® TDA2822

DUAL POWER AMPLIFIER

.. SUPPLY VOLTAGE DOWN TO 3 V

.. LOW CROSSOVER DISTORSION

LOW QUIESCENT CURRENT
BRIDGE OR STEREO CONFIGURATION

POWERDIP

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(Plastic 12+2+2)

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ORDERING NUMBER : TDA2822
DESCRIPTION
The TDA2822 is a monolithic integrated circuit in
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12+2+2 powerdip, intended for use as dual audio
power amplifier in portable radios and TS sets. P r
te
ole
TYPICAL APPLICATION CIRCUIT (STEREO)

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 TDA2822

PIN CONNECTION (top view)

INPUT+(1) 1 16 INPUT+(2)
N.C. 2 15 N.C.
INPUT-(1) 3 14 INPUT-(2)
GND 4 13 GND
GND 5 12 GND
OUTPUT(1) 6 11 OUTPUT(2)
N.C. 7 10 N.C.
+VS 8 9 N.C.
D95AU321

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SCHEMATIC DIAGRAM
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OABSOLUTE MAXIMUM RATINGS

Symbol Parameter Value Unit

Vs Supply Voltage 15 V
Io Output Peak Current 1.5 A
Ptot Total Power Dissipation at Tamb = 50 °C 1.25 W
at Tcase = 70 °C 4 W
Tstg, Tj Storage and Junction Temperature – 40 to 150 °C

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 TDA2822

THERMAL DATA

Symbol Parameter Value Unit

Rth j-amb Thermal Resistance Junction-ambient Max 80 °C/W
Rth j-case Thermal Resistance Junction-pins Max 20 °C/W

ELECTRICAL CHARACTERISTICS (Vs = 6 V, Tamb = 25 °C, unless otherwise specified)

STEREO (test circuit of fig. 1)

Symbol Parameter Test Condition Min. Typ. Max. Unit

Vs Supply Voltage 3 15 V
Vc Quiescent Output Voltage Vs = 9 V 4 V
Vs = 6 V 2.7 V
Id Quiescent Drain Current 6 12 mA
Ib Input Bias Current 100 nA
Po Output Power d = 10 % f = 1 kHz
(each channel) Vs = 9 V RL = 4 Ω 1.3 1.7 W
Vs = 6 V
Vs = 4.5 V
RL = 4 Ω
RL = 4 Ω
0.45 0.65
0.32
s) W
W
Gv Closed Loop Voltage Gain f = 1 kHz 36 39
c
41
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N
Input Resistance
Total Input Noise
f = 1 kHz
Rs = 10 kΩ
100

d u kΩ

B = 22 Hz to 22 kHz
r o 2.5 µV

SVR Supply Voltage Rejection

Curve A
f = 100 Hz
e P
24
2
30
µV
dB
CS Channel Separation Rg = 10 kΩ f = 1 kHz

le t 50 dB

s o
Vs
Id
Supply Voltage
Quiescent Drain Current RL = ∞
Ob 3
6
15
12
V
mA
Vos Output Offset Voltage RL = 8 Ω
- 10 60 mV

(s)
Ib Input Bias Current 100 nA
Po Output Power

c t d = 10 % f = 1 kHz
Vs = 9 V RL = 8 Ω 2.7 3.2 W

d u Vs = 6 V RL = 8 Ω
Vs = 4.5 V RL = 4 Ω
0.9 1.35
1
W
W
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Distortion (f = 1 kHz) RL = 8 Ω Po = 0.5 W 0.2 %
Gv

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Closed Loop Voltage Gain f = 1 kHz 39 dB
Ri
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N
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Input Resistance
Total Input Noise
f = 1 kHz
Rs = 10 kΩ
100 kΩ

s o B = 22 Hz to 22 kHz
Curve A
3
2.5
µV
µV

O b SVR Supply Voltage Rejection f = 100 Hz 40 dB

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 TDA2822

Figure 1 : Test Circuit (stereo).

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Figure 2 : P.C. Board and Components Layout of the Circuit of Figure 1 (1:1 scale).
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 TDA2822

Figure 3 : Test Circuit (bridge).

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Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale).
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 TDA2822

Figure 5 : Output Power vs. Supply Voltage Figure 6 : Output Power vs. Supply Voltage
(Stereo). (Bridge).

Figure 7 : Distorsion vs. Output Power (Bridge).

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Figure 8 : Distorsion vs. Output Power (Bridge).

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Figure 9 : Supply Voltage Rejection vs. Figure 10 : Quiescent Current vs. Supply Voltage.
Frequency.

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 TDA2822

Figure 11 : Total Power Dissipation vs. Output Figure 12 : Total Power Dissipation vs. Output
Power (Stereo). Power (Bridge).

Figure 13 : Total Power Dissipation vs. Output

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Power (Bridge).
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 TDA2822

Figure 14 : Application Circuit for Portable Radios.

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MOUNTING INSTRUCTION
The Rth j-amb of the TDA2822 can be reduced by sol- r o
During soldering the pins temperature must not ex-
dering the GND pins to a suitable copper area of the
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ceed 260 °C and the soldering time must not be
printed circuit board (Figure 15) or to an external
heatsink (Figure 16).
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longer than 12 seconds.
The external heatsink or printed circuit copper area
The diagram of Figure 17 shows the maximum dis-
sipable power Ptot and the Rth j-amb as a function of
s o
must be connected to electrical ground.

the side "∂" of two equal square copper areas having

a thickness of 35 µ (1.4 mils).
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Figure 15 : Example of P.C. Board Copper Area Figure 16 : External Heatsink Mounting Example.
which is used as Heatsink.

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 TDA2822

Figure 6 : Maximum Dissipable Power and Figure 7 : Maximum Allowable Power Dissipation
Junction to Ambient Thermal vs. Ambient Temperature.
Resistance vs. Side "∂".

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 TDA2822

mm inch
DIM. OUTLINE AND
MIN. TYP. MAX. MIN. TYP. MAX. MECHANICAL DATA

a1 0.51 0.020

B 0.85 1.40 0.033 0.055

b 0.50 0.020

b1 0.38 0.50 0.015 0.020

D 20.0 0.787

E 8.80 0.346

e 2.54 0.100

e3 17.78 0.700

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F 7.10 0.280
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I 5.10 0.201
d u
L 3.30 0.130
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Powerdip 16
Z 1.27 0.050

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 TDA2822

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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the conse-

b s
quences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this
publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMi-

Ocroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.

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