Data Sheet No.

PD60045-N

IR2103(S)
HALF-BRIDGE DRIVER
Features Product Summary
• Floating channel designed for bootstrap operation
Fully operational to +600V
VOFFSET 600V max.
Tolerant to negative transient voltage
dV/dt immune
IO+/- 130 mA / 270 mA
• Gate drive supply range from 10 to 20V
VOUT 10 - 20V
• Undervoltage lockout
• 3.3V, 5V and 15V logic compatible ton/off (typ.) 680 & 150 ns
• Cross-conduction prevention logic
• Matched propagation delay for both channels Deadtime (typ.) 520 ns
• Internal set deadtime
• High side output in phase with HIN input
• Low side output out of phase with LIN input Packages
Description
The IR2103(S) are high voltage, high speed power
MOSFET and IGBT drivers with dependent high and
low side referenced output channels. Proprietary HVIC 8-Lead SOIC
and latch immune CMOS technologies enable rug- IR2103S
8-Lead PDIP
gedized monolithic construction. The logic input is IR2103
compatible with standard CMOS or LSTTL output,
down to 3.3V logic. The output drivers feature a high
pulse current buffer stage designed for minimum driver cross-conduction. The floating channel can be used to
drive an N-channel power MOSFET or IGBT in the high side configuration which operates up to 600 volts.

Typical Connection
up to 600V

VCC

VCC VB
HIN HIN HO
LIN LIN VS TO
LOAD

COM LO

(Refer to Lead Assignments for correct configuration). This/These diagram(s) show electrical connections only.
Please refer to our Application Notes and DesignTips for proper circuit board layout.

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IR2103(S)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.

Symbol Definition Min. Max. Units

VB High side floating absolute voltage -0.3 625
VS High side floating supply offset voltage VB - 25 VB + 0.3
VHO High side floating output voltage VS - 0.3 VB + 0.3
V
VCC Low side and logic fixed supply voltage -0.3 25
VLO Low side output voltage -0.3 VCC + 0.3
VIN Logic input voltage (HIN & LIN ) -0.3 VCC + 0.3
dVs/dt Allowable offset supply voltage transient — 50 V/ns
PD Package power dissipation @ TA ≤ +25°C (8 Lead PDIP) — 1.0
W
(8 Lead SOIC) — 0.625
RthJA Thermal resistance, junction to ambient (8 Lead PDIP) — 125
°C/W
(8 Lead SOIC) — 200
TJ Junction temperature — 150
TS Storage temperature -55 150 °C
TL Lead temperature (soldering, 10 seconds) — 300

Recommended Operating Conditions

The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential.

Symbol Definition Min. Max. Units

VB High side floating supply absolute voltage VS + 10 VS + 20
VS High side floating supply offset voltage Note 1 600
VHO High side floating output voltage VS VB
V
VCC Low side and logic fixed supply voltage 10 20
VLO Low side output voltage 0 VCC
VIN Logic input voltage (HIN & LIN ) 0 VCC
TA Ambient temperature -40 125 °C

Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip
DT97-3 for more details).

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 IR2103(S)
Dynamic Electrical Characteristics
VBIAS (VCC, VBS) = 15V, C L = 1000 pF and TA = 25°C unless otherwise specified.

Symbol Definition Min. Typ. Max. Units Test Conditions

ton Turn-on propagation delay — 680 820 VS = 0V
toff Turn-off propagation delay — 150 220 VS = 600V
tr Turn-on rise time — 100 170
tf Turn-off fall time — 50 90 ns
DT Deadtime, LS turn-off to HS turn-on & 400 520 650
HS turn-on to LS turn-off
MT Delay matching, HS & LS turn-on/off — — 60

Static Electrical Characteristics

VBIAS (VCC, VBS) = 15V and TA = 25°C unless otherwise specified. The V IN, VTH and IIN parameters are referenced to
COM. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or LO.

