Quiz 1 Data Sheet
Quiz 1 Data Sheet
Quiz 1 Data Sheet
IRG4PC50WPbF
INSULATED GATE BIPOLAR TRANSISTOR
Features
Designed expressly for Switch-Mode Power C
Supply and PFC (power factor correction)
applications VCES = 600V
Industry-benchmark switching losses improve
efficiency of all power supply topologies
50% reduction of Eoff parameter G VCE(on) max. = 2.30V
Low IGBT conduction losses
Latest-generation IGBT design and construction E @VGE = 15V, IC = 27A
offers tighter parameters distribution, exceptional n-channel
reliability
Lead-Free
Benefits
Lower switching losses allow more cost-effective
operation than power MOSFETs up to 150 kHz
("hard switched" mode)
Of particular benefit to single-ended converters and
boost PFC topologies 150W and higher
Low conduction losses and minimal minority-carrier
recombination make these an excellent option for
resonant mode switching as well (up to >300 kHz)
TO-247AC
Absolute Maximum Ratings
Parameter Max. Units
VCES Collector-to-Emitter Breakdown Voltage 600 V
IC @ TC = 25°C Continuous Collector Current 55
IC @ TC = 100°C Continuous Collector Current 27 A
ICM Pulsed Collector Current 220
ILM Clamped Inductive Load Current 220
VGE Gate-to-Emitter Voltage ± 20 V
EARV Reverse Voltage Avalanche Energy 170 mJ
PD @ TC = 25°C Maximum Power Dissipation 200
W
PD @ TC = 100°C Maximum Power Dissipation 78
TJ Operating Junction and -55 to + 150
TSTG Storage Temperature Range °C
Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )
Mounting torque, 6-32 or M3 screw. 10 lbfin (1.1Nm)
Thermal Resistance
Parameter Typ. Max. Units
RθJC Junction-to-Case 0.64
RθCS Case-to-Sink, Flat, Greased Surface 0.24 °C/W
RθJA Junction-to-Ambient, typical socket mount 40
Wt Weight 6 (0.21) g (oz)
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IRG4PC50WPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V(BR)CES Collector-to-Emitter Breakdown Voltage 600 V VGE = 0V, IC = 250µA
V(BR)CES Emitter-to-Collector Breakdown Voltage 18 V VGE = 0V, IC = 1.0A
∆V(BR)CES/∆TJ Temperature Coeff. of Breakdown Voltage 0.41 V/°C VGE = 0V, IC = 5.0mA
1.93 2.3 IC = 27A VGE = 15V
VCE(ON) Collector-to-Emitter Saturation Voltage 2.25 IC = 55A See Fig.2, 5
V
1.71 IC = 27A , TJ = 150°C
VGE(th) Gate Threshold Voltage 3.0 6.0 VCE = VGE, IC = 250µA
∆VGE(th)/∆TJ Temperature Coeff. of Threshold Voltage -11 mV/°C VCE = VGE, IC = 1.0mA
gfe Forward Transconductance
27 41 S VCE = 100 V, IC = 27A
250 VGE = 0V, VCE = 600V
ICES Zero Gate Voltage Collector Current µA
2.0 VGE = 0V, VCE = 10V, TJ = 25°C
5000 VGE = 0V, VCE = 600V, TJ = 150°C
IGES Gate-to-Emitter Leakage Current ±100 nA VGE = ±20V
VCC = 80%(VCES), VGE = 20V, L = 10µH, RG = 5.0Ω, Pulse width ≤ 80µs; duty factor ≤ 0.1%.
(See fig. 13a)
Pulse width 5.0µs, single shot.
Repetitive rating; pulse width limited by maximum
junction temperature.
