Design and Fabrication of Thermoelectric Cooler

ADHIPARASAKTHI ENGINNERING
COLLEGE,MELMARUVATHUR.
MECHANICAL DEPARTMENT
DESING AND FABRICATION OF
THERMOELECTERIC COOLER
NAME REG. NUMBER

R.AKASHKUMAR 420416114004
B.BOOPATHIRAJAN 420416114017
G.DELHIBABU 420416114021
GUIDED BY,
Mr.J.JAYARAM., M.E.
(ASST. PROF/MECH)
ABSTRACT:
 Cooling is achieved by using a solid state semiconductor
device called thermo electric module which consists of an
array of bismuth telluride(Bi2te3) pellets.
 By applying a low voltage DC power source to a module,
heat will be moved through the module from one side to the
other. One face, will be cooled while the opposite face
simultaneously is heated.
 Thermoelectric cooler may be used for both heating and
cooling by reversing the polarity (changing the direction of
the applied current).
INTRODUCTION:
Refrigeration is the achievement of temperatures

below that of the local environment. The main purpose
of refrigeration is thermal conditioning (e.g. for food
preservation or air conditioning), and the basic
apparatus is a refrigerator.
Electric oven is the process heating the closed surface
by application of current supply.
The purpose of refrigeration in maintain the
temperature below the ambient level. And the Oven is
used to increase the temperature level of surface.
OBJECTIVE:
 Our project Concerns about the destruction of the
global environment by chlorofluorocarbon (CFC) fluids.
It has become an impetus in searching for alternative
non-CFC refrigerants and cooling methods.
 While some alternative refrigerants have been
identified, they are not considered as lasting solution
because of their high global warming potential (GWP),
which could result in their eventual phase-out. In view of
this dilemma, environmentally acceptable alternative
cooling methods have become important.
 The main aim of our project is to replace the
conventional cooling process. Most modern
refrigerators in use today utilize compressors,
condensers, refrigerants etc.
 But our system replaces these components
with DC power source, heat sink and
semiconductors respectively.
 From that we changing the current direction
we get the heat energy from that thermo electric
module.
Components:
Thermoelectric modules
Aluminum cage
Heat sink
Cooling fan
DC Transformer
Thermoelectric Modules:
By applying a low voltage DC power to a TE
module, heat will be moved through the module from one
side to the other. One module face, therefore, will be cooled
while the opposite face is simultaneously heated.
Heat sink:
A heat sink (also commonly spelled heat sink ) is a
passive heat exchanger that transfers the heat generated by
an electronic or a mechanical device to a fluid medium,
often air or a liquid coolant, where it is dissipated away from
the device, thereby allowing regulation of the device's
temperature at optimal levels.
COOLING FAN:
A fan is a machine used to create flow within a fluid, typically a gas such
as air. The fan consists of a rotating arrangement of vanes or blades which act
on the fluid. The rotating assembly of blades and hub is known as an impeller,
a rotor, or a runner. Usually, it is contained within some form of housing or
case. This may direct the airflow or increase safety by preventing objects from
contacting the fan blades.
ADVANTAGES:
► A TE module works electrically without any moving parts so they
are virtually maintenance free.
► The overall thermoelectric cooling system is much smaller and

lighter than a comparable mechanical system.
► Thermoelectric coolers will either heat or cool depending upon the

polarity of the applied DC power. This feature eliminates the
necessity of providing separate heating and cooling functions
within a given system.
► Thermoelectric modules exhibit very high reliability due to their

solid state construction.
► With a TE cooler it is possible to cool one specific component or

area only, thereby often making it unnecessary to cool an entire
package or enclosure.
CONCLUSION:
A Thermoelectric Air cooling system was designed and built
which can be used for personal cooling. Five TECs were used for
achieving the cooling with a DC power supply through external
power supply (dimmer stat). It had been shown from testing
results that the cooling system is capable of cooling. TEC cooling
designed was able to cool an ambient air temperature from32.5°C
to 22.1°C.

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ADHIPARASAKTHI ENGINNERING

NAME REG. NUMBER

Refrigeration is the achievement of temperatures

► The overall thermoelectric cooling system is much smaller and

► Thermoelectric coolers will either heat or cool depending upon the

► Thermoelectric modules exhibit very high reliability due to their

► With a TE cooler it is possible to cool one specific component or

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