7-31k D 07252012 PDF
7-31k D 07252012 PDF
7-31k D 07252012 PDF
WIRING HARNESSES
7-31k Wire Harness Design Task Group
Working Draft
Revision 2
(Design version)
07/24/2012
TABLE OF CONTENTS
1. PURPOSE ................................................................................................................................. 6
1.1 SCOPE ...................................................................................................................................... 6
1.2 CLASSIFICATION ..................................................................................................................... 6
1.3 DEFINITION OF REQUIREMENTS .......................................................................................... 6
1.3.1 HARDWARE DEFECTS AND PROCESS INDICATORS ......................................................... 7
1.3.2 MATERIAL AND PROCESS NONCONFORMANCE................................................................ 7
1.4 MEASUREMENT UNITS AND APPLICATIONS ....................................................................... 8
1.4.1 VERIFICATION OF DIMENSIONS ........................................................................................... 8
1.5 ENGINEERING DOCUMENTATION ........................................................................................ 8
1.6 ORDER OF PRECEDENCE...................................................................................................... 8
1.6.1 CONFLICT ................................................................................................................................. 8
1.6.2 CLAUSE REFERENCES........................................................................................................... 8
1.6.3 APPENDICES............................................................................................................................ 8
1.7 APPROVAL OF DEPARTURES FROM STANDARDS AND REQUIREMENTS...................... 8
1.8 MODIFICATION, REWORK AND REPAIR ............................................................................... 8
1.8.1 MODIFICATION ........................................................................................................................ 9
1.8.2 REWORK................................................................................................................................... 9
1.8.3 REPAIR ..................................................................................................................................... 9
1.1 SCOPE
This document is intended to provide design requirements and technical insight that has been removed
from the acceptance standards for cable and wire harness assemblies. Reference materials listed in this
text are among those considered as required reading. The design engineer is encouraged to obtain
materials referenced in this text, as this text is by no means a comprehensive coverage of design
considerations for all possible end item use application.
1.2 CLASSIFICATION
This document recognizes that electrical wiring harnesses and cable assemblies are subject to
classifications by intended end-item use. Three general end-product classes have been established to
reflect differences in producibility, complexity, functional performance requirements, and verification
(inspection/test) frequency. It should be recognized that there may be requirement overlaps between
classes.
The USER is responsible for defining the product class. The product class should be stated in the
procurement documentation package.
Though not officially recognized as a separate performance classification, a specialized classification for
spaceflight is levied by IPC/WHMA-A-620AS, “Space Applications Electronic Hardware Addendum to
IPC/WHMA-A-620A”. This classification includes products where continued high performance or
performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may
be uncommonly harsh, and the equipment must survive the vibration and thermal cyclic environments
getting to and operating in spaceflight.
Examples:
[A1P2D3] is Acceptable Class 1, Process Indicator Class 2, and Defect Class 3
[N1D2D3] is Requirement Not Establish Class 1, and Defect Classes 2 and 3
[A1A2D3] is Acceptable Classes 1 and 2, and Defect Class 3
[D1D2D3] is Defect for all Classes
A defect for a Class 1 product means that the characteristic is also a defect for Class 2 and 3. A
defect for a Class 2 product means that the characteristic is also a defect for a Class 3 product, but
may not be a defect for a Class 1 product where less demanding criteria may apply.
The word ‘‘should’’ reflects recommendations and is used to reflect general industry practices and
procedures for guidance only.
Line drawings and illustrations are depicted herein to assist in the interpretation of the written
requirements of this standard.
The written requirement always takes precedence over the drawings and illustrations.
It is the responsibility of the USER to define additional or unique defect categories applicable to the
product. It is the responsibility of the SUPPLIER to identify defects that are unique to the assembly
process.
Note: Material and process nonconformance differs from hardware defects or hardware process
indicators in that the material/process nonconformance often does not result in an obvious change in the
hardware’s appearance but can impact the hardware’s performance; e.g., contaminated solder, incorrect
solder alloy (per drawing/procedure).
1.4 MEASUREMENT UNITS AND APPLICATIONS
All dimensions and tolerances, as well as other forms of measurement (temperature, weight, etc.) in this
standard are expressed in SI (System International) units (with Imperial English equivalent dimensions
provided in brackets). Dimensions and tolerances use millimeters as the main form of dimensional
expression; micrometers are used when the precision required makes millimeters too cumbersome.
Celsius is used to express temperature. Weight is expressed in grams.
1.6.1 CONFLICT
a. In the event of conflict between the requirements of this document and the approved assembly
drawing(s)/documentation, the USER approved assembly drawing(s) / documentation shall
[D1D2D3] govern.
b. In the event of a conflict between the text of this document and the applicable documents cited
herein, the text of this document shall [D1D2D3] take precedence.
c. In the event of conflict between the requirements of this document and an assembly drawing(s)/
documentation that has not been USER approved, this document shall [D1D2D3] govern.
d. If no criteria is specified, required, or cited, criteria shall [D1D2D3] be established and agreed upon
between the Manufacturer and USER.
1.6.3 APPENDICES
Appendices to this document shall [D1D2D3] be binding, unless separately and specifically excluded by
the applicable contract, approved drawing(s), or purchase order.
1.8.1 MODIFICATION
Modification changes the functional capability of the affected hardware. Modifications require written
approval from USER and shall [D1D2D3] be fully detailed in the engineering documentation. The
modification of a cable or wire harness assembly shall [D1D2D3] be limited to the revision / rerouting of
circuit interconnections by the interrupting of conductors, the addition and deletion of conductors,
correction of pin-out errors, correction of keying errors, addition of staking, and the addition or deletion of
components in the cable or wire harness assembly (i.e.: a connector, addition / removal of contacts, etc.).
The maximum number of modifications shall not [D1D2D3] exceed six (6) per electrical wiring harness or
cable assembly.
1.8.2 REWORK
Rework corrects minor assembly and workmanship non-conformances to bring the affected hardware into
conformance to the engineering documentation / drawing. Though rework is usually permissible without
Material Review Board (MRB) involvement, or notification and approval from the USER, it is
recommended that all rework be documented to provide an opportunity for development of corrective
action to reduce future rework and production costs.
All rework shall [D1D2D3] meet the workmanship requirements of the applicable design specifications.
1.8.3 REPAIR
Repair restores the functional capability of the affected hardware. However, depending on the severity of
the damage, the repair may (or may not) return the affected hardware to full conformance to the
engineering documentation / drawing. Repairs are only permitted following review and disposition by a
Material Review Board (MRB), and authorization to repair shall [D1D2D3] require approval from the
USER prior to the start of actual repair procedures.
Solder Thermal Cycles. The maximum number of solder repairs to any one joint shall not [D1D2D3]
exceed three (3) complete cycles (desolder and resolder).
The maximum number of repairs shall not [D1D2D3] exceed three (3) per electrical wiring harness or
cable assembly.
2. APPLICABLE DOCUMENTS
The following documents form a part of this standard to the extent specified herein.
