Infineon TLE6244X DS v07 00 en

TLE 6244X
18 Channel Smart Lowside Switch

ASSP for Powertrain
Data Sheet
Features
• Short Circuit Protection
• Overtemperature Protection
• Overvoltage Protection
• 16 bit Serial Data Input and Diagnostic Output
(2 bit/chan. acc. SPI Protocol)
• Direct Parallel Control of 16 channels for PWM Applications
• Low Quiescent Current
• Compatible with 3.3V Microcontrollers PG-MQFP-64-10
• Electrostatic discharge (ESD) Protection
• Green Product (RoHS-compliant)
• AEC qualified
General description
18-fold Low-Side Switch (0.35 Ω to 1 Ω) in Smart Power Technology (SPT) with a Serial Pe-
ripheral Interface (SPI) and 18 open drain DMOS output stages. The TLE6244X is protected
by embedded protection functions and designed for automotive and industrial applications.
The output stages are controlled via SPI Interface. Additionally 16 of the 18 channels can be
controlled direct in parallel for PWM applications. Therefore the TLE6244X is particularly
suitable for engine management and powertrain systems.
VS
IN1 V BB
IN2 as Ch. 1 Protection

as Ch. 1
Functions
as Ch. 1
LOGIC
as Ch. 1
OUT1
as Ch. 1 Output Stage
IN15 as Ch. 1
IN16 as Ch. 1
16 1 16
SCLK
Output Control
SI Serial Interface
Buffer OUT18
SPI
SO
GND
Data Sheet 1 V7, 2007-06-11
TLE 6244X
1. Description
1.1 Short Description
This circuit is available in PG-MQFP-64 package or as chip.
1.1.1 Features of the Power Stages
Nominal Current Ron,max at TJ = 25°C static current limita- Clamping

tion enabled by SPI
OUT1, 2, 5, 6 2.2A 400mΩ - 70V
OUT3, OUT4 2.2A 380mΩ - 70V
OUT7, OUT8 1.1A 780mΩ - 45V
OUT9, OUT10 2.2A 380mΩ X 45V
OUT11...OUT14 2.2A 380mΩ - 45V
OUT15, OUT16 3.0A 280mΩ X 45V
OUT17, OUT18 *) 1.1A 780mΩ X 45V

*) only serial control possible (via SPI)
Parallel connection of power stages is possible (see 1.13)

Internal short-circuit protection
Phase relation: non-inverting (exception: IN8->OUT8 is inverting)
1.1.2 Diagnostic Features
The following types of error can be detected:

Short-circuit to UBatt (SCB)
Short-circuit to ground (SCG)
Open load (OL)
Overtemperature (OT)
Individual detection for each output.
Serial transmission of the error code via SPI.
1.1.3 VDD-Monitoring
Low signal at pin ABE and shut-off of the power stages if VDD is out of the permitted range.
Exception: If OUT8 is controlled by IN8, OUT8 will only be switched off by the overvoltage
detection and not by undervoltage detection.
The state of VDD can be read out via SPI.
1.1.4 µsec-bus
Alternatively to the parallel and SPI control of the power stages, a high speed serial bus inter-
face can be configured as control of the power stages OUT1...OUT7 and OUT9...OUT16.
1.1.5 Power Stage OUT8

OUT8 can be controlled by SPI or by the pin IN8 only. When controlled by IN8 this power stage
is functional if the voltage at the pin VDD is above 3,5V. OUT8 will not be reset by RST. In
SPI mode the power stage is fully supervised by the VDD-monitor.
Data Sheet 2 V7, 2007-06-11

TLE 6244X
1.2 Block Diagram
UBatt
fault
diagnostics
OUT1
IN1
2,2A / 70V
SPI
IN2 2,2A / 70V OUT2
IN3 2,2A / 70V OUT3
IN4 2,2A / 70V OUT4
IN5 2,2A / 70V OUT5
IN6 2,2A / 70V OUT6
IN7 1.1A / 45V OUT7
IN8 1.1A / 45V OUT8
IN9 2,2A / 45V OUT9
IN10 2,2A / 45V OUT10
IN11 2,2A / 45V OUT11
IN12 2,2A / 45V OUT12
IN13 2,2A / 45V OUT13
IN14 2,2A / 45V OUT14
IN15 3,0A / 45V OUT15
IN16 3,0A / 45V OUT16

control only via SPI possible 1.1A / 45V OUT17
control only via SPI possible 1.1A / 45V OUT18
IN6 IN7 IN16
µsec - Bus VDD
SCK VDD
SPI Interface VDD-Moni-
SI
toring ABE
SS
SO RST GND1...8 GND_ABE
Data Sheet 3 V7, 2007-06-11

TLE 6244X
1.3 Description of the Power Stages
OUT1... OUT6
6 non-inverting low side power switches for nominal currents up to 2.2A. Control is possible by
input pins, by the µsec-bus or via SPI. For TJ = 25°C the on-resistance of the power switches is
below 400mΩ.
An integrated zener diode limits the output voltage to 70V typically.
A protection for inverse current is implemented for OUT1... OUT4 for use as stepper-motor con-
trol.
OUT9... OUT14
below 380mΩ.
OUT15, OUT16
below 280mΩ.
OUT7, OUT8, OUT17, OUT18

4 low side power switches for nominal currents up to 1100mA. Stage 7 is non-inverting, Stage 8
is inverting (IN8 = ‘1’ => OUT8 is active). For the output OUT7 control is possible by the input pin,
by the µsec-bus or via SPI, OUT8 is controlled by the input pin IN8 or via SPI, for the outputs
OUT17 and OUT18 control is only possible via SPI. For TJ = 25°C the on-resistance of the power
switches is below 780mΩ.
In order to increase the switching current or to reduce the power dissipation parallel connection
of power stages is possible (for additional information see 1.13).
The power stages are short-circuit proof:
Power stages OUT1...OUT8, OUT11.14: In case of overload (SCB) they will be turned off after a
given delay time. During this delay time the output current is limited by an internal current control
loop.
Power stages OUT9, OUT10, OUT15...OUT18:
In case of SCB these power stages can be configured for a shut-down mode or for static current
limitation. In the shut down mode while SCB they will behave like OUT1..8 or OUT11..14.
In case of static current limitation and SCB the current is limited and the corresponding bit com-
bination is set (early warning) after a given delay time. They will not be turned off. If this condition
leads to an overtemperature condition, the output will be set into a low duty cycle PWM (selective
thermal shutdown with restart) to prevent critical chip temperature.
There are 3 possibilities to turn the power stages on again:

- turn the power stage off and on, either via serial control (SPI) or via parallel control (input pin,
except outputs OUT17 and OUT18) or by the µsec-bus (except OUT8, OUT17,OUT18)
- applying a reset signal.
- sending the instruction “del_dia” by the SPI-interface
The VDD-monitoring locks all power stages, except OUT8 for access by the IN8 input. OUT8 is
locked by an internal threshold of 3,5V maximum when controlled by IN8. Otherwise OUT8 is
locked by the VDD-monitor.
Data Sheet 4 V7, 2007-06-11

TLE 6244X
All low side switches are equipped with fault diagnostic functions:
- short-circuit to UBatt: (SCB) can be detected if switches are turned on

- short-circuit to ground: (SCG) can be detected if switches are turned off
- open load: (OL) can be detected if switches are turned off
- overtemperature: (OT) will only be detected if switches are turned on
The fault conditions SCB, SCG, OL and OT will not be stored until an integrated filtering time is
expired (please note for PWM application). If, at one output, several errors occur in a sequence,
always the last detected error will be stored (with filtering time). All fault conditions are encoded
in two bits per switch and are stored in the corresponding SPI registers. Additionally there are
two central diagnostic bits: one specially for OT and one for fault occurrence at any output.
The registers can be read out via SPI. After each read out cycle the registers have to be cleared
by the DEL_DIA command.
1.3.1 Power Stage OUT8 (Condensed Description)

1.3.1.1 Control of OUT8 and VDD-Monitoring
OUT8 can be controlled by SPI or by the pin IN8 only, control by µs-bus is not possible. When
controlled by IN8 this power stage is functional if the voltage at the pin VDD is above 3,5V. In
SPI mode the power stage is fully supervised by the VDD-monitor.
If OUT8 is controlled by IN8, OUT8 will only be switched off by the overvoltage detection and
not by undervoltage detection.
1.3.1.2 Phase Relation IN8 - OUT8
The phase relation IN8 -> OUT8 is inverting.
OUT8 is active if IN8 is set to logic '1' (high level, see 3.4.2 ) in case of parallel access.
On executing the read instruction on RD_INP1/2 the inverted status of IN8 is read back.
1.3.1.3 Reset / Power Stage Diagnostics
If OUT8 is controlled by IN8, OUT8 will not be reseted by RST.
After reset parallel control (by IN8) is active for OUT8.
If UVDD < 4.5V errors are not stored because of the active RST of the external Regulator. Nev-
ertheless
OUT8 is protected against overload.
1.3.1.4 Input Current
The control input IN8 has an internal pull-down current source. Thus the input currents I IN8
are positive (flow into the pin).
1.3.1.5 On Resistance
For OUT8 and 3.5V < UVDD < 4.5V R on increases (see 3.8.5).
1.3.1.6 Parallel Connection of Power Stages
Parallel connection of power stages with OUT8 and parallel control is prohibited (inverting
input IN8). Control via SPI is possible. See 1.13.
Data Sheet 5 V7, 2007-06-11

TLE 6244X
1.4 Pinout
Function Pin Pin Number

Input 1 IN1 7
Input 2 IN2 46
Input 3 IN3 10
Input 4 IN4 43
Input 5 IN5 6
Input 6 or FDA IN6 63
Input 7 or SSY IN7 61
Input 8 IN8 22
Input 9 IN9 20
Input 10 IN10 33
Input 11 IN11 5
Input 12 IN12 48
Input 13 IN13 13
Input 14 IN14 40
Input 15 IN15 1
Input 16 or FCL IN16 62
Output 1 OUT1 8
Output 2 OUT2 45
Output 3 OUT3 9
Output 4 OUT4 44
Output 5_1 OUT5_1 16
Output 7 OUT7 60
Output 8 OUT8 57
Output 11 OUT11 4
Output 12 OUT12 49
Output 17 OUT17 25
Output 18 OUT18 28
(Note: OUTxy_1 and OUTxy_2 have to be connected externally!)
Slave Select SS 56
Serial Output SO 53
Serial Input SI 55
SPI Clock SCK 54
Data Sheet 6 V7, 2007-06-11

TLE 6244X
Supply Voltage VDD VDD 47

Supply Voltage UBatt Ubatt 23
GND1 GND1 26
GND2 GND2 27
GND3 GND3 58
GND4 GND4 59
GND5 GND5 11
GND6 GND6 12
GND7 GND7 42
GND8 GND8 41
Sense Ground VDD-Monitoring GND_ABE 29

In-/Output VDD-Monitoring ABE 30
Reset (low active) RST 31
not connected nc 21, 24, 32, 52, 64

