User's Guide: EXP430FR4133)

MSP430FR4133 LaunchPad™ Development Kit
(MSP‑‑EXP430FR4133)
User's Guide
Literature Number: SLAU595

October 2014
Contents
1 Getting Started .................................................................................................................... 4

1.1 Introduction................................................................................................................ 4
1.2 Key Features.............................................................................................................. 5
1.3 What's Included .......................................................................................................... 5
1.4 First Steps: Out-of-Box Experience .................................................................................... 5
1.5 Next Steps: Looking Into the Provided Code ......................................................................... 6
2 Hardware ............................................................................................................................ 7
2.1 Block Diagram ............................................................................................................ 8
2.2 Hardware Features ...................................................................................................... 8
2.3 Power..................................................................................................................... 16
2.4 Measure MSP430 Current Draw ...................................................................................... 17
2.5 Clocking .................................................................................................................. 17
2.6 Using the eZ-FET Emulator With a Different Target ............................................................... 17
2.7 BoosterPack Pinout .................................................................................................... 18
2.8 Design Files ............................................................................................................. 19
2.9 Hardware Change Log ................................................................................................. 19
3 Software Examples ............................................................................................................. 19
3.1 Precompiled Binary ..................................................................................................... 19
3.2 MSP430Ware Library .................................................................................................. 20
3.3 Development Environment Requirements ........................................................................... 20
3.4 Out-of-Box Software Example ........................................................................................ 22
4 Additional Resources.......................................................................................................... 24
4.1 LaunchPad Websites ................................................................................................... 24
4.2 Information on the MSP430FR4133.................................................................................. 24
4.3 Download CCS or IAR ................................................................................................. 24
4.4 MSP430Ware and TI Resource Explorer ............................................................................ 24
4.5 MSP430FR4133 Code Examples .................................................................................... 25
4.6 MSP430 Application Notes ............................................................................................ 25
4.7 Community Resources ................................................................................................. 25
5 FAQ .................................................................................................................................. 26
6 Schematics ........................................................................................................................ 27
2 Table of Contents SLAU595 – October 2014

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List of Figures
1 MSP-EXP430FR4133 ....................................................................................................... 4
2 MSP-EXP430FR4133 Overview ........................................................................................... 7
3 Block Diagram ................................................................................................................ 8
4 MSP430FR4133 Pinout ..................................................................................................... 9
5 eZ-FET Emulator ........................................................................................................... 10
6 eZ-FET Isolation Jumper Block Diagram................................................................................ 12
7 Application Backchannel UART in Device Manager ................................................................... 12
8 LCD Segment Layout ...................................................................................................... 13
9 MSP-EXP430FR4133 Power Block Diagram ........................................................................... 16
10 LaunchPad to BoosterPack Connector Pinout ......................................................................... 18
11 Programming the LaunchPad With Program Batch Files ............................................................. 20
12 Directing the Project>Import Function to the Demo Project .......................................................... 21
13 When CCS Has Found the Project ...................................................................................... 22
14 MSP-EXP430FR4133 Software Examples in TI Resource Explorer ................................................ 25
15 Schematics (1 of 6) ........................................................................................................ 27
16 Schematics (2 of 6) ........................................................................................................ 28
17 Schematics (3 of 6) ........................................................................................................ 29
18 Schematics (4 of 6) ........................................................................................................ 30
19 Schematics (5 of 6) ........................................................................................................ 31
20 Schematics (6 of 6) ........................................................................................................ 32
List of Tables
1 EnergyTrace Technology.................................................................................................. 10
2 Isolation Block Connections............................................................................................... 11
3 LCD FH-1138P Segment Mapping....................................................................................... 14
4 LCD to MSP430 Connections ............................................................................................ 15
5 Hardware Change Log..................................................................................................... 19
6 Software Examples ........................................................................................................ 19
7 IDE Minimum Requirements for MSP-EXP430FR4133 ............................................................... 20
8 List of Source Files and Folders.......................................................................................... 23
9 How MSP430 Device Documentation is Organized ................................................................... 24
SLAU595 – October 2014 List of Figures 3

User's Guide
SLAU595 – October 2014
MSP430FR4133 LaunchPad™ Development Kit

(MSP‑EXP430FR4133)
1 Getting Started
1.1 Introduction
The MSP-EXP430FR4133 LaunchPad™ Development Kit is an easy-to-use Evaluation Module (EVM) for
the MSP430FR4133 microcontroller (see Figure 1). It contains everything needed to start developing on
the MSP430™ ultra-low-power (ULP) FRAM-based microcontroller (MCU) platform, including on-board
emulation for programming, debugging, and energy measurements. The board features on-board buttons
and LEDs for quick integration of a simple user interface and a liquid crystal display (LCD) that showcases
the integrated driver with flexible software-configurable pins. The MSP430FR4133 device features
embedded FRAM (ferroelectric random access memory), a nonvolatile memory known for its ultra-low
power, high endurance, and high-speed write access.
Figure 1. MSP-EXP430FR4133
LaunchPad, MSP430, BoosterPack, Code Composer Studio, EnergyTrace, E2E are trademarks of Texas Instruments.
IAR Embedded Workbench is a registered trademark of IAR Systems.
4 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) SLAU595 – October 2014

www.ti.com Getting Started
Rapid prototyping is simplified by the 20-pin BoosterPack™ Plug-in Module headers, which support a wide
range of available BoosterPacks. You can quickly add features like wireless connectivity, graphical
displays, environmental sensing, and much more. Design your own BoosterPack or choose among many
already available from TI and third-party developers.
Free software development tools are also available, including TI's Eclipse-based Code Composer
Studio™ (CCSTUDIO) and IAR Embedded Workbench® IAR-KICKSTART. Both of these integrated
development environments (IDEs) support EnergyTrace™ technology when paired with the
MSP430FR4133 LaunchPad. More information about the LaunchPad, the supported BoosterPacks, and
available resources can be found at TI's LaunchPad portal.
1.2 Key Features