2.1 SPECIFICATIONS
Aerospace
AIR1329B ........................... Compatibility of Electrical Connectors and Wiring
AIR4487A .......................... Investigation of Silver Plated Conductor Corrosion (Red Plague)
AIR4789B .......................... Evaluating Corrosion Testing of Electrical Connectors and Accessories for
the Purpose of Qualification
AIR5468B .......................... Ultraviolet (UV) Lasers for Aerospace Wire Marking
AIR5558 ............................ Ultraviolet (UV) Laser Marking Performance of Aerospace Wire
Constructions
AIR5575 ............................. Hot Stamp Wire Marking Concerns for Aerospace Vehicle Applications
AIR5717 ............................ Mitigating Wire Insulation Damage During Processing and Handling
AMS2491D ........................ Surface Treatment of Polytetrafluoroethylene, Preparation for Bonding
AS4373E ........................... Test Methods for Insulated Electric Wire
AS5382 .............................. Aerospace Cable, Fiber Optic
AS5649 .............................. Wire and Cable Marking Process, UV Laser
AS7928B ........................... Terminals, Lug: Splices, Conductor: Crimp Style, Copper, General
Specification For
AS22759.............................. Wire, Electric, Fluoropolymer-Insulated Copper or Copper Alloy (/11, /89B,
/90B, 91B, /92B)
AS83519B ......................... Shield Termination, Solder Style, Insulated, Heat-Shrinkable, Environment
Resistant, General Specification For (/1, /2)
AS9100C ........................... Quality Management Systems - Requirements for Aviation, Space and
Defense Organizations
Commercial
A-A-52083C ...................... Commercial Item Description, Tape, Lacing and Tying, Glass
A-A-59569B ....................... Commercial Item Description, Braid, Wire (Copper, Tin-Coated, Silver-
Coated, or Nickel Coated, Tubular or Flat)
IPC/WHMA-A-620AS ........ Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A
J-STD-001ES .................... Space Applications Electronic Hardware Addendum to IPC J-STD-001E
Requirements for Soldered Electrical and Electronic Assemblies
J-STD-004A ...................... Requirements for Soldering Fluxes
J-STD-006B ...................... Requirements for Electronic Grade Solder Alloys and Fluxed and Non-
Fluxed Solid Solders for Electronic Soldering Applications
ANSI/NEMA WC 27500 .... Standard for Aerospace and Industrial Electrical Cable
ASTM B-174 ...................... Bunch Strand
ASTM B 8 .......................... Concentric Strand
ASTM B 172-01a ............... Standard Specification for Rope-Lay-Stranded Copper Conductors Having
Bunch- Stranded Members, for Electrical Conductors
ASTM B 173-01a ............... Standard Specification for Rope-Lay-Stranded Copper Conductors Having
Concentric-Stranded Members, for Electrical Conductors
ASTM B 263-04 ................. Standard Test Method for Determination of Cross-Sectional Area of
Stranded Conductors
ASTM B 738-03 ................. Standard Specification for Fine-Wire Bunch-Stranded and Rope-Lay
Bunch-Stranded Copper Conductors for Use as Electrical Conductors
Federal
NASA PUBLICATION 1124 Outgassing Data for Selecting Spacecraft Materials
(http://outgassing.nasa.gov)
NASA-STD-6001 ............... Flammability, Odor, Offgassing, and Compatibility Requirements and Test
Procedures for Materials in Environments That Support Combustion
QQ-B-575 ........................... Braid, Wire Copper, Tin-Coated Tubular
Military
MIL-A-46146B ................... Adhesives-Sealants, Silicone, RTV, Noncorrosive (For Use With Sensitive
Metals and Equipment)
MIL-C-17G .......................... Cables, Radio-Frequency, Coaxial, Dual Coaxial, Twin Conductor, and
Twin Lead
MIL-C-27500 ....................... Cable, Electrical Shielded and Unshielded, Aerospace
MIL-C-39012 ....................... Connector, Coaxial, Radio-Frequency, General Specification for
MIL-DTL-17 ....................... Detail Specification, Cables, Radio Frequency, Flexible And Semi-rigid.
General Specification For
MIL-I-631D ........................ Insulation, Electrical, Synthetic-Resin Composition, Non-Rigid
MIL-I-22129 ......................... Insulation Tubing, Electrical, Polytetrafluorethylene (PTFE) Resin, Non-
Rigid
MIL-I-23053 ......................... Insulation Sleeving, Electrical, Heat Shrinkable, General Specification for
MIL-STD-202G .................. Test Method Standard, Electronic and Electrical Component Parts (Method
107, Test Condition B)
MIL-T-43435 ........................ Tape, Impregnated, Lacing, and Tying
MIL-W-22759 ...................... Wire, Electric, Fluoropolymer-Insulated Copper or Copper Alloy
3. DESIGN PHILOSOPHY
Cables and wiring harnesses are equivalent to the
human circulatory and nervous system. They deliver
energy, transmit command and control instructions,
and collect and distribute sensory data describing not
only the environment external to the system, but the
health and status of the system itself.
Conditions that contribute to degradation of performance and/or reliability of hardware in service shall
[D1D2D3] require special consideration.
The selection and control procedures shall [D1D2D3] emphasize quality and reliability to meet the
mission requirements and to minimize total life-cycle costs. An additional objective in the selection of
parts, materials, and processes shall [D1D2D3] be to maximize commonality and thereby minimize the
variety of parts, related tools, and test equipment required in the fabrication, installation, and maintenance
of the hardware.
Whenever a selected specification provides more than one (1) characteristic or tolerance for an item, the
SUPPLIER shall [D1D2D3] use items of broadest characteristics in the equipment and of the greatest
allowable tolerances that will fulfill the performance and reliability requirements of the design. When
acceptable items of higher than minimum quality are readily available, the utilization of which would not
increase the life cycle costs, may be used. When maximum physical dimensions of an item are indicated
in the selected specification for the item, all new equipment shall [D1D2D3] be designed to
accommodate the maximum physical size specified, so that all parts having the same type designation
will be physically interchangeable in the hardware.
4.1.2.1 FLAMMABILITY
Insulation materials shall [D1D2D3] be non-combustible or self extinguishing. Selection and use shall
[D1D2D3] be traceable to acceptable flammability test reports. When no test report exists, flammability
testing shall [D1D2D3] be performed using the procedure of NASA-STD-6001, previously NHB 8060.1C
(Flammability, Odor, Offgassing, and Compatibility Requirements and Test Procedures for Materials in
Environments that Support Combustion), or as otherwise specified by the USER.
4.1.2.2 OUTGASSING
Nonmetallic materials shall not [D1D2D3] exceed 1% Total Mass Loss (TLM) or 0.1% Collected Volatile
Condensable Material (CVCM), when tested in accordance with ASTM-E595 (Test Method, Outgassing).
Cleanliness shall [D1D2D3] be an ongoing effort. Practices shall [D1D2D3] include assembly in a clean
environment and the use of protective plastic sheeting or other coverings over cables and harness
assemblies not undergoing active assembly.
Interconnecting cable and harness assemblies shall [D1D2D3] be clean and free of contamination prior
to installation.
Signal Level
Circuit Character Category Shielding
Volts (V) or Amperes (A)
≥ 10 V Ia None
Electro-explosive (EED)
Bridge Wire Activated All IV Each pair double-shielded
Device (BWAD)
5.1.1 CATEGORY I (POWER AND CONTROL)
Includes (a) DC circuits over 10V; (b) DC circuits below 10V and over 5 A; (c) AC circuits below 0.1 MHz
with voltages above 25 Vrms; and, (d) pulse circuits with maximum voltages above 25V with rise and fall
times greater than 1 microsecond.
Notes:
1. Grounding is designed to ensure USER safety, proper operation of electrical fault avoidance /
detection systems, and electromagnetic interference reduction by establishing a minimum series
impedance path between the electrical equipment and the ground plane.
2. A ground is used to establish a zero signal reference for any equipment or other item required to be
grounded.