64
63
62
61
60
59
58
57
56
55
54
53
GND3
OUT8
SS
SI
SCK
SO
nc
IN6 / FDA
IN16 / FCL
IN7 / SSY
OUT7
GND4
1 IN15 nc 52
2 OUT15_1 OUT16_1 51
3 OUT15_2 OUT16_2 50
4 OUT11 OUT12 49
5 IN11 IN12 48
6 IN5 VDD 47
7 IN1 IN2 46
8 OUT1 OUT2 45
9 OUT3 OUT4 44
IN3 IN4 43
PG-DSO-64
10
11 GND5 GND7 42
12 GND6 GND8 41
13 IN13 IN14 40
14 OUT13_1 OUT14_1 39
15 OUT13_2 OUT14_2 38
16 OUT5_1 OUT6_1 37
17 OUT5_2 OUT6_2 36
18 OUT9_1 OUT10_1 35
19 OUT9_2 OUT10_2 34
20 IN9 IN10 33
GND_ABE
OUT18
OUT17
GND2
GND1
Ubatt
ABE
RST
IN8
n.c.
nc
21 nc
22
23
24
25
26
27
28
29
30
31
32
Data Sheet 7 V7, 2007-06-11

TLE 6244X
1.5 Function of Pins
IN1 to IN16 Control inputs of the power stages
Internal pull-up current sources (exception: IN8 with pull-down current

source)
FCL Clock for the µsec-bus (pin shared with IN16)

FDA Data for the µsec-bus (pin shared with IN6)
SSY Strobe and Synchronisation for the µsec-bus (pin shared with IN7)
OUT1 to OUT18 Outputs of the power switches
Short-circuit proof
Low side switches
Limitation of the output voltage by zener diodes
VDD Supply voltage 5V
UBatt Supply voltage UBatt
Pin must not be left open but has to be connected either to UBatt or to VDD
(e.g. in commercial vehicles)
GND1 to GND8 Ground pins
Ground pins for the power stages (see 2.4)

Ground reference of all logic signals is GND1/2
RST Reset
Active low
Locks all power switches regardless of their input signals (except OUT8)
Clears the fault registers
Resets the µsec-bus interface registers
ABE In-/Output VDD-Monitoring
Active low
Output pin for the VDD-Monitoring
Input pin for the shut-off signal coming from the supervisor
GND_ABE Sense ground VDD-Monitoring
SI, SO, SCK, SS SPI Interface
Data Sheet 8 V7, 2007-06-11

TLE 6244X
1.6 SPI Interface
The serial SPI interface establishes a communication link between TLE6244X and the systems mi-
crocontroller. TLE6244X always operates in slave mode whereas the controller provides the mas-
ter function. The maximum baud rate is 5 MBaud.
The TLE6244X is selected by the SPI master by an active slave select signal at SS and by the first
two bits of the SPI instruction.SI is the data input (Slave In), SO the data output (Slave Out). Via
SCK (Serial Clock Input) the SPI clock is provided by the master.
In case of inactive slave select signal (High) the data output SO goes into tristate.
Block Diagram:
Power Stages 1..18 Power Stages 1..16
SCON_REG1...3 MUX_REG1,2
SS
SPI Control:
SCK State Machine
Clock Counter
Control Bits
SI Parity Generator
Shift Register
SO
STATCON_REG DIA_REG1...5
VDD-Monitoring Power Stages 1..18
Data Sheet 9 V7, 2007-06-11

TLE 6244X
A SPI communication always starts with a SPI instruction sent from the controller to TLE6244X.
During a write cycle the controller sends the data after the SPI instruction, beginning with the MSB.
During a reading cycle, after having received the SPI instruction, TLE6244X sends the correspond-
ing data to the controller, also starting with the MSB.
SPI Command/Format:
MSB
7 6 5 4 3 2 1 0
0 0 INSTR4 INSTR3 INSTR2 INSTR1 INSTR0 INSW
Bit Name Description

7,6 CPAD1,0 Chip Address (has to be ‘0’, ‘0’)
5-1 INSTR (4-0) SPI instruction (encoding)
0 INSW Parity of the instruction
Characteristics of the SPI Interface:
1) If the slave select signal at SS is High, the SPI-logic is set on default condition, i.e. it expects
an instruction.
2) If the 5V-reset (RST) is active, the SPI output SO is switched into tristate.
The VDD monitoring (ABE) has no influence on the SPI interface.
3) Verification byte:
Simultaneously to the receipt of an SPI instruction TLE6244X transmits a verification
byte via the output SO to the controller. This byte indicates regular or irregular operation of
the SPI. It contains an initial bit pattern and a flag indicating an invalid instruction of the previous
access.
4) On a read access the databits at the SPI input SI are rejected. On a writing access or after
the DEL_DIA instruction the TLE6244XTLE6244X sets the SPI output SO to low after sending
the verification byte. If more than 16 bits are received the rest of the frame is rejected.
5) Invalid instruction/access:
An instruction is invalid, if one of the following conditions is fulfilled:
- an unused instruction code is detected (see tables with SPI instructions)
- in case the previous transmission is not completed in terms of internal data processing
- number of SPI clock pulses counted during active SS differs from exactly 16 clock pulses.
A write access and the instruction DEL_DIA is internally suppressed (i.e internal
registers will not be affected) in all cases where at the rising (inactive) edge of SS the
number of falling edges applied to the SPI input SCK during the access is not equal to 16.
A write access is also internally suppressed (i.e internal registers will not be affected) if
at the rising (inactive) edge of SS a 17th bit is submitted (SCK=‘1’).
After the bits CPAD1,0 and INSTR (4-0) have been sent from the microcontroller
TLE6244X is able to check if the instruction code is valid. If an invalid instruction is
detected, any modification on a register of TLE6244X is not allowed and the data
byte ‘FFh’ is transmitted after having sent the verification byte. If a valid read instruction is
detected the content of the corresponding register is transmitted to the controller after having
sent the verification byte (even if bit INSW afterwards is wrong). If a valid write instruction is
Data Sheet 10 V7, 2007-06-11

TLE 6244X
detected the data byte ’00h’ is transmitted to the controller after having sent the verification
byte (even if bit INSW afterwards is wrong) but modifications on any register of TLE6244 are
not allowed until bit INSW is valid, too.
If an invalid instruction is detected bit TRANS_F in the following verification byte is set to
’High’. This bit must not be cleared before it has been sent to the microcontroller.
6) If TLE6244X and additional IC’s are connected to one common slave select, they are
distinguished by the chip address (CPAD1, CPAD0). If an IC with 32bit-transmission-format is
selected, TLE6232 must not be activated, even if slave select is set to ’low’ and
the first two bits of the third byte of the 32bit-transmission are identical to the chip address
of TLE6244X.
During the transmission of CPAD1 and CPAD0 the data output SO remains in tristate (see
timing diagram of the SPI in chapter 3.9. ).
SPI access format:
WRITE-access (16bit) READ-access (16bit)

8 bit command + 8bit data 8 bit command + 8bit data
SS SS
SPI instruction Data 8bit SPI instruction XX XX XX XX

SI SI
MSB MSB MSB
Check byte 00 00 00 00 Check byte Data 8bit

SO SO
ZZ + 6bit ZZ + 6bit
MSB
Z=tristate
Verification byte:
MSB
7 6 5 4 3 2 1 0
Z Z 1 0 1 0 1 TRANS_F

0 TRANS_F Bit = 1: error detected during previous transfer
Bit = 0: previous transfer was recognised as valid
State after reset: 0
1 Fixed to High
2 Fixed to Low
3 Fixed to High
4 Fixed to Low
5 Fixed to High
6 send as high impedance
7 send as high impedance
Data Sheet 11 V7, 2007-06-11

TLE 6244X
SPI Instructions
SPI Instruction Encoding Description

bit 7,6 bit 5,4,3,2,1 Parity
CPAD1,0 INSTR(4...0)
RD_IDENT1 00 00000 0 read identifier 1
RD_IDENT2 00 00001 1 read identifier2
WR_STATCON 00 10001 0 write into STATCON_REG

WR_MUX1 00 10010 0 write into MUX_REG1
WR_MUX2 00 10011 1 write into MUX_REG2
WR_SCON1 00 10100 0 write into SCON_REG1
WR_CONFIG 00 10111 0 write into CONFIG
RD_MUX1 00 00010 1 read MUX_REG1

RD_MUX2 00 00011 0 read MUX_REG2
RD_SCON1 00 00100 1 read SCON_REG1
RD_STATCON 00 00111 1 read STATCON_REG
DEL_DIA 00 11000 0 resets the 5 diagnostic registers
DIA_REG
RD_DIA1 00 01000 1 read DIA_REG1
RD_CONFIG 00 01101 1 read CONFIG
RD_INP1 00 01110 1 read INP_REG1
RD_INP2 00 01111 0 read INP_REG2
all others no function
Data Sheet 12 V7, 2007-06-11

TLE 6244X
1.6.1 Serial/Parallel Control
Serial/Parallel Control of the Power Stages 1...16 and Serial Control (SPI) of the Power Stages 17 and
18:
The registers MUX_REG1/2 and the bmux-bit prescribe parallel control or serial control (SPI or µsec-
bus) of the power stages.
(SPI-Instructions: WR_MUX1...2, RD_MUX1...2, WR_SCON1...3, RD_SCON1...3)
The following table shows the truth table for the control of the power stages 1...18. The registers
MUX_REG1, 2 prescribe parallel-control or serial control of the power stages. The registers
SCON_REG1...3 prescribe the state of the power stage in case of SPI-serial control. BMUX deter-
mines parallel control or control by µsec-bus.
For the power stages 17 and 18 control is exclusively possible via SCON17/18. IN17/18 and
MUX17/18 do not exist. BMUX has no function for OUT17/18.
ABE RST INx BMUX MUXx SCONx µsec- Output OUTx of Power Stage x,
REGx x = 1..18
0 0 X X X X X OUTx off
1 1 X X 0 0 X SPI Control: OUTx on
1 1 X X 0 1 X SPI Control: OUTx off
1 1 0 1 1 X X Parallel Control: OUTx on
1 1 1 1 1 X X Parallel Control: OUTx off
1 1 X 0 1 X 0 µsec-bus Control: OUTx on
1 1 X 0 1 X 1 µsec-bus Control: OUTx off
Exception: OUT8 is on (active) if IN8 is set to logic ‘1’ (and off if IN8 is set to logic ‘0’) in case of
parallel access.
Note: OUT8 cannot be controlled by the µsec-Bus. Refer to section 1.7.
Data Sheet 13 V7, 2007-06-11

TLE 6244X
Description of the SPI Registers
Register: MUX_REG1
7 6 5 4 3 2 1 0
MUX7 MUX6 MUX5 MUX4 MUX3 MUX2 MUX1 MUX0
State of Reset: 80H

Access by Controller: Read/Write
0 MUX0 Serial or parallel control of power stage 1
Register: MUX_REG2
7 6 5 4 3 2 1 0
MUX15 MUX14 MUX13 MUX12 MUX11 MUX10 MUX9 MUX8
State of Reset: 00H

Data Sheet 14 V7, 2007-06-11

TLE 6244X
Register: SCON_REG1
7 6 5 4 3 2 1 0
SCON7 SCON6 SCON5 SCON4 SCON3 SCON2 SCON1 SCON0
State of Reset: FFH

0 SCON0 State of serial control of power stage 1
Register: SCON_REG2
7 6 5 4 3 2 1 0
SCON15 SCON14 SCON13 SCON12 SCON11 SCON10 SCON9 SCON8
State of Reset: FFH