• MSP430 ultra-low-power FRAM technology based MSP430FR4133 16-bit MCU
• 20-pin LaunchPad standard that leverages the BoosterPack ecosystem
• eZ-FET, an open-source onboard debugger that features EnergyTrace technology
• On-board segmented LCD
• Two buttons and two LEDs for user interaction
• Backchannel UART through USB to PC
1.3 What's Included
1.3.1 Kit Contents

• 1 x MSP-EXP430FR4133 LaunchPad Development Kit
• 1 x micro-USB cable
• 1 x Quick Start Guide
1.3.2 Software Examples

• Out-of-Box Software
1.4 First Steps: Out-of-Box Experience

An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. It demonstrates
some key features from a user level.
1.4.1 Connecting to the Computer

Connect the LaunchPad using the included USB cable to a computer. A green power LED should
illuminate. For proper operation, drivers are needed. It is recommended to get drivers by installing an IDE
such as TI's CCS or IAR EW430. Drivers are also available at www.ti.com/MSPdrivers.
1.4.2 Running the Out-of-Box Demo

When connected to the computer, the LaunchPad powers up and displays a greeting message on the
LCD. Press and hold the S1 and S2 buttons simultaneously to select a new mode. A more detailed
explanation of each mode can be found in Section 3.4.
SLAU595 – October 2014 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) 5

Getting Started www.ti.com
1.4.2.1 Stopwatch Mode

This mode provides a simple stopwatch application. It supports split time, where the display freezes while
the stopwatch continues running in the background.
Timer Stopped:
S1: Start time
S2: Reset time
Timer Running:
S1: Stop time
S2: Split time (lap time)
1.4.2.2 Temperature Mode

This mode provides a simple thermometer application. Using the on-chip temperature sensor, the
temperature is displayed on the LCD.
S1: Pause current temperature
S2: Toggle temperature between °F and °C
1.5 Next Steps: Looking Into the Provided Code

After the EVM features have been explored, the fun can begin. It's time to open an integrated
development environment and start editing the code examples. Refer to Section 3.3 for more information
on IDEs and where to download them.
The out-of-box source code and more code examples are provided for download at
http://www.ti.com/tool/msp-exp430fr4133. Code is licensed under BSD, and TI encourages reuse and
modifications to fit specific needs.
Section 3 describes all of the functions in detail and describes the project structure to help familiarize you
with the code.
With the onboard eZ-FET emulator debugging and downloading new code is simple. A USB connection
between the EVM and a PC through the provided USB cable is all that is needed.

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2 Hardware
Figure 2 shows an overview of the MSP-EXP430FR4133 hardware.
eZ-FET on-board emulator

Enables debugging/programming as
well as communication back to the
PC. The eZ-FET can also provide
{ { Introducing EnergyTraceTM Technology
Real-time power consumption readings and
state updates from the MSP430FR4133
MCU, including CPU and peripheral state
power to the target MCU. are viewable through the EnergyTrace GUI
Jumpers to isolate emulator

Reset from target MCU (J101)
- Back-channel UART to PC
{
(RTS, CTS, RXD, TXD)
- Spy-Bi -Wire d ebug (SBWTDIO/SBWTCK)
20-pin BoosterPack - Power (5V, 3V3, and GND)
plug-in module connector
(J1 and J2)
MSP430FR4133 Microcontroller
MSP1 Segmented LCD Display
- 6 alphanumeric characters
- 6 symbols for various applicaions
- Ultra-lo w power display
Button/Switch Button/Switch
S1 S2
User LEDs
LED1, LED2
Figure 2. MSP-EXP430FR4133 Overview

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2.1 Block Diagram

Figure 3 shows the block diagram.
Micro-B LEDs Crystal

USB Red, Green 4 MHz
ESD Debug
EnergyTrace
Protection MCU
3.3-VLDO
UART/SBW to Target Power to Target
Reset
button Segmented LCD
Crystal Target Device 20-pin LaunchPad

32.768 kHz MSP430FR4133 standard headers
User Interface
2 Buttons and 2 LEDs
Figure 3. Block Diagram
2.2 Hardware Features
2.2.1 MSP430FR4133
The MSP430FR4133 is the next device in TI's new ULP FRAM technology platform. FRAM is a cutting
edge memory technology, combining the best features of flash and RAM into one nonvolatile memory.
Device features include:
• 1.8-V to 3.6-V operation
• Up to 16-MHz system clock and 8-MHz FRAM access
• 16KB of nonvolatile FRAM
• Industry's lowest-power LCD controller
• IR modulation logic
• Two timer blocks and up to three serial interfaces (SPI, UART, or I2C)
• Analog: 10-channel 10-bit differential ADC
• Digital: RTC, CRC

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P3.2/L10
P3.4/L12
P3.5/L13
P3.6/L14
P3.7/L15
P3.3/L11
P7.0/L0
P7.1/L1
P7.2/L2
P7.3/L3
P7.4/L4
P7.5/L5
P7.6/L6
P7.7/L7
P3.0/L8
P3.1/L9
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
P4.7/R13 1 48 P6.0/L16
P4.6/R23 2 47 P6.1/L17
P4.5/R33 3 46 P6.2/L18
P4.4/LCDCAP1 4 45 P6.3/L19
P4.3/LCDCAP0 5 44 P6.4/L20
P4.2/XOUT 6 43 P6.5/L21
P4.1/XIN 7 42 P6.6/L22
DVSS 8 41 P6.7/L23
DVCC 9 40 P2.0/L24
RST/NMI/SBWTDIO 10 39 P2.1/L25
TEST/SBWTCK 11 38 P2.2/L26
P4.0/TA1.1 12 37 P2.3/L27
P8.3/TA1.2 13 36 P2.4/L28
P8.2/TA1CLK 14 35 P2.5/L29
P8.1/ACLK/A9 15 34 P2.6/L30
P8.0/SMCLK/A8 16 33 P2.7/L31
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
P1.7/TA0.1/TDO/A7
P1.6/TA0.2/TDI/TCLK/A6
P1.5/TA0CLK/TMS/A5
P1.4/MCLK/TCK/A4/VREF+
P1.3/UCA0STE/A3
P1.2/UCA0CLK/A2
P1.1/UCA0RXD/UCA0SOMI/A1/Veref+
P1.0/UCA0TXD/UCA0SIMO/A0/Veref–
P5.7/L39
P5.6/L38
P5.5/L37
P5.4/L36
P5.3/UCB0SOMI/UCB0SCL/L35
P5.2/UCB0SIMO/UCB0SDA/L34
P5.1/UCB0CLK/L33
P5.0/UCB0STE/L32
Figure 4. MSP430FR4133 Pinout