Shielding shall [D1D2D3] be added over that specified for the category of each to the extent required
when an electromagnetic pulse (EMP) environment is specified. Shielded circuits may be routed together
in a bundle with a common secondary (overbraid) shield.
TABLE 5.2.6 BOND CLASSIFICATION
≤ 2.5 milliohm* (2.5mΩ) at the frequencies ≤ 2.5 milliohm* (2.5mΩ) at the frequencies
of interest, Z=R+iωL of interest, Z=R+iωL
A • May be any low impedance value deemed • May be any low impedance value deemed
appropriate by engineering design for the appropriate by engineering design for the
particular application. particular application.
Max. Resistance = Max Voltage Drop / Max Max. Resistance = Max Voltage Drop / Max
Current Current
• Max. Voltage Drop: <3.5% (28V system, ≤ • Max. Voltage Drop: <3.5% (28V system, ≤
1V; 120V system, ≤ 4V) 1V; 120V system, ≤ 4V)
• Not allowed in most NASA programs to • Not allowed in most NASA programs to
C prevent structural damage / galvanic prevent structural damage / galvanic
corrosion to vehicle structure, unintentional corrosion to vehicle structure, unintentional
heating, electrical interference, potential heating, electrical interference, potential
shock hazards to crew. shock hazards to crew.
• Cable / harness shield shall not be used as • Cable / harness shield shall not be used as
the intentional power return path. the intentional power return path.
0.1 ohm max from exposed equipment 0.1 ohm max from exposed equipment
chassis or cable tray to structure chassis or cable tray to structure
H • The fault current return path through • The fault current return path through
structure: 500% overload current , 0.5s structure: 500% overload current , 0.5s
• Cable / harness shields • Cable / harness shields
≤ 2.5 milliohm (≤2.5mΩ) at 200,000 Amperes ≤ 2.5 milliohm (≤2.5mΩ) at 200,000 Amperes
• Design to route lightning across outer • Design to route lightning across outer
surface – not penetrate. surface – not penetrate.
L • Bond strap / conductor terminations shall • Bond strap / conductor terminations shall
not be soldered not be soldered
• Bond straps will withstand the magnetic • Bond straps will withstand the magnetic
forces from the current they conduct. forces from the current they conduct.
≤ 2.5 milliohm (2.5mΩ) at the frequencies of ≤ 2.5 milliohm (2.5mΩ) at the frequencies of
interest, Z=R+iωL interest, Z=R+iωL
R • Bond straps should be flat with length to • Bond straps should be flat with length to
width ratio less than 5:1 width ratio less than 5:1
• Covers wide frequency ranges. • Covers wide frequency ranges.
< 1 Ohm: Conducting Structural Items < 1 Ohm: Conducting Structural Items
(>100cm2) (>100cm2)
S • < 1000 Ohm: Conductive Mechanical • < 1000 Ohm: Conductive Mechanical
Subassemblies / Parts (>100cm2) Subassemblies / Parts (>100cm2)
• < 1000 Ohm: Non-metallic / Composite • < 1000 Ohm: Non-metallic / Composite
Structural Items Structural Items
Conditions that contribute to degradation of performance and/or reliability of hardware in service shall
[D1D2D3] require special consideration.
6.1 RELIABILITY
The reliability design requirements shall [D1D2D3] assure that the overall reliability requirements are met
under the most severe extremes of acceptance testing, storage, transportation, testing, and operational
environments.
6.2 INTERCHANGEABILITY
Any two (2) or more wiring harnesses or cable assemblies bearing the same part number shall [D1D2D3]
possess such functional and physical characteristics as to be equivalent in performance, durability, and
connectivity; and, shall [D1D2D3] be capable of being changed, one for another, without alteration of the
items themselves or of adjoining items.
6.5.1 DATUM
Wire harness length and/or breakout length, shall [D1D2D3] be measured from the connector face at one
end of the wire harness (datum) to its final termination and/or breakout point. (i.e. connector face,
terminals, splice, etc.).
6.5.2 BREAKOUTS
Dimensions for breakouts shall [D1D2D3] be referenced from the approximate center-line of the harness
/ breakout.
6.5.3 TOLERANCE
Cable length measurement tolerance shall be as specified in IPC/WHMA-A-620A, Table 11-1 “Cable
Length Measurement Tolerance”, unless otherwise on the drawing / documentation. If the engineering
drawing has multiple dimensions called out between a connector and termination, breakout, or overall
length, the tolerances shall [D1D2D3] be considered noncumulative and will be applied to the sum of the
dimensions (entire length to the termination point), not each individual dimension.
For the purposes of form layout board layout only, the recommended acute angle of the breakouts from
the main body of the harness is 45 +/-15 degrees, unless shown otherwise on the drawing. For the
purposes of form board layout, breakouts that branch away from the main body of the harness do not
have to be routed straight but may be curved, provided the curves do not exceed the minimum bend
radius requirements.
Cable Type
Semi-rigid Coax Not less than Manufacturer’s stated minimum bend radius
Harness assembly Minimum bend radius of largest gauge individual wire/cable within the
harness.
Breakouts Minimum bend radius of largest gauge individual wire/cable within the
harness.
Note 1: OD is the outer diameter of the wire or cable, including insulation.
Note 2: Coaxial Fixed Cable: Coaxial cable that is secured to prevent movement; not expected to have the cable repeatedly
flexed during operation of the equipment.
Note 3: Coaxial Flexible Cable: Coaxial cable that is or may be flexed during operation of the equipment.
6.9 BREAKOUTS
The location of breakouts shall [D1D2D3] be specified on the design documentation.
a. Bend radius at breakout. Breakouts shall [D1D2D3] meet the bend radius requirements as specified
in Table 6.8.1.
b. Forming and Support. Breakouts shall [D1D2D3] be formed into a twisted or parallel lay bundle, and
secured with spot tie, plastic strap, or stitch lacing within two harness diameters (2d) immediately
following their emergence from the main bundle. and within 2 breakout harness diameters (2d) after
emergence from the trunk bundle.
Exceptions:
1. Power harnesses where the size of individual wires shall [D1D2D3] be a minimum of 18 AWG.
2. Thermistor wiring where wire sizes smaller that 24 AWG may be considered for use.
6.15.1 DERATING
Wire and cable shall [D1D2D3] be of a type suitable for the intended application, and shall [D1D2D3] be
selected so that the rated maximum conductor temperature is not exceeded for any combination of
electrical loading, ambient temperature, and heating effects of bundles, conduit and other enclosures.
If the wiring used in any application is unknown, as it may be in the case of off-the-shelf equipment, pig-
tailed components, heater strips, etc. and if the application is non-critical, the assembly is required only to
meet applicable program materials and process requirements.
