TD62304,305P/AP/F/AF

TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC

TD62304P,TD62304AP,TD62304F,TD62304AF
TD62305P,TD62305AP,TD62305F,TD62305AF

7CH LOW ACTIVE DARLINGTON SINK DRIVER

The TD62304P/AP/F/AF and TD62305P/AP/F/AF are

non−inverting transistor arrays, which are comprised of eight
NPN darlington buffer-transistor output stages and PNP input
stages.
These devices can be operated by source input voltage and are
suitable for operations with a 5-V general purposed logic IC such
as 5-V TTL, 5-V CMOS and 5-V Microprocessor which have sink
current output drivers.
Please observe the thermal condition for using.

FEATURES
l Output current (single output) 500 mA (Max.)
l High sustaining voltage 35 V (TD62304P/F, 62305P/F) 50 V
(TD62304AP/AF, 62305AP/AF) (Min.)
l Low level active input
l Input compatible with 5-V TTL and 5-V CMOS
l Package type-P, AP: DIP-16 pin
l Package type-F, AF: SOP-18 pin

PIN CONNECTION (TOP VIEW)

Weight
DIP16−P−300−2.54A : 1.11 g (Typ.)
SOP16−P−225−1.27 : 0.16 g (Typ.)

SCHEMATICS (EACH DRIVER)

TD62034P/AP/F/AF TD62305P/AP/F/AF

Note: The input and output parasitic diodes cannot be used as clamp diodes.

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MAXIMUM RATINGS (Ta = 25°C)

CHARACTERISTICS SYMBOL RATING UNIT

Supply Voltage VCC −0.5~7.0 V

P, F −0.5~35
Output Sustaining Voltage AF VCE (SUS) −0.5~50 V

AP −0.5~50
Output Current IOUT 500 mA / ch
−22~VCC +0.5
Input Voltage VIN V
−0.5~7 (Note 1)
Input Current IIN −10 mA
P 1.0
Power Dissipation AP PD 1.47 W

F, AF 0.625 (Note 2)
P −30~75
Operating Temperature Topr °C
−40~85
Storage Temperature Tstg −55~150 °C

Note 1: TD62305P / AP / F / AF
Note 2: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%)

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RECOMMENDED OPERATING CONDITIONS
(Ta = −40~85°C and Ta = −30~75°C for only Type−P)

CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT

Supply Voltage VCC ― 4.5 5.0 5.5 V

P, F 0 ― 35
Output Sustaining Voltage AF VCE (SUS) ― 0 ― 50 V

AP 0 ― 50
DC 1 Circuit 0 ― 350
Tpw = 25 ms, duty = 10%
P 0 ― 300
7 circuits
Output Current IOUT Tpw = 25 ms, duty = 10% mA / ch
0 ― 350
7 circuits
AP
Tpw = 25 ms, duty = 20%
0 ― 200
7 circuits
TD62304P / AP / F / AF −20 ― VCC
Input Voltage VIN ― V
TD62305P / AP / F / AF 0 ― 5.5
P ― ― ― 0.44
Power Dissipation AP PD ― ― ― 0.52 W

F, AF (Note 1) ― ― 0.325

Note 1: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%)

ELECTRICAL CHARACTERISTICS (Ta = 25°C)

TEST
CHARACTERISTIC SYMBOL CIR− TEST CONDITION MIN TYP. MAX UNIT
CUIT
VOUT = 35 V
P/F
Output Leakage VCC = 5.5 V Ta = 75°C
ICEX 1 ― ― −100 µA
Current VIN = 0 V
VOUT = 50 V
Ta = 85°C
VCC = 4.5 V VIN = VIN (ON)
Output Saturation Voltage VCE (sat) 2 ― 1.4 2.0 V
IOUT = 350 mA MAX.
VCC = 5.5 V, VIN = 0.4 V ― −0.32 −0.45
(Output On) IIN (ON) 3 mA
Input Current VCC = 5.5 V, VIN = −20 V ― ― −2.6
(Output Off) IIN (OFF) 4 ― ― ― −40 µA
VCC
TD62304 ― ―
Input Voltage −2.8
VIN (ON) 5 ― V
(Output On) VCC
TD62305 ― ―
−3.7
(Output On) ICC (ON) 6 VCC = 5.5 V, VIN = 0 V ― 17 22 mA
Supply Current
(Output Off) ICC (OFF) 6 VCC = VIN = 5.5 V ― ― 100 µA
VOUT = 35 V
P, F
RL = 87.5 Ω
Turn−On Delay tON ― 0.1 ―
VOUT = 50 V
AP, AF
VCC = 5 V, RL = 125 Ω
7 µs
CL = 15 pF VOUT = 35 V
P, F
RL = 87.5 Ω
Turn−Off Delay tOFF ― 3 ―
VOUT = 50 V
AP, AF
RL = 125 Ω

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TEST CIRCUIT
1. ICEX 2. hFE, VCE (sat)

3. IIN (ON) 4. IIN (OFF)

5. VIN (ON) 6. ICC

7. tON, tOFF

Note 1: Pulse Width 50 µs, duty cycle 10%

Output impedance 50 Ω, tr ≤ 10 ns, tf ≤ 5 ns
Note 2: CL includes probe and jig capacitance.

PRECAUTIONS for USING

This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.Utmost care is
necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short−circuit
between outputs, air contamination fault, or fault by improper grounding.

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PACKAGE DIMENSIONS
DIP16−P−300−2.54A Unit : mm

Weight: 1.11 g (Typ.)

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PACKAGE DIMENSIONS
SOP16−P−225−1.27 Unit : mm

Weight: 0.16 g (Typ.)

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RESTRICTIONS ON PRODUCT USE 000707EBA

· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
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conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..

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(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
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