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2.2.2 eZ-FET Onboard Emulator With EnergyTrace™ Technology

To keep development easy and cost effective, TI's LaunchPad Development Kits integrate an onboard
emulator, which eliminates the need for expensive programmers. The MSP-EXP430FR4133 has the eZ-
FET emulator (see Figure 5), which is a simple and low-cost debugger that supports all MSP430 device
derivatives.
Figure 5. eZ-FET Emulator
The MSP-EXP430FR4133 LaunchPad features EnergyTrace technology but does not have support for
EnergyTrace++™ technology. The EnergyTrace functionality varies across the MSP portfolio (see
Table 1).
Table 1. EnergyTrace Technology

Feature EnergyTrace™ Technology EnergyTrace++™ Technology
Current Monitoring ✓ ✓
CPU State ✓
Peripheral and System State ✓
MSP430FR59xx and
Devices Supported All MSP430 MCUs
MSP430FR69xx MCUs
Development Tool Required MSP-FET or eZ-FET MSP-FET or eZ-FET
The eZ-FET also provides a "backchannel" UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC. The provided UART supports hardware
flow control (RTS and CTS), although by default these signals are not connected to the target.
The dotted line through J101 shown in Figure 5 divides the eZ-FET emulator from the target area. The
signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. More
details on the isolation jumper block are in Section 2.2.3.
The eZ-FET hardware can be found in the schematics in Section 6 and in the accompanying hardware
design files (SLAR102). The software and more information about the debugger can be found on the eZ-
FET lite wiki.

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2.2.3 Emulator Connection: Isolation Jumper Block

The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from
the eZ-FET domain into the MSP430FR4133 target domain. This includes eZ-FET Spy-Bi-Wire signals,
application UART signals, and 3.3-V and 5-V power (see Table 2 and Figure 6).
Reasons to open these connections:
• To remove any and all influence from the eZ-FET emulator for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the eZ-FET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the eZ-FET so that it can be used for devices other
than the onboard MCU.
Table 2. Isolation Block Connections

Jumper Description
GND Ground
5V 5-V VBUS from USB
3V3 3.3-V rail, derived from VBUS by an LDO in the eZ-FET domain
Backchannel UART: Ready-To-Send, for hardware flow control. The target can use this to indicate whether it
RTS >>
is ready to receive data from the host PC. The arrows indicate the direction of the signal.
Backchannel UART: Clear-To-Send, for hardware flow control. The host PC (through the emulator) uses this
CTS <<
to indicate whether it is ready to receive data. The arrows indicate the direction of the signal.
Backchannel UART: The target FR4133 receives data through this signal. The arrows indicate the direction
RXD <<
of the signal.
Backchannel UART: The target FR4133 sends data through this signal. The arrows indicate the direction of
TXD >>
the signal.
SBW RST Spy-Bi-Wire emulation: SBWTDIO data signal. This pin also functions as the RST signal (active low).
SBW TST Spy-Bi-Wire emulation: SBWTCK clock signal. This pin also functions as the TST signal.

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USB Connector
USB
eZ-FET
eZ-FET
in out Emulator
LDO
MCU
EnergyTrace
Isolation
Jumper Block
Spy-Bi-Wire (SBW)
5V Power
Application UART
3.3V Power
Emulation
MSP430 Target
BoosterPack Header
BoosterPack Header
Target MSP430
MCU
Figure 6. eZ-FET Isolation Jumper Block Diagram
2.2.4 Application (or "Backchannel") UART

The backchannel UART allows communication with the USB host that is not part of the target application's
main functionality. This is useful during development and also provides a communication channel to the
PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the PC
that communicate with the LaunchPad.
The pathway of the backchannel UART is shown in Figure 6. The backchannel UART is the UART on
eUSCI_A0. Because of USCI limitations, this UART channel is shared with the UART on the 20-pin
BoosterPack connector (eUSCI_A0). This UART channel is also shared with the red LED on P1.0. This is
a lot of sharing, but all 64 pins of the device are used and this was done out of necessity. The P1.0 pin
serves more functions than any other.
On the host side, a virtual COM port for the application backchannel UART is generated when the
LaunchPad enumerates on the host. You can use any PC application that interfaces with COM ports,
including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the
target application. You need to identify the COM port for the backchannel. On Windows PCs, Device
Manager can assist (see Figure 7).
Figure 7. Application Backchannel UART in Device Manager

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The backchannel UART is the "MSP Application UART1" port. In this case, Figure 7 shows COM13, but
this port can vary from one host PC to the next. After you identify the correct COM port, configure it in
your host application according to its documentation. You can then open the port and begin
communication to it from the host.
On the target MSP430FR4133 side, the backchannel is connected to the eUSCI_A0 module. The eZ-FET
has a configurable baud rate; therefore, it is important that the PC application configures the baud rate to
be the same as what is configured on the eUSCI_A0.
The eZ-FET also supports hardware flow control, if desired. Hardware flow control (CTS and RTS
handshaking) allows the target MSP430FR4133 and the emulator to tell each other to wait before sending
more data. At low baud rates and with simple target applications, flow control may not be necessary.
Applications with higher baud rates and more interrupts to service have a higher likelihood that the will not
be able to read the eUSCI_A0 RXBUF register in time, before the next byte arrives. If this happens, the
eUSCI_A0 UCA0STATW register reports an overrun error.
2.2.5 Special Features
2.2.5.1 Liquid Crystal Display (LCD)