6.16 CONNECTORS
Connectors used in the fabrication of wire harnesses and cable assemblies shall [D1D2D3] be suitable
for the application. Connectors shall [D1D2D3] be specifically designed and approved for mating and
demating in the existing environment under the loads being carried, or connectors must not be mated or
demated until voltages have been removed (dead-faced) from the powered side(s) of the connectors.
a. Wire harness connectors shall [D1D2D3] be of the rear insertable / removable crimp contact and
quick disconnect type, where feasible.
b. Connector Pins/Sockets. The powered side of a connector pair shall [D1D2D3] be terminated in
sockets rather than pins and shall [D1D2D3] have a grounded backshell.
c. When mating/demating recessed / blind connectors (e.g., connectors that will be hidden from sight
during mate/demate), the connector design shall [D1D2D3] be scoop-proof and maintain grounding
during mating/demating.
d. Designs that are reconfigured such that their fault bond circuit is disturbed during mate/demate
operations, shall [D1D2D3] require either redundant fault bonds to grounded structure or a post-
installation test to verify a good fault bond has been established prior to power activation.
e. Connectors to be used in an EMP or high-level RF environment shall [D1D2D3] be capable of
incorporating RF finger stock at the connector-receptacle interface to provide for shield continuity and
shall [D1D2D3] be mechanically capable of being subjected to the coupling nut torque.
f. Connectors that are not self-locking shall [D1D2D3] be safety wired.
g. High Voltage. Circuits carrying potentials in excess of 200VAC rms, or 300VDC through critical
pressure environments shall [D1D2D3] be terminated in single-contact, high voltage connectors. If
the design requires that high voltage circuits be terminated in multi-contact connectors, contacts shall
[D1D2D3] be selected which are the most distant from ground potentials. Shielded wire should not
be used in high voltage circuits unless required by special designs. High voltage connectors must be
kept free of any contamination which would decrease the voltage flashover characteristics.
h. High Power. Connector interfaces categorized as high-power shall [D1D2D3] have one verifiable
upstream inhibit which removes voltage from the connector prior to mate/demate. The design shall
[D1D2D3] provide for verification of the inhibit status at the time the inhibit is initiated.
Note: High-power connector interfaces are those that do not limit the short circuit outputs to 16 W or
less, or have an open-circuit output voltage of greater than 32 V.
Electrical connectors and wiring junctions to connectors which are not hermetically sealed or otherwise
positively protected against moisture shall not [D1D2D3] be cooled below the dew point of the
surrounding atmosphere.
The protective covers or caps shall [D1D2D3] have the following characteristics:
a. Provide protection from moisture for the plugs and receptacles
b. Provide protection against damage to sealing surfaces, threads, and pins
c. Be made of conductive or dissipative materials that provide electrostatic discharge (ESD) protection
of components.
d. Be resistant to abrasion, chipping, or flaking.
e. Be positively marked by bright colors or streamers if they are to be removed prior to flight / launch.
f. Be maintained at a level of cleanliness equivalent to the plugs or receptacles on which they are used.
g. Be made of material that is compatible with the connector material.
h. Be made of a material that does not contaminate the connector (i.e.: outgassing / offgassing, etc.).
i. Be provided with restraining devices or suitable storage areas if required for on-orbit activities.
Pressure-sensitive tape shall not be used to satisfy this requirement.
6.18.1 SPLICES
The use of splices shall [D1D2D3] be minimized as much as possible, and should only be considered
where the use of a connector is not practicable or would reduce reliability; and/or, where the use of a
splice can optimize complicated wiring when the harness must support branch circuits or parallel-
connected devices, or where use of a splice facilities installation (i.e.: joining harness sections /
branches).
a. The splice termination shall not [D1D2D3] be located in a flexure zone and shall [D1D2D3] be
provided acceptable stress relief. Splices shall not [D1D2D3] be located in breakout / branch areas.
b. Extra care should be exercised with harnesses and cables that have splices so that they are
protected from abrasion, cold flow, cut through, vibration, chafing, flexing, sharp edges and excessive
handling.
c. For applications involving the mass splicing of conductors in a harness, the splices shall [D1D2D3]
be staggered along the length of the harness to minimize the final cross-sectional profile.
d. Splices shall [D1D2D3] be completed with conductors that are properly sized to safely accommodate
the power load expected, at the recommended derating.
e. The completed splice termination and any exposed metallization shall [D1D2D3] be over-sleeved
with transparent / translucent heat shrink tubing extending a minimum of 5.1mm (0.2 inch) beyond
any exposed metal. For mission critical harnesses incorporating splices, two layers of shrink sleeving
shall [D1D2D3] be used over the splice area. Splices shall [D1D2D3] be wrapped with protective
tape to prevent cold flow of adjacent wiring and possible abrasion of shrink sleeving over the splice
area.
Examples of splices demonstrated to be acceptable for high-reliability and space flight applications
designs are listed in Table xxxxx. It is the engineer’s responsibility to choose the splice most suitable to a
specific application.
6.18.2 DEAD-ENDING
Undesignated wires shall [D1D2D3] be dead-ended with AS25274 caps or with insulation sleeving in
compliance with IPC/WHAM-A-620, and in a manner acceptable to the USER. Dead-ending shall
[D1D2D3] be located within 101-152 mm [4-6 in.] of connectors, breakouts, or bulkhead feed-through
bushings. Dead-ending shall not [D1D2D3] be located under mounting clamps.
a. The identification code should be printed to read horizontally from left to right or vertically from top to
bottom. The characters shall [D1D2D3] be legible and permanent and the method of identification
shall [D1D2D3] not impair the electrical or mechanical characteristics of the wiring.
b. When it is not possible to print directly upon a wire or electrical / optical cable, an identification marker
(i.e.: heat shrinkable sleeving, tape, etc.) shall be placed on the external surface, at each end within
12 inches or before the first clamp (whichever is less), and at intervals not greater than 3 feet. The
marker shall [D1D2D3] not be used as an electrical insulating device.
c. Short electrical wires and electrical / optical cables less than 6 inches in length need not be identified,
but shall [D1D2D3] be completely identified on the drawing.
d. Wire(s) for which the identifications are reassigned after installation may be re-identified by markers
at each termination, but do not need to be re-identified throughout its length.
e. Optical Cable. Optical cable shall [D1D2D3] be uniquely color coded to facilitate identification.
When unidirectional or helical wire twist (lay) is not required, discrete wires or cables may be laid parallel
to each other with minimal cross-over before tying into bundles. Harness assemblies requiring preformed
bends using this assembly technique shall [D1D2D3] be constructed on a 3-D form board. Minimum
bend radius requirements shall [D1D2D3] be observed when constructing preformed bends.
a. Constructing Twisted Pair. When constructing twisted pairs by the twisting of single conductors is
specified by engineering drawings, the twist operation should produce a uniform twist pattern. The
single conductors defined for twisting by the engineering drawing shall [D1D2D3] be twisted in pairs
only and the twist shall [D1D2D3] run throughout the length of the harness or the length of the signal
run in the harness (i.e., from connector to connector, to splice, etc....).
b. Twisted Pair. Wires that are twisted by design, such as twisted wire pairs or triplets, shall [D1D2D3]
be treated as a single cable (do not untwist). Run all wires and cable in parallel when routing under a
backshell clamp.
c. Parallel or Straight Wire Lay. A wiring harness or cable assembly may be fabricated with a parallel or
straight wire lay for that portion of the wiring harness or cable assembly which is permanently
installed, and which is not subject to movement after installation.
9.1 DEFINITIONS
Accessories Mechanical devices, such as cable clamps or backshells, added to
connector bodies.
Adapter An intermediate device to provide for attaching special accessories or
to provide special mounting means.
Barrel (Contact Wire Barrel) The section of contact that accommodates the stripped conductor.
The radius of a formed bend, either temporary or permanent,
Bend Radius measured in multiples of cross-sectional diameters, to which a
component lead, conductor, cable (metallic, fiber, hybrid), harness
(metallic, fiber, hybrid), optical fiber, or wire, can be bent without
inducing permanent damage or reduction in performance, power, or
reliability.
A nonionic substance does not form free ions, nor increase the water's
conductivity. Ionic contaminants are usually processing residue such
as flux activators, finger prints, and etching or plating salts.
Crimp The physical compression (deformation) of a contact barrel around a
conductor to make an electrical and mechanical connection to the
conductor.
