %
10 %
0V OUTPUT
ID
−10 V
90 %
50 Ω
ton toff
MBB689
MBB690
Fig.2 Switching times test circuit. Fig.3 Input and output waveforms.
MDA776 MDA777
−103 −1
handbook, halfpage
V GS = −10 V handbook, halfpage
ID
−7.5 V
(A)
ID −6 V −0.8
(mA)
−5 V
−4.5 V −0.6
−102
−0.4
−0.2
−10 0
4 6 8 10 12 14 16 0 −2 −4 −6 −8 −10
RDSon (Ω) VGS (V)
April 1995 5
Philips Semiconductors Product specification
MDA778
−1
handbook, halfpage
ID
(A) VGS = −10 V
−0.8
−7.5 V
−0.6
−6 V
−0.4
−5 V
−4.5 V
−0.2
0
0 −2 −4 −6 −8 −10
VDS (V)
April 1995 6
Philips Semiconductors Product specification
PACKAGE OUTLINES
Plastic surface mounted package; collector pad for good heat transfer; 3 leads SOT89
D B
b3
E
HE
L
1 2 3
b2 c
w M b1
e1
0 2 4 mm
scale
SOT89 97-02-28
April 1995 7
Philips Semiconductors Product specification
DEFINITIONS
April 1995 8
Philips Semiconductors Product specification
NOTES
April 1995 9
Philips Semiconductors Product specification
NOTES
April 1995 10
Philips Semiconductors Product specification
NOTES
April 1995 11
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Printed in The Netherlands 137107/00/01/pp12 Date of release: April 1995 Document order number: 9397 750 02494
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