DATASHEET

PECL TO CMOS CONVERTER ICS508

Description Features
The ICS508 is the most cost effective way to generate • Packaged in 8 pin SOIC (Pb-free) or die
a high quality, high frequency CMOS clock output from • Separate VDD supplies allow voltage translation
a PECL clock input.
• Clock frequency of 0 - 250 MHz
The ICS508 has separate VDD supplies for the PECL
input buffer and the output buffer, allowing different
• Duty cycle of 45/55
voltages to be used. For example, the input clock could • Operating voltages of 2.375 to 5.5V
use a 3.3 V supply while the output operates from 2.5V. • Tri-state output for board level testing
The device has an Output Enable pin that tri-states the • 24mA output drive capability
clock output when the OE pin is taken low.
• Industrial temperature version available
The ICS508 is a member of IDT’s ClockBlocksTM
• Advanced, low power, sub-micron CMOS process
family.

Block Diagram

VDDP VDDC

P E C LIN O utput
C LK
P E C LIN B uffer

GND OE GND

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PECL TO CMOS CONVERTER PECL TO CMOS TRANSLATOR

Pin Assignment

VDDP 1 8 VDDC
PECLIN 2 7 CLK
PECLIN 3 6 GND
GND 4 5 OE

8 Pin (150 mil) SOIC

Pin Descriptions
Pin Pin Pin Pin Description
Number Name Type
1 VDDP Output Connect to 3.3V or 5V. Supplies PECL input buffer.
2 PECLIN Input Complementary PECL clock input.
3 PECLIN Input PECL clock input.
4 GND Power Connect to ground.
5 OE Input Output enable. Tri-states CLK output when low. Internal pull-up to
VDDC.
6 GND Power Connect to ground.
7 CLK Output Clock output.
8 VDDC Power Connect to 2.5 V, or 3.3 V, or 5 V. Supplies output buffer and OE pin.

External Components
The ICS508 requires two 0.01µF decoupling capacitors to be connected between VDDP and GND and
between VDDC and GND. They must be connected close to the ICS508 to minimize lead inductance. A
33Ω series terminating resistor can be used next to the CLK pin.

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PECL TO CMOS CONVERTER PECL TO CMOS TRANSLATOR

Absolute Maximum Ratings

Stresses above the ratings listed below can cause permanent damage to the ICS508. These ratings, which
are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the
device at these or any other conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.

Item Rating
Supply Voltage, VDDP and VDDC 7V
PECL Inputs -0.5 V to VDDP+0.5 V
Clock Output and OE Pin -0.5 V to VDDC+0.5 V
Ambient Operating Temperature, ICS508 0 to +70° C
Ambient Operating Temperature, ICS508MI -40 to +85° C
Storage Temperature -65 to +150° C
Soldering Temperature 260° C

Recommended Operation Conditions

Parameter Min. Typ. Max. Units
Ambient Operating Temperature, ICS508M 0 +70 °C
Ambient Operating Temperature, ICS508MI -40 +85 °C
Power Supply Voltage (measured in respect to GND) +3.15 +3.45 V
Reference crystal parameters Refer to page 3

DC Electrical Characteristics
VDDP = VDDC =3.3V ±5% , Ambient temperature 0 to +70° C, unless stated otherwise
Parameter Symbol Conditions Min. Typ. Max. Units
Operating Voltage VDD VDDP 3 5.5 V
VDD VDDC 2.375 5.5 V
Peak to Peak Input Voltage PECLIN 0.3 1 V
Common Mode Range PECLIN VDDP - 3.7 VDDP - 0.6 V
VDDP = 5 V
PECLIN VDDP - 2.0 VDDP - 0.6 V
VDDP = 3.3 V
Input High Voltage VIH OE only 2 VDDC V
Input Low Voltage VIL OE only 0.8 V

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PECL TO CMOS CONVERTER PECL TO CMOS TRANSLATOR

Parameter Symbol Conditions Min. Typ. Max. Units

Output High Voltage VOH VDDC = 5 V VDDC - 0.4 V
IOH = -24 mA
VDDC = 3.3 V VDDC - 0.4 V
IOH = -18 mA
VDDC = 2.5 V VDDC - 0.4 V
IOH = -8 mA
Output Low Voltage VOL VDDC = 5 V 0.4 V
IOL = 24 mA
VDDC = 3.3 V 0.4 V
IOL = 18 mA
VDDC = 2.5 V 0.4 V
IOL = 8 mA
On Chip Pull-up Resistor RPU OE 250 kΩ
Operating Supply Current IDDP 100 MHz, no load 1.5 mA
IDDC 100 MHz, no load 8 mA
Note 1: VDDP must always be greater than or equal to VDDC

