International Journal of Research in Computer and ISSN (Online) 2278- 5841

Communication Technology, Vol 3, Issue 10, October - 2014 ISSN (Print) 2320- 5156

Design of The CAN Bus Booster Pack and The Implementation of The CAN Protocol
on the TIVA C Launch pad Evaluation Board
G.SriSaiteja , K.N.V.Khasim
M.Tech(EmbeddedSystems), Asst.Prof
Gokaraju Rangaraju Institute of Engineering &Gokaraju Rangaraju Institute of Engineering&
Technology (GRIET), Hyderabad
otherperipherals. A Boosterpack on TIVA C
Abstract Launchpad evaluation board is an interface
between applications and the evaluation board,
This paperis about the practical design of a CAN which is connected to the Launchpad through its
Bus Boosterpack and the implementation of the pin handlers. It can be having any application, for
CAN protocol on the TIVA C Launchpad example, a boosterpack for Bluetooth dongle, an
evaluation board. The boosterpack board contains a LCD display, an RTC controller etc…, here; a
CAN transceiver that can make communication CAN boosterpack of such is to be designed.
between applications possible via the CAN 2. RELATEDWORK
controller module, present in the TIVA C The implementation of the CAN protocol on an
Launchpad. The CAN booster pack will be evaluation board is done previously. For example it
designed around an MSP 2551 CAN transceiver was done on the ARDUINO evaluation board. But
that will be connected through the CAN TX and the major difference between that of the
CAN RX signals of the CAN module on the ARDUINO board and the TIVA C board is the
launchpad. The transceiver will connect the CAN operating speed.The speed of the TIVA C
bus between applications and the CAN controller Launchpad is 80 MHz; this makes it 4 times faster
module on the launchpad. The Boosterpack board than ARDUINO.
is designed using the Cadsoft Eagle and the 3. PROPOSED SYSTEM
programming of the board is done in the Code
Composer Studio (CCStudio) v5.5, and using The following figure shows the proposed system,
Tivaware v2.1. in block level representation.The TIVA C
Launchpad evaluation board, on which, the process
Key words: TIVA C Launchpad, TM4C123GXL has to be done, a PC to provide the required power
Microcontroller, CAN Protocoletc….. supply, and to program the Board. The CAN
BusBoosterpack is connected to the board via the
1. INTRODUCTION stackable headers present on the Launchpad
CAN protocol, protocol for LAN (Local Area evaluation board. The end use of the boosterpack
Network) communication. It is a multi- can be of the OBD-II protocol or any other
channeltransmission system, where when a unit applications.
fails, it does not affect others. All systems
connected to the CAN bus are accessible via the
control unit on the CAN bus interface for sending
and receiving data. The CAN Bus Boosterpack
contains the CAN protocol features, which can be
used on the TIVA C Launchpad. TIVA C
Launchpad is a single board microcontroller
designed by the Texas Instruments (TI). It contains
an ARM cortex M4U-based microcontroller
namely TM4C123GXL. The TIVA C Series
TM4C123G Launchpad evaluation board is a low-
cost evaluation platform, with an excellent level of
processing power. The stackable headers of the Fig (1) – Proposed System
Launchpad evaluation board demonstrate how easy
it is to expand the functionality of the TIVA C
Series Launchpad when interfacing to 4. HARDWARE

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 International Journal of Research in Computer and ISSN (Online) 2278- 5841
Communication Technology, Vol 3, Issue 10, October - 2014 ISSN (Print) 2320- 5156

and exceptional system response to interrupts. The

4.1 TIVA C Launchpad TM4C123GH6PM controller supports
TIVAC Launchpad is a single board bothasynchronous and synchronous
microcontroller designed by the Texas Instruments serialcommunications.
(TI). It contains an ARM cortex M4U-based
microcontroller namely TM4C123GXL.The 4.3DEVELOPMENT OF THE CAN BUS
TIVAC Series TM4C123G Launchpad Evaluation BOOSTERPACK
Board is a low-cost evaluation platform for ARM
Cortex-M4F-based microcontrollers. The stackable TIVA C Series Boosterpacks expand the available
headers of the TIVAC Series TM4C123G peripherals and potential applications of the TIVA
Launchpad Boosterpack XL interface demonstrate C Series Launchpad. Boosterpacks can be used
the ability of the Launchpad to interface to other with the TIVA C Series Launchpad or the on-board
Boosterpack add-on boards. There are 40 I/O pins TM4C123GH6PM microcontroller as its processor.
that have multi-personality, this means that they The two double rows of stackable headers are
can be easily configured as digital inputs or mapped to most of the GPIO pins of the
outputs, analog inputs and outputs or other TM4C123GH6PM microcontroller.The expansion
functions, allowing a great variety of applications, headers are referred to as the Boosterpack
are just the multiple serial ports have the ability to interface. These rows are labeled as connectors J1,
interface with more items such as test cards or J2, J3, and J4.
other communication modules, etc.. Among those
pins there are included the GND and POWER (3.3 MCP 2551 CAN TRANCEIVER
v) pins.
The CAN Bus Boosterpack for the TIVA C
Launchpad evaluation board will be designed
around an MCP 2551 CAN transceiver. The
MCP2551 is a high-speed CAN, fault-tolerant
device that serves as the interface between a CAN
protocol controller and the physical bus. The
MCP2551 device provides differential transmit and
receive capability for the CAN protocol controller
on the TIVA C Launchpad. It operates at speeds of
up to 1 Mb/s. It also provides a buffer between the
CAN controller and the high-voltage spikes that
can be generated on the CAN bus by outside
sources.