The MSP430FR4133 LaunchPad features an on-board LCD (see Figure 8). This LCD is driven by the
internal LCD driver on the MSP430FR4133 device.
Figure 8. LCD Segment Layout

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There are many available LCD segments, including six full alpha-numeric numbers and letters in addition
to several symbols at the top for various modes or applications. Table 3 shows the mapping of these
segments.
Table 3. LCD FH-1138P Segment Mapping

Pin COM3 COM2 COM1 COM0
1 A1E A1F A1G A1M
2 A1A A1B A1C A1D
3 A1Q NEG A1N A1DP
4 A1H A1J A1K A1P
5 A2E A2F A2G A2M
6 A2A A2B A2C A2D
7 A2Q A2COL A2N A2DP
8 A2H A2J A2K A2P
9 A3R A3F A3G A3M
10 A3A A3B A3C A3D
11 A3Q ANT A3N A3DP
12 A3H A3J A3K A3P
13 A4R A4F A4G A4M
14 A4A A4B A4C A4D
15 A4Q A4COL A4N A4DP
16 A4H A4J A4K A4P
17 A5E A5F A5G A5M
18 A5A A5B A5C A5D
19 A5Q DEG A5N A5DP
20 A5H A5J A5K A5P
21 COM3 - - -
22 - COM2 - -
23 - - COM1 -
24 - - - COM0
25 - - - -
26 - - - -
27 - - - -
28 - - - -
29 - - - -
30 - - - -
31 - - - -
32 TMR HRT REC !
33 B6 B4 B2 BATT
34 B5 B3 B1 []
35 A6E A6F A6G A6M
36 A6A A6B A6C A6D
37 A6Q TX A6N RX
38 A6H A6J A6K A6P

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The MSP430FR4133 device has flexible LCD pins allowing any pin to be a SEG or a COM. This simplifies
layout for the user. The LCD connections are typically a tradeoff between easy layout and optimal memory
settings for cleaner user software, among other considerations. The flexibility of the MSP430FR4133
allowed an optimal memory setting for easy software, along with a simple layout on the PCB (see
Table 4).
Each LCDMEM register is eight bits, controlling up to eight segments. The FH-1138P is a 4-mux LCD, so
four COM pins are needed from the MSP430FR4133. With four COM pins, each segment pin controls four
bits or segments. This means that each LCDMEM register controls two segment pins, as shown in
Table 4. Note that LCDMEM14 to LCDMEM17 and LCDMEM20 and higher are not used due to layout
considerations.
Each alphanumeric character A1 to A6 is controlled by two adjacent LCDMEM registers for efficiency and
ease of use in software. This allows for a single 16-bit memory access to control the whole character, as
opposed to split memory regions requiring separate memory accesses.
Table 4. LCD to MSP430 Connections

FR4133 Pin
FR4133 Pin
LCDMEM
LCD Pin
LCD Pin
Port Pin
Port Pin
COM3
COM2
COM1
COM0
COM3
COM2
COM1
COM0
LCDM19 P5.7 L39 38 A6H A6J A6K A6P P5.6 L38 37 A6Q TX A6N RX
LCDM18 P5.5 L37 36 A6A A6B A6C A6D P5.4 L36 35 A6E A6F A6G A6M
LCDM17 P5.3 L35 P5.2 L34
LCDM16 P5.1 L33 P5.0 L32
LCDM15 P2.7 L31 P2.6 L30
LCDM14 P2.5 L29 P2.4 L28
LCDM13 P2.3 L27 P2.2 L26 34 B5 B3 B1 []
LCDM12 P2.1 L25 33 B6 B4 B2 BATT P2.0 L24 32 TMR HRT REC !
LCDM11 P6.7 L23 16 A4H A4J A4K A4P P6.6 L22 15 A4Q A4COL A4N A4DP
LCDM10 P6.5 L21 14 A4A A4B A4C A4D P6.4 L20 13 A4R A4F A4G A4M
LCDM9 P6.3 L19 12 A3H A3J A3K A3P P6.2 L18 11 A3Q ANT A3N A3DP
LCDM8 P6.1 L17 10 A3A A3B A3C A3D P6.0 L16 9 A3R A3F A3G A3M
LCDM7 P3.7 L15 8 A2H A2J A2K A2P P3.6 L14 7 A2Q A2COL A2N A2DP
LCDM5 P3.3 L11 4 A1H A1J A1K A1P P3.2 L10 3 A1Q NEG A1N A1DP
LCDM3 P7.7 L7 20 A5H A5J A5K A5P P7.6 L6 19 A5Q DEG A5N A5DP
LCDM1 P7.3 L3 21 COM3 - - - P7.2 L2 22 - COM2 - -
LCDM0 P7.1 L1 23 - - COM1 - P7.0 L0 24 - - - COM0

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2.3 Power
The board was designed to accommodate various powering methods, including through the on-board eZ-
FET and from external or BoosterPack power (see Figure 9).
USB (eZ-FET) Power BoosterPack and External

Configuration Power Configuration
eZ-FET eZ-FET
Legend
Jumper
Jumper
J101 J101
Place
3V3
3V3
No
J1 J2 Debug J1 J2
Power
Target
Domain Target
MSP430FR4133 MSP430FR4133
Device Device
MSP430FR4133 MSP430FR4133
Target and
target and target and
BoosterPack
BoosterPack Power BoosterPack
Domain
LCD LCD
GND GND
J6 GND J6 GND
VCC VCC
Figure 9. MSP-EXP430FR4133 Power Block Diagram
2.3.1 eZ-FET USB Power

The most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the
target side of the LaunchPad. Power from the eZ-FET is controlled by jumper J101. For 3.3 V, make sure
that a jumper is connected across the J101 3V3 terminal.
2.3.2 BoosterPack and External Power Supply

Header J6 is present on the board to supply external power directly. It is important to comply with the
device voltage operation specifications when supplying external power. The MSP430FR4133 has an
operating range of 1.8 V to 3.6 V. More information can be found in the MSP430FR4133 data sheet
(SLAS865).