Data Sheet 15 V7, 2007-06-11

TLE 6244X
Register: SCON_REG3
7 6 5 4 3 2 1 0
1 1 1 1 1 1 SCON17 SCON16
State of Reset: FFH

7-2 No function: HIGH on reading
Data Sheet 16 V7, 2007-06-11

TLE 6244X
1.6.2 Diagnostics/Encoding of Failures
Description of the SPI Registers
(SPI Instructions: RD_DIA1...5)
Register: DIA_REG1
7 6 5 4 3 2 1 0
DIA7 DIA6 DIA5 DIA4 DIA3 DIA2 DIA1 DIA0
State of Reset: FFH

Access by Controller: Read only
1-0 DIA (1-0) Diagnostic Bits of power stage 1
Register: DIA_REG2
7 6 5 4 3 2 1 0
State of Reset: FFH

Data Sheet 17 V7, 2007-06-11

TLE 6244X
Register: DIA_REG3
7 6 5 4 3 2 1 0
State of Reset: FFH

Register: DIA_REG4
7 6 5 4 3 2 1 0
State of Reset: FFH

Data Sheet 18 V7, 2007-06-11

TLE 6244X
Register: DIA_REG5
7 6 5 4 3 2 1 0
1 1 1 UBatt DIA35 DIA34 DIA33 DIA32
State of Reset: FFH

4 UBatt 0: Voltage Level at Pin UBatt is below 2V (typically)
1: Voltage Level at Pin UBatt is above 2V (typically)
Diagnosis of UBatt is only possible if UVDD > 4.5V
Status of UBatt is not latched.
7-5 No function: High on reading
Encoding of the Diagnostic Bits of the Power Stages

DIA(2*x-1) DIA(2*x-2) State of power stage x x = 1..18
1 1 Power stage o.k.
1 0 Short-circuit to UBatt (SCB) / OT
0 1 Open load (OL)
0 0 Short-circuit to ground (SCG)
Data Sheet 19 V7, 2007-06-11

TLE 6244X
1.6.3 Configuration
The µsec-bus is enabled by this register. In addition the shut off at SCB can be configured for the
power-stages OUT9, OUT10 and OUT15... OUT18.
CONFIG (Read and write)

7 6 5 4 3 2 1 0
O16-SCB O15-SCB O10-SCB O9-SCB O18-SCB O17-SCB BMUX 1
State of Reset: FFh

0 No function: HIGH on reading
1 BMUX 1: parallel inputs INx enabled
0: µsec-Bus Interface enabled
2 O17-SCB 1: The output OUT17 is switched off in case of SCB
0: The output is not switched off in case of SCB
7 O16-SCB 1: The output OUT16 s switched off in case of SCB
Description of the µsec-bus see chapter 1.7
Data Sheet 20 V7, 2007-06-11

TLE 6244X
1.6.4 Other
Reading the IC Identifier (SPI Instruction: RD_IDENT1):
IC Identifier1 (Device ID)

7 6 5 4 3 2 1 0
ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0

7...0 ID(7...0) ID-No.: 10101000
Reading the IC revision number (SPI Instruction: RD_IDENT2):
IC revision number
7 6 5 4 3 2 1 0
SWR3 SWR2 SWR1 SWR0 MSR3 MSR2 MSR1 MSR0

7...4 SWR(3...0) Revision corresponding to Software release: 0Hex
3...0 MSR(3...0) Revision corresponding to Maskset: 0Hex
Reset of the Diagnostic Information (SPI Instruction: DEL_DIA):
Resets the 5 diagnostic registers DIA_REG1...5 to FFH and the common overtemperature flag in regis-
ter STATCON_REG (Bit4) to High. These bits are only cleared by the DEL_DIA instruction when there
is no failure entry at the input of the registers.
Access is performed like a writing access with any data byte.
In the case a power stage is shut off because of SCB, the output is activated again by the DEL_DIA
instruction and the filtering-time is enabled. Therefore in case of SCB the output is activated and shut
off after the shutoff delay.
For a power stage in the current limitation mode, the current limitation mode is left, if a DEL_DIA
instruction has been received. If there is still the condition for SCB the current limitation mode
is entered again.
On the following pages the conditions for set and reset of the SCB report in DIA_REGx is shown in
several schematics. The signal „power stage control“ is generated as follows:
INi=“ON“ ABE not active

SPI=“ON“ power stage control = „ON“
µsec=“ON“ OR AND
Data Sheet 21 V7, 2007-06-11

Schematic of SCB report of power stages OUT1...7,9...18 (power stage programmed for
shut-off in case of SCB), SCB entry deleted by DEL_DIA after SCB condition disappeared
Data Sheet
and power stage control was toggled
SCB condition SCB no SCB
tDIAG tDIAG tDIAG tDIAG
OUTx On On On On On On
Fault entry
in DIA_REGx SCB SCB SCB
22
DEL_DIA command
Reset
power stage
control On On On On On
TLE 6244X
V7, 2007-06-11
Data Sheet
shut-off in case of SCB), SCB entry deleted by Reset after SCB condition disappeared
and power stage control was toggled
Fault entry
23
DEL_DIA command
Reset
power stage
control On On On On On
TLE 6244X
V7, 2007-06-11
Data Sheet
shut-off in case of SCB), SCB entry deleted by DEL_DIA after SCB condition disappeared
but power stage control was not toggled
Fault entry
24
DEL_DIA command
Reset
power stage
control On On On On
TLE 6244X
V7, 2007-06-11
Data Sheet
shut-off in case of SCB), SCB entry deleted by Reset after SCB condition disappeared
but power stage control was not toggled
OUTx On On On On On
Fault entry
25
DEL_DIA command
Reset
power stage
control On On On On
TLE 6244X
V7, 2007-06-11
Schematic of SCB report of power stages OUT9,10,15...18 (power stage programmed for
Data Sheet
current limitation in case of SCB), SCB resp. OT flag entry deleted exemplary by DEL_DIA
after SCB resp. OT condition disappeared and power stage control was toggled
OT condition no OT OT no OT
tDIA,OT tDIA,OT
OUTx On On On On On
tDIAG tDIAG tDIAG

Fault entry
26
common OT flag
OT
in STATCON_REG
DEL_DIA command
Reset
power stage
control On On On On
TLE 6244X
V7, 2007-06-11
TLE 6244X
Reading Input1 (SPI Instruction: RD_INP1)

:
Register INP_REG1
7 6 5 4 3 2 1 0
IN8 Test 0 IN5 IN4 IN3 IN2 IN1

0..4 IN(1...5) Status of the input pins IN1... IN5
5 No function: LOW on reading
6 Test µsec-test-bit, the bit D8 of the µsec-bus is read
7 IN8 Inverted status of the input pin IN8:
Low level at pin IN8: Bit 7 = 1
High level at pin IN8: Bit 7 = 0
Reading Input2 (SPI Instruction: RD_INP2):
Register INP_REG2
7 6 5 4 3 2 1 0
0 IN15 IN14 IN13 IN12 IN11 IN10 IN9

0..6 IN9...IN15 Status of the input pins IN9...IN15
7 No function: LOW on reading
The input pins IN1..IN5 and IN8...IN15 can be used as input port expander by reading the status of
the input pins using the SPI-commands RD_INP1/2. If the µsec-bus-interface is enabled (BMUX=0) the
pull-up current sources at the input IN1..5 and IN9..15 are disabled. If BMUX=1 the pullup current
sources at these pins are enabled. The pull-up/pull-down current sources of the other input pins are
not effected by the bit BMUX.
On executing the read instruction on RD_INP1/2, the present status (not latched) of the input pins INx is
read back (exception: bit IN8 represents the inverted status of input pin IN8).
Data Sheet 27 V7, 2007-06-11

TLE 6244X
Reading the State resp. the Configuration:

(SPI Instructions: WR_STATCON, RD_STATCON)
Register: STATCON_REG
7 6 5 4 3 2 1 0
CONFIG2 CONFIG1 CONFIG0 STATUS4 STATUS3 STATUS2 STATUS1 STATUS0

0 STATUS0 Bit = 1: No overvoltage at VDD
Bit = 0: Overvoltage at VDD resp. state of overvoltage still
stored (reset by CONFIG0 = 0)
Overvoltage information (bit STATUS0 = 0) will not be reset by an
external reset signal (pin RST=low). Overvoltage will be detected
and stored (CONFIG0 = 1) during RST=low. The information will be
deleted when an internal (undervoltage) reset occurs or when
CONFIG0 is set to 0.
1 STATUS1 Bit = 1: No undervoltage at VDD

Bit = 0: Undervoltage at VDD
2 STATUS2 Reading the voltage level at ABE
3 STATUS3 Common error flag
Bit =1: At present no error is entered in one of the 5 diag-
nostic registers DIA_REG1..5.
Bit = 0: For at least at one power stage an error has been
detected and entered in the corresponding diagnostic
register.
4 STATUS4 Common overtemperature flag
Bit = 1: No overtemperature detected since the last reset
of diagnostic information (by del_dia instruction,
RST = Low or undervoltage at VDD (see 3.2. ))
Bit = 0: Overtemperature for at least one power stage has
been detected since the last reset of the
diagnostic information (by del_dia instruction,
RST = Low or undervoltage at VDD (see 3.2. ))
State of Reset: 1
5 CONFIG0 Bit = 1: Latch function for overvoltage at VDD is switched on
Bit = 0: Latch function for overvoltage at VDD is switched off
State of Reset: 1
Data Sheet 28 V7, 2007-06-11

TLE 6244X
6 CONFIG1 Bit = 1: Lower threshold of VDD-monitoring is lifted

if bit CONFIG2 = 0 (test of switch-off path)
Bit = 0: Upper threshold of VDD-monitoring is reduced
if bit CONFIG2 = 0 (test of switch-off path)
State of Reset: 1
7 CONFIG2 Bit = 1: Test of VDD threshold is switched off
Bit = 0: Test of VDD threshold is switched on
State of Reset: 1
Data Sheet 29 V7, 2007-06-11

TLE 6244X
1.7 µsec - Bus Interface

The µsec-bus-interface is one of three possibilities to control the power stages. OUT1...OUT7
and OUT9...OUT16 are influenced by the reset input RST. If RST is set to Low, these power
stages are switched off. After reset they are controlled by the SPI (default initialization of
TLE6244X). Power stage 8 however is not influenced by the reset input if it’s controlled by IN8
and UVDD > 3,5V. Alternatively these outputs can be controlled either by the pins IN1...IN16 or by
the µsec-bus interface. Exception: OUT8 can be controlled by IN8 or by the SPI-interface only.
The bit ’Bus-Multiplex’ (BMUX) in the SPI register CONFIG prescribes parallel access (IN1...IN7,
IN9...IN16) or µsec-bus control (see figure below). Exception: If BMUX is set to ‘0’ only the power-
stages OUT1...OUT7 and OUT9...OUT16 are controlled by the µsec-bus.
Main features:
- 16 data bits for each data-frame (at the pin FDA)
- 16 clock-pulses for each data-frame (at the pin FCL)
- clock frequency TLE6244: 0...16 MHz
- one sync -input (pin SSY) to latch the input data stream
- input level interface same as for IN6, IN7, IN16
- no error correction
Data-Frame
SSY
FCL
FDA D0 D1 D14 D15 don’t care D0
INx BMUX
FDA
16 bit shift register
FCL
OUTx
Glitch 16 bit µsec-bus Reg.