Fig (2) – TIVA C Launchpad Evaluation Board

4.2 TM4C123GXL MICROCONTROLLER
The TM4C123GH6PM is a 32-bit ARM Cortex-
M4-based microcontroller with 256-kB Flash
memory, 32-kB SRAM, and 80-MHz operation; Fig (3)–MCP 2551
USB host, device, and OTG connectivity; a
hibernation module and PWM; and a wide range of
other peripherals. Most of the microcontroller
signals are routed to 0.1-in (2.54-mm) pitch
headers. An internal multiplexer allows different
peripheral functions to be assigned to each of these
GPIO pads.
The TI TM4C123GXLmicroprocessors are based
on ARM cortex-M4F processor. The ARM Cortex-
M4F processor provides a high-performance; low-
cost platform that meets the system requirements of
minimal memory implementation, reduced pin
count, and low power consumption, while
delivering outstanding computational performance Fig (4) – Pin Function of MCP 2551 pins

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 International Journal of Research in Computer and ISSN (Online) 2278- 5841
Communication Technology, Vol 3, Issue 10, October - 2014 ISSN (Print) 2320- 5156

FUNCTIONAL INTERFACING OF THE

BOOSTERPACK

The J1 connector and the J3 connector which are

on the left side of the board are the ones required
for the operation of the CAN BUS Boosterpack.
The interfacing needs the use of 4header pins from
the J1 and J3 connectors, they are 1.02, 1.07 pins of
J1 connector and the 3.01, 3.02 pins of J3
connector.
The CANH, CANL pins on the MCP2551 are used
for the output CAN protocol applications, along
with the 5V and the GND.

Fig (7) – CAN BOOSTERPACK

5. IMPLEMENTATION

The implementation of the CAN protocol using the

CAN Bus Boosterpack is mainly in the OBD-II
protocol applications. The CAN Bus Boosterpack
can be used for OBD-II applications via a DB-9
serial port.

Fig (5) – Functional pin interfacing of the

Boosterpack

4.4 THE CAN (Controller Area Network) Bus

Boosterpack

The CAN bus Boosterpack design is according to

the Launchpad dimensions of the TIVA C
Launchpad. It is designed using the CADSOFT Fig (8) – DB-9 PORT PINOUT
EAGLE software, and it is designed around a MCP
2551 CAN transceiver.

Fig (6) – CAN BOOSTERPACK Fig (9) – DB-9 TO OBD-II PINOUT

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 International Journal of Research in Computer and ISSN (Online) 2278- 5841
Communication Technology, Vol 3, Issue 10, October - 2014 ISSN (Print) 2320- 5156

Fig (10) – Connection between CAN

Boosterpack and DB-9 Serial port Fig (12) – LED is in OFF state (TEMP is same
as given value)

Fig (11) – TIVA C Launchpad with CAN Bus

Boosterpack and DB-9 connector
Fig (13) – LED is in ON state (TEMP is more
6. WORKING than given value)

The working of the CAN Bus Boosterpack can be 7. CONCLUSION

tested by using a code to make the LED on the
TIVA C Launchpad blink depending on the The CAN Bus Boosterpack for the TIVA C
temperature conditions using the CAN protocol, as Launchpad can be used for the OBD-II protocol
there exists a temperature sensor on the TIVA C applications and some other applications. As the
Launchpad evaluation board, the LED will blink if operating speed of the TIVA C Launchpad is more
the temperature is more than the given value or it than that of most other microcontroller evaluation
will be in OFF state. Here, the output, i.e. the LED boards, it is faster and reliable for these
blinking is via the transferring of temperature value applications. As it is shown, the serial port is not
through CAN. soldered to the CAN Boosterpack board, it will be
improvised in the future.
Here, the Transmission and reception are done on
the same board.
8. REFERANCES

[1] CAN specification version 2.0. Robert Bosch

GmbH, Stuttgart,
Germany, 1991.
[2] Karl Henrik Johansson, Martin Törngren, and
Lars Nielsen,

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 International Journal of Research in Computer and ISSN (Online) 2278- 5841
Communication Technology, Vol 3, Issue 10, October - 2014 ISSN (Print) 2320- 5156

“Vehicle Application of Controller Area

Network”.proc of
The Handbook of Networked and Embedded
Control Systems
Control Engineering, 2005, VI, pp.741-76
[3] Steve Corrigan, “Introduction to the Controller
Area Network”,
Published by Texas Instruments Application
Report,SLOA101A,
August 2002–Revised July 2008
[4]TIVATM4C123GH6PMMicrocontroller
Datasheet.
[5] ‘’Getting started with the TIVA Launchpad
Workshop” Student guide.
[6] MCP 2551 High speed CAN Transceiver
Datasheet.
[7]http://www.en.wikipedia.org/wiki/Tiva-
C_Launchpad
[8]http://e2e.ti.com

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