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IRG4PC50WPbF
100
For both: Triangular wave:
Duty cycle: 50%
TJ = 125°C
80 Tsink = 90°C
Gate drive as specified
Power Dissipation = 40W Clamp voltage:
Load Current ( A )
80% of rated
60
Square wave:
60% of rated
voltage
40
20
Ideal diodes
0 A
0.1 1 10 100 1000
f, Frequency (kHz)
1000 1000
I C , Collector-to-Emitter Current (A)
100 100
TJ = 150 °C
TJ = 150 °C
TJ = 25 °C
TJ = 25 °C
10 10
V GE = 15V V CC = 50V
20µs PULSE WIDTH 5µs PULSE WIDTH
1 1
1 10 5 6 7 8 9 10 11
VCE , Collector-to-Emitter Voltage (V) VGE , Gate-to-Emitter Voltage (V)
50
40
IC = 54 A
30 2.0
IC = 27 A
20
IC =13.5 A
10
0 1.0
25 50 75 100 125 150 -60 -40 -20 0 20 40 60 80 100 120 140 160
TC , Case Temperature ( °C) TJ , Junction Temperature ( ° C)
Fig. 4 - Maximum Collector Current vs. Case Fig. 5 - Typical Collector-to-Emitter Voltage
Temperature vs. Junction Temperature
0.50
Thermal Response (Z thJC )
0.20
0.1
0.10
0.05
0.02
0.01 SINGLE PULSE PDM
(THERMAL RESPONSE)
0.01
t1
t2
Notes:
1. Duty factor D = t 1 / t 2
2. Peak TJ = PDM x Z thJC + TC
0.001
0.00001 0.0001 0.001 0.01 0.1 1
t1 , Rectangular Pulse Duration (sec)
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IRG4PC50WPbF
8000 20
VGE = 0V, f = 1MHz VCC = 400V
Cies = Cge + Cgc , Cce SHORTED I C = 27A
Cres = Cgc
Cies 12
4000
Coes
2000
4
Cres
0 0
1 10 100 0 40 80 120 160 200
VCE , Collector-to-Emitter Voltage (V) QG , Total Gate Charge (nC)
3.0 10
V CC = 480V 5.0Ω
RG = Ohm
V GE = 15V VGE = 15V
TJ = 25 °C VCC = 480V
I C = 27A
Total Switching Losses (mJ)
Total Switching Losses (mJ)
IC = 54 A
2.0
IC = 27 A
1
IC = 13.5 A
1.0
0.0 0.1
0 10 20 30 40 50 -60 -40 -20 0 20 40 60 80 100 120 140 160
RGRG, ,Gate
GateResistance Ω)
Resistance ((Ohm) TJ , Junction Temperature (° C )
Fig. 9 - Typical Switching Losses vs. Gate Fig. 10 - Typical Switching Losses vs.
Resistance Junction Temperature
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IRG4PC50WPbF
3.0 1000
RG 5.0Ω
= Ohm VGE = 20V
TJ = 150 ° C T J = 125 oC
2.0 100
1.0 10
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IRG4PC50WPbF
L D.U.T.
VC * 480V
RL =
4 X I C@25°C
50V 0 - 480V
1000V 480µF
960V
c
d
* Driver same type as D.U.T.; Vc = 80% of Vce(max)
* Note: Due to the 50V power supply, pulse width and inductor
will increase to obtain rated Id.
IC
L
Driver* D.U.T. Fig. 14a - Switching Loss
VC Test Circuit
50V
1000V
c * Driver same type
as D.U.T., VC = 480V
d e
d
90%
e 10%
VC
90%
t d(off)
Fig. 14b - Switching Loss
Waveforms
10%
I C 5%
tr tf
t d(on) t=5µs
E on E off
E ts = (Eon +Eoff )
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IRG4PC50WPbF
20.30 (.800)
19.70 (.775) 5.50 (.217) NOTES:
2X
4.50 (.177) 1 DIMENSIONING & TOLERANCING
PER ANSI Y14.5M, 1982.
1 2 3 2 CONTROLLING DIMENSION : INCH.
3 CONFORMS TO JEDEC OUTLINE
-C- TO-247-AC.
14.80 (.583)
4.30 (.170)
14.20 (.559) 3.70 (.145)
LEAD ASSIGNMENTS
Hexfet IGBT
2.40 (.094) 1.40 (.056) 0.80 (.031) 1 -LEAD
GateASSIGNMENTS
1 - Gate
2.00 (.079) 3X 1.00 (.039) 3X 0.40 (.016) 2 - Drain
1 - GATE 2 - Collector
2X 2 - DRAIN
0.25 (.010) M C A S 2.60 (.102) 3 - Source 3 - Emitter
3 - SOURCE
5.45 (.215) 2.20 (.087) 4 - Drain
4 - DRAIN4 - Collector
3.40 (.133)
2X 3.00 (.118)
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.11/03
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Note: For the most current drawings please refer to the IR website at:
http://www.irf.com/package/