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2.4 Measure MSP430 Current Draw

To measure the current draw of the MSP430FR4133 using a multi-meter, use the 3V3 jumper on the
jumper isolation block. The current measured includes the target device and any current drawn through
the BoosterPack headers.
To measure ultra-low power, follow these steps:
1. Remove the 3V3 jumper in the isolation block, and attach an ammeter across this jumper.
2. Consider the effect that the backchannel UART and any circuitry attached to the MSP430FR4133 may
have on current draw. Consider disconnecting these at the isolation jumper block, or at least consider
their current sinking and sourcing capability in the final measurement.
3. Make sure there are no floating input/output (I/Os). These cause unnecessary extra current draw.
Every I/O should either be driven out or, if it is an input, should be pulled or driven to a high or low
level.
4. Begin target execution.
5. Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
stable measurement. It is easier to measure quiescent states.
Alternatively, EnergyTrace technology can be used to measure the same current, and see energy profiles
through integrated GUI in CCS and IAR. EnergyTrace allows you to compare various current profiles and
better optimize your energy performance!
2.5 Clocking
The MSP-EXP430FR4133 provides an external clock in addition to the internal clocks in the device.
• Y1: a 32-kHz crystal
The 32-kHz crystal allows for lower LPM3 sleep currents than do the other low-frequency clock sources.
Therefore, the presence of the crystal allows the full range of low-power modes to be used.
The internal clocks in the device default to the following configuration:
• MCLK: DCO, 2 MHz
• SMCLK: DCO, 2 MHz
• ACLK: REFO, 32.768 kHz
For more information about configuring internal clocks and using the external oscillators, see the
MSP430FR4xx and MSP430FR2xx Family User's Guide (SLAU445).
2.6 Using the eZ-FET Emulator With a Different Target

The eZ-FET emulator on the LaunchPad can interface to most MSP430 derivative devices, not just the on-
board MSP430FR4133 target device.
To do this, disconnect every jumper in the isolation jumper block. This is necessary, because the emulator
cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.
Next, make sure the target board has proper connections for SBW. Note that to be compatible with SBW,
the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430
JTAG interface circuitry is the MSP430 Hardware Tools User's Guide (SLAU278).
Finally, wire together these signals from the emulator side of the isolation jumper block to the target
hardware:
• 5 V (if 5 V is needed) • TXD (if the UART backchannel is used)

• 3.3 V • RXD (if the UART backchannel is used)
• GND • CTS (if hardware flow control is used)
• SBWTDIO • RTS (if hardware flow control is used)
• SBWTCK
This wiring can be done either with jumper wires or by designing the board with a connector that plugs
into the isolation jumper block.

Hardware www.ti.com
2.7 BoosterPack Pinout

The LaunchPad adheres to the 20-pin LaunchPad pinout standard. A standard was created to aid
compatibility between LaunchPad and BoosterPack tools across the TI ecosystem.
The 20-pin standard is compatible with the 40-pin standard that is used by other LaunchPads like the
MSP‑EXP430F5529LP. This allows some subset of functionality of 40-pin BoosterPacks to be used with
20-pin LaunchPads.
While most BoosterPacks are compliant with the standard, some are not. The MSP-EXP430FR4133
LaunchPad is compatible with all 20-pin BoosterPacks that are compliant with the standard. If the reseller
or owner of the BoosterPack does not explicitly indicate compatibility with the MSP-EXP430FR4133
LaunchPad, compare the schematic of the candidate BoosterPack with the LaunchPad to ensure
compatibility. Keep in mind that sometimes conflicts can be resolved by changing the MSP430FR4133
device pin function configuration in software. More information about compatibility can also be found at
http://www.ti.com/launchpad.
Figure 10 shows the 20-pin pinout of the MSP430FR4133 LaunchPad.
Note that software's configuration of the pin functions plays a role in compatibility. The LaunchPad side of
the dashed line in Figure 10 shows all of the functions for which the MSP430FR4133 device's pins can be
configured. This can also be seen in the MSP430FR4133 data sheet. The BoosterPack side of the dashed
line shows the standard. The LaunchPad function whose color matches the BoosterPack function shows
the specific software-configurable function by which the MSP430FR4133 LaunchPad adheres to the
standard.
The following pins are exposed at the BoosterPack connector.
Also shown are functions that map with the BoosterPack standard.
2 2
* Note that to comply with the I C channels of the BoosterPack standard, a software-emulated I C must be used.
** Some LaunchPads do not 100% comply with the standard, please check your LaunchPad to ensure compatability
(!) Denotes I/O pins that are interrupt-capable.
BoosterPack
MSP-EXP430FR4133 Pin Map
Standard
+3.3V +3.3V
Analog In A C LK A9 P8.1
RX UCA0SOMI UCA0RXD A1 (!) P1.1
UART
TX UCA0SIMO UCA0TXD A0 (!) P1.0
GPIO (!) L31 (!) P2.7
Analog In SMCLK A8 P8.0
SPI CLK UCB0CLK L33 P5.1
GPIO (!) L29 (!) P2.5
SCL TA1CLK P8.2
I2C*
SDA TA1.2 P8.3
MSP-EXP430FR4133 Pin Map BoosterPack Standard
GND GND
P1.7 (!) TA0.1 TDO A7 PWM Out GPIO (!)
P1.6 (!) TA0.2 TDI A6 TCLK SPI CS Wireless GPIO (!)
P5.0 L32 UCB0STE GPIO**
RST RST
P5.2 L34 UCB0SIMO UCB0SDA MOSI
SPI
P5.3 L35 UCB0SOMI UCB0SCL MISO
P1.3 (!) A3 UCA0STE SPI CS Display GPIO (!)
P1.4 (!) MCLK TCK A4 SPI CS Other GPIO (!)
P1.5 (!) TMS TA0CLK A5 GPIO (!)
Figure 10. LaunchPad to BoosterPack Connector Pinout

www.ti.com Hardware
2.8 Design Files
2.8.1 Hardware
Schematics can be found in Section 6. All design files including schematics, layout, bill of materials
(BOM), Gerber files, and documentation are available in a zip folder (SLAR102).
2.8.2 Software
All design files including TI-TXT object-code firmware images, software example projects, and
documentation are available in a zip folder (SLAC682).
2.9 Hardware Change Log
Table 5. Hardware Change Log