Symbol Definition Min. Typ. Max. Units Test Conditions

VIH Logic “1” (HIN) & Logic “0” ( LIN ) input voltage 3 — — VCC = 10V to 20V
V
VIL Logic “0” (HIN) & Logic “1” ( LIN ) input voltage — — 0.8 VCC = 10V to 20V
VOH High level output voltage, VBIAS - VO — — 100 IO = 0A
mV
VOL Low level output voltage, VO — — 100 IO = 0A
ILK Offset supply leakage current — — 50 VB = VS = 600V
IQBS Quiescent VBS supply current — 30 55 VIN = 0V or 5V
IQCC Quiescent VCC supply current — 150 270 µA VIN = 0V or 5V
IIN+ Logic “1” input bias current — 3 10 HIN = 5V, LIN = 0V
IIN- Logic “0” input bias current — — 1 HIN = 0V, LIN = 5V
VCCUV+ VCC supply undervoltage positive going 8 8.9 9.8
threshold
V
VCCUV- VCC supply undervoltage negative going 7.4 8.2 9
threshold
IO+ Output high short circuit pulsed current 130 210 — VO = 0V, VIN = VIH
PW ≤ 10 µs
mA
IO- Output low short circuit pulsed current 270 360 — VO = 15V, VIN = VIL
PW ≤ 10 µs

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IR2103(S)
Functional Block Diagram
VB

Q
HV
LEVEL PULSE R HO
DEAD SHIFT
TIME FILTER S
HIN
PULSE VS
GEN
UV
DETECT VCC
Vcc

LIN
LO
DEAD
TIME

COM

Lead Definitions
Symbol Description
HIN Logic input for high side gate driver output (HO), in phase
LIN Logic input for low side gate driver output (LO), out of phase
VB High side floating supply
HO High side gate drive output
VS High side floating supply return
VCC Low side and logic fixed supply
LO Low side gate drive output
COM Low side return

Lead Assignments

1 VCC VB 8 1 VCC VB 8
2 HIN HO 7 2 HIN HO 7

3 LIN VS 6 3 LIN VS 6

4 COM LO 5 4 COM LO 5

8 Lead PDIP 8 Lead SOIC

IR2103 IR2103S

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 IR2103(S)

LIN
HIN

50% 50%

LIN
ton tr toff tf

90% 90%
HO

LO 10% 10%
LO

Figure 1. Input/Output Timing Diagram

50% 50%

HIN
ton tr toff tf

90% 90%

HO 10% 10%

Figure 2. Switching Time Waveform Definitions

HIN 50% 50%
LIN

90%

HO 10%
DT DT
LO 90%

10%

Figure 4. Deadtime Waveform Definitions

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IR2103(S)

1400 1400

1200 1200

Turn-On Delay Time (ns)

Turn-On Delay Time (ns)

Max.
1000 1000
Max.
800 800

600 600 Typ.

Typ.
400 400

200 200

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) VBIAS Supply Voltage (V)

Figure 6A. Turn-On Time vs Temperature Figure 6B. Turn-On Time vs Supply Voltage

1000 500
Max.
Turn-Off Delay Time (ns)
Turn-On Delay Time (ns

800 400

600 300
Typ.
400 200 Max .

200 100
Ty p.

0 0
0 2 4 6 8 10 12 14 16 18 20 -50 -25 0 25 50 75 100 125
Temperature (oC)
Input Voltage (V)

Figure 6C. Turn-On Time vs Input Voltage Figure 7A. Turn-Off Time vs Temperature

500 1000
Turn-Off Delay Time (ns)

Turn-Off Delay Time (ns

400 800

300 Max . 600

Max.
200 400

Ty p. 200
100
T yp

0 0
10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20
VBIAS Supply Voltage (V)
Input V oltage (V )

Figure 7B. Turn-Off Time vs Supply Voltage Figure 7C. Turn-Off Time vs Input Voltage

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 IR2103(S)

500 500

Turn-On Rise Time (ns)

400
Turn-On Rise Time (ns)

400

300 300
Max.
200 Max. 200

100 100
Typ. Typ.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) VBIAS Supply Voltage (V)