SSY Filter
SCON_REG
SPI
SPI-shift-reg
MUX_REG
Principle of the µsec-bus interface
Data Sheet 30 V7, 2007-06-11

TLE 6244X
When the bit BMUX in CONFIG is set to Low, the power stages 1...7 and 9...16 are controlled by
the µsec-bus-interface on condition that registers MUX_REG1/2 are configured for serial access.
The received µsec-bus bit stream (D0... D15) is latched into a 16-bit register by the rising edge at
SSY. Power stages 1...7 and 9...16 are switched according to bits D0...D7 and D9...D15:
µsec-bus control of µsec-bus control of

power stage power stage
D0 OUT14 D8 µsec-bus Test

Bit
D1 OUT1 D9 OUT11
D2 OUT2 D10 OUT10
D3 OUT3 D11 OUT9
D4 OUT4 D12 OUT12
D5 OUT5 D13 OUT13
D6 OUT6 D14 OUT16
D7 OUT7 D15 OUT15
Bit Dx = 0: Power stage OUTx is switched on

Bit Dx = 1: Power stage OUTx is switched off
State of reset: FFFFH
Because the power stage 8 is not controlled by the µsec-bus-interface, the corresponding bit D8
can be used as test bit, that can be read back by the SPI-interface (see register RD_INP1).
If the µsec-bus-interface is used to control the power stages, the input pins IN1..IN5 and
IN8...IN15 can be used as input port expander by reading the status of the input pins by the SPI-
commands RD_INP1/2.
Data Sheet 31 V7, 2007-06-11

TLE 6244X
1.8 Unused Power Stages
To avoid an „open load“ fault indication an unused power switch has to be connected to an exter-
nal pull up resistor connected to UUB or has to be switched on by the input pin or via SPI or the
µsec-bus-interface.
UUBatt Voltage
regulator
Udrop RPull-up
UBatt
UUB
UBR
TLE6244X Idiag
OUTi
UthresOL
RPull-up,max = (UBRmin - Udrop,max - UthresOL,max) / Idiag,max
UBRmin is the required minimum battery voltage for diagnostic function of the ECU. The drop volt-
age is composed of the drop voltage of the regulator and the drop voltage of the reverse protec-
tion circuit of the regulator resp. the forward voltage of a reverse protection diode.
Attention:
This equation also applies to power switches that are used as signal drivers (pull up resistor
inside ECU or outside ECU): the permissible pull up resistance without a wrong diagnostic infor-
mation is calculated by the same equation. On dimensioning the pull up resistance in combination
with the diagnostic current, in applications as signal drivers attention must be paid especially to
the required high level (also for low battery voltage).
Data Sheet 32 V7, 2007-06-11

TLE 6244X
1.9 Timing Diagram of the Power Outputs
1.9.1 Power Stages
UINi
UINiH
UINiL
UOUTi
UCLi
0.8UCLi*)
soff
UBATT
0.8UBATT
son
0.2UCLi
0.2UBATT
t
tdon tson tdoff tsoff
If the output is controlled via SPI the timing starts with the positive slope at SS
If the output is controlled by the µsec-bus, the timing starts with the pos. slope of SSY
*) With ohmic load, UCLi = UBatt
Data Sheet 33 V7, 2007-06-11

TLE 6244X
1.10 VDD-Monitoring
Overview:
The VDD-monitoring generates a „low“ signal at the bidirectional pin ABE if the 5V supply volt-
age at pin VDD is out of the permissible range of 4.5V...5.5V. On ABE = low the power stages of
TLE6244X are switched off. Exception: OUT8 is not switched off in case of parallel control via
IN8 by the VDD monitoring undervoltage threshold, but by a threshold of 3.5V at VDD.
On shorting pin ABE to VDD or UBATT (≤ 36V), the power stages will be switched off in case of
undervoltage or overvoltage at pin VDD in spite of ABE = high.
The behavior of the ABE level on the return of VDD out of the undervoltage range into the cor-
rect range is not configurable. At the transition from undervoltage to normal voltage the signal
at pin ABE goes high after a filtering time is expired. The behavior of the ABE level on the
return of VDD out of the overvoltage range into the correct range is configurable in
STATCON_REG, Bit5. At the transition from overvoltage to normal voltage the signal at pin ABE
goes high either after a filtering time (OV not latched) or after a SPI writing instruction (OV
latched, state after reset).
On undervoltage condition the signal at pin ABE goes high after a filtering time is expired. On
overvoltage condition pin ABE goes high either after a filtering time or after a SPI writing instruc-
tion. Before this SPI instruction is sent to TLE6244X appropriate tests can be carried out by the
controller.
If the voltage at pin VDD is below the lower limit or is resp. was above the upper limit, this can
be read out by the SPI instruction RD_STATCON.
VDD-monitoring has no influence on SCON_REGx, MUX_REGx, DIA_REGx, CONFIG and
INP_REGx.
If output stages are switched off by the internal over-/undervoltage detection or by externally
applying a low signal at the ABE pin, no failure storage (DIAREG1...5) may occur.
Description in Detail:
Description of the Register:

STATCON_REG
Bit 7 1: Normal operation

0: Test of VDD threshold
Access by controller: read/write
State of reset: 1
Bit 6 1: Testing the lower threshold (if bit 7 = 0)

0: Testing the upper threshold (if bit 7 = 0)
State of reset: 1
Bit 5 1: ABE latched after overvoltage

0: ABE deactivated immediately after the disappearance of the overvoltage
State of reset: 1
Bit 2 Reading out the level at pin ABE

Access by controller: read only
Bit 1 1: no undervoltage at pin VDD

0: undervoltage at pin VDD
Data Sheet 34 V7, 2007-06-11

TLE 6244X
Bit 0 1: no overvoltage at pin VDD

0: overvoltage at pin VDD resp. state of overvoltage still stored
Testing the VDD-Monitoring:
Upper threshold:
By writing 000xxxxxb in the register STATCON_REG the overvoltage threshold is reduced by
0.8V. In STATCON_REG Bit 0 has to be LOW then.
After writing 110xxxxxb in the register STATCON_REG Bit 0 in STATCON_REG must be HIGH
again.
Lower threshold:
By writing 010xxxxxb in the register STATCON_REG the overvoltage threshold is increased by
0.8V. In STATCON_REG Bit 1 has to be LOW then.
After writing 110xxxxxb in the register STATCON_REG Bit 1 in STATCON_REG must be HIGH
again.
Example of configuration:
Requirement: After overvoltage ABE is to be LOW;

After overvoltage a self-test is carried out by the ECU, afterwards ABE is deactivated.
Register STATCON_REG is set to 111xxxxxb during driving cycle.

When ABE becomes active, overvoltage can be detected by reading out STATCON_REG.
After the ECU’s self-test a reset condition is achieved by writing 110xxxxxb into the register
STATCON_REG. This reset is only possible after disappearance of the overvoltage condition
because the set input is dominant. The reset signal is withdrawn by writing 111xxxxxb.
Data Sheet 35 V7, 2007-06-11

Data Sheet
Block Diagram: VDD-Monitoring
VDD
VDD
„L“ = Undervoltage at VDD

1
+ ABE
0 -
Glitch filter
Set dominant
1 +
- S Q &
0 R
„L“ = Overvoltage at VDD
GND1,2
GND_ABE Undervoltage
Reset
GND_ABE
36
100k
>1
1
>1
1
&
„L“ = Switch Off
STATCON_REG Power Stages
7 6 5 4 3 2 1 0
0 0 Test: Overvoltage Threshold
<=
0 1
<=
Test: Undervoltage Threshold

1 X default
TLE 6244X
V7, 2007-06-11
TLE 6244X
1.11 Notes for the Application in Commercial Vehicles
> 37V in case of

For electric systems with 24V battery voltage, that can even increase to _
load dump, some peculiarities have to be observed!
The static voltage at pin UBatt without destruction is limited to 37V, therefore this pin must either
be connected to the 5V supply voltage VDD or else the voltage at pin UBatt has to be limited by
adequate external circuitry. By connecting pin UBatt to VDD the values of Rds, on of the power
switches will increase up to 20%.
The power stages 7...18 are equipped with a 40V active clamping. Therefore this power stages
must only drive loads with an accordingly high resistance that can be switched on in case of over-
voltage (e.g. a maximum load dump voltage of 60V and a load resistor of 1kΩ result in a power
dissipation of 0.8W for each power stage. For all of the 12 power stages together there is a power
dissipation of 9.6W for the typical duration of a load dump of 500ms.).
The restrictions listed above are no longer relevant in case of a „overvoltage-protected

battery voltage“within the 24V electric system that limits the voltage to e.g. a maximum of
37V.
The thresholds of the currents, on which the power stages are switched off in case of overload,
are increased by approximately 25% if there is a voltage at pin UBatt higher than19V (reason:
jump start requirements in 12V electric systems). Exception: OUT9 and OUT10 and OUT15...
OUT18. See characteristics in chapters 3.5.3, 3.6.3, 3.7.3 and 3.8.3.
The restrictions concerning overload of power stages (see 3.5.2, 3.6.2, 3.7.2 and 3.8.2) and per-
missible clamping energy (see 3.5.8, 3.6.8, 3.7.8 and 3.8.8) are relevant further on.
1.11.1 Notes for short circuit limitation

The power stages are short circuit protected for the following conditions:
The max. voltage at the output pins are limited to 36V and the TLE6244 is not operating in the
booster mode.
The power stages will be switched on/off with a max. frequency of 1 kHz.
Only a 40 msec burst with the 1 kHz on/off-frequency is allowed, with a minimum burst repetition
time of 1 sec. The maximum number of burst repetition cycles is 25. The number of driving cycles
under these conditions is limited to 100 in lifetime. The temperature of the slug of the PG-MQFP-
64
package must not exceed 130°C.
These limitations are valid for UBatt > 24 V.
For Ubatt ≤ 24 V the number of driving cycles under these conditions is extended to 1000 in life-
time.
Data Sheet 37 V7, 2007-06-11

TLE 6244X
1.12 Notes for the Diagnostics
- SCB entry in DIA_REGx see diagrams in chapter 1.6.4.
- In case of overvoltage at pin VDD (VDD > 5,5V) the diagnostic information can be wrong. In
that case, the diagnostic information has to be cleared with the DEL_DIA instruction.
- The filtering time restarts when the output voltage passes the diagnostic threshold for
short to ground (SCG).
- Diagram of the typical diagnostic current:
IOUTPUT
580 µA
A
A
3.5V
0V 2.7V 5V 14V
UOUT
B
-130 µA
A A
Short to GND Open load o. k.
C D
A: Diagnostic current (see 3.11.3)
B: Bias Voltage Open Load (see3.11.2)
C: Short to GND Threshold (see 3.11.1.2)
D: Open load Threshold (see 3.11.1.1)
Data Sheet 38 V7, 2007-06-11