PCB Revision Description
Rev 1.0 Initial Release
3 Software Examples
The software examples included with the MSP430FR4133 LaunchPad can be found in the zip source
folder (SLAC682).
Table 6. Software Examples

BoosterPack
Demo Name Description Details
Required
The out-of-box demo pre-programmed on the LaunchPad from
OutOfBox_FR4133 None Section 3.4
the factory. Demonstrates features of MSP430FR4133 device
3.1 Precompiled Binary

The /Binary/ folder inside the software zip package includes precompiled TI-TXT binary files for each of
the projects in Table 6 that are ready to be flashed onto the LaunchPad. A copy of the MSP430Flasher
tool is also shipped to interface with the eZ-FET Emulator.
To quickly program a demo onto the LaunchPad, simply navigate into the corresponding demo project's
directory and double click the "Program <Example>.bat" file.

Software Examples www.ti.com
Figure 11. Programming the LaunchPad With Program Batch Files
If desired, the "Program <Example>.bat" file can be modified to point to your own projects' binary file.
NOTE: After importing and compiling the software source code in an IDE such as CCS or IAR, the
TI-TXT binary files located in the /Binary/ folder are not updated automatically. Copy the
newly compiled binary from your IDE's /Workspace/Project/ directory and replace the
"<Example>.txt" in /Binary/ for the batch file to program your own binary file.
3.2 MSP430Ware Library

The examples are built upon MSP430 libraries shown below that are available from TI. All libraries are
available as part of MSP430Ware. Downloading CCS includes MSP430Ware along with TI Resource
Explorer.
• Driver library (MSP430DRIVERLIB): a foundational MSP430 software library that is useful for
interfacing with all MSP430 core functions and peripherals, especially clocks and power.
• Graphics library (MSP430-GRLIB): a library for interfacing MSP430 devices to dot-matrix LCD displays.
Contains primitives for simple drawing as well as images and more.
• Capacitive Touch Library (CAPSENSELIBRARY): a library for capacitive touch sensing applications.
This library supports the use of buttons, sliders, wheels and more. Highly configurable for each
application.
When you begin your own development, you will need more information about these libraries than can be
included in this user's guide. All of the information that you need is in MSP430Ware or the specific library
documentation linked above.
3.3 Development Environment Requirements

To use any of the software examples with the LaunchPad, you must have an IDE that supports the
MSP430FR4133 device (see Table 7). For more details on where to download the latest IDE, see
Section 4.3.
Table 7. IDE Minimum Requirements for MSP-EXP430FR4133

Code Composer Studio™ IDE IAR Embedded Workbench™ IDE
CCS v6.0 or later IAR EW430 v6.10 or later

www.ti.com Software Examples
3.3.1 CCS
CCS v6.0 or later is required. When CCS has been launched, and a workspace directory chosen, use
Project>Import Existing CCS Eclipse Project. Direct it to the desired demo project directory that contains
main.c (see Figure 12). Selecting the \CCS subdirectory also works. The CCS-specific files are located
there.
Figure 12. Directing the Project>Import Function to the Demo Project
When you click OK, CCS should recognize the project and allow you to import it. The indication that CCS
has found the project is that it appears in "Discovered projects" and is checked (see Figure 13).

Software Examples www.ti.com
Figure 13. When CCS Has Found the Project
Sometimes CCS finds the project but does not show a checkmark; this might mean that your workspace
already has a project by that name. You can resolve this by renaming or deleting that project. (Even if you
do not see it in the CCS workspace, be sure to check the workspace directory on the file system.)
3.3.2 IAR
IAR 6.10 or higher is required. To open the demo in IAR, click File>Open>Workspace…, and browse to
the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is
contained within this file.
The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace by
clicking Project>Add-Existing-Project….
Although the software examples have all of the code required to run them, IAR users may download and
install MSP430Ware, which contains MSP430 libraries and the TI Resource Explorer. These are already
included in a CCS installation (unless the user selected otherwise).
3.4 Out-of-Box Software Example

This section describes the functionality and structure of the out-of-box software that is preloaded on the
EVM.
There are two modes in the out-of-box software, stopwatch mode and temperature sensor mode, which
can be controlled with S1 and S2 push buttons on the LaunchPad. This demo shows how to utilize the
LCD_E module (active in low power mode 3.5), combined with the RTC counter, ADC, and internal
temperature sensor, to implement simple stopwatch and thermometer.

www.ti.com Software Examples
3.4.1 Source File Structure

The project is split into multiple files. This makes it easier to navigate and reuse parts of it for other
projects.
Table 8. List of Source Files and Folders

Name Description
main.c The out-of-box demo main function, initializations, shared ISRs, and so on
hal_LCD.c Hardware abstraction layer for LCD
StopWatchMode.c Main function file for stopwatch mode
TempSensorMode.c Main function file for live thermometer mode
Library: Driverlib Device driver library (MSP430DRIVERLIB)
3.4.2 Power Up and Idle

Upon powering up the out-of-box demo, the LCD displays a scrolling welcome message. The
MSP430FR4133 then enters a loop, in which the LCD cycles through all of its segments followed by a
scrolling instruction message to "Hold S1 and S2 to switch modes".
3.4.3 Stopwatch Mode