Figure 9A. Turn-On Rise Time Figure 9B. Turn-On Rise Time
vs Temperature vs Voltage

200 200
Turn-Off Fall Time (ns)
Turn-Off Fall Time (ns)

150 150

Max.
100 100
Max.
Typ.
50 Typ. 50

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) VBIAS Supply Voltage (V)

Figure 10A. Turn Off Fall Time Figure 10B. Turn Off Fall Time vs Voltage
vs Temperature

140 0 140 0

120 0 120 0

100 0 100 0
Deadtime (ns)
Deadtime (ns)

Max .
800 Max . 800
Ty p .
600 600
Ty p.
400 400
Min. Min.
200 200
0 0
-5 0 -2 5 0 25 50 75 100 125 10 12 14 16 18 20
Temperature ( oC) VBIAS Supply Voltage (V)

Figure 11A. Deadtime vs Temperature Figure 11B. Deadtime vs Voltage

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IR2103(S)

8 8
7 7
6 6
Input Voltage (V)

Input Voltage (V)

5 5
4 Min. 4 Min.
Min.
3 3
2 2
1 1
0 Temperature (oC) 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) VBIAS Supply Voltage (V)

Figure12A. Logic "1" (HIN) & Logic "0" (LIN) Figure 12B. Logic "1" (HIN) & Logic "0" (LIN)
Input Voltage vs Temperature Input Voltage vs Voltage

4 4

3.2 3.2
Input Voltage (V)
Input Voltage (V)

2.4 2.4

1.6 1.6
Max . Max.
0.8 0.8

0 0
- 50 - 25 0 25 50 75 10 0 12 5 10 12 14 16 18 20
Temperature (oC) Vcc Supply Voltage (V)

Figure 13A. Logic "0"(HIN) & Logic "1"(LIN) Figure 13B. Logic "0"(HIN) & Logic "1"(LIN)
Input Voltage vs Temperature Input Voltage vs Voltage

1 1
High Level Output Voltage (V)
High Level Output Voltage (V)

0.8 0.8

0.6 0.6

0.4 0.4

0.2 Max . 0.2

Max.

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) Vcc Supply Voltage (V)

Figure 14A. High Level Output Figure 14B. High Level Output vs Voltage
vs Temperature

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 IR2103(S)

1 1

Low Level Output Voltage (V)

Low Level Output Voltage (V)

0.8 0.8

0.6 0.6

0.4 0.4

0.2 0.2 Max.

Max .

0 0
- 50 - 25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) Vcc Supply Voltage (V)

Figure 15A. Low Level Output Figure 15B. Low Level Output vs Voltage
vs Temperature

50 0 500
Offset Supply Leakge Current (µA)

Offset Supply Leakge Current (µA)

40 0 400

30 0 300

20 0 200

10 0 100 Max.
Max .

0 0
- 50 - 25 0 25 50 75 10 0 12 5 0 200 400 600 800
Temperature (oC) VB Boost Voltage (V)

Figure 16A. Offset Supply Current Figure 16B. Offset Supply Current vs Voltage
vs Temperature

15 0 150
VBS Supply Current (µA)
VBS Supply Current (µA)

12 0 120

90 90

60 60
Max . Max.

30 30
Ty p. Typ.
0 0
- 50 - 25 0 25 50 75 10 0 12 5 10 12 14 16 18 20
Temperature ( oC) VBS Floating Supply Voltage (V)

Figure 17A. VBS Supply Current Figure 17B. VBS Supply Current vs Voltage
vs Temperature

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IR2103(S)

700 700
VCC Supply Current (µA)

VCC Supply Current (µA)

600 600
500 500
400 400
300 Max. 300 Max.