Crimping A method of mechanically compressing or securing a terminal, splice,
or contact to a conductor.
Drain Wire A wire that runs linearly along a foil shield wire or cable and is used to
make contact with the shield. Grounding of foil shields is done with
drain wires.
Electromagnetic Interference The unwanted intrusion of electromagnetic radiation energy
(EMI) whose frequency spectrum extends from subsonic frequency to X-rays.
Ferrule A short metal tube used to make crimp connections to shielded or
coaxial cables.
Grommet An insulator that covers sharp edges of holes through panels and
partitions to protect wire insulation from cut-through damage.
Harness One or more insulated wires or cables, with or without helical twist;
with or without common covering, jacket, or braid; with or without
breakouts; assembled with two or more electrical termination devices;
and so arranged that as a unit it can be assembled and handled as
one assembly.
Insertion Tool A device used to install contacts into a contact cavity in a connector
insert.
Interfacial Seal A sealing of mated connectors over the whole area of the interface to
provide sealing around each contact.
Jacket The outermost layer of insulating material of a cable or harness.
Joint A termination.
Key A mechanical device or feature in addition to, or in lieu of, a
Keying polarization feature that ensures the coupling of identical connectors /
components can occur in only one orientation and only to similar keyed
connectors / components.
Lay The twist (helical) pattern of wire stands in a stranded wire, insulated
wires in a cable, or insulated wires and cables in a harness assembly.
Length of lay The axial length of one complete turn of the wiring helix.
Mate The mechanical and electrical joining of two connectors
Minimum Electrical Spacing The minimum allowable distance between adjacent non-common
conductors or conductive surfaces (i.e.: mounting hardware, brackets,
metal-cased components, etc.), at a given voltage and altitude, that is
sufficient to prevent dielectric breakdown, corona, or both, from
occurring between the conductors.
Mission Essential Support Equipment used in a closed loop within the system, where the failure of
Equipment this equipment would degrade the mission or imperil personnel. This
category includes items of ground support equipment whose functions
are necessary to support the pre-countdown and countdown phases,
whose failure can create a safety hazard, cause damage to flight
hardware, or create an inability to detect a problem in the flight
hardware.
Moisture Barrier Bag (MBB) A bag used to package moisture-sensitive devices (MSD) that is
electrostatic discharge (ESD) safe and is designed to restrict the
ingress of water vapor.
Molding The process of creating a defined shape or pattern by shaping pliable
raw material (i.e.: epoxy, plastic, etc.) using a reusable, rigid frame,
pattern, or mold/casting. Molding is typically used to create sealed and
environmentally resistant (ER) connector assemblies. The mold /
casting is removed, cleaned, and reused once the curing process is
complete.
Offgassing The release of a volatile part(s) from a substance when placed in a
vacuum environment that may affect crew members.
Orbital Replaceable Unit Hardware assemblies / sub-assemblies designed to allow removal and
(ORU) replacement during microgravity flight.
Outgassing The release of a volatile part(s) from a substance when placed in a
vacuum environment.
Potting The process of filling of a connector backshell, shape/shell with a
material that excludes moisture and provides stress relief. The
connector backshell or a potting shape/shell typically remains a part of
the assembly once the curing process is complete.
Protoflight A test program intended to combine the objectives of the qualification
and acceptance test programs; i.e. design confidence for use in the
service environments and adequate workmanship/quality. All
protoflight components, assemblies, and flight elements are intended
for subsequent flight use. The protoflight approach uses reduced test
levels, cycles, and/or duration from the standard qualification test
requirements, to allow the protoflight tested hardware to be used for
flight.
Number: Revision
A-1
RED PLAGUE CONTROL PLAN (RPCP)
Page Date:
1 of 1
STATEMENT OF STANDARD
Red Plague (cuprous / cupric oxide corrosion) can develop in silver-coated copper (SCC), silver-coated
copper-alloy (SCA), and silver-coated ultra-high strength copper alloy (SCU) wire and cable when a
galvanic cell forms between the copper base metal and the silver coating in the presence of moisture
(H2O) and oxygen (O2). Once initiated, the sacrificial corrosion of the copper base conductor can
continue indefinitely in the presence of oxygen (O2). The color of the corrosion by-product (cuprous oxide
crystals) may vary depending on the amount of oxygen available, but is commonly noted as a red /
reddish-brown discoloration on the silver plating surface – hence the term “Red Plague”.
SCC1 / SCA1: Silver-Coated Copper (SCC1) and Silver-Coated Copper-Alloy (SCA1) primary and shield
conductors shall [D1D2D3] have a coating thickness of not less than 2 micron (~80 micro-inches) average,
when measured in accordance with ASTM B 298-07. After stranding, the coating thickness on each of the
individual conductor strands shall not [D1D2D3] be less than 1 micron (~40 micro-inches) when inspected
using micro-section analysis in accordance with ASTM B 961-08.
SCU: Silver-Coated Ultra-High-Strength Copper-Alloy (SCU) primary and shield conductors shall
[D1D2D3] have a coating thickness of not less than 1 micron (~40 micro-inches) when measured in
accordance with ASTM B 298-07.
1. The silver coating shall [D1D2D3] exhibit a non-porous, smooth, and continuous finish with no evidence
of lumps, kinks, splits, scrapes, corrosion, contamination, or exposed base material after stranding. The
continuity (non-porosity) of the coating shall [D1D2D3] be determined on representative samples by the
sodium polysulfide test, in accordance with ASTM B 298–07.
2. Micro-section inspections shall [D1D2D3] be in accordance with ASTM-B961 except that the coating
thicknesses specified herein shall [D1D2D3] be in effect. When required by the USER, photographs
shall [D1D2D3] be captured and saved as proof of inspection. The magnification scale of photographs
shall [D1D2D3] be identified.
3. Micro-section analysis shall [D1D2D3] be performed by a lab certified to IPC-QL-653A, or as agreed
upon by the USER.
4. All wire and cable shall [D1D2D3] have full lot traceability and manufacturer’s test reports, certified by
the Government Source Inspector (GSI). Test reports, and all tested and untested micro-section
analysis coupons, shall [D1D2D3] be delivered to the USER as part of the procurement.
Note:
Silver is highly susceptible to attack by contaminants present in the atmosphere and common “green”
packaging materials. Paper wrapping materials, rubber bands, and cardboard boxes should be avoided
because such materials contain and outgas small amounts of sulfur.
(ref.: MIL-HDBK-338B [11.4.1])
A.1.5.2. ASSEMBLY
All assembly processes, including Receiving Inspection and Kitting, shall [D1D2D3] be conducted in an
environmentally-controlled and monitored area where dew point is not attained and the relative humidity is
less than 70%RH.
1. Wire and cable shall [D1D2D3] not be removed from its protective packaging until it has reached
thermal equilibrium with the assembly environment to reduce the risk of condensation formation.
2. Unused Wire. Prior to returning wire back to storage, wire ends shall [D1D2D3] be capped to prevent
diffusion of air and water vapor into the wire through open ends, and stored in water-vapor-proof
packaging per 4.4.1, or in an environmentally-controlled and monitored area where dew point is not
attained and the relative humidity is less than 70%RH.
3. Wiring, cable, and harness assemblies that are not being actively worked on shall [D1D2D3] be stored
in water-vapor-proof packaging per 4.4.1, or in an environmentally-controlled and monitored area where
dew point is not attained and the relative humidity is less than 70%RH.