While in the power up and idle state or in the temperature sensor mode, the stopwatch mode can be
entered by holding down both S1 and S2 buttons shortly. The LCD displays scrolling text "STOPWATCH
MODE" to indicate successful entry into this mode.
The MSP430FR4133 initializes the stopwatch calendar to HH:MM:SS:CC = 00:00:00:00, then goes to
sleep in LPM3.5. Since the onboard LCD has 6 alphanumeric digits, the stopwatch format is initially
MM:SS:CC but becomes HH:MM:SS when the timer reaches the first hour.
Press the S1 button to start the stopwatch timer (counts up). While the timer is running, the
MSP430FR4133 sleeps and wakes between LPM3 (waiting for RTC interrupt) and active mode
(incrementing calendar and updating LCD). Press the S1 button again to stop the stopwatch timer and
return the MSP430FR4133 back to LPM3.5 to conserve power. When the stopwatch timer is stopped,
press the S2 button resets the timer back to 00:00:00.
While the stopwatch timer is running, press the S2 button to pause the LCD at the current time but
continue the timer running in the background, allowing for the "split timer" functionality. Press the S2
button to resume display of the running timer on the LCD.
3.4.4 Temperature Sensor Mode

While in the stopwatch mode, the temperature sensor mode can be entered by holding down both S1 and
S2 buttons shortly. The LCD displays scrolling text "TEMPSENSOR MODE" to indicate successful entry
into this mode.
Upon entering this mode, the MSP430FR4133 initializes the ADC input to its internal temperature sensor
and starts sampling/conversion at four times per second. Each time an ADC conversion completes, the
LCD shows the calculated temperature to the tenths decimal place.
The temperature unit can be toggled between Celsius and Fahrenheit by pressing the S2 button.
The temperature measurement can also be paused/resumed by pressing the S1 button. While the
temperature measurement is running, the MSP430FR4133 sleeps and wakes between LPM3 (waiting for
ADC sample/conversion to finish) and active mode (processing the results and updating LCD). When the
temperature measurement is paused, the MSP430FR4133 enters LPM3.5 with the LCD remaining on
displaying the last measured temperature.

Additional Resources www.ti.com
4 Additional Resources
4.1 LaunchPad Websites

More information about the MSP430FR4133 LaunchPad, supported BoosterPacks, and available
resources can be found at:
• Tool Folder: resources specific to this particular LaunchPad
• TI's LaunchPad portal: information about all LaunchPads from TI for all MCUs
4.2 Information on the MSP430FR4133

At some point, you will probably want more information about the MSP430FR4133 device. For every
MSP430 device, the documentation is organized as shown in Table 9.
Table 9. How MSP430 Device Documentation is Organized

Document For MSP430FR4133 Description
MSP430FR4xx and MSP430FR2xx Architectural information about the device, including all modules
Device family user's guide
Family User's Guide (SLAU445) and peripherals such as clocks, timers, ADC, and so on.
MSP430FR413x Mixed-Signal
Device-specific information and all parametric information for this
Device-specific data sheet Microcontrollers data sheet
device
(SLAS865)
4.3 Download CCS or IAR

Although the files can be viewed with any text editor, more can be done with the projects if they're opened
with a development environment like Code Composer Studio (CCS) or IAR Embedded Workbench.
CCS and IAR are available in full, free code-size, or time limited versions. The full out-of-box demo can be
built with the free versions of CCS and IAR (IAR KickStart), because it is under the code size limit. For full
functionality, download the full version of either CCS or IAR.
Go to the MSP430 software tools page to download them and for instructions on installation.
4.4 MSP430Ware and TI Resource Explorer

MSP430Ware is a complete collection of libraries and tools. It includes all of the MSP430 libraries used in
the software examples. By default, MSP430Ware is included in a CCS installation. IAR users must
download it separately.
MSP430Ware is built into the TI Resource Explorer, for easily browsing tools. For example, all of the
software examples are shown in Figure 14.

www.ti.com Additional Resources
Figure 14. MSP-EXP430FR4133 Software Examples in TI Resource Explorer
Inside TI Resource Explorer, these examples and many more can be found, and easily imported into CCS
with one click.
4.5 MSP430FR4133 Code Examples

This is a set of very simple code examples (SLAC625) that demonstrate how to use the entire set of
MSP430 peripherals: ADC12, Timer_A, eUSCI, and so on. These do not use driver library, rather they
access the MSP430 registers directly.
Every MSP430 derivative has a set of these code examples. When writing code that uses a peripheral,
they can often serve as a starting point.
Code examples can be accessed directly through MSP430Ware and the TI Resource Explorer without
downloading the zip folder referenced above. TI Resource Explorer allows a one-click import of the device
example code.
4.6 MSP430 Application Notes

There are many application notes at www.ti.com/msp430, with practical design examples and topics.
4.7 Community Resources
4.7.1 TI E2E™ Community

Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the community.

FAQ www.ti.com
4.7.2 Community at Large

Many online communities focus on the LaunchPad – for example, http://www.43oh.com. You can find
additional tools, resources, and support from these communities.
5 FAQ
Q: I can't get the backchannel UART to connect. What's wrong?
A:Check the following:
• Do the baud rate in the host's terminal application and the USCI settings match?
• Are the appropriate jumpers in place, on the isolation jumper block?
• Probe on RXD and send data from the host. If you don't see data, it might be a problem on the host
side.
• Probe on TXD while sending data from the MSP430. If you don't see data, it might be a configuration
problem with the eUSCI module.
• Consider the use of the hardware flow control lines (especially for higher baud rates).
Q: So the onboard emulator is really open source? And I can build my own onboard emulator?
A: Yes! We encourage you to do so. The design files are on ti.com.
Q: The MSP430 G2 LaunchPad had a socket, allowing me change the target device. Why doesn't
this LaunchPad use one?
A: This LaunchPad provides more functionality, and this means using a device with more pins. Sockets for
devices with this many pins are too expensive for the LaunchPad's target price.
Q: With the female headers on the bottom, the board doesn't sit flat on the table, and I can't
unsolder them. Why did TI do this?
A: For several reasons. A major feedback item on previous LaunchPads was the desire for female
headers instead of male ones. But simply using female instead is problematic, because compatibility with
existing BoosterPacks would be lost, and some people prefer male headers. So, adding female headers
without removing male ones satisfies both preferences. It also allows more flexibility in stacking
BoosterPacks and other LaunchPads.