AC Electrical Characteristics
VDDP = VDDC = 3.3V±5%, Ambient Temperature 0 to +70° C, unless stated otherwise
Parameter Symbol Conditions Min. Typ. Max. Units
Input Frequency fIN 0 250 MHz
Output Clock Rise Time 100 MHz 0.8 V to 2.0 V, VDDP=VDDC = 5 V 0.4 ns
100 MHz 0.8 V to 2.0 V, VDDP=VDDC=3.3 V 0.6 ns
100 MHz 0.8 V to 2.0 V, VDDP=VDDC=2.5 V 1 ns
Output Clock Fall Time 100 MHz 2.0 V to 0.8 V, VDDP=VDDC = 5 V 0.4 ns
100 MHz 2.0 V to 0.8 V, VDDP=VDDC=3.3 V 0.6 ns
100 MHz 2.0 V to 0.8 V, VDDP=VDDC=2.5 V 1 ns
Output Enable Time 100 MHz OE high to output on 0 - 100 MHz 7 20 ns
Output Disable Time 100 MHz OE low to tri-state 0 - 100 MHz 7 20 ns
Propagation Delay VDDP = 5 V, VDDC = 5 V, 4 6 ns
100 MHz VDDP = 5 V, VDDC = 3.3 V 4.5 7 ns
100 MHz VDDP = 5 V, VDDC = 2.5 V 5.5 9 ns
100 MHz VDDP = 3.3 V, VDDC = 3.3 V 4.5 7 ns
VDDP = 3.3 V, VDDC = 2.5 V 5.5 9 ns
Output Clock Duty Any VDD combination 45 55 %
Cycle 0 - 100 MHz

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PECL TO CMOS CONVERTER PECL TO CMOS TRANSLATOR

Parameter Symbol Conditions Min. Typ. Max. Units

Output Clock Duty VDDP = 5 V, VDDC = 5 V 45 55 %
Cycle VDDP = 5 V, VDDC = 3.3 V 45 55 %
100 - 166 MHz
VDDP = 5 V, VDDC = 2.5 V 40 60 %
VDDP = 3.3 V, VDDC = 3.3 V 40 60 %
VDDP = 3.3 V, VDDC = 2.5 V 45 55 %
Output Clock Duty VDDP = 5 V, VDDC = 5 V 40 60 %
Cycle VDDP = 5 V, VDDC = 3.3 V 40 60 %
166 - 250 MHz
VDDP = 5 V, VDDC = 2.5 V 35 65 %
VDDP = 3.3 V, VDDC = 3.3 V 35 65 %
VDDP = 3.3 V, VDDC = 2.5 V 40 60 %

Thermal Characteristics
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to θJA Still air 150 ° C/W
Ambient θJA 1 m/s air flow 140 ° C/W
θJA 3 m/s air flow 120 ° C/W
Thermal Resistance Junction to Case θJC 40 ° C/W

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PECL TO CMOS CONVERTER PECL TO CMOS TRANSLATOR

Marking Diagrams

508MILF
######
YYWW

508MLF
######
YYWW

Notes:
1. ###### is the lot number
2. YYWW is the last two digits of the year and the week number that the part was assembled.
3. “I” denotes industrial temperature range.
4. “LF” denotes Pb-free.
5. Bottom marking: country of origin if not USA.

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PECL TO CMOS CONVERTER PECL TO CMOS TRANSLATOR

Package Outline and Package Dimensions (8 pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
8 Millimeters Inches

Symbol Min Max Min Max

A 1.35 1.75 .0532 .0688
A1 0.10 0.25 .0040 .0098
E H B 0.33 0.51 .013 .020
INDEX
AREA C 0.19 0.25 .0075 .0098
D 4.80 5.00 .1890 .1968
E 3.80 4.00 .1497 .1574
1 2 e 1.27 BASIC 0.050 BASIC
H 5.80 6.20 .2284 .2440
D h 0.25 0.50 .010 .020
L 0.40 1.27 .016 .050
α 0° 8° 0° 8°

A h x 45

A1 C
-C-

e SEATING
B PLANE
L
.10 (.004) C

*Ordering Information
Part / Order Number Marking Shipping Packaging Package Temperature
508MLF Tubes 8 pin SOIC 0 to +70° C
508MLFT Tape and Reel 8 pin SOIC 0 to +70° C
see page 6
508MILF Tubes 8 pin SOIC -40 to +85° C
508MILFT Tape and Reel 8 pin SOIC -40 to +85° C
508-DWF - Die on uncut, probed wafers 0 to +70° C
508-DPK - Tested die in waffle pack 0 to +70° C

While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no
responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other
circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those
requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without
additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant
any IDT product for use in life support devices or critical medical instruments.

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PECL TO CMOS CONVERTER PECL TO CMOS TRANSLATOR

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