Exemplary for a power stage controlled by input pin INx. Diagram is accordingly valid for serial con-
trol via SPI or µsec-bus. The SPI instruction DEL_DIA deletes all fault registers in any state.
Data Sheet
On active reset resp. active ABE (VDD is out of range) output OUTx is switched off. After reset the
power stage is in state A (except OUT8).
OT Toggling INx HIGH -> LOW
No SCG
SCB OL
Action No No
Fault Fault
A Toggling INx LOW -> HIGH
B No
INx HIGH Action
INx LOW
OUTx off Toggling INx
SCG LOW -> HIGH OUTx on
SCB
OL
Debouncing Debouncing OT
Debouncing Current Control
No SCG SCG Debouncing
OL No SCB No SCB
OL
Fault Entry Fault Entry
01 OL 00 CSG Fault Entry
Fault Entry
10 SCB 10 OT
for OUT1..8, for OUT9..10
39
OUT11..14 OUT15...16
(if current limitation is configured)
for OUT9..10
OUT15...16 (no current limitation)
OL SCB
OT
SCG No OL SCG No
Fault A Action
C D
Fault Entry INx LOW
10 SCB INx LOW
OUTx off OUTx on
max current
Toggling INx 3..5A Fault Entry
LOW -> HIGH 10 SCB
State Diagram of the Power Stages Diagnostics
OT no OT A
At DEL_DIA: no OT
C -> B INx LOW
Fault Entry OT
D -> B Debouncing OUTx off
10 OT Toggling INx
A no action OT
LOW -> HIGH
TLE 6244X
V7, 2007-06-11
TLE 6244X
1.13 Parallel Connection of Power Stages
The power stages (PS) which are connected in parallel have to be switched on and off simultaneously.
The corresponding SPI-Bits SCONx have to be in the same register (see page 15), when the PS are
serial controlled via SPI.
In case of overload the ground current and the power dissipation are increasing. The application has to
take into account that all maximum ratings are observed (e.g. operating temperature TJ and total
ground current IGND, see page 36, 37).
Max. number of parallel connections: 3
The following statements apply to PS within the same TLE6244X
The max. short circuit shutdown threshold of the parallel connected PS is the summation of the corre-
sponding max. values of the PS (ISC,OUTx + ISC,OUTy +....).
Max. Nominal Current Max. Clamping Energy On Resistance

2 symmetrical PS 0.9 x (Imax,OUTx + Imax,OUTy) 0.75 x (ECl,OUTx + ECl,OUTy)
0.5 x Ron,OUTx,y
(see note 1)
2 PS of the same type 0.85 x (Imax,OUTx + Imax,OUTy) 0.75 x (ECl,OUTx + ECl,OUTy) 0.5 x Ron,OUTx,y
(see note 2)
3 PS of the same type 0,8 x 0,58 x
0.34 x
(see note 2) (Imax,OUTx + Imax,OUTy+ (ECl,OUTx + ECl,OUTy +
Ron,OUTx,y,z
Imax,OUTz) ECl,OUTz)
2 PS with the same nominal 0.7 x (Imax,OUTx + Imax,OUTy) Clamping energy

current, but different clamp- of the PS with the lower Ron,OUTx x Ron,OUTy
ing voltage (application with- clamping voltage Ron,OUTx + Ron,OUTy
out
free-wheeling-diode)
(see note 3)
2 PS with the same nominal 0.7 x (Imax,OUTx + Imax,OUTy)
current, but different clamp- no clamping required Ron,OUTx x Ron,OUTy
ing voltage (application with Ron,Ax + Ron,OUTy
free-wheeling-diode)
(see note 3)
2 PS with the same clamp-
Imax,OUTx
ing voltage, but different Ron,OUTx x Ron,OUTy
ECl,OUTx
nominal Max Imax,OUTy Min Ron,OUTx + Ron,OUTy
current (see note 4) ECl,OUTy
0.75 x (Imax,OUTx +
Imax,OUTy)
2 PS with different nominal Clamping energy

current and different clamp- Imax,OUTx of the PS with the lower Ron,OUTx x Ron,OUTy
ing voltage (see note 5) Max clamping voltage
Imax,OUTy Ron,OUTx + Ron,OUTy
Data Sheet 40 V7, 2007-06-11

TLE 6244X
note 1: For every PS there exists only one symmetrical PS

OUT1 and OUT2 are symmetrical PS.
...
note 2: PS of the same type have the same nominal current and the same clamping voltage
note 3: Parallel connection of PS-type 2,2A/45V with type 2,2A/70V
note 4: Parallel connection of PS-type 2,2A/45V with type 3.0A/45V or

Parallel connection of PS-type 1.1A/45V with type 2,2A/45V
note 5: Parallel connection of PS-type 2,2A/70V with type 1.1A/45V or

Parallel connection of PS-type 2,2A/70V with type 3.0A/45V
If the power stages are configured for static current limitation the max. current limitation of the parallel
connected PS is the summation of the corresponding max. values of the
PS (ISC,OUTx + ISC,OUTy +....).
The following statements apply to Power Stages within different TLE6244X
The application has to take into account that all maximum ratings of each TLE6244X are observed.
Data Sheet 41 V7, 2007-06-11

TLE 6244X
2. Maximum Ratings
2.1 Definition of Test Conditions
The integrated circuit must not be destroyed if maximum ratings are reached. Every maximum
rating is allowed to reach, as far as no other maximum rating is exceeded.
Unless otherwise indicated all voltages are referred to GND (GND pins 1...8 connected to each
other)
Positive current flows into the pin.
2.2 Test Coverage (TC) in Series Production
In the standard production flow not all parameters can be covered due to technical or economic
reasons. Therefore the following test coverage was defined:
A) Parameter test
B) Go/NoGo test (in the course of release qualification/characterization: parameter test)
C) Guaranteed by design (covered by lab tests, not considered within the standard production
flow)
2.3 Thermal Limits
Operating temperature TLE6244

continuous -40°C ≤ TJ ≤ 150°C
additionally only for the power switches 150°C ≤ TJ ≤ 200°C
(for 100h accumulated)
Storage temperature -55°C ≤ TC ≤ 125°C
Thermal resistance RthJC ≤ 2,5 K/W
2.4 Electrical Limits
Limits must absolutely not be exceeded. By exceeding only one limit the integrated circuit might
be destroyed.
Power Supplies UVDD and UUBatt
Static (without destruction) *) -0.3V ≤ UVDD ≤ 36V

-0.3V ≤ UUBatt ≤ 37V
Dynamic <10µsec (without destruction) -0.5V ≤ UVDD ≤ 36V

-0.5V ≤ UUBatt ≤ 40V
Dynamic (500 ms, 10 x in lifetime, without destruction) -0.5V ≤ UUBatt ≤ 40V
*) UVDD > 5.5V is allowed only in case of error conditions! Not suitable for continuous
operation.
SPI Output
Output voltage -0.3V ≤ USO ≤ 36V
Data Sheet 42 V7, 2007-06-11

TLE 6244X
Output current ISO ≤ 5mA
Outputs Low Side Switches
Static voltage (without destruction) OUT1...6 ≤ 64V

OUT7..18 ≤ 40V
Dynamic voltage without destruction after ISO/DIS7637-1, pulses 1 to 4

OUT1 to 6, OUT9 to16: via external load (e.g. 2W lamp) ≤ 2ms
OUT7, OUT8, OUT17 and OUT18: via external load ≤ 2ms
Ground Current
Total current GND1+2 (pins 26/27) IGND1+2 ≤ 18 A

(total ground current of OUT5,6,9,10,17,18)

(total ground current of OUT1,2,7,8,11,12,15,16)

(total ground current of OUT3,13)

(total ground current of OUT4,14)
Attention: Even if all ground pins are connected with each other on the PCB the total
ground currents IGND1+2 and IGND3+4 and IGND5+6 and IGND7+8 must not be exceeded.
The 4 ground pins GND1...4 are internally connected to the heat sink via an unspecified
rivet joint. Therefore it is advisable to short-circuit the 4 ground pins on the PCB and to
connect them with the heat sink. In addition the 4 ground pins GND5..8 must be connected
to the other ground pins on the PCB
Inputs of the Power Switches, SPI Inputs, Reset and Shut-off of the Power Stages
Input voltage -0.3V ≤ UINi,RST,SS,SI,SCK,ABE ≤ 36V
Input currents see 3.4.4 , 3.9.1 , 3.9.2 , 3.9.3 , 3.13.2
Pin RST
Minimum reset duration (Power-On) 15 ms
Input currents see 3.4.4
Data Sheet 43 V7, 2007-06-11

TLE 6244X
3. Electrical Characteristics
3.1 Operating Out of this range the power stages
Range can be shut off by the VDD-moni-
(see also 3.13 toring except OUT8
VDD-monitoring
ABE) Voltage referred to GND_ABE UVDD 4.7 5.3 V
Minimum reset duration tRST,min 15 ms

(Power-On)
Minimum reset duration tRST,min 1 µs

in operation mode
4.5V ≤ UVDD ≤ 5.5V
3.2 Validity of Parameters are valid for
Parameters 4.5V ≤ UVDD ≤ 5.5V,
4.5V ≤ UUBatt ≤ 37V
TLE6244: -40°C ≤ TJ ≤ 150°C and
2 power stages in
current limitation
unless otherwise noted.
If VDD-monitoring is active the
power stages are switched off
except OUT8 (see page 28).
Positive current flows into the pin,
negative current flows out of the
pin.
Unless otherwise noted all volt-
ages are referred to GND
(GND1...8 connected with each
other).
If the UVDD falls below this

trashed the power stages (except UVDD 3.5 4.2 4.5 V
OUT8) are switched off.
If UVDD rises above this threshold
the power stages work regularly
after a delay time of 250 µsec.
Threshold for shut off of OUT8:

If UVDD rises above this threshold UVDD 3.5 V
the power stages work regularly
after a delay time of 250 µsec.
Supply voltage UVDD 4.5 5.5 V
Data Sheet 44 V7, 2007-06-11

TLE 6244X
3.3 Power Con- UVDD ≤ 5.5V A IVDD 20 mA

sumption 5,5 V < UVDD < 36 V (IC is not C IVDD 50 mA
destroyed)
UUBatt = 14V A IUBatt 3 mA
UUBatt = 28V A IUBatt 4 mA
UUBatt ≤ UVDD A IUBatt 1 mA
Power consumption in standby A IUBatt 200 µA

mode in case of missing UVDD,
UUBatt ≤ 14V
3.4 Inputs of the Outputs are switched off if inputs
Power Stages are open (parallel control).
and Reset
IN1...IN16, RST
3.4.1 Low Level Reset not active, B URSTL 1.0 V
Power stage on for
i = 1...5, 9...15 B UINiL 1.0 V
i = 6, 7, 16 B UINiL 1.0 V
Power stage off for
i=8 B UINiL 1.0 V
3.4.2 High Level Power stage off for B URSTH 1.7 V
i = 1...7, 9...16 B UINiH 2.0 V
V
Power stage on for
i=8 B UINiH 2.0 V
3.4.3 Hysteresis C ∆UINi, 0.1 0.6 V
∆URST
3.4.4 Input Cur- -0.3V ≤ UINi,RST ≤ UVDD A/B IINi,RST -100 5 µA
rents (i = 1...7, 9...16)
In, RST
UVDD ≤ UINi ≤ 36 V C |IINi| 5 µA
(i = 1...7, 9...16)
-0.3V ≤ UIN8 ≤ UVDD A/B IIN8 -100 100 µA
0.8V ≤ UIN8 ≤ UVDD, pull down A IIN8 20 40 100 µA