200 200

100 100
Typ. Typ.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) Vcc Supply Voltage (V)

Figure 18A. Vcc Supply Current Figure 18B. Vcc Supply Current vs Voltage
vs Temperature

30 30
Logic “1” Input Current (µA)
Logic “1” Input Current (µA)

25 25

20 20

15 15
Ma x . Ma x .
10 10
Max
5 5 Ty p .
Ty p .
0 0
-50 -25 0 25 50 75 10 0 12 5 10 12 14 16 18 20

Temperature ( oC) Vcc Supply Voltage (V)

Figure 19A. Logic "1" Input Current Figure 19B. Logic "1" Input Current
vs Temperature vs Voltage

5 5
Logic “0” Input Current (µA)
Logic “0” Input Current (µA)

4 4

3 3

2 2
Max. Max.
1 1

0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature ( oC) Vcc Supply Voltage (V)

Figure 20A. Logic "0" Input Current Figure 20B. Logic "0" Input Current
vs Temperature vs Voltage

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 IR2103(S)
11 11
Max .

VCC UVLO Threshold -(V)

VCC UVLO Threshold +(V)

10 10
Ty p.
Typ. Max.
9 9
Min . Typ.
Typ.
8 8

7 7 Min.

6 6
-50 -25 0 25 50 75 10 0 12 5 -50 -25 0 25 50 75 100 125
Temperature (oC) Temperature (oC)

Figure 21A. Vcc Undervoltage Threshold(+) Figure 21B. Vcc UndervoltageThreshold (-)
vs Temperature vs Temperature

50 0 500
Output Source Current (mA)
Output Source Current (mA)

40 0 400

30 0 Ty p. 300

20 0 200
Typ.
10 0 Min. 100
Min.
0 0
-50 -25 0 25 50 75 10 0 12 5 10 12 14 16 18 20
Temperature ( oC) VBIAS Supply Voltage (V)

Figure 22A. Output Source Current vs Figure 22B. Output Source Current
Temperature vs Voltage

700 700
Output Sink Current (mA)

600
Output Sink Current (mA)

600

500 Ty p . 500

400 400
Typ.
300 300
Min.
200 200
Min.
100 100

0 0
- 50 - 25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) VBIAS Supply Voltage (V)

Figure 23A. Output Sink Current Figure 23B. Output Sink Current
vs Temperature vs Voltage

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IR2103(S)

01-6014
8-Lead PDIP 01-3003 01 (MS-001AB)

INCHES MILLIMETERS
D B DIM
MIN MAX MIN MAX
A 5 F OOT PRINT A .0532 .0688 1.35 1.75
A1 .0040 .0098 0.10 0.25
8X 0.72 [.028]
b .013 .020 0.33 0.51
8 7 6 5 c .0075 .0098 0.19 0.25
6 H D .189 .1968 4.80 5.00
E E .1497 .1574 3.80 4.00
0.25 [.010] A
1 2 3 4 6.46 [.255] e .050 BAS IC 1.27 BAS IC
e1 .025 BAS IC 0.635 BAS IC
H .2284 .2440 5.80 6.20
K .0099 .0196 0.25 0.50
L .016 .050 0.40 1.27
6X e 3X 1.27 [.050] 8X 1.78 [.070] y 0° 8° 0° 8°

e1 K x 45°
A
C y

0.10 [.004]
A1 8X L 8X c
8X b
7
0.25 [.010] C A B

NOT ES: 5 DIMENSION DOES NOT INCLUDE MOLD PROT RUS IONS.
1. DIMENS IONING & T OLERANCING PE R ASME Y14.5M-1994. MOLD PROTRUSIONS NOT T O E XCEED 0.15 [.006].
2. CONT ROLLING DIMENSION: MILLIMET ER 6 DIMENSION DOES NOT INCLUDE MOLD PROT RUS IONS.
MOLD PROTRUSIONS NOT T O E XCEED 0.25 [.010].
3. DIMENS IONS ARE SHOWN IN MILLIME TE RS [INCHES].
7 DIMENSION IS T HE LE NGTH OF LEAD FOR SOLDE RING TO
4. OUT LINE CONF ORMS T O JEDEC OUTLINE MS-012AA.
A SUBS TRAT E.
01-6027
8-Lead SOIC 01-0021 11 (MS-012AA)

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105
Data and specifications subject to change without notice. 5/23/2001

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