4. Completed cable and harness assemblies shall [D1D2D3] be stored in water-vapor-proof packaging
per 4.4.1, or stored in an environmentally-controlled and monitored area where dew point is not attained
and the relative humidity is less than 70%RH, until ready for installation.
5. Aqueous solvents and cleaning systems shall [D1D2D3] not be used.
1. Magnification. Magnification power for visual inspection shall [D1D2D3] be based on the inspection
activity or conductor size, per J-STD-001E. For wire and cable with mixed conductor sizes, the greater
magnification may be used for the entire inspection. The tolerance for magnification aids is ± 15% of the
selected magnification power. Magnification aids should be maintained and calibrated as appropriate
(see IPC-OI-645).
2. Illumination. Illumination intensity on the surface being inspected shall [D1D2D3] be at least 1000
lm/m2 (~93 foot-candles). The light source type shall [D1D2D3] be as specified by engineering
documentation.
A.2.2 ACCEPTANCE
Wire and cable that has been accepted shall [D1D2D3] be stored in water-vapor-proof packaging per 4.4.1,
or stored in an environmentally-controlled and monitored area where dew point is not attained and the
relative humidity is less than 70%RH.
A.4 NON-CONFORMANCE
Non-conformance to any of the above requirements shall [D1D2D3] require:
1. Immediate rejection and segregation of the wire, cable and/or harness assemblies from stock and
production.
2. Relocation to a dry area or otherwise protected (i.e.: placed in a nitrogen-purged dry box, MBB, etc.) to
prevent continued environmental damage.
3. Disposition by the appropriate Material Review Board (MRB).
4. Non-conformances dispositioned other than scrap shall [D1D2D3] be approved by the USER.
A.5 CAPPING
Capping provides a simple and effective environmental barrier to oxygen and moisture contamination of the
cut / exposed ends of silver-coated copper wire and cable by sealing the cut / exposed ends of the wire /
cable with double-wall (melt-liner) heat shrinkable tubing or preformed end cap, or by dip coating with Red
“GLPT” Insulating Varnish.
Acronym Definition
GSI Government Source Inspector
i-HIC Irreversible Humidity Indicator Card
SCA Silver-Coated Copper-Alloy, 1 micron (~40 micro-inches)
SCA1 Silver-Coated Copper-Alloy, 2 micron (~80 micro-inches)
SCC Silver-Coated Copper, 1 micron (~40 micro-inches)
SCC1 Silver-Coated Copper, 2 micron (~80 micro-inches)
SCU Silver-Coated Ultra-High Strength Copper Alloy
GLOSSARY OF TERMS
Term Description
REMARKS
APPENDIX B - PROHIBITED MATERIALS
Beryllium (Be) Beryllium shall not [D1D2D3] not be used for primary structural applications or
as an alloying constituent exceeding 4% (percent) by weight. Beryllium is
allowed as an alloying constituent up to a maximum of 4% (percent) by weight.
Cadmium (Cd) Cadmium and cadmium plating in electrical connectors, cables, wiring harness
assemblies, and mechanical fasteners shall not [D1D2D3] be used where
exposure to elevated temperatures and reduce atmospheric pressures could
cause sublimation (vaporization) and deposition of cadmium on optical or
electrically energized surfaces.
Rationale
There are several reasons for prohibiting the use of Cadmium plating in space
flight electronic systems.
1. Cadmium has the ability to sublimate (vaporize), if exposed to temperatures
in excess of +75 °C (+167 °F), and reduced atmospheric pressure or
vacuum. This temperature is well under the rated temperatures of
approved wire insulations thereby reinforcing the need for a cadmium
prohibition as today’s wire gauge selections often take advantage of
insulation temperature tolerances. The resulting toxic, heavy-metal vapor
can be inhaled by crewmembers, or condense onto surfaces as a thin,
electrically conductive layer, impacting the performance of electrical circuits
and optical systems.
2. Cadmium plating on tool surfaces can be transferred to the surfaces of
hardware and fasteners.
3. Cadmium is subject to the spontaneous growth of Cadmium whiskers. The
propensity of Cadmium to grow whiskers appears to be lower than that of
zinc and especially tin. Cadmium whiskers (like tin whiskers) grow
spontaneously and are capable of causing electrical failures ranging from
parametric deviations to sustained plasma arcing that can result in
catastrophic short circuits.
Recommendations
Cadmium plating is commonly used on connectors, connector hardware and
mechanical hardware such as fasteners. It provides excellent resistance to salt
corrosion and is therefore offered in many military specifications predominantly
for use in naval applications. However, most applications are not concerned
with salt corrosion and the risks associated with use of Cadmium plating noted
above outweigh the benefits of its use.
There are several alternatives to Cadmium plating that are suited for spaceflight
use:
1. For connectors, electroless nickel plating is preferred. Gold plating is
preferred when the application requires additional shielding effectiveness,
improved electrical conductivity in RF applications, or where low residual
magnetism is desired.
2. Passivated stainless steel is the preferred material for hardware items such
as fasteners.
When solutions containing other glycols (aliphatic dihydric alcohols) are used in
these conditions, testing shall [D1D2D3] be conducted to determine if the same
spontaneous ignition reaction can occur as with ethylene glycol and propylene
glycol, and a silver chelating agent shall [D1D2D3] be added to the solution if
ignition can occur.
Magnesium (Mg) Magnesium alloys shall [D1D2D3] not be used except in areas where minimal
exposure to corrosive environments can be expected and protection systems can
be maintained with ease and high reliability. Magnesium alloys shall [D1D2D3]
not be used in the primary structure or in other areas subject to wear, abuse,
foreign object damage, abrasion, erosion, or at any location where fluid or
moisture entrapment is possible.
Mercury (Hg) Equipment containing mercury shall not [D1D2D3] be used where the mercury
could come in contact with electrical connectors, cables, and wiring harness
assemblies during manufacturing, assembly, test, checkout, and use.
Rationale
Mercury (Hg) is a particularly hazardous material because of its toxicity and
tendency to penetrate joints and amalgamate structure materials. Metal
contaminated while under high stress will receive greater penetration of mercury
and degradation of ability to withstand stress than will metals under relatively low
stress. Aluminum contaminated by contact with mercury will rapidly corrode, as
the mercury prevents formation of the protective oxide layer on the aluminum’s
surface.
Coronal discharge can occur at low voltage potentials in the presence of mercury
vapor.
Recommendations
1. Well-protected lamps containing mercury, including those used in the
fluorescent die-penetrant inspection are exempt from this requirement.
2. Mercury must not be removed from metal surfaces with any abrasive
cleaning method. The removal of oxide films on the metal will cause
immediate mercury penetration.
Polyvinyl Chloride The use of polyvinylchloride (PVC) insulated wire or cable shall [D1D2D3] be
(PVC) limited to applications where temperatures do not exceed +49°C (+120°F).
Non-lead stabilized PVC (classified as RoHS compatible) shall not [D1D2D3]
be used without USER approval. Polyvinylchloride (PVC) insulation shall not
[D1D2D3] be used in vacuum environments.
Rationale
Recommendations
Silver (Au) Silver-plated hardware and finishes shall not [D1D2D3] be used in applications
where condensing moisture, salt fog, sulfur compounds, or atomic oxygen are
present. Use of electroplated silver is prohibited as a plated surface on printed
wiring boards, terminal boards and bus bars.
Rationale
Recommendations
Tin (Sn) Pure tin plating containing less than 3% lead (Pb) by weight as a finish coat on
mechanical, EEE, electromechanical, or electro-optical parts or devices is
prohibited.