UVDD ≤ UIN8 ≤ 36 V, pull down C IIN8 20 40 100 µA
0V ≤ URST ≤ UVDD - 1.7V, pull up A -IRST 20 40 100 µA
0V ≤ UINi ≤ UVDD - 1.7V, pull up A -IINi 5 10 20 µA

(i = 6,7,16)
Bit BMUX = 1 (CONFIG_REG):

0V ≤ UINi ≤ UVDD - 1.7V, pull up A -IINi 20 40 100 µA
(i = 1..5, 9..15)
Bit BMUX = 0 (CONFIG_REG):

0V ≤ UINi ≤ UVDD, high-impedance A |IINi| 1 µA
(i = 1..5, 9..15)
Data Sheet 45 V7, 2007-06-11

TLE 6244X
3.4.5 Input Protec- Input clamping at INi (i = 1...16):

tion INi No malfunction during clamping.
Max. clamping current (externally

limited)
static C |IINi| 2 mA
dynamic (t < 2ms) C |IINi| 5 mA
Max. clamping voltage

IINi = -5mA C UINi -3 V
IINi = +2mA (t < 2ms) C UINi 40 70 V
External current limitation at INi is

only provided if µsec-bus control is
used. In that case INi are used as
digital inputs. If µsec-bus is not
used, there is no external resistor
for current limitation. See 2.4
“Inputs of the Power Switches, SPI
Inputs...”
3.5 Power Outputs In case of open input (parallel con-
2.2A/70V trol) or missing power supply the
OUT1...6 power stage is switched off. Paral-
lel connection of power stages is
possible.
3.5.1 Nominal Cur- C IOUT1..6 2.2 A
rent
3.5.2 Extended Cur- IOUT1...6 > 2.2A
rent Range
Accumulated operating time C 100 h
3.5.3 Maximum 4.5V ≤ UUBatt ≤ 17V

Current TJ = -40°C B IOUT1..6 2.4 4.0 A
(Short Circuit TJ = 150°C A IOUT1..6 2.2 3.7 A
Shut- down
Threshold)
UUBatt > 21V
TJ = -40°C B IOUT1..6 3 5.0 A
TJ = 150°C A IOUT1..6 2.7 4.6 A
Above this limit short circuit to
UBatt is detected. For the duration
of the shutoff delay time tVoff (see
3.5.4) the output current is limited
to approximately this value. If the
short circuit condition is still
present after tVoff, the output is
switched off. An error is stored
after tDiag (see 3.11.4).
Data Sheet 46 V7, 2007-06-11

TLE 6244X
Between -40°C and 150°C an

approximately linear characteristic
line can be assumed for the short
circuit shutdown threshold.
Between 17V ≤ UUBatt ≤ 21V, the

short circuit shutdown threshold is
switched.
A power stage that is switched off

in case of SCB can be switched on
again by an off/on cycle at the cor-
responding input pin resp. by the
change of the state of the corre-
sponding SPI bit SCONx (see
page 16), by the µsec-Bus, by a
DEL_DIA instruction or can be
released again by reset. If the fault
register is cleared before this
release (by a DEL_DIA instruc-
tion), a new fault entry of SCB is
immediately carried out, even if
SCB condition is no longer
present.
3.5.3.1 Maximum See Note 1.11.1 C UOUT 36 V
Battery Volt- 1..6
age at Short
Circuit to Bat-
tery
3.5.4 Shutoff Delay Shutoff delay of the power stages B tVoff 60 215 µs
after detection of SCB
3.5.5 On Resis- OUT1,2,5,6: TJ = 25°C A Ron1,2,5,6 220 320 400 mΩ
tance OUT1,2,5,6: TJ = 150°C A Ron1,2,5,6 420 600 750 mΩ
OUT1,2,5,6: TJ = -40°C A Ron1,2,5,6 180 250 310 mΩ
OUT3,4: TJ = 25°C A Ron3, 4 210 300 380 mΩ
OUT3,4: TJ = 150°C A Ron3, 4 410 580 720 mΩ
OUT3,4: TJ = -40°C A Ron3, 4 170 240 300 mΩ
For UUBatt ≤ 10V Ron is increased
up to 20%.
3.5.6 On/off Delay „On“ B tdon1...6 10 µs
Times B tson1...6 5 µs
„Off“ B tdoff1...6 10 µs
(Measurement with ohmic load) C tsoff1...6 10 µs
|tdon - tdoff| C ∆td 5 µs
switch-on slew rate C son1...6 15 V/µs
switch-off slew rate C soff1...6 21 V/µs
Data Sheet 47 V7, 2007-06-11

TLE 6244X
3.5.7 Leakage Cur- UVDD = 0V, UOUT1...6 = 14V (leak- A IOUT1..6 50 µA

rent age current of the DMOS, diag-
nostic current = 0)
IOUT1..6
UVDD = 0V, UOUT1...6 = 24V (leak- A 200 µA
age current of the DMOS, diag-
nostic current = 0)
3.5.8 Clamping
3.5.8.1 Clamping IOUT1...6 = 0.2A A UOUT1..6 64 76 V
Voltage
3.5.8.2 Matching of Between different outputs with A ∆U 3 V
the Clamp- identical inductive loads
ing Voltage
3.5.8.3 Maximum Linear decreasing current,
Clamping En- fmax = 50Hz (see diagrams
ergy E = f(I) on page 66)
TC ≤ 110°C
IOUT1...6 ≤ 2.2A C E 8.5 mJ
IOUT1...6 ≤ 1.0A C E 19 mJ
IOUT1...6 ≤ 0.5A C E 30 mJ
Clamping En- fmax = 50Hz
ergy
TC ≤ 60°C
IOUT1...6 ≤ 2.2A C E 10.8 mJ
IOUT1...6 ≤ 1.0A C E 22 mJ
IOUT1...6 ≤ 0.5A C E 36 mJ
3.5.8.5 Maximum Each output 75% of the values of C
Clamping En- 3.5.8.3 resp. 3.5.8.4
ergy with two
Outputs con-
nected in par-
allel
3.5.8.6 Maximum For a maximum of 10 times during C E 50 mJ
Clamping En- ECU life (load dump with 400ms
ergy at Load and Ri = 2Ω over the load, e.g. 2W
Dump lamp)
3.5.8.7 Jump Start Each output 150% of the values of C
3.5.8.4.
For a maximum of 10 jump starts
of 2 minutes each during ECU life.
3.5.8.8 Single pulse IOUT1...6 ≤ 0.6A, max 10 000 pulse C E 50 mJ
TC ≤ 60°C
Data Sheet 48 V7, 2007-06-11

TLE 6244X
3.6 Power outputs In case of open input (parallel con-

OUT9...OUT14 power stage is switched off. Paral-
possible.
3.6.1 Nominal Cur- C IOUT9.. 2.2 A
rent .14
3.6.2 Extended Cur- IOUTi > 2.2A

rent Range
3.6.3 Maximum 4.5V ≤ UUBatt ≤ 17V for OUT11..14
Current 4.5V ≤ UUBatt for OUT9/10
(Short Circuit
Shut down TJ = -40°C B IOUTi 2.4 3.8 A
Threshold) TJ = 150°C A IOUTi 2.2 3.7 A
UUBatt > 21V for OUT11...14
TJ = -40°C B IOUTi 3 5 A
TJ = 150°C A IOUTi 2.7 4.6 A
For OUT11... OUT14
present after tVoff, the outputs
OUT11...OUT14 are switched off.
An error is stored after tDiag (see
3.11.4).
The same is true for OUT9,
OUT10 if the static current limita-
tion is not enabled.
line can be assumed.

switched for OUT11..14
Data Sheet 49 V7, 2007-06-11

TLE 6244X

sponding bit for SPI or µsec-bus
by a DEL_DIA instruction or can
be released again by reset. If the
fault register is cleared before this
present.
For OUT9, OUT10
UBatt is detected. The output cur-
rent is limited to approximately this
value if the static current limitation
is configured. An error is stored
after tDiag (see 3.11.4). If the oper-
ation leads to an overtemperature
condition, a second protection
level (about 170°C) will change the
output into a low duty cycle PWM
(selective thermal shutdown with
restart) to prevent critical chip tem-
peratures
Battery Volt- 9..14
age at Short
Circuit to Bat-
tery
after detection of KSUB. For the
duration of tVoff current is limited to
maximum current.
3.6.5 On Resis- TJ = 25°C A Ron9-14 200 300 380 mΩ
tance TJ = 150°C A Ron9-14 380 550 680 mΩ
TJ = -40°C A Ron9-14 150 220 280 mΩ
up to 20%.
Data Sheet 50 V7, 2007-06-11

TLE 6244X
3.6.6 On /off Delay „On“ B tdon 10 µs

Times B tson 5 µs
„Off“ B tdoff 10 µs
(Measurement with ohmic load) C tsoff 10 µs
switch-on slew rate C son 20 V/µs
switch-off slew rate C soff 25 V/µs
3.6.7 Leakage Cur- UVDD = 0V, UOUT9...14 = 14V A IOUTi 50 µA
rent (leakage current of the DMOS,
diagnostic current = 0)
UVDD = 0V, UOUT9...14 = 24V A IOUTi 200 µA

(leakage current of the DMOS,
3.6.8 Clamping
3.6.8.1 Clamping IOUTi = 0.2A A U9...14 40 45 50 V
Voltage
TC ≤ 110°C
IOUT9...14 ≤ 2.2A C E 14 mJ
IOUT9...14 ≤ 1.0A C E 30 mJ
ergy
TC ≤ 60°C
IOUT9...14 ≤ 2.2A C E 17 mJ
IOUT9...14 ≤ 1.0A C E 36 mJ
Clamping En- 3.6.8.2 resp. 3.6.8.3.
ergy with two
Outputs con-
nected in par-
allel
Dump lamp)

3.6.8.3.
3.6.8.7 Single pulse IOUT9...14 ≤ 0.6A, max 10 000 C E 50 mJ
TC ≤ 60°C pulse
Data Sheet 51 V7, 2007-06-11

TLE 6244X
3.7 Power outputs In case of open input (parallel con-

OUT15...OUT16 power stage is switched off. Paral-
possible.
3.7.1 Nominal Cur- C IOUT15 3.0 A
rent IOUT16
3.7.2 Extended Cur- IOUT15,16 > 3.0A
rent Range
3.7.3 Maximum UUBatt > 4.5V
Current TJ = -40°C B IOUT15 3.3 6 A
IOUT16
(Short Circuit TJ = 150°C A 3 5.5 A
Shut down
threshold) Above this limit short circuit to
OUT15/16 are switched off if the
static current limitation is not
enabled. An error is stored after
tDiag (see 3.11.4).
peratures.
Battery Volt- 15,16
age at Short
Circuit to Bat-
tery
3.7.4 Shuttoff Delay Shutoff delay of the power stages B tVoff 60 215 µs
after detection of SCB. For the
maximum current.
Data Sheet 52 V7, 2007-06-11