www.ti.com Schematics
6 Schematics
The following figures show the schematics for the MSP-EXP430FR4133.
D
A
B
6
6
5
5
4
4
3
3
2
2
1
1
C
D
A
Figure 15. Schematics (1 of 6)

B
A
D
C
1
1
9
8
7
6
5
4
3
2
1
11
16
15
14
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2
DVSS
DVCC
P4.1/XIN
P4.5/R33
P4.6/R23
P4.7/R13
P8.3/TA1.2
P4.0/TA1.1
P4.2/XOUT
P8.2/TA1CLK
P8.1/ACLK/A9
P4.3/LCDCAP0
P4.4/LCDCAP1
TEST/SBWTCK
P8.0/SMCLK/A8
17 P1.7/TA0.1/TDO/A7 P7.0/L0 64
18 P1.6/TA0.2/TDI/TCLK/A6 P7.1/L1 63
RST/NMI/SBWTDIO
19 P1.5/TA0CLK/TMS/A5 P7.2/L2 62
20 P1.4/MCLK/TCK/A4 P7.3/L3 61
21 P1.3/UCA0STE/A3 P7.4/L4 60
22 P1.2/UCA0CLK/A2 P7.5/L5 59
23 P1.1/UCA0RXD/UCA0SOMI/A1/VEREF+ P7.6/L6 58
24 P1.0/UCA0TXD/UCA0SIMO/A0/VEREF- P7.7/L7 57
25 P5.7/L39 P3.0/L8 56
26 P5.6/L38 P3.1/L9 55
27 P5.5/L37 P3.2/L10 54
28 53
3
3
P5.4/L36 P3.3/L11
29 P5.3/UCB0SOMI/UCB0SCL/L35 P3.4/L12 52
30 P5.2/UCB0SIMO/UCB0SDA/L34 P3.5/L13 51
31 P5.1/UCB0CLK/L33 P3.6/L14 50
32 P5.0/UCB0STE/L32 P3.7/L15 49
P2.7/L31
P2.6/L30
P2.5/L29
P2.4/L28
P2.3/L27
P2.2/L26
P2.1/L25
P2.0/L24
P6.7/L23
P6.6/L22
P6.5/L21
P6.4/L20
P6.3/L19
P6.2/L18
P6.1/L17
P6.0/L16
33
34
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36
37
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D
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Schematics www.ti.com
D
A
B
6
6
8
4
COM1
COM2
V+ 2 GND 6
NO1
NO2
IN1
IN2
5
5
1
7
4
4
TP
16
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10
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9
3
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2 57 24
58 23
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63 18
64 17
TP
2
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12
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C
D
A

Schematics www.ti.com
D
A
B
6
6
5
5
3OUT
GND 2
EN
1IN
6
4
4
3
3
IO1 VCC 6
IO2 IO4 5
GND IO3 4
1
2
3
2
2
1
1
S1*6
1
1
S
5
4
3
2
1
D
A

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documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
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Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
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SPACER
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Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan are NOT certified by
TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs:
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

User's Guide: EXP430FR4133)

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MSP430FR4133 LaunchPad™ Development Kit

Literature Number: SLAU595

1 Getting Started .................................................................................................................... 4

2 Table of Contents SLAU595 – October 2014

SLAU595 – October 2014 List of Figures 3

MSP430FR4133 LaunchPad™ Development Kit

4 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) SLAU595 – October 2014

1.2 Key Features

1.3 What's Included

1.3.1 Kit Contents

1.3.2 Software Examples

1.4 First Steps: Out-of-Box Experience

1.4.1 Connecting to the Computer

1.4.2 Running the Out-of-Box Demo

SLAU595 – October 2014 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) 5

1.4.2.1 Stopwatch Mode

1.4.2.2 Temperature Mode

1.5 Next Steps: Looking Into the Provided Code

6 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) SLAU595 – October 2014

eZ-FET on-board emulator

Jumpers to isolate emulator

Figure 2. MSP-EXP430FR4133 Overview

SLAU595 – October 2014 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) 7

2.1 Block Diagram

Micro-B LEDs Crystal

UART/SBW to Target Power to Target

Crystal Target Device 20-pin LaunchPad

Figure 3. Block Diagram

2.2 Hardware Features

8 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) SLAU595 – October 2014

Figure 4. MSP430FR4133 Pinout

SLAU595 – October 2014 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) 9

2.2.2 eZ-FET Onboard Emulator With EnergyTrace™ Technology

Figure 5. eZ-FET Emulator

Table 1. EnergyTrace Technology

10 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) SLAU595 – October 2014

2.2.3 Emulator Connection: Isolation Jumper Block

Table 2. Isolation Block Connections

SLAU595 – October 2014 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) 11

Figure 6. eZ-FET Isolation Jumper Block Diagram

2.2.4 Application (or "Backchannel") UART

Figure 7. Application Backchannel UART in Device Manager

12 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) SLAU595 – October 2014

2.2.5 Special Features

2.2.5.1 Liquid Crystal Display (LCD)

Figure 8. LCD Segment Layout

SLAU595 – October 2014 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) 13

Table 3. LCD FH-1138P Segment Mapping

14 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) SLAU595 – October 2014

Table 4. LCD to MSP430 Connections

SLAU595 – October 2014 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) 15

USB (eZ-FET) Power BoosterPack and External

Figure 9. MSP-EXP430FR4133 Power Block Diagram

2.3.1 eZ-FET USB Power

2.3.2 BoosterPack and External Power Supply

16 MSP430FR4133 LaunchPad™ Development Kit (MSP‑EXP430FR4133) SLAU595 – October 2014

2.4 Measure MSP430 Current Draw

2.6 Using the eZ-FET Emulator With a Different Target

• 5 V (if 5 V is needed) • TXD (if the UART backchannel is used)