Rationale
Pure tin finishes are susceptible to the spontaneous growth of electrically
conductive single crystal structures known as tin whiskers. Over time these
whiskers may grow to be several millimeters (mm) long. Tin whiskers are capable
of causing electrical failures ranging from parametric deviations to sustained
plasma arcing (in vacuum) that can result in catastrophic short circuits.
The problem with tin whiskers has been known since the 1940 – 1950s, and was
solved over 30 years ago by prohibiting the use of pure tin plating on component
leads, component bodies, connectors, and mechanical components. Tin whisker
is considered an electronics reliability concern and whisker FOD in the habitable
section of the vehicle may present a possible health risk to the crew.
Tin whiskers are electrically conductive, crystalline structures of tin that grow as a
result of mechanical stress in the tin crystal lattice, from surfaces where tin
(especially bright electroplated tin) is used as a final finish. Whisker growth does
not require moisture or ionic contamination as an activator, and growth rates from
0.03 to 0.9 mm/yr have been reported, with lengths of several millimeters (mm)
and in rare instances to lengths up to 10 mm. Because they are crystalline
structures they are very strong, and capable of conducting significant amounts of
power before melting or vaporizing.
Recommendations
1. Growth of whiskers has been shown to be controllable by tinning with tin-lead
(SnPb) solder, and as little as 2 %Pb (lead) in the alloy or tin plating will
significantly reduce whisker growth.
2. Conformal coatings will not stop whisker development. Preliminary results
from various NASA and industry-sponsored studies indicate that resilient
conformal coatings (i.e.: urethanes (UR), silicones (SR), etc.) appear to only
slow whisker growth.
3. Rigid coatings such as acrylics (AR), epoxies (ER), and paraxylene (XY) may
offer some whisker protection, but present additional reliability and rework
issues that must be taken into consideration by the design engineer.
Titanium (Ti) Titanium shall not [D1D2D3] be used with Liquid Oxygen (LOX) or Gaseous
Oxygen (GOX) at any pressure or with air at oxygen partial pressures above 34.5
kPa (5 psia).
Rationale
With a few exceptions, common structural metallic materials are flammable in
oxygen at modest pressures. However, most metals can be used safely in
oxygen, provided that the system is designed to eliminate potential ignition
sources.
Recommendation(s):
1. Titanium alloys are extremely flammable and should be used only in
exceptional circumstances.
2. In some applications, use of Titanium (Ti) may be acceptable via a Project
approved waiver process that includes review and approval by both
Materials and Parts Engineering disciplines.
3. Care shall [D1D2D3] be exercised to ensure that cleaning fluids and other
chemicals used on titanium are not detrimental to performance or reliability.
Surface contaminants which can induce stress corrosion, hydrogen
embrittlement, or reduce fracture toughness include the following:
hydrochloric acid, cadmium, silver, chlorinated cutting oils and solvents,
methyl alcohol, fluorinated hydrocarbons, and components containing
mercury.
Zinc (Zn) Zinc plating is prohibited on EEE parts and connector hardware.
Rationale:
There are several reasons for prohibiting the use of zinc in space flight electronic
systems:
1. Zinc is known to sublimate in a vacuum environment, especially at elevated
temperatures. The sublimation products are conductive and can result in
short circuits.
2. Electrically-deposited zinc (Zn) coatings have been shown to exhibit
spontaneous metallic whisker growth that appears to be more aggressive
than that observed with electrically-deposited bright tin (Sn).
3. The propensity for whisker growth and the possibility of microscopic metallic
fiber FOD in an IVA environment presents a serious reliability and health
concern.
4. Zinc whiskers are capable of causing electrical failures ranging from
parametric deviations to sustained plasma arcing that can result in
catastrophic short circuits. See prohibition against pure tin plating for
additional insight regarding the risks of metal whiskers.
5. The use of zinc chromate coatings in the habitable section of the vehicle is
considered a crew health risk.
Recommendation(s):
In some applications use of Zinc plating may be acceptable via a Project
approved waiver process that includes review and approval by both Materials and
Parts Engineering disciplines.
1. Zinc (galvanized) plating is occasionally used on mechanical hardware such
as fasteners for its corrosion resistant properties. By using alternative plating
materials most designs can avoid the risks associated with the use of Zinc
plating while still achieving suitable corrosion resistance.
2. Consult your materials or parts specialists for suggested alternatives to Zinc
plating.
Radiation Cross-
Linked Tefzel (XL- Rationale:
TEFZEL, XL-ETFE)
Recommendation(s):
Lock Washers (Star Lock washers with a “star” or “tooth” locking feature have a potential to create
and Tooth Type) foreign object damage (FOD).
Rationale:
Recommendation(s):
Fasteners requiring a lock washer should use a split washer design.
Silver-Coated Copper Rationale:
Wire With Less Than
40 Micro-Inches of Recommendation(s):
Silver Coating
Use of Silver-Coated Inadequate silver plating thickness results in wire corrosion, known as “Red
Copper Wire Without a Plague.”
Red Plague Control
Plan (RPCP). Rationale:
Recommendation(s):
Parylene (Paraxylene) Chlorine may corrode metals or form undesirable electrically conductive
Coatings Containing substances.
Chlorine
Rationale:
Recommendation(s):
Natural Rubber Natural rubber materials outgas sulfur when subjected to heat, low pressure, or
Materials vacuum conditions; have limited resistance to extreme temperatures, sunlight, or
ozone; are fungus nutrients; and, exhibit significant compositional variation from
batch to batch.
Rationale:
Recommendation(s):
Acetic Acid Cure RTV
Silicone Sealants,
Adhesives, and Rationale: Release of acetic acid during cure of Room Temperature Vulcanizing
Coatings (RTV) silicones creates potential corrosion and contamination.
Recommendation(s):
Soldering Of Solid
Gold Ribbon Leads
and Wires With Tin- Rationale: Unlike gold-plated leads or wires from which the gold can be stripped
Lead Solder prior to soldering, solid gold ribbon leads and wires cannot be stripped, and
soldering with tin-lead eutectic solder can result in the failure of the solder joint
due to gold embrittlement.
Ultrasonic Cleaning Ultrasonic cleaning systems shall not [D1D2D3] not be used to clean electronic
parts and assemblies.
Rationale: The high acoustic energy levels used in ultrasonic cleaning systems
can damage sensitive parts inside electronic parts and overstress solder joints.
Recommendation(s):
Rationale:
Recommendation(s):
Immersion Cleaning of
Connectors and
Harness Assemblies Rationale:
Recommendation(s):
Sulfides or Free Sulfur Materials containing or coated with substances known to be detrimental to
metals used in electrical connectors or optics shall not [D1D2D3] be used
adjacent to exposed electrical contact or optical surfaces. The use of materials
containing or coated with sulfides or free sulfur is prohibited [D1D2D3].
APPENDIX C - FOREIGN OBJECT DEBRIS (FOD) CONTROL
Number: Revision
F-1
PROTECTION FROM FOREIGN OBJECT
DEBRIS (FOD)
Page Date:
1 of 1
STATEMENT OF STANDARD
A Foreign Object Debris (FOD) prevention program shall [D1D2D3] be established for the design,
development, manufacturing, assembly, repair, processing, testing, maintenance, operation, and
check out of the equipment to prevent immediate and latent damage and to ensure the highest
practical level of cleanliness.
a. Cable and wiring harness assemblies shall [D1D2D3] be designed with debris-proof covers,
shrouds, containers, housings, potting, or conformal coatings that protect the entire system prior to
use, or that prevent debris from entering into critical areas of the mechanism where the debris
could cause arcing, binding, jamming, seizing, or unwanted current paths.
b. Connectors not being actively assembled shall [D1D2D3] be individually protected by wrapping
them in bubble pack or other physical covering (i.e.: clean, ESD-rated dust caps, etc.).
c. Clean, ESD-rated dust caps shall [D1D2D3] be installed on all unmated connectors.
d. Interim Assembly / Temporary Storage - Wiring, cable, connectors, and harness assemblies that
are not being actively worked on shall [D1D2D3] be stored in water-vapor-proof packaging, or
covered by Electrostatic Discharge (ESD) protective covering in accordance with ANSI/ESD
S20.20 and stored in an environmentally-controlled and monitored area where dew point is not
attained and the relative humidity is less than 70%RH.