TLE 6244X
3.7.5 On Resis- TJ = 25°C: A Ron15, 150 220 280 mΩ

tance 16
TJ = 150°C: A Ron15, 270 390 480 mΩ
16
TJ = -40°C: A Ron15, 120 170 210 mΩ
16
up to 20%.
3.7.6 On /off Delay „On“ B tdon 10 µs
Times B tson 5 µs
switch-on slew rate C son 20 V/µs
switch-off slew rate C soff 25 V/µs
3.7.7 Leakage Cur- UVDD = 0V, UOUT15,16 = 14V A IOUT15 50 µA
rent (leakage current of the DMOS, ,16
UVDD = 0V, UOUT15,16 = 24V A IOUT15 200 µA

(leakage current of the DMOS, ,16
3.7.8 Clamping
3.7.8.1 Clamping IOUT15,16 = 0.2A UOUT15, 40 45 50 V
Voltage 16

TC ≤ 110°C
IOUT15,16 ≤ 3.0A C E 18 mJ
IOUT15,16 ≤ 2.2A C E 20 mJ
IOUT15,16 ≤ 1.5A C E 24 mJ
IOUT15,16 ≤ 1.0A C E 40 mJ
ergy
TC ≤ 60°C
IOUT15,16 ≤ 3.0A C E 20 mJ
IOUT15,16 ≤ 1.0A C E 46 mJ
ergy with two
Outputs con-
nected in par-
allel
Data Sheet 53 V7, 2007-06-11

TLE 6244X

Dump lamp)
3.7.8.3.
3.7.8.7 Single pulse IOUT15, 16 ≤ 0.6A, max 10 000 C E 50 mJ
TC ≤ 60°C pulses
3.8 Power Outputs In case of open input (parallel con-
OUT7,8, power stage is switched off. Paral-
OUT17,18 lel connection of power stages is
possible.
3.8.1 Nominal Cur- for OUT7, 8, 17, 18 C IOUTi 1.1 A
rent
3.8.2 Extended Cur- IOUT7,8,17,18 > 1.1A
rent Range
3.8.3 Maximum 4.5V ≤ UUBatt ≤ 17V for OUT7, 8
Current 4.5V ≤ UUBatt for OUT17,18
(Short Circuit
Shut down TJ = -40°C B IOUTi 1.2 2.2 A
Threshold TJ = 150°C A IOUTi 1.1 2.0 A
and static
current limita-
tion)
UUBatt > 21V only for OUT7,8
TJ = -40°C B IOUTi 1.5 2.5 A
TJ = 150°C A IOUTi 1.3 2.3 A
For OUT7, OUT8
OUT7/8 are switched off. An error
is stored after tDiag (see 3.11.4).
The same is true for OUT17
OUT18 if the static current limita-
tion is not enabled.
Data Sheet 54 V7, 2007-06-11

TLE 6244X


switched for OUT7/8
sponding bit for SPI or µsec-bus
by a DEL_DIA instruction or can
be released again by reset. If the
fault register is cleared before this
present.
For OUT17, OUT18
peratures
Battery Volt- 17,18
age at Short
Circuit to Bat-
tery
after detection of SCB. For the
maximum current.
Data Sheet 55 V7, 2007-06-11

TLE 6244X
3.8.5 On Resis- TJ = 25°C A Ron7,8, 400 620 780 mΩ

tance 17,18
TJ = 150°C A Ron7,8, 780 1200 1500 mΩ
17,18
TJ = -40°C A Ron7,8, 290 450 560 mΩ
17,18
For UUBatt ≤ 10V Ron is increased up
to 20%; condition: UVDD > 4.5 V
For OUT8 only:

3.5V<(UVDD, UUBatt)<4.5V
TJ = 25°C A Ron 1300 mΩ
TJ = 150°C A Ron 2200 mΩ
TJ = -40°C A Ron 1050 mΩ
3.8.6 On/off Delay „On“ B tdon 10 µs
Times B tson 5 µs
Switch-on slew rate C son 25 V/µs
Switch-off slew rate C soff 40 V/µs
3.8.7 Leakage Cur- For OUT7,8, OUT1718:
rent
UVDD = 0V, UOUTi = 14V (leakage A IOUTi 50 µA
current of the DMOS, diagnostic
current = 0)
UVDD = 0V, UOUTi = 24V (leakage A IOUTi 200 µA

current of the DMOS, diagnostic
current = 0)
3.8.8 Clamping For OUT7,8, OUT17,18:
3.8.8.1 Clamping IOUTi = 0.2A A UOUTi 40 45 50 V
Voltage
TC ≤ 110°C
IOUTi ≤ 0.6A C E 10 mJ
IOUTi ≤ 1.1A C E 7 mJ
ergy
TC ≤ 60°C IOUTi ≤ 0.6 C E 12 mJ
IOUTi ≤ 1.1A C E 8.5 mJ
Data Sheet 56 V7, 2007-06-11

TLE 6244X

ergy with two
Outputs con-
nected in par-
allel
ergy at Load and Ri = 2Ω over the load)
Dump
3.8.8.3.
of 2 minutes each during ECU life
Data Sheet 57 V7, 2007-06-11

TLE 6244X
3.9 SPI Interface

The timing of TLE6244X is defined as follows:
- The change at output (SO) is forced by the rising edge of the SCK signal.
- The input signal (SI) is sampled on the falling edge of the SCK signal.
- The data received during a writing access is taken over into the internal registers on the rising edge of the
SS
signal, if exactly 16 SPI clocks have been counted during SS = active.
(Also: Only if exactly 16 SPI clocks have been counted the instruction DEL_DIA resets the diagnostic regis-
ters.)
10 9
SS
2 1 11 3 8
SCK
14
13
4 12
7
SO tristate
Bit (n-3) Bit (n-4)...1 Bit 0; LSB
5 6
SI MSB IN Bit (n-2) Bit (n-3) Bit (n-4)...1 LSB IN

X see 3.9.5
n = 16
Data Sheet 58 V7, 2007-06-11

TLE 6244X
3.9.1 Input SCK SPI clock input

3.9.1.1 Low Level B USCKL 1.0 V
3.9.1.2 High Level B USCKH 2.0 V
3.9.1.3 Hysteresis C ∆USCK 0.1 0.6 V
3.9.1.4 Input Capacity C CSCK 10 pF
3.9.1.5 Input Current Pull up current source connected A -ISCK 10 20 50 µA
to VDD
3.9.2 Input SS Slave select signal

3.9.2.1 Low Level TLE6244X is selected B USSL 1.0 V
3.9.2.2 High Level B USSH 2.0 V
3.9.2.3 Hysteresis C ∆USS 0.1 0.6 V
3.9.2.4 Input Capaci- C CSS 10 pF
ty
3.9.2.5 Input Current Pull up current source connected A -ISS 10 20 50 µA
to VDD
3.9.3 Input SI SPI data input

3.9.3.1 Low Level B USIL 1.0 V
3.9.3.2 High Level B USIH 2.0 V
3.9.3.3 Hysteresis C ∆USI 0.1 0.6 V
3.9.3.4 Input Capaci- C CSI 10 pF
ty
3.9.3.5 Input Current Pull up current source connected A -ISI 10 20 50 µA
to VDD
3.9.4 Output SO Tristate output of the TLE6244X

(SPI output);
On active reset (RST) output SO is
in tristate.
3.9.4.1 Low Level ISO = 2mA A USOL 0.4 V
3.9.4.2 High Level ISO = -2mA A USOH UVDD V
- 1.0
3.9.4.3 Capacity Capacity of the pin in tristate C CSO 10 pF
3.9.4.4 Leakage Cur- In tristate A ISO -10 10 µA
rent
Data Sheet 59 V7, 2007-06-11

TLE 6244X
3.9.5 Timing 1. Cycle-Time B t cyc 200 ns

(referred to master)
2. Enable Lead Time C t lead 100 ns

3. Enable Lag Time C t lag 150 ns

4. Data Valid CL = 50pF (5 MHz) C tv 100 ns

Data Valid CL = 200pF (2MHz) C tv 150 ns
(referred to TLE6244X)
5. Data Setup Time C t su 50 ns

6. Data Hold Time C th 20 ns

7. Disable Time C t dis 100 ns

(referred to TLE6244X)
8. Transfer Delay C t dt 150 ns

9. Select time C t sel 50 nsec

10. Access time C t acc 8.35 µsec

11. Serial clock high time C tSCKH 50 ns

12. Serial clock low time C tSCKL 120 ns
C
13. Disable Lead Time tdld 250 ns
C
14. Disable Lag Time tdlg 250 ns
Data Sheet 60 V7, 2007-06-11

TLE 6244X
3.10 µsec-bus
tcyc
FCL/IN16
tswitch
tsetup thold
tshold
FDA/IN6 tSF
SSY/IN7
Timing µsec-bus
Notes for the timing:

Timing definitions are starting or ending at a voltage level of 1V (Low Level) resp. 2V (High Level).
During SSY = high the clock at FCL may be interrupted, i.e. there is no need for a clock during SSY = high.
The clock signal may remain on high or low statically during SSY = high.
A rising edge at SSY and a falling edge at FCL must not occur simultaneously!
On the rising edge of SSY the 16 bits clocked in TLE6244X by the last 16 falling edges at FCL are latched.
3.10.1 Input FCL, µsec-bus interface pins
FDA, SSY
3.10.1.1 Low Level B UFCLl 1.0 V
UFDAl
USSYl
3.10.1.2 High Level B UFCLh 2.0 V
UFDAh
USSYh
3.10.1.3 Hysteresis C ∆UFCL 0.1 0.6 V
∆UFDA
∆USSY
3.10.1.4 Input Ca- C CFCL 10 pF

pacity CFDA
CSSY
3.10.1.5 Input Cur- Pull up current source connected A IFCL 5 10 20 µA
rent to VDD IFDA
ISSY
3.10.2 Timing Cycle Time C tCYC 62 nsec
Data setup time C tsetup 10 nsec
Data hold time C thold 10 nsec
Switching time on FCL C tswitch 30 nsec
fFCL < 10MHz
Data Sheet 61 V7, 2007-06-11

TLE 6244X
Switching time on FCL C tswitch 8 nsec

fFCL > 10MHz
Select hold time C tshold 25 10 nsec
FCL Low time C tFCLL 25 nsec
FCL High time C tFCLH
25
SSY Low time C tSSYL 25 nsec

SSY High time C tSSYH
25
Time between rising edge of SSY C tSF 8 nsec

and next falling edge of FCL
3.11 Diagnostics
3.11.1 Diagnostic
Thresholds
Power Stages
3.11.1.1 Open Load Output turned off B UOUT1.. UVDD UVDD UVDD V
(OL) 18 - +
0.5V 0.5V
3.11.1.2 Short to Output turned off B UOUT1... 0.54 0.54 0.54 V
Ground 18 * * *
(SCG) UVDD UVDD UVDD
- +
0.5V 0.5V
3.11.1.3 Short to Bat- See 3.5.3, 3.6.3, 3.7.3, 3.8.3
tery (SCB)
3.11.1.4 Overtem- Output turned on B TJ 150 °C
perature Individually for each stage
3.11.2 Bias Voltage Output turned off, IOUT1...18 = 0 A UOUT1... 0.6 * 0.7 * 0.76* V
Open Load 18 UVDD UVDD UVDD
Power Stages
3.11.3 Diagnostic 4.5V ≤ UVDD ≤ 5.5V, output turned
Currents off
Power Stages
UOUT1...18 = 14V (diagnostic cur- A IOUT 270 580 980 µA
rent incl. leakage current)
UOUT1...18 = 0V A -IOUT 50 130 250 µA
UOUT1...18 = OL-Threshold C IOUT 220 980 µA
UOUT1...18 = SCG-Threshold C -IOUT 40 250 µA
Data Sheet 62 V7, 2007-06-11

TLE 6244X
3.11.4 Filtering Time from occurrence of one of B tDiag 60 240 µs

Time Power the errors ’short to ground’, ’open
Switches load’ or ’short to battery’ until the
fault is entered into the corre-
sponding diagnostic register.
Time from occurrence of OT until C tDiatOT 3 30 µs

the information is entered into the
corresponding diagnostic register.
3.11.5 Diagnostic Bit Ubatt in DIA_REG5 Uth,UB 1 9 V
Threshold
UBatt
3.12 Reverse Cur-
rents UVDD ≤ 1V
3.12.1 Reverse Cur- Static C -IO1...6 3 A

rent at C -IO9...16 3 A
OUT1...18 C -IO7,8 0.8 A
without Sup- C -IO17,18 0.8 A
ply Voltage
Dynamic C -IO1...6 10 A
(Test pulse 1 according to ISO: C -IO9...16 10 A
100V, Ri = 10W, 2ms) C -IO7,8 1.5 A
C -IO17,18 1.5 A
3.12.2 Reverse Cur- 4.5V ≤ UVDD ≤ 5.5V
rent at Pulsed power stage.
OUT1...OUT18 Neighboring stages, reset, input
in Operation signals of the power stages, VDD-
Mode monitoring, SPI interface (incl. reg-
isters) and µsec-bus must not be
disturbed. Diagnostics of fault con-
ditions at neighboring stages is still
possible. Control bits in the SPI
registers (serial control of power
stages are not disturbed).
Open load failure at neighboring C -IO1...16 1 A

stages may be detected as short C -IO7,8 0.3 A
to ground C -IO17,18 0.3 A
Open load failure at neighboring C -IO1...4 0.5 A

stages are not detected as short C -IO5...16 0.25 A
to ground C -IO7,8 0.3 A
C -IO17,18 0.3 A
Destruction limit C -IO1...6 3 A
C -IO9...16 3 A
C -IO7,8 0.8 A
C -IO17,18 0.8 A
Data Sheet 63 V7, 2007-06-11

TLE 6244X
3.13 VDD-Monitor- Bidirectional: open drain output /

ing ABE input with pull up current source
An external current limitation
must guarantee IABE < 5 mA for
any UABE
3.13.1 Output UABE = Low (after tglitch)for:
2.7V < UVDD < 4.5V... 4.7V or
5.3V... 5.5V < UVDD < 36V or
Testmode (see 3.13.5 or 3.13.6) or
Pin GND_ABE is open
3.13.1.1 Low Level UVDD > 4.5V, IABE<5mA A UABE 1.2 V
UVDD = 2.7V, IABE<1mA, A UABE 1.0 V
in case of less current, ohmic
behavior can be assumed
3.13.1.2 Maximum No current recovery on VDD, C UABE 36 V

Voltage UBatt and the logical pins
(SS,SCK,SI,SO,INx,RST) in case
of short to battery at ABE (up to
36V)
3.13.2 Input
3.13.2.1 Low Level B UABEL 0.3 * V
UVDD
3.13.2.2 High Level B UABEH 0.7 * V

UVDD
3.13.2.3 Hysteresis C ∆UABE 0.2 1.0 V

3.13.2.4 Input Cur- Pull up current source connected
rent to VDD
-0.25V ≤ UABE ≤ UVDD-1.7 V A -IABE 20 40 100 µA

-0.25V ≤ UABE ≤ UVDD-1.5 V C -IABE 15 40 100 µA
-0.3V ≤ UABE < -0,25V C -IABE 300 µA
3.13.3 Overvoltage Voltage referred to GND_ABE B VDDth_h 5.3 5.5 V
Threshold
Data Sheet 64 V7, 2007-06-11

TLE 6244X
3.13.4 Undervolt- Voltage referred to GND_ABE B VDDth_l 4.5 4.7 V

age Thresh-
old
3.13.5 Test Mode: Voltage referred to GND_ABE B VDDth_h 4.5 4.7 V
Reducing the
Overvoltage
Threshold
3.13.6 Test Mode: Voltage referred to GND_ABE B VDDth_l 5.3 5.5 V
Lifting the
Undervoltage
Threshold
3.13.7 Suppres- Periodical alternating between A tglitch 50 215 µs
sion of overvoltage and normal operating
Glitches voltage with T< 50µs and overvolt-
age duration > 5µs leads to over-
voltage detection.
If the transition from undervoltage
to overvoltage is faster than the fil-
tering time tglitch, the filtering time
tglitch for overvoltage detection is
not started again. The same is
valid for reverse order.
3.13.8 GND_ABE
3.13.8.1 Permissible C ∆UGND 0.3 V
Offset be-
tween
GND_ABE
and GND
3.13.8.2 Bond Lift / Pin ABE goes LOW
Solder Crack (see 3.13.1.1).
on The power stages are switched off.
GND_ABE The over- and undervoltage
thresholds are increased by typi-
cally 700mV for TA = 25°C.
Data Sheet 65 V7, 2007-06-11

TLE 6244X
3.14 Clamping Energy
3.14.1 E = f(IOUT1...6), 2.2A Power Stages with 70V Clamping
E / mJ
Injector Drivers
Clamping Voltage 64... 76V
30 + fmax = 50 Hz
TCmax = 110°C
+
20 +
+
10 +
+
0 0.5 1.0 1.5 2.0 IMAX / A
3.14.2 E = f (IOUT9...A14), 2.2A Power Stages with 45V Clamping
E / mJ
2.2A Power Stage

30 + fmax = 30 Hz
TCmax = 110°C
+
20 +
+
+
10
0 0.5 1.0 1.5 2.0 IMAX / A
Data Sheet 66 V7, 2007-06-11

TLE 6244X
3.14.3 E = f(IOUT7,8,17,18), 1100mA Power Stages with 45V Clamping
E / mJ
1.1A Power Stage

fmax = 10 Hz
15
TCmax = 110°C
10 +
+
5
0 0.25 0.5 0.75 1.0 IMAX / A
3.14.4 E = f(IOUT15, OUT16), 3.0A Power Stages with 45V Clamping
E / mJ
3.0A Power Stage

30 + fmax = 30 Hz
TCmax = 110°C
+
20
+
+
10
0 0.5 1.0 1.5 2.0 2.5 IMAX / A
Data Sheet 67 V7, 2007-06-11

TLE 6244X
4. ESD
All pins of the IC have to be protected against electrostatic discharge (ESD) by appropriate pro-
tection
components.
The integrated circuit has to meet the requirements of the „Human Body Model“ with UC = 2kV,
C = 100pF and R2 = 1,5kΩ without any defect or destruction of the IC.
Appropriate measures to reach the required ESD capability have to be coordinated.
The ESD capability of the IC has to be verified by the following test circuit.
S2
(1) (2)
R1 R2
S1
US
DC-Volt-
V meter C UC
DUT S3
UC = + 2kV
R1 = 100kΩ
R2 = 1,5kΩ
C = 100pF
Number of pulses each pin: 18 in all

Frequency: 1Hz
Arrangement and performance:

The requirements of MIL883D Method 3015 (latest revision) have to be fulfilled.
Data Sheet 68 V7, 2007-06-11

TLE 6244X
5. Package Outline
Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products and to be
compliant with government regulations the device is available as a green product. Green
products are RoHSCompliant (i.e Pb-free finish on leads and suitable for Pb-free soldering
according to IPC/JEDEC JSTD-020).
Data Sheet 69 V7, 2007-06-11

TLE 6244X
6. Revision History
TLE 6244X
Revision History: 2007-06-11 V7 (previous Version V6 - Preliminary Data Sheet)

Changes to V7
2007-06-11 Status to Final
2007-06-11 typo: MQFM > MQFP
Data Sheet 70 V7, 2007-06-11

TLE 6244X
Edition 2007-06-11
Published by
Infineon Technologies AG
81726 Munich, Germany
© 6/11/07 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/
or any information regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement
of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the
nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the
types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected
to cause the failure of that life-support device or system or to affect the safety or effectiveness of that
device or system. Life support devices or systems are intended to be implanted in the human body or to
support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that
the health of the user or other persons may be endangered.
Data Sheet 71 V7, 2007-06-11

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TLE 6244X

18 Channel Smart Lowside Switch

IN2 as Ch. 1 Protection

This circuit is available in PG-MQFP-64 package or as chip.

1.1.1 Features of the Power Stages

Nominal Current Ron,max at TJ = 25°C static current limita- Clamping

OUT3, OUT4 2.2A 380mΩ - 70V

OUT7, OUT8 1.1A 780mΩ - 45V

OUT9, OUT10 2.2A 380mΩ X 45V

OUT11...OUT14 2.2A 380mΩ - 45V

OUT15, OUT16 3.0A 280mΩ X 45V

OUT17, OUT18 *) 1.1A 780mΩ X 45V

Parallel connection of power stages is possible (see 1.13)

1.1.2 Diagnostic Features

The following types of error can be detected:

1.1.5 Power Stage OUT8

Data Sheet 2 V7, 2007-06-11

1.2 Block Diagram

IN16 3,0A / 45V OUT16

µsec - Bus VDD

SO RST GND1...8 GND_ABE

Data Sheet 3 V7, 2007-06-11

1.3 Description of the Power Stages

OUT7, OUT8, OUT17, OUT18

There are 3 possibilities to turn the power stages on again:

Data Sheet 4 V7, 2007-06-11

- short-circuit to UBatt: (SCB) can be detected if switches are turned on

1.3.1 Power Stage OUT8 (Condensed Description)

Data Sheet 5 V7, 2007-06-11

Function Pin Pin Number

Data Sheet 6 V7, 2007-06-11

Supply Voltage VDD VDD 47

Sense Ground VDD-Monitoring GND_ABE 29

not connected nc 21, 24, 32, 52, 64

Data Sheet 7 V7, 2007-06-11

1.5 Function of Pins

IN1 to IN16 Control inputs of the power stages

Internal pull-up current sources (exception: IN8 with pull-down current

FCL Clock for the µsec-bus (pin shared with IN16)

OUT1 to OUT18 Outputs of the power switches

VDD Supply voltage 5V

UBatt Supply voltage UBatt

GND1 to GND8 Ground pins

Ground pins for the power stages (see 2.4)

ABE In-/Output VDD-Monitoring

GND_ABE Sense ground VDD-Monitoring

SI, SO, SCK, SS SPI Interface

Data Sheet 8 V7, 2007-06-11

1.6 SPI Interface

Power Stages 1..18 Power Stages 1..16

VDD-Monitoring Power Stages 1..18

Data Sheet 9 V7, 2007-06-11

0 0 INSTR4 INSTR3 INSTR2 INSTR1 INSTR0 INSW

Bit Name Description

Characteristics of the SPI Interface:

Data Sheet 10 V7, 2007-06-11

SPI access format:

WRITE-access (16bit) READ-access (16bit)

SPI instruction Data 8bit SPI instruction XX XX XX XX