If necessary, connectors that were subjected to frequent mating and demating operations during
fabrication and test shall [D1D2D3] receive additional cleaning prior to the final mating. Visual
examination of the contact surfaces of connectors shall [D1D2D3] not reveal the presence of
contaminants such as metal flakes or large dust particles. If required, additional cleaning should
be performed by vacuum removal methods and solvent-brushing.
e. After harness fabrication is complete and certified, the complete harness shall [D1D2D3] be
cleaned with an approved solvent, inspected with both black and white light and then vacuum
baked (bakeout) at a temperature of +20°C above the maximum environmental test temperature.
The bakeout will continue until a chamber pressure of 1X10-6 Torr is reached and the QCM
requirements have been fulfilled.
f. Completed Assemblies - Completed cable and harness assemblies shall [D1D2D3] be placed in a
sealed, vapor-proof, protective bag, with desiccant and a humidity indicator card (HIC). Clean,
ESD-rated dust caps shall [D1D2D3] be installed on all unmated connectors.
g. Cleaning The Harness Assembly - Particles and debris shall [D1D2D3] be cleaned from the
harness or cable assembly by vacuum-removal methods. Solvent brushing with solvent, or wiping
with a clean lint free cloth and an approved solvent may be used as required to remove other
contamination. Under no circumstances should the harness assembly be submersion cleaned,
and aqueous solvents (water-based) should not be used in instances where the wiring is silver-
coated copper.
h. Cleaning Harness Connectors - The following cleaning procedures shall [D1D2D3] be used with
connectors:
(1) For solder-type connectors, flux rundown into the mating part of socket contacts shall
[D1D2D3] be removed (Requirement). Solvent cleaning by brushing may be used. Contact
surfaces of pins, sockets, and connector bodies shall [D1D2D3] be free of flux residue (see
Figure 15-1), solder splash, metal flakes, moisture, and other contaminants that may
jeopardize the integrity of the connector system.
(2) Crimp-type multi-pin and coaxial electrical connectors should be solvent-cleaned by brushing
before assembly to the harness or unit cable. Contact surfaces of pins and sockets and the
interior surfaces of the connector shall [D1D2D3] be free of contaminants.
i. Cleaning Connector Covers - The internal surfaces of dust covers and connector covers shall
[D1D2D3] be cleaned by solvent brushing and allowed to air dry before the covers are fitted onto
cleaned connectors.
j. Cleaning Coaxial Connectors (Assembled) - Coaxial connectors shall [D1D2D3] not have
accumulated contaminants such as metal flakes, dirt, moisture, and other foreign materials. The
connector interface shall [D1D2D3] be cleaned by brushing with solvent, vacuum procedures, or
a combination thereof until the contaminants have been removed.
k. Metallic Braid - All tubular metallic braid shall [D1D2D3] be cleaned with an approved solvent
before being incorporated into the harness. Aqueous (water-based) solvents shall not [D1D2D3]
be used.
l. The FOD prevention program shall [D1D2D3] conform to NAS 412 "Foreign Object Damage/
Foreign Object Debris (FOD) Prevention".
REMARKS
Overbraid / metallic tubular braid shielding must be cleaned to remove the oils and the tarnish
inhibiters used during the weaving process. While use of an ultrasonic cleaning process is
recommended, a manual process of three immersion-removal-drain cycles (with a gentle agitation by
hand while immersed) with room temperature isopropyl alcohol (IPA) should be sufficient. The third
cycle should be clean IPA and used as a final rinse. Once dried, the braid should be visibly inspected
at 4X-10X magnification to verify it is clean, particulate free, and should not have a sticky / tacky feel
when touched.
Silver-coated copper braid should not exhibit visible indications of Red Plague (a dusty reddish / pink
tint at the intersections of braid weave).
Aqueous (water-based) solvents / cleaning processes shall not be used if the braid is silver-coated
copper (commonly used for flight hardware), as this may promote Red Plague.
APPENDIX D - ELECTRICAL WIRE AND CABLE ACCEPTANCE TESTS
Number: Revision
APPENDIX D
ELECTRICAL WIRE AND CABLE
ACCEPTANCE TESTS
Page Date:
1 of 1
STATEMENT OF STANDARD
Electrical wire and cable, including wiring used within containerized electrical / electronic assemblies
("black boxes") shall [D1D2D3] be procured and acceptance tested to the appropriate cable
specifications listed below:
• Cable specification ANSI/NEMA WC27500, Standard for Aerospace and Industrial Electrical
Cable.
• Cable specification MIL-C-17, Cables, Radio Frequency, Flexible and Semi-rigid.
• Wire specification AS22759, Wire, Electrical, Fluoropolymer Insulated Copper or Copper Alloy
• Other wire procurement specifications may be authorized by the USER.
• Wire and cable shall [D1D2D3] also comply with applicable Materials and Process (M&P)
requirements.
If the wiring used in any application is unknown, as it may be in the case of off-the-shelf equipment,
pig-tailed components, heater strips, etc. and if the application is non-critical, the assembly is required
only to meet applicable program materials and process requirements.
In either case, testing shall [D1D2D3] consist of the tests below. Testing for insulation flaws of
cable’s basic wires shall [D1D2D3] be done prior to cable assembly.
100-Percent Testing
a. Insulated single conductor wires and cable basic wires
(1) Impulse dielectric test (no greater than 80% of military specification)
b. Cable
(1) Dielectric withstand of component wires
(2) Jacket flaws for shielded cables
Sample Testing
As a minimum, a sample or samples of each lot of wire/cable shall [D1D2D3] be subjected to the
following applicable quality conformance inspections. (Applicability is determined by the specifications
cited above).
2. Cable
a. Shield coverage
b. Identification of product
c. Jacket wall thickness
d. Cold bend
e. Thermal shock
f. Stress-Crack Resistance testing (MIL-C-17 Cable only)
Any failure during sample testing shall [D1D2D3] be cause for immediate rejection of the entire lot.
Certification Processes
Certification of a USER-approved test facility is done by an audit team with representatives from the
USER, or their representatives. The team shall [D1D2D3] assure the test lab is qualified to perform
the test methods referenced in this standard.
At the using installation, before placing wire/cable into bonded storage, representatives from the
Engineering team and/or receiving inspection function shall [D1D2D3] verify that the test report
indicating conformance with all applicable procurement specification requirements accompanies each
lot shipped.
Storage shelf life: Silver plated wire and cable that has exceeded a shelf life of 10 years from its
manufacturing date shall [D1D2D3] be downgraded to non-flight status and not be used on flight
hardware.
REMARKS
The primary reason for downgrading silver-coated wire after ten (10) years of age is to control
increased solderability problems with silver and the potential for Red Plague for wire stored in a high
moisture environment. See Red Plague Control Plan (RPCP